Thermally-assisted magnetic recording head, head gimbal assembly and magnetic recording device

[0001] 1. Field of the Invention

[0002] The present invention relates to a head that is used for a thermally-assisted magnetic recording which performs data recording by irradiating near-field light to a magnetic recording medium and decreasing an anisotropic magnetic field of the magnetic recording medium, and also to a head gimbal assembly and a magnetic recording device to which the head is used.

[0003] 2. Description of the Related Art

[0004] In the field of magnetic recording using a head and a medium, further performance improvement of thin film magnetic heads and magnetic recording media have been demanded in conjunction with a growth of high recording density of magnetic disk devices. Currently, composite type thin film magnetic heads are widely used for the thin film magnetic heads. The composite type thin film magnetic heads are configured with a configuration in which a magnetoresistive (MR) element for reading and an electromagnetic conversion element for writing are laminated.

[0005] The magnetic recording medium is a discontinuous medium in which magnetic nanoparticles gather and each of the magnetic nanoparticles has a single magnetic domain structure. In this magnetic recording medium, a single recording bit is configured with a plurality of magnetic nanoparticles. Therefore, in order to increase recording density, asperities at a border between adjacent recording bits need to be reduced by decreasing the size of the magnetic nanoparticles. However, decreasing the magnetic nanoparticles in size leads to a decrease in the volume of the magnetic nanoparticles, resulting in a decrease in thermal stability of magnetization in the magnetic nanoparticles.

[0006] As a countermeasure against this problem, increasing magnetic anisotropy energy Ku of magnetic nanoparticles may be considered; however, the increase in Ku causes an increase in an anisotropic magnetic field (coercive force) of the magnetic recording medium. On the other hand, the upper limit of the writing magnetic field intensity of the thin film magnetic head is substantially determined by saturation magnetic flux density of a soft magnetic material configuring a magnetic core in the head. As a result, when the anisotropic magnetic field of the magnetic recording medium exceeds an acceptable value determined by the upper limit of the writing magnetic field intensity, it becomes impossible to write. Currently, as a method to solve such thermal stability problem, a so-called thermally-assisted magnetic recording method has been proposed in which, while a magnetic recording medium formed of a magnetic material with large Ku is used, the magnetic recording medium is heated immediately before the application of the writing magnetic field so that the anisotropic magnetic field is reduced and the writing is performed.

[0007] As this thermally-assisted magnetic recording method, a method that uses a near-field light probe (a so-called plasmon-generator) which is a metal piece that generates near-field light from plasmon excited by laser light is generally known.

[0008] As a magnetic recording head provided with such plasmon generator, a magnetic recording head provided with a pole, a waveguide, and a plasmon generator having a propagation edge opposing the waveguide has been already proposed by the inventors of the present application. Specifically, a magnetic recording head is proposed in which from the perspective of the air bearing surface side, heat dissipation layers are respectively jointed to trailing side end parts of a substantially V-shaped portion of the plasmon generator which has the substantially V-shaped part that is formed with a propagation edge positioned on the leading side and in which a part of the pole is contained in a space formed by the V-shaped part (U.S. patent application Ser. No. 13/046,117).

[0009] In this thermally-assisted magnetic recording head, light propagating through the waveguide is coupled with a plasmon generator in a surface plasmon mode to excite surface plasmon, and the surface plasmon propagates through the plasmon generator so that the near-field light is generated at the near-field light generating portion positioned at an air bearing surface (ABS) side end part of the propagation edge. Furthermore, a magnetic recording medium is heated by the near-field light generated in the near-field light generating portion of the plasmon generator, a writing magnetic field is applied upon a reduced isotropic magnetic field of the magnetic recording medium, and thereby information is written. In the above-described thermally-assisted magnetic recording head, a method that allows steep magnetization reversal between adjacent magnetic domains of the magnetic recording medium and that satisfies the demand of high recording density and high signal to noise (SN) ratio is shortening the distance between the center of near-field light irradiated to the magnetic recording medium and the center of the magnetic field applied from the pole, that is, in other word, shortening the distance between the near-field light generator and a tip end part (the end part positioned on the most leading side on the air bearing surface side) of the pole.

[0010] In order to shorten the distance between the near-field light generator and the tip end part of the pole in the magnetic recording head with the above-described configuration, it is necessary to thin the thickness of a substantially V-shaped part of the plasmon generator. However, with the thinned thickness, the light is absorbed by the pole contacting the substantially V-shaped part, and this may reduce light intensity of the near-field light that emits at the near-field light generator. As a result, a preferred thermally-assisted effect may not be obtained. On the other hand, when the thickness of the substantially V-shaped part of the plasmon generator is thickened to obtain sufficient light intensity of the near-field light, the distance between the near-field light generator and the tip end part of the pole is lengthened, and this may bring difficulties to satisfy the demand of high recording density and high SN ratio.

[0011] In such a situation, due to demands of further higher recording density in recent years, there is a current situation that the demand for the thermally-assisted magnetic recording head that allows even steeper magnetization reversal between adjacent magnetic domains of the magnetic recording medium and that satisfies the demand of higher SN ratio and higher recording density has raised.

[0012] The object of the present invention is to provide a thermally-assisted magnetic recording head that allows even steeper magnetization reversal between adjacent magnetic domains of a magnetic recording medium and that satisfies the demands of high SN ratio and high recording density, and a head gimbal assembly and a magnetic recording device using thereof.

[0013] In order to achieve the object, the present invention provides a thermally-assisted magnetic recording head includes a pole that generates a writing magnetic field from an end surface that forms a part of an air bearing surface that opposes a magnetic recording medium, a waveguide through which light for exciting surface plasmon propagates, and a plasmon generator that couples to the light in a surface plasmon mode to generate near-field light from a near-field light generating end surface that forms a part of the air bearing surface. The waveguide is arranged on a back side of the pole along a direction perpendicular to the air bearing surface from the perspective of the air bearing surface side, the plasmon generator has a plane part and a projection part that is projected from the plane part to the waveguide side and that opposes the pole and the waveguide with a predetermined gap, and a projection part opposing surface that opposes the projection part in the pole is configured so as to be distant from the projection part as approaching from the air bearing surface side toward the back side along the direction perpendicular to the air bearing surface (First Invention).

[0014] In the above invention (First Invention), it is preferred that, in a cross-section that is obtained by cutting the thermally-assisted magnetic recording head along a plane that is parallel to a travelling direction of the magnetic recording medium and a direction perpendicular to the air bearing surface and that goes across the pole and the projection part, an area ratio of the pole to a region of a quadrilateral shape is 4-38%. The quadrilateral shape surrounded by a first segment that is elongated from an end part of the projection part opposing surface in the back side to the air bearing surface along the direction perpendicular to the air bearing surface so as to be orthogonal to the air bearing surface, a second segment that is elongated from the end part of the projection part opposing surface to the projection part so as to be orthogonal to the projection part, the air bearing surface, and the projection part (Second Invention).

[0015] In the above invention (First Invention), it is preferred that, on the air bearing surface, a distance between the end part of the projection part opposing surface and the projection part is 5-30 nm (Third Invention).

[0016] In the above invention (First Invention), it is preferred to further include a heat dissipation part that is continued to the plane part (Fourth Invention).

[0017] In the above invention (First Invention), it is preferred that the projection part is continued from the air bearing surface along the direction perpendicular to the air bearing surface (Fifth Invention).

[0018] In the above invention (First Invention), it is preferred that the shape of the projection part is a substantially trapezoidal shape that is surrounded by a short side that is positioned on the air bearing surface, a long side that is positioned on the back side with respect to the short side along the direction perpendicular to the air bearing surface, and that is substantially parallel to the short side, and two inclined sides that are respectively continued to end parts of the short side and end parts of the long side (Sixth Invention).

[0019] In the above invention (Sixth Invention), it is preferred that an angle formed by the direction perpendicular to the air bearing surface and one of the inclined sides is less than 10 degree (Seventh Invention).

[0020] In the above invention (First Invention), it is preferred that the shape of the projection part includes a substantial V-shape formed by an apex that is positioned on the air bearing surface and two inclined sides that spread to each other from the apex toward the back side along the direction perpendicular to the air bearing surface (Eighth Invention).

[0021] In the above invention (First Invention), it is preferred that a gap between the projection part and the waveguide is 10-200 nm (Ninth Invention).

[0022] Further, the present invention provides a head gimbal assembly including the thermally-assisted magnetic recording head according to the above invention (First Invention), and a suspension that supports the thermally-assisted magnetic recording head (Tenth Invention).

[0023] Furthermore, the present invention provides a magnetic recording device including a magnetic recording medium, the thermally-assisted magnetic recording head according to the above invention (First Invention), a positioning device that supports the thermally-assisted magnetic recording head and also positions the thermally-assisted magnetic recording head with respect to the magnetic recording medium (Eleventh Invention).

[0024] With the present invention, it is realized to provide a thermally-assisted magnetic recording head that allows even steeper magnetization reversal between adjacent magnetic domains of a magnetic recording medium and that satisfies the demands of high SN ratio and high recording density, and a head gimbal assembly and a magnetic recording device using thereof.

[0036] Prior to explaining embodiments of the present invention, terminologies used in the present specification are defined. In a lamination structure or an element structure formed on an element formation surface of a slider substrate of a magnetic recording head according to embodiments of the present invention, from a perspective of a layer or element to be a standard, a substrate side is referred to as “lower (below),” and an opposite side is referred to as “upper (above).” In addition, in the magnetic recording head according to embodiments of the present invention, “X, Y and Z axis directions” are defined in some of the drawings as necessary. Here, the Z axis direction corresponds to the above-described “up and down directions”, +Z side corresponds to a trailing side, and −Z side corresponds to a leading side. Moreover, the Y axis direction is a track width direction, and the X axis direction is a height direction

[0037] A thermally-assisted magnetic recording head according to one embodiment of the present invention is explained with reference to the drawings.

[0038] FIG. 1 is a perspective view schematically illustrating a magnetic recording device of the present embodiment. FIG. 2 is a perspective view schematically illustrating a head gimbal assembly (HGA) of the present embodiment. FIG. 3 is a perspective view illustrating a thermally-assisted magnetic recording head according to the present embodiment.

[0039] As illustrated in FIG. 1, a magnetic disk device as a magnetic recording device according to the present embodiment is provided with a number of magnetic disks 301, an assembly carriage device 310, head gimbal assemblies (HGA) 312, and a control circuit 330. The magnetic disks 301 rotate around a rotational shaft of a spindle motor 302. The assembly carriage device 310 is provided with a plurality of drive arms 311. The HGAs 312 each is attached to a tip portion of each of the drive arms 311 and has the thermally-assisted magnetic recording head 1, which is a thin film magnetic head, according to the present embodiment. The control circuit 330 controls writing and reading operations of the thermally-assisted magnetic recording head 1 according to the present embodiment and controls a light emission operation of a laser diode, which is a light source that generates laser light for after-mentioned thermally-assisted magnetic recording.

[0040] In the present embodiment, the magnetic disks 301 are for perpendicular magnetic recording and each has a structure in which a soft magnetic under layer, an intermediate layer, and a magnetic recording layer (perpendicular magnetization layer) are sequentially laminated above a disk substrate.

[0041] The assembly carriage device 310 is a device for positioning the thermally-assisted magnetic recording head 1 above a track, formed in the magnetic disk 301, on which recording bits are arrayed. In the assembly carriage device 310, the drive arms 311 are stacked in a direction along a pivot bearing shaft 313 and are angularly swingable by a voice coil motor (VCM) 314 centering around the pivot bearing shaft 313.

[0042] Note, the structure of the magnetic disk device of the present embodiment is not limited to the above-described structure but may include only a single piece of each of the magnetic disk 301, the drive arm 311, the HGA 312, and the thermally-assisted magnetic recording head 1.

[0043] In the HGA 312 illustrated in FIG. 2, a suspension 320 includes a load beam 321, a flexure 322 that is firmly attached to the load beam 321 and has elasticity, and a base plate 323 provided at a base of the load beam 321. In addition, a wiring member 324 is provided on the flexure 322. The wiring member 324 is formed from a lead conductor and connection pads that are electrically connected to both sides of the lead conductor. The thermally-assisted magnetic recording head 1 according to the present embodiment is firmly attached to the flexure 322 at a tip portion of the suspension 320 so as to oppose a surface of each of the magnetic disks 301 with a predetermined gap (flying height). Further, an end of the wiring member 324 is electrically connected to a terminal electrode of the thermally-assisted magnetic recording head 1 according to the present embodiment. Additionally, the structure of the suspension 320 in the present embodiment is also not limited to the above-described structure, and a head drive IC chip (not illustrated) may be mounted in the middle of the suspension 320.

[0044] As illustrated in FIG. 3, the thermally-assisted magnetic recording head 1 according to the present embodiment is provided with a slider 10 and a light source unit 50. The slider 10 is formed of ALTIC (Al₂O₃-TiC) or the like and is provided with a slider substrate 11 having an air bearing surface (ABS) 11a and a head part 12. The ABS 11a as a medium opposing surface is processed to obtain an appropriate flying height, and the head part 12 is formed on an element formation surface 11b perpendicular to the ABS 11a.

[0045] Furthermore, the light source unit 50 is formed of ALTIC (Al₂O₃-TiC) or the like, and is provided with a unit substrate 51 having a joining surface 51a, and a laser diode 60 as a light source provided on a light source installation surface 51b perpendicular to the joining surface 51a.

[0046] Here, the slider 10 and the light source unit 50 are joined with each other such that a back surface 11c of the slider substrate 11 contacts the joining surface 51a of the unit substrate 51. The back surface 11c of the slider substrate 11 means an end surface of the slider substrate 11 on the opposite side to the ABS 11a. Note, the thermally-assisted magnetic recording head 1 according to the present embodiment may have a configuration in which the laser diode 60 is directly mounted on the slider 10 without using the light source unit 50.

[0047] The head part 12 formed on the element formation surface 11b of the slider substrate 11 is provided with a head element 20, a waveguide 23, a plasmon generator 24, a protective layer 31, a pair of first terminal electrodes 25a, and a pair of second terminal electrodes 25b. The head element 20 has an MR element 21 for reading out data from the magnetic disk 301 and an electromagnetic transducer element 22 for writing data to the magnetic disk 301. The waveguide 23 is disposed for guiding laser light from the laser diode 60 provided on the light source unit 50 to an ABS side. The plasmon generator 24 configures a near-field light generating optical system with the waveguide 23. The protective layer 31 is formed on the element formation surface 11b so as to cover the MR element 21, the electromagnetic transducer element 22, the waveguide 23, and the plasmon generator 24. The pair of first terminal electrodes 25a is exposed on an upper surface of the protective layer 31 and is electrically connected to the MR element 21. The pair of second terminal electrodes 25b is exposed on the upper surface of the protective layer 31 and is electrically connected to the electromagnetic transducer element 22. The first and second terminal electrodes 25a and 25b are electrically connected to the connection pad of the wiring member 324 provided to the flexure 322 (see FIG. 2).

[0048] Ends of the MR element 21, the electromagnetic transducer element 22, and the plasmon generator 24 reach a head part end surface 12a, which is the air bearing surface of the head part 12. Here, the head part end surface 12a and the ABS 11a form the air bearing surface of the entire thermally-assisted magnetic recording head 1 according to the present embodiment.

[0049] During the actual writing and reading, the thermally-assisted magnetic recording head 1 hydro-dynamically flies above the surface of the rotating magnetic disk 301 with a predetermined flying height. At this time, the end surfaces of the MR element 21 and the electromagnetic transducer element 22 oppose the surface of the magnetic recording layer of the magnetic disk 301 with an appropriate magnetic spacing. In this state, the MR element 21 performs the reading by sensing a data signal magnetic field from the magnetic recording layer, and the electromagnetic transducer element 22 performs the writing by applying a data signal magnetic field to the magnetic recording layer.

[0050] At the time of the writing, the laser light that has propagated from the laser diode 60 of the light source unit 50 through the waveguide 23 is coupled with the plasmon generator 24 in a surface plasmon mode and excites surface plasmon at the plasmon generator 24. This surface plasmon propagates along a projection part 241 (see FIG. 4), which will be described later, of the plasmon generator 24 toward the head part end surface 12a so that the near-field light is generated at an end part of the plasmon generator 24 on a head part end surface 12a side. This near-field light reaches the surface of the magnetic disk 301 so that a part of the magnetic recording layer of the magnetic disk 301 is heated. As a result, anisotropic magnetic field (coercive force) at that part decreases to a value at which the writing becomes possible. It becomes able to perform the thermally-assisted magnetic recording by applying a writing magnetic field to the part where the anisotropic magnetic field has decreased.

[0051] FIG. 4 is a cross-sectional view of the A-A line (XZ plane) in FIG. 3, and schematically illustrates a configuration of the thermally-assisted magnetic recording head 1 according to the present embodiment.

[0052] As illustrated in FIG. 4, the MR element 21 has a lower shield layer 21a formed on a first insulating layer 32a on the element forming surface 11b of the slider substrate 11, an MR multilayer body 21b formed on the lower shield layer 21a, and an upper shield layer 21c formed on the MR multilayer body 21b. A second insulating layer 32b is provided between the lower shield layer 21a and the upper shield layer 21c in the periphery of the MR multilayer body 21b. The lower shield layer 21a and the upper shield layer 21c prevent the MR multilayer body 21b from receiving the effects of external magnetic fields which are noise.

[0053] The lower shield layer 21a and the upper shield layer 21c are magnetic layers with a thickness of approximately 0.5-3 μm formed by, for example, a frame plating method, a spattering method or the like of a soft magnetic material, for example, NiFe (permalloy), FeSiAl (sendust), CoFeNi, CoFe, FeN, FeZrN, CoZrTaCr or the like, or a multilayer film or the like formed of these materials.

[0054] The MR multilayer body 21b is a magnetically sensitive part that senses the signal magnetic field using the MR effect and may be any of a current in plane-giant magnetoresistive (CIP-GMR) multilayer body that uses a current in plane-giant magnetoresistive effect, a current perpendicular to plane-giant magnetoresistive (CPP-GMR) multilayer body that uses a current perpendicular to plane-giant magnetoresistive effect, and a tunnel-magnetoresistive (TMR) multilayer body that uses a tunnel-magnetoresistive effect. When the MR multilayer body 21b is a CPP-GMR multilayer body or a TMR multilayer body, the lower shield layer 21a and the upper shield layer 21c also function as electrodes. On the other hand, when the MR multilayer body 21b is a CIP-GMR multilayer body, insulating layers are provided respectively between the MR multilayer body 21b and the lower shield layer 21a and between the MR multilayer body 21b and the upper shield layer 21c. Moreover, an MR lead layer that is electrically connected to the MR multilayer body 21b is provided.

[0055] When the MR multilayer body 21b is a TMR multilayer body, the MR multilayer body 21b has a structure in which the following are sequentially laminated: an antiferromagnetic layer formed of, for example, IrMn, PtMn, NiMn, RuRhMn or the like having a thickness of approximately 5-15 nm; a magnetization pinned layer that has a structure in which two ferromagnetic layers formed of, for example, CoFe or the like sandwich a nonmagnetic metal layer formed of Ru or the like and of which a magnetization direction is pinned by the antiferromagnetic layer; a tunnel barrier layer formed of a nonmagnetic dielectric material that is a metal film formed of Al, AlCu or the like having a thickness of approximately 0.5-1 nm oxidized by oxygen introduced into a vacuum device or by natural oxidation; and a magnetization free layer that is configured with a double layer film formed of a layer of CoFe or the like having a thickness of approximately 1 nm and a layer of NiFe or the like having a thickness of approximately 3-4 nm, which are ferromagnetic materials, and that achieves tunnel exchange coupling with the magnetization pinned layer with the tunnel barrier layer therebetween.

[0056] The head part 12 in the present embodiment is provided with a third insulating layer 32c provided on the upper shield layer 21c, an interelement shield layer 33 provided on the third insulating layer 32c, and a fourth insulating layer 32d provided on the interelement shield layer 33. The interelement shield layer 33 may be formed of a soft magnetic material, and has a function to shield the MR element 21 from the magnetic field generated at the electromagnetic transducer element 22 provided on the fourth insulating layer 32d. Note, the third insulating layer 32c and the interelement shield layer 33 may be omitted.

[0057] The electromagnetic transducer element 22 for the perpendicular magnetic recording is provided with a lower yoke layer 22a disposed on the fourth insulating layer 32d, a writing coil 22b disposed on the lower yoke layer 22a, a pole 22c above the writing coil 22b that reaches the head part end surface 12a to form a part of the head part end surface 12a, an upper yoke layer 22d disposed above the pole 22c, two linkage layers 22e and 22e (see FIG. 6) that are disposed on the lower yoke layer 22a so as to sandwich the waveguide 23, which will be described later, in the Y axis direction (track width direction) and to link the lower yoke layer 22a and the upper yoke layer 22d. The writing coil 22b has a spiral structure in which the writing coil 22b wounds around two linkage layers 22e and 22e (see FIG. 6) so as to go across between at least the lower yoke layer 22a and the upper yoke layer 22d during one turn.

[0058] The head part 12 in the present embodiment is provided with a fifth insulating layer 32e provided around the lower yoke layer 22a on the fourth insulating layer 32d, a sixth insulating layer 32f provided on the lower yoke layer 22a and the fifth insulating layer 32e, seventh insulating layers 32g provided between the winding lines of the writing coil 22b and in its vicinity, an eighth insulating layer 32h provided on the writing coil 22b and the seventh insulating layer 32g, and a ninth insulating layer 32i provided on the eighth insulating layer 32h in the vicinity of the plasmon generator 24, which will be described later.

[0059] In the head part 12 in the present embodiment, the lower yoke layer 22a, the linkage layers 22e, the upper yoke layer 22d, and the pole 22c form a magnetic guide path that allows the magnetic flux corresponding to the magnetic field generated by the writing coil 22b to pass through, and guides the magnetic flux to the magnetic recording layer (perpendicular magnetization layer) of the magnetic disk 301. The furthest leading side of the end surface 220 of the pole 22c that forms a part of the head part end surface 12a is the point that generates the writing magnetic field.

[0060] The pole 22c is preferably formed of a soft magnetic material having a higher saturation magnetic flux density than the upper yoke layer 22d, and is formed of a soft magnetic material such as, for example, FeNi, FeCo, FeCoNi, FeN, FeZrN or the like, which are iron-based alloy materials having Fe as a main component. Note, the thickness of the pole 22c in the Z axis direction may be set to 0.1-0.8 μm.

[0061] Furthermore, the width of the pole 22c in the Y axis direction is preferably 0.2-0.3 μm. When the width of the pole 22c in the Y axis direction is within the aforementioned range, a magnetic field having a writable intensity can be appropriately applied to the heating spot of the magnetic disk 301 that is heated by the plasmon generator 24. Furthermore, the thickness of the pole 22c in the X axis direction (height direction) is preferably thin to the extent possible and is preferably 0.06-0.3 μm. When the thickness of the pole 22c is thinned, this enables the distance MO (see FIG. 5) to be shortened, and enables the spot diameter of the near-field light irradiated to the magnetic disk 301 to be small. The distance MO is the distance between an end part A positioned on a projection part opposing surface 22c₁ of the pole 22c, which will be described later, on the head part end surface 12a side and an end part B positioned on the projection part 241 (upper surface of the projection part) of the plasmon generator 24 on the head part end surface 12a side. Therefore, the demands on high SN ratio and high recording density can be satisfied together.

[0062] The end surface of the upper yoke layer 22d on the head part end surface 12a side does not reach the head part end surface 12a, and is positioned at a location recessed from the head part end surface 12a by a predetermined distance toward the head part back end surface 12b side in the X axis direction. Thereby, magnetic flux can be focused at the pole 22c, and the intensity of the magnetic field generated from the pole 22c can be strengthened.

[0063] The writing coil 22b is formed of a conductive material such as Cu (copper) or the like. Note, the writing coil 22b is configured with one layer in the present embodiment; however, may be configured with two or more layers. Furthermore, the number of windings of the writing coil 22b is not particularly limited, and can be set to 2-7 turns, for example.

[0064] The lower yoke layer 22a is formed on the forth insulating layer 32d formed of an insulation material such as Al₂O₃ (alumina), and functions as a magnetic guide path that guides a magnetic flux that has returned from a soft magnetic under layer provided under the magnetic recording layer (perpendicular magnetization layer) of the magnetic disk 301. The lower yoke layer 22a is formed of a soft magnetic material and has a thickness of approximately 0.5-5 μm, for example.

[0065] The waveguide 23 is provided at a recessed position from the pole 22c in the X axis direction (height direction) from the perspective of the ABS' 11a (the head part end surface 12a). The plasmon generator 24 is provided below the pole 22c (on the leading side). The waveguide 23 and the plasmon generator 24 form an optical system for generating near-field light in the head part 12.

[0066] The waveguide 23 is elongated in parallel with the element formation surface 11b from a rear end surface 23a that forms a part of a head part rear end surface 12b toward a rear end surface of the pole 22c with a predetermined gap between the rear end surface of the pole 22c and a end surface 23b so as not to contact the pole 22c. When the end surface 23b on the pole 22c side of the waveguide 23 contacts the pole 22c, light (laser light) propagating through the waveguide 23 is absorbed by the pole 22c. Therefore, this may cause negative effects that light peak intensity of the near-field light irradiated from the plasmon generator 24 decreases and that the temperature of the pole 22c increases. However, in the present embodiment, the occurrence of these negative effects can be prevented because the rear end surface of the pole 22c and the end surface 23b do not contact each other. Also, a lower surface (a part of side surfaces) of the waveguide 23 and a part of the projection part 241 of the plasmon generator 24 oppose each other with a predetermined gap, and the portion sandwiched by these is a buffer portion 40 with a lower refractive index than the refractive index of the waveguide 23.

[0067] The buffer portion 40 functions to couple laser light propagating through the waveguide 23 with the plasmon generator 24 in the surface plasmon mode. Note, the buffer portion 40 may be a part of a ninth insulating layer 32i or may be another layer provided separately from the ninth insulating layer 32i.

[0068] The plasmon generator 24 is provided such that the projection part 241 opposes both the pole 22c and the waveguide 23. Note, the specific configurations of the pole 22c, the waveguide 23, and the plasmon generator 24 are described later.

[0069] As illustrated in FIG. 4, the light source unit 50 is provided with the unit substrate 51, the laser diode 60 provided on the light source installation surface 51b of the unit substrate 51, a first drive terminal electrode 61 electrically connected to an electrode 60f that forms a lower surface of the laser diode 60, and a second drive terminal electrode 62 electrically connected to an electrode 60e that forms an upper surface of the laser diode 60. The first and second drive terminal electrodes 61 and 62 are electrically connected to the connection pads of the wiring member 324 provided to the flexure 322 (see FIG. 2). When a predetermined voltage is applied to the laser diode 60 from the first and second drive terminal electrodes 61 and 62, laser light is radiated from an emission center 60h positioned on an emission surface of the laser diode 60. In the head structure illustrated in FIG. 4, an oscillation direction of the electric field of laser light that the laser diode 60 generates is preferably perpendicular (Z axis direction) to a lamination layer surface of an active layer 60c. That is, it is preferable that the laser light that the laser diode 60 generates is a TM-mode polarized light. As a result, the laser light propagating through the waveguide 23 becomes able to be coupled properly with the plasmon generator 24 in the surface plasmon mode through the buffer portion 40.

[0070] For the laser diode 60, a diode that is generally used for communication, optical disk storage, material analysis or the like such as InP-type, GaAs-type, and GaN-type diodes etc. may be used. The wavelength 4 of laser light to radiate need only be in the range of 375 nm-1.7 μm, for example.

[0071] Specifically, it is also possible to use an InGaAsP/InP quaternary mixed crystal type laser diode, of which the available wavelength region is set to be 1.2-1.67 μm, for example. The laser diode 60 has a multilayered structure that includes an upper electrode 60e, the active layer 60c, and a lower electrode 60f. Reflection layers for exciting oscillation by total reflection are formed on the front and back of cleavage surfaces of this multilayered structure. In a reflection layer 60g, an aperture is provided at a position of the active layer 60c that includes the emission center 60h. It is possible to set the thickness T_LA of the laser diode 60 to approximately 60-200 μm, for example.

[0072] Also, it is possible to use a power source in the magnetic disk device for driving the laser diode 60. In fact, magnetic disk devices normally have a power source of approximately 5V, for example, which is a sufficient voltage for operating the laser oscillation. In addition, power consumption of the laser diode 60 is approximately several tens of mW, for example, which can be sufficiently covered by the power source in the magnetic disk device. In actual, the power source applies a predetermined voltage to the middle of the first drive terminal electrode 61 that is electrically connected to the lower electrode 60f and the second drive terminal electrode 62 that is electrically connected to the upper electrode 60e to oscillate the laser diode 60, and thereby the laser light is radiated from the aperture including the emission center 60h in the reflection layer 60g. Note, the laser diode 60 and the first and second drive terminal electrodes 61 and 62 are not limited to the above-described embodiment. For example, the electrodes may be positioned in a vertically reversed manner in the laser diode 60, and the upper electrode 60e may be joined to the light source installation surface 51b of the unit substrate 51. Also, it is possible to optically connect the laser diode and the waveguide 23 with each other by installing the laser diode on the element formation surface 11b of the thermally-assisted magnetic recording head 1. Moreover, it is possible for thermally-assisted magnetic recording head 1 to be provided without the laser diode 60 and to have the emission center of a laser diode provided in the magnetic disk device and the rear end surface 23a of the waveguide 23 that are connected with each other by an optical fiber or the like, for example.

[0073] The sizes of the slider 10 and the light source unit 50 are arbitrary; however, for example, the slider 10 may be also a so-called femto slider having a width of 700 μm in the track width direction (Y axis direction), a length of 850 μm (in Z axis direction), and a thickness of 230 μm (in X axis direction). In this case, the size of the light source unit 50 may be smaller than the size of the slider and may have a width of 425 μm in the track width direction, a length of 300 μm, and a thickness of 300 μm, for example.

[0074] By connecting the above-described light source unit 50 and slider 10, the thermally-assisted magnetic recording head 1 is configured. In this connection, the joining surface 51a of the unit substrate 51 and the back surface 11c of the slider substrate 11 are contacted to each other. At this time, the position of the unit substrate 51 and the slider substrate 11 are determined such that the laser light generated from the laser diode 60 enters into the rear end surface 23a of the waveguide 23 that is on the side opposite to the ABS 11a.

[0075] FIG. 5 is an enlarged cross-sectional view of the cross-section (XZ plane) of FIG. 4, and mainly schematically illustrates the configuration of the waveguide 23, the plasmon generator 24, and the pole 22c in the thermally-assisted magnetic recording head 1 according to the embodiment of the present invention.

[0076] As illustrated in FIG. 5, in the thermally-assisted magnetic recording head 1 in the present embodiment, the pole 22c includes the projection part opposing surface 22c₁ that opposes the projection part 241 (upper surface of the projection part), and the ninth insulating layer 32i and the insulating layer 32j are intervened between the pole 22c and the projection part 241 (upper surface of the projection part) of the plasmon generator 24. The projection part opposing surface 22c₁ is configured as an inclined surface, which is distant from the projection part 241 (upper surface of the projection part) of the plasmon generator 24 as approaching from a head part end surface 12a side toward a back side along the X axis direction (direction perpendicular to the head part end surface 12a). Note, in FIG. 5, the projection part opposing surface 22c₁ is illustrated in a planer shape; however, in the present invention, the projection part opposing surface 22c₁ is not limited to this form, and the projection part opposing surface 22c₁ may be also a curved surface that is curved in a projection shape or a concave shape to the plasmon generator 24 side.

[0077] The distance MO between an end part A and an end part B is preferably 5-30 nm, and further preferably 8-25 nm. The end part A is positioned on the head part end surface 12a side in the projection part opposing surface 22c₁ of the pole 22c. The end part B is positioned on the head part end surface 12a side in the projection part 241 (upper surface of the projection part) of the plasmon generator 24. When the distance MO is less than 5 nm, there is a risk that near-field light cannot be output in the magnetic disk 301 direction (−X direction); when the distance MO is in excess of 30 nm, there is a risk that the requirement for the high SN ratio may not be satisfied because the distance between the center of a magnetic field to be applied to the magnetic disk 301 and the center of near-field light to be irradiated becomes larger. In other words, when the distance MO is in the above-described range, near-field light that has been generated from a near-field light generating portion NFP (see FIG. 6 and FIG. 8) of the plasmon generator 24 to spread on the pole 22c side is shielded by the existence of the pole 22c. Therefore, the spot diameter of light irradiated to the magnetic disk 301 may be reduced, and also the requirement of high recording density and the high SN ratio may be satisfied.

[0078] On the cross-section illustrated in FIG. 5, a first segment VL1 is given which extends from another end part D positioned in the back side in the X axis direction (direction perpendicular to the head part end surface 12a) in the projection part opposing surface 22c₁ to the head part end surface 12a and is perpendicular to the head part end surface 12a; a second segment VL2 is given which extends from the end part D of the projection part opposing surface 22c₁ to the projection part 241 (upper surface of the projection part) of the plasmon generator 24 and is perpendicular to the projection part 241 (upper surface of the projection part). At this point, when the above-described distance MO is in the above-described range, a ratio of an area of a pole 22c part (substantially triangular shaped region formed by points A, C, and D) that exists in a region of a quadrilateral shape (substantial quadrilateral shaped region formed by points B, C, D, and E) that is surrounded by the first segment VL1, the second segment VL2, the projection part 241 (upper surface of the projection part) of the plasmon generator 24, and the head part end surface 12a to an area of the region of the quadrilateral shape is preferably 4-38%, and further preferably 10-30%. In the case where the area ratio is less than 4% when the above-described distance MO is shortened (0-4 nm), light (surface plasmon) propagating through the projection part 241 of the plasmon generator 24 is absorbed by the pole 22c, and thereby there is a risk that light intensity of near-field light irradiated to the magnetic disk 301 may reduce. On the other hand, when the above-described distance MO is lengthened such that the light (surface plasmon) is not absorbed by the pole 22c, the distance between the center of the magnetic field to be applied to the magnetic disk 301 and the center of the near-field light to be irradiated becomes larger, and thereby there is a risk that the requirement of high SN ratio may not be satisfied. When the area ratio is in excess of 38%, the thickness of the pole 22c in the X axis direction near the plasmon generator 24 becomes excessively thin. Thereby, a magnetic field is generated from a portion above the end part A; but not from the end part A that is positioned on the head part end surface 12a side of the projection part opposing surface 22c₁ of the pole 22c. As a result, the distance between the center of the magnetic field to be applied to the magnetic disk 301 and the center of the near-field light to be irradiated becomes larger, and therefore there is a risk that the requirement of high SN ratio may not be satisfied.

[0079] Between an rear end surface 22c₂ of the pole 22c and the end surface 23b of the waveguide 23 on the head part end surface 12a side, an insulating layer 32j formed of an insulating material such as Al₂O₃ (alumina) or the like is provided. As will be described later, in the manufacturing method of the thermally-assisted magnetic recording head 1 according to the present embodiment, when the insulating layer 32j is formed so as to be inclined toward the air bearing surface side, the pole 22c formed on the insulating layer 32j has the project part opposing surface 22c₁ that is configured as an inclined surface.

[0080] From the perspective of the head part end surface 12a side, the waveguide 23 is provided in the back side of the pole 22c along the Z axis direction so as to be hidden by the pole 22c. By providing the waveguide 23 in such position, it is possible to set the distance MO between the end part A positioned on the head part end surface 12a side in the projection part opposing surface 22c₁ of the pole 22c and the end part B positioned on the head part end surface 12a side in the projection part 241 (upper surface of the projection part) of the plasmon generator 24 within the above-described range, and it is also possible to set the distance between the waveguide 23 and the projection part 241 (upper surface of the projection) opposing the waveguide 23 such that it becomes possible for laser light propagating through the waveguide 23 to couple to the projection part 241 of the plasmon generator 24 in the surface plasmon mode.

[0081] FIG. 6 is a perspective view schematically illustrating a configuration of the waveguide 23, the plasmon generator 24, and the pole 22c in the thermally-assisted magnetic recording head 1 according to the present embodiment. In FIG. 6, the head part end surface 12a including a portion from which the writing magnetic field and the near-field light are radiated to the magnetic recording medium is positioned on the left side.

[0082] As illustrated in FIG. 6, the thermally-assisted magnetic recording head 1 according to the present embodiment is provided with the waveguide 23 for propagating laser light 63 for generating near-field light, and the plasmon generator 24 that includes the projection part 241 through which the surface plasmon excited by the laser light (waveguide light) 63 propagates. The projection part 241 opposes the lower surface of the waveguide 23 with a predetermined gap.

[0083] The plasmon generator 24 is provided with a near-field light generating end surface 24a that reaches the head part end surface 12a. Additionally, the portion that is sandwiched by a portion of an side surface of the waveguide 23 and a portion of an upper surface (side surface) including the projection part 241 of the plasmon generator 24 forms a buffer portion 40 (see FIG. 8). In other words, a portion of the projection part 241 is covered by the buffer portion 40. The buffer portion 40 functions to couple the laser light (waveguide light) 63 with the plasmon generator 24 in the surface plasmon mode. Additionally, the projection part 241 functions to propagate the surface plasmon excited by the laser light (waveguide light) 63 to the near-field light generating end surface 24a.

[0084] Note, side surfaces of the waveguide 23 refer end surfaces out of end surfaces surrounding the waveguide 23, excluding the end surface 23b positioned on the head part end surface 12a side and the rear end surface 23a opposite to the end surface 23b. The side surfaces of the waveguide 23 are the surfaces on which the laser light (waveguide light) 63 propagating through the waveguide 23 may totally reflect, and herein the waveguide 23 corresponds to a core. Note, in the present embodiment, the side surface of the waveguide 23 having a portion contacting the buffer portion 40 is the lower surface of the waveguide 23.

[0085] More specifically, the laser light (waveguide light) 63 that has propagated to the vicinity of the buffer portion 40 is coupled with the optical configuration of the plasmon generator 24 formed by the waveguide 23 having a predetermined refractive index n_WG, the buffer portion 40 having a predetermined refractive index n_BF, and the plasmon generator 24 made of a conductive material such as a metal or the like, and thereby the surface plasmon mode at the projection part 241 of the plasmon generator 24 is induced. In other words, the laser light (waveguide light) 63 is coupled with the plasmon generator 24 in the surface plasmon mode. It becomes possible to achieve this induction of the surface plasmon mode when the refractive index n_BF of the buffer portion 40 is set to be smaller than the refractive index n_WG of the waveguide 23 (n_BF<n_WG). Actually, evanescent light is excited in the buffer portion 40 based on the optical interfacial condition between the waveguide 23, which is the core, and the buffer portion 40. Then, the surface plasmon mode is induced such that the evanescent light and a fluctuation of charges excited on the surface (projection part 241) of the plasmon generator 24 are coupled with each other, and surface plasmon 70 is excited (see FIG. 8). Herein, the projection part 241 is in the closest position to the waveguide 23 and also the width in the Y axis direction is extremely small, so that an electrical field is more likely to be concentrated. Accordingly, the surface plasmon 70 is more likely to be excited.

[0086] A gap G (see FIG. 8) between the lower surface of the waveguide 23 (opposing surface to the plasmon generator 24) and the upper surface of the projection part 241 of the plasmon generator 24 (opposing surface to the waveguide 23) is preferably 15-40 nm, and further preferably 25-30 nm. When the gap G is within the above-described range, it is possible to increase light density and to decrease the light spot diameter of the near-field light irradiated to the magnetic disk 301.

[0087] As illustrated in FIG. 6, the plasmon generator 24 has a plane part 240 and the projection part 241 that is projected from the plane part 240 to the waveguide 23 side, and an end surface that forms a part of the head part end surface 12a is the near-field light generating end surface 24a.

[0088] As is made clear in FIG. 6, a portion of the projection part 241 opposes the waveguide 23 with the buffer portion 40 therebetween, and is elongated to the near-field light generating end surface 24a. Thereby, the projection part 241 can realize the function to propagate the surface plasmon excited by the laser light (waveguide light) that has propagated through the waveguide 23. In other words, the plasmon generator 24 is coupled with the waveguide light in the surface plasmon mode, and propagates the surface plasmon onto the projection part 241. As a result, near-field light is generated from the near-field light generating portion NFP on the near-field light generating end surface 24a.

[0089] The projection height T_PGC of the projection part 241 is preferably 15-45 nm. Also, the width W_PGC of the near-field light generating end surface 24a of the projection part 241 in the Y axis direction is smaller than the wavelength of the laser light (waveguide light) 63, and is preferably 15-30 nm. Also, from the perspective of the air bearing surface side where the waveguide 23 is positioned on the trailing side with respect to the plasmon generator 24, the height T_PG from a lower end of the plane part 240 to the upper end (upper surface) of the projection part 241 is preferably 65-205 nm, and further preferably approximately 130 nm. Furthermore, the length H_PG of the plasmon generator 24 in the X axis direction is preferably 1.0-1.4 μm, and further preferably approximately 1.2 μm. When the plasmon generator 24 and the projection part 241 have the above-described size, it is possible to decrease the light spot diameter of the near-field light irradiated to the magnetic disk 301.

[0090] In the present embodiment, the shape of the upper surface of the projection part 241 is a rectangle; however, is not limited to this shape. For example, as illustrated in FIG. 7A, the shape of the upper surface of the projection part 241 may be a trapezoidal shape that is formed by a short side positioned on the head part end surface 12a, a long side positioned on the head part rear end surface 12b side, and two inclined sides that respectively connect end parts of the sides. Therein, the width in the Y axis direction gradually gets wider as approaching from the head par end surface 12a toward the head part rear end surface 12b side. Also, as illustrated in FIG. 7B, the shape of the upper surface of the projection part 241 may be the shape where the width in the Y axis direction gradually gets wider as approaching from the head part end surface 12a toward the back side in the X axis direction to a predetermined position and gets constant from the predetermined position to the head part rear end surface 12b side. Furthermore, as illustrated in FIG. 7C, the shape of the upper surface of the projection part 241 may be also a substantially triangular shape where its apex is positioned on the head part end surface 12a and the width in the Y axis direction gradually gets wider as approaching toward the head part rear end surface 12b side. When the shape of the upper surface of the projection part 241 is any one of the above-described shapes, it is possible to increase the light density of the near-field light irradiated to the magnetic disk 301 and to reduce the light spot diameter. As illustrated in FIG. 7A, the angles θ formed respectively by the two inclined sides of the trapezoid in the upper surface of the projection part 241 and the X axis are preferably less than 10 degree, further preferably 1-3 degree, and extremely preferably approximately 2 degree.

[0091] The plane part 240 of the plasmon generator 24 can function to release heat generated at the near-field light generating portion NFP on the near-field light generating end surface 24a of the plasmon generator 24 from the near-field light generating portion NFP. As a result, this can contribute to suppress the excessive temperature increase of the plasmon generator 24 and to prevent an unnecessary projection of the near-field light generating end surface 24a and a significant reduction in light usage efficiency of the plasmon generator 24.

[0092] The plasmon generator 24 is preferably formed of a conductive material such as a metal (e.g., Pd, Pt, Rh, Ir, Ru, Au, Ag, Cu or Al) or an alloy made of at least two types of these metals.

[0093] The waveguide 23 is provided in a position recessed more than the pole 22c in the X axis direction (height direction) with a predetermined gap from the rear end surface 22c₂ (see FIG. 5) of the pole 22c. Then, between the rear end surface 22c₂ of the pole 22c and the end surface 23b of the waveguide 23, the insulating layer 32j (see FIG. 5) is provided. With such configuration, the waveguide 23 and the pole 22c can be positionally separated from each other. As a result, a case can be avoided, in which a portion of the laser light (waveguide light) 63 is absorbed by the pole 22c formed of a metal so that the amount of light to be converted to the near-field light decreases.

[0094] Regarding the shape of the waveguide 23, the width in the track width direction (Y axis direction) may be constant; however, as illustrated in FIG. 6, the width may get wider as approaching from the end surface 23b of the waveguide 23 toward the back side in the X axis direction (height direction). The width in the track width direction (Y axis direction) of the rear end surface 23a of the waveguide 23 may be, for example, approximately 0.5-20 μm; the width in the track width direction (Y axis direction) of the end surface 23b may be, for example, approximately 0.3-10 μm; the thickness in the Z axis direction may be approximately 0.1-4 μm; the length in the X axis direction may be, for example, approximately 10-300 μm.

[0095] The upper surface of the waveguide 23 contacts the protective layer 31 (see FIG. 4); the lower surface and both end surfaces in the track width direction (Y axis direction) of the waveguide 23 contact the ninth insulating layer 32i (see FIG. 4). Herein, the waveguide 23 is configured of a material with a refractive index n_WG that is higher than a refractive index n_IS of the configuration material of the ninth insulating layer 32i and the protective layer 31. For example, in case where the wavelength λ_L of the laser light is 600 nm when the ninth insulating layer 32i and the protective layer 31 are formed of SiO₂ (silicon dioxide; n=1.46), the waveguide 23 may be formed of Al₂O₃ (alumina; n=1.63). Furthermore, when the ninth insulating layer 32i and the protective layer 31 are formed of Al₂O₃ (n=1.63), the waveguide 23 may be formed of SiO_xN_y (n=1.7-1.85), Ta₂O₅ (n=2.16), Nb₂O₅ (n=2.33), TiO (n=2.3-2.55) or TiO₂ (n=2.3-2.55). When the waveguide 23 is formed of such materials, propagation loss of the laser light (waveguide light) 63 can be suppressed low due to excellent optical characteristics that the materials themselves have. Further, while the waveguide 23 functions as a core, the ninth insulating layer 32i and the protective layer 31 function as a cladding, so that the condition for total reflection off all of the side surfaces is established. As a result, more laser light (waveguide light) 63 reaches the position of the buffer portion 40, and the propagation efficiency of the waveguide 23 increases.

[0096] Further, the waveguide 23 may have a multilayered structure of dielectric materials. In the multilayered structure, the upper portion the layers are positioned in, the higher the refractive index n becomes. For example, such a multilayered structure is realized by sequentially laminating dielectric materials of which the values of a composition ratio (X, Y) in SiO_xN_y are appropriately varied. The number of laminated layers may be 8-12 layers, for example. As a result, when the laser light (waveguide light) 63 is linearly polarized light in the Z axis direction, it becomes possible to propagate the laser light (waveguide light) 63 farther toward the buffer portion 40 side in the Z axis direction. At that time, by selecting the composition of each layer in the multilayered structure, the layer thickness, and the number of layers, the preferred propagation position for the laser light (waveguide light) 63 in the Z axis direction can be obtained.

[0097] The buffer portion 40 is formed of a dielectric material having a refractive index n_BF that is lower than the refractive index n_WG of the waveguide 23. For example, when the wavelength λ_L of the laser light is 600 nm and the waveguide 23 is formed of Al₂O₃ (alumina; n=1.63), the buffer portion 40 may be formed of SiO₂ (silicon dioxide; n=1.46). In addition, when the waveguide 23 is formed of Ta₂O₅ (n=2.16), the buffer portion 40 may be formed of SiO₂ (n=1.46) or Al₂O₃ (n=1.63). In these cases, the buffer portion 40 may be configured as a part of the ninth insulating layer 32i (see FIG. 4) formed of SiO₂ (n=1.46) or Al₂O₃ (n=1.63) and functioning as a cladding. Moreover, the length L_BF (see FIG. 8) in the X axis direction of the buffer portion 40, which is a portion sandwiched by the lower surface of the waveguide 23 and the projection part 241, is preferably 0.5-5 μm and is preferably larger than the wavelength 4 of the laser light (waveguide light) 63. In this case, the buffer portion 40 has a significantly larger region compared to the so-called “focal region” formed when the laser light is focused at the buffer portion 40 and the plasmon generator 24 for being coupled in the surface plasmon mode. This enables extremely stable coupling in the surface plasmon mode. The thickness T_BF (see FIG. 8) in the Z axis direction of the buffer portion 40 is preferably 10-200 nm. These length L_BF and thickness T_BF of the buffer portion 40 are important parameters for obtaining appropriate excitation and propagation of the surface plasmon.

[0098] Next, the description is given of the function of the thermally-assisted magnetic recording head 1 having the above-described configuration according to the present embodiment. FIG. 8 is a schematic view for explaining thermally-assisted magnetic recording that uses a surface plasmon mode in the thermally-assisted magnetic recording head 1 according to the present embodiment.

[0099] As illustrated in FIG. 8, during the writing to a magnetic recording layer of the magnetic disk 301 by the electromagnetic transducer element 22, laser light (waveguide light) 63 radiated from the laser diode 60 in the light source unit 50 initially propagates through the waveguide 23. Next, the laser light (waveguide light) 63 that has propagated to the vicinity of the buffer portion 40 is coupled with the optical configuration of the waveguide 23 having a predetermined refractive index n_WG, the buffer portion 40 having a predetermined refractive index n_BF, and then the plasmon generator 24 made of a conductive material such as metal or the like, and the surface plasmon mode is induced at the projection part 241 of the plasmon generator 24. That is, the laser light (waveguide light) 63 is coupled with the plasmon generator 24 in the surface plasmon mode. Actually, evanescent light is excited in the buffer portion 40 based on the optical interfacial condition of the waveguide 23, which is the core, and the buffer portion 40. Then, the surface plasmon mode is induced such that the evanescent light and fluctuation of charges excited at the metal surface (projection part 241) of the plasmon generator 24 are coupled with each other, and the surface plasmon is excited. Note, more precisely, since the surface plasmon that is elementary excitation is coupled with electromagnetic wave in this system, surface plasmon.polariton is excited. However, hereinafter, the surface plasmon.polariton is referred to as surface plasmon for short. The excitation of the surface plasmon mode can be achieved by setting the refractive index n_BF of the buffer portion 40 smaller than the refractive index n_WG of the waveguide 23 (n_BF<n_WG) and by appropriately selecting the length L_BF of the buffer portion 40 in the X axis direction, which is in other words the length of the coupling portion of the waveguide 23 and the plasmon generator 24, and the thickness T_BF (gap G between the waveguide 23 and the projection part 241: preferably 15-40 nm and further preferably 25-30 nm) of the buffer portion 40 in the Z axis direction.

[0100] In the excited surface plasmon mode, the surface plasmon 70 is excited on the projection part 241 of the plasmon generator 24 to propagate on the projection part 241 along the direction of an arrow 71. Since the projection part 241 does not contact the pole 22c, the projection part 241 does not receive bad effects from the pole 22c even when adjustment for efficient excitation of the surface plasmon has not done. As a result, it becomes possible to intentionally propagate the surface plasmon on the projection part 241.

[0101] As described above, by the surface plasmon 70 propagating on the projection part 241 in the direction of the arrow 71, the surface plasmon 70, which is in other words a electric field, is concentrated in the near-field light generating portion NFP on the near-field light generating end surface 24a that is reached to the head part end surface 12a and that is an end of the projection part 241. As a result, the near-field light 72 is generated from the near-field light generating portion NFP. The near-field light 72 is irradiated toward the magnetic recording layer of the magnetic disk 301, reaches the surface of the magnetic disk 301, and heats the portion of the magnetic recording layer of the magnetic disk 301. Thereby, the anisotropic magnetic field (coercive force) of the portion is reduced to the value that allows the writing, and the writing is performed by the magnetic field that has been applied to the portion.

[0102] Herein, in the present embodiment, the distance MO (see FIG. 5) between the end part A and the end part B is set to be shorter in comparison with a conventional thermally-assisted magnetic recording head (5-30 nm). The end part A is positioned on the head part end surface 12a side in the projection part opposing surface 22c₁ of the pole 22c. The end part B is positioned on the head part end surface 12a side in the projection part 241 (upper surface of the projection part) of the plasmon generator 24. Generally, when the distance MO is shortened, light (surface plasmon) propagating through the projection part 241 of the plasmon generator 24 is more likely to be absorbed by the pole 22c, and thereby there is a risk that the light intensity of the near-field light generated from the near-field light generating portion NFP may reduce. However, in the present embodiment, the projection part opposing surface 22c₁ of the pole 22c is configured as an inclined surface that separates from the projection part 241 (upper surface of the projection part) of the plasmon generator 24 as approaching from the head part end surface 12a side toward the back side along the X axis direction (direction perpendicular to the ABS 11a). Therefore, it becomes possible to restrain the light (surface plasmon) from being absorbed by the pole 22c and to generate near-field light with a light intensity that is sufficient to reduce the anisotropic magnetic field of the magnetic disk 301. As a result, according to the thermally-assisted magnetic recording head 1 of the present embodiment, it enables a steep magnetization reversal between adjacent magnetic domains of the magnetic disk 301, so that it becomes possible to satisfy the requirement of high recording density and high SN ratio.

[0103] Also, when the distance MO is short (5-30 nm), near-field light that is generated from the near-field light generating portion NFP of the plasmon generator 24 and then spreads on the pole 22c side is shielded by the existence of the pole 22c. Therefore, the spot diameter of light to be irradiated to the magnetic disk 301 may be reduced. Further, when the plasmon generator 24 in the present embodiment has the plane part 240 and the projection part 241 projected to the waveguide 23 side, the light density of the near-field light generated from the near-field light generating portion NFP of the projection part 241 and irradiated to the magnetic disk 301 may be increased and the light spot diameter may be reduced. Therefore, it becomes possible to comply with the further higher recording density.

[0104] Furthermore, due to the generation of the near-field light 72, heating occurs in the vicinity of the near-field light generating portion NFP of the near-field light generating end surface 24a; however, the heat dissipates into the plane part 240 of the plasmon generator 24. As a result, this can contribute to suppress the excessive temperature increase of the plasmon generator 24 and to prevent an unnecessary projection of the near-field light generating end surface 24a and a significant reduction in light usage efficiency of the plasmon generator 24. Further, because the pole 22c and the plasmon generator 24 are not contacted to each other, it is possible to suppress heat dissipation into the pole 22c side and also to suppress the deterioration or the like of the pole 22c due to the heat dissipation into the pole 22c side.

[0105] The thermally-assisted magnetic recording head having the above-described configuration can be manufactured as will be described below.

[0106] FIGS. 9A-9K are perspective views mainly schematically illustrating steps of forming the plasmon generator 24, the pole 22c, and the waveguide 23 of the thermally-assisted magnetic recording head 1 according to the present embodiment.

[0107] As illustrated in FIG. 9A, a metal layer 90 with a predetermined thickness (for example, approximately 60 nm) made of Au or Au alloy, etc. is formed by using, for example, a sputtering method on the eighth insulating layer 32h made of Al₂O₃, SiO₂, or the like. The metal layer 90 eventually becomes the plasmon generator 24.

[0108] Next, a photoresist film is formed so as to cover the metal layer 90, and then patterning is performed. As illustrated in FIG. 9B, by using a remaining photoresist film as a mask, etching is performed using a dry etching method such as ion milling or the like such that the thickness of the metal layer 90 in the portion on which the photoresist film does not exist becomes a predetermined thickness (for example, approximately 30 nm). As described above, the plasmon generator 24 including the plane part 240 and the projection part 241 is formed.

[0109] Next as illustrated in FIG. 9C, Al₂O₃, SiO₂, or the like is refilled so as to embed it on the plane part 240 of the plasmon generator 24 to form insulating layers 91, and the remaining photoresist film is peeled. Then, as illustrated in FIG. 9D, an insulating layer 92 formed of Al₂O₃, SiO₂, or the like is formed on the upper surface of the projection part 241 and the insulating layers 91 by using, for example, a sputtering method. A portion of the insulating layer 92 eventually becomes a gap between the waveguide 23 and the plasmon generator 24 (projection part 241), which is the buffer portion 40. Because the thickness of the insulating layer 92 affects the coupling efficiency of the laser light (waveguide light) 63 at the projection part 241 of the plasmon generator 24, it is required to control a film formation thickness of the insulating layer 92 to be an appropriate thickness.

[0110] Next as illustrated in FIG. 9E, TaO_x layer 93 is formed on the insulating layer 92, a photoresist film 94 is formed on the TaO_x layer 93, and then patterning is performed. The TaO_x layer 93 positioned directly below the photoresist film 94 that remains as described above eventually becomes the waveguide 23.

[0111] Next as illustrated in FIG. 9F, by using the remaining photoresist film 94 as a mask, etching is performed on the portions of the TaO_x layer 93 on which the photoresist film 94 does not exist using a dry etching method such as ion milling. Then, the remaining photoresist film 94 is peeled, insulating layers 95 formed of Al₂O₃, SiO₂, or the like are formed in the portions where the TaO_x layer 93 has been etched using, for example, a sputtering method or the like, and planarization is performed using a polishing method such as chemical mechanical polishing (CMP) or the like.

[0112] Next as illustrated in FIG. 9G, a photoresist film 96 is formed on the remaining TaO_x layer 93 and the insulating layers 95, and then patterning is performed. As illustrated in FIG. 9H, a portion of the TaO_x layer 93 and the insulating layer 92 directly below the TaO_x layer 93 are etched using a dry etching method such as ion milling, and the remaining photoresist film 96 is peeled. In a chamfer part that has been formed by the etching, the pole 22c is eventually to be embedded, and the remaining TaO_x layer 93 eventually becomes the waveguide 23. Note, when the distance MO between the end part A positioned on the head part end surface 12a side on the projection part opposing surface 22c₁ of the pole 22c and the end part B positioned on the head part end surface 12a side at the projection part 241 (upper surface of the projection part) of the plasmon generator 24 is set to be shorter than the thickness of the buffer portion 40 (see FIG. 5), etching is performed on the TaO_x layer 93 and also on the insulating layer 92 directly below the TaO_x layer 93. However, when the distance MO is set to be thicker than the thickness of the buffer portion 40, there is no need to perform etching on the insulating layer 92 directly below the TaO_x layer 93.

[0113] Then as illustrated in FIG. 9I, using the CVD method or the like, an insulating layer formed of Al₂O₃, SiO₂, or the like is formed and then etching is performed using a dry etching method such as ion milling or the like, and then an insulating layer 32j is formed. At this time, when the insulating layer 32j positioned on a lower surface side (on the insulating layer 92) of the chamfer part is inclined downward to the air bearing surface 11a side and the pole 22c is embedded in the chamfer part, the insulating layer formed of Al₂O₃, SiO₂, or the like by the CVD method or the like is etched such that the ratio of the area of the portion of the pole 22c (substantially triangular shaped region formed by points A, C, and D) included in the region of the quadrilateral shape (substantially quadrilateral shaped region formed by points B, C, D, and E) illustrated in FIG. 5 to the area of the region of the quadrilateral shape becomes in the predetermined range (preferably 4-38%).

[0114] Next, as illustrated in FIG. 9J, a magnetic material such as FeCo or the like is plated to the chamfer part, planarization is performed using a polishing method such as chemical mechanical polishing (SMP) or the like, and then the pole 22c is formed. Lastly, as illustrated in FIG. 9K, a magnetic material such as FeCo or the like is plated in a manner of covering the pole 22c to form the upper yoke layer 22d, the protective layer 31 formed of Al₂O₃ (alumina) or SiO₂ is formed using, for example, a sputtering method or the like, and then planarization is performed using a polishing method such as chemical mechanical polishing (CMP) or the like. As described above, the head part 12 in the present embodiment can be manufactured.

[0115] The above-described embodiment is provided for a clear understanding of the present invention, and is not provided to limit the present invention. Therefore, each of the elements disclosed in the above-described embodiment also includes any design changes and equivalents thereof that belong to the technical scope of the present invention.

[0116] In the thermally-assisted magnetic recording head 1 according to the above-described embodiment, as illustrated in FIG. 10, a pair of heat dissipation parts HS may be provided, which are formed upright on the plane part 240 of the plasmon generator 24 so as to sandwich the pole 22c, the upper yoke layer 22d, and the waveguide 23 in the Y axis direction. When the thermally-assisted magnetic recording head 1 is provided with the heat dissipation parts HS, it becomes possible to release heat generated at the near-field light generating portion NFP to the heat dissipation parts HS through the plane part 240. This allows to suppress the excessive temperature increase in the plasmon generator 24 and this also contributes to prevent an unnecessary projection of the near-field light generating end surface 24a and a significant reduction in light usage efficiency of the plasmon generator 24. In this case, the heat dissipation parts HS are preferably formed of a conductive material such as a metal (e.g., Pd, Pt, Rh, Ir, Ru, Au, Ag, Cu, W, Mo, Ta or Al) or an alloy made of at least two types of these metals. Namely, the lengths of the heat dissipation parts HS in the X axis direction, the Y axis direction, and the Z axis direction are not particularly limited as long as it is possible to efficiently release the heat generated at the near-field light generating portion NFP.

[0117] Also, in the above-described embodiment, the shape of the projection part 241 is rectangular when the projection part 241 projected from the plane part 240 of the plasmon generator 24 is viewed from the head part end surface 12a side; however, the present invention is not limited to such form. The shape of the projection part 241 when the projection part 241 is viewed from the head part end surface 12a side may be substantially trapezoidal or substantially invertedly trapezoidal; the shape of an angle at the intersection of the side (side in the Z axis direction) of the projection part 241 when the projection part 241 is viewed from the head part end surface 12a side and the plane part 240 may be curved.

[0118] Furthermore, in the step illustrated in FIG. 9H of the manufacturing method of the thermally-assisted magnetic recording head 1 according to the above-described embodiment, the TaOx layer 93 and the insulating layer 92 may be etched such that the lower surface of the chamfer part formed by etching the TaOx layer 93 and the insulating layer 92 becomes an inclined surface that separates from the projection part 241 (upper surface of the projection part) of the plasmon generator 24 as approaching from the head part end surface 12a side toward the back side along the X axis direction (direction perpendicular to the ABS 11a) and such that the ratio of the area of the pole 22c part (substantially triangular shaped region formed by points A, C, and D) that is included in the region of the quadrilateral shape substantially quadrilateral shaped region formed by points B, C, D, and E) illustrated in FIG. 5 to the area of the region of the quadrilateral shape when the pole 22c is embedded in the chamfer part becomes in the predetermined range (preferably 4-38%). In this case, in the step illustrated in FIG. 9I, it is not required to perform etching on the insulating layer formed by a CVD method or the like.

[0119] Hereinafter, further detailed description of the present invention will be given showing experimental examples; however, the present invention is not particularly limited to the experimental examples, which will be described below.

[0120] In the thermally-assisted magnetic recording head 1 illustrated in FIG. 5 and FIG. 6, a simulation analysis experiment was performed as will be described below on the relation between a SN ratio of magnetic recording signal and a ratio (AR) of the area of the pole 22c part (substantially triangular shaped region formed by points A, C, and D illustrated in FIG. 5) that is included in a predetermined region (substantially quadrilateral shaped region formed by points B, C, D, and E illustrated in FIG. 5) in the cross section (XZ plane) that comes across the pole 22c and the projection part 241 of the plasmon generator 24 to the area of the predetermined region.

[0121] The simulation analysis experiment was performed using a finite-difference time-domain method (FDTD method) of three dimension, which is an electromagnetic field analysis.

[0122] As the thermally-assisted magnetic recording head 1 in the present experimental example, a model with the pole 22c formed of a FeCo alloy was adopted. In the model, a projection height T_PGC of the projection part 241 of the plasmon generator 24 was set to 30 nm; a height T_PG from the lower surface of the plane part 240 to the upper surface of the projection part 241 was set to 130 nm; a width W_PGC of the projection part 241 in the Y axis direction on the near-field light generating end surface 24a was set to 30 nm; a length H_PG of the plasmon generator 24 in the X axis direction was set to 1.2 μm; the gap G (thickness T_BF of the buffer portion 40 in the Z axis direction) between the waveguide 23 and the projection part 241 was set to 25 nm; the wavelength of laser light (waveguide light) was set to 797 nm. Furthermore, the winding number of the writing coil 22b was set to three; input current value was set to 40 mA.

[0123] Then, the length of the second segment VL2 (length of the segment DE) was given as MO2 (see FIG. 5). The second segment VL2 extends from the end part D positioned at the back side in the X axis direction (direction perpendicular to the head part end surface 12a) in the projection part opposing surface 22c₁ of the pole 22c to the projection part 241 (upper surface of the projection part) of the plasmon generator 24 and the second segment VL2 is orthogonal to the projection part 241 (upper surface of the projection part). In respective cases when the length MO2 is 10 nm, 25 nm, or 40 nm, the distance MO (see FIG. 5) was changed to vary the area ratio (AR), and then the relation between the SN ratio (SNR) and the area ratio (AR) was calculated by the simulation analysis.

[0124] The result of the above-described simulation analysis experiment was given in FIG. 11. FIG. 11 is a graph showing the result of the simulation analysis experiment. Note, in the graph shown in FIG. 11, the SN ratio (SNR) in the Y axis is represented by the relative value that is based on the SN ratio (SNR) set to 100% when the projection part opposing surface 22_C1 of the pole 22c is parallel to the upper surface of the projection part 241 of the plasmon generator 24 but is not configured as an inclined surface (the area ratio (AR)=0%).

[0125] As illustrated in FIG. 11, when the projection part opposing surface 22c₁ of the pole 22c was configured as the inclined surface that separates from the projection part 241 (upper surface of the projection part) of the plasmon generator 24 as approaching from the head part end surface 12a side toward the back side along the X axis direction (direction perpendicular to the head part end surface 12a); the distance MO between the end part A positioned on the head part end surface 12a side on the projection part opposing surface 22c₁ of the pole 22c and the end part B positioned on the head part end surface 12a side on the projection part 241 (upper surface of the projection part) of the plasmon generator 24 was set to 5-30 nm; the above-described area ratio AR was set to 4-38%, this allows to achieve even steeper magnetization reversal in adjacent magnetic domains of the magnetic recording medium and it is understood that it is possible to simultaneously satisfy the requirements on the high SN ratio and high recording density.