US 8,675,429 B1Grant
Optimal channel design for memory devices for providing a high-speed memory interface
Issue Date:2014-03-18
•20 Claims
•11 Drawing Sheets
Abstract
A system is provided for high-speed communication between a memory controller and a plurality of memory devices. A memory controller, and a plurality of memory devices are provided. Additionally, at least one channel is included for providing electrical communication between the memory controller and the plurality of memory devices, an impedance of the channel being at least partially controlled using High Density Interconnect (HDI) technology.
Metadata
Assignee
- Google Inc.
Inventors
- Min Wang
- Philip Arnold Ferolito
- Suresh Natarajan Rajan
- Michael John Sebastian Smith
Application Information
Application Number:US 13/597,895
Filing Date:2012-08-29
Priority Date:2007-11-16
Art Unit:2827
Classifications
IPC:
G11C7/00
Patent Drawings (11 sheets)
Description
Cross-Reference to Related Applications
[0001] This application is a continuation of U.S. application Ser. No. 13/367,259, filed Feb. 6, 2012, which is a divisional of U.S. application Ser. No. 11/941,589, filed Nov. 16, 2007. The contents of the prior applications are incorporated herein by reference in its entirety.
Field
[0002] The present invention relates to circuit boards, and more particularly to providing communication between a memory controller and memory devices.
Background
[0003] There is an ever-increasing desire for faster and more compact semiconductor memory with an increasing amount of functionality. One challenge in the design of memory subsystems involves utilizing readily available manufacturing techniques and materials. In many cases, a memory subsystem designer may have limited control of some of the components of the system, or as is sometimes the case in memory subsystems, many components of the memory subsystem are defined by actual or de-facto standards. Extreme economic demands are placed on the memory subsystem designer to find techniques to improve the speed and capacity of the subsystem while maintaining high reliability standards, low cost, and small form factor.
[0004] Commercial embodiments of memory systems often contain a memory controller, package and PCB interconnects, and at least one dual in-line memory module (DIMM). Often, the topology of the electrical connectivity between a memory controller and one or more DIMMs is characterized by different interconnect distances between the memory controller and DIMM #1, DIMM #2, DIMM#3, etc. Such a configuration is known as a multi-drop bus topology.
[0005] A structure of transmission conductor, dielectric substrate material, and conductive reference plane is often referred to as a transmission line, for carrying signals. A group of transmission lines connecting multiple chips are usually called a channel. The transmission channel has higher transmission bandwidth if its impedance profile is better matched along the channel. As DIMMs are added to the multi-drop configuration, additional capacitive loads as well as additional impedance discontinuity points are presented in the transmission channel, which in turn may have the effect to decrease the maximum speed of communication through the channel.
[0006] Capacitive loading limits the maximum channel bandwidth. Additionally, impedance discontinuity of the channel exhibits the inherently undesirable phenomenon of multiple reflections and resonance, both of which phenomenon tend to decrease the maximum speed of communication through the channel. There is thus a need for addressing these and/or other issues associated with the prior art.
Summary
[0007] A system is provided for high-speed communication between a memory controller and a plurality of memory devices. A memory controller, and a plurality of memory devices are provided. Additionally, at least one channel is included for providing electrical communication between the memory controller and the plurality of memory devices, an impedance of the channel being at least partially controlled using High Density Interconnect (HDI) technology.
Brief Description of the Drawings
[0008] FIG. 1A shows a system for providing electrical communication between a memory controller and a plurality of memory devices, in accordance with one embodiment.
[0009] FIG. 1B shows a system for providing electrical communication between a host controller chip package and one or more memory devices.
[0010] FIG. 1C illustrates a system corresponding to a schematic representation of the topology and interconnects for FIG. 1B .
[0011] FIG. 2A shows an eye diagram of a data read cycle associated with the prior art.
[0012] FIG. 2B shows an eye diagram of a data read cycle, in accordance with one embodiment.
[0013] FIG. 3A shows an eye diagram of a data write cycle associated with the prior art.
[0014] FIG. 3B shows an eye diagram of a data write cycle, in accordance with one embodiment.
[0015] FIG. 4A shows an eye diagram of a command/address (CMD/ADDR) cycle associated with the prior art.
[0016] FIG. 4B shows an eye diagram of a CMD/ADDR cycle, in accordance with one embodiment.
[0017] FIGS. 5A and 5B depict a memory module (e.g. a DIMM) and a corresponding buffer chip, in accordance with one embodiment.
[0018] FIG. 6 shows a system including a system device coupled to an interface circuit and a plurality of memory circuits, in accordance with one embodiment.
[0019] FIG. 7 shows a DIMM, in accordance with one embodiment.
[0020] FIG. 8 shows a graph of a transfer function of a read channel, in accordance with one embodiment.
Detailed Description
[0021] FIG. 1A shows a system 190 for providing electrical communication between a memory controller and a plurality of memory devices, in accordance with one embodiment. As shown, a memory controller 192 is provided. Additionally, a plurality of memory devices 194 are provided. Still yet, a channel 196 is included for providing electrical communication between the memory controller 192 and the plurality of memory devices 196, an impedance of the channel being at least partially controlled using High Density Interconnect (HDI) technology. In the context of the present description, HDI refers to a technology utilized to condense integrated circuit packaging and printed circuit boards (PCBs) in order to obtain higher electrical performance, higher scale of integration, and more design convenience.
[0022] Additionally, in the context of the present description, a channel refers to any component, connection, or group of components and/or connections, used to provide electrical communication between a memory device and a memory controller. For example, in various embodiments, the channel 196 may include PCB transmission lines, module connectors, component packages, sockets, and/or any other components or connections that fit the above definition. Furthermore, the memory devices 194 may include any type of memory device. For example, in one embodiment, the memory devices 194 may include dynamic random access memory (DRAM). Additionally, the memory controller 192 may be any device capable of sending instructions or commands, or otherwise controlling the memory devices 194.
[0023] In one embodiment, the channel 196 may be connected to a plurality of DIMMs. In this case, at least one of the DIMMs may include a micro-via. In the context of the present description, a micro-via refers to a via constructed utilizing mico-via technology. A via refers to any pad or strip with a plated hole that connects tracks from one layer of a substrate (e.g. a PCB) to another layer or layers.
[0024] In another embodiment, at least one of the DIMMs may include a microstrip trace constructed on a board using HDI technology. In this case, a microstrip refers to any electrical transmission line on the surface layer of a PCB which can be used to convey electrical signals. As an option, the DIMMs may include a read and/or write path. In this case, impedance controlling may be utilized to adjust signal integrity properties of the read and/or write communication path. In one embodiment, the impedance controlling may use HDI technology. In the context of the present description, impedance controlling refers to any altering or configuring of the impedance of a component.
[0025] As an option, at least one interface circuit (not shown) may also be provided for allowing electrical communication between the memory controller 192 and at least one of the memory devices 194, where the interface circuit may be utilized as an intermediate buffer or repeater chip between the memory controller 192 and at least one memory device 194. In this case, the interface circuit may be included as part of a DIMM. In one embodiment, the interface circuit may be electronically positioned between the memory controller 192 and at least one of the plurality of memory devices 194. In this case, signals from the memory controller 192 to the memory devices 194 will pass though the interface circuit.
[0026] As an option, the interface circuit may include at least one programmable I/O driver. In such case, the programmable I/O driver may be utilized to buffer the signals from memory controller 192, recover the signal waveform quality, and resend them to at least one downstream memory device 194.
[0027] More illustrative information will now be set forth regarding various optional architectures and features with which the foregoing framework may or may not be implemented, per the desires of the user. It should be strongly noted that the following information is set forth for illustrative purposes and should not be construed as limiting in any manner. Any of the following features may be optionally incorporated with or without the exclusion of other features described.
[0028] FIG. 1B shows a system 100 for providing electrical communication between a host controller chip package 102 and one or more memory devices 118. The electrical signals traverse paths from the host controller chip package 102 through a socket 104, traces 106(a)-106(b) on the surface of a printed circuit board (PCB) 107, through a DIMM connector 108, a resistor stub (Rstub) 110(a)-110(c), traces 112(a)-112(b) on the surface of the DIMMs 120, any other interface connectors or circuits 114, and finally to one or more memory devices 118 (e.g. DRAM, etc.).
[0029] As shown further, a plurality of DIMMs 120 may be provided (e.g. DIMM#1-DIMM#N). Any number of DIMMs 120 may be included. In such a configuration, the topology of the communication between the host controller chip package 102 and the memory devices 118 is called a multi-drop topology.
[0030] FIG. 1C illustrates a system 150 corresponding to a schematic representation of the topology and interconnects for FIG. 1B . As shown in FIG. 1C , a memory controller 152 which may be part of the host controller chip package 102 is connected to a buffer chip 154(a) through traces (e.g. transmission lines) 106(a) and 112(a). Similarly, the memory controller 152 is connected to a buffer chip 154(b) through traces 106(a), 106(b), and 112(b). As shown further, the memory controller 152 is connected to a buffer chip 154(c) through traces 106(a)-106(c), and 112(c). Together, the traces form a channel such that the memory controller 152 may maintain electrical communication with the plurality of memory devices 118.
[0031] It should be noted that, in various embodiments the system 150 may include a motherboard (e.g. the PCB 107), multiple connectors, multiple resistor stubs, multiple DIMMs, multiple arrays of memory devices, and multiple interface circuits, etc. Further, each buffer chips 154(a)-154(c) may be situated electrically between the memory controller 152 and corresponding memory devices 118, as shown.
[0032] It should also be noted that the system 150 may be constructed from components with various characteristics. In one embodiment, the system 150 may be constructed such that the traces 106(a)-106(c) may present an impedance (presented at point 157) of about 50 ohms to about 55 ohms. In one exemplary embodiment, the impedance of the traces 106(a)-106(c) may be 52.5 ohms.
[0033] In this case, for the data read/write channel, the resistive stubs 110(a)-110(c) may be configured to have a resistance of about 8 ohms to about 12 ohms. In one exemplary embodiment, the resistive stubs 110(a)-110(c) may have a resistance of 10 ohms. Additionally, the DIMMs 120 may have an impedance of about 35 ohms to about 45 ohms at a point of the traces 112(a)-112(c). In one exemplary embodiment, the DIMMs 120 may have an impedance of 40 ohms. In addition, the on-die termination resistors 156(a)-156(c) may be configured have a resistance of 20 Ohm, 20 Ohm, and off, respectively, if buffer chip 154(c) is the active memory device in the operation. In the prior art, for example, the resistive stubs 110(a)-110(c) may be configured as 15 Ohm and the DIMMs 120 are configured as 68 Ohm.
[0034] In this case, for the command/address channel, the resistive stubs 110(a)-110(c) may be configured to have a resistance of about 20 ohms to about 24 ohms. In one exemplary embodiment, the resistive stubs 110(a)-110(c) may have a resistance of 22 ohms. In this case, the impedance of traces 112(a)-112(c) may be about 81 ohms to about 99 ohms. In one exemplary embodiment, the impedance of the traces 112(a)-112(b) may be 90 ohms. In addition, the on-die termination resistors (input bus termination, IBT) 156(a)-156(c) may be configured have a resistance of 100 Ohm, 100 Ohm, 100 Ohm, respectively. In the prior art, for example, the resistive stubs 110(a)-110(c) are configured as 22 Ohm and the DIMMs 120 are configured as 68 Ohm. It should be noted, that all of the forgoing impedances are specific examples, and should not be construed as limiting in any manner. Such impedances may vary depending on the particular implementation and components used.
[0035] In order to realize a physical design with the characteristics as mentioned in the preceding paragraphs, several physical design techniques may be employed. For example, in order to achieve a desired impedance at a point of the traces 112(a)-112(b), a PCB manufacturing technique known as High Density Interconnect (HDI), and Build-Up technology may be employed.
[0036] HDI technology is a technique to condense integrated circuit packaging for increased microsystem density and high performance. HDI technology is sometimes used as a generic term to denote a range of technologies that may be added to normal PCB technology to increase the density of interconnect. HDI packaging minimizes the size and weight of the electronics while maximizing performance. HDI allows three-dimensional wafer-scale packaging of integrated circuits. In context of the present description the particular features of HDI technology that are used are the thin layers used as insulating material between conducting layers and micro-via holes that connect conducting layers and are drilled through the thin insulating layers.
[0037] One way of constructing the thin insulating layers is using build-up technology, although other methods may equally be employed. One way of creating micro-vias is to use a laser to drill a precision hole through thin build-up layers, although other methods may equally be employed. By using a laser to direct-write patterns of interconnect layouts and drill micro-via holes, individual chips may be connected to each other using standard semiconductor fabrication methods. The thin insulating layers and micro-vias provided by HDI technology allow precise control over the transmission line impedance of the PCB interconnect as well as the unwanted parasitic impedances of the PCB interconnect.
[0038] In another embodiment, a micro-via manufacturing technique may be utilized to achieve the desired impedance at a point of the traces 112(a)-112(c). Micro-via technology implements a via between layers of a PCB wherein the via traverses only between the specific two layers of the PCB, resulting in elimination of redundant open via stubs with conventional through-hole vias, a much lower parasitic capacitance, a much smaller impedance discontinuity and accordingly a much lower amplitude of reflections. In the context of the present description, a via refers to any pad or strip with a plated hole that connects tracks from one layer of a substrate (e.g. a PCB) to another layer or layers.
[0039] Additionally, in order to achieve better electrical signal performance, a PCB manufacturing technique known as flip-chip may be employed. Flip chip package technology implements signal connectivity between the package and a die that uses much less (and often a shortened run-length of) conductive material than other similarly purposed technologies employed for the stated connectivity such as wire bond, and therefore presents a much lower serial inductance, and accordingly a much lower impedance discontinuity and lower inductive crosstalk.
[0040] To further extend the read cycle signal integrity between the memory controller 152 and the memory devices 118, a programmable I/O driver may be employed. In this case, the driver may be capable of presenting a range of drive strengths (e.g. drive strengths 1-N, where N is an integer). Each of the drive strength settings normally corresponds to a different value of effective or average driver resistance or impedance, though other factors such as shape, effective resistance, etc. of the drive curve at different voltage levels may also be varied. Such a strength value may be programmed using a variety of well known techniques, including setting the strength of the programmable buffer as a response to a command originating or sent through the memory controller 152. Due to the nature of the multi-drop topology, the read path desires stronger driver strength than what memory devices on regular Register-DIMM can provide.
[0041] The components that contribute to the characteristics of the aforementioned channel are designed to provide an interconnection capable of conveying high-speed signal transitions. Table 1 shows specific memory cycles (namely, READ, WRITE, and CMD) illustrating the performance characteristics of a generic solution of the prior art, representative of commercial standards, versus an implementation of one embodiment discussed in the context of the present description. It should be noted that long valid data times (e.g. valid windows) supporting high frequency memory reads and writes are both highly valued, and elusive.
[0042]
| TABLE 1 | ||||
|---|---|---|---|---|
| Generic Embodiments | Presently Discussed Embodiments | |||
| Impedance | Valid | Impedance | Valid | |
| Path | Matching | Window | Matching | Window |
| READ | ~70 ohm | 300 | ~40 ohm | 700 |
| driving | picoseconds | driving | picoseconds | |
| into 40 | into 40 | |||
| ohm in | ohm in | |||
| parallel | parallel | |||
| with 40 | with 40 | |||
| ohm | ohm | |||
| WRITE | ~40 ohms | 280 | ~40 ohm | 580 |
| driving | picoseconds | driving | picoseconds | |
| into 80 in | into 50 | |||
| parallel | ohm in | |||
| with 40 | parallel | |||
| with 40 | ||||
| ohm | ||||
| CMD | 630 | 1 | ||
| picoseconds | nanosecond | |||
[0043] As shown in Table 1, impedance matching of the presently discussed embodiments are nearly symmetric. This is in stark contrast to the extreme asymmetric nature of the prior art. In the context of the present description, impedance matching refers to configuring the impedances of different transmission line segments in a channel so that the impedance variation along the channel remains minimal. There are challenges for achieving good impedance match on both read and write directions for a multi-drop channel topology. Additionally, not only the differences in symmetry between the READ and WRITE paths that are evident, but also the related characteristics as depicted in FIGS. 2-4 discussed below.
[0044] FIGS. 2A and 2B depict eye diagrams 200 and 250 for a data READ cycle for double-data-rate three (DDR3) dual rank synchronous dynamic random access memory (SDRAM) at a speed of 1067 Mbps. FIG. 2A substantially illustrates the data shown for the generic READ memory cycle associated with the prior art. In particular, FIG. 2A shows a time that an eye is almost closed.
[0045] More specifically the time that high signals 202 is above the high DC input threshold Vih(DC) voltage and the time that the low signals 204 are below the lower DC input threshold Vil(DC) voltage defines a valid window 206 (i.e. the eye). As can be seen by inspection, the valid window 206 of FIG. 2A is only about 300 picoseconds, while the valid window 206 of an implementation of the presently discussed embodiments is about 700 picoseconds, as shown in FIG. 2B , which is more than twice as long as the prior art.
[0046] In similar fashion, FIGS. 3A and 3B depict eye diagrams 300 and 350 for a data WRITE cycle. Inspection of FIG. 3A illustrates data for the WRITE cycle associated with the prior art. More specifically, the time that high signals 302 are above the Vih(AC) voltage and the time that low signals 304 are below the Vil(DC) voltage defines a valid window 306. As can be seen by inspection, the valid window of FIG. 3A is only about 350 picoseconds, while the valid window 306 of an implementation of the presently discussed embodiments is about 610 picoseconds, as shown in FIG. 3B .
[0047] FIGS. 4A and 4B depict eye diagrams 400 and 450 for a CMD cycle. Inspection of FIG. 4A illustrates data for the CMD cycle associated with the prior art. More specifically a time that high signals 402 is above the Vih(AC) voltage and a time that low signals 404 are below the Vil(DC) voltage defines the valid window 406. As can be seen by inspection, the valid window 406 of FIG. 4A is only about 700 picoseconds, while the valid window 406 of the presently discussed embodiments as shown in FIG. 4B is about 1.05 nanoseconds.
[0048] FIGS. 5A and 5B depict a memory module (e.g. a DIMM) 500 and a corresponding buffer chip 502 which may be utilized in the context of the details of the FIGS. 1-4 . For example, the memory module 500 and the buffer chip 502 may be utilized in the context of the DIMMs 120 of FIGS. 1B and 1C .
[0049] FIG. 6 shows a system 600 including a system device 606 coupled to an interface circuit 602 and a plurality of memory circuits 604A-604N, in accordance with one embodiment. Although the interface circuit 602 is illustrated as an individual circuit, the interface circuit may also be represented by a plurality of interface circuits, each corresponding to one of the plurality of memory circuits 604A-604N.
[0050] In one embodiment, and as exemplified in FIG. 6 , the memory circuits 604A-604N may be symmetrical, such that each has the same capacity, type, speed, etc. Of course, in other embodiments, the memory circuits 604A-604N may be asymmetrical. For ease of illustration only, four such memory circuits 604A-604N are shown, but actual embodiments may use any number of memory circuits. As will be discussed below, the memory chips may optionally be coupled to a memory module (not shown), such as a DIMM.
[0051] The system device 606 may be any type of system capable of requesting and/or initiating a process that results in an access of the memory circuits. The system may include a memory controller (not shown) through which it accesses the memory circuits 604A-604N.
[0052] The interface circuit 602 may also include any circuit or logic capable of directly or indirectly communicating with the memory circuits, such as a memory controller, a buffer chip, advanced memory buffer (AMB) chip, etc. The interface circuit 602 interfaces a plurality of signals 608 between the system device 606 and the memory circuits 604A-604N. Such signals 608 may include, for example, data signals, address signals, control signals, clock signals, and so forth.
[0053] In some embodiments, all of the signals communicated between the system device 606 and the memory circuits 604A-604N may be communicated via the interface circuit 602. In other embodiments, some other signals 610 are communicated directly between the system device 606 (or some component thereof, such as a memory controller, or a register, etc.) and the memory circuits 604A-604N, without passing through the interface circuit 602.
[0054] As pertains to optimum channel design for a memory system, the presence of a buffer chip between the memory controller and the plurality of memory circuits 604A-604N may present a single smaller capacitive load on a channel as compared with multiple loads that would be presented by the plurality of memory devices in multiple rank DIMM systems, in absence of any buffer chip.
[0055] The presence of an interface circuit 602 may facilitate use of an input buffer design that has a lower input threshold requirement than normal memory chips. In other words, the interface circuit 602 is capable of receiving more noisy signals, or higher speed signals from the memory controller side than regular memory chips. Similarly, the presence of the interface circuit 602 may facilitate use of an output buffer design that is capable of not only driving with wider strength range, but also driving with wider range of edge rates, i.e., rise time. Faster edge rate may also facilitate the signal integrity of the data read path, given voltage margin is the main limiting factor. In addition, such an output buffer can be designed to operate more linearly than regular memory device output drivers.
[0056] FIG. 7 shows a DIMM 700, in accordance with one embodiment. As shown, the DIMM includes memory (e.g. DRAM) 702, a repeater chip 704 (e.g. an interface circuit), a DIMM PCB 706, a stub resister 708, and a connector finger 710. The repeater chip 704, the DIMM PCB 706, the stub resister 708, and the connector finger 710 may be configured, as described in the context of the details of the above embodiments, in order to provide a high-speed interface between the DRAM 702 and a memory controller (not shown).
[0057] FIG. 8 shows a graph 800 of a transfer function of a read function, in accordance with one embodiment. As shown, a transfer function 802 for the optimized memory channel design indicates significant improvement of channel bandwidth compared to a transfer function 804 of the original channel design on a wide range of frequencies. In this case, the graph 800 represents an experiment with a DDR3, 3 DIMMs per channel topology, using a 1.4 volt power supply voltage on the stimulus source.
[0058] While various embodiments have been described above, it should be understood that they have been presented by way of example only, and not limitation. For example, although the foregoing embodiments have been described using a defined number of DIMMs, any number of DIMMs per channel (DPC) or operating frequency of similar memory technologies [Graphics DDR (GDDR), DDR, etc.] may be utilized. Thus, the breadth and scope of a preferred embodiment should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims
What is claimed is:
1. A system, comprising:
a plurality of memory devices; and
a channel, comprising:
a transmission line, wherein the transmission line includes thin layers of insulating material between conducting layers and micro-via holes connecting conducting layers through the thin insulating layers; and
an interface circuit, wherein the interface circuit includes a programmable I/O driver operable to be programmed to present any one of a plurality of driver impedances;
wherein the channel is configured to provide electrical communication between a memory controller and a first memory device of the plurality of memory devices, and
wherein at least one of a target impedance of the transmission line or a driver impedance of the programmable I/O driver provides impedance matching between the memory controller and the first memory device.
2. The system of claim 1, wherein the channel includes a respective connection to each of a plurality of dual in-line memory modules (DIMMs), and wherein the first memory device is on a first DIMM of the plurality of DIMMs.
3. The system of claim 2, wherein the channel further comprises a DIMM connector and a resistor stub of the first DIMM.
4. The system of claim 2, wherein the channel is configured to provide an impedance control to adjust signal integrity properties of a read path of the plurality of DIMMs.
5. The system of claim 2, wherein the channel is configured to provide an impedance control to adjust signal integrity properties of a write path of the plurality of DIMMs.
6. The system of claim 2, wherein the interface circuit is on the first DIMM as a flip-chip package.
7. The system of claim 1, wherein the channel includes a connection to a printed circuit board (PCB).
8. The system of claim 7, wherein the printed circuit board includes the transmission line.
9. The system of claim 7, wherein the interface circuit is on the PCB as a flip-chip package.
10. The system of claim 1, wherein the programmable I/O driver provides bi-directional impedance matching between the memory controller and the first memory device.
11. The system of claim 1, wherein the channel includes a read path and a write path.
12. The system of claim 11, wherein the matched impedance of the channel in the read path is substantially equal to the matched impedance of the channel in the write path.
13. A sub-system, comprising:
a first memory device;
a circuit board comprising a transmission line, wherein the transmission line includes a thin layer of insulating material between two conducting layers and micro-via holes connecting the conducting layers through the thin layer of insulating material; and
an interface circuit configured to present, on a channel between the first memory device and a memory controller, any one of a plurality of driver impedances based on a received command from the memory controller and an effective impedance of the transmission line.
14. The sub-system of claim 13, further comprising a channel configured to provide electrical communication between the memory controller and the first memory device, the channel including the transmission line and the interface circuit, wherein at least one of a target impedance of the transmission line or a driver impedance presented by the interface circuit provides impedance matching between the memory controller and the first memory device.
15. The sub-system of claim 13, wherein the channel includes a read path and a write path.
16. The sub-system of claim 15, wherein the matched impedance of the channel in the read path is substantially equal to the matched impedance of the channel in the write path.
17. A method comprising:
providing electrical communication between a memory controller and a memory device through a channel that includes a transmission line that includes thin layers of insulating material between two conducting layers and micro-via holes connecting the conducting layers through the thin insulating layers;
receiving a command from the memory controller directed to the memory device;
determining a driver impedance based on the received command; and
presenting the driver impedance on the channel to match an impedance on the transmission line between the memory controller and the memory device.
18. The method of claim 17, wherein determining a driver impedance based on the received command further comprising determining a first driver impedance based on a read command that is different from a second driver impedance determined based on a write command.
19. The method of claim 18, wherein a matched impedance of the channel in a read path is substantially equal to a matched impedance of the channel in a write path.
20. The method of claim 17, wherein determining a driver impedance further comprising selecting the driver impedance from a plurality of predetermined impedances based on the received command.
Patent Citations (889)
| Patent | Date | Inventor | Cited By |
|---|---|---|---|
| US3800292(A) | 1974-03-01 | Curley et al. | Applicant |
| US4069452(A) | 1978-01-01 | Conway et al. | Applicant |
| US4323965(A) | 1982-04-01 | Johnson et al. | Applicant |
| US4334307(A) | 1982-06-01 | Bourgeois et al. | Applicant |
| US4345319(A) | 1982-08-01 | Bernardini et al. | Applicant |
| US4392212(A) | 1983-07-01 | Miyasaka et al. | Applicant |
| US4500958(A) | 1985-02-01 | Manton et al. | Applicant |
| US4525921(A) | 1985-07-01 | Carson et al. | Applicant |
| US4566082(A) | 1986-01-01 | Anderson | Applicant |
| US4592019(A) | 1986-05-01 | Huang et al. | Applicant |
| US4646128(A) | 1987-02-01 | Carson et al. | Applicant |
| US4698748(A) | 1987-10-01 | Juzswik et al. | Applicant |
| US4706166(A) | 1987-11-01 | Go | Applicant |
| US4710903(A) | 1987-12-01 | Hereth et al. | Applicant |
| US4764846(A) | 1988-08-01 | Go | Applicant |
| US4780843(A) | 1988-10-01 | Tietjen | Applicant |
| US4794597(A) | 1988-12-01 | Ooba et al. | Applicant |
| US4796232(A) | 1989-01-01 | House | Applicant |
| US4807191(A) | 1989-02-01 | Flannagan | Applicant |
| US4841440(A) | 1989-06-01 | Yonezu et al. | Applicant |
| US4862347(A) | 1989-08-01 | Rudy | Applicant |
| US4884237(A) | 1989-11-01 | Mueller et al. | Applicant |
| US4887240(A) | 1989-12-01 | Garverick et al. | Applicant |
| US4888687(A) | 1989-12-01 | Allison et al. | Applicant |
| US4899107(A) | 1990-02-01 | Corbett et al. | Applicant |
| US4912678(A) | 1990-03-01 | Mashiko | Applicant |
| US4922451(A) | 1990-05-01 | Lo et al. | Applicant |
| US4935734(A) | 1990-06-01 | Austin | Applicant |
| US4937791(A) | 1990-06-01 | Steele et al. | Applicant |
| US4956694(A) | 1990-09-01 | Eide | Applicant |
| US4982265(A) | 1991-01-01 | Watanabe et al. | Applicant |
| US4983533(A) | 1991-01-01 | Go | Applicant |
| US5025364(A) | 1991-06-01 | Zellmer | Applicant |
| US5072424(A) | 1991-12-01 | Brent et al. | Applicant |
| US5083266(A) | 1992-01-01 | Watanabe | Applicant |
| US5104820(A) | 1992-04-01 | Go et al. | Applicant |
| US5193072(A) | 1993-03-01 | Frenkil et al. | Applicant |
| US5212666(A) | 1993-05-01 | Takeda | Applicant |
| US5220672(A) | 1993-06-01 | Nakao et al. | Applicant |
| US5222014(A) | 1993-06-01 | Lin | Applicant |
| US5241266(A) | 1993-08-01 | Ahmad et al. | Applicant |
| US5252807(A) | 1993-10-01 | Chizinsky | Applicant |
| US5257233(A) | 1993-10-01 | Schaefer | Applicant |
| US5278796(A) | 1994-01-01 | Tillinghast et al. | Applicant |
| US5282177(A) | 1994-01-01 | McLaury | Applicant |
| US5332922(A) | 1994-07-01 | Oguchi et al. | Applicant |
| US5347428(A) | 1994-09-01 | Carson et al. | Applicant |
| US5369749(A) | 1994-11-01 | Baker et al. | Applicant |
| US5384745(A) | 1995-01-01 | Konishi et al. | Applicant |
| US5388265(A) | 1995-02-01 | Volk | Applicant |
| US5390334(A) | 1995-02-01 | Harrison | Applicant |
| US5392251(A) | 1995-02-01 | Manning | Applicant |
| US5408190(A) | 1995-04-01 | Wood et al. | Applicant |
| US5432729(A) | 1995-07-01 | Carson et al. | Applicant |
| US5448511(A) | 1995-09-01 | Paurus et al. | Applicant |
| US5453434(A) | 1995-09-01 | Albaugh et al. | Applicant |
| US5467455(A) | 1995-11-01 | Gay et al. | Applicant |
| US5483497(A) | 1996-01-01 | Mochizuki et al. | Applicant |
| US5498886(A) | 1996-03-01 | Hsu et al. | Applicant |
| US5502333(A) | 1996-03-01 | Bertin et al. | Applicant |
| US5502667(A) | 1996-03-01 | Bertin et al. | Applicant |
| US5513135(A) | 1996-04-01 | Dell et al. | Applicant |
| US5513339(A) | 1996-04-01 | Agrawal et al. | Applicant |
| US5519832(A) | 1996-05-01 | Warchol | Applicant |
| US5526320(A) | 1996-06-01 | Zagar et al. | Applicant |
| US5530836(A) | 1996-06-01 | Busch et al. | Applicant |
| US5550781(A) | 1996-08-01 | Sugawara et al. | Applicant |
| US5559990(A) | 1996-09-01 | Cheng et al. | Applicant |
| US5561622(A) | 1996-10-01 | Bertin et al. | Applicant |
| US5563086(A) | 1996-10-01 | Bertin et al. | Applicant |
| US5566344(A) | 1996-10-01 | Hall et al. | Applicant |
| US5581498(A) | 1996-12-01 | Ludwig et al. | Applicant |
| US5581779(A) | 1996-12-01 | Hall et al. | Applicant |
| US5590071(A) | 1996-12-01 | Kolor et al. | Applicant |
| US5598376(A) | 1997-01-01 | Merritt et al. | Applicant |
| US5604714(A) | 1997-02-01 | Manning et al. | Applicant |
| US5606710(A) | 1997-02-01 | Hall et al. | Applicant |
| US5608262(A) | 1997-03-01 | Degani et al. | Applicant |
| US5610864(A) | 1997-03-01 | Manning | Applicant |
| US5623686(A) | 1997-04-01 | Hall et al. | Applicant |
| US5627791(A) | 1997-05-01 | Wright et al. | Applicant |
| US5640337(A) | 1997-06-01 | Huang et al. | Applicant |
| US5640364(A) | 1997-06-01 | Merritt et al. | Applicant |
| US5652724(A) | 1997-07-01 | Manning | Applicant |
| US5654204(A) | 1997-08-01 | Anderson | Applicant |
| US5661677(A) | 1997-08-01 | Rondeau et al. | Applicant |
| US5661695(A) | 1997-08-01 | Zagar et al. | Applicant |
| US5668773(A) | 1997-09-01 | Zagar et al. | Applicant |
| US5675549(A) | 1997-10-01 | Ong et al. | Applicant |
| US5680342(A) | 1997-10-01 | Frankeny | Applicant |
| US5682354(A) | 1997-10-01 | Manning | Applicant |
| US5692121(A) | 1997-11-01 | Bozso et al. | Applicant |
| US5692202(A) | 1997-11-01 | Kardach et al. | Applicant |
| US5696732(A) | 1997-12-01 | Zagar et al. | Applicant |
| US5696929(A) | 1997-12-01 | Hasbun et al. | Applicant |
| US5702984(A) | 1997-12-01 | Bertin et al. | Applicant |
| US5703813(A) | 1997-12-01 | Manning et al. | Applicant |
| US5706247(A) | 1998-01-01 | Merritt et al. | Applicant |
| USRE35733(E) | 1998-02-01 | Hernandez et al. | Applicant |
| US5717654(A) | 1998-02-01 | Manning | Applicant |
| US5721859(A) | 1998-02-01 | Manning | Applicant |
| US5724288(A) | 1998-03-01 | Cloud et al. | Applicant |
| US5729503(A) | 1998-03-01 | Manning | Applicant |
| US5729504(A) | 1998-03-01 | Cowles | Applicant |
| US5742792(A) | 1998-04-01 | Yanai et al. | Applicant |
| US5748914(A) | 1998-05-01 | Barth et al. | Applicant |
| US5752045(A) | 1998-05-01 | Chen | Applicant |
| US5757703(A) | 1998-05-01 | Merritt et al. | Applicant |
| US5760478(A) | 1998-06-01 | Bozso et al. | Applicant |
| US5761703(A) | 1998-06-01 | Bolyn | Applicant |
| US5781766(A) | 1998-07-01 | Davis | Applicant |
| US5787457(A) | 1998-07-01 | Miller et al. | Applicant |
| US5798961(A) | 1998-08-01 | Heyden et al. | Applicant |
| US5802010(A) | 1998-09-01 | Zagar et al. | Applicant |
| US5802395(A) | 1998-09-01 | Connolly et al. | Applicant |
| US5802555(A) | 1998-09-01 | Shigeeda | Applicant |
| US5812488(A) | 1998-09-01 | Zagar et al. | Applicant |
| US5818788(A) | 1998-10-01 | Kimura et al. | Applicant |
| US5819065(A) | 1998-10-01 | Chilton et al. | Applicant |
| US5831833(A) | 1998-11-01 | Shirakawa et al. | Applicant |
| US5831931(A) | 1998-11-01 | Manning | Applicant |
| US5831932(A) | 1998-11-01 | Merritt et al. | Applicant |
| US5834838(A) | 1998-11-01 | Anderson | Applicant |
| US5835435(A) | 1998-11-01 | Bogin et al. | Applicant |
| US5838165(A) | 1998-11-01 | Chatter | Applicant |
| US5838177(A) | 1998-11-01 | Keeth | Applicant |
| US5841580(A) | 1998-11-01 | Farmwald et al. | Applicant |
| US5843799(A) | 1998-12-01 | Hsu et al. | Applicant |
| US5843807(A) | 1998-12-01 | Burns | Applicant |
| US5845108(A) | 1998-12-01 | Yoo et al. | Applicant |
| US5850368(A) | 1998-12-01 | Ong et al. | Applicant |
| US5859792(A) | 1999-01-01 | Rondeau et al. | Applicant |
| US5860106(A) | 1999-01-01 | Domen et al. | Applicant |
| US5870347(A) | 1999-02-01 | Keeth et al. | Applicant |
| US5870350(A) | 1999-02-01 | Bertin et al. | Applicant |
| US5872907(A) | 1999-02-01 | Griess et al. | Applicant |
| US5875142(A) | 1999-02-01 | Chevallier | Applicant |
| US5878279(A) | 1999-03-01 | Athenes | Applicant |
| US5884088(A) | 1999-03-01 | Kardach et al. | Applicant |
| US5901105(A) | 1999-05-01 | Ong et al. | Applicant |
| US5903500(A) | 1999-05-01 | Tsang et al. | Applicant |
| US5905688(A) | 1999-05-01 | Park | Applicant |
| US5907512(A) | 1999-05-01 | Parkinson et al. | Applicant |
| US5910010(A) | 1999-06-01 | Nishizawa et al. | Applicant |
| US5913072(A) | 1999-06-01 | Wierenga | Applicant |
| US5915105(A) | 1999-06-01 | Farmwald et al. | Applicant |
| US5915167(A) | 1999-06-01 | Leedy | Applicant |
| US5917758(A) | 1999-06-01 | Keeth | Applicant |
| US5923611(A) | 1999-07-01 | Ryan | Applicant |
| US5924111(A) | 1999-07-01 | Huang et al. | Applicant |
| US5926435(A) | 1999-07-01 | Park et al. | Applicant |
| US5929650(A) | 1999-07-01 | Pappert et al. | Applicant |
| US5943254(A) | 1999-08-01 | Bakeman, Jr. et al. | Applicant |
| US5946265(A) | 1999-08-01 | Cowles | Applicant |
| US5949254(A) | 1999-09-01 | Keeth | Applicant |
| US5953215(A) | 1999-09-01 | Karabatsos | Applicant |
| US5953263(A) | 1999-09-01 | Farmwald et al. | Applicant |
| US5954804(A) | 1999-09-01 | Farmwald et al. | Applicant |
| US5956233(A) | 1999-09-01 | Yew et al. | Applicant |
| US5962435(A) | 1999-10-01 | Mao et al. | Applicant |
| US5963429(A) | 1999-10-01 | Chen | Applicant |
| US5963463(A) | 1999-10-01 | Rondeau et al. | Applicant |
| US5963464(A) | 1999-10-01 | Dell et al. | Applicant |
| US5963504(A) | 1999-10-01 | Manning | Applicant |
| US5966724(A) | 1999-10-01 | Ryan | Applicant |
| US5966727(A) | 1999-10-01 | Nishino | Applicant |
| US5969996(A) | 1999-10-01 | Muranaka et al. | Applicant |
| US5973392(A) | 1999-10-01 | Senba et al. | Applicant |
| US5978304(A) | 1999-11-01 | Crafts | Applicant |
| US5995424(A) | 1999-11-01 | Lawrence et al. | Applicant |
| US5995443(A) | 1999-11-01 | Farmwald et al. | Applicant |
| US6001671(A) | 1999-12-01 | Fjelstad | Applicant |
| US6002613(A) | 1999-12-01 | Cloud et al. | Applicant |
| US6002627(A) | 1999-12-01 | Chevallier | Applicant |
| US6014339(A) | 2000-01-01 | Kobayashi et al. | Applicant |
| US6016282(A) | 2000-01-01 | Keeth | Applicant |
| US6026027(A) | 2000-02-01 | Terrell, II et al. | Applicant |
| US6026050(A) | 2000-02-01 | Baker et al. | Applicant |
| US6029250(A) | 2000-02-01 | Keeth | Applicant |
| US6032214(A) | 2000-02-01 | Farmwald et al. | Applicant |
| US6032215(A) | 2000-02-01 | Farmwald et al. | Applicant |
| US6034916(A) | 2000-03-01 | Lee | Applicant |
| US6034918(A) | 2000-03-01 | Farmwald et al. | Applicant |
| US6035365(A) | 2000-03-01 | Farmwald et al. | Applicant |
| US6038195(A) | 2000-03-01 | Farmwald et al. | Applicant |
| US6038673(A) | 2000-03-01 | Benn et al. | Applicant |
| US6044032(A) | 2000-03-01 | Li | Applicant |
| US6047073(A) | 2000-04-01 | Norris et al. | Applicant |
| US6047344(A) | 2000-04-01 | Kawasumi et al. | Applicant |
| US6047361(A) | 2000-04-01 | Ingenio et al. | Applicant |
| US6053948(A) | 2000-04-01 | Vaidyanathan et al. | Applicant |
| US6058451(A) | 2000-05-01 | Bermingham et al. | Applicant |
| US6065092(A) | 2000-05-01 | Roy | Applicant |
| US6069504(A) | 2000-05-01 | Keeth | Applicant |
| US6070217(A) | 2000-05-01 | Connolly et al. | Applicant |
| US6073223(A) | 2000-06-01 | McAllister et al. | Applicant |
| US6075730(A) | 2000-06-01 | Barth et al. | Applicant |
| US6075744(A) | 2000-06-01 | Tsern et al. | Applicant |
| US6078546(A) | 2000-06-01 | Lee | Applicant |
| US6079025(A) | 2000-06-01 | Fung | Applicant |
| US6084434(A) | 2000-07-01 | Keeth | Applicant |
| US6088290(A) | 2000-07-01 | Ohtake et al. | Applicant |
| US6091251(A) | 2000-07-01 | Wood et al. | Applicant |
| USRE36839(E) | 2000-08-01 | Simmons et al. | Applicant |
| US6101152(A) | 2000-08-01 | Farmwald et al. | Applicant |
| US6101564(A) | 2000-08-01 | Athenes et al. | Applicant |
| US6108795(A) | 2000-08-01 | Jeddeloh | Applicant |
| US6111812(A) | 2000-08-01 | Gans et al. | Applicant |
| US6125072(A) | 2000-09-01 | Wu | Applicant |
| US6134638(A) | 2000-10-01 | Olarig et al. | Applicant |
| US6154370(A) | 2000-11-01 | Degani et al. | Applicant |
| US6166991(A) | 2000-12-01 | Phelan | Applicant |
| US6181640(B1) | 2001-01-01 | Kang | Applicant |
| US6182184(B1) | 2001-01-01 | Farmwald et al. | Applicant |
| US6199151(B1) | 2001-03-01 | Williams et al. | Applicant |
| US6208168(B1) | 2001-03-01 | Rhee | Applicant |
| US6216246(B1) | 2001-04-01 | Shau | Applicant |
| US6222739(B1) | 2001-04-01 | Bhakta et al. | Applicant |
| US6226709(B1) | 2001-05-01 | Goodwin et al. | Applicant |
| US6226730(B1) | 2001-05-01 | Murdoch et al. | Applicant |
| US6233192(B1) | 2001-05-01 | Tanaka | Applicant |
| US6233650(B1) | 2001-05-01 | Johnson et al. | Applicant |
| US6240048(B1) | 2001-05-01 | Matsubara | Applicant |
| US6243282(B1) | 2001-06-01 | Rondeau et al. | Applicant |
| US6252807(B1) | 2001-06-01 | Suzuki et al. | Applicant |
| US6253278(B1) | 2001-06-01 | Ryan | Applicant |
| US6260097(B1) | 2001-07-01 | Farmwald et al. | Applicant |
| US6260154(B1) | 2001-07-01 | Jeddeloh | Applicant |
| US6262938(B1) | 2001-07-01 | Lee et al. | Applicant |
| US6266285(B1) | 2001-07-01 | Farmwald et al. | Applicant |
| US6266292(B1) | 2001-07-01 | Tsern et al. | Applicant |
| US6274395(B1) | 2001-08-01 | Weber | Applicant |
| US6279069(B1) | 2001-08-01 | Robinson et al. | Applicant |
| US6295572(B1) | 2001-09-01 | Wu | Applicant |
| US6298426(B1) | 2001-10-01 | Ajanovic | Applicant |
| US6304511(B1) | 2001-10-01 | Gans et al. | Applicant |
| US6307769(B1) | 2001-10-01 | Nuxoll et al. | Applicant |
| US6314051(B1) | 2001-11-01 | Farmwald et al. | Applicant |
| US6317352(B1) | 2001-11-01 | Halbert et al. | Applicant |
| US6317381(B1) | 2001-11-01 | Gans et al. | Applicant |
| US6324120(B2) | 2001-11-01 | Farmwald et al. | Applicant |
| US6326810(B1) | 2001-12-01 | Keeth | Applicant |
| US6327664(B1) | 2001-12-01 | Dell et al. | Applicant |
| US6330683(B1) | 2001-12-01 | Jeddeloh | Applicant |
| US6336174(B1) | 2002-01-01 | Li et al. | Applicant |
| US6338108(B1) | 2002-01-01 | Motomura | Applicant |
| US6338113(B1) | 2002-01-01 | Kubo et al. | Applicant |
| US6341347(B1) | 2002-01-01 | Joy et al. | Applicant |
| US6343019(B1) | 2002-01-01 | Jiang et al. | Applicant |
| US6343042(B1) | 2002-01-01 | Tsern et al. | Applicant |
| US6353561(B1) | 2002-03-01 | Funyu et al. | Applicant |
| US6356105(B1) | 2002-03-01 | Volk | Applicant |
| US6356500(B1) | 2002-03-01 | Cloud et al. | Applicant |
| US6362656(B2) | 2002-03-01 | Rhee | Applicant |
| US6363031(B2) | 2002-03-01 | Phelan | Applicant |
| US6378020(B2) | 2002-04-01 | Farmwald et al. | Applicant |
| US6381188(B1) | 2002-04-01 | Choi et al. | Applicant |
| US6381668(B1) | 2002-04-01 | Lunteren | Applicant |
| US6389514(B1) | 2002-05-01 | Rokicki | Applicant |
| US6392304(B1) | 2002-05-01 | Butler | Applicant |
| US6414868(B1) | 2002-07-01 | Wong et al. | Applicant |
| US6418034(B1) | 2002-07-01 | Weber et al. | Applicant |
| US6421754(B1) | 2002-07-01 | Kau et al. | Applicant |
| US6424532(B2) | 2002-07-01 | Kawamura | Applicant |
| US6426916(B2) | 2002-07-01 | Farmwald et al. | Applicant |
| US6429029(B1) | 2002-08-01 | Eldridge et al. | Applicant |
| US6430103(B2) | 2002-08-01 | Nakayama et al. | Applicant |
| US6434660(B1) | 2002-08-01 | Lambert et al. | Applicant |
| US6437600(B1) | 2002-08-01 | Keeth | Applicant |
| US6438057(B1) | 2002-08-01 | Ruckerbauer | Applicant |
| US6442698(B2) | 2002-08-01 | Nizar | Applicant |
| US6445591(B1) | 2002-09-01 | Kwong | Applicant |
| US6452826(B1) | 2002-09-01 | Kim et al. | Applicant |
| US6452863(B2) | 2002-09-01 | Farmwald et al. | Applicant |
| US6453400(B1) | 2002-09-01 | Maesako et al. | Applicant |
| US6453402(B1) | 2002-09-01 | Jeddeloh | Applicant |
| US6453434(B2) | 2002-09-01 | Delp et al. | Applicant |
| US6455348(B1) | 2002-09-01 | Yamaguchi | Applicant |
| US6457095(B1) | 2002-09-01 | Volk | Applicant |
| US6459651(B1) | 2002-10-01 | Lee et al. | Applicant |
| US6473831(B1) | 2002-10-01 | Schade | Applicant |
| US6476476(B1) | 2002-11-01 | Glenn | Applicant |
| US6480929(B1) | 2002-11-01 | Gauthier et al. | Applicant |
| US6487102(B1) | 2002-11-01 | Halbert et al. | Applicant |
| US6489669(B2) | 2002-12-01 | Shimada et al. | Applicant |
| US6490161(B1) | 2002-12-01 | Johnson | Applicant |
| US6492726(B1) | 2002-12-01 | Quek et al. | Applicant |
| US6493789(B2) | 2002-12-01 | Ware et al. | Applicant |
| US6496440(B2) | 2002-12-01 | Manning | Applicant |
| US6496897(B2) | 2002-12-01 | Ware et al. | Applicant |
| US6498766(B2) | 2002-12-01 | Lee et al. | Applicant |
| US6510097(B2) | 2003-01-01 | Fukuyama | Applicant |
| US6510503(B2) | 2003-01-01 | Gillingham et al. | Applicant |
| US6512392(B2) | 2003-01-01 | Fleury et al. | Applicant |
| US6521984(B2) | 2003-02-01 | Matsuura | Applicant |
| US6526471(B1) | 2003-02-01 | Shimomura et al. | Applicant |
| US6526473(B1) | 2003-02-01 | Kim | Applicant |
| US6526484(B1) | 2003-02-01 | Stacovsky et al. | Applicant |
| US6545895(B1) | 2003-04-01 | Li et al. | Applicant |
| US6546446(B2) | 2003-04-01 | Farmwald et al. | Applicant |
| US6553450(B1) | 2003-04-01 | Dodd et al. | Applicant |
| US6560158(B2) | 2003-05-01 | Choi et al. | Applicant |
| US6563337(B2) | 2003-05-01 | Dour | Applicant |
| US6563759(B2) | 2003-05-01 | Yahata et al. | Applicant |
| US6564281(B2) | 2003-05-01 | Farmwald et al. | Applicant |
| US6564285(B1) | 2003-05-01 | Mills et al. | Applicant |
| US6574150(B2) | 2003-06-01 | Suyama et al. | Applicant |
| US6584037(B2) | 2003-06-01 | Farmwald et al. | Applicant |
| US6587912(B2) | 2003-07-01 | Leddige et al. | Applicant |
| US6590822(B2) | 2003-07-01 | Hwang et al. | Applicant |
| US6594770(B1) | 2003-07-01 | Sato et al. | Applicant |
| US6597616(B2) | 2003-07-01 | Tsern et al. | Applicant |
| US6597617(B2) | 2003-07-01 | Ooishi et al. | Applicant |
| US6614700(B2) | 2003-09-01 | Dietrich et al. | Applicant |
| US6618267(B1) | 2003-09-01 | Dalal et al. | Applicant |
| US6618791(B1) | 2003-09-01 | Dodd et al. | Applicant |
| US6621760(B1) | 2003-09-01 | Ahmad et al. | Applicant |
| US6628538(B2) | 2003-09-01 | Funaba et al. | Applicant |
| US6630729(B2) | 2003-10-01 | Huang | Applicant |
| US6631086(B1) | 2003-10-01 | Bill et al. | Applicant |
| US6639820(B1) | 2003-10-01 | Khandekar et al. | Applicant |
| US6646939(B2) | 2003-11-01 | Kwak | Applicant |
| US6650588(B2) | 2003-11-01 | Yamagata | Applicant |
| US6650594(B1) | 2003-11-01 | Lee et al. | Applicant |
| US6657634(B1) | 2003-12-01 | Sinclair et al. | Applicant |
| US6657918(B2) | 2003-12-01 | Foss et al. | Applicant |
| US6657919(B2) | 2003-12-01 | Foss et al. | Applicant |
| US6658016(B1) | 2003-12-01 | Dai et al. | Applicant |
| US6658530(B1) | 2003-12-01 | Robertson et al. | Applicant |
| US6659512(B1) | 2003-12-01 | Harper et al. | Applicant |
| US6664625(B2) | 2003-12-01 | Hiruma | Applicant |
| US6665224(B1) | 2003-12-01 | Lehmann et al. | Applicant |
| US6665227(B2) | 2003-12-01 | Fetzer | Applicant |
| US6668242(B1) | 2003-12-01 | Reynov et al. | Applicant |
| US6674154(B2) | 2004-01-01 | Minamio et al. | Applicant |
| US6683372(B1) | 2004-01-01 | Wong et al. | Applicant |
| US6684292(B2) | 2004-01-01 | Piccirillo et al. | Applicant |
| US6690191(B2) | 2004-02-01 | Wu et al. | Applicant |
| US6697295(B2) | 2004-02-01 | Farmwald et al. | Applicant |
| US6701446(B2) | 2004-03-01 | Tsern et al. | Applicant |
| US6705877(B1) | 2004-03-01 | Li et al. | Applicant |
| US6708144(B1) | 2004-03-01 | Merryman et al. | Applicant |
| US6710430(B2) | 2004-03-01 | Minamio et al. | Applicant |
| US6711043(B2) | 2004-03-01 | Friedman et al. | Applicant |
| US6713856(B2) | 2004-03-01 | Tsai et al. | Applicant |
| US6714891(B2) | 2004-03-01 | Dendinger | Applicant |
| US6724684(B2) | 2004-04-01 | Kim | Applicant |
| US6730540(B2) | 2004-05-01 | Siniaguine | Applicant |
| US6731009(B1) | 2004-05-01 | Jones et al. | Applicant |
| US6731527(B2) | 2004-05-01 | Brown | Applicant |
| US6742098(B1) | 2004-05-01 | Halbert et al. | Applicant |
| US6744687(B2) | 2004-06-01 | Koo et al. | Applicant |
| US6747887(B2) | 2004-06-01 | Halbert et al. | Applicant |
| US6751113(B2) | 2004-06-01 | Bhakta et al. | Applicant |
| US6751696(B2) | 2004-06-01 | Farmwald et al. | Applicant |
| US6754129(B2) | 2004-06-01 | Khateri et al. | Applicant |
| US6754132(B2) | 2004-06-01 | Kyung | Applicant |
| US6757751(B1) | 2004-06-01 | Gene | Applicant |
| US6762948(B2) | 2004-07-01 | Kyun et al. | Applicant |
| US6765812(B2) | 2004-07-01 | Anderson | Applicant |
| US6766469(B2) | 2004-07-01 | Larson et al. | Applicant |
| US6771526(B2) | 2004-08-01 | LaBerge | Applicant |
| US6772359(B2) | 2004-08-01 | Kwak et al. | Applicant |
| US6779097(B2) | 2004-08-01 | Gillingham et al. | Applicant |
| US6785767(B2) | 2004-08-01 | Coulson | Applicant |
| US6791877(B2) | 2004-09-01 | Miura et al. | Applicant |
| US6795899(B2) | 2004-09-01 | Dodd et al. | Applicant |
| US6799241(B2) | 2004-09-01 | Kahn et al. | Applicant |
| US6801989(B2) | 2004-10-01 | Johnson et al. | Applicant |
| US6807598(B2) | 2004-10-01 | Farmwald et al. | Applicant |
| US6807650(B2) | 2004-10-01 | Lamb et al. | Applicant |
| US6807655(B1) | 2004-10-01 | Rehani et al. | Applicant |
| US6810475(B1) | 2004-10-01 | Tardieux | Applicant |
| US6816991(B2) | 2004-11-01 | Sanghani | Applicant |
| US6819602(B2) | 2004-11-01 | Seo et al. | Applicant |
| US6819617(B2) | 2004-11-01 | Hwang et al. | Applicant |
| US6820163(B1) | 2004-11-01 | McCall et al. | Applicant |
| US6820169(B2) | 2004-11-01 | Wilcox et al. | Applicant |
| US6826104(B2) | 2004-11-01 | Kawaguchi et al. | Applicant |
| US6839290(B2) | 2005-01-01 | Ahmad et al. | Applicant |
| US6844754(B2) | 2005-01-01 | Yamagata | Applicant |
| US6845027(B2) | 2005-01-01 | Mayer et al. | Applicant |
| US6845055(B1) | 2005-01-01 | Koga et al. | Applicant |
| US6847582(B2) | 2005-01-01 | Pan | Applicant |
| US6850449(B2) | 2005-02-01 | Takahashi | Applicant |
| US6854043(B2) | 2005-02-01 | Hargis et al. | Applicant |
| US6862202(B2) | 2005-03-01 | Schaefer | Applicant |
| US6862249(B2) | 2005-03-01 | Kyung | Applicant |
| US6862653(B1) | 2005-03-01 | Dodd et al. | Applicant |
| US6873534(B2) | 2005-03-01 | Bhakta et al. | Applicant |
| US6878570(B2) | 2005-04-01 | Lyu et al. | Applicant |
| US6894933(B2) | 2005-05-01 | Kuzmenka et al. | Applicant |
| US6898683(B2) | 2005-05-01 | Nakamura | Applicant |
| US6908314(B2) | 2005-06-01 | Brown | Applicant |
| US6912778(B2) | 2005-07-01 | Ahn et al. | Applicant |
| US6914786(B1) | 2005-07-01 | Paulsen et al. | Applicant |
| US6917219(B2) | 2005-07-01 | New | Applicant |
| US6922371(B2) | 2005-07-01 | Takahashi et al. | Applicant |
| US6930900(B2) | 2005-08-01 | Bhakta et al. | Applicant |
| US6930903(B2) | 2005-08-01 | Bhakta et al. | Applicant |
| US6938119(B2) | 2005-08-01 | Kohn et al. | Applicant |
| US6943450(B2) | 2005-09-01 | Fee et al. | Applicant |
| US6944748(B2) | 2005-09-01 | Sanches et al. | Applicant |
| US6947341(B2) | 2005-09-01 | Stubbs et al. | Applicant |
| US6951982(B2) | 2005-10-01 | Chye et al. | Applicant |
| US6952794(B2) | 2005-10-01 | Lu | Applicant |
| US6961281(B2) | 2005-11-01 | Wong et al. | Applicant |
| US6968416(B2) | 2005-11-01 | Moy | Applicant |
| US6968419(B1) | 2005-11-01 | Holman | Applicant |
| US6970968(B1) | 2005-11-01 | Holman | Applicant |
| US6980021(B1) | 2005-12-01 | Srivastava et al. | Applicant |
| US6986118(B2) | 2006-01-01 | Dickman | Applicant |
| US6992501(B2) | 2006-01-01 | Rapport | Applicant |
| US6992950(B2) | 2006-01-01 | Foss et al. | Applicant |
| US7000062(B2) | 2006-02-01 | Perego et al. | Applicant |
| US7003618(B2) | 2006-02-01 | Perego et al. | Applicant |
| US7003639(B2) | 2006-02-01 | Tsern et al. | Applicant |
| US7007095(B2) | 2006-02-01 | Chen et al. | Applicant |
| US7007175(B2) | 2006-02-01 | Chang et al. | Applicant |
| US7010642(B2) | 2006-03-01 | Perego et al. | Applicant |
| US7010736(B1) | 2006-03-01 | Teh et al. | Applicant |
| US7024518(B2) | 2006-04-01 | Halbert et al. | Applicant |
| US7026708(B2) | 2006-04-01 | Cady et al. | Applicant |
| US7028215(B2) | 2006-04-01 | Depew et al. | Applicant |
| US7028234(B2) | 2006-04-01 | Huckaby et al. | Applicant |
| US7033861(B1) | 2006-04-01 | Partridge et al. | Applicant |
| US7035150(B2) | 2006-04-01 | Streif et al. | Applicant |
| US7043599(B1) | 2006-05-01 | Ware et al. | Applicant |
| US7043611(B2) | 2006-05-01 | McClannahan et al. | Applicant |
| US7045396(B2) | 2006-05-01 | Crowley et al. | Applicant |
| US7045901(B2) | 2006-05-01 | Lin et al. | Applicant |
| US7046538(B2) | 2006-05-01 | Kinsley et al. | Applicant |
| US7053470(B1) | 2006-05-01 | Sellers et al. | Applicant |
| US7053478(B2) | 2006-05-01 | Roper et al. | Applicant |
| US7058776(B2) | 2006-06-01 | Lee | Applicant |
| US7058863(B2) | 2006-06-01 | Kouchi et al. | Applicant |
| US7061784(B2) | 2006-06-01 | Jakobs et al. | Applicant |
| US7061823(B2) | 2006-06-01 | Faue et al. | Applicant |
| US7066741(B2) | 2006-06-01 | Burns et al. | Applicant |
| US7075175(B2) | 2006-07-01 | Kazi et al. | Applicant |
| US7079396(B2) | 2006-07-01 | Gates et al. | Applicant |
| US7079441(B1) | 2006-07-01 | Partsch et al. | Applicant |
| US7079446(B2) | 2006-07-01 | Murtagh et al. | Applicant |
| US7085152(B2) | 2006-08-01 | Ellis et al. | Applicant |
| US7085941(B2) | 2006-08-01 | Li | Applicant |
| US7089438(B2) | 2006-08-01 | Raad | Applicant |
| US7093101(B2) | 2006-08-01 | Aasheim et al. | Applicant |
| US7103730(B2) | 2006-09-01 | Saxena et al. | Applicant |
| US7110322(B2) | 2006-09-01 | Farmwald et al. | Applicant |
| US7111143(B2) | 2006-09-01 | Walker | Applicant |
| US7117309(B2) | 2006-10-01 | Bearden | Applicant |
| US7119428(B2) | 2006-10-01 | Tanie et al. | Applicant |
| US7120727(B2) | 2006-10-01 | Lee et al. | Applicant |
| US7126399(B1) | 2006-10-01 | Lee | Applicant |
| US7127567(B2) | 2006-10-01 | Ramakrishnan et al. | Applicant |
| US7133960(B1) | 2006-11-01 | Thompson et al. | Applicant |
| US7136978(B2) | 2006-11-01 | Miura et al. | Applicant |
| US7138823(B2) | 2006-11-01 | Janzen et al. | Applicant |
| US7149145(B2) | 2006-12-01 | Kim et al. | Applicant |
| US7149824(B2) | 2006-12-01 | Johnson | Applicant |
| US7173863(B2) | 2007-02-01 | Conley et al. | Applicant |
| US7200021(B2) | 2007-04-01 | Raghuram | Applicant |
| US7205789(B1) | 2007-04-01 | Karabatsos | Applicant |
| US7210059(B2) | 2007-04-01 | Jeddeloh | Applicant |
| US7215561(B2) | 2007-05-01 | Park et al. | Applicant |
| US7218566(B1) | 2007-05-01 | Totolos, Jr. et al. | Applicant |
| US7224595(B2) | 2007-05-01 | Dreps et al. | Applicant |
| US7228264(B2) | 2007-06-01 | Barrenscheen et al. | Applicant |
| US7231562(B2) | 2007-06-01 | Ohlhoff et al. | Applicant |
| US7233541(B2) | 2007-06-01 | Yamamoto et al. | Applicant |
| US7234081(B2) | 2007-06-01 | Nguyen et al. | Applicant |
| US7243185(B2) | 2007-07-01 | See et al. | Applicant |
| US7245541(B2) | 2007-07-01 | Janzen | Applicant |
| US7254036(B2) | 2007-08-01 | Pauley et al. | Applicant |
| US7266639(B2) | 2007-09-01 | Raghuram | Applicant |
| US7269042(B2) | 2007-09-01 | Kinsley et al. | Applicant |
| US7269708(B2) | 2007-09-01 | Ware | Applicant |
| US7274583(B2) | 2007-09-01 | Park et al. | Applicant |
| US7277333(B2) | 2007-10-01 | Schaefer | Applicant |
| US7286436(B2) | 2007-10-01 | Bhakta et al. | Applicant |
| US7289386(B2) | 2007-10-01 | Bhakta et al. | Applicant |
| US7296754(B2) | 2007-11-01 | Nishizawa et al. | Applicant |
| US7299330(B2) | 2007-11-01 | Gillingham et al. | Applicant |
| US7302598(B2) | 2007-11-01 | Suzuki et al. | Applicant |
| US7307863(B2) | 2007-12-01 | Yen et al. | Applicant |
| US7317250(B2) | 2008-01-01 | Koh et al. | Applicant |
| US7327613(B2) | 2008-02-01 | Lee | Applicant |
| US7337293(B2) | 2008-02-01 | Brittain et al. | Applicant |
| US7363422(B2) | 2008-04-01 | Perego et al. | Applicant |
| US7366947(B2) | 2008-04-01 | Gower et al. | Applicant |
| US7379316(B2) | 2008-05-01 | Rajan | Applicant |
| US7386656(B2) | 2008-06-01 | Rajan et al. | Applicant |
| US7392338(B2) | 2008-06-01 | Rajan et al. | Applicant |
| US7408393(B1) | 2008-08-01 | Jain et al. | Applicant |
| US7409492(B2) | 2008-08-01 | Tanaka et al. | Applicant |
| US7414917(B2) | 2008-08-01 | Ruckerbauer et al. | Applicant |
| US7428644(B2) | 2008-09-01 | Jeddeloh et al. | Applicant |
| US7437579(B2) | 2008-10-01 | Jeddeloh et al. | Applicant |
| US7441064(B2) | 2008-10-01 | Gaskins | Applicant |
| US7457122(B2) | 2008-11-01 | Lai et al. | Applicant |
| US7464225(B2) | 2008-12-01 | Tsern | Applicant |
| US7472220(B2) | 2008-12-01 | Rajan et al. | Applicant |
| US7474576(B2) | 2009-01-01 | Co et al. | Applicant |
| US7480147(B2) | 2009-01-01 | Hoss et al. | Applicant |
| US7480774(B2) | 2009-01-01 | Ellis et al. | Applicant |
| US7496777(B2) | 2009-02-01 | Kapil | Applicant |
| US7515453(B2) | 2009-04-01 | Rajan | Applicant |
| US7532537(B2) | 2009-05-01 | Solomon et al. | Applicant |
| US7539800(B2) | 2009-05-01 | Dell et al. | Applicant |
| US7573136(B2) | 2009-08-01 | Jiang et al. | Applicant |
| US7580312(B2) | 2009-08-01 | Rajan et al. | Applicant |
| US7581121(B2) | 2009-08-01 | Barth et al. | Applicant |
| US7581127(B2) | 2009-08-01 | Rajan et al. | Applicant |
| US7590796(B2) | 2009-09-01 | Rajan et al. | Applicant |
| US7599205(B2) | 2009-10-01 | Rajan | Applicant |
| US7606245(B2) | 2009-10-01 | Ma et al. | Applicant |
| US7609567(B2) | 2009-10-01 | Rajan et al. | Applicant |
| US7613880(B2) | 2009-11-01 | Miura et al. | Applicant |
| US7619912(B2) | 2009-11-01 | Bhakta et al. | Applicant |
| US7724589(B2) | 2010-05-01 | Rajan et al. | Applicant |
| US7730338(B2) | 2010-06-01 | Rajan et al. | Applicant |
| US7761724(B2) | 2010-07-01 | Rajan et al. | Applicant |
| US7934070(B2) | 2011-04-01 | Brittain et al. | Applicant |
| US7990797(B2) | 2011-08-01 | Moshayedi et al. | Applicant |
| US8111566(B1) | 2012-02-01 | Wang et al. | Examiner |
| US8116144(B2) | 2012-02-01 | Shaw et al. | Applicant |
| US8279690(B1) | 2012-10-01 | Wang et al. | Examiner |
| US2001/0000822(A1) | 2001-05-01 | Dell et al. | Applicant |
| US2001/0003198(A1) | 2001-06-01 | Wu | Applicant |
| US2001/0011322(A1) | 2001-08-01 | Stolt et al. | Applicant |
| US2001/0019509(A1) | 2001-09-01 | Aho et al. | Applicant |
| US2001/0021106(A1) | 2001-09-01 | Weber et al. | Applicant |
| US2001/0021137(A1) | 2001-09-01 | Kai et al. | Applicant |
| US2001/0046129(A1) | 2001-11-01 | Broglia et al. | Applicant |
| US2001/0046163(A1) | 2001-11-01 | Yaganawa | Applicant |
| US2001/0052062(A1) | 2001-12-01 | Lipovski | Applicant |
| US2002/0002662(A1) | 2002-01-01 | Olarig et al. | Applicant |
| US2002/0004897(A1) | 2002-01-01 | Kao et al. | Applicant |
| US2002/0015340(A1) | 2002-02-01 | Batinovich | Applicant |
| US2002/0019961(A1) | 2002-02-01 | Blodgett | Applicant |
| US2002/0034068(A1) | 2002-03-01 | Weber et al. | Applicant |
| US2002/0038405(A1) | 2002-03-01 | Leddige et al. | Applicant |
| US2002/0040416(A1) | 2002-04-01 | Tsern et al. | Applicant |
| US2002/0041507(A1) | 2002-04-01 | Woo et al. | Applicant |
| US2002/0051398(A1) | 2002-05-01 | Mizugaki | Applicant |
| US2002/0060945(A1) | 2002-05-01 | Ikeda | Applicant |
| US2002/0060948(A1) | 2002-05-01 | Chang et al. | Applicant |
| US2002/0064073(A1) | 2002-05-01 | Chien | Applicant |
| US2002/0064083(A1) | 2002-05-01 | Ryu et al. | Applicant |
| US2002/0089831(A1) | 2002-07-01 | Forthun | Applicant |
| US2002/0089970(A1) | 2002-07-01 | Asada et al. | Applicant |
| US2002/0094671(A1) | 2002-07-01 | Distefano et al. | Applicant |
| US2002/0121650(A1) | 2002-09-01 | Minamio et al. | Applicant |
| US2002/0121670(A1) | 2002-09-01 | Minamio et al. | Applicant |
| US2002/0124195(A1) | 2002-09-01 | Nizar | Applicant |
| US2002/0129204(A1) | 2002-09-01 | Leighnor et al. | Applicant |
| US2002/0145900(A1) | 2002-10-01 | Schaefer | Applicant |
| US2002/0165706(A1) | 2002-11-01 | Raynham | Applicant |
| US2002/0167092(A1) | 2002-11-01 | Fee et al. | Applicant |
| US2002/0172024(A1) | 2002-11-01 | Hui et al. | Applicant |
| US2002/0174274(A1) | 2002-11-01 | Wu et al. | Applicant |
| US2002/0184438(A1) | 2002-12-01 | Usui | Applicant |
| US2003/0002262(A1) | 2003-01-01 | Benisek et al. | Applicant |
| US2003/0011993(A1) | 2003-01-01 | Summers et al. | Applicant |
| US2003/0016550(A1) | 2003-01-01 | Yoo et al. | Applicant |
| US2003/0021175(A1) | 2003-01-01 | Tae Kwak | Applicant |
| US2003/0026155(A1) | 2003-02-01 | Yamagata | Applicant |
| US2003/0026159(A1) | 2003-02-01 | Frankowsky et al. | Applicant |
| US2003/0035312(A1) | 2003-02-01 | Halbert et al. | Applicant |
| US2003/0039158(A1) | 2003-02-01 | Horiguchi et al. | Applicant |
| US2003/0041295(A1) | 2003-02-01 | Hou et al. | Applicant |
| US2003/0061458(A1) | 2003-03-01 | Wilcox et al. | Applicant |
| US2003/0061459(A1) | 2003-03-01 | Aboulenein et al. | Applicant |
| US2003/0083855(A1) | 2003-05-01 | Fukuyama | Applicant |
| US2003/0088743(A1) | 2003-05-01 | Rader | Applicant |
| US2003/0093614(A1) | 2003-05-01 | Kohn et al. | Applicant |
| US2003/0101392(A1) | 2003-05-01 | Lee | Applicant |
| US2003/0105932(A1) | 2003-06-01 | David et al. | Applicant |
| US2003/0110339(A1) | 2003-06-01 | Calvignac et al. | Applicant |
| US2003/0117875(A1) | 2003-06-01 | Lee et al. | Applicant |
| US2003/0123389(A1) | 2003-07-01 | Russell et al. | Applicant |
| US2003/0126338(A1) | 2003-07-01 | Dodd et al. | Applicant |
| US2003/0127737(A1) | 2003-07-01 | Takahashi | Applicant |
| US2003/0131160(A1) | 2003-07-01 | Hampel et al. | Applicant |
| US2003/0145163(A1) | 2003-07-01 | Seo et al. | Applicant |
| US2003/0158995(A1) | 2003-08-01 | Lee et al. | Applicant |
| US2003/0164539(A1) | 2003-09-01 | Yau | Applicant |
| US2003/0164543(A1) | 2003-09-01 | Kheng Lee | Applicant |
| US2003/0174569(A1) | 2003-09-01 | Amidi | Applicant |
| US2003/0182513(A1) | 2003-09-01 | Dodd et al. | Applicant |
| US2003/0183934(A1) | 2003-10-01 | Barrett | Applicant |
| US2003/0189868(A1) | 2003-10-01 | Riesenman et al. | Applicant |
| US2003/0189870(A1) | 2003-10-01 | Wilcox | Applicant |
| US2003/0191888(A1) | 2003-10-01 | Klein | Applicant |
| US2003/0191915(A1) | 2003-10-01 | Saxena et al. | Applicant |
| US2003/0200382(A1) | 2003-10-01 | Wells et al. | Applicant |
| US2003/0200474(A1) | 2003-10-01 | Li | Applicant |
| US2003/0205802(A1) | 2003-11-01 | Segaram et al. | Applicant |
| US2003/0206476(A1) | 2003-11-01 | Joo | Applicant |
| US2003/0217303(A1) | 2003-11-01 | Chua-Eoan et al. | Applicant |
| US2003/0223290(A1) | 2003-12-01 | Park et al. | Applicant |
| US2003/0227798(A1) | 2003-12-01 | Pax | Applicant |
| US2003/0229821(A1) | 2003-12-01 | Ma | Applicant |
| US2003/0230801(A1) | 2003-12-01 | Jiang et al. | Applicant |
| US2003/0231540(A1) | 2003-12-01 | Lazar et al. | Applicant |
| US2003/0231542(A1) | 2003-12-01 | Zaharinova-Papazova et al. | Applicant |
| US2003/0234664(A1) | 2003-12-01 | Yamagata | Applicant |
| US2004/0016994(A1) | 2004-01-01 | Huang | Applicant |
| US2004/0027902(A1) | 2004-02-01 | Ooishi et al. | Applicant |
| US2004/0034732(A1) | 2004-02-01 | Valin et al. | Applicant |
| US2004/0034755(A1) | 2004-02-01 | LaBerge et al. | Applicant |
| US2004/0037133(A1) | 2004-02-01 | Park et al. | Applicant |
| US2004/0042503(A1) | 2004-03-01 | Shaeffer et al. | Applicant |
| US2004/0044808(A1) | 2004-03-01 | Salmon et al. | Applicant |
| US2004/0047228(A1) | 2004-03-01 | Chen | Applicant |
| US2004/0049624(A1) | 2004-03-01 | Salmonsen | Applicant |
| US2004/0057317(A1) | 2004-03-01 | Schaefer | Applicant |
| US2004/0064647(A1) | 2004-04-01 | DeWhitt et al. | Applicant |
| US2004/0064767(A1) | 2004-04-01 | Huckaby et al. | Applicant |
| US2004/0083324(A1) | 2004-04-01 | Rabinovitz et al. | Applicant |
| US2004/0088475(A1) | 2004-05-01 | Streif et al. | Applicant |
| US2004/0100837(A1) | 2004-05-01 | Lee | Applicant |
| US2004/0117723(A1) | 2004-06-01 | Foss | Applicant |
| US2004/0123173(A1) | 2004-06-01 | Emberling et al. | Applicant |
| US2004/0125635(A1) | 2004-07-01 | Kuzmenka | Applicant |
| US2004/0133736(A1) | 2004-07-01 | Kyung | Applicant |
| US2004/0139359(A1) | 2004-07-01 | Samson et al. | Applicant |
| US2004/0145963(A1) | 2004-07-01 | Byon | Applicant |
| US2004/0151038(A1) | 2004-08-01 | Ruckerbauer et al. | Applicant |
| US2004/0174765(A1) | 2004-09-01 | Seo et al. | Applicant |
| US2004/0177079(A1) | 2004-09-01 | Gluhovsky et al. | Applicant |
| US2004/0178824(A1) | 2004-09-01 | Pan | Applicant |
| US2004/0184324(A1) | 2004-09-01 | Pax | Applicant |
| US2004/0186956(A1) | 2004-09-01 | Perego et al. | Applicant |
| US2004/0188704(A1) | 2004-09-01 | Halbert et al. | Applicant |
| US2004/0195682(A1) | 2004-10-01 | Kimura | Applicant |
| US2004/0196732(A1) | 2004-10-01 | Lee | Applicant |
| US2004/0205433(A1) | 2004-10-01 | Gower et al. | Applicant |
| US2004/0208173(A1) | 2004-10-01 | Di Gregorio | Applicant |
| US2004/0225858(A1) | 2004-11-01 | Brueggen | Applicant |
| US2004/0228166(A1) | 2004-11-01 | Braun et al. | Applicant |
| US2004/0228196(A1) | 2004-11-01 | Kwak et al. | Applicant |
| US2004/0228203(A1) | 2004-11-01 | Koo | Applicant |
| US2004/0230932(A1) | 2004-11-01 | Dickmann | Applicant |
| US2004/0236877(A1) | 2004-11-01 | Burton | Applicant |
| US2004/0250989(A1) | 2004-12-01 | Im et al. | Applicant |
| US2004/0256638(A1) | 2004-12-01 | Perego et al. | Applicant |
| US2004/0257847(A1) | 2004-12-01 | Matsui et al. | Applicant |
| US2004/0257857(A1) | 2004-12-01 | Yamamoto et al. | Applicant |
| US2004/0260957(A1) | 2004-12-01 | Jeddeloh et al. | Applicant |
| US2004/0264255(A1) | 2004-12-01 | Royer | Applicant |
| US2004/0268161(A1) | 2004-12-01 | Ross | Applicant |
| US2005/0018495(A1) | 2005-01-01 | Bhakta et al. | Applicant |
| US2005/0021874(A1) | 2005-01-01 | Georgiou et al. | Applicant |
| US2005/0024963(A1) | 2005-02-01 | Jakobs et al. | Applicant |
| US2005/0027928(A1) | 2005-02-01 | Avraham et al. | Applicant |
| US2005/0028038(A1) | 2005-02-01 | Pomaranski et al. | Applicant |
| US2005/0034004(A1) | 2005-02-01 | Bunker et al. | Applicant |
| US2005/0036350(A1) | 2005-02-01 | So et al. | Applicant |
| US2005/0041504(A1) | 2005-02-01 | Perego et al. | Applicant |
| US2005/0044302(A1) | 2005-02-01 | Pauley et al. | Applicant |
| US2005/0044303(A1) | 2005-02-01 | Perego et al. | Applicant |
| US2005/0044305(A1) | 2005-02-01 | Jakobs et al. | Applicant |
| US2005/0047192(A1) | 2005-03-01 | Matsui et al. | Applicant |
| US2005/0071543(A1) | 2005-03-01 | Ellis et al. | Applicant |
| US2005/0078532(A1) | 2005-04-01 | Ruckerbauer et al. | Applicant |
| US2005/0081085(A1) | 2005-04-01 | Ellis et al. | Applicant |
| US2005/0086548(A1) | 2005-04-01 | Haid et al. | Applicant |
| US2005/0099834(A1) | 2005-05-01 | Funaba et al. | Applicant |
| US2005/0102590(A1) | 2005-05-01 | Norris et al. | Applicant |
| US2005/0105318(A1) | 2005-05-01 | Funaba et al. | Applicant |
| US2005/0108460(A1) | 2005-05-01 | David | Applicant |
| US2005/0127531(A1) | 2005-06-01 | Tay et al. | Applicant |
| US2005/0132158(A1) | 2005-06-01 | Hampel et al. | Applicant |
| US2005/0135176(A1) | 2005-06-01 | Ramakrishnan et al. | Applicant |
| US2005/0138267(A1) | 2005-06-01 | Bains et al. | Applicant |
| US2005/0138304(A1) | 2005-06-01 | Ramakrishnan et al. | Applicant |
| US2005/0139977(A1) | 2005-06-01 | Nishio et al. | Applicant |
| US2005/0141199(A1) | 2005-06-01 | Chiou et al. | Applicant |
| US2005/0149662(A1) | 2005-07-01 | Perego et al. | Applicant |
| US2005/0152212(A1) | 2005-07-01 | Yang et al. | Applicant |
| US2005/0156934(A1) | 2005-07-01 | Perego et al. | Applicant |
| US2005/0166026(A1) | 2005-07-01 | Ware et al. | Applicant |
| US2005/0193163(A1) | 2005-09-01 | Perego et al. | Applicant |
| US2005/0193183(A1) | 2005-09-01 | Barth et al. | Applicant |
| US2005/0194676(A1) | 2005-09-01 | Fukuda et al. | Applicant |
| US2005/0194991(A1) | 2005-09-01 | Dour et al. | Applicant |
| US2005/0195629(A1) | 2005-09-01 | Leddige et al. | Applicant |
| US2005/0201063(A1) | 2005-09-01 | Lee et al. | Applicant |
| US2005/0204111(A1) | 2005-09-01 | Natarajan | Applicant |
| US2005/0207255(A1) | 2005-09-01 | Perego et al. | Applicant |
| US2005/0210196(A1) | 2005-09-01 | Perego et al. | Applicant |
| US2005/0223179(A1) | 2005-10-01 | Perego et al. | Applicant |
| US2005/0224948(A1) | 2005-10-01 | Lee et al. | Applicant |
| US2005/0232049(A1) | 2005-10-01 | Park | Applicant |
| US2005/0235119(A1) | 2005-10-01 | Sechrest et al. | Applicant |
| US2005/0235131(A1) | 2005-10-01 | Ware | Applicant |
| US2005/0237838(A1) | 2005-10-01 | Kwak et al. | Applicant |
| US2005/0243635(A1) | 2005-11-01 | Schaefer | Applicant |
| US2005/0246558(A1) | 2005-11-01 | Ku | Applicant |
| US2005/0249011(A1) | 2005-11-01 | Maeda | Applicant |
| US2005/0259504(A1) | 2005-11-01 | Murtugh et al. | Applicant |
| US2005/0263312(A1) | 2005-12-01 | Bolken et al. | Applicant |
| US2005/0265506(A1) | 2005-12-01 | Foss et al. | Applicant |
| US2005/0269715(A1) | 2005-12-01 | Yoo | Applicant |
| US2005/0278474(A1) | 2005-12-01 | Perersen et al. | Applicant |
| US2005/0281096(A1) | 2005-12-01 | Bhakta et al. | Applicant |
| US2005/0281123(A1) | 2005-12-01 | Bell et al. | Applicant |
| US2005/0283572(A1) | 2005-12-01 | Ishihara | Applicant |
| US2005/0285174(A1) | 2005-12-01 | Saito et al. | Applicant |
| US2005/0286334(A1) | 2005-12-01 | Saito et al. | Applicant |
| US2005/0289292(A1) | 2005-12-01 | Morrow et al. | Applicant |
| US2005/0289317(A1) | 2005-12-01 | Liou et al. | Applicant |
| US2006/0002201(A1) | 2006-01-01 | Janzen | Applicant |
| US2006/0010339(A1) | 2006-01-01 | Klein | Applicant |
| US2006/0026484(A1) | 2006-02-01 | Hollums | Applicant |
| US2006/0038597(A1) | 2006-02-01 | Becker et al. | Applicant |
| US2006/0039204(A1) | 2006-02-01 | Cornelius | Applicant |
| US2006/0039205(A1) | 2006-02-01 | Cornelius | Applicant |
| US2006/0041711(A1) | 2006-02-01 | Miura et al. | Applicant |
| US2006/0041730(A1) | 2006-02-01 | Larson | Applicant |
| US2006/0044909(A1) | 2006-03-01 | Kinsley et al. | Applicant |
| US2006/0044913(A1) | 2006-03-01 | Klein et al. | Applicant |
| US2006/0049502(A1) | 2006-03-01 | Goodwin et al. | Applicant |
| US2006/0050574(A1) | 2006-03-01 | Streif et al. | Applicant |
| US2006/0056244(A1) | 2006-03-01 | Ware | Applicant |
| US2006/0062047(A1) | 2006-03-01 | Bhakta et al. | Applicant |
| US2006/0067141(A1) | 2006-03-01 | Perego et al. | Applicant |
| US2006/0085616(A1) | 2006-04-01 | Zeighami et al. | Applicant |
| US2006/0087900(A1) | 2006-04-01 | Bucksch et al. | Applicant |
| US2006/0090031(A1) | 2006-04-01 | Kirshenbaum et al. | Applicant |
| US2006/0090054(A1) | 2006-04-01 | Choi et al. | Applicant |
| US2006/0106951(A1) | 2006-05-01 | Bains | Applicant |
| US2006/0112214(A1) | 2006-05-01 | Yeh | Applicant |
| US2006/0112219(A1) | 2006-05-01 | Chawla et al. | Applicant |
| US2006/0117152(A1) | 2006-06-01 | Amidi et al. | Applicant |
| US2006/0117160(A1) | 2006-06-01 | Jackson et al. | Applicant |
| US2006/0118933(A1) | 2006-06-01 | Haba | Applicant |
| US2006/0120193(A1) | 2006-06-01 | Casper | Applicant |
| US2006/0123265(A1) | 2006-06-01 | Ruckerbauer et al. | Applicant |
| US2006/0126369(A1) | 2006-06-01 | Raghuram | Applicant |
| US2006/0129712(A1) | 2006-06-01 | Raghuram | Applicant |
| US2006/0129740(A1) | 2006-06-01 | Ruckerbauer et al. | Applicant |
| US2006/0129755(A1) | 2006-06-01 | Raghuram | Applicant |
| US2006/0133173(A1) | 2006-06-01 | Jain et al. | Applicant |
| US2006/0136791(A1) | 2006-06-01 | Nierle | Applicant |
| US2006/0149857(A1) | 2006-07-01 | Holman | Applicant |
| US2006/0149982(A1) | 2006-07-01 | Vogt | Applicant |
| US2006/0174082(A1) | 2006-08-01 | Bellows et al. | Applicant |
| US2006/0176744(A1) | 2006-08-01 | Stave | Applicant |
| US2006/0179262(A1) | 2006-08-01 | Brittain et al. | Applicant |
| US2006/0179333(A1) | 2006-08-01 | Brittain et al. | Applicant |
| US2006/0179334(A1) | 2006-08-01 | Brittain et al. | Applicant |
| US2006/0180926(A1) | 2006-08-01 | Mullen et al. | Applicant |
| US2006/0181953(A1) | 2006-08-01 | Rotenberg et al. | Applicant |
| US2006/0195631(A1) | 2006-08-01 | Rajamani | Applicant |
| US2006/0198178(A1) | 2006-09-01 | Kinsley et al. | Applicant |
| US2006/0203590(A1) | 2006-09-01 | Mori et al. | Applicant |
| US2006/0206738(A1) | 2006-09-01 | Jeddeloh et al. | Applicant |
| US2006/0233012(A1) | 2006-10-01 | Sekiguchi et al. | Applicant |
| US2006/0236165(A1) | 2006-10-01 | Cepulis et al. | Applicant |
| US2006/0236201(A1) | 2006-10-01 | Gower et al. | Applicant |
| US2006/0248261(A1) | 2006-11-01 | Jacob et al. | Applicant |
| US2006/0248387(A1) | 2006-11-01 | Nicholson et al. | Applicant |
| US2006/0262586(A1) | 2006-11-01 | Solomon et al. | Applicant |
| US2006/0262587(A1) | 2006-11-01 | Matsui et al. | Applicant |
| US2006/0277355(A1) | 2006-12-01 | Ellsberry et al. | Applicant |
| US2006/0294295(A1) | 2006-12-01 | Fukuzo | Applicant |
| US2007/0005998(A1) | 2007-01-01 | Jain et al. | Applicant |
| US2007/0050530(A1) | 2007-03-01 | Rajan | Applicant |
| US2007/0058471(A1) | 2007-03-01 | Rajan et al. | Applicant |
| US2007/0070669(A1) | 2007-03-01 | Tsern | Applicant |
| US2007/0088995(A1) | 2007-04-01 | Tsern et al. | Applicant |
| US2007/0091696(A1) | 2007-04-01 | Niggemeier et al. | Applicant |
| US2007/0106860(A1) | 2007-05-01 | Foster et al. | Applicant |
| US2007/0136537(A1) | 2007-06-01 | Doblar et al. | Applicant |
| US2007/0162700(A1) | 2007-07-01 | Fortin et al. | Applicant |
| US2007/0188997(A1) | 2007-08-01 | Hockanson et al. | Applicant |
| US2007/0192563(A1) | 2007-08-01 | Rajan et al. | Applicant |
| US2007/0195613(A1) | 2007-08-01 | Rajan et al. | Applicant |
| US2007/0204075(A1) | 2007-08-01 | Rajan et al. | Applicant |
| US2007/0216445(A1) | 2007-09-01 | Raghavan et al. | Applicant |
| US2007/0247194(A1) | 2007-10-01 | Jain | Applicant |
| US2007/0279084(A1) | 2007-12-01 | Oh et al. | Applicant |
| US2007/0288683(A1) | 2007-12-01 | Panabaker et al. | Applicant |
| US2007/0288686(A1) | 2007-12-01 | Arcedera et al. | Applicant |
| US2007/0288687(A1) | 2007-12-01 | Panabaker et al. | Applicant |
| US2008/0002447(A1) | 2008-01-01 | Gulachenski et al. | Applicant |
| US2008/0010435(A1) | 2008-01-01 | Smith et al. | Applicant |
| US2008/0025108(A1) | 2008-01-01 | Rajan et al. | Applicant |
| US2008/0025122(A1) | 2008-01-01 | Schakel et al. | Applicant |
| US2008/0025136(A1) | 2008-01-01 | Rajan et al. | Applicant |
| US2008/0025137(A1) | 2008-01-01 | Rajan et al. | Applicant |
| US2008/0027697(A1) | 2008-01-01 | Rajan et al. | Applicant |
| US2008/0027702(A1) | 2008-01-01 | Rajan et al. | Applicant |
| US2008/0027703(A1) | 2008-01-01 | Rajan et al. | Applicant |
| US2008/0028135(A1) | 2008-01-01 | Rajan et al. | Applicant |
| US2008/0028136(A1) | 2008-01-01 | Schakel et al. | Applicant |
| US2008/0028137(A1) | 2008-01-01 | Schakel et al. | Applicant |
| US2008/0031030(A1) | 2008-02-01 | Rajan et al. | Applicant |
| US2008/0031072(A1) | 2008-02-01 | Rajan et al. | Applicant |
| US2008/0034130(A1) | 2008-02-01 | Perego et al. | Applicant |
| US2008/0037353(A1) | 2008-02-01 | Rajan et al. | Applicant |
| US2008/0056014(A1) | 2008-03-01 | Rajan et al. | Applicant |
| US2008/0062773(A1) | 2008-03-01 | Rajan et al. | Applicant |
| US2008/0065820(A1) | 2008-03-01 | Gillingham et al. | Applicant |
| US2008/0082763(A1) | 2008-04-01 | Rajan et al. | Applicant |
| US2008/0086588(A1) | 2008-04-01 | Danilak et al. | Applicant |
| US2008/0089034(A1) | 2008-04-01 | Hoss et al. | Applicant |
| US2008/0098277(A1) | 2008-04-01 | Hazelzet | Applicant |
| US2008/0103753(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0104314(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0109206(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0109595(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0109597(A1) | 2008-05-01 | Schakel et al. | Applicant |
| US2008/0109598(A1) | 2008-05-01 | Schakel et al. | Applicant |
| US2008/0115006(A1) | 2008-05-01 | Smith et al. | Applicant |
| US2008/0120443(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0120458(A1) | 2008-05-01 | Gillingham et al. | Applicant |
| US2008/0123459(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0126624(A1) | 2008-05-01 | Prete et al. | Applicant |
| US2008/0126687(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0126688(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0126689(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0126690(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0126692(A1) | 2008-05-01 | Rajan et al. | Applicant |
| US2008/0130364(A1) | 2008-06-01 | Guterman et al. | Applicant |
| US2008/0133825(A1) | 2008-06-01 | Rajan et al. | Applicant |
| US2008/0155136(A1) | 2008-06-01 | Hishino | Applicant |
| US2008/0159027(A1) | 2008-07-01 | Kim | Applicant |
| US2008/0170425(A1) | 2008-07-01 | Rajan | Applicant |
| US2008/0195894(A1) | 2008-08-01 | Schreck et al. | Applicant |
| US2008/0215832(A1) | 2008-09-01 | Allen et al. | Applicant |
| US2008/0239857(A1) | 2008-10-01 | Rajan et al. | Applicant |
| US2008/0239858(A1) | 2008-10-01 | Rajan et al. | Applicant |
| US2008/0256282(A1) | 2008-10-01 | Guo et al. | Applicant |
| US2008/0282084(A1) | 2008-11-01 | Hatakeyama | Applicant |
| US2008/0282341(A1) | 2008-11-01 | Hatakeyama | Applicant |
| US2009/0024789(A1) | 2009-01-01 | Rajan et al. | Applicant |
| US2009/0024790(A1) | 2009-01-01 | Rajan et al. | Applicant |
| US2009/0049266(A1) | 2009-02-01 | Kuhne | Applicant |
| US2009/0063865(A1) | 2009-03-01 | Berenbaum et al. | Applicant |
| US2009/0063896(A1) | 2009-03-01 | Lastras-Montano et al. | Applicant |
| US2009/0070520(A1) | 2009-03-01 | Mizushima | Applicant |
| US2009/0089480(A1) | 2009-04-01 | Wah et al. | Applicant |
| US2009/0109613(A1) | 2009-04-01 | Legen et al. | Applicant |
| US2009/0216939(A1) | 2009-08-01 | Smith et al. | Applicant |
| US2009/0285031(A1) | 2009-11-01 | Rajan et al. | Applicant |
| US2009/0290442(A1) | 2009-11-01 | Rajan | Applicant |
| US2010/0005218(A1) | 2010-01-01 | Gower et al. | Applicant |
| US2010/0020585(A1) | 2010-01-01 | Rajan | Applicant |
| US2010/0257304(A1) | 2010-10-01 | Rajan et al. | Applicant |
| US2010/0271888(A1) | 2010-10-01 | Rajan | Applicant |
| US2010/0281280(A1) | 2010-11-01 | Rajan et al. | Applicant |
| DE102004051345 | 2006-05-01 | Applicant | |
| DE102004053316 | 2006-05-01 | Applicant | |
| DE102005036528 | 2007-02-01 | Applicant | |
| EP644547 | 1995-03-01 | Applicant | |
| JP62121978 | 1987-06-01 | Applicant | |
| JP1171047 | 1989-07-01 | Applicant | |
| JP3-029357 | 1991-02-01 | Applicant | |
| JP3029357 | 1991-02-01 | Applicant | |
| JP3/276487 | 1991-12-01 | Applicant | |
| JP3286234 | 1991-12-01 | Applicant | |
| JP2005-298192 | 1993-11-01 | Applicant | |
| JP7-141870 | 1995-06-01 | Applicant | |
| JP8/077097 | 1996-03-01 | Applicant | |
| JP8077097 | 1996-03-01 | Applicant | |
| JP11-149775 | 1999-06-01 | Applicant | |
| JP2002025255 | 2002-01-01 | Applicant | |
| JP3304893(B2) | 2002-05-01 | Applicant | |
| JP2004-327474 | 2004-11-01 | Applicant | |
| JP2006236388 | 2006-09-01 | Applicant | |
| KR1020040062717 | 2004-07-01 | Applicant | |
| KR2005120344 | 2005-12-01 | Applicant | |
| WO95/05676 | 1995-02-01 | Applicant | |
| WO97/25674 | 1997-07-01 | Applicant | |
| WO9900734 | 1999-01-01 | Applicant | |
| WO/45270 | 2000-08-01 | Applicant | |
| WO1/90900 | 2001-11-01 | Applicant | |
| WO1/97160 | 2001-12-01 | Applicant | |
| WO2004/044754 | 2004-05-01 | Applicant | |
| WO2004/051645 | 2004-06-01 | Applicant | |
| WO2006/072040 | 2006-07-01 | Applicant | |
| WO2007002324 | 2007-01-01 | Applicant | |
| WO2007/028109 | 2007-03-01 | Applicant | |
| WO2007/038225 | 2007-04-01 | Applicant | |
| WO2007/095080 | 2007-08-01 | Applicant | |
| WO2008063251 | 2008-05-01 | Applicant |
Non-Patent Literature (281)
- Kellerbauer “Die Schnelle Million,” with translation, “The quick million.”Applicant
- Wu et al., “eNVy: A Non-Volatile, Main Memory Storage System,” to appear in ASPLOS VI.Applicant
- “Using Two Chip Selects to Enable Quad Rank,” IP.com PriorArtDatabase, copyright IP.com, Inc. 2004.Applicant
- “BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors,” AMD, 31116 Rev 3.00, Sep. 7, 2007.Applicant
- Skerlj et al., “Buffer Device for Memory Modules (DIMM)” Qimonda 2006, p. 1.Applicant
- Written Opinion from PCT Application No. PCT/US06/24360 mailed on Jan. 8, 2007.Applicant
- Preliminary Report on Patentability from PCT Application No. PCT/US06/24360 mailed on Jan. 10, 2008.Applicant
- Written Opinion from International PCT Application No. PCT/US06/34390 mailed on Nov. 21, 2007.Applicant
- International Search Report from PCT Application No. PCT/US06/34390 mailed on Nov. 21, 2007.Applicant
- International Search Report and Written Opinion from PCT Application No. PCT/US07/16385 mailed on Jul. 30, 2008.Applicant
- Office Action from U.S. Appl. No. 11/461,427 mailed on Sep. 5, 2008.Applicant
- Final Office Action from U.S. Appl. No. 11/461,430 mailed on Sep. 8, 2008.Applicant
- Notice of Allowance from U.S. Appl. No, 11/474,075 mailed on Nov. 26, 2008.Applicant
- Office Action from U.S. Appl. No. 11/474,076 mailed on Nov. 3, 2008.Applicant
- Office Action from U.S. Appl. No. 11/524,811 mailed on Sep. 17, 2008.Applicant
- Non-final Office Action from U.S. Appl. No. 11/461,430 mailed on Feb. 19, 2009.Applicant
- Final Office Action from U.S. Appl. No. 11/461,435 mailed on Jan. 28, 2009.Applicant
- Non-final Office Action from U.S. Appl. No. 11/461,437 mailed on Jan. 26, 2009.Applicant
- Non-final Office Action from U.S. Appl. No. 11/939,432 mailed on Feb. 6, 2009.Applicant
- Wu et al., “eNVy: A Non-Volatile, Main Memory Storage System,” ASPLOS-VI Proceedings—Sixth International Conference on Architectural Support for Programming Languages and Operating Systems, San Jose, California, Oct. 4-7, 1994. SIGARCH Computer Architecture News 22(Special Issue Oct. 1994).Applicant
- Form AO-120 as filed in US Patent No. 7,472,220 on Jun. 17, 2009.Applicant
- German Office Action From German Patent Application No. 11 2006 002 300.4-55 Mailed Jun. 5, 2009 (With Translation).Applicant
- Non-Final Office Action From U.S. Appl. No. 11/461,430 Mailed Feb. 19, 2009.Applicant
- Final Office Action From U.S. Appl. No. 11/461,435 Mailed Jan. 28, 2009.Applicant
- Non-Final Office Action From U.S. Appl. No. 11/461,437 Mailed Jan. 26, 2009.Applicant
- Non-Final Office Action From U.S. Appl. No. 11/461,441 Mailed Apr. 2, 2009.Applicant
- Non-Final Office Action From U.S. Appl. No. 11/611,374 Mailed Mar. 23, 2009.Applicant
- Non-Final Office Action From U.S. Appl. No. 11/762,010 Mailed Mar. 20, 2009.Applicant
- Non-Final Office Action From U.S. Appl. No. 11/939,432 Mailed Feb. 6, 2009.Applicant
- Non-Final Office Action From U.S. Appl. No. 12/111,819 Mailed Apr. 27, 2009.Applicant
- Non-Final Office Action From U.S. Appl. No. 12/111,828 Mailed Apr. 17, 2009.Applicant
- Supplemental European Search Report and Search Opinion issued on Sep. 21, 2009 in corresponding European Application No. 07870726.2, 8 pages.Applicant
- Fang et al., W. Power Complexity Analysis of Adiabatic SRAM, 6th Int. Conference on ASIC, vol. 1, Oct. 2005, pp. 334-337.Applicant
- Pavan et al., P. A Complete Model of E2PROM Memory Cells for Circuit Simulations, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 22, No. 8, Aug. 2003, pp. 1072-1079.Applicant
- German Office Action From German Patent Application No. 11 2006 001 810.8-55 Mailed Apr. 20, 2009 (With Translation).Applicant
- Final Rejection From U.S. Appl. No. 11/461,437 Mailed Nov. 10, 2009.Applicant
- Final Rejection from U.S. Appl. No. 11/762,010 Mailed Dec. 4, 2009.Applicant
- Non-Final Rejection from U.S. Appl. No. 11/672,921 Mailed Dec. 8, 2009.Applicant
- Non-Final Rejection from U.S. Appl. No. 11/672,924 Mailed Dec. 14, 2009.Applicant
- Non-Final Rejection from U.S. Appl. No. 11/929,225 Mailed Dec. 14, 2009.Applicant
- Non-Final Rejection from U.S. Appl. No. 11/929,261 Mailed Dec. 14, 2009.Applicant
- Notice of Allowance From U.S. Appl. No. 11/611,374 Mailed Nov. 30, 2009.Applicant
- Notice of Allowance From U.S. Appl. No. 11/939,432 Mailed Dec. 1, 2009.Applicant
- Notice of Allowance From U.S. Appl. No. 12/111,819 Mailed Nov. 20, 2009.Applicant
- Notice of Allowance From U.S. Appl. No. 12/111,828 Mailed Dec. 15, 2009.Applicant
- Great Britain Office Action from GB Patent Application No. GB0800734.6 Mailed Mar. 1, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/461,420 Mailed Apr. 28, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/553,372 Mailed Mar. 12, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/553,399 Mailed Mar. 22, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/588,739 Mailed Dec. 29, 2009.Applicant
- Notice of Allowance from U.S. Appl. No. 11/611,374 Mailed Apr. 5, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/828,181 Mailed Mar. 2, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/828,182 Mailed Mar. 29, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/858,518 Mailed Apr. 21, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,432 Mailed Jan. 14, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,571 Mailed Mar. 3, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,631 Mailed Mar. 3, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,655 Mailed Mar. 3, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/939,432 Mailed Apr. 12, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 12/111,819 Mailed Mar. 10, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/507,682 Mailed Mar. 8, 2010.Applicant
- Great Britain Office Action from GB Patent Application No. GB0803913.3 Mailed Mar. 1, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/461,435 Dated May 13, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/515,167 Dated Jun. 3, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/515,223 Dated Jul. 30, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/553,390 Dated Jun. 24, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/611,374 Dated Jul. 19, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/672,921 Dated Jul. 23, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/702,960 Dated Jun. 21, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,010 Dated Jul. 2, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/763,365 Dated Jun. 29, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,500 Dated Jun. 24, 2010.Applicant
- Office Action from U.S. Appl. No. 12/574,628 Dated Jun. 10, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/461,420 Dated Jul. 23, 2009.Applicant
- Notice of Allowance from U.S. Appl. No. 11/461,430 Dated Sep. 9, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/461,435 Dated Aug. 5, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/515,167 Dated Sep. 25, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/515,223 Dated Sep. 22, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/538,041 Dated Jun. 10, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/553,372 Dated Jun. 25, 2009.Applicant
- Notice of Allowance from U.S. Appl. No. 11/553,372 Dated Sep. 30, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/553,390 Dated Sep. 9, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/553,399 Dated Jul. 7, 2009.Applicant
- Notice of Allowance from U.S. Appl. No. 11/553,399 Dated Oct. 13, 2009.Applicant
- Notice of Allowance from U.S. Appl. No. 11/611,374 Dated Sep. 15, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/702,960 Dated Sep. 25, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/702,981 Dated Aug. 19, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/762,013 Dated Jun. 5, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/763,365 Dated Oct. 28, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/858,518 Dated Aug. 14, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,500 Dated Oct. 13, 2009.Applicant
- Notice of Allowance from U.S. Appl. No. 11/939,432 Dated Sep. 24, 2009.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/941,589 Dated Oct. 1, 2009.Applicant
- Wu et al., “eNVy: A Non-Volatile, Main Memory Storage System”, ASPLOS-VI Proceedings, Oct. 4-7, 1994, pp. 86-97.Applicant
- Buffer Device for Memory Modules (DIMM) , IP.com Prior Art Database, <URL: http://ip.com/IPCOM/000144850>, Feb. 10, 2007, 1 pg.Applicant
- German Office Action from German Patent Application No. 11 2006 002 300.4-55 Dated May 11, 2009 (With Translation).Applicant
- Great Britain Office Action from GB Patent Application No. GB0803913.3 Dated Mar. 1, 2010.Applicant
- International Preliminary Examination Report From PCT Application No. PCT/US07/016385 Dated Feb. 3, 2009.Applicant
- Search Report and Written Opinion From PCT Application No. PCT/US07/03460 Dated on Feb. 14, 2008.Applicant
- Notice of Allowance from U.S. Appl. No. 11/553,372 Dated Aug. 4, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/553,399 Dated Dec. 3, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/611,374 Dated Oct. 29, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/672,924 Dated Sep. 7, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/702,981 Dated Mar. 11, 2009.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,010 Dated Oct. 22, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,013 Dated Aug. 17, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,013 Dated Dec. 7, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/763,365 Dated Oct. 20, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/855,805 Dated Sep. 21, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/858,518 Dated Sep. 8, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,225 Dated Aug. 27, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,261 Dated Sep. 7, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,286 Dated Aug. 20, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,320 Dated Sep. 29, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,403 Dated Aug. 31, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,417 Dated Aug. 31, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,483 Dated Oct. 7, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,432 Dated Aug. 20, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,450 Dated Aug. 20, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,631 Dated Nov. 18, 2010.Applicant
- Final Office Action from U.S. Appl. No. 11/929,655 Dated Nov. 22, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/939,440 Dated Sep. 17, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/941,589 Dated Oct. 25, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/057,306 Dated Oct. 8, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/203,100 Dated Dec. 1, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/769,428 Dated Nov. 8, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/838,896 Dated Sep. 3, 2010.Applicant
- Search Report From PCT Application No. PCT/US10/038041 Dated Aug. 23, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/461,437 Dated Jan. 4, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/515,223 Dated Feb. 4, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/553,372 Dated Jan. 5, 2011.Applicant
- Final Office Action from U.S. Appl. No. 11/588,739 Dated Dec. 15, 2010.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,010 Dated Feb. 18, 2011.Applicant
- Final Office Action from U.S. Appl. No. 11/828,182 Dated Dec. 22, 2010.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/855,826 Dated Jan. 13, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/939,432 Dated Feb. 18, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 12/144,396 Dated Feb. 1, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/816,756 Dated Feb. 7, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,013 Dated Feb. 22, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,500 Dated Feb. 24, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/763,365 Dated Mar. 1, 2011.Applicant
- Final Office Action from U.S. Appl. No. 12/574,628 Dated Mar. 3, 2011.Applicant
- Final Office Action from U.S. Appl. No. 11/929,571 Dated Mar. 3, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/611,374 Dated Mar. 4, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,483 Dated Mar. 4, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/553,399 Dated Mar. 18, 2011.Applicant
- Final Office Action from U.S. Appl. No. 12/507,682 Dated Mar. 29, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,403 Dated Mar. 31, 2011.Applicant
- Office Action from U.S. Appl. No. 11/929,417 Dated Mar. 31, 2011.Applicant
- Copy of Notice Allowance from U.S. Appl. No. 12/838,896 Dated Apr. 19, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/702,981 Dated Apr. 25, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,320 Dated May 5, 2011.Applicant
- Final Office Action from U.S. Appl. No. 11/939,440 Dated May 19, 2011.Applicant
- Office Action from U.S. Appl. No. 11/855,805, Dated May 26, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/672,921 Dated May 27, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,010 Dated Jun. 8, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/672,924 Dated Jun. 8, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,225 Dated Jun. 8, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,500 Dated Jun. 13, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/941,589 Dated Jun. 15, 2011.Applicant
- Final Office Action from U.S. Appl. No. 12/057,306 Dated Jun. 15, 2011.Applicant
- Final Office Action from U.S. Appl. No. 12/769,428 Dated Jun. 16, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 12/203,100 Dated Jun. 17, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/762,013 Dated Jun. 20, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/797,557 Dated Jun. 21, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,483 Dated Jun. 23, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/702,960 Dated Jun. 23, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,655 Dated Jun. 24, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/763,365 Dated Jun. 24, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/611,374 Dated Jun. 24, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/828,182 Dated Jun. 27, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/828,181 Dated Jun. 27, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/378,328 Dated Jul. 15, 2011.Applicant
- Final Office Action from U.S. Appl. No. 11/461,420 Dated Jul. 20, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/461,437 Dated Jul. 25, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/702,981 Dated Aug. 5, 2011.Applicant
- Notice of Allowability from U.S. Appl. No. 11/855,826 Dated Aug. 15, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/574,628 Dated Sep. 20, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/858,518 Dated Sep. 27, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,571 Dated Sep. 27, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,500 Dated Sep. 27, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/941,589 Dated Sep. 30, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 12/816,756 Dated Oct. 3, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/508,496 Dated Oct. 11, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/588,739 Dated Oct. 13, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/939,432 Dated Oct. 24, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,631 Dated Nov. 1, 2011.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/553,372 Dated Nov. 14, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 11/515,223 Dated Nov. 29, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 12/769,428 Dated Nov. 29, 2011.Applicant
- Final Office Action from U.S. Appl. No. 11/939,440 Dated Dec. 12, 2011.Applicant
- Notice of Allowance from U.S. Appl. No. 12/797,557 Dated Dec. 28, 2011.Applicant
- Office Action, including English translation, from related Japanese application No. 2008-529353, Dated Jan. 10, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 12/838,896 Dated Jan. 18, 2012.Applicant
- Final Office Action from U.S. Appl. No. 11/929,655 Dated Jan. 19, 2012.Applicant
- Final Office Action from U.S. Appl. No. 12/378,328 Dated Feb. 3, 2012.Applicant
- Final Office Action from U.S. Appl. No. 11/672,921 Dated Feb. 16, 2012.Applicant
- Final Office Action from U.S. Appl. No. 11/672,924 Dated Feb. 16, 2012.Applicant
- Final Office Action from U.S. Appl. No. 11/929,225 Dated Feb. 16, 2012.Applicant
- Final Office Action from U.S. Appl. No. 11/828,181 Dated Feb. 23, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/276,212 Dated Mar. 15, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 12/769,428 Dated Nov. 28, 2011.Applicant
- Office Action, including English translation, from co-pending Japanese application No. 2008-529353, Dated Jan. 10, 2012.Applicant
- International Search Report for Application No. EP12150807 Dated Feb. 16, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/461,520 Dated Feb. 29, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 12/574,628 Dated Mar. 6, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/343,612 Dated Mar. 29, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 11/939,440 Dated Mar. 30, 2012.Applicant
- European Search Report from co-pending European application No. 11194876.6-2212/2450798, Dated Apr. 12, 2012.Applicant
- European Search Report from co-pending European application No. 11194862.6-2212/2450800, Dated Apr. 12, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,636, Dated Apr. 17, 2012.Applicant
- Final Office Action from U.S. Appl. No. 11/858,518, Dated Apr. 17, 2012.Applicant
- European Search Report from co-pending European application No. 11194883.2-2212, Dated Apr. 27, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/553/372, Dated May 3, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,631, Dated May 3, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/165,713, Dated May 22, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/144,396, Dated May 29, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/165,713, Dated May 31, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/280,251, Dated Jun. 12, 2012.Applicant
- Final Office Action from U.S. Appl. No. 11/855,805, Dated Jun. 14, 2012.Applicant
- Office Action, including English translation, from co-pending Japanese application No. 2008-529353, Dated Jul. 31, 2012.Applicant
- Final Office Action from U.S. Appl. No. 13/315,933, Dated Aug. 24, 2012.Applicant
- Final Office Action from U.S. Appl. No. 13/276,212, Dated Aug. 30, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/367,182, Dated Aug. 31, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 11/461,420, Dated Sep. 5, 2012.Applicant
- Final Office Action from U.S. Appl. No. 13/280,251, Dated Sep. 12, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/929,225, Dated Sep. 17, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 12/508,496, Dated Sep. 17, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/672,921, Dated Oct. 1, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 12/057,306, Dated Oct. 10, 2012.Applicant
- Notice of Allowance from U.S. Appl. No. 12/144,396, Dated Oct. 11, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/411,489, Dated Oct. 17, 2012.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/471,283, Dated Dec. 7, 2012.Applicant
- English translation of Office Action from co-pending Korean patent application No. KR1020087005172, dated Dec. 20, 2012.Applicant
- Office Action, including English translation, from co-pending Japanese application No. 2008-529353, Dated Dec. 27, 2012.Applicant
- Office Action from co-pending European patent application No. EP12150798, Dated Jan. 3, 2013.Applicant
- Final Office Action from U.S. Appl. No. 11/672,924, Dated Feb. 1, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/260,650, Dated Feb. 1, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/141,844, Dated Feb. 5, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/473,827, Dated Feb. 15, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 12/378,328, Dated Feb. 27, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/536,093, Dated Mar. 1, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 11/461,435, Dated Mar. 6, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/471,283, Dated Mar. 21, 2013.Applicant
- Extended European Search Report for co-pending European patent application No. EP12150807.1, dated Feb. 1, 2013, mailed Mar. 22, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/181,716, Dated Apr. 3, 2013.Applicant
- English translation of Office Action from co-pending Korean patent application No. KR1020087019582, Dated Mar. 13, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/618,246, Dated Apr. 23, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/182,234, Dated May 1, 2013.Applicant
- Final Office Action from U.S. Appl. No. 13/315,933, Dated May 3, 2013.Applicant
- English Translation of Office Action from co-pending Korean patent application No. 10-2013-7004006, Dated Apr. 12, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,793, Dated May 6, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,565, Dated May 24, 2013.Applicant
- Final Office Action from U.S. Appl. No. 11/929,225, Dated May 24, 2013.Applicant
- Final Office Action from U.S. Appl. No. 11/672,921, Dated May 24, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 11/929,631, Dated May 28, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/620,424, Dated May 29, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/341,844, Dated May 30, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/455,691, Dated Jun. 4, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,199, Dated Jun. 17, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,207, Dated Jun. 20, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 11/828,182, Dated Jun. 20, 2013.Applicant
- Final Office Action from U.S. Appl. No. 11/828,181, Dated Jun. 20, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,645, Dated Jun. 26, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/471,283, Dated Jun. 28, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/181,747, Dated Jul. 9, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 11/515,223, Dated Jul. 18, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/182,234, Dated Jul. 22, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/181,716, Dated Jul. 22, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,233, Dated Aug. 2, 2013.Applicant
- Notice of Allowance and Issue Fee Due from U.S. Appl. No. 13/618,246, Dated Aug. 6, 2013.Applicant
- Final Office Action from U.S. Appl. No. 13/367,182, Dated Aug. 8, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/615,008, Dated Aug. 15, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/620,425, Dated Aug. 20, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,601, Dated Aug. 23, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 12/507,683, Dated Aug. 27, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/315,933, Dated Aug. 27, 2013.Applicant
- Final Office Action from U.S. Appl. No. 13/620,650, Dated Aug. 30, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/620,424, Dated Sep. 11, 2013.Applicant
- Non-Final Office Action from U.S. Appl. No. 13/620,291, Dated Sep. 12, 2013.Applicant
- Notice of Allowance from U.S. Appl. No. 13/341,844, Dated Sep. 17, 2013.Applicant