Structure for removable cooler

[0001] The present invention relates to a cooler, especially a removable cooler on the memory of a PC.

[0002] Traditionally, during the run time of a PC, the electronic components inside and memory module generate lots of heat, especially the new memory module required by high-level computers. The temperature of the memory module going up continuously affects operation performance, even causes the memory module to break down. Currently, a cooler designed for such a heat dispensation problem of the memory module is still unavailable.

[0003] In view of such the unavailability, the inventor of the present invention was devoted to finding a solution and accomplished structural improvement for cooler.

[0004] The main objective for the present invention is to provide a removable cooler on the memory module inside a PC, wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module combined by two pieces of heat conduction heat sinks placed oppositely is screwed or tenoned to the memory module so that the heat generated by the memory module is conducted to the extension part of the heat sink and thus stimulates heat exchange. The cooler module could be a fan or heat conduction tube. If it is a fan, it could be buckled on the memory module socket for the extension part of the two oppositely placed heat sinks to absorb the heat of the memory module and drives heat exchange. If it is a heat conductive tube screwed or tenoned against the extension of the two oppositely placed heat sinks, it absorbs the heat of the memory conducted to the extension part of the two oppositely placed heat sinks and stimulates heat exchange, thus provides heat dispensation to assure the performance of the memory module.

[0005] In the following, the embodiment illustrated is used to describe the detailed structural characteristics and operation action for the present invention

[0015] Please refer to FIG. 1. The present invention provides a removal cooler for the memory module inside a PC, mainly consisting of a heat sink module 1 and a cooler module 2. The heat sink module 1 covered on the memory module 3 contains two pieces of heat-conductive heat sinks 11 placed oppositely. There is a concave 111 on the inner side of each heat sink 11 that shelters and contacts against the chips 31 protruding from both sides of the memory module 3 and conducts heat (as shown in FIG. 3). Otherwise, a heat conduction interface 4 is used between the chip 31 and the concave 111 for heat conduction (as shown in FIG. 4). This heat conduction interface 4 can be heat dispensation ointment or heat dispensation tape. On the two heat sinks 11 placed oppositely there are several holes 112 corresponding to the holes 32 on the memory module 3 so that the two heat sinks 11 can be screwed (as shown in FIG. 2) or tenoned (as shown in FIG. 5) to the memory module 3, on the extension part above the heat sink 11 there are several heat dispensation fins 114 (as shown in FIG. 2) or ventilators 115 (as shown in FIG. 5) for ventilation and heat dispensation.

[0016] Please refer to FIG. 6. The above cooler module 2 is a fan-style frame that contains a frame 21 and at least one fan 22 (in this case two fans 22 are used). The frame 21 is a π-shaped frame with two flexible sides. On the frame's top 211 there are two holes 212 stretching to the side of the frame. There is a fan 22 placed at different angle on top of the hole, at the bottom of the hole or on one side of the hole (in this case the fan is placed on top of the hole). At the inner bottom of the frame's leg 213 on both sides of the frame 21 there is a cavity 214 and the inner bottom of the two frame's legs 213 are bevels 215.

[0017] Please refer to FIGS. 6 through 8. Several memory modules 3 are inserted on the memory socket 7 and fixed by hook 71. In this way, when pushing the frame's legs 213 of the frame 21 outward and pushing the bevel 215 at the inner bottom of the two frame's legs 213 toward the hook 71 on both sides of the memory socket 7, the cavity 214 at the inner bottom of the two frames' legs 213 are stuck onto the hook 71 on both sides of the memory socket 7, thus secures the frame 21 above the memory socket 7 with the frame's top 211 and the fan 22 placed above the extension part 113 of the oppositely placed heat sinks 11. In this way, the heat generated by the chip 31 of each pair of memory module 3 is conducted to the extension part 113 through the two heat sinks 11 and the air absorbed by the fan 22 is transmitted to the space above the extension part 113 for ventilation and heat exchange, thus achieves the heat dispensation of the memory module 3 and ensures the performance of the memory module 3.

[0018] Please refer to FIG. 9. The cooler module 2 of the present invention can be a tube combined with a heat-conduction tube 23 and a pair of fans 22. The heat-conduction tube 23 is screwed or tenoned on top of the extension part 113 of the heat sinks 11 and extends outward with heat dispensation fins 231 at the extended end. The fan 22 is placed on one side of the heat dispensation fins 231, allowing the air absorbed by the fan 22 to be transmitted to the space above the heat dispensation fins 231 for heat exchange, thus achieves heat dispensation for the memory module 3 and ensures the performance of the memory module 3.