US 8,917,581 B1Grant
Self-anneal process for a near field transducer and chimney in a hard disk drive assembly
Issue Date:2014-12-23
•26 Claims
•6 Drawing Sheets
Abstract
Articles of manufacture and methods of manufacturing such articles of manufacture are disclosed. The articles of manufacture may include a heat assisted magnetic recording (HAMR) transducer having a near field transducer (NFT) and a chimney thermally coupled to the NFT. The articles of manufacture may also include an electrical conductor having section with a reduced width that is thermally coupled to the chimney. The methods include applying an electrical current to the electrical conductor to generate heat in the section and annealing the chimney and the NFT from the heat generated.
Metadata
Assignee
- Western Digital Technologies, Inc.
Inventor
- Michael L. Mallary
Application Information
Application Number:US 14/158,754
Filing Date:2014-01-17
Priority Date:2013-12-18
Art Unit:2686
Classifications
IPC:
G11B11/00
Patent Drawings (6 sheets)
Description
Cross-Reference to Related Application
[0001] This application claims the benefit of U.S. Provisional Application Ser. No. 61/917,799, filed on Dec. 18, 2013, which is expressly incorporated by reference herein in its entirety.
Background
[0002] The disclosure relates to energy assisted magnetic recording transducers or hard disk drives.
[0003] A conventional heat assisted magnetic recording (HAMR) transducer is used in writing data to a recording media. The conventional HAMR receives light, or energy, from a conventional laser, which may be a diode laser, for example. The current areal data density using HAMR is about 1 Tb/in−2. The HAMR is conventionally bonded to a slider that rides on an air bearing surface of the recording media. The slider is attached to an arm that rotates to provide the slider and HAMR access to write tracks on the media at different radii.
[0004] The surface plasmon effect may be applied in a near-field transducer (NFT) to write data bits of smaller dimension than with conventional HAMR, on the order of 70 nm or less, but with higher heat energy density, increasing the possible areal data density that may be written to a magnetic disk. It is estimated that areal densities approaching 3 Tb/in−2 are possible.
[0005] The NFT is effective in heating high magnetic anisotropy materials for about 1 nsec above the phase transition temperature to briefly lower the high coercivity, enabling the write head to record data that becomes stable once the heated bit region cools to ambient. The small size of the data bit translates into a large increase of storage density as compared to current areal densities of about 1 Tbm−2.
[0006] However, because of the intensity of the resonant electromagnetic field that builds up in the NFT, the accumulated heat concentration may cause migration of the NFT material, thereby degrading the effectiveness of a HAMR. In-process anneals and better alloys have been proposed to mitigate this problem but studies indicate the need for anneals at greater than 200° C. However the disk reader and hard baked photoresist structures of the hard disk drive may degrade for >200° C. Local heating with a laser spot has been proposed but may not be economic and readily reduced to practice. Therefore a local annealing technique is needed.
Brief Description of the Drawings
[0007] Various aspects of the present invention will now be presented in the detailed description by way of example, and not by way of limitation, with reference to the accompanying drawings, wherein:
[0008] FIG. 1 is a conceptual view of an exemplary embodiment of a HAMR disk drive.
[0009] FIG. 2 is a conceptual view of an exemplary embodiment of a HAMR transducer arranged with a slider for a HAMR disk drive.
[0010] FIG. 3 is a plan view of an exemplary embodiment of an NFT.
[0011] FIG. 4 is a plan view of an exemplary embodiment of an electrical conductor for annealing an NFT and chimney heat sink during the manufacturing process.
[0012] FIG. 5A is a plan view illustrating an exemplary embodiment of the narrow section of the electrical conductor on a surface of the HAMR transducer directly over the chimney and NFT.
[0013] FIG. 5B is a cross-section view of the exemplary embodiment shown FIG. 5A .
[0014] FIG. 6 is a plan view of an exemplary embodiment of an array of individual electrical conductors for annealing an array of NFT and chimneys in a batch manufacturing process.
Detailed Description
[0015] The detailed description set forth below in connection with the appended drawings is intended as a description of various exemplary embodiments of the present invention and is not intended to represent the only embodiments in which the present invention may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts of the present invention. Acronyms and other descriptive terminology may be used merely for convenience and clarity and are not intended to limit the scope of the invention.
[0016] The word “exemplary” is used herein to mean serving as an example, instance, or illustration. Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments. Likewise, the term “embodiment” of an apparatus, method or article of manufacture does not require that all embodiments of the invention include the described components, structure, features, functionality, processes, advantages, benefits, or modes of operation.
[0017] Any reference to an element herein using a designation such as “first,” “second,” and so forth does not generally limit the quantity or order of those elements. Rather, these designations are used herein as a convenient method of distinguishing between two or more elements or instances of an element. Thus, a reference to first and second elements does not mean that only two elements can be employed, or that the first element must precede the second element.
[0018] As used herein, the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of the stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
[0019] In the following detailed description, various aspects of the present invention will be presented in the context of a process for locally annealing a heat sinking chimney and near field transducer (NFT) in a HAMR transducer for hard disk drive read/write assemblies. However, those skilled in the art will realize that these aspects may be extended to other materials or components in other apparatus or articles of manufacture. Accordingly, any reference to a process for annealing a heat sinking chimney and NFT in a HAMR transducer is intended only to illustrate the various aspects of the present invention, with the understanding that such aspects may have a wide range of applications.
[0020] Various aspects of articles of manufacture and methods of manufacturing such articles of manufacture are disclosed. The articles of manufacture may include a HAMR transducer having an NFT and a chimney thermally coupled to the NFT. The articles of manufacture may also include an electrical conductor having section with a reduced width that is thermally coupled to the chimney. The methods include applying an electrical current to the electrical conductor to generate heat in the section and annealing the chimney and the NFT from the heat generated.
[0021] Various aspects of articles of manufacture and methods of manufacturing such articles of manufacture in batch are also disclosed. The articles of manufacture may include an array of HAMR transducers each having a near field transducer (NFT) and a chimney thermally coupled to the NFT. The articles of manufacture may further include an array of electrical conductors arranged with the array of HAMR transducers with each of the electrical conductors having section with a reduced width that is thermally coupled to a respective one of the chimneys. The methods include applying an electrical current to the electrical conductors to generate heat in their respective sections, and annealing the chimneys and the NFTs from the heat generated.
[0022] It is understood that other aspects of apparatus, articles of manufacture and methods will become readily apparent to those skilled in the art from the following detailed description, wherein various aspects of articles of manufacture and methods are shown and described by way of illustration. As will be realized, these aspects may be implemented in other and different forms and its several details are capable of modification in various other respects. Accordingly, the drawings and detailed description are to be regarded as illustrative in nature and not as restrictive.
[0023] FIG. 1 is a conceptual view of an exemplary embodiment of a HAMR disk drive. The HAMR disk drive 100 is shown with a rotatable magnetic disk 102. The magnetic disk 102 may be rotated on a spindle 104 by a disk drive motor (not shown) located under the magnetic disk 102. A head 106 may include read and write poles (not shown) that detect and modify the magnetic polarization of the recording layer on the disk's surface. The head 106 is generally integrally formed with a slider 108. The function of the slider 108 is to support the head 106 and any electrical connections between the head 106 and the rest of the HAMR disk drive 100. The slider 108 is mounted to a positioner arm 110 which may be used to move the head 106 on an arc across the rotating magnetic disk 102, thereby allowing the head 106 to access the entire surface of the magnetic disk 102. The arm 110 may be moved using a voice coil actuator 112 or by some other suitable means.
[0024] The slider 108 is aerodynamically designed to fly above the magnetic disk 102 by virtue of an air bearing created between the surface of the slider 106 and the rotating magnetic disk 102. This surface of the slider 108 is referred to as an air bearing surface (ABS). The ABS is the portion of the slider 108 surface which is closest to the rotating magnetic disk 102, which is typically the head 104. A HAMR transducer 114 may be coupled to the distal end of the slider 108 to assist writing data to the magnetic disk 102. The HAMR transducer 114 includes an NFT (not shown) aligned with the ABS of the slider 108. Light from a laser is coupled to the HAMR transducer 114 and guided by waveguide (not shown) to the NFT. The NFT focuses (or concentrates) the light to the magnetic disk 102, and heats a small region of the media. The head 106 magnetically writes data to the heated region of the media by energizing the write pole. When the laser, as the heat source, is turned off, the localized magnetic media cools and the written bit becomes thermally stable at ambient temperature.
[0025] FIG. 2 is a conceptual view of an exemplary embodiment of a HAMR transducer arranged with a slider for a HAMR disk drive. The HAMR disk drive 100 includes the magnetic disk 102, a subassembly 202 and a slider 108 on which a HAMR transducer 114 is formed. The subassembly 202 includes a light source, such as a laser diode 204 having an emission exit 206, attached to a submount 208. The slider 108 has a back side 210 to which the submount 208 may be bonded, and an ABS. In the embodiment shown, the back side 210 is opposite to the ABS. However, in other embodiments, the back side 210 (i.e, the side to which the submount is bonded) may not be opposite to the ABS.
[0026] A surface plasmon effect may be applied in the NFT (not shown) to potentially increase areal data density that may be written to a magnetic disk 102. Surface plasmons (SPs) are collective oscillations of surface charge that are confined to an interface between a dielectric and a metal. When SPs are resonantly excited by an external optical field, the field amplitude in the vicinity of the surface may be orders of magnitude greater than that of the incident field. Moreover, the region of enhanced field may be tightly confined to a spot much smaller than the incident wavelength, e.g., on the order of 70 nm or less. Gold is a suitable plasmonic material for wavelengths longer than ˜700 nm as it is chemically inert with a relatively high melting point.
[0027] A gold NFT that is excited at a SP resonance can couple light even more efficiently into a nearby medium by including a sharp tip in its design to take advantage of a “lightning rod” effect. A “lollipop” NFT may include a disk and a peg, where the peg acts as the sharp tip. At resonance the surface charge oscillates along the length of the lollipop peg to generate an electric field at the tip of the peg that couples energy into the magnetic disk 102. The peg provides the lightning rod effect for field confinement. A plasmonic metal beneath the recording layer of the magnetic disk 102 acts as both a heat sink and an image plane for the electric field. The recording layer is effectively within the gap of two nanoparticles, i.e., where the two nanoparticles constitute the NFT and its (virtual charge) image, resulting in good coupling efficiency and further confinement of the electric field.
[0028] FIG. 3 is a cross-section view of an exemplary embodiment of an NFT 302402. The NFT 302 is arranged as a disk in thermal and electrical contact with the peg 304. In operation, the NFT 302 is excited by light directed at it, typically by a laser, such as a laser diode, through an optical waveguide (not shown). The excitation is a resonant surface plasmon, in which the intensity of the evanescent field at the surface of the disk is enhanced relative to the field intensity of the illuminating light. The relatively intensified evanescent field is coupled down the length of the peg 304, where the tip of the peg 304 faces toward the ABS of the HAMR transducer 114 (see FIG. 2 ). This results in a lightning rod effect, which may produce a large electromagnetic field at the surface of the magnetic recording media, which absorbs and dissipates enough energy to raise the media temperature locally and reduce the magnetic coercivity in a high localized area corresponding to the dimensions of the peg 304.
[0029] The NFT 302 may be arranged with a heat removal, or heat sinking “chimney” 306. The chimney 306 may be made of gold because of the thermal conductivity properties of the metal. The NET 302 and chimney 306 may be partially or completely encapsulated in ceramics (SiO2 and Al2O3), oxides or other materials commonly used for optical waveguides and electrical insulation. To mitigate the effects of atomic migration of gold due to localized heating of the NFT 302 and chimney 306, an electrical conductor may be deposited over the HAMR transducer during the manufacturing process. In a manner to be described later, the electrical conductor may act as a heater by passing an electrical current through it. In accordance with the present embodiment, the heat generated by the electrical conductor anneals the NFT 302 and the chimney 306.
[0030] FIG. 4 is a plan view of an exemplary embodiment of an electrical conductor 402, which passes over the chimney heat sink and NFT for annealing when an electrical current passes through. The electrical conductor 402 has a section 404 with a reduced width that is electrically coupled to the chimney during the annealing process. The reduced width increases the resistance of the portion of the electrical conductor 402 localized at the chimney, and therefore causes localized joule heating when an electrical current is applied.
[0031] FIG. 5A is a plan view illustrating an exemplary embodiment of the narrow section of the electrical conductor on a surface of the HAMR transducer directly over the chimney 306 and NFT 302, where both are shown with dotted lines to indicate that they are beneath the electrical conductor, and therefore embedded beneath the surface of the HAMR transducer. The NFT 302 and chimney 306 are shown in this view merely for clarity but, in fact, are not visible. As mentioned above, the electrical conductor 402 may be gold, and serves for thermal conduction of heat over the region including the chimney 306, NFT 302 and peg 304, and it provides heat from resistive losses in the narrow section of the electrical conductor 402. The chimney 306 is substantially in line with the center of the NFT 302, and provides thermal connection to the electrical conductor 402.
[0032] FIG. 5B is a cross-section view of the exemplary embodiment shown in FIG. 5A . The electrical conductor 402.404 is at the surface of the encapsulating substrate of the HAMR transducer that includes the NFT 302 and peg 304, which have been fabricated and where the encapsulant may be ceramic, oxide or other insulating materials. The chimney 306, which may be a gold filled via in the insulating encapsulant, provides thermal contact to the electrical conductor 402 so that heat generated in the section 404 of the electrical conductor 402 is effectively transferred to the NFT 302 and peg 304, which may also be gold. The encapsulant may have a lower thermal conductivity, and thus serve to thermally insulate other components of a magnetic read/write assembly from thermal damage due to the annealing.
[0033] The electrical conductor 402 may be formed by depositing a conductive layer (preferably gold, due to its thermal conductivity) and patterning the electrical conductor 402 in a photolithographic process. The electrical conductor 402 is shown wider at the ends 406, so that the resistance is higher in the narrow section 404 of the electrical conductor 402. Therefore, an electrical current passing through the section 404 of the electrical conductor 402 will dissipate an amount of thermal power in proportion to its resistance, and the surrounding region of NFT 302, chimney 306, and encapsulating material will heat up. The low thermal impedance of the path from the electrical conductor 402 through the chimney 306 to the NFT 302 and peg 304 enables the NET 302, peg 304 and chimney 306 to get nearly as hot as the electrical conductor 402. At a sufficient temperature, the gold will anneal, which may reduce or prevent degradation of the structures in operational use. The low thermal conductivity of the encapsulating ceramics (e.g., SiO2 and/or Al2O3) may contribute to confining the heat to the NFT 302, peg 304 and chimney 306, thus preventing damage to surrounding structures, such as the read and/or write poles, which may include, for example, hard baked photoresist that cannot withstand temperature required to anneal gold. The narrow section 404 of electrical conductor 402 may be on the order of 1 micron wide, and is narrower than the wider current carrying ends 406 of the electrical conductor 402, which is wide enough to dissipate less heat due to a lower path resistance that is proportional to the width. In practice, the actual dimension of the narrow section 404 of the electrical conductor 402 may vary, depending on the thickness of the metallization and the electrical current delivered to generate heat.
[0034] Passing an electrical current through a network of electrical conductors 402 may cause sufficient heating in the localized region beneath it to generate an annealing temperature only sufficient to affect the immediate chimney 304, NFT 302 and peg 306. Because of localization of the heating in the HAMR transducer localized near the NFT 302, the temperature of the hot region below the electrical conductor 402 will decrease with depth, shielding other components in the HAMR transducer from suffering heat damage. Furthermore, a bottom pole layer of the write pole in a read/write assembly may tend to heat sink its surroundings and prevent the read pole from experiencing damaging high temperatures.
[0035] After the anneal process, the electrical conductor 402, may be removed, for example, by chemical mechanical polishing (CMP), ion milling, or other suitable means, down to the encapsulant substrate surface, leaving the chimney 306 intact for heat sinking to other structural features during operational use of the HAMR transducer.
[0036] It may be appreciated that the embodiment described may achieve anneal temperatures for gold localized at the NFT 302, peg 304 and chimney 306 above 200° C. for greater structural stability without damaging the reader and hard baked photoresist in adjacent structures in a magnetic read/write pole.
[0037] During the manufacturing process, an array of HAMR transducers may be manufactured in bulk in a single wafer by means well known in the art. As shown in FIG. 6 , an array 600 of individual electrical conductors 402 may be connected in series and parallel so that a broken or shorted conductor will not lead to a failure of annealing capability in an entire wafer containing a plurality of chimneys 306, NFTs 302 and pegs 304. As part of the process, after annealing, the array 600 may be removed by a chemical-mechanical-polish (CMP) step, ion milling step, or by some other suitable means. As described above, the array 600 may be formed by depositing and patterning a metal layer, such as gold to form the plurality of electrical conductors 402, A group of serially interconnected electrical conductors 402 may be arranged to form a group 602. A plurality of groups 602 may be arranged in parallel to form the array 600, wherein the groups are connected by summing traces 604 that connect to contacts 606. Current is applied to the array 600 at contacts 606. The current divides among the plurality of parallel groups 602. The divided current i flows through each of the serial electrical conductors 402 in a respective group 602. The power dissipation in each of the electrical conductors 402 is given by i2R, with R being higher in the narrow sections 404 of the serially connected electrical conductors 402.
[0038] The various aspects of this disclosure are provided to enable one of ordinary skill in the art to practice the present invention. Various modifications to exemplary embodiments presented throughout this disclosure will be readily apparent to those skilled in the art, and the concepts disclosed herein may be extended to other devices. Thus, the claims are not intended to be limited to the various aspects of this disclosure, but are to be accorded the full scope consistent with the language of the claims. All structural and functional equivalents to the various components of the exemplary embodiments described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the claims. No claim element is to be construed under the provisions of 35 U.S.C. §112(f) unless the element is expressly recited using the phrase “means for” or, in the case of a method claim, the element is recited using the phrase “step for.”
Claims
What is claimed is:
1. An article of manufacture, comprising:
a heat assisted magnetic recording (HAMR) transducer comprising a near field transducer (NFT) and a chimney thermally coupled to the NFT; and
an electrical conductor arranged on the HAMR transducer, the electrical conductor having a section with a reduced width that is thermally coupled to the chimney.
2. The article of manufacture of claim 1, wherein the electrical conductor is configured to be coupled to an electrical current source, whereby the section of the electrical conductor generates heat.
3. The article of manufacture of claim 1, wherein the section of the electrical conductor is configured to thermally anneal the chimney.
4. The article of manufacture of claim 1, wherein the chimney is configured to thermally conduct heat to anneal the NFT.
5. The article of manufacture of claim 1, further comprising a peg arranged with the NFT, wherein the chimney is configured to thermally conduct heat to anneal the peg.
6. The article of manufacture of claim 1, wherein the section of the electrical conductor is further configured to thermally anneal the chimney at a temperature greater than 200° C.
7. The article of manufacture of claim 1, wherein each of the electrical conductor, chimney, and NFT comprises at least one of gold, gold alloy, silver alloy, and copper alloy.
8. An article of manufacture comprising:
an array of heat assisted magnetic recording (HAMR) transducers, wherein each of the HAMR transducers comprises a near field transducer (NFT) and a chimney thermally coupled to the NFT; and
an array of electrical conductors arranged with the array of HAMR transducers, wherein each of the electrical conductors comprises a section with a reduced width that is thermally coupled to a respective one of the chimneys.
9. The article of manufacture of claim 8, wherein the array of electrical conductors are configured to be coupled to a source of current, whereby the sections of the electrical conductors generate heat.
10. The article of manufacture of claim 8, wherein each of the sections of the electrical conductors is configured to thermally anneal its respective corresponding chimneys.
11. The article of manufacture of claim 8, wherein each of the chimneys is configured to thermally conduct heat to anneal its respective NFT.
12. The article of manufacture of claim 8, wherein each of the HAMR transducers further comprises a peg arranged with the NFT, wherein the chimney is configured to thermally conduct heat to anneal the peg.
13. The article of manufacture of claim 8, wherein each of the sections of the electrical conductors is further configured to thermally anneal its respective chimney at a temperature greater than 200° C.
14. The article of manufacture of claim 8, wherein each of the electrical conductors, chimneys, and NFTs comprises at least one of gold, gold alloy, silver alloy, and copper alloy.
15. A method of manufacturing an article of manufacture, wherein the article of manufacture comprises a heat assisted magnetic recording (HAMR) transducer having a near field transducer (NFT) and a chimney thermally coupled to the NFT, and wherein the article of manufacture further comprises an electrical conductor having a section with a reduced width that is thermally coupled to the chimney, the method comprising:
applying an electrical current to the electrical conductor to generate heat in the section; and
annealing the chimney and the NFT from the heat generated.
16. The method of claim 15, wherein the transducer comprises a peg arranged with the NFT, the method further comprising annealing the peg from the heat generated.
17. The method of claim 15, wherein the annealing comprises annealing the chimney and the NFT at a temperature greater than 200° C.
18. The method of claim 15, wherein each of the electrical conductors, chimneys, and NFTs comprises at least one of gold, gold alloy, silver alloy, and copper alloy.
19. The method of claim 15, further comprising removing at least a portion of the electrical conductor after the annealing.
20. The method of claim 19, wherein the removing includes one or more of chemical mechanical polishing (CMP) and ion milling.
21. A method of manufacturing an article of manufacture, wherein the article of manufacture comprises an array of heat assisted magnetic recording (HAMR) transducers each having a near field transducer (NFT) and a chimney thermally coupled to the NFT, and wherein the article of manufacture further comprises an array of electrical conductors arranged with the array of HAMR transducers with each of the electrical conductors having a section with a reduced width that is thermally coupled to a respective one of the chimneys, the method comprising:
applying an electrical current to the electrical conductors to generate heat in their respective sections; and
annealing the chimneys and the NFTs from the heat generated.
22. The method of claim 21, wherein each of the HAMR transducers comprises a peg arranged with the NFT, the method further comprising annealing each of the pegs from the heat generated.
23. The method of claim 21, wherein the annealing comprises annealing the chimneys and NFTs at a temperature greater than 200° C.
24. The method of claim 21, wherein each of the electrical conductors, chimneys, and NFTs comprises at least one of gold, gold alloy, silver alloy, and copper alloy.
25. The method of claim 21, further comprising removing at least a portion of the electrical conductors after the annealing.
26. The method of claim 25, wherein the removing includes one or more of chemical mechanical polishing (CMP) and ion milling.
Patent Citations (613)
| Patent | Date | Inventor | Cited By |
|---|---|---|---|
| US4814578(A) | 1989-03-01 | Tuckerman | Applicant |
| US5868951(A) | 1999-02-01 | Schuck, III et al. | Applicant |
| US6016290(A) | 2000-01-01 | Chen et al. | Applicant |
| US6018441(A) | 2000-01-01 | Wu et al. | Applicant |
| US6025978(A) | 2000-02-01 | Hoshi et al. | Applicant |
| US6025988(A) | 2000-02-01 | Yan | Applicant |
| US6032353(A) | 2000-03-01 | Hiner et al. | Applicant |
| US6033532(A) | 2000-03-01 | Minami | Applicant |
| US6034851(A) | 2000-03-01 | Zarouri et al. | Applicant |
| US6043959(A) | 2000-03-01 | Crue et al. | Applicant |
| US6046885(A) | 2000-04-01 | Aimonetti et al. | Applicant |
| US6049650(A) | 2000-04-01 | Jerman et al. | Applicant |
| US6055138(A) | 2000-04-01 | Shi | Applicant |
| US6058094(A) | 2000-05-01 | Davis et al. | Applicant |
| US6073338(A) | 2000-06-01 | Liu et al. | Applicant |
| US6078479(A) | 2000-06-01 | Nepela et al. | Applicant |
| US6081499(A) | 2000-06-01 | Berger et al. | Applicant |
| US6094803(A) | 2000-08-01 | Carlson et al. | Applicant |
| US6099362(A) | 2000-08-01 | Viches et al. | Applicant |
| US6103073(A) | 2000-08-01 | Thayamballi | Applicant |
| US6108166(A) | 2000-08-01 | Lederman | Applicant |
| US6118629(A) | 2000-09-01 | Huai et al. | Applicant |
| US6118638(A) | 2000-09-01 | Knapp et al. | Applicant |
| US6125018(A) | 2000-09-01 | Takagishi et al. | Applicant |
| US6130779(A) | 2000-10-01 | Carlson et al. | Applicant |
| US6134089(A) | 2000-10-01 | Barr et al. | Applicant |
| US6136166(A) | 2000-10-01 | Shen et al. | Applicant |
| US6137661(A) | 2000-10-01 | Shi et al. | Applicant |
| US6137662(A) | 2000-10-01 | Huai et al. | Applicant |
| US6160684(A) | 2000-12-01 | Heist et al. | Applicant |
| US6163426(A) | 2000-12-01 | Nepela et al. | Applicant |
| US6166891(A) | 2000-12-01 | Lederman et al. | Applicant |
| US6173486(B1) | 2001-01-01 | Hsiao et al. | Applicant |
| US6175476(B1) | 2001-01-01 | Huai et al. | Applicant |
| US6178066(B1) | 2001-01-01 | Barr | Applicant |
| US6178070(B1) | 2001-01-01 | Hong et al. | Applicant |
| US6178150(B1) | 2001-01-01 | Davis | Applicant |
| US6181485(B1) | 2001-01-01 | He | Applicant |
| US6181525(B1) | 2001-01-01 | Carlson | Applicant |
| US6185051(B1) | 2001-02-01 | Chen et al. | Applicant |
| US6185077(B1) | 2001-02-01 | Tong et al. | Applicant |
| US6185081(B1) | 2001-02-01 | Simion et al. | Applicant |
| US6188549(B1) | 2001-02-01 | Wiitala | Applicant |
| US6190764(B1) | 2001-02-01 | Shi et al. | Applicant |
| US6193584(B1) | 2001-02-01 | Rudy et al. | Applicant |
| US6195229(B1) | 2001-02-01 | Shen et al. | Applicant |
| US6198608(B1) | 2001-03-01 | Hong et al. | Applicant |
| US6198609(B1) | 2001-03-01 | Barr et al. | Applicant |
| US6201673(B1) | 2001-03-01 | Rottmayer et al. | Applicant |
| US6204998(B1) | 2001-03-01 | Katz | Applicant |
| US6204999(B1) | 2001-03-01 | Crue et al. | Applicant |
| US6212153(B1) | 2001-04-01 | Chen et al. | Applicant |
| US6215625(B1) | 2001-04-01 | Carlson | Applicant |
| US6219205(B1) | 2001-04-01 | Yuan et al. | Applicant |
| US6221218(B1) | 2001-04-01 | Shi et al. | Applicant |
| US6221750(B1) | 2001-04-01 | Fjelstad | Applicant |
| US6222707(B1) | 2001-04-01 | Huai et al. | Applicant |
| US6229782(B1) | 2001-05-01 | Wang et al. | Applicant |
| US6230959(B1) | 2001-05-01 | Heist et al. | Applicant |
| US6233116(B1) | 2001-05-01 | Chen et al. | Applicant |
| US6233125(B1) | 2001-05-01 | Knapp et al. | Applicant |
| US6237215(B1) | 2001-05-01 | Hunsaker et al. | Applicant |
| US6252743(B1) | 2001-06-01 | Bozorgi | Applicant |
| US6255721(B1) | 2001-07-01 | Roberts | Applicant |
| US6258468(B1) | 2001-07-01 | Mahvan et al. | Applicant |
| US6266216(B1) | 2001-07-01 | Hikami et al. | Applicant |
| US6271604(B1) | 2001-08-01 | Frank, Jr. et al. | Applicant |
| US6275354(B1) | 2001-08-01 | Huai et al. | Applicant |
| US6277505(B1) | 2001-08-01 | Shi et al. | Applicant |
| US6282056(B1) | 2001-08-01 | Feng et al. | Applicant |
| US6296955(B1) | 2001-10-01 | Hossain et al. | Applicant |
| US6297955(B1) | 2001-10-01 | Frank, Jr. et al. | Applicant |
| US6304414(B1) | 2001-10-01 | Crue, Jr. et al. | Applicant |
| US6307715(B1) | 2001-10-01 | Berding et al. | Applicant |
| US6310746(B1) | 2001-10-01 | Hawwa et al. | Applicant |
| US6310750(B1) | 2001-10-01 | Hawwa et al. | Applicant |
| US6317290(B1) | 2001-11-01 | Wang et al. | Applicant |
| US6317297(B1) | 2001-11-01 | Tong et al. | Applicant |
| US6322911(B1) | 2001-11-01 | Fukagawa et al. | Applicant |
| US6330136(B1) | 2001-12-01 | Wang et al. | Applicant |
| US6330137(B1) | 2001-12-01 | Knapp et al. | Applicant |
| US6333830(B2) | 2001-12-01 | Rose et al. | Applicant |
| US6340533(B1) | 2002-01-01 | Ueno et al. | Applicant |
| US6349014(B1) | 2002-02-01 | Crue, Jr. et al. | Applicant |
| US6351355(B1) | 2002-02-01 | Min et al. | Applicant |
| US6353318(B1) | 2002-03-01 | Sin et al. | Applicant |
| US6353511(B1) | 2002-03-01 | Shi et al. | Applicant |
| US6356412(B1) | 2002-03-01 | Levi et al. | Applicant |
| US6359779(B1) | 2002-03-01 | Frank, Jr. et al. | Applicant |
| US6369983(B1) | 2002-04-01 | Hong | Applicant |
| US6376964(B1) | 2002-04-01 | Young et al. | Applicant |
| US6377535(B1) | 2002-04-01 | Chen et al. | Applicant |
| US6381095(B1) | 2002-04-01 | Sin et al. | Applicant |
| US6381105(B1) | 2002-04-01 | Huai et al. | Applicant |
| US6389499(B1) | 2002-05-01 | Frank, Jr. et al. | Applicant |
| US6392850(B1) | 2002-05-01 | Tong et al. | Applicant |
| US6396660(B1) | 2002-05-01 | Jensen et al. | Applicant |
| US6399179(B1) | 2002-06-01 | Hanrahan et al. | Applicant |
| US6400526(B2) | 2002-06-01 | Crue, Jr. et al. | Applicant |
| US6404600(B1) | 2002-06-01 | Hawwa et al. | Applicant |
| US6404601(B1) | 2002-06-01 | Rottmayer et al. | Applicant |
| US6404706(B1) | 2002-06-01 | Stovall et al. | Applicant |
| US6410170(B1) | 2002-06-01 | Chen et al. | Applicant |
| US6411522(B1) | 2002-06-01 | Frank, Jr. et al. | Applicant |
| US6417998(B1) | 2002-07-01 | Crue, Jr. et al. | Applicant |
| US6417999(B1) | 2002-07-01 | Knapp et al. | Applicant |
| US6418000(B1) | 2002-07-01 | Gibbons et al. | Applicant |
| US6418048(B1) | 2002-07-01 | Sin et al. | Applicant |
| US6421211(B1) | 2002-07-01 | Hawwa et al. | Applicant |
| US6421212(B1) | 2002-07-01 | Gibbons et al. | Applicant |
| US6424505(B1) | 2002-07-01 | Lam et al. | Applicant |
| US6424507(B1) | 2002-07-01 | Lederman et al. | Applicant |
| US6430009(B1) | 2002-08-01 | Komaki et al. | Applicant |
| US6430806(B1) | 2002-08-01 | Chen et al. | Applicant |
| US6433965(B1) | 2002-08-01 | Gopinathan et al. | Applicant |
| US6433968(B1) | 2002-08-01 | Shi et al. | Applicant |
| US6433970(B1) | 2002-08-01 | Knapp et al. | Applicant |
| US6437945(B1) | 2002-08-01 | Hawwa et al. | Applicant |
| US6445536(B1) | 2002-09-01 | Rudy et al. | Applicant |
| US6445542(B1) | 2002-09-01 | Levi et al. | Applicant |
| US6445553(B2) | 2002-09-01 | Barr et al. | Applicant |
| US6445554(B1) | 2002-09-01 | Dong et al. | Applicant |
| US6447935(B1) | 2002-09-01 | Zhang et al. | Applicant |
| US6448765(B1) | 2002-09-01 | Chen et al. | Applicant |
| US6451514(B1) | 2002-09-01 | Iitsuka | Applicant |
| US6452742(B1) | 2002-09-01 | Crue et al. | Applicant |
| US6452765(B1) | 2002-09-01 | Mahvan et al. | Applicant |
| US6456465(B1) | 2002-09-01 | Louis et al. | Applicant |
| US6459552(B1) | 2002-10-01 | Liu et al. | Applicant |
| US6462920(B1) | 2002-10-01 | Karimi | Applicant |
| US6466401(B1) | 2002-10-01 | Hong et al. | Applicant |
| US6466402(B1) | 2002-10-01 | Crue, Jr. et al. | Applicant |
| US6466404(B1) | 2002-10-01 | Crue, Jr. et al. | Applicant |
| US6468436(B1) | 2002-10-01 | Shi et al. | Applicant |
| US6469877(B1) | 2002-10-01 | Knapp et al. | Applicant |
| US6477019(B2) | 2002-11-01 | Matono et al. | Applicant |
| US6479096(B1) | 2002-11-01 | Shi et al. | Applicant |
| US6483662(B1) | 2002-11-01 | Thomas et al. | Applicant |
| US6487040(B1) | 2002-11-01 | Hsiao et al. | Applicant |
| US6487056(B1) | 2002-11-01 | Gibbons et al. | Applicant |
| US6490125(B1) | 2002-12-01 | Barr | Applicant |
| US6496330(B1) | 2002-12-01 | Crue, Jr. et al. | Applicant |
| US6496334(B1) | 2002-12-01 | Pang et al. | Applicant |
| US6504676(B1) | 2003-01-01 | Hiner et al. | Applicant |
| US6512657(B2) | 2003-01-01 | Heist et al. | Applicant |
| US6512659(B1) | 2003-01-01 | Hawwa et al. | Applicant |
| US6512661(B1) | 2003-01-01 | Louis | Applicant |
| US6512690(B1) | 2003-01-01 | Qi et al. | Applicant |
| US6515573(B1) | 2003-02-01 | Dong et al. | Applicant |
| US6515791(B1) | 2003-02-01 | Hawwa et al. | Applicant |
| US6532823(B1) | 2003-03-01 | Knapp et al. | Applicant |
| US6535363(B1) | 2003-03-01 | Hosomi et al. | Applicant |
| US6552874(B1) | 2003-04-01 | Chen et al. | Applicant |
| US6552928(B1) | 2003-04-01 | Qi et al. | Applicant |
| US6577470(B1) | 2003-06-01 | Rumpler | Applicant |
| US6583961(B2) | 2003-06-01 | Levi et al. | Applicant |
| US6583968(B1) | 2003-06-01 | Scura et al. | Applicant |
| US6597548(B1) | 2003-07-01 | Yamanaka et al. | Applicant |
| US6611398(B1) | 2003-08-01 | Rumpler et al. | Applicant |
| US6618223(B1) | 2003-09-01 | Chen et al. | Applicant |
| US6629357(B1) | 2003-10-01 | Akoh | Applicant |
| US6633464(B2) | 2003-10-01 | Lai et al. | Applicant |
| US6636394(B1) | 2003-10-01 | Fukagawa et al. | Applicant |
| US6639291(B1) | 2003-10-01 | Sin et al. | Applicant |
| US6650503(B1) | 2003-11-01 | Chen et al. | Applicant |
| US6650506(B1) | 2003-11-01 | Risse | Applicant |
| US6654195(B1) | 2003-11-01 | Frank, Jr. et al. | Applicant |
| US6657816(B1) | 2003-12-01 | Barr et al. | Applicant |
| US6661621(B1) | 2003-12-01 | Iitsuka | Applicant |
| US6661625(B1) | 2003-12-01 | Sin et al. | Applicant |
| US6674610(B1) | 2004-01-01 | Thomas et al. | Applicant |
| US6680863(B1) | 2004-01-01 | Shi et al. | Applicant |
| US6683763(B1) | 2004-01-01 | Hiner et al. | Applicant |
| US6687098(B1) | 2004-02-01 | Huai | Applicant |
| US6687178(B1) | 2004-02-01 | Qi et al. | Applicant |
| US6687977(B2) | 2004-02-01 | Knapp et al. | Applicant |
| US6691226(B1) | 2004-02-01 | Frank, Jr. et al. | Applicant |
| US6697294(B1) | 2004-02-01 | Qi et al. | Applicant |
| US6700738(B1) | 2004-03-01 | Sin et al. | Applicant |
| US6700759(B1) | 2004-03-01 | Knapp et al. | Applicant |
| US6704158(B2) | 2004-03-01 | Hawwa et al. | Applicant |
| US6707083(B1) | 2004-03-01 | Hiner et al. | Applicant |
| US6713801(B1) | 2004-03-01 | Sin et al. | Applicant |
| US6721138(B1) | 2004-04-01 | Chen et al. | Applicant |
| US6721149(B1) | 2004-04-01 | Shi et al. | Applicant |
| US6721203(B1) | 2004-04-01 | Qi et al. | Applicant |
| US6724569(B1) | 2004-04-01 | Chen et al. | Applicant |
| US6724572(B1) | 2004-04-01 | Stoev et al. | Applicant |
| US6729015(B2) | 2004-05-01 | Matono et al. | Applicant |
| US6735850(B1) | 2004-05-01 | Gibbons et al. | Applicant |
| US6737281(B1) | 2004-05-01 | Dang et al. | Applicant |
| US6744608(B1) | 2004-06-01 | Sin et al. | Applicant |
| US6747301(B1) | 2004-06-01 | Hiner et al. | Applicant |
| US6751055(B1) | 2004-06-01 | Alfoqaha et al. | Applicant |
| US6754049(B1) | 2004-06-01 | Seagle et al. | Applicant |
| US6756071(B1) | 2004-06-01 | Shi et al. | Applicant |
| US6757140(B1) | 2004-06-01 | Hawwa | Applicant |
| US6760196(B1) | 2004-07-01 | Niu et al. | Applicant |
| US6762910(B1) | 2004-07-01 | Knapp et al. | Applicant |
| US6765756(B1) | 2004-07-01 | Hong et al. | Applicant |
| US6775902(B1) | 2004-08-01 | Huai et al. | Applicant |
| US6778358(B1) | 2004-08-01 | Jiang et al. | Applicant |
| US6781927(B1) | 2004-08-01 | Heanuc et al. | Applicant |
| US6785955(B1) | 2004-09-01 | Chen et al. | Applicant |
| US6791793(B1) | 2004-09-01 | Chen et al. | Applicant |
| US6791807(B1) | 2004-09-01 | Hikami et al. | Applicant |
| US6798616(B1) | 2004-09-01 | Seagle et al. | Applicant |
| US6798625(B1) | 2004-09-01 | Ueno et al. | Applicant |
| US6801408(B1) | 2004-10-01 | Chen et al. | Applicant |
| US6801411(B1) | 2004-10-01 | Lederman et al. | Applicant |
| US6803615(B1) | 2004-10-01 | Sin et al. | Applicant |
| US6806035(B1) | 2004-10-01 | Atireklapvarodom et al. | Applicant |
| US6807030(B1) | 2004-10-01 | Hawwa et al. | Applicant |
| US6807332(B1) | 2004-10-01 | Hawwa | Applicant |
| US6809899(B1) | 2004-10-01 | Chen et al. | Applicant |
| US6816345(B1) | 2004-11-01 | Knapp et al. | Applicant |
| US6828897(B1) | 2004-12-01 | Nepela | Applicant |
| US6829160(B1) | 2004-12-01 | Qi et al. | Applicant |
| US6829819(B1) | 2004-12-01 | Crue, Jr. et al. | Applicant |
| US6833979(B1) | 2004-12-01 | Spallas et al. | Applicant |
| US6834010(B1) | 2004-12-01 | Qi et al. | Applicant |
| US6859343(B1) | 2005-02-01 | Alfoqaha et al. | Applicant |
| US6859997(B1) | 2005-03-01 | Tong et al. | Applicant |
| US6861937(B1) | 2005-03-01 | Feng et al. | Applicant |
| US6870712(B2) | 2005-03-01 | Chen et al. | Applicant |
| US6873494(B2) | 2005-03-01 | Chen et al. | Applicant |
| US6873547(B1) | 2005-03-01 | Shi et al. | Applicant |
| US6879464(B2) | 2005-04-01 | Sun et al. | Applicant |
| US6888184(B1) | 2005-05-01 | Shi et al. | Applicant |
| US6888704(B1) | 2005-05-01 | Diao et al. | Applicant |
| US6891702(B1) | 2005-05-01 | Tang | Applicant |
| US6894871(B2) | 2005-05-01 | Alfoqaha et al. | Applicant |
| US6894877(B1) | 2005-05-01 | Crue, Jr. et al. | Applicant |
| US6906894(B2) | 2005-06-01 | Chen et al. | Applicant |
| US6909578(B1) | 2005-06-01 | Missell et al. | Applicant |
| US6912106(B1) | 2005-06-01 | Chen et al. | Applicant |
| US6934113(B1) | 2005-08-01 | Chen | Applicant |
| US6934129(B1) | 2005-08-01 | Zhang et al. | Applicant |
| US6940688(B2) | 2005-09-01 | Jiang et al. | Applicant |
| US6942824(B1) | 2005-09-01 | Li | Applicant |
| US6943993(B2) | 2005-09-01 | Chang et al. | Applicant |
| US6944938(B1) | 2005-09-01 | Crue, Jr. et al. | Applicant |
| US6947258(B1) | 2005-09-01 | Li | Applicant |
| US6950266(B1) | 2005-09-01 | McCaslin et al. | Applicant |
| US6954332(B1) | 2005-10-01 | Hong et al. | Applicant |
| US6958885(B1) | 2005-10-01 | Chen et al. | Applicant |
| US6961221(B1) | 2005-11-01 | Niu et al. | Applicant |
| US6969989(B1) | 2005-11-01 | Mei | Applicant |
| US6975486(B2) | 2005-12-01 | Chen et al. | Applicant |
| US6987643(B1) | 2006-01-01 | Seagle | Applicant |
| US6989962(B1) | 2006-01-01 | Dong et al. | Applicant |
| US6989972(B1) | 2006-01-01 | Stoev et al. | Applicant |
| US6998278(B2) | 2006-02-01 | Silverbrook | Applicant |
| US7006327(B2) | 2006-02-01 | Krounbi et al. | Applicant |
| US7007372(B1) | 2006-03-01 | Chen et al. | Applicant |
| US7012832(B1) | 2006-03-01 | Sin et al. | Applicant |
| US7023658(B1) | 2006-04-01 | Knapp et al. | Applicant |
| US7026063(B2) | 2006-04-01 | Ueno et al. | Applicant |
| US7027268(B1) | 2006-04-01 | Zhu et al. | Applicant |
| US7027274(B1) | 2006-04-01 | Sin et al. | Applicant |
| US7035046(B1) | 2006-04-01 | Young et al. | Applicant |
| US7041985(B1) | 2006-05-01 | Wang et al. | Applicant |
| US7046490(B1) | 2006-05-01 | Ueno et al. | Applicant |
| US7054113(B1) | 2006-05-01 | Seagle et al. | Applicant |
| US7057857(B1) | 2006-06-01 | Niu et al. | Applicant |
| US7059868(B1) | 2006-06-01 | Yan | Applicant |
| US7092195(B1) | 2006-08-01 | Liu et al. | Applicant |
| US7110289(B1) | 2006-09-01 | Sin et al. | Applicant |
| US7111382(B1) | 2006-09-01 | Knapp et al. | Applicant |
| US7113366(B1) | 2006-09-01 | Wang et al. | Applicant |
| US7114241(B2) | 2006-10-01 | Kubota et al. | Applicant |
| US7116517(B1) | 2006-10-01 | He et al. | Applicant |
| US7124654(B1) | 2006-10-01 | Davies et al. | Applicant |
| US7126788(B1) | 2006-10-01 | Liu et al. | Applicant |
| US7126790(B1) | 2006-10-01 | Liu et al. | Applicant |
| US7131346(B1) | 2006-11-01 | Buttar et al. | Applicant |
| US7133253(B1) | 2006-11-01 | Seagle et al. | Applicant |
| US7134185(B1) | 2006-11-01 | Knapp et al. | Applicant |
| US7154715(B2) | 2006-12-01 | Yamanaka et al. | Applicant |
| US7170725(B1) | 2007-01-01 | Zhou et al. | Applicant |
| US7177117(B1) | 2007-02-01 | Jiang et al. | Applicant |
| US7193815(B1) | 2007-03-01 | Stoev et al. | Applicant |
| US7196880(B1) | 2007-03-01 | Anderson et al. | Applicant |
| US7199974(B1) | 2007-04-01 | Alfoqaha | Applicant |
| US7199975(B1) | 2007-04-01 | Pan | Applicant |
| US7211339(B1) | 2007-05-01 | Seagle et al. | Applicant |
| US7212384(B1) | 2007-05-01 | Stoev et al. | Applicant |
| US7238292(B1) | 2007-07-01 | He et al. | Applicant |
| US7239478(B1) | 2007-07-01 | Sin et al. | Applicant |
| US7248431(B1) | 2007-07-01 | Liu et al. | Applicant |
| US7248433(B1) | 2007-07-01 | Stoev et al. | Applicant |
| US7248449(B1) | 2007-07-01 | Seagle | Applicant |
| US7280325(B1) | 2007-10-01 | Pan | Applicant |
| US7283327(B1) | 2007-10-01 | Liu et al. | Applicant |
| US7284316(B1) | 2007-10-01 | Huai et al. | Applicant |
| US7286329(B1) | 2007-10-01 | Chen et al. | Applicant |
| US7289303(B1) | 2007-10-01 | Sin et al. | Applicant |
| US7292409(B1) | 2007-11-01 | Stoev et al. | Applicant |
| US7296339(B1) | 2007-11-01 | Yang et al. | Applicant |
| US7307814(B1) | 2007-12-01 | Seagle et al. | Applicant |
| US7307818(B1) | 2007-12-01 | Park et al. | Applicant |
| US7310204(B1) | 2007-12-01 | Stoev et al. | Applicant |
| US7318947(B1) | 2008-01-01 | Park et al. | Applicant |
| US7333295(B1) | 2008-02-01 | Medina et al. | Applicant |
| US7337530(B1) | 2008-03-01 | Stoev et al. | Applicant |
| US7342752(B1) | 2008-03-01 | Zhang et al. | Applicant |
| US7349170(B1) | 2008-03-01 | Rudman et al. | Applicant |
| US7349179(B1) | 2008-03-01 | He et al. | Applicant |
| US7354664(B1) | 2008-04-01 | Jiang et al. | Applicant |
| US7363697(B1) | 2008-04-01 | Dunn et al. | Applicant |
| US7371152(B1) | 2008-05-01 | Newman | Applicant |
| US7372665(B1) | 2008-05-01 | Stoev et al. | Applicant |
| US7375926(B1) | 2008-05-01 | Stoev et al. | Applicant |
| US7379269(B1) | 2008-05-01 | Krounbi et al. | Applicant |
| US7386933(B1) | 2008-06-01 | Krounbi et al. | Applicant |
| US7389577(B1) | 2008-06-01 | Shang et al. | Applicant |
| US7417832(B1) | 2008-08-01 | Erickson et al. | Applicant |
| US7419891(B1) | 2008-09-01 | Chen et al. | Applicant |
| US7428124(B1) | 2008-09-01 | Song et al. | Applicant |
| US7430098(B1) | 2008-09-01 | Song et al. | Applicant |
| US7436620(B1) | 2008-10-01 | Kang et al. | Applicant |
| US7436638(B1) | 2008-10-01 | Pan | Applicant |
| US7440220(B1) | 2008-10-01 | Kang et al. | Applicant |
| US7443632(B1) | 2008-10-01 | Stoev et al. | Applicant |
| US7444740(B1) | 2008-11-01 | Chung et al. | Applicant |
| US7493688(B1) | 2009-02-01 | Wang et al. | Applicant |
| US7508627(B1) | 2009-03-01 | Zhang et al. | Applicant |
| US7522377(B1) | 2009-04-01 | Jiang et al. | Applicant |
| US7522379(B1) | 2009-04-01 | Krounbi et al. | Applicant |
| US7522382(B1) | 2009-04-01 | Pan | Applicant |
| US7542246(B1) | 2009-06-01 | Song et al. | Applicant |
| US7551406(B1) | 2009-06-01 | Thomas et al. | Applicant |
| US7552523(B1) | 2009-06-01 | He et al. | Applicant |
| US7554767(B1) | 2009-06-01 | Hu et al. | Applicant |
| US7583466(B2) | 2009-09-01 | Kermiche et al. | Applicant |
| US7595967(B1) | 2009-09-01 | Moon et al. | Applicant |
| US7639457(B1) | 2009-12-01 | Chen et al. | Applicant |
| US7660080(B1) | 2010-02-01 | Liu et al. | Applicant |
| US7672080(B1) | 2010-03-01 | Tang et al. | Applicant |
| US7672086(B1) | 2010-03-01 | Jiang | Applicant |
| US7684160(B1) | 2010-03-01 | Erickson et al. | Applicant |
| US7688546(B1) | 2010-03-01 | Bai et al. | Applicant |
| US7691434(B1) | 2010-04-01 | Zhang et al. | Applicant |
| US7695761(B1) | 2010-04-01 | Shen et al. | Applicant |
| US7698806(B2) | 2010-04-01 | Bonin et al. | Applicant |
| US7719795(B2) | 2010-05-01 | Hu et al. | Applicant |
| US7726009(B1) | 2010-06-01 | Liu et al. | Applicant |
| US7729086(B1) | 2010-06-01 | Song et al. | Applicant |
| US7729087(B1) | 2010-06-01 | Stoev et al. | Applicant |
| US7736823(B1) | 2010-06-01 | Wang et al. | Applicant |
| US7773330(B2) | 2010-08-01 | Itagi et al. | Examiner |
| US7785666(B1) | 2010-08-01 | Sun et al. | Applicant |
| US7796356(B1) | 2010-09-01 | Fowler et al. | Applicant |
| US7800858(B1) | 2010-09-01 | Bajikar et al. | Applicant |
| US7819979(B1) | 2010-10-01 | Chen et al. | Applicant |
| US7829264(B1) | 2010-11-01 | Wang et al. | Applicant |
| US7846643(B1) | 2010-12-01 | Sun et al. | Applicant |
| US7855854(B2) | 2010-12-01 | Hu et al. | Applicant |
| US7869160(B1) | 2011-01-01 | Pan et al. | Applicant |
| US7872824(B1) | 2011-01-01 | Macchioni et al. | Applicant |
| US7872833(B2) | 2011-01-01 | Hu et al. | Applicant |
| US7910267(B1) | 2011-03-01 | Zeng et al. | Applicant |
| US7911735(B1) | 2011-03-01 | Sin et al. | Applicant |
| US7911737(B1) | 2011-03-01 | Jiang et al. | Applicant |
| US7916426(B2) | 2011-03-01 | Hu et al. | Applicant |
| US7918013(B1) | 2011-04-01 | Dunn et al. | Applicant |
| US7968219(B1) | 2011-06-01 | Jiang et al. | Applicant |
| US7982989(B1) | 2011-07-01 | Shi et al. | Applicant |
| US8008912(B1) | 2011-08-01 | Shang | Applicant |
| US8012804(B1) | 2011-09-01 | Wang et al. | Applicant |
| US8015692(B1) | 2011-09-01 | Zhang et al. | Applicant |
| US8018677(B1) | 2011-09-01 | Chung et al. | Applicant |
| US8018678(B1) | 2011-09-01 | Zhang et al. | Applicant |
| US8024748(B1) | 2011-09-01 | Moravec et al. | Applicant |
| US8072705(B1) | 2011-12-01 | Wang et al. | Applicant |
| US8074345(B1) | 2011-12-01 | Anguelouch et al. | Applicant |
| US8077418(B1) | 2011-12-01 | Hu et al. | Applicant |
| US8077434(B1) | 2011-12-01 | Shen et al. | Applicant |
| US8077435(B1) | 2011-12-01 | Liu et al. | Applicant |
| US8077557(B1) | 2011-12-01 | Hu et al. | Applicant |
| US8079135(B1) | 2011-12-01 | Shen et al. | Applicant |
| US8081403(B1) | 2011-12-01 | Chen et al. | Applicant |
| US8091210(B1) | 2012-01-01 | Sasaki et al. | Applicant |
| US8097846(B1) | 2012-01-01 | Anguelouch et al. | Applicant |
| US8104166(B1) | 2012-01-01 | Zhang et al. | Applicant |
| US8116043(B2) | 2012-02-01 | Leng et al. | Applicant |
| US8116171(B1) | 2012-02-01 | Lee | Applicant |
| US8125856(B1) | 2012-02-01 | Li et al. | Applicant |
| US8134794(B1) | 2012-03-01 | Wang | Applicant |
| US8136224(B1) | 2012-03-01 | Sun et al. | Applicant |
| US8136225(B1) | 2012-03-01 | Zhang et al. | Applicant |
| US8136805(B1) | 2012-03-01 | Lee | Applicant |
| US8141235(B1) | 2012-03-01 | Zhang | Applicant |
| US8146236(B1) | 2012-04-01 | Luo et al. | Applicant |
| US8149536(B1) | 2012-04-01 | Yang et al. | Applicant |
| US8151441(B1) | 2012-04-01 | Rudy et al. | Applicant |
| US8163185(B1) | 2012-04-01 | Sun et al. | Applicant |
| US8164760(B2) | 2012-04-01 | Willis | Applicant |
| US8164855(B1) | 2012-04-01 | Gibbons et al. | Applicant |
| US8164864(B2) | 2012-04-01 | Kaiser et al. | Applicant |
| US8165709(B1) | 2012-04-01 | Rudy | Applicant |
| US8166631(B1) | 2012-05-01 | Tran et al. | Applicant |
| US8166632(B1) | 2012-05-01 | Zhang et al. | Applicant |
| US8169473(B1) | 2012-05-01 | Yu et al. | Applicant |
| US8171618(B1) | 2012-05-01 | Wang et al. | Applicant |
| US8179636(B1) | 2012-05-01 | Bai et al. | Applicant |
| US8191237(B1) | 2012-06-01 | Luo et al. | Applicant |
| US8194365(B1) | 2012-06-01 | Leng et al. | Applicant |
| US8194366(B1) | 2012-06-01 | Li et al. | Applicant |
| US8196285(B1) | 2012-06-01 | Zhang et al. | Applicant |
| US8200054(B1) | 2012-06-01 | Li et al. | Applicant |
| US8203800(B2) | 2012-06-01 | Li et al. | Applicant |
| US8208350(B1) | 2012-06-01 | Hu et al. | Applicant |
| US8220140(B1) | 2012-07-01 | Wang et al. | Applicant |
| US8222599(B1) | 2012-07-01 | Chien | Applicant |
| US8225488(B1) | 2012-07-01 | Zhang et al. | Applicant |
| US8227023(B1) | 2012-07-01 | Liu et al. | Applicant |
| US8228633(B1) | 2012-07-01 | Tran et al. | Applicant |
| US8231796(B1) | 2012-07-01 | Li et al. | Applicant |
| US8233248(B1) | 2012-07-01 | Li et al. | Applicant |
| US8248896(B1) | 2012-08-01 | Yuan et al. | Applicant |
| US8254060(B1) | 2012-08-01 | Shi et al. | Applicant |
| US8257597(B1) | 2012-09-01 | Guan et al. | Applicant |
| US8259410(B1) | 2012-09-01 | Bai et al. | Applicant |
| US8259539(B1) | 2012-09-01 | Hu et al. | Applicant |
| US8262918(B1) | 2012-09-01 | Li et al. | Applicant |
| US8262919(B1) | 2012-09-01 | Luo et al. | Applicant |
| US8264797(B2) | 2012-09-01 | Emley | Applicant |
| US8264798(B1) | 2012-09-01 | Guan et al. | Applicant |
| US8270126(B1) | 2012-09-01 | Roy et al. | Applicant |
| US8276258(B1) | 2012-10-01 | Tran et al. | Applicant |
| US8277669(B1) | 2012-10-01 | Chen et al. | Applicant |
| US8279719(B1) | 2012-10-01 | Hu et al. | Applicant |
| US8284517(B1) | 2012-10-01 | Sun et al. | Applicant |
| US8288204(B1) | 2012-10-01 | Wang et al. | Applicant |
| US8289821(B1) | 2012-10-01 | Huber | Applicant |
| US8291743(B1) | 2012-10-01 | Shi et al. | Applicant |
| US8307539(B1) | 2012-11-01 | Rudy et al. | Applicant |
| US8307540(B1) | 2012-11-01 | Tran et al. | Applicant |
| US8308921(B1) | 2012-11-01 | Hiner et al. | Applicant |
| US8310785(B1) | 2012-11-01 | Zhang et al. | Applicant |
| US8310901(B1) | 2012-11-01 | Batra et al. | Applicant |
| US8315019(B1) | 2012-11-01 | Mao et al. | Applicant |
| US8316527(B2) | 2012-11-01 | Hong et al. | Applicant |
| US8320076(B1) | 2012-11-01 | Shen et al. | Applicant |
| US8320077(B1) | 2012-11-01 | Tang et al. | Applicant |
| US8320219(B1) | 2012-11-01 | Wolf et al. | Applicant |
| US8320220(B1) | 2012-11-01 | Yuan et al. | Applicant |
| US8320722(B1) | 2012-11-01 | Yuan et al. | Applicant |
| US8322022(B1) | 2012-12-01 | Yi et al. | Applicant |
| US8322023(B1) | 2012-12-01 | Zeng et al. | Applicant |
| US8325569(B1) | 2012-12-01 | Shi et al. | Applicant |
| US8333008(B1) | 2012-12-01 | Sin et al. | Applicant |
| US8334093(B2) | 2012-12-01 | Zhang et al. | Applicant |
| US8336194(B2) | 2012-12-01 | Yuan et al. | Applicant |
| US8339738(B1) | 2012-12-01 | Tran et al. | Applicant |
| US8341826(B1) | 2013-01-01 | Jiang et al. | Applicant |
| US8343319(B1) | 2013-01-01 | Li et al. | Applicant |
| US8343364(B1) | 2013-01-01 | Gao et al. | Applicant |
| US8349195(B1) | 2013-01-01 | Si et al. | Applicant |
| US8351307(B1) | 2013-01-01 | Wolf et al. | Applicant |
| US8357244(B1) | 2013-01-01 | Zhao et al. | Applicant |
| US8373945(B1) | 2013-02-01 | Luo et al. | Applicant |
| US8375564(B1) | 2013-02-01 | Luo et al. | Applicant |
| US8375565(B2) | 2013-02-01 | Hu et al. | Applicant |
| US8381391(B2) | 2013-02-01 | Park et al. | Applicant |
| US8385157(B1) | 2013-02-01 | Champion et al. | Applicant |
| US8385158(B1) | 2013-02-01 | Hu et al. | Applicant |
| US8394280(B1) | 2013-03-01 | Wan et al. | Applicant |
| US8400731(B1) | 2013-03-01 | Li et al. | Applicant |
| US8404128(B1) | 2013-03-01 | Zhang et al. | Applicant |
| US8404129(B1) | 2013-03-01 | Luo et al. | Applicant |
| US8405930(B1) | 2013-03-01 | Li et al. | Applicant |
| US8409453(B1) | 2013-04-01 | Jiang et al. | Applicant |
| US8409888(B2) | 2013-04-01 | Rumpler et al. | Applicant |
| US8413317(B1) | 2013-04-01 | Wan et al. | Applicant |
| US8416540(B1) | 2013-04-01 | Li et al. | Applicant |
| US8419953(B1) | 2013-04-01 | Su et al. | Applicant |
| US8419954(B1) | 2013-04-01 | Chen et al. | Applicant |
| US8422176(B1) | 2013-04-01 | Leng et al. | Applicant |
| US8422342(B1) | 2013-04-01 | Lee | Applicant |
| US8422841(B1) | 2013-04-01 | Shi et al. | Applicant |
| US8424192(B1) | 2013-04-01 | Yang et al. | Applicant |
| US8441756(B1) | 2013-05-01 | Sun et al. | Applicant |
| US8443510(B1) | 2013-05-01 | Shi et al. | Applicant |
| US8444866(B1) | 2013-05-01 | Guan et al. | Applicant |
| US8449948(B2) | 2013-05-01 | Medina et al. | Applicant |
| US8451556(B1) | 2013-05-01 | Wang et al. | Applicant |
| US8451563(B1) | 2013-05-01 | Zhang et al. | Applicant |
| US8454846(B1) | 2013-06-01 | Zhou et al. | Applicant |
| US8455119(B1) | 2013-06-01 | Jiang et al. | Applicant |
| US8456961(B1) | 2013-06-01 | Wang et al. | Applicant |
| US8456963(B1) | 2013-06-01 | Hu et al. | Applicant |
| US8456964(B1) | 2013-06-01 | Yuan et al. | Applicant |
| US8456966(B1) | 2013-06-01 | Shi et al. | Applicant |
| US8456967(B1) | 2013-06-01 | Mallary | Applicant |
| US8458892(B2) | 2013-06-01 | Si et al. | Applicant |
| US8462592(B1) | 2013-06-01 | Wolf et al. | Applicant |
| US8468682(B1) | 2013-06-01 | Zhang | Applicant |
| US8472288(B1) | 2013-06-01 | Wolf et al. | Applicant |
| US8480911(B1) | 2013-07-01 | Osugi et al. | Applicant |
| US8486285(B2) | 2013-07-01 | Zhou et al. | Applicant |
| US8486286(B1) | 2013-07-01 | Gao et al. | Applicant |
| US8488272(B1) | 2013-07-01 | Tran et al. | Applicant |
| US8491801(B1) | 2013-07-01 | Tanner et al. | Applicant |
| US8491802(B1) | 2013-07-01 | Gao et al. | Applicant |
| US8493693(B1) | 2013-07-01 | Zheng et al. | Applicant |
| US8493695(B1) | 2013-07-01 | Kaiser et al. | Applicant |
| US8495813(B1) | 2013-07-01 | Hu et al. | Applicant |
| US8498084(B1) | 2013-07-01 | Leng et al. | Applicant |
| US8506828(B1) | 2013-08-01 | Osugi et al. | Applicant |
| US8514517(B1) | 2013-08-01 | Batra et al. | Applicant |
| US8518279(B1) | 2013-08-01 | Wang et al. | Applicant |
| US8518832(B1) | 2013-08-01 | Yang et al. | Applicant |
| US8520336(B1) | 2013-08-01 | Liu et al. | Applicant |
| US8520337(B1) | 2013-08-01 | Liu et al. | Applicant |
| US8524068(B2) | 2013-09-01 | Medina et al. | Applicant |
| US8526275(B1) | 2013-09-01 | Yuan et al. | Applicant |
| US8531801(B1) | 2013-09-01 | Xiao et al. | Applicant |
| US8532450(B1) | 2013-09-01 | Wang et al. | Applicant |
| US8533937(B1) | 2013-09-01 | Wang et al. | Applicant |
| US8537494(B1) | 2013-09-01 | Pan et al. | Applicant |
| US8537495(B1) | 2013-09-01 | Luo et al. | Applicant |
| US8537502(B1) | 2013-09-01 | Park et al. | Applicant |
| US8545999(B1) | 2013-10-01 | Leng et al. | Applicant |
| US8547659(B1) | 2013-10-01 | Bai et al. | Applicant |
| US8547667(B1) | 2013-10-01 | Roy et al. | Applicant |
| US8547730(B1) | 2013-10-01 | Shen et al. | Applicant |
| US8555486(B1) | 2013-10-01 | Medina et al. | Applicant |
| US8559141(B1) | 2013-10-01 | Pakala et al. | Applicant |
| US8563146(B1) | 2013-10-01 | Zhang et al. | Applicant |
| US8565049(B1) | 2013-10-01 | Tanner et al. | Applicant |
| US8576517(B1) | 2013-11-01 | Tran et al. | Applicant |
| US8578594(B2) | 2013-11-01 | Jiang et al. | Applicant |
| US8582238(B1) | 2013-11-01 | Liu et al. | Applicant |
| US8582241(B1) | 2013-11-01 | Yu et al. | Applicant |
| US8582253(B1) | 2013-11-01 | Zheng et al. | Applicant |
| US8588039(B1) | 2013-11-01 | Shi et al. | Applicant |
| US8593914(B2) | 2013-11-01 | Wang et al. | Applicant |
| US8597528(B1) | 2013-12-01 | Roy et al. | Applicant |
| US8599520(B1) | 2013-12-01 | Liu et al. | Applicant |
| US8599657(B1) | 2013-12-01 | Lee | Applicant |
| US8603593(B1) | 2013-12-01 | Roy et al. | Applicant |
| US8607438(B1) | 2013-12-01 | Gao et al. | Applicant |
| US8607439(B1) | 2013-12-01 | Wang et al. | Applicant |
| US8611035(B1) | 2013-12-01 | Bajikar et al. | Applicant |
| US8611054(B1) | 2013-12-01 | Shang et al. | Applicant |
| US8611055(B1) | 2013-12-01 | Pakala et al. | Applicant |
| US8614864(B1) | 2013-12-01 | Hong et al. | Applicant |
| US8619512(B1) | 2013-12-01 | Yuan et al. | Applicant |
| US8625233(B1) | 2014-01-01 | Ji et al. | Applicant |
| US8625941(B1) | 2014-01-01 | Shi et al. | Applicant |
| US8628672(B1) | 2014-01-01 | Si et al. | Applicant |
| US8630068(B1) | 2014-01-01 | Mauri et al. | Applicant |
| US8634280(B1) | 2014-01-01 | Wang et al. | Applicant |
| US8638529(B1) | 2014-01-01 | Leng et al. | Applicant |
| US8643980(B1) | 2014-02-01 | Fowler et al. | Applicant |
| US8649123(B1) | 2014-02-01 | Zhang et al. | Applicant |
| US8665561(B1) | 2014-03-01 | Knutson et al. | Applicant |
| US8670211(B1) | 2014-03-01 | Sun et al. | Applicant |
| US8670213(B1) | 2014-03-01 | Zeng et al. | Applicant |
| US8670214(B1) | 2014-03-01 | Knutson et al. | Applicant |
| US8670294(B1) | 2014-03-01 | Shi et al. | Applicant |
| US8670295(B1) | 2014-03-01 | Hu et al. | Applicant |
| US8675318(B1) | 2014-03-01 | Ho et al. | Applicant |
| US8675455(B1) | 2014-03-01 | Krichevsky et al. | Applicant |
| US8681594(B1) | 2014-03-01 | Shi et al. | Applicant |
| US8689430(B1) | 2014-04-01 | Chen et al. | Applicant |
| US8693141(B1) | 2014-04-01 | Elliott et al. | Applicant |
| US8703397(B1) | 2014-04-01 | Zeng et al. | Applicant |
| US8705205(B1) | 2014-04-01 | Li et al. | Applicant |
| US8711518(B1) | 2014-04-01 | Zeng et al. | Applicant |
| US8711528(B1) | 2014-04-01 | Xiao et al. | Applicant |
| US8717709(B1) | 2014-05-01 | Shi et al. | Applicant |
| US8720044(B1) | 2014-05-01 | Tran et al. | Applicant |
| US8721902(B1) | 2014-05-01 | Wang et al. | Applicant |
| US8724259(B1) | 2014-05-01 | Liu et al. | Applicant |
| US8749790(B1) | 2014-06-01 | Tanner et al. | Applicant |
| US8749920(B1) | 2014-06-01 | Knutson et al. | Applicant |
| US8753903(B1) | 2014-06-01 | Tanner et al. | Applicant |
| US8760807(B1) | 2014-06-01 | Zhang et al. | Applicant |
| US8760818(B1) | 2014-06-01 | Diao et al. | Applicant |
| US8760819(B1) | 2014-06-01 | Liu et al. | Applicant |
| US8760822(B1) | 2014-06-01 | Li et al. | Applicant |
| US8760823(B1) | 2014-06-01 | Chen et al. | Applicant |
| US8763235(B1) | 2014-07-01 | Wang et al. | Applicant |
| US8780498(B1) | 2014-07-01 | Jiang et al. | Applicant |
| US8780505(B1) | 2014-07-01 | Xiao | Applicant |
| US8786983(B1) | 2014-07-01 | Liu et al. | Applicant |
| US8790524(B1) | 2014-07-01 | Luo et al. | Applicant |
| US8790527(B1) | 2014-07-01 | Luo et al. | Applicant |
| US8792208(B1) | 2014-07-01 | Liu et al. | Applicant |
| US8792312(B1) | 2014-07-01 | Wang et al. | Applicant |
| US8793866(B1) | 2014-08-01 | Zhang et al. | Applicant |
| US8797680(B1) | 2014-08-01 | Luo et al. | Applicant |
| US8797684(B1) | 2014-08-01 | Tran et al. | Applicant |
| US8797686(B1) | 2014-08-01 | Bai et al. | Applicant |
| US8797692(B1) | 2014-08-01 | Guo et al. | Applicant |
| US2004/0046148(A1) | 2004-03-01 | Zhang et al. | Applicant |
| US2004/0124438(A1) | 2004-07-01 | Mukherjee et al. | Applicant |
| US2010/0290157(A1) | 2010-11-01 | Zhang et al. | Applicant |
| US2011/0086240(A1) | 2011-04-01 | Xiang et al. | Applicant |
| US2012/0111826(A1) | 2012-05-01 | Chen et al. | Applicant |
| US2012/0216378(A1) | 2012-08-01 | Emley et al. | Applicant |
| US2012/0237878(A1) | 2012-09-01 | Zeng et al. | Applicant |
| US2012/0298621(A1) | 2012-11-01 | Gao | Applicant |
| US2013/0216702(A1) | 2013-08-01 | Kaiser et al. | Applicant |
| US2013/0216863(A1) | 2013-08-01 | Li et al. | Applicant |
| US2013/0257421(A1) | 2013-10-01 | Shang et al. | Applicant |
| US2013/0330573(A1) | 2013-12-01 | Zhao et al. | Examiner |
| US2014/0050058(A1) | 2014-02-01 | Zou et al. | Examiner |
| US2014/0154529(A1) | 2014-06-01 | Yang et al. | Applicant |
| US2014/0175050(A1) | 2014-06-01 | Zhang et al. | Applicant |