The present invention relates to machines for placing surface mount electronic components (SMD) on printed circuit boards and more particularly to stations on such machines for verifying the presence of the leads or contacts (geometric features) on each component.
With machine-vision inspection the most important factor is to present the inspection scene to the vision sensor in such a way as to highlight its most important features. The vision sensor "sees" by measuring varying intensities of light waves reflected from the object in the field of view. These intensities will vary depending on the part composition and geometry effecting the levels of specular and/or diffused reflection returning to the sensor.
Front lighting will highlight a SMD leaded component's metalized leads through a combination of specular and diffused reflection. Depending on the surface texture of the lead there can be varying intensities reflected back to the sensor on a part-to-part/lead-to-lead basis. Most of this light energy will be specular in nature which can cause blooming in the sensor on some leads. This blooming (saturating pixel elements) can cause system measurement errors.
Back lighting the same leaded components would present a silhouette of the part to the sensor. If the back lighting is uniform and diffuse in nature, the transition from the background to edge of the lead will be well defined and consistent from part to part. Some components, however (i.e., non-leaded and J-lead) require front lighting to highlight their features for optimum inspection.
Ideally, then, both schemes are necessary for the flexibility required to inspect a large variety of components.
It is accordingly an object of the present invention to provide an inspection system which can either back light or front light a component to be inspected.
Other objects and advantages of the present invention will become apparent from the following portion of this specification and from the accompanying drawing which illustrates in accordance with the mandate of the patent statutes a presently preferred embodiment incorporating the principles of the invention.
Referring to the drawing:
The sole figure is a perspective view of a portion of a surface mount machine made in accordance with the teachings of the present invention.
The surface mount machine includes a pickup tool head including a housing 10 having an outer pickup tool 11 which is vertically displaceable to engage and pick up a component 12 from a feeder (not shown) and to deposit that component on a printed circuit board (not shown). The pickup tool head also includes an inner tool 13. A disc shaped light emitter/ reflector/absorber 14 may be located between the tool 11 and the pickup tool housing 10. The component is held on the tools 11 or 13 by suction. The tool spindle is also displaceable rotationally so that the picked up component can be located at a precise orientation.
The inspection station includes a high resolution CCD video camera 20 supported on a base 21 which is made up of a lens 22 which focuses the image of the component reflected to the lens by a mirror 15 on a suitable sensor (not shown). The resulting analog video image is digitized to high resolution and stored in a dual-ported frame buffer and inspection is carried out by a special purpose computer 26 designed for image processing and vision analysis. Such a system utilizes high speed vision algorithms such as normalized greyscale correlation, edge detection and connectivity analysis for inspecting the leads 28 of the component.
According to the present invention an ultra violet (UV) excited fluorescing material is mixed with transparent or translucent material to form the disc and the tools 11 and 13 and may be excited by a stationary UV lamp 32. When the UV lamp 32 is powered, the pigmentation in the disc 14 and tools 11 and 13 will fluoresce in the selected visible spectra providing backlighting, while the UV radiation will not be detected by the sensor due to the absorption properties of the components, the glass lens and the sensor's lack of sensitivity to these wavelengths.
The front light system consists of a bank of light emitting diodes 36 which emit a narrow band wavelength of approximately 660 nm. (visible red). This light is outside the UV range and either has a wavelength corresponding to the wavelength of the UV fluorescing surface so that no fluorescing occurs or has a substantially different wavelength that is absorbed by the surface without causing fluorescing to take place. The fluorescing material is selected for an absorbing wavelength so that there is a minimum of reflectivity from the front lighting. If the fluorescent pigment is, in this example, green (550 NM), the light rays from the front light will become absorbed in the absorbing wavelength of the disc 14 and tools 11 and 13 causing the sensor to "see" a dark background. Both front and back lighting are realized with light sources mounted on the sensor side of the component.
A similar technique to achieve the above is to coat the light shroud and tool with a fluorescent pigmentation. The wavelengths of the fluorescing carrier and the front lighting must be selected to match and an absorbing wavelength behind the fluorescing material is necessary. If the fluorescent layer (pigment carrier) is the same wavelength as the front light, the light rays from the front light will pass through the pigment carrier and become absorbed in the absorbing background of the disc 14 and tools 11 and 13, again achieving the maximum contrast between front light and back light.
Alternate operation of the UV light source 32 and the LED light 36 is controlled by a suitable light source controller 30 which alternately turns on these sources. The component to be tested accordingly can be evaluated with backlighting, or frontlighting or with both in sequence.