Light emitting diode structure having a textured package lens

[0001] 1. Field of the Invention

[0002] This invention generally relates to a light emitting diode structure. More particularly, this invention relates to a light emitting diode structure for providing a more uniform light and a method of forming the same.

[0003] 2. Description of the Prior Art

[0004] Light emitting diodes are small in volume and low consumption in energy. Therefore, light emitting diodes are widely used as the light sources of many electronic devices, including liquid crystal display.

[0005] As shown in FIG. 1, a conventional light emitting diode structure 10 includes a base 30, a diode chip 50, and a package lens 70. The diode chip 50 is mounted on the base 30. The package lens 70 covers the diode chip 50.

[0006] As shown in FIG. 1, the light 200 emitted from the diode chip 50 has no significant change after passing the package lens 70. More particularly, since the surface of the package lens 70 is far larger than the diode chip 50 and the emitting angle of the light 200 emitted from the diode chip 500 is limited, the light 200 emitted from the diode chip 500 is non-uniformly distributed on the surface of the package lens 70. Therefore, the conventional light emitting diode structure 10 is still improvable.

[0007] It is an object of the present invention to provide a light emitting diode structure having a larger light emitting angle.

[0008] It is another object of the present invention to provide a light emitting diode structure having a more uniform light.

[0009] It is another object of the present invention to provide a light emitting diode structure forming method for increasing the light emitting angle.

[0010] It is another object of the present invention to provide a light emitting diode structure forming method for enhancing the uniformity of the light distribution.

[0011] The light emitting diode structure of the present invention includes a base, a diode chip, and a package lens. The diode chip is mounted on the base. The package lens covers the diode chip. The surface of the package lens includes a plurality of dot structures.

[0012] The surface of the package lens is curved or flat. The plurality of dot structures and the package lens are integrally formed into a single piece. In other embodiments, the plurality of dot structures are attached to the surface of the package lens. The plurality of dot structures are selected from a group consisting of a circle, a rectangle, a regular polygon, and a polygon. The plurality of dot structures are embossed structures. The embossed structures are selected from a group consisting of a hemisphere, a cone, a pyramid, and a prism. The distribution density of the plurality of dot structures is uniform. In other embodiments, the distribution density of the plurality of dot structures can be gradually increased or decreased with respect to the central location of the diode chip

[0013] The steps of the method include mounting a light emitting diode chip on a base, assembling a package lens to cover the light emitting diode chip, and forming a plurality of dot structures on the surface of the package lens.

[0014] The plurality of dot structures forming step includes forming the dot structures on the surface of the package lens by coating, spraying, or screen printing. The step of forming the plurality of dot structures on the surface of the package lens can further include uniformly distributing the dot structures on the surface of the package lens or increasing the distribution density of the plurality of dot structures on the surface of the package lens corresponding to the central location of the diode chip.

[0025] The present invention provides a light emitting diode structure and a light emitting diode structure forming method. In a preferred embodiment shown in FIG. 2, the light emitting diode structure 100 includes a base 300, a diode chip 500, and a package lens 700. The diode chip 500 is mounted on the base 300. The package lens 700 covers the diode chip 500, wherein the surface of the package lens 700 includes a plurality of dot structures 710. In this embodiment, the package lens 700 has a flat surface. In other embodiments shown in FIG. 3, however, the package lens 700 has a curved surface.

[0026] In the preferred embodiment shown in FIG. 2, the plurality of dot structures 710 and the package lens 700 are integrally formed into a single piece. In another embodiment, as shown in FIG. 4, however, the plurality of dot structures 710 are attached to the surface of the package lens 700 by coating, spraying, or screen printing. The plurality of dot structures 710 are selected from a group consisting of a circle, a rectangle, a regular polygon, and a polygon, wherein the top face of the plurality of dot structures 710 are preferably convex. In other embodiments, however, the top face of the plurality of dot structures 710 may be flat, concave, or rugged.

[0027] In another embodiment, as shown in FIG. 5, the plurality of dot structures 710 are embossed structures. Different from the embodiment shown in FIG. 4, the plurality of dot structures 710 are pillars protruding from the surface of the package lens 700. Therefore, the light reflection and light interference between the plurality of dot structures 710 are more significant. The embossed structures, i.e. the plurality of dot structures 710, are selected from a group consisting of a hemisphere, a cone, a pyramid, and a prism.

[0028] The area of the plurality of dot structures 710 on the surface of the package lens 700 can be modified in accordance with design requirements. As shown in FIG. 6A, which is a top view of the preferred embodiment shown in FIG. 2, the dot structures 710 located near the region corresponding to the central location of the diode chip 500 have a larger area. However, in other embodiments, the plurality of dot structures 710 may have a same area as shown in FIG. 6B, or have a different area in a different region. For example, the area of the plurality of dot structures 710 may be gradually increased or decreased with respect to the central location of the diode chip 500 or the dot structures 710 may be divided into several groups by block. In this way, the dot structures 710 in different blocks may have different areas. By adjusting the area of the dot structures 710 at different locations, the emitting angle and the uniformity of the light emitted from the diode chip 500 can be modified.

[0029] The distribution density of the plurality of dot structures 710 on the surface of the package lens 700 can be modified in accordance with design requirements. In other words, the manner how the plurality of dot structures 710 disposed on the surface of the package lens 700 can be changed in accordance with distribution density requirements. As shown in FIG. 6B, the distribution density of the dot structures 710 is uniform. Therefore, the dot structures 710 are uniformly distributed on the surface of the package lens 700. However, in another embodiment shown in FIG. 6C, the distribution density of the plurality of dot structures 710 is increased toward the central location of the diode chip 500. In other words, the distribution of the dot structures 710 on the surface of the package lens which corresponds to the central location of the diode chip 500 is more dense. In another embodiment, the distribution density of the plurality of dot structures 710 is decreased toward the central location of the diode chip 500. In still another embodiment, the plurality of dot structures 710 are divided into several groups by block, wherein the dot structures 710 in different blocks have different distribution densities. By adjusting the distribution density of the dot structures 710 at different locations, the emitting angle and the uniformity of the light emitted from the diode chip 500 can be modified.

[0030] A schematic light emission diagram of the light emitting diode structure 100 of the present invention is shown in FIG. 7. By disposing the dot structures 710 on the surface of the package lens 700, the emitting angle and the uniformity of the light emitted from the diode chip 500 can be modified. More particularly, the light 200 emitted from the diode chip 500 changes the emitting angle after passing through and being refracted by the dot structures 710 of the surface of the package lens 700. Therefore, the light emitted from the light emitting diode structure 100 of the present invention is more uniform. On the other hand, the emitting angle of the light emitted from the diode chip 500 can be further modified by modifying the configuration, the area, or the distribution density of the dot structures 710.

[0031] A flow chart of the light emitting diode structure forming method of the present invention is shown in FIG. 8, wherein the light emitting diode structure forming method includes the following steps.

[0032] Step 3001, a step of mounting a diode chip on a base is performed. The diode chip may include different color types of light emitting diode chips, such as a blue type, a yellow type, a red type, etc.

[0033] Step 3003, a step of assembling a package lens to cover the diode chip is performed. The surface of the package lens can be curved or flat. Materials, such as a fluorescent material, can be added into the package lens to change the optical characteristics of the light according to different design needs.

[0034] Step 3005, a step of forming a plurality of dot structures on the surface of the package lens is performed. The plurality of dot structures can be attached to the surface of the package lens by coating, spraying, or screen printing, wherein the plurality of dot structures are selected from a group consisting of a circle, a rectangle, a regular polygon, and a polygon. On the other hand, the dot structures are embossed structures, wherein the embossed structures are selected from a group consisting of a hemisphere, a cone, a pyramid, and a prism.

[0035] The step of forming the dot structures on the surface of the package lens can further include designing the area and the distribution location of the dot structures in accordance with the distribution density of the dot structures. For example, the area of the dot structures may be gradually increased or decreased with respect to the central location of the diode chip or the dot structures may be divided into several groups by block. In this way, the dot structures 710 in different blocks have different areas. Moreover, the step of forming the dot structures on the surface of the package lens can further include uniformly distributing the dot structures on the surface of the package lens or increasing or decreasing the distribution density of the plurality of dot structures on the surface of the package lens with respect to the central location of the diode chip to meet the scattering or the uniformity requirements. For example, the distribution density of the dot structures is decreased or increased with respect to the central location of the diode chip. Alternatively, the dot structures 710 are divided into several groups by block, wherein the dot structures in different blocks have different distribution densities.

[0036] Although the preferred embodiments of the present invention have been described herein, the above description is merely illustrative. Further modification of the invention herein disclosed will occur to those skilled in the respective arts and all such modifications are deemed to be within the scope of the invention as defined by the appended claims.