Electric gaps and method for making electric gaps for multiple sensor arrays

[0001] This application claims priority to provisional U.S. Patent Application Ser. No. 61/922,352, filed on Dec. 31, 2013, which is hereby incorporated by reference in its entirety.

[0002] FIG. 1 depicts an air-bearing surface (ABS) view of a conventional read transducer 10. The conventional read transducer 10 includes shields 12 and 20, sensor 14, magnetic bias structures 16 and conventional electric gaps 22. The read sensor 14 is typically a giant magnetoresistive (GMR) sensor or tunneling magnetoresistive (TMR) sensor. The read sensor 14 includes an antiferromagnetic (AFM) layer, a pinned layer, a nonmagnetic spacer layer, and a free layer. Also shown is a capping layer. In addition, seed layer(s) may be used. The free layer has a magnetization sensitive to an external magnetic field. Thus, the free layer functions as a sensor layer for the magnetoresistive sensor 14. The magnetic bias structures 16 may be hard bias structures or soft bias structures. These magnetic bias structures are used to magnetically bias the sensor layer of the sensor 14.

[0003] The electric gaps 22 are used to electrically isolate the read sensor 14. Typically, the conventional electric gaps are formed after the read sensor 14 and magnetic bias structure have been formed and the conventional transducer 10 has been planarized. After the chemical mechanical planarization (CMP) or analogous planarization step, the conventional electric gaps 22 are formed. The shield 20 may then be deposited.

[0004] Although the conventional magnetic recording transducer 10 functions, there are drawbacks. In particular, the conventional magnetic recording transducer 10 may not function adequately at higher recording densities. Two-dimensional magnetic recording (TDMR) technology may enable significantly higher recording densities. In TDMR, multiple read sensors are used. These sensors are longitudinally distributed along the cross track direction. The central sensor reads the data from a track of interest, while the outer sensors sense the data in adjacent tracks in order to account for noise.

[0005] Although TDMR might be capable of higher recording densities, issues may complicate fabrication of a read transducer or adversely affect its performance. Fabrication of an additional read sensor above the read sensor 14 shown, in place of the shield 20, may be complicated. Such a read sensor would be desired to be electrically isolated from the read sensor 14. However, the conventional electric gaps 22 do not allow for a flat topology. If the electric gaps are omitted, electrical insulation may be insufficient. If the additional read sensor is fabricated above the tops of the electric gaps 22, too large a space may be between the read sensors. Consequently, a transducer suitable for use in TDMR and which may be relatively simply fabricated is desired.

[0014] FIG. 2 depicts a side view of a disk drive 100. For clarity, FIG. 2 is not to scale. For simplicity not all portions of the disk drive 100 are shown. In addition, although the disk drive 100 is depicted in the context of particular components other and/or different components may be used. For example, circuitry used to drive and control various portions of the disk drive 100 is not shown. For simplicity, only single components are shown. However, multiples of one or more of the components and/or their sub-components might be used.

[0015] The disk drive 100 includes media 101, a slider 102, a head 103 including a write transducer 104 and a read transducer 110. The write transducer includes at least a write pole 106 and coil(s) 108 for energizing the pole 106. Additional and/or different components may be included in the disk drive 100. Although not shown, the slider 102, and thus the transducers 104 and 110 are generally attached to a suspension (not shown). The transducers 104 and 110 are fabricated on the slider 102 and include an ABS proximate to the media 101 during use. Although both a write transducer 104 and a read transducer 110 are shown, in other embodiments, only a read transducer 110 may be present. The read transducer 110 includes multiple read sensors 112 and 114, read shields 120 and 150 and middle shield 130. In the embodiment shown, the read sensor 112 and 114 are self-aligned in the down track direction of the transducer 110.

[0016] FIGS. 3A and 3B depict a close-up ABS view of the transducer 110 of the disk drive 100 and a further-away ABS view of the transducer 110. For clarity, FIGS. 3A and 3B are not to scale. For simplicity not all portions of the disk drive 100 are shown. The transducer 110 and disk drive 100 depicted in FIGS. 3A and 3B are analogous to the read transducer 110 and disk drive 100 depicted in FIG. 2. Consequently, analogous components have similar labels. For simplicity, only a portion of the transducer 110 and disk drive 100 are shown in FIGS. 3A-3B.

[0017] Referring to FIGS. 2, 3A and 3B, the read transducer 110 includes multiple read sensors 112 and 114 having sensor layers 113 and 115, respectively, that may be free layers in a giant magnetoresistive (GMR) sensor or a tunneling magnetoresistive (TMR) sensor. Thus, each sensor 112 and 114 may include a pinning layer, a pinned layer and a nonmagnetic spacer layer in addition to the free layer 113 and 115, respectively. For simplicity, only the free layers 113 and 115 are separately labeled in FIGS. 3A-3B. The sensors 112 and 114 may also include other layers such as seed layer(s) (not shown) and capping layer(s) (not shown). The pinning layer is generally an AFM layer that is magnetically coupled to the pinned layer. In other embodiments, however, the pinning layer may be omitted or may use a different pinning mechanism. The free layers 113 and 115 are each shown as a single layer, but may include multiple layers including but not limited to a synthetic antiferromagnetic (SAF) structure. The pinned layer may also be a simple layer or a multilayer. Although shown as extending the same distance from the ABS in FIG. 2, the pinned layer may extend further than the corresponding free layer 113 and/or 115. The nonmagnetic spacer layer may be a conductive layer, a tunneling barrier layer, or other analogous layer. Although depicted as a GMR or TMR sensor, in other embodiments, other structures and other sensing mechanisms may be used for the sensor. Also shown in FIG. 3B are the electric gaps 160 and 162.

[0018] The read sensors 112 and 114 may have different widths in the track width, or cross-track, direction. However, in other embodiments, the widths of the sensors 112 and 114 may be the same. The widths of the sensors 112, 114 and 116 may also be based on the track pitch. The track pitch is the distance from the center of one track to the center of the next track. Further, the widths may depend not only on the track pitch, but also on the distance between the sensors 112 and 114. In the embodiment shown, the read sensors 112 and 114 are offset in the cross track direction. Therefore, the centers of each of the read sensors 112 and 114 are not aligned along a line that runs the down track direction. Stated differently, the centers of the read sensors 112 and 114 are separated in the cross-track direction. The read sensor 114 is also in a down track direction from the read sensor 112. The read sensor 114 is thus closer to the trailing edge of the slider 102 than the read sensor 112 is. Conversely, the read sensor 112 is in a direction opposite to the down track direction from the read sensor 114. The read sensor 112 is thus closer to the leading edge of the slider 102 than the read sensor 114. The down track direction, cross track direction and stripe height direction are thus shown in FIGS. 3A and 3B.

[0019] Also shown are bias structures 122 and 123 that magnetically bias the read sensors 112 and 114, respectively. The magnetic bias structure(s) 122 and/or 123 may be soft bias structures fabricated with soft magnetic material(s). In other embodiments, the magnetic bias structure(s) 122 and/or 123 may be hard magnetic bias structures. Other mechanisms for biasing the sensors 112, and 114 might also be used.

[0020] The read sensors 112 and 114 are separated by middle shield 130. The read sensors 112 and 114 and shield 130 are surrounded by read shields 120 and 150. Thus, as used herein, a middle shield may be considered to be an internal shield, which is interleaved with read sensors 112 and 114 and between the outer, read shields 120 and 150. The outermost shields for the read transducer 110 are termed read shields. The middle shield 130 is in the down track direction from the read sensor 112 and in the opposite direction from the down track direction from read sensor 114. In the embodiment shown in FIGS. 2, 3A and 3B, there are two read sensors 112 and 114 and one middle shield 130. However, in another embodiment, another number of read sensors and middle/internal shields may be present. The middle shield/read shields 120, 130 and 150 generally include soft magnetic material. In some embodiments, one or more of the shields 120, 130 and 150 may include ferromagnetic layers that are antiferromagnetically coupled. For example, the middle shield 130 is depicted as including conductive shield layers 132 and 136 separated by insulating layer 134. As can be seen in FIG. 3B, each of the shield layers 132 and 136 may be a multilayer. Although not shown as such, the insulating layer 134 may be an insulator or a conductor.

[0021] In operation, current is driven perpendicular-to-plane for the sensors 112 and 114. Thus, current is driven through the sensor 112 between the shields 120 and 130. Similarly, current is driven through the sensor 114 between the shields 130 and 150. Thus, electrical connection is to be made to the shields 120, 130 and 150. However, different currents may be desired to be driven through the sensors 112 and 114. Similarly, the resistances of the sensors 112 and 114 may be desired to be separately sensed. For example, the sensors 112 and 114 may each be desired to be separately coupled to their own preamplifier (preamp). As a result, the sensors 112 and 114 are desired to be electrically isolated from each other. Consequently, the middle shield 130 may be configured to not only magnetically shield the sensors 112 and 114, but also to provide electrical isolation. As a result, the shield 130 may include the insulating layer 134. However, in other embodiments, the shield 130 may be a monolithic structure.

[0022] Electric gaps 160 and 162 and thin electric gaps 164 and 166 are used to electrically insulate the sensor 112 and read shield 120 from other layers such as the read shield 150 and shield layer 136. The electric gaps 160, 162, 164 and 166 also prevent current from shunting away from the sensors 112 and 114. In an alternate embodiment, one or more of the electric gaps 160, 162, 164 and/or 166 might be omitted. In addition, the electric gaps 160 and 162 are shown as being substantially the same. Thus, the gaps 160 and 162 and shields 120, 130 and 140 are symmetric with respect to a line drawn through the center of the middle shield 130 in either the down track or the cross track direction. In other embodiments, the gaps 160, 162, 164 and 166 may not be symmetric. For example, the locations of gaps 162 and 166 may be switched. The electric gaps 160 and 162 include insulating material(s) such as aluminum oxide and/or silicon oxide. In some embodiments, the electric gaps 160 and 162 are at least one hundred fifty nanometers thick at their thickest portions. In some embodiments, the thickness is at least two hundred nanometers. At their edges (thinnest regions), the electric gaps 160 and 162 may be not substantially thicker than the read sensor 112. In other embodiments, the electric gaps 160 and 162 may have other thicknesses. The electric gaps 160 and 162 may also be used to reduce the capacitance of the transducer 110. Further, as can be seen in FIG. 3B, a portion of each of the electric gaps 160 and 162 is in a direction opposite to the down track direction from the read sensor 112. In other words, the electric gaps 160 and 162 extend further down the page (toward the leading edge of the slider 102) than the read sensor 112. As a result, the insulation between the shields 120 and 150 may be increased.

[0023] On the other hand, the electric gaps 160 and 162 do not extend significantly further in the down track direction than the read sensor 112. The surface formed at least in part by the down track surfaces of the electric gaps 160 and 162, the read sensor 112 and the bias structures 122 is thus substantially flat. In some embodiments, therefore, the middle shield 130 has a substantially flat bottom/leading edge surface. At least in part because of the configuration of the electric gaps 160 and 162, the surface of the middle shield closest to the leading edge is substantially flat. In some embodiments, the surface of the middle shield 130 closest to the trailing edge is also substantially flat.

[0024] The magnetic read transducer 110 and disk drive 100 may have improved performance and manufacturability. The thickness and insulating ability of the electric gaps 160 and 162 may be maintained. The sensors 112 and 114 may be separated by a relatively small distance corresponding to the thickness of the middle shield 130. As a result, the capacitances between the sensors 112 and 114 may be reduced. The magnetic transducer 110 may then be used at higher data rates in TDMR. In addition, the down track surface of the shield 130/shield layer 136 (the surface closest to the sensor 114) may be substantially flat, even over the electric gaps 160 and 162. In some embodiments, the leading surface of the shield 130/shield layer 132 (the surface closest to the sensor 112) may also be substantially flat. Consequently, variations in topography due to fabrication of the sensor 112 may be reduced or eliminated. Fabrication of the sensor 114 may be facilitated. Performance and fabrication of the magnetic transducer 110 may, therefore, be improved.

[0025] FIG. 4 depicts an ABS view of an exemplary embodiment of a transducer 110′ that is part of a disk drive 100′. For clarity, FIG. 4 is not to scale. For simplicity not all portions of the disk drive 100′ and transducer 110′ are shown. The transducer 110′ and disk drive 100′ depicted in FIG. 4 are analogous to the read transducer 110 and disk drive 100 depicted in FIGS. 2-3B. Consequently, analogous components have similar labels. For simplicity, only a portion of the transducer 110′ and disk drive 100′ are shown in FIGS. 3A-3B.

[0026] The transducer 110′ includes read shields 120 and 150, read sensors 112 and 114, magnetic bias structures 122 and 123, and middle shield 130 including layers 132, 134 and 136 that are analogous to the read shields 120 and 150, read sensors 112 and 114, magnetic bias structures 122 and 123, and middle shield 130 including layers 132, 134 and 136 depicted in FIGS. 2-3B, respectively. The transducer 110′ thus operates in a similar manner to the transducer 110.

[0027] The transducer 110′ includes electric gaps 160, 162, 164′ and 166′ that are analogous to the electric gaps 160, 162, 164 and 166, respectively, depicted in FIGS. 2-3B. Thus, the electric gaps 160, 162, 164′ and 166′ include insulating material(s) such as aluminum oxide and/or silicon oxide. In an alternate embodiment, one or more of the electric gaps 160, 162, 164′ and/or 166′ might be omitted.

[0028] The electric gaps 164′ and 166′ that are analogous to the electric gaps 164 and 166 in that the gaps 164′ and 166′ are in the down track direction from the middle shield 130. However, the configuration of the electric gaps 164′ and 166′ is more similar to that of the gaps 160 and 162. The electric gaps 164′ and 166′ are shown as being substantially the same. Thus, the gaps 164′ and 166′ and shields 120, 130 and 140 are symmetric with respect to a line drawn through the center of the middle shield 130 in either the down track or the cross track direction. However, symmetry is not required. In some embodiments, the electric gaps 164′ and 166′ are at least one hundred and fifty nanometers thick at their thickest portions. In some embodiments, the thickness is at least two hundred nanometers. At their edges (thinnest regions), the electric gaps 164′ and 166′ may be not substantially thicker than the read sensor 114. In other embodiments, the electric gaps 164′ and 166′ may have other thicknesses. The electric gaps 164′ and 166′ may also be used to reduce the capacitance of the transducer 110′. As can be seen in FIG. 4, a portion of each of the electric gaps 164′ and 166′ is in the down track direction from the read sensor 114. In other words, the electric gaps 164′ and 166′ extend further up the page (toward the trailing edge of the slider 102) than the read sensor 114. On the other hand, the electric gaps 164′ and 166′ do not extend significantly further in a direction opposite to the down track direction than the read sensor 114. The surface formed by the up track (closer toward the leading edge) surfaces of the electric gaps 164′ and 166′, the read sensor 114 and the bias structures 123 is thus substantially flat. The down track surfaces of the electric gaps 160 and 162, the read sensor 112 and the bias structures 122 may also be substantially flat. At least in part because of the configuration of the electric gaps 160, 162, 164′ and 166′, the top (trailing edge) and bottom (leading edge) surfaces of the middle shield 130 may be substantially flat.

[0029] The magnetic read transducer 110′ and disk drive 100′ may have improved performance. For example, the thickness of the electric gaps 160, 162, 164 and 166 may be relatively large. As a result, the capacitances between the sensors 112 and 114 may be reduced. The small distance between the sensors 112 and 114 may be maintained. The magnetic transducer 110′ may then be used at higher data rates for TDMR. In addition, the surfaces of the shield 130 may be substantially flat, even between the electric gaps 160 and 164 and between the electric gaps 162 and 166. Consequently, variations in topography due to fabrication of the sensor 112 may be reduced or eliminated. Fabrication of the sensor 114 may be facilitated.

[0030] FIG. 5 is an exemplary embodiment of a method 200 for providing a read transducer having multiple sensors and electric gaps that may facilitate fabrication. For simplicity, some steps may be omitted, interleaved, and/or combined. The method 200 is also described in the context of providing a single recording transducer 110 or 110′ depicted in FIGS. 2, 3A-3B and 4. However, the method 200 may be used to fabricate multiple transducers at substantially the same time. The method 200 may also be used to fabricate other transducers. The method 200 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 200 also may start after formation of other portions of the magnetic recording transducer.

[0031] The first read shield 120 is provided, via step 202. Step 202 typically includes depositing (e.g. plating) a large high permeability layer. The layer may also be planarized. The first read sensor 114 is provided, via step 204. Step 204 may include full-film depositing an AFM layer, a pinned layer, a nonmagnetic spacer (e.g. tunneling barrier) layer and a free layer 113. The read sensor 112 is defined in step 204. Step 204 may define the read sensor 112 in the cross track and/or the stripe height direction. The stripe height direction is perpendicular to the ABS.

[0032] The first and second electric gaps 160 and 162 are provided, via step 206. Step 206 may be performed before or after formation of the read sensor 112. Step 206 may also be interleaved with various steps carried out in fabricating the read sensor 112. Because a portion of the electric gaps 160 and 162 are closer to the leading edge that the read sensor 112, step 206 may include removing a portion of the read shield 120. The material for the electric gaps 160 and 162 may be deposited in the trenches formed by the removal of the shield material. In some embodiments, the deposition may be carried out such that the top/down track surface of the electric gaps 160 is substantially the same as the top/down track surface of the sensor 112. In some such embodiments, a planarization such as a chemical mechanical planarization (CMP) may also be performed.

[0033] The middle shield 130 is provided on the first read sensor 112, via step 208. Step 208 may include depositing the shield layers 132 and 136 as well as the insulating layer 134. The shield 130 resides in a down track direction from the first read sensor 112 and, therefore, from the electric gaps 160 and 162. Because of the configuration of the electric gaps 160 and 162, the middle shield 130 has a substantially flat down track surface.

[0034] The second read sensor 114 may be provided, via step 210. Step 210 includes full-film depositing the layers for the read sensor 114 on the middle shield 130. The second read sensor 114 may also be defined in the cross track direction and/or the stripe height direction. The middle shield 130 is thus between the first read sensor 112 and the second read sensor 114 in the down track direction.

[0035] The electric gaps 164/164′ and 166/166′ may optionally be provided, via step 212. Step 212 may include covering the read sensor 114 with a mask and depositing the electric gaps 164/164′ and 166/166′. Thus, the down track surface of the shield 130 may not be affected by formation of the electric gaps 164/164′ and 166/166′. The second read shield 150 may be provided, via step 214. Step 214 typically includes depositing (e.g. plating) a large high permeability layer. The layer may also be planarized. Fabrication of the read transducer 110/110′ may then be completed.

[0036] Using the method 200, the magnetic read transducer 110/110′ and disk drive 110/100′ may be provided. Because of the manner in which the electric gaps 160 and 162 are fabricated, a substantially flat surface is provided for fabrication of the read sensor 114. Processing may thus be simplified. The thickness of the electric gaps 160, 162, 164′ and 166′ may be sufficiently large that the capacitances between the sensors 112 and 114 may be reduced. The small distance between the sensors 112 and 114 may be maintained. Consequently, the simplification in processing may not adversely affect performance of the transducer 110/110′. The benefits of the transducers 110 and/or 110′ may thus be achieved.

[0037] FIG. 6 is an exemplary embodiment of a method 250 for providing a read transducer having multiple sensors and electric gaps that may facilitate fabrication. For simplicity, some steps may be omitted, interleaved, and/or combined. FIGS. 7-14 depict ABS views of an exemplary embodiment of a transducer 300 that may be used in a magnetic disk drive during fabrication using the method 250. Such a disk drive may be analogous to the disk drive 100. For clarity, FIGS. 7-14 are not to scale and not all portions of the transducer 300 are shown. FIGS. 15-20 depict ABS views of an exemplary embodiment of a transducer 300′ that may be used in a magnetic disk drive during fabrication using the method 250. Such a disk drive may be analogous to the disk drive 100. For clarity, FIGS. 15-20 are not to scale and not all portions of the transducer 300′ are shown. The method 250 is first described in the context of providing a transducer 300 depicted in FIGS. 7-14. However, the method 250 may be used to fabricate multiple transducers at substantially the same time. The method 250 may also be used to fabricate other disk drives including but not limited to the disk drive 100 and transducers 110/110′. The method 250 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 250 also may start after formation of other portions of the magnetic recording transducer.

[0038] The first read shield is provided, via step 252. Step 252 typically includes depositing (e.g. plating) a large high permeability layer. A CMP may also be performed to provide a flat surface for subsequent processing. The first read sensor and magnetic bias structures are provided, via step 254. Step 254 may include full-film depositing the layers for the first read sensor and defining the read sensor in at least the cross track direction. The magnetic bias structures may also be provided. In some embodiments, an insulating layer is provided between the sidewall of the read sensor and the bias structures. An insulating layer may adjoin the edges of the bias structures furthest from the sensor in the cross track direction. FIG. 7 depicts an ABS view of the transducer 300 after step 254 has been performed. A first read shield 320 formed in step 252 is depicted. Also shown is the read sensor 312, magnetic bias structures 322 and insulating layer 317.

[0039] A mask that covers the region around the read sensor 312 is provided and the underlying read shield 320 is partially etched, via step 256. Thus, trenches are formed in the read shield 320. In some embodiments, these trenches are at least one hundred nanometers deep. In other embodiments, the trenches are at least two hundred nanometers deep. However, other depths are possible. Using step 256, the read shield 320 is prepared for formation of the electric gaps. FIGS. 8A and 8B depict ABS and plan views of the transducer 300 during step 255. Thus, the mask 324 covering the read sensor 312 has been formed. In some embodiments, the mask 324 is approximately 5 μm by 5 μm.

[0040] A refill is then performed, via step 258. Consequently, a refill material such as alumina may be deposited to fill in the region of the read shield 320 that was removed in step 256. A light ion mill may also be performed as part of step 258 after the insulator is deposited. Such an ion mill may be used to further planarize the surface. In other embodiments, another process may be used or the ion mill may be omitted. FIG. 9 depicts a side view of the transducer 300 after step 258 is performed. Thus, the insulator has formed electric gaps 360 and 362 having a substantially flat down track surface. Further, a portion of the electric gaps 360 and 362 extend further than the read sensor 312 in a direction opposite to the down track direction. The electric gaps 360 and 362 may be as thick as the trenches are deep. Although not shown, a portion of the insulator may reside on the mask 324.

[0041] The middle shield is provided on the first read sensor 312, magnetic bias 322, insulator 317 and electric gaps 360 and 362, via step 260. Step 260 may include providing conductive shield layers that are separated by an insulating layer. The conductive shield layers and insulating layer may have sublayers. After formation of the middle shield, a light planarization such as a CMP may optionally be performed, via step 262. Thus, the down track surface of the middle shield may be substantially flat. FIG. 10 depicts an ABS view of the transducer 300 after step 262 is performed. Thus, middle shield 330 has been formed. The middle shield 330 includes shield layers 332 and 336 and insulating layer 334. The shield layers 332 and 336 may be conductive, high permeability layers. the

[0042] A second read sensor and corresponding magnetic bias structures are provided, via step 264. Step 264 includes full-film depositing the layers for the second read sensor on the middle shield 330 and defining the second read sensor in at least the cross track direction. The magnetic bias structures may be deposited while the second read sensor is covered by a mask. An insulating layer may be provided between the second read sensor and the magnetic bias structures. In addition, another insulator may be provided adjacent to the edges of the magnetic bias structures. These edges are furthest from the second read sensor in the cross track direction. FIG. 11 depicts an ABS view of the transducer 300 after step 264 is performed. Thus, the second read sensor 314 is shown. The second read sensor 314 may be analogous to the first read sensor 312. In the embodiment shown, the sensors 312 and 314 are offset in the cross track direction. In other embodiments, the sensors 312 and 314 might be aligned. Also shown are magnetic bias structures 323 and insulating layers 319. The middle shield 330 is between the first read sensor 312 and the second read sensor 314 in the down track direction.

[0043] The third and fourth electric gaps are provided, via step 266. This may be accomplished by providing a mask that covers the region around the read sensor 314 and depositing an insulator. For example, a connection to a lower shield may not be provided, but a connection to an upper shield (not shown) may be present. The mask used may be similar to the mask 324 used in forming the electric gaps 360 and 362. FIG. 12 depicts an ABS view of the transducer 300 during step 266. Thus, the mask 326 has been provided. FIG. 13 depicts an ABS view of the transducer 300 after the insulator has been deposited and the mask 326 removed. Thus, electric gaps 364 and 366 have been formed.

[0044] The second read shield is provided, via step 268. Step 268 typically includes depositing (e.g. plating) a large high permeability layer. Fabrication of the transducer may then be completed. The electronics such as preamplifiers for the read sensors may be provided. FIG. 14 depicts an ABS view of the read transducer 300 after step 268 has been completed. Thus, the read shield 350 is shown.

[0045] As discussed above, the steps of the method 250 may be performed in another order. For example, the formation of the electric gaps in steps 256 and 258 may be performed before the read sensor and bias structures are formed in step 254. The method 250 is thus also described in the context of FIGS. 15-20, which depict ABS views of an exemplary embodiment of a magnetic transducer 300′ during fabrication using the method 250 if the steps 256 and 258 are performed after step 252 but before step 254. Although one transducer 300′ is shown, multiple may be fabricated at substantially the same time. The transducer 300′ is analogous to the transducer 300. Consequently, the components are labeled similarly.

[0046] The first read shield 320 is formed in step 252. The sensor region is then masked and the first read shield 320 etched to form trenches. FIG. 15 depicts the transducer during step 256. Thus, a mask 324′ is shown on the read shield 320. Note that no read sensor has been formed. FIG. 16 depicts an ABS view of the transducer 300′ after step 256 has been completed. Thus, trenches 361 have been formed in the read shield 320. FIG. 17 depicts the transducer 300′ after step 258 has been completed. Thus, the gaps 360′ and 362′ have been formed. In some embodiments, a CMP may be performed after step 258 is performed. This CMP may be instead of or in addition to the CMP on just the read shield 320.

[0047] The read sensor and bias structures may then be formed in step 254. FIG. 18 depicts the transducer 300′ after step 254 is performed. Thus, read sensor 312, magnetic bias structures 322 and insulating layers 317′ are shown. The method 250 may then continue with formation of the middle shield in step 260. A light planarization may optionally be performed and the second read sensor and bias structures formed in steps 262 and 264. FIG. 19 depicts the transducer 300′ after step 264 is performed. Thus, middle shield 330 including shield layers 332 and 336 and insulating layer 334 are shown. Also depicted are second read sensor 314, magnetic bias structures 323 and insulating layer 319.

[0048] The third and fourth electric gaps may be formed in step 266 as discussed above. An additional read shield may also be provided in step 268. FIG. 20 depicts an ABS view of the transducer 300′ after steps 266 and 268 have been completed. Thus, electric gaps 364′ and 366′ and read shield 350 are shown.

[0049] Using the method 250, the magnetic read transducer 300/300′ may be provided. Because of the manner in which the electric gaps 360/360′ and 362/362′ are fabricated, a substantially flat surface is provided for fabrication of the read sensor 314. Processing may thus be simplified. The thickness of the electric gaps 360, 362, 364/364′ and 366/366′ may be sufficiently large that the capacitances between the sensors 312 and 314 may be reduced. The small distance between the sensors 312 and 314 may be maintained. Consequently, the simplification in processing may not adversely affect performance of the transducer 300/300′. The benefits of the transducers 300 and/or 300′ may thus be achieved.