Method for providing a magnetic recording transducer using a combined main pole and side shield CMP for a wraparound shield scheme

[0001] FIG. 1 is a flow chart depicting a conventional method 10 for fabricating for a conventional magnetic recording transducer including side shields. For simplicity, some steps are omitted. Prior to the conventional method 10 starting, underlayers such as a leading shield may be formed. The conventional method 10 typically starts by building up material for a pole, such as a perpendicular magnetic recording (PMR) pole, via step 12. Step 12 includes forming a trench in a nonmagnetic layer, such as aluminum oxide. Nonmagnetic side gap/seed layers and magnetic pole layers may also be provided. For example, a Ru seed layer may be deposited and a high saturation magnetization pole layers may be plated. In addition, a portion of the magnetic pole material may be masked. The portion of the magnetic pole material in the field region may be removed using a wet etch and a nonmagnetic layer deposited, via step 14. Thus, only the magnetic material in the pole region remains. The main pole then undergoes a chemical mechanical planarization (CMP) process. The CMP removes the portion of the pole material external to the trench in the nonmagnetic layer.

[0002] An α-carbon hard mask is provided for the pole, via step 18. The exposed aluminum oxide nonmagnetic layer is wet etched, via step 20. The α-carbon hard mask provided in step 18 protects the pole during the wet etch in of step 20. Thus, a trench is formed around a portion of the pole near the ABS location. The side shields are then provided by refilling at least part of the region opened by the wet etch in step 20, via step 22. The side shield undergoes its own, separate CMP, via step 24. Processing may then be completed. For example, the α-carbon hard mask is removed and a trailing edge shield and gap may be formed.

[0003] FIG. 2 depicts plan and air-bearing surface (ABS) views of a portion of a conventional transducer 50 formed using the conventional method 10. The conventional transducer 50 includes a leading shield 52, side shields 54, Ru side gap layer 56 which is deposited in the trench, a pole 58, top gap layer 60, and trailing shield 62. Thus, using the conventional method 10, the pole 58, side shields 54, and trailing shield 62 may be formed.

[0004] Although the conventional method 10 may provide the conventional transducer 50, there may be drawbacks. Formation of the conventional transducer 50 may involve numerous steps, some of which may be complex. As a result, fabrication of the conventional transducer may take a longer time than desired to complete. In addition, more complicated processing may be more error-prone. The performance of the conventional transducer 50 may thus be compromised. Further, the materials around the α-carbon mask (not shown in FIG. 2) may polish at different rates. Thus, the flatness of the pole 58 and side shields 54 may be less than desired. This may be seen in FIG. 2 in which a portion of the side shields 54 is higher than the top of the pole 58, while another portion is lower than the tip of the pole. The removal of the α-carbon hard mask may also introduce issues. The α-carbon residue may accumulate at the corners of the pole 58 during removal. These residues may introduce asymmetries in the transducer 50 and adversely affect downstream processing. These and other issues may adversely affect performance of the conventional magnetic transducer 50.

[0005] Accordingly, what is needed is an improved method for fabricating a transducer.

[0006] A method fabricates a magnetic transducer having a nonmagnetic layer and an ABS location corresponding to an ABS. A pole trench is provided in the nonmagnetic layer. The pole trench has a pole tip region and a yoke region. At least one pole material is provided. After removal of the pole material(s) in the field, the remaining pole material(s) form an external protrusion that is above and outside of the pole trench. A hard mask that covers at least the external protrusion is provided. A portion of the nonmagnetic layer adjacent to the pole trench is removed to form a side shield trench. At least one side shield material is provided. A portion of the side shield material(s) are adjacent to the hard mask and fill at least part of the side shield trench. The side shield material(s) and the pole material(s) are planarized to form side shield(s) and a main pole.

[0014] FIG. 3 is a flow chart depicting an exemplary embodiment of a method 100 for fabricating a transducer. The method 100 may be used in fabricating transducers such as PMR or heat assisted magnetic recording (HAMR) transducers, though other transducers might be so fabricated. For simplicity, some steps may be omitted, performed in another order, and/or combined. The magnetic recording transducer being fabricated may be part of a merged head that also includes a read head (not shown) and resides on a slider (not shown) in a disk drive. The method 100 is also described in the context of providing a pole, a single set of shields and their associated structures in a single magnetic recording transducer. However, the method 100 may be used to fabricate multiple transducers at substantially the same time. The method 100 and system are also described in the context of particular layers. However, in some embodiments, such layers may include multiple sub-layers. The method 100 also may commence after formation of other portions of the transducer. For example, the method 100 starts after the leading shield has been provided and a nonmagnetic layer has been provided on the leading shield.

[0015] A pole trench is provided in the nonmagnetic layer, via step 102. The pole trench has a pole tip region proximate to the ABS location and a yoke region. The ABS location corresponds to the location of the ABS after fabrication of the transducer is completed. The pole material(s) are provided, via step 104. The pole material(s) include or consist of high saturation magnetization material such as CoFe. Such materials may be plated or provided in another manner. In addition, a nonmagnetic seed and/or gap layer(s) may be provided. For example, a Ru layer may be deposited in the trench. The magnetic pole material(s) may be deposited with a mask in place. Alternatively, the pole materials may be grown as a full film, and then a portion outside of the pole region removed. For example, a mask that covers the region above the pole trench and exposes a portion of the pole material(s) may be provided, and the exposed portion of the pole material(s) removed. However, an external protrusion of pole material(s) remains. This external protrusion resides above and external to the pole trench.

[0016] A hard mask is provided, via step 106. The hard mask covers at least the external protrusion of the pole materials. The hard mask may be a metal, such as Ru. Step 106 may include full film depositing a hard mask layer, providing a mask that covers the portion of the hard mask layer on the external protrusion, and then removing the exposed portion of the hard mask layer. In an alternate embodiment, a mask exposing the external protrusion may be provided, the material(s) for the hard mask may be deposited, and then the mask may be removed. Thus, the magnetic materials for the pole are surrounded by a combination of seed and/or gap layers in the pole trench and the hard mask above the pole trench.

[0017] A portion of the nonmagnetic layer adjacent to the pole is removed, via step 106. In some embodiments, step 106 is performed by providing a mask having an aperture above the desired portion of the nonmagnetic layer and performing a wet etch. The portion of the nonmagnetic material removed forms a side shield trench adjacent to the pole and in which side shields may be formed.

[0018] Side shield material(s) are provided, via step 110. Step 110 may include depositing a seed layer and plating high permeability materials, such as NiFe, for the side shields. At least part of the side shield material(s) fills the side shield trench. In some embodiments, a portion of the side shield material(s) also covers the hard mask and, therefore, the pole material(s).

[0019] Both the side shield material(s) and the pole material(s) are planarized, via step 112. In some embodiments, a dielectric layer that covers both the side shield material(s) and the external protrusion of the pole materials may be provided prior to the planarization step. The planarization performed in step 112 may be a chemical mechanical planarization (CMP). Thus, the external protrusion of the pole material(s) is removed. The side shield(s) and main pole are thus formed. Fabrication of the transducer is then completed, via step 114. For example, some additional milling of the pole and/or side shields may be performed. A write gap and trailing shield may also be fabricated.

[0020] FIGS. 4 and 5 depict an exemplary embodiment of a magnetic transducer 150, otherwise termed a writer, during after formation using the method 100. For clarity, FIGS. 4 and 5 are not to scale. FIG. 4 depicts an ABS view of the transducer 150 before the planarization in step 112. The magnetic transducer 150 includes an underlayer 152, which may be a leading shield. As can be seen in FIG. 4, a gap/seed layer 154 and pole material(s) 156 have been provided. A hard mask 158 and side shield material(s) 160 have also been formed. Because the planarization step 112 has not yet been performed, an external protrusion 157 of the pole materials remains above the location of the pole trench.

[0021] FIG. 5 depicts the transducer 150 after step 112 has been performed. Write gap 162 and trailing shield 164 have also been fabricated. The write gap 162 is nonmagnetic and may be an insulator such as alumina. The trailing shield 164 may be a high permeability material such as NiFe. Because the planarization step 112 has been completed, the external protrusion 157 is removed. Thus, the main pole 156′ and side shields 160′ remain. In the embodiment shown, a portion of the nonmagnetic gap layer has been removed, leaving layer 154′.

[0022] Using the method 100, the transducer 150 having side shields 160′ and pole 156′ may be formed. Only a single planarization is used in forming both the pole 156′ and the side shields 160′. This may be accomplished without introducing additional photoresist masks and critical dimensions. Thus, processing may be greatly simplified and may require significantly less time. In addition, a single CMP for both the pole 156′ and side shields 160′ may reduce variations in the heights of the pole 156′ and side shields 160′. Performance of the transducer 150 may thus be improved. Because a single planarization is used for both the pole 156′ and shields 160′, the materials consumed during fabrication may also be reduced. The transducer 150 may cost less. Further, use of the hard mask 1158 may obviate the need for a mask such as the α-carbon mask. Related issues such as asymmetries in the pole geometry and problems with downstream processing may be reduced or avoided. Thus, performance and fabrication of the transducer 150 may be enhanced.

[0023] FIG. 6 is a flow chart depicting another exemplary embodiment of a method 200 for fabricating a write transducer. For simplicity, some steps may be omitted, interleaved, and/or combined. FIGS. 7-25 are diagrams various views of an exemplary embodiment of a portion of a transducer during 250 fabrication. For clarity, FIGS. 7-25 are not to scale. Referring to FIGS. 6-25, the method 200 is described in the context of the transducer 250. However, the method 200 may be used to form another device (not shown). The transducer 250 being fabricated may be part of a merged head that also includes a read head (not shown in FIGS. 7-25) and resides on a slider (not shown) in a disk drive. The method 200 also may commence after formation of other portions of the transducer 250. For example, the method 200 starts after formation of a leading shield (if any) and a nonmagnetic layer in which the pole is to be formed. The method 200 is also described in the context of providing a single transducer 250. However, the method 200 may be used to fabricate multiple transducers at substantially the same time. The method 200 and device 250 are also described in the context of particular layers. However, in some embodiments, such layers may include multiple sublayers.

[0024] A pole trench is provided in the nonmagnetic layer, via step 202. This may be accomplished by reactive ion etching the nonmagnetic layer. For example, if the nonmagnetic layer is formed of aluminum oxide, then step 202 may include performing a reactive ion etch with an aluminum oxide etch chemistry. The pole trench has a pole tip region proximate to the ABS location and a yoke region. The pole tip region is between the ABS location and the yoke region. The ABS location is the location at which the ABS is formed during fabrication.

[0025] A nonmagnetic seed layer is full filmed deposited, via step 204. In some embodiments, step 204 includes depositing a single nonmagnetic layer. In other embodiments, multiple sublayers may be used. In some embodiments, the nonmagnetic seed layer is Ru that may have been deposited using chemical vapor deposition (CVD). Thus, the nonmagnetic seed layer has substantially uniform thickness. FIG. 7 depicts an ABS view of the transducer 250 after step 204 has been performed. A leading shield 251 and nonmagnetic layer 252 are shown. A pole trench 254 has been formed in the nonmagnetic layer 252. Also shown is the nonmagnetic seed layer 256. A portion of the nonmagnetic seed layer 256 is within the pole trench 254. The nonmagnetic seed layer 256 may also function as a side gap layer. In the embodiment shown, the pole trench 254 is trapezoidal. However, because the nonmagnetic seed layer 256 has been deposited, the remaining portion of the pole trench 254 is triangular in cross-section. In other embodiments, the pole trench 254 and/or the unfilled remaining portion of the pole trench 254 may have another shape.

[0026] At least one magnetic pole layer is full film deposited, via step 206. In some embodiments, step 206 includes plating a high saturation magnetization material, such as CoFe. In other embodiments, step 206 may be performed using sputtering or other deposition techniques and may use additional and/or different materials. FIG. 8 depicts an ABS view of the transducer 250 after step 206 has been performed. Thus, pole material(s) 258 are shown. A portion of the pole material(s) reside in the pole trench 254 (not labeled in FIGS. 8-25 for simplicity), while another portion of the pole material(s) 258 are external to the pole trench 254.

[0027] A pole mask is formed, via step 208. In some embodiments, the pole mask is a photoresist mask that covers the region above the pole trench 254. FIGS. 9 and 10 depict ABS and plan views, respectively, of the transducer 250 after step 208 is performed. Thus, photoresist mask 260 is shown. The pole mask 260 covers at least the portion of the pole material(s) 250 above and around the pole trench 254. The remaining portion of the pole material(s) 258 is exposed.

[0028] The exposed portion of the pole material(s) 258 are removed, via step 210. As part of step 210, the photoresist mask 260 may also be stripped. FIG. 11 depicts an ABS view of the transducer 250 after step 210 is performed. Thus, only pole material(s) 258′ remain. The remaining pole material(s) 258′ has an external protrusion 259 above and external to the pole trench 254

[0029] A hard mask layer is full film deposited, via step 212. In some embodiments, step 212 includes depositing a material such as Ru. FIG. 12 depicts an ABS view of the transducer 250 after step 212 is performed. Thus, hard mask layer 262 is shown. A portion of the hard mask layer 262 covers the external protrusion 257.

[0030] A portion of the nonmagnetic layer 252 underlying part of the hard mask layer 262 is desired to be removed in order to fabricate the side shields. Thus, a mask that covers a desired portion of the hard mask layer 262 is provided, via step 214. In some embodiments, the mask provided in step 214 is a photoresist mask. The pole material(s) 258′ are covered by the mask. In addition, regions of the transducer in which the nonmagnetic layer 252 is not desired to be removed are covered. FIGS. 13 and 14 depict ABS and plan views, respectively, of the transducer 250 after step 214 is performed. Thus, mask 264 is shown. The mask 264 has apertures 263 that correspond to the side shields. Note that the underlying pole material(s) 258′ are shown as dashed lines in FIG. 14 as these structures are covered by the mask 264.

[0031] An exposed portion of the hard mask layer is removed to form a hard mask, via step 216. FIG. 15 depicts an ABS view of the transducer 250 after step 216 is performed. The hard mask 262′ covers at least the external protrusion 259. Thus, the pole materials 258′ are enclosed in the seed layer 256′ and hard mask 262′, both of which may be formed of protective material(s) such as Ru.

[0032] The portion of the nonmagnetic layer 252 adjacent to the pole material(s) 258′ and exposed by the hard mask 262′ is wet etched, via step 218. In some embodiments, the mask 264 doubles as a mask used in the wet etch of step 218. However, in other embodiments, the mask 264 may be removed and another mask may be provided. After step 218 is performed, the mask 264 may be removed. FIG. 16 depicts an ABS view of the transducer 250 after step 218 is performed. Part of the nonmagnetic layer 252 has been removed, with part of the nonmagnetic layer 252′ remaining. Side shield trenches 265 have thus been formed.

[0033] A seed layer for the side shields is full film deposited, via step 220. FIG. 17 depicts an ABS view of the transducer 250 after step 220 is performed. Thus, layer 266 is shown. A side shield mask is provided, via step 222. The side shield mask is used to control the region in which the side shield material is to be deposited. In some embodiments, the side shield mask is a photoresist mask. FIGS. 19 and 20 depict ABS and plan views of the transducer 250 after step 222 is performed. Thus, side shield mask 268 having aperture 269 is shown. The aperture 269 exposes a portion of the side shield trenches 265, the region above the pole material(s) 258′, and the hard mask 262′ on the pole material(s) 258′.

[0034] One or more layer(s) of material(s) are deposited for the side shields, via step 224. In some embodiments, a layer of high permeability material such as NiFe may be plated. However, in other embodiments, other material(s) and/or other deposition techniques may be used. FIG. 20 depicts an ABS view of the transducer after step 224 is performed. Thus, side shield material(s) 270 have been provided.

[0035] The side shield mask 268 is removed, via step 226. For example, a photoresist strip may be performed. The exposed side shield seed layer 266 may be removed, via step 228. In some embodiments, step 228 is performed by milling the side shield seed layer 266. FIG. 21 depicts an ABS view of the transducer 250 after step 228 is performed. Thus, the side shield seed layer 266′ under the side shield material(s) 270 remains. However, the side shield seed layer in portions surrounding the side shield material(s) 270 has been removed.

[0036] An aluminum oxide layer is deposited, via step 230. FIG. 22 depicts an ABS view of the transducer 250 after step 230 is performed. Thus, an aluminum oxide layer 272 that covers the side shield material(s) 270 has been formed.

[0037] The side shield material(s) 270 and pole material(s) 258′ are planarized, via step 232. Step 232 includes performing a CMP. FIG. 23 depicts an ABS view of the transducer after step 232 is performed. Thus, the external protrusion 259 has been removed. Only a portion of the pole material(s) 258″ within the pole trench remains. In addition, the side shield material(s) 270′ above the pole 258″ have been removed. Only a portion of the side shield seed layer 266″ and seed layer 256″ remain. The remaining side shield material(s) 270′ have a top surface that is substantially the same as the top surface of the pole 258″. Thus, side shields 270′ and main pole 258″ have been formed.

[0038] A write gap and trailing shield are formed, via step 234. In forming the write gap, a mill may be performed that removes portions of the side shield 270′, side shield seed layer 266″, pole 258″ and 256″. The write gap may be formed by atomic layer deposition of a nonmagnetic material such as aluminum oxide. At least part of the write gap is formed on the pole 258″. The trailing shield may be formed by plating a magnetic material such as NiFe. At least part of the trailing shield is on the write gap. FIG. 24 depicts an ABS view of the transducer 250 after the write gap 274 is formed in step 234. FIG. 25 depicts an ABS view of the transducer 250 after the trailing shield 276 is formed. In the embodiment shown, the trailing shield 276 is magnetically and physically connected with the side shields 270′. In other embodiments, the write gap 274 may be extended so that the trailing shield 276 and side shields 270′ are physically and magnetically disconnected.

[0039] Thus, using the method 200, the transducer 250 may be fabricated. The transducer 250 shares the benefits of the transducer 150. More specifically, fabrication and performance of the transducer 250 may be improved.