US 7,480,130 B2Grant

Wet electrolytic capacitor

Issue Date:2009-01-20

•34 Claims

•6 Drawing Sheets

Abstract

A wet electrolytic capacitor that includes an anode, cathode, and an electrolyte is provided. The cathode contains a plurality of metal particles disposed on a surface of a substrate and sinter bonded thereto. The metal particles have a median size of from about 20 to about 500 micrometers.

Metadata

Assignee

AVX Corporation

Inventors

James Allen Fife
Zebbie Lynn Sebald
Gang Ning

Application Information

Application Number:US 11/372,461

Filing Date:2006-03-09

Priority Date:2006-03-09

Art Unit:2831

Classifications

IPC:

H01G9/04H01G9/145

Patent Drawings (6 sheets)

Description

BACKGROUND OF THE INVENTION

[0001] Electrolytic capacitors are increasingly being used in the design of circuits due to their volumetric efficiency, reliability, and process compatibility. Electrolytic capacitors typically have a larger capacitance per unit volume than certain other types of capacitors, making them valuable in relatively high-current and low-frequency electrical circuits. One type of capacitor that has been developed is a wet electrolytic capacitor that includes an anode, a cathode current collector (e.g., aluminum can), and a liquid or “wet” electrolyte. Wet electrolytic capacitors tend to offer a good combination of high capacitance with low leakage current and a low dissipation factor. In certain situations, wet electrolytic capacitors may exhibit advantages over solid electrolytic capacitors. For example, wet electrolytic capacitors may operate at a higher working voltage than solid electrolytic capacitors. Additionally, wet electrolytic capacitors are often larger in size than solid electrolytic capacitors, leading to larger capacitance values. Unfortunately, however, many conventional capacitors experience significant problems when used with corrosive electrolytes, such as sulfuric acid. For example, aluminum current collectors are highly sensitive to corrosion and are not generally compatible with corrosive electrolytes. Also, under certain conditions (e.g., high temperatures), coatings applied to cathode current collectors (e.g., ruthenium oxide) may become detached due to corrosion by the electrolyte. To avoid these problems, more neutral liquid electrolytes may be employed, but this often results in a corresponding sacrifice in electrical properties.

[0002] As such, a need currently exists for a wet electrolytic capacitor that is able to adequately function with a wide variety of electrolytes.

SUMMARY OF THE INVENTION

[0003] In accordance with one embodiment of the present invention, a wet electrolytic capacitor is disclosed that comprises an anode, a cathode, and an electrolyte disposed between the anode and cathode. The cathode contains a substrate and a plurality of metal particles disposed on a surface of a substrate and sinter bonded thereto. The metal particles have a median size of from about 20 to about 500 micrometers.

[0004] In accordance with another embodiment of the present invention, a method for forming a wet electrolytic capacitor is disclosed. The method comprises applying a plurality of metal particles to a substrate of a cathode, wherein the metal particles have a median size of from about 20 to about 500 micrometers. The method further comprises sintering the metal particles and disposing an electrolyte between the cathode and an anode.

[0005] Other features and aspects of the present invention are set forth in greater detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] A full and enabling disclosure of the present invention, including the best mode thereof, directed to one of ordinary skill in the art, is set forth more particularly in the remainder of the specification, which makes reference to the appended figures in which:

[0007] FIG. 1 is a cross-sectional view of one embodiment of a capacitor according to the present invention;

[0008] FIG. 2 is a perspective view of another embodiment of a capacitor according to the present invention; and

[0009] FIG. 3 is a side view of the capacitor of FIG. 2;

[0010] FIG. 4 is SEM microphotograph (5000×) of the top of the cathode coating formed in Example 1;

[0011] FIG. 5 is SEM microphotograph (140×) of the side of the cathode coating formed in Example 1; and

[0012] FIG. 6 is SEM microphotograph (2500×) of a cross-section of the cathode coating formed in Example 1.

[0013] Repeat use of reference characters in the present specification and drawings is intended to represent same or analogous features or elements of the invention.

DETAILED DESCRIPTION OF REPRESENTATIVE EMBODIMENTS

[0014] It is to be understood by one of ordinary skill in the art that the present discussion is a description of exemplary embodiments only, and is not intended as limiting the broader aspects of the present invention, which broader aspects are embodied in the exemplary construction.

[0015] The present invention is directed to a wet electrolytic capacitor that includes an anode, cathode, and an electrolyte disposed therebetween. The cathode is formed from a substrate that is coated with a plurality of metal particles having a median particle size of from about 20 to about 500 micrometers. The metal particles are sintered to adhere them to the substrate. Without intending to be limited by theory, the present inventors believe that the metal particles can inhibit corrosion of the cathode substrate and also help maintain a strong bond between the substrate and a cathode coating, even under highly corrosive, high temperature conditions. Various embodiments of the wet electrolytic capacitor will now be described in more detail. It should be understood that the description below is merely exemplary, and multiple other embodiments are also contemplated by the present invention.

I. Anode

[0016] The anode may generally be formed from a variety of different materials, For example, the anode may be formed from a powder constituted primarily by a valve metal (i.e., metal that is capable of oxidation) or from a composition that contains the valve metal as a component. Suitable valve metals that may be used include, but are not limited to, tantalum, niobium, aluminum, hafnium, titanium, alloys of these metals, and so forth. For example, the anode may be formed from a valve metal oxide or nitride (e.g., niobium oxide (e.g., NbO), tantalum oxide, tantalum nitride, niobium nitride, etc.) that is generally considered a semi-conductive or highly conductive material. Examples of such valve metal oxides are described in U.S. Pat. No. 6,322,912 to Fife, which is incorporated herein in its entirety by reference thereto for all purposes. Examples of valve metal nitrides are also described in “Tantalum Nitride: A New Substrate for Solid Electrolytic Capacitors” by T. Tripp; Proceedings of CARTS 2000: 20th Capacitor and Resistor Technology Symposium, 6-20 Mar. 2000.

[0017] A variety of conventional fabricating procedures may generally be utilized to form the anode. In one embodiment, a tantalum powder having a certain particle size is first selected. The particle size may vary depending on the desired voltage of the resulting capacitor. For example, powders with a relatively large particle size (e.g., about 10 micrometers) are often used to produce high voltage capacitors, while powders with a relatively small particle size (e.g., about 0.5 micrometers) are often used to produce low voltage capacitors. The particles are then optionally mixed with a binder and/or lubricant to ensure that the particles adequately adhere to each other when pressed to form the anode. Binders commonly employed for tantalum powder include camphor, stearic and other soapy fatty acids, Carbowax (Union Carbide), Glyptal (General Electric), polyvinyl alcohols, napthaline, vegetable wax, and microwaxes (purified paraffins). The binder may be dissolved and dispersed in a solvent. Exemplary solvents may include acetone; methyl isobutyl ketone; trichloromethane; fluorinated hydrocarbons (freon) (DuPont); alcohols; and chlorinated hydrocarbons (carbon tetrachloride). When utilized, the percentage of binders and/or lubricants may vary from about 0.1% to about 4% by weight of the total mass. It should be understood, however, that binders and lubricants are not required in the present invention.

[0018] Once formed, the powder is compacted using any conventional powder press mold. For example, the press mold may be a single station compaction press using a die and one or multiple punches. Alternatively, anvil-type compaction press molds may be used that use only a die and single lower punch. Single station compaction press molds are available in several basic types, such as cam, toggle/knuckle and eccentric/crank presses with varying capabilities, such as single action, double action, floating die, movable platen, opposed ram, screw, impact, hot pressing, coining or sizing. After compression, any binder/lubricant may be removed by heating the pellet under vacuum at a certain temperature (e.g., from about 150° C. to about 500° C.) for several minutes. Alternatively, the binder/lubricant may also be removed by contacting the pellet with an aqueous solution, such as described in U.S. Pat. No. 6,197,252 to Bishop, et al., which is incorporated herein in its entirety by reference thereto for all purposes. Thereafter, the pellet is sintered to form a porous, integral mass. For example, in one embodiment, the pellet may be sintered at a temperature of from about 1200° C. to about 2000° C., and in some embodiments, from about 1500° C. to about 1800° C. under vacuum. Upon sintering, the pellet shrinks due to the growth of bonds between the particles. In addition to the techniques described above, any other technique for forming the anode may also be utilized in accordance with the present invention, such as described in U.S. Pat. Nos. 4,085,435 to Galvagni; 4,945,452 to Sturmer, et al.; 5,198,968 to Galvagni; 5,357,399 to Salisbury; 5,394,295 to Galvagni, et al.; 5,495,386 to Kulkarni; and 6,322,912 to Fife, which are incorporated herein in their entirety by reference thereto for all purposes.

[0019] The anode may be anodized so that a dielectric film is formed over and within the porous anode. Anodization is an electrical chemical process by which the anode metal is oxidized to form a material having a relatively high dielectric constant. For example, a tantalum anode may be anodized to form tantalum pentoxide (Ta₂O₅), which has a dielectric constant “k” of about 27. Specifically, in one embodiment, the tantalum pellet is dipped into a weak acid solution (e.g., phosphoric acid) at an elevated temperature (e.g., about 85° C.) that is supplied with a controlled amount of voltage and current to form a tantalum pentoxide coating having a certain thickness. The power supply is initially kept at a constant current until the required formation voltage is reached. Thereafter, the power supply is kept at a constant voltage to ensure that the desired dielectric thickness is formed over the surface of the tantalum pellet. The anodization voltage typically ranges from about 10 to about 200 volts, and in some embodiments, from about 20 to about 100 volts. In addition to being formed on the surface of the tantalum pellet, a portion of the dielectric oxide film will also typically form on the surfaces of the pores of the metal. It should be understood that the dielectric film may be formed from other types of materials and using different techniques.

II. Electrolyte

[0020] As indicated above, an electrolyte is disposed between and in contact with the anode and the cathode. The electrolyte is the electrically active material that provides the connecting path between the anode and cathode. The electrolyte is generally in the form of a liquid, such as a solution (e.g., aqueous or non-aqueous), dispersion, gel, etc. For example, the electrolyte may be an aqueous solution of an acid (e.g., sulfuric acid, phosphoric acid, or nitric acid), base (e.g., potassium hydroxide), or salt (e.g., ammonium salt, such as a nitrate), as well any other suitable electrolyte known in the art, such as a salt dissolved in an organic solvent (e.g., ammonium salt dissolved in a glycol-based solution). Various other electrolytes are described in U.S. Pat. Nos. 5,369,547 and 6,594,140 to Evans, et al., which are incorporated herein their entirety by reference thereto for all purposes.

III. Cathode

[0021] A. Substrate

[0022] The cathode substrate may be formed from any metal suitable for use in forming a capacitor. For instance, the cathode substrate may be formed from tantalum, niobium, aluminum, nickel, hafnium, titanium, copper, silver, alloys thereof, oxides thereof, nitrides thereof, and so forth. The configuration of the cathode substrate may generally vary as is well known to those skilled in the art. For example, the substrate may be in the form of a container, can, foil, sheet, foam, screen, cloth, felt, etc. In one embodiment, the cathode substrate is a cylindrically-shaped “can” with an attached lid. The surface area of the cathode substrate is selected to provide a certain level of capacitance. For example, the cathode substrate typically covers a surface area of from about 1 to about 25 square centimeters, in some embodiments from about 2 to about 15 square centimeters, and in some embodiments, from about 5 to about 10 square centimeters. It should be understood that the specific surface area of the substrate may be much greater than the ranges specified above.

[0023] B. Metal Particles

[0024] In accordance with the present invention, a plurality of metal particles are applied to the surface(s) of the cathode substrate that interface with the electrolyte. The metal particles may be constituted primarily by a metal or from a composition that contains a metal as a component. Suitable metal particles may, for instance, be formed from tantalum, niobium, aluminum, nickel, hafnium, titanium, copper, silver, etc., as well as alloys, oxides, and nitrides of these metals, such as described above. Preferably, the metal particles are formed from a material that is the same or substantially similar in nature to the cathode substrate. In this manner, a strong bond will form between the particles and the cathode substrate when sintered. In one particular embodiment, for example, tantalum metal particles are employed for bonding to a tantalum substrate. Likewise, copper metal particles may be employed for bonding to a copper substrate.

[0025] Any of a variety of known techniques may be employed to form the metal particles. For example, metals may be extracted from their ores and formed into powders by processes that include chemical reduction. Valve metals (e.g., tantalum), for instance, may be prepared by reducing a valve metal salt with a reducing agent. The reducing agent may be hydrogen, active metals (e.g., sodium, potassium, magnesium, calcium, etc.), and so forth. Likewise, suitable valve metal salts may include potassium fluotantalate (K₂TaF₇), sodium fluotantalate (Na₂TaF₇), tantalum pentachloride (TaCl₅), etc. Examples of such reduction techniques are described in U.S. Pat. Nos. 3,647,415 to Yano, et al.; 4,149,876 to Rerat; 4,684,399 to Bergman, et al.; and 5,442,978 to Hildreth, et al., which are incorporated herein in their entirety by reference thereto for all purposes. For instance, a valve metal salt may be electrolytically reduced in a molten bath with a diluent alkali metal halide salt (e.g., KCl or NaCl). The addition of such diluents salts allows the use of lower bath temperatures. Valve metal powder may also be made by an exothermic reaction in a closed vessel in which the valve metal salt is arranged in alternate layers with the reducing agent. The enclosed charge is indirectly heated until the exothermic reaction is spontaneously initiated.

[0026] Mechanical milling techniques may be employed to grind the metal powder (e.g., metal hydride) to a desired size. For example, the powder may be dispersed in a fluid medium (e.g., ethanol, methanol, fluorinated fluid, etc.) to form a slurry. The slurry may then be combined with a grinding media (e.g., metal balls, such as tantalum) in a mill. The number of grinding media may generally vary depending on the size of the mill, such as from about 100 to about 2000, and in some embodiments from about 600 to about 1000. The starting powder, the fluid medium, and grinding media may be combined in any proportion. For example, the ratio of the starting metal powder to the grinding media may be from about 1:5 to about 1:50. Likewise, the ratio of the volume of the fluid medium to the combined volume of the starting valve metal powder may be from about 0.5:1 to about 3:1, in some embodiments from about 0.5:1 to about 2:1, and in some embodiments, from about 0.5:1 to about 1:1. Some examples of mills that may be used are described in U.S. Pat. Nos. 5,522,558; 5,232,169; 6,126,097; and 6,145,765, which are incorporated herein in their entirety by reference thereto for all purposes.

[0027] Milling may occur for any predetermined amount of time needed to achieve the target specific surface area. For example, the milling time may range from about 30 minutes to about 40 hours, in some embodiments, from about 1 hour to about 20 hours, and in some embodiments, from about 5 hours to about 15 hours. Milling may be conducted at any desired temperature, including at room temperature or an elevated temperature. After milling, the fluid medium may be separated or removed from the powder, such as by air-drying, heating, filtering, evaporating, etc. For instance, the powder may optionally be subjected to one or more acid leaching steps to remove metallic impurities. Such acid leaching steps are well known in the art and may employ any of a variety of acids, such as mineral acids (e.g., hydrochloric acid, hydrobromic acid, hydrofluoric acid, phosphoric acid, sulfuric acid, nitric acid, etc.), organic acids (e.g., citric acid, tartaric acid, formic acid, oxalic acid, benzoic acid, malonic acid, succinic acid, adipic acid, phthalic acid, etc.); and so forth. Although not required, the metal powder may also be agglomerated using any technique known in the art. Typical agglomeration techniques involve, for instance, one or multiple heat treatment steps in a vacuum or inert atmosphere at temperatures ranging from about 800° C. to about 1400° C. for a total time period of from about 30 to about 60 minutes.

[0028] The metal particles may have any desired shape, such as nodular, flake, angular, fibrous, or an agglomerate thereof, and possess an irregular surface to which the cathode coating is better able to attach. Generally, the particles have a relatively large median size (individual or agglomerated), such as from about 20 to about 500 micrometers, in some embodiments from about 30 to about 400 micrometers, and in some embodiments, from about 50 to about 200 micrometers. The specific surface area of the metal particles may likewise range from about 0.05 to about 40 m²/g, in some embodiments from about 0.1 to about 10 m²/g, and in some embodiments, from about 0.5 to about 5 m²/g. The term “specific surface area was determined by the physical gas adsorption (B.E.T.) method of Bruanauer, Emmet, and Teller, Journal of American Chemical Society, Vol. 60, 1938, p. 309, with nitrogen as the adsorption gas.

[0029] Any of a variety of techniques may generally be employed to apply the metal particles to the substrate in accordance with the present invention, such as heat treating, thermal sintering, sputtering, screen-printing, dipping, electrophoretic coating, electron beam deposition, spraying, roller pressing, brushing, doctor blade casting, and vacuum deposition. Excess particles may be removed, for instance, by inverting the substrate. Upon application, the metal particles may optionally be heated to remove any binder/lubricant present in the particles. Heating may occur, for instance, at a temperature of from about 40° C. to about 800° C. If desired, the cathode substrate may optionally be pre-treated with a viscous liquid to hold the metal particles in place upon application to the substrate surface. For instance, the viscous liquid may be a solvent such as described above. Besides solvents, still other suitable viscous liquids may include water-soluble or water-swellable polymers, such as sodium, potassium and calcium alginates, carboxymethylcellulose, agar, gelatin, polyvinyl alcohol, collagen, pectin, chitin, chitosan, poly(α-amino acids), polyester, poly-1-caprolactone, polyvinylpyrrolidone, polyethylene oxide, polyvinyl alcohol, polyether, polysaccharide, hydrophilic polyurethane, polyhydroxyacrylate, polymethacrylate, dextran, xanthan, hydroxypropyl cellulose, methyl cellulose, and homopolymers and copolymers of N-vinylpyrrolidone, N-vinyllactam, N-vinyl butyrolactam, N-vinyl caprolactam, other vinyl compounds having polar pendant groups, acrylate and methacrylate having hydrophilic esterifying groups, hydroxyacrylate, acrylic acid, and combinations thereof. Further, resinous liquid adhesives (e.g., shellac) may also be employed.

[0030] Once applied, one or more layers (e.g., monolayer) of metal particles are typically formed on the substrate surface to form a coating. The thickness of the coating may vary depending on the size and configuration of the cathode substrate, anode, and optional cathode coating. Generally speaking, the metal particle coating has a total thickness of from about 20 to about 2000 micrometers, in some embodiments from about 30 to about 1000 micrometers, and in some embodiments, from about 50 to about 500 micrometers. By way of example, if tantalum particles having a particle size of about 100 μm are used, then one monolayer of tantalum particles has a thickness of about 100 μm. Then, forming about 10 monolayers containing these tantalum particles will provide a coating having a total thickness of about 1000 μm.

[0031] The extent to which the metal particles cover the cathode substrate may also vary. For example, the metal particles may be applied in a spaced-apart fashion over the surface of the cathode substrate so that they form “island-like” structures. In this manner, the constituents of a cathode coating may be subsequently disposed in the spaces of these adjacent particles to enhance their adherence to the cathode substrate. The extent to which the metal particles are spaced apart may vary, but may be approximately the same as the size of the metal particles. For example, adjacent metal particles may be spaced apart a distance that ranges from about 20 to about 500 micrometers, in some embodiments from about 30 to about 400 micrometers, in some embodiments, from about 50 to about 200 micrometers.

[0032] The metal particles are subsequently sintered so that a bond forms between the particles and the cathode substrate. Although such sintering step(s) may occur simultaneously with sintering of the cathode coating as described below, it is usually desired that the metal particles are sintered separately, prior to the subsequent sintering of the cathode coating. In this manner, the sintering conditions may be more specifically tailored to the particles employed. For example, the metal particles may be sintered at a temperature that is higher than the preferred sintering temperature for the cathode coating, such as at a temperature of from about 1000° C. to about 2500° C., in some embodiments from about 1000° C. to about 2000° C., and in some embodiments from about 1200° C. to about 1800° C. The heating step(s) may occur at a relatively low pressure, such as less than about 200 millitorr, in some embodiments less than about 100 millitorr, and in some embodiments, less than about 50 millitorr. The total time of the heating step(s) may range from about 10 minutes to about 1 hour.

[0033] C. Cathode Coating

[0034] The cathode of the present invention may optionally contain a cathode coating that overlies the metal particle-coated cathode substrate. More specifically, the cathode coating supports an electrochemical capacitance at an interface with the electrolyte and has a high ratio of surface area to volume. Generally, the cathode coating is formed from electrochemically-active particles that are conductive so that the electrolyte maintains good electrical contact with the cathode substrate. The extent of conductivity may be characterized in terms of the “resistivity” of the electrochemically-active particles at about 20° C., which is generally less than about 1×10⁵ohm-cm, in some embodiments less than about 1×10⁴ohm-cm, in some embodiments less than about 1×10³ohm-cm, in some embodiments less than about 1×10⁻³ohm-cm, and in some embodiments, less than about 1×10⁻⁴ohm-cm.

[0035] The electrochemically-active particles increase the effective cathode surface area over which the electrolyte electrochemically communicates with the cathode substrate. Such an increased effective cathode surface area allows for the formation of capacitors with increased cell capacitance for a given size and/or capacitors with a reduced size for a given capacitance. Typically, the electrochemically-active particles have a specific surface area of at least about 200 m²/g, in some embodiments at least about 500 m²/g, and in some embodiments, at least about 1500 m²/g. To achieve the desired surface area, the electrochemically-active particles generally have a small size. For example, the median size of the electrochemically-active particles may be less than about 100 micrometers, in some embodiments from about 1 to about 50 micrometers, and in some embodiments, from about 5 to about 20 micrometers. Likewise, the electrochemically-active particles may be porous. Without intending to be limited by theory, it is believed that porous particles provide a passage for the electrolyte to better contact the cathode substrate. For example, the electrochemically-active particles may have pores/channels with a mean diameter of greater than about 5 angstroms, in some embodiments greater than about 20 angstroms, and in some embodiments, greater than about 50 angstroms.

[0036] Any of a variety of electrochemically-active particles may be employed in the present invention. For example, carbonaceous particles may be employed in the present invention that have the desired level of conductivity, such as activated carbon, carbon black, graphite, etc. Some suitable forms of activated carbon and techniques for formation thereof are described in U.S. Pat. Nos. 5,726,118 to Ivey, et al.; 5,858,911 to Wellen, et al.; as well as U.S. Patent Application Publication No. 2003/0158342 to Shinozaki, et al., all of which are incorporated herein in their entirety by reference thereto for all purposes.

[0037] Various metals may also be employed as electrochemically-active particles, such as particles formed from ruthenium, iridium, nickel, rhodium, rhenium, cobalt, tungsten, manganese, tantalum, niobium, molybdenum, lead, titanium, platinum, palladium, and osmium, as well as combinations of these metals. In one particular embodiment, for example, the electrochemically-active particles are palladium particles.

[0038] Non-insulating oxide particles may also be employed in the present invention. Suitable oxides may include a metal selected from the group consisting of ruthenium, iridium, nickel, rhodium, rhenium, cobalt, tungsten, manganese, tantalum, niobium, molybdenum, lead, titanium, platinum, palladium, and osmium, as well as combinations of these metals. Particularly suitable metal oxides for use in the present invention include ruthenium dioxide (RuO₂) and manganese dioxide (MnO₂). In another embodiment, the metal oxide may be a niobium oxide having an atomic ratio of niobium to oxygen of 1:less than 2.5, in some embodiments 1:less than 1.5, in some embodiments 1:less than 1.1, and in some embodiments, 1:0.5±0.2. For example, the niobium oxide may be NbO_0.7, NbO_1.0, NbO_1.1, and NbO₂. In one particular embodiment, the electrochemically-active particles are formed from NbO₂. NbO₂is a relatively conductive niobium oxide that does not anodize under normal conditions. NbO₂is also stable in or does not readily dissolve in H₂SO₄or other electrolytes. Further, NbO₂is chemically stable after sintering at high temperatures. That is, an NbO₂-coated cathode may be sintered at high enough temperatures such that the NbO₂bonds well to the cathode substrate, while still maintaining its chemical structure and physical properties. The electrochemically-active particles may also be nitride and/or carbide particles containing a metal, such as titanium, vanadium, zirconium, niobium, or tungsten-based particles. Examples of such metal oxides, nitrides, and carbides are described in more detail in U.S. Pat. Nos. 5,369,547 to Evans, et al.; 5,754,394 to Evans, et al.; 5,754,394 to Evans, et al.; 5,982,609 to Evans, et al.; and 6,594,140 to Evans, et al., which are incorporated herein in their entirety by reference thereto for all purposes.

[0039] The present inventors have discovered that the metal particles of the present invention enhance the bond strength between the cathode substrate and cathode coatings, particularly under highly corrosive, high temperature conditions. Nevertheless, a binder may optionally be employed in the cathode coating to further enhance bonding. Any of a variety of binders may be employed in the present invention, such as liquid binder (e.g., organic adhesives, inorganic adhesives, etc.), solid binders (e.g., particles), and so forth. Exemplary liquid binders may include, for instance, polytetrafluoroethylene, polyvinylidene fluoride, carboxymethylcellulose, fluoroolefin copolymer crosslinked polymer, polyvinyl alcohol, polyacrylic acid, polyimide, petroleum pitch, coal pitch, and phenol resins. Alternatively, adhesive particles may be employed as a binder to segregate the electrochemically-active particles from direct chemical contact with the cathode substrate. The adhesive particles may form bonds with the electrochemically-active particles when sintered (i.e., sinter bonded). The nature of the bond may vary, and may be metallurgical, covalent, electrostatic, etc. The adhesive particles may also surround the electrochemically-active particles to further inhibit their removal.

[0040] The adhesive particles are generally smaller than the electrochemically-active particles so that they may more effectively surround such particles upon sintering. This relative size difference may be characterized by the ratio of the median particle size of the electrochemically-active particles to the median particle size of the adhesive particles, which may range from about 1.5:1 to about 50:1, in some embodiments, from about 3:1 to about 25:1, and in some embodiments, from about 4:1 to about 15:1. To achieve the desired ratio, the median size of the adhesive particles may, for instance, be less than about 50 micrometers, in some embodiments less than about 20 micrometers, and in some embodiments, less than about 5 micrometers. Without intending to be limited by theory, the present inventors also believe that the adhesive particles do not substantially block the pores and surface of the electrochemically-active particles. In this manner, the electrochemically-active particles may retain a high surface area for contacting the electrolyte.

[0041] To ensure that the desired level of electrical contact is maintained, the adhesive particles are also typically conductive. In this regard, any of a variety of conductive adhesive particles that provide the desired level of adhesive strength may be used in the present invention. For example, the adhesive particles may be inorganic oxide particles formed from a valve metal or from a composition that contains the valve metal as a component. Suitable valve metals that may be used include, but are not limited to, tantalum, niobium, aluminum, hafnium, titanium, as well as alloys, oxides, or nitrides of these metals. In one particular embodiment, the adhesive particles are formed from niobium oxide having an atomic ratio of niobium to oxygen of 1:less than 2.5, in some embodiments 1 less than 1.5, in some embodiments 1:less than 1.1, and in some embodiments, 1:0.5±0.2, such as described above. The adhesive particles may have any shape desired, such as angular, nodular, flake, etc. The specific surface area of the adhesive particles may be from about 0.1 to about 200 m²/g, in some embodiments from about 0.5 to about 100 m²/g, and in some embodiments, from about 1 to about 40 m²/g. The adhesive particles may optionally be agglomerated using any technique known in the art, such as heat treatment, organic binders, and so forth. In one embodiment, for instance, the adhesive particles are agglomerated using one or more heat treatment steps in a vacuum or inert atmosphere at temperatures ranging from about 800° C. to about 1400° C. for a total time period of from about 30 to about 60 minutes.

[0042] When utilized, the relative amount of the electrochemically-active particles and adhesive particles in the cathode coating may also vary depending on the desired properties of the capacitor. For example, a greater relative amount of electrochemically-active particles will generally result in a capacitor having a greater cathode capacitance. If the amount of the electrochemically-active particles is too great, however, the cathode coating may insufficiently bond to the cathode substrate. Thus, to achieve an appropriate balance between these properties, the cathode coating of the present invention typically contains adhesive particles and electrochemically-active particles in a weight ratio, respectively, of from about 0.2:1 to about 100:1, in some embodiments from about 0.5:1 to about 50:1, and in some embodiments, from about 1:1 to about 20:1. The adhesive particles may constitute from about 50 wt. % to about 99 wt. %, in some embodiments from about 60 wt. % to about 98 wt. %, and in some embodiments, from about 80 wt. % to about 95 wt. % of the cathode coating. Likewise, the electrochemically-active particles may constitute from about 1 wt. % to about 50 wt. %, in some embodiments from about 2 wt. % to about 40 wt. %, and in some embodiments, from about 5 wt. % to about 20 wt. % of the cathode coating.

[0043] To apply the cathode coating to the substrate, the components (e.g., electrochemically-active particles, adhesive particles, etc.) may be mixed with a solvent, either separately or together, to form a coating formulation that may be easily applied to a substrate. The coating formulation may include, for instance, a niobium oxide having an atomic ratio of niobium to oxygen of 1:less than 2.5. Alternatively, the coating formulation may also contain an oxide (e.g., Nb₂O₅) that is reduced to the desired level (e.g., NbO₂) upon sintering. Any solvent may be employed, such as water; glycols (e.g., propylene glycol, butylene glycol, triethylene glycol, hexylene glycol, polyethylene glycols, ethoxydiglycol, and dipropyleneglycol); glycol ethers (e.g., methyl glycol ether, ethyl glycol ether, and isopropyl glycol ether); ethers (e.g., diethyl ether and tetrahydrofuran); alcohols (e.g., methanol, ethanol, n-propanol, isopropanol, and butanol); triglycerides; ketones (e.g., acetone, methyl ethyl ketone, and methyl isobutyl ketone); esters (e.g., ethyl acetate, butyl acetate, diethylene glycol ether acetate, and methoxypropyl acetate); amides (e.g., dimethylformamide, dimethylacetamide, dimethylcaprylic/capric fatty acid amide and N-alkylpyrrolidones); nitriles (e.g., acetonitrile, propionitrile, butyronitrile and benzonitrile); sulfoxides or sulfones (e.g., dimethyl sulfoxide (DMSO) and sulfolane); and so forth. The concentration of the solvent may generally vary, it is nonetheless typically present in an amount from about 10 wt. % to about 80 wt. %, in some embodiments from about 20 wt. % to about 70 wt. %, and in some embodiments, from about 25 wt. % to about 60 wt. % of the coating formulation.

[0044] The solids content and/or viscosity of the coating formulation may generally vary as desired to achieve the desired coating thickness. For example, the solids content of the oxide may range from about 20% to about 80% by weight, more particularly, between about 30% to about 70% by weight, and even more particularly, between about 35% to about 65% by weight. By varying the solids content of the coating formulation, the presence of the particles in the coating may be controlled. For example, to form a cathode coating with a higher level of electrochemically-active particles, the formulation may be provided with a relatively high solids content so that a greater percentage of the particles are incorporated into the coating during the application process. In addition, the viscosity of the coating formulation may also vary depending on the coating method and/or type of solvent employed. For instance, lower viscosities may be employed for some coating techniques (e.g., dip-coating), while higher viscosities may be employed for other coating techniques. Generally, the viscosity is less than about 2×10⁶centipoise, in some embodiments less than about 2×10⁵centipoise, in some embodiments less than about 2×10⁴centipoise, and in some embodiments, less than about 2×10³centipoise, such as measured with a Brookfield DV-1 viscometer with an LV spindle. If desired, thickeners or other viscosity modifiers may be employed in the coating formulation to increase or decrease viscosity.

[0045] Once formed, the coating formulation may then be applied to the substrate using any known technique. For example, the cathode coating may be applied using techniques such as heat treating, thermal sintering, sputtering, screen-printing, dipping, electrophoretic coating, electron beam deposition, spraying, roller pressing, brushing, doctor blade casting, centrifugal casting, masking, and vacuum deposition. Other suitable techniques are also described in U.S. Pat. Nos. 5,369,547 to Evans, et al.; 6,594,140 to Evans, et al.; and 6,224,985 to Shah, et al., which are incorporated herein in their entirety by reference thereto for all purposes. For example, the cathode substrate may be dipped into or sprayed with the coating formulation. The coating formulation may cover an entire surface of the substrate. Alternatively, the coating formulation may cover only a portion of the substrate so that space remains for a lid, a stopper, or other component(s) to reside against the substrate. By way of example, the coating formulation may cover from about 25% and about 75% of a surface of the substrate, and in some embodiments, from about 40% to about 60% of a surface of the substrate. Upon application, the coating formulation may optionally be dried to remove any solvent(s). Drying may occur, for instance, at a temperature of from about 50° C. to about 150° C.

[0046] If desired, the cathode coating may be sintered to form bonds between the constituents of the coating (e.g. electrochemically-active and adhesive particles), between the constituents of the coating and the metal particles, and/or between the constituents of the coating and the cathode substrate. Sintering may occur in one or more heating steps that are selectively controlled to provide the desired bonds without adversely affecting the physical properties of the coating. The heating step(s) may occur, for instance, at a temperature of from about 500° C. to about 2400° C., in some embodiments from about 700° C. to about 1500° C., and in some embodiments from about 900° C. to about 1200° C. Likewise, the heating step(s) generally occur at a relatively low pressure, such as less than about 200 millitorr, in some embodiments less than about 100 millitorr, and in some embodiments, less than about 50 millitorr.

[0047] The total time of the heating step(s) may range from about 10 minutes to about 3 hours. Besides facilitating the adhesion of the coating to the cathode substrate, sintering may also provide other benefits. For example, sintering may cause a chemical change in the coating itself, such as by reducing Nb₂O₅to NbO₂or converting a ruthenium or manganese oxide precursor to RuO₂or MnO₂, respectively. Likewise In this manner, the desired oxide coating may be formed in situ.

[0048] If desired, the above-described application and sintering steps may be repeated until the desired thickness of the cathode coating is formed. In some embodiments, only a relatively thin layer of the coating is formed at a time. For example, particles may adhere better to the cathode substrate if the coating is applied through a series of thin layers. Thus, a thin layer of the coating may be added and sintered, and then another thin layer of the coating may be added and then sintered, wherein each thin layer has a thickness of less than about 150 μm, in some embodiments, less than about 100 μm, and in some embodiments, less than about 75 μm. The total target thickness of the cathode coating may generally vary depending on the desired properties of the capacitor. Typically, the cathode coating has a thickness of less than about 200 μm, and in some embodiments, from about 50 to about 150 μm.

[0049] The cathode coating may be single- or multi-layered. In single-layered coatings, for instance, electrochemically-active particles and adhesive particles may be distributed in a manner so that the layer is substantially uniform or homogeneous across its thickness. In most embodiments, however, the cathode coating is formed from multiple layers. In this manner, the particular content, thickness, etc., of the layers may be selectively tailored to achieve the desired properties. For example, the cathode coating may contain a first layer overlying the metal particles and cathode substrate, and a second layer overlying the first layer. The second layer may contain electrochemically-active particles, while the first layer may contain adhesive particles. For example, the first layer may be formed primarily from adhesive particles, such as in an amount greater than about 95 wt. %, and in some embodiments, 100 wt. %. As a result, the first layer may form a stronger bond with the metal particles and cathode substrate than might otherwise form with a layer containing electrochemically-active particles. Although the second layer may be formed primarily from electrochemically-active particles (e.g., greater than about 95 wt. %), it is preferred that the second layer also employs adhesive particles in a sufficient amount to improve bond strength. For example, the second layer may contain adhesive particles in an amount from about 50 wt. % to about 90 wt. %, and in some embodiments, from about 60 wt. % to about 80 wt. %, and likewise contain electrochemically-active particles in an amount from about 10 wt. % to about 50 wt. %, and in some embodiments, from about 20 wt. % to about 40 wt. %. If desired, the cathode coating may also contain a third layer overlying the second layer. The third layer may, for instance, be formed primarily from adhesive particles such as described above. In this manner, the first and third layer of adhesive particles will sandwich the second layer and further increase the likelihood that the electrochemically-active particles will become fully encapsulated and bonded within an inorganic particle matrix.

[0050] In addition to those identified above, other components may also be utilized in the cathode coating. For example, a conductive polymer may be utilized to form the cathode coating, either alone or in conjunction with the components identified above. Suitable conductive polymers may include, but are not limited to, polypyrroles; polythiophenes, such as poly(3,4-ethylenedioxythiophene) (PEDT); polyanilines; polyacetylenes; poly-p-phenylenes; and derivatives thereof. Various methods may be utilized to apply a conductive polymer to the substrate, such as sputtering, screen-printing, dipping, electrophoretic coating, electron beam deposition, spraying, and vacuum deposition. In one embodiment, the monomer(s) used to form the conductive polymer (e.g., PEDT) are initially mixed with a polymerization catalyst to form a dispersion. An example of such a catalyst is BAYTRON C (Bayer Corp.), which is iron (III) toluene-sulphonate and n-butanol and is a commercially available catalyst for BAYTRON M, which is 3,4-ethylenedioxythiophene (PEDT monomer) also available from Bayer Corp. Once the dispersion is formed, the substrate may then be dipped into the dispersion so that conductive polymer forms. Alternatively, the catalyst and monomer(s) may also be applied separately. In one embodiment, the catalyst may be dissolved in a solvent (e.g., butanol) and then applied as a dipping solution. Although various methods have been described above, it should be understood that any other method for applying the coating comprising the conductive polymer may also be utilized in the present invention. For example, other suitable methods may be described in U.S. Pat. Nos. 5,457,862 to Sakata, et al., 5,473,503 to Sakata, et al., 5,729,428 to Sakata, et al., 5,812,367 to Kudoh, et al., and 6,674,635 to Fife, et al., which are incorporated herein in their entirety by reference thereto for all purposes.

[0051] The physical arrangement of the cathode and its components may generally vary as is well known in the art. Referring to FIG. 1, for example, one embodiment of a wet electrolytic capacitor 10 is shown that includes an electrolyte 24 disposed between an anode 20 and a cathode 13. The anode 20 contains a dielectric film 21 and is embedded with a wire 22 (e.g., tantalum wire). The cathode 13 is formed from a cathode substrate 12, a plurality of metal particles 15, and a cathode coating 14. In this embodiment, the cathode substrate 12 is in the form of a cylindrically-shaped “can” with an attached lid. A seal 23 (e.g., glass-to-metal) may also be employed that connects and seals the anode 20 to the cathode 13. Although not shown, the capacitor 10 may also include a spacer (not shown) that holds the anode 20 steady within the cathode 13. The spacer may, for example, be made of plastic and may be washer-shaped.

[0052] Another embodiment of the wet electrolytic capacitor of the present invention is shown in FIGS. 2 and 3. Similar to FIG. 1, a capacitor 100 is shown that includes an electrolyte 124 disposed between an anode 120 and a cathode 113. In this embodiment, however, the cathode 113 includes a cathode substrate (not shown) in the form of a rectangular-shaped metal foil or coupon. The metal particles (not shown) and cathode coating (not shown) extend over the sides of the rectangular-shaped metal coupon or foil. Further, the anode 120 and the cathode 113 are both attached to a voltage supply 130 and are suspended in a glass beaker 132 so that they do not touch one another. Although not shown, a separator (e.g., paper) may also be positioned between the cathode and anode as is well known in the art. Typically, the anode and cathode are separated by a distance of from about 10 micrometers to about 1000 micrometers. The cathode is attached to a metal wire 134 (e.g., tantalum wire) via spot welding for providing electrical continuity up to the voltage supply 30.

[0053] The wet electrolytic capacitor of the present invention exhibits excellent electrical properties. For example, the good electrical and mechanical interface formed between the cathode coating and the metal particles leads to a highly continuous connection with the electrolyte, thereby providing low equivalent series resistance (ESR). The equivalent series resistance of a capacitor generally refers to the extent that the capacitor acts like a resistor when charging and discharging in an electronic circuit and is usually expressed as a resistance in series with the capacitor. For example, a capacitor of the present invention may have an ESR of less than about 500 milliohms, in some embodiments less than about 300 milliohms, and in some embodiments, less than about 200 milliohms, measured with a 2-volt bias and 1-volt signal at a frequency of 120 Hz. It is also believed that the dissipation factor (DF) of the capacitor may also be maintained at relatively low levels. The dissipation factor (DF) generally refers to losses that occur in the capacitor and is usually expressed as a percentage of the ideal capacitor performance. For example, the dissipation factor of a capacitor of the present invention is typically less than about 10%, and in some embodiments, less than about 5%. Further, the capacitor may exhibit a higher level of cathode capacitance when compared to conventional wet electrolytic capacitors of the same general size and configuration. For example, the ratio of cathode capacitance to anode capacitance may be at least about 10, in some embodiments at least about 50, in some embodiments at least about 100, and in some embodiments, at least about 150. Additionally, it is believed that wet electrolytic capacitors are functional over a wider range of pH values (i.e., in more neutral pH environments) than certain conventional wet electrolytic capacitors. Functioning over a wider range of pH values means that wet electrolytic capacitors containing the cathodes described herein may contain a wider variety of anodes and other components, such as casing components.

[0054] The wet electrolytic capacitors of the present invention may be used in various applications, including but not limited to medical applications, such as defibrillators and so forth, as well as military applications, such as RADAR systems and so forth. The wet electrolytic capacitors of the present invention may also be used in consumer electronics including radios, televisions, and so forth.

[0055] The present invention may be better understood by reference to the following examples.

Test Methods

[0056] The capacitance, equivalence series resistance, and dissipation factor were measured at ambient temperature using an Agilent 4284A Precision LCR meter with Agilent 16089B Kelvin Leads with 2 volts bias and 1 volt signal. The operating frequency was 120 Hz. EG&G 273 Potentiostat and Solartron 1255 Frequency Response Analyzer were used for the electrical characterization. Communication between the hardware and the electrochemical cell was achieved through Screibner Corrware 2.1 software. The cell capacitance was measured directly and the largest measured cell capacitance was used as the real anode capacitance. Cathode capacitance was then calculated using the following equation:

[0057]

C_{cathode} = \frac{1}{\frac{1}{C_{cell}} - \frac{1}{C_{anode}}}

[0058] wherein,

[0059] C_cellis the measured cell capacitance;

[0060] C_anodeis the anode capacitance; and

[0061] C_cathodeis the cathode capacitance.

EXAMPLE 1

[0062] The ability to form a wet electrolytic capacitor in accordance with the present invention was demonstrated. A tantalum foil (thickness of 250 μm, surface area of 4.0 square centimeters) was initially degreased in soap water for 10 minutes at a temperature of about 45° C.; cleansed with deionized water, air dried, and degreased again in ethanol; cleansed with deionized water, air dried, and etched with 10 vol. % hydrofluoric acid for less than 5 minutes; and cleansed with deionized water and air dried. The tantalum foil was then coated with an agglomerated tantalum powder. Specifically, NH175 powder was obtained from H.C. Starck Co. and collected between #150 mesh and #250 mesh. A cotton swab soaked with 0.25 wt. % sodium carboxylmethyl cellulose water solution was used to wet the surface of the substrate. The collected tantalum powder was fed to the wet tantalum surface through a vibrated #250 mesh. The tantalum powder loaded foil was then sintered at a pressure of lower than 50 millitorr and at a temperature of 1900° C. for 10 minutes.

[0063] Two different inks (Inks A and B) were prepared for use in forming the cathode coating. Ink A was formed by mixing 2.2 grams of NbO₂particles, 2.2 grams of activated carbon particles, and 12.0 milliliters of isopropanol. Ink B was formed by mixing 4.4 grams of NbO₂particles and 12.0 milliliters of isopropanol. The NbO₂particles were obtained from Reading Alloys, Inc. of Robesonia, Pa., and had a B.E.T. surface area of 3.46 m²/g and a median particle size of about 1 μm. The activated carbon particles were obtained from Norit Americas, Inc. under the designation “Norit DLC Super 30”, and had a B.E.T. surface area of 1760 m²/g and a median particle size of 5 to 10 μm. The inks were then subjected to an ultrasonic bath for 30 minutes. The first layer of the coating was formed by applying Ink B to the interior surface of the metal particle-coated can using a pipette. The ink was then dried at 120° C. for 15 minutes. These steps were repeated 2 times so that the total weight of the first layer was 0.0103 grams. The second layer was then formed by applying Ink A in the manner described above. The coating and drying steps were repeated 8 times so that the total weight of the second layer was 0.0170 grams. Finally, the third layer was formed using Ink B in the manner described above. These steps were repeated 3 times so that the total weight of the third layer was 0.0125 grams. The configurations of the resulting coatings are set forth below in Table 1.

[0064]

TABLE 1

Metal Particle and Cathode Coating Configuration
			Weight
	Layer	Constituents	(grams)

	1	Ta particles	0.0602
	2	NbO₂	0.0103
	3	NbO₂(80 wt. %)	0.0136
		Activated carbon (20 wt. %)	0.0034
	4	NbO₂	0.0125

[0065] The coated tantalum foil was then sintered at 1150° C. at a pressure of 50 millitorr for 15 minutes.

[0066] To evaluate its electrical performance, the cathode was measured against a cylindrical tantalum slug and H₂SO₄electrolyte. The tantalum anode was obtained from Tantalum Pellet Company of Phoenix Ariz. and was made of H.C. Starck NA30KT tantalum powder. The sintered cylindrical anode had a height of 1.8 centimeters and a diameter of 0.65 centimeters. The anode contained a built-in tantalum lead wire and weighed about 3.9 grams. The anode was then anodized at 50 volts in 85° C. phosphoric bath. The anodized tantalum anode had a capacitance of about 2.65 mF. The anode and cathode were then placed in a 100-milliliter beaker filled with 5.0 M H₂SO₄so that the distance between the anode and cathode was approximately 1.0 millimeter. The cell capacitance was 2.58 mF, the anode capacitance was 2.65 mF, and the cathode capacitance was 97.7 mF. Thus, the ratio of the cathode to anode capacitance was about 36.9. The dissipation factor was 0.86.

[0067] Various scanning electron microphotographs (“SEMs”) were also taken of the capacitor as shown in FIGS. 4-6. The top view of FIG. 4, for instance, illustrates the presence of primarily niobium dioxide particles, which evidences that the migration of the activated carbon particles from the coating was inhibited. Likewise, the “island-like” appearance of the coating illustrated in FIG. 5 evidences the presence of the tantalum agglomerates. It is believed that these agglomerates further improve the adherence of the cathode coating to the substrate. Finally, the cross-sectional view of FIG. 6 shows the presence of both niobium dioxide particles (white color) and activated carbon particles (dark color) within the cathode coating.

EXAMPLE 2

[0068] The ability to form a wet electrolytic capacitor in accordance with the present invention was demonstrated. Tantalum cans (T4 case size) were degreased and rinsed as in Example 1. The tantalum cans were then coated with agglomerated tantalum powder. Specifically, NH175 powder was obtained from H.C. Starck Co. and collected between #150 mesh and #250 mesh. A cotton swab soaked with di(ethylene glycol) ethyl ether acetate was used to wet the surface of the substrate. The collected tantalum powder was fed to the wet tantalum surface through a vibrated #250 mesh (i.e., 75 to 150 micrometers). While the cans were tilted at an angle of 70°, the tantalum powder was sprinkled into the cans. The cans were then rotated approximately 45° and additional tantalum powder was sprinkled therein. This was repeated until the cans were each rotated 360° and had a loading of approximately 0.125 grams. The tantalum powder loaded cans were then sintered at a pressure of less than 50 millitorr and at a temperature of 1825° C. for 30 minutes.

[0069] An ink was then prepared from NH175 tantalum powder (H.C. Starck) having an average size of less than 25 μm, which was obtained by screening. 2 grams of the tantalum powder was then mixed with 1 gram of activated carbon (average size of 10 μm) in 10 milliliters of di(ethylene glycol) ethyl ether acetate. The activated carbon particles were the same as described in Example 1. The stirred ink was pipetted into the can and pipetted out, leaving a coating of ink on the inner surface of the cans. The cans were dried at 125° C. in air for 15 minutes. These steps were repeated 2 times. The configurations of the resulting coatings are set forth below in Table 2.

[0070]

TABLE 2

Metal Particle and Cathode Coating Configuration
			Wt. of Metal	Wt. of Cathode
		Substrate Weight	Particles	Coating
	Can	(g)	(g)	(g)

	1	3.6736	0.2254	0.0213
	2	3.6696	0.1935	0.0208
	3	3.6729	0.1810	0.0199
	4	3.6734	0.1982	0.0270
	5	3.6429	0.1807	0.0213

[0071] The coated tantalum cans were then sintered at 1550° C. at a pressure of less than 50 millitorr for 10 minutes. Thereafter, the cathodes were measured against a cylindrical tantalum slug and H₂SO₄electrolyte as described in Example 1. The results are shown below in Table 3.

[0072]

TABLE 3

Electrical Properties
	With Anode
		Capacitance	ESR
	Sample	(μF)	(ohms)

	1	2302	0.329
	2	2349	0.272
	3	2287	0.273
	4	2149	0.253
	5	2354	0.345

[0073] These and other modifications and variations of the present invention may be practiced by those of ordinary skill in the art, without departing from the spirit and scope of the present invention. In addition, it should be understood that aspects of the various embodiments may be interchanged both in whole or in part. Furthermore, those of ordinary skill in the art will appreciate that the foregoing description is by way of example only, and is not intended to limit the invention so further described in such appended claims.

Claims

What is claimed is:

1. A wet electrolytic capacitor comprising:

an anode;

a cathode containing a plurality of metal particles disposed on a surface of a substrate and sinter bonded thereto, wherein the metal particles have a median size of from about 20 to about 500 micrometers, further wherein a coating overlies the metal particles and the substrate, the coating comprising electrochemically-active particles; and

an electrolyte disposed between the cathode and anode.

2. The wet electrolytic capacitor of claim 1, wherein the metal particles contain tantalum, niobium, aluminum, nickel, hafnium, titanium, copper, or silver.

3. The wet electrolytic capacitor of claim 1, wherein the metal particles comprise tantalum.

4. The wet electrolytic capacitor of claim 1, wherein the metal particles have a median size of from about 30 to about 400 micrometers.

5. The wet electrolytic capacitor of claim 1, wherein the metal particles have a median size of from about 50 to about 200 micrometers.

6. The wet electrolytic capacitor of claim 1, wherein the metal particles have a specific surface area of from about 0.05 to about 40 m²/g.

7. The wet electrolytic capacitor of claim 1, wherein the metal particles have a specific surface area of from about 0.5 to about 5 m²/g.

8. The wet electrolytic capacitor of claim 1, wherein at least a portion of the metal particles are spaced apart over the surface of the substrate.

9. The wet electrolytic capacitor of claim 1, wherein the metal particles are agglomerated.

10. The wet electrolytic capacitor of claim 1, wherein the electrochemically-active particles comprise carbon.

11. The wet electrolytic capacitor of claim 1, wherein the electrochemically-active particles comprise a metal.

12. The wet electrolytic capacitor of claim 11, wherein the metal is palladium.

13. The wet electrolytic capacitor of claim 1, wherein the electrochemically-active particles comprise a metal oxide.

14. The wet electrolytic capacitor of claim 13, wherein the metal oxide is RuO₂.

15. The wet electrolytic capacitor of claim 13, wherein the metal oxide is MnO₂.

16. The wet electrolytic capacitor of claim 1, wherein the coating further comprises a binder.

17. The wet electrolytic capacitor of claim 16, wherein the binder comprises adhesive particles.

18. The wet electrolytic capacitor of claim 1, wherein the substrate comprises a metal selected from the group consisting of tantalum, niobium, aluminum, nickel, hafnium, titanium, copper, silver, and combinations thereof.

19. The wet electrolytic capacitor of claim 1, wherein the electrolyte is an aqueous solution containing an acid.

20. The wet electrolytic capacitor of claim 1, wherein the anode comprises tantalum or niobium.

21. The wet electrolytic capacitor of claim 20, wherein the anode comprises niobium oxide.

22. A method for forming a wet electrolytic capacitor, the method comprising:

applying a plurality of metal particles to a substrate of a cathode, wherein the metal particles have a median size of from about 20 to about 500 micrometers;

sintering the metal particles;

applying a coating formulation to the substrate after sintering the metal particles, the coating formulation comprising electrochemically-active particles; and

disposing an electrolyte between the cathode and an anode.

23. The method of claim 22, wherein the metal particles are sintered at a temperature of from about 1000° C. to about 2000° C.

24. The method of claim 22, wherein the metal particles are sintered at a temperature of from about 1200° C. to about 1800° C.

25. The method of claim 22, wherein the metal particles are sintered at a pressure of less than about 50 millitorr.

26. The method of claim 22, wherein the metal particles comprise tantalum.

27. The method of claim 22, wherein the metal particles have a median size of from about 50 to about 200 micrometers.

28. The method of claim 22, wherein the metal particles are agglomerated.

29. The method of claim 22, further comprising pre-coating the substrate with a viscous liquid prior to application of the metal particles.

30. The method of claim 22, wherein the coating formulation is sintered at a temperature of from about 500° C. to about 2400° C.

31. The method of claim 22, wherein the electrochemically-active particles comprise carbon.

32. The method of claim 22, wherein the electrochemically-active particles comprise a metal.

33. The method of claim 22, wherein the electrochemically-active particles comprise a metal oxide.

34. The method of claim 33, wherein the metal oxide is RuO₂.

Patent Citations (204)

Patent	Date	Inventor	Cited By
US3082360(A)	1963-03-01	Robinson et al.	Applicant
US3138746(A)	1964-06-01	Burger et al.	Applicant
US3647415(A)	1972-03-01	Yano et al.	Applicant
US3647420(A)	1972-03-01	Restelli	Applicant
US3835055(A)	1974-09-01	Chesnot	Applicant
US3958044(A)	1976-05-01	Yamaguchi et al.	Applicant
US3962715(A)	1976-06-01	Raccah et al.	Applicant
US4031436(A)	1977-06-01	Alwitt	Applicant
US4084965(A)	1978-04-01	Fry	Applicant
US4085435(A)	1978-04-01	Galvagni	Applicant
US4118727(A)	1978-10-01	LaPlante	Applicant
US4121949(A)	1978-10-01	Walters	Examiner
US4149876(A)	1979-04-01	Rerat	Applicant
US4155017(A)	1979-05-01	Gaule et al.	Applicant
US4201798(A)	1980-05-01	Lindmayer	Applicant
US4408257(A)	1983-10-01	Walters	Applicant
US4412902(A)	1983-11-01	Michikami et al.	Applicant
US4466841(A)	1984-08-01	Walters	Applicant
US4469610(A)	1984-09-01	Fukuda et al.	Applicant
US4494174(A)	1985-01-01	Schroeder	Applicant
US4523255(A)	1985-06-01	Rogers	Applicant
US4535389(A)	1985-08-01	Buczkowski et al.	Applicant
US4599383(A)	1986-07-01	Satoji	Applicant
US4672267(A)	1987-06-01	Lapatovich et al.	Applicant
US4683516(A)	1987-07-01	Miller	Applicant
US4684399(A)	1987-08-01	Bergman et al.	Applicant
US4712857(A)	1987-12-01	Lee	Applicant
US4722756(A)	1988-02-01	Hard	Applicant
US4774011(A)	1988-09-01	Mori et al.	Applicant
US4780797(A)	1988-10-01	Libby	Applicant
US4892862(A)	1990-01-01	Ogushi et al.	Applicant
US4945452(A)	1990-07-01	Sturmer et al.	Applicant
US4981942(A)	1991-01-01	Bockrath et al.	Applicant
US4985098(A)	1991-01-01	Kohno et al.	Applicant
US4992910(A)	1991-02-01	Evans	Applicant
US5011999(A)	1991-04-01	Bowman et al.	Applicant
US5043849(A)	1991-08-01	Libby	Applicant
US5098485(A)	1992-03-01	Evans	Applicant
US5105341(A)	1992-04-01	Stephenson et al.	Examiner
US5126156(A)	1992-06-01	Jones	Applicant
US5160653(A)	1992-11-01	Clouse et al.	Applicant
US5198187(A)	1993-03-01	Lu et al.	Applicant
US5198968(A)	1993-03-01	Galvagni	Applicant
US5211741(A)	1993-05-01	Fife	Examiner
US5232169(A)	1993-08-01	Kaneko et al.	Applicant
US5304330(A)	1994-04-01	Tatarchuk et al.	Applicant
US5306479(A)	1994-04-01	Sommers	Applicant
US5357399(A)	1994-10-01	Salisbury	Applicant
US5369547(A)	1994-11-01	Evans	Applicant
US5394295(A)	1995-02-01	Galvagni et al.	Applicant
US5400211(A)	1995-03-01	Evans	Applicant
US5419824(A)	1995-05-01	Weres et al.	Applicant
US5419977(A)	1995-05-01	Weiss et al.	Applicant
US5442978(A)	1995-08-01	Hildreth et al.	Applicant
US5448447(A)	1995-09-01	Chang	Applicant
US5455999(A)	1995-10-01	Weiss et al.	Applicant
US5457862(A)	1995-10-01	Sakata et al.	Applicant
US5469325(A)	1995-11-01	Evans	Applicant
US5473503(A)	1995-12-01	Sakata et al.	Applicant
US5495386(A)	1996-02-01	Kulkarni	Applicant
US5496532(A)	1996-03-01	Monzen et al.	Applicant
US5522558(A)	1996-06-01	Kaneko	Applicant
US5559667(A)	1996-09-01	Evans	Applicant
US5687057(A)	1997-11-01	Dapo	Applicant
US5726118(A)	1998-03-01	Ivey et al.	Applicant
US5729428(A)	1998-03-01	Sakata et al.	Applicant
US5737181(A)	1998-04-01	Evans	Applicant
US5754394(A)	1998-05-01	Evans et al.	Applicant
US5777428(A)	1998-07-01	Farahmandi et al.	Applicant
US5786555(A)	1998-07-01	Saito et al.	Applicant
US5786980(A)	1998-07-01	Evans	Applicant
US5812367(A)	1998-09-01	Kudoh et al.	Applicant
US5858911(A)	1999-01-01	Wellen et al.	Applicant
US5894403(A)	1999-04-01	Shah et al.	Applicant
US5926362(A)	1999-07-01	Muffoletto et al.	Applicant
US5973913(A)	1999-10-01	McEwen et al.	Applicant
US5982609(A)	1999-11-01	Evans	Applicant
US5986876(A)	1999-11-01	Stepanov et al.	Applicant
US5993513(A)	1999-11-01	Fife	Applicant
US6051044(A)	2000-04-01	Fife	Applicant
US6059847(A)	2000-05-01	Farahmandi et al.	Applicant
US6072692(A)	2000-06-01	Hiratsuka et al.	Applicant
US6094339(A)	2000-07-01	Evans	Applicant
US6094788(A)	2000-08-01	Farahmandi et al.	Applicant
US6104600(A)	2000-08-01	Suhara et al.	Applicant
US6115235(A)	2000-09-01	Naito	Applicant
US6126097(A)	2000-10-01	Chen et al.	Applicant
US6128179(A)	2000-10-01	Morokuma	Applicant
US6145765(A)	2000-11-01	Capelle, Jr. et al.	Applicant
US6165623(A)	2000-12-01	Fife et al.	Applicant
US6181546(B1)	2001-01-01	Stepanov et al.	Applicant
US6197252(B1)	2001-03-01	Bishop et al.	Applicant
US6208502(B1)	2001-03-01	Hudis et al.	Applicant
US6219222(B1)	2001-04-01	Shah et al.	Applicant
US6224985(B1)	2001-05-01	Shah et al.	Applicant
US6301093(B1)	2001-10-01	Noguchi et al.	Applicant
US6309428(B1)	2001-10-01	Niiori et al.	Applicant
US6310765(B1)	2001-10-01	Tanahashi et al.	Applicant
US6312642(B1)	2001-11-01	Fife	Applicant
US6322912(B1)	2001-11-01	Fife	Applicant
US6332900(B1)	2001-12-01	Muffoletto et al.	Applicant
US6334879(B1)	2002-01-01	Muffoletto et al.	Applicant
US6338816(B1)	2002-01-01	Fife	Applicant
US6373685(B1)	2002-04-01	Kimmel et al.	Applicant
US6375704(B1)	2002-04-01	Habecker et al.	Applicant
US6377442(B1)	2002-04-01	Strange et al.	Applicant
US6391275(B1)	2002-05-01	Fife	Applicant
US6402066(B1)	2002-06-01	Habecker et al.	Applicant
US6413282(B1)	2002-07-01	Tanahashi et al.	Applicant
US6414837(B1)	2002-07-01	Sato et al.	Applicant
US6416730(B1)	2002-07-01	Fife	Applicant
US6420043(B1)	2002-07-01	Fife et al.	Applicant
US6442015(B1)	2002-08-01	Niiori et al.	Applicant
US6455108(B1)	2002-09-01	Muffoletto et al.	Applicant
US6462934(B2)	2002-10-01	Kimmel et al.	Applicant
US6468605(B2)	2002-10-01	Shah et al.	Applicant
US6479581(B1)	2002-11-01	Ireland et al.	Applicant
US6507480(B2)	2003-01-01	Nomoto et al.	Applicant
US6510042(B1)	2003-01-01	Lee et al.	Applicant
US6517645(B2)	2003-02-01	Fife	Applicant
US6522523(B2)	2003-02-01	Takatomi et al.	Applicant
US6527937(B2)	2003-03-01	Fife	Applicant
US6562255(B1)	2003-05-01	Feger	Applicant
US6563645(B2)	2003-05-01	Heemstra et al.	Applicant
US6563695(B1)	2003-05-01	Suzuki et al.	Applicant
US6576099(B2)	2003-06-01	Kimmel et al.	Applicant
US6592740(B2)	2003-07-01	Fife	Applicant
US6594139(B2)	2003-07-01	Muffoletto et al.	Applicant
US6594140(B1)	2003-07-01	Evans et al.	Applicant
US6614646(B2)	2003-09-01	Bogaki et al.	Applicant
US6616728(B2)	2003-09-01	Fife	Applicant
US6639787(B2)	2003-10-01	Kimmel et al.	Applicant
US6674635(B1)	2004-01-01	Fife et al.	Applicant
US6687116(B2)	2004-02-01	Hudis	Applicant
US6687117(B2)	2004-02-01	Liu et al.	Applicant
US6702869(B2)	2004-03-01	Habecker et al.	Applicant
US6706240(B2)	2004-03-01	Habecker et al.	Applicant
US6721169(B2)	2004-04-01	Melody et al.	Applicant
US6721170(B1)	2004-04-01	Evans et al.	Applicant
US6743370(B1)	2004-06-01	Feger et al.	Applicant
US6759026(B2)	2004-07-01	Kimmel et al.	Applicant
US6761728(B2)	2004-07-01	Harguth et al.	Applicant
US6788523(B1)	2004-09-01	Hossick-Schott et al.	Applicant
US6827879(B2)	2004-12-01	Shinozaki et al.	Applicant
US6842328(B2)	2005-01-01	Schott et al.	Applicant
US6859354(B2)	2005-02-01	Viste et al.	Applicant
US6885545(B2)	2005-04-01	Michel et al.	Applicant
US6888717(B2)	2005-05-01	Kinard et al.	Applicant
US6914768(B2)	2005-07-01	Matsumoto et al.	Applicant
US6942819(B2)	2005-09-01	Ebel et al.	Applicant
US6965510(B1)	2005-11-01	Liu et al.	Applicant
US7099143(B1)	2006-08-01	Fife et al.	Applicant
US7131988(B2)	2006-11-01	Harguth et al.	Applicant
US7149074(B2)	2006-12-01	Kimmel et al.	Examiner
US7160615(B2)	2007-01-01	Iwaida et al.	Applicant
US7169284(B1)	2007-01-01	Jiang et al.	Applicant
US7171267(B2)	2007-01-01	Harguth et al.	Applicant
US7203055(B2)	2007-04-01	Shin et al.	Applicant
US7279117(B2)	2007-10-01	Komatsu et al.	Applicant
US2002/0028175(A1)	2002-03-01	Fife	Applicant
US2002/0179753(A1)	2002-12-01	Habecker et al.	Applicant
US2003/0026756(A1)	2003-02-01	Kimmel et al.	Applicant
US2003/0172774(A1)	2003-09-01	Naito et al.	Applicant
US2004/0219094(A1)	2004-11-01	Motchenbacher et al.	Applicant
US2004/0225327(A1)	2004-11-01	Norton et al.	Applicant
US2004/0240149(A1)	2004-12-01	Lessner et al.	Applicant
US2004/0240152(A1)	2004-12-01	Hossick-Schott et al.	Applicant
US2004/0243183(A1)	2004-12-01	Norton et al.	Applicant
US2005/0034299(A1)	2005-02-01	Kurihara et al.	Applicant
US2005/0090108(A1)	2005-04-01	Hossick-Schott et al.	Applicant
US2005/0098242(A1)	2005-05-01	Hossick-Schott et al.	Applicant
US2005/0146841(A1)	2005-07-01	Schott et al.	Applicant
US2005/0150576(A1)	2005-07-01	Venigalla	Applicant
US2005/0177193(A1)	2005-08-01	Nielsen et al.	Applicant
US2005/0190530(A1)	2005-09-01	Muffoletto et al.	Applicant
US2006/0028787(A1)	2006-02-01	Yoshida et al.	Applicant
US2006/0091020(A1)	2006-05-01	Hossick-Schott et al.	Applicant
US2006/0139850(A1)	2006-06-01	Rorvick et al.	Applicant
US2006/0187616(A1)	2006-08-01	Norton et al.	Applicant
US2006/0198082(A1)	2006-09-01	Eberhard et al.	Applicant
US2006/0227496(A1)	2006-10-01	Hossick-Schott et al.	Applicant
CA2018346	1990-12-01		Applicant
CN1549286	2004-11-01		Applicant
EP1075884	2001-02-01		Applicant
EP1266386	2002-12-01		Applicant
EP1357086	2003-10-01		Applicant
GB1123015	1968-08-01		Applicant
JP62265119	1987-11-01		Applicant
JP222851	2005-08-01		Applicant
JP223155	2005-08-01		Applicant
WO9738143	1997-10-01		Applicant
WO9819811	1998-05-01		Applicant
WO9838660	1998-09-01		Applicant
WO9957739	1999-11-01		Applicant
WO15555	2000-03-01		Applicant
WO34299	2000-06-01		Applicant
WO56486	2000-09-01		Applicant
WO69588	2000-11-01		Applicant
WO1/26852(A1)	2001-04-01		Applicant
WO171738	2001-09-01		Applicant
WO2086923	2002-10-01		Applicant
WO2005028370	2005-03-01		Applicant
WO2005076297	2005-08-01		Applicant
WO2006127663(A3)	2006-11-01		Applicant

Non-Patent Literature (51)

Abstract of Japanese Patent No. JP1158715 dated Jun. 21, 1989.Applicant
Abstract of Japanese Patent No. JP2023604 dated Jan. 25, 1990.Applicant
U.S. Appl. No. 11/372,486, filed Mar. 9, 2006, Fife et al., Wet Electrolytic Capacitor Containing a Cathode Coating.Applicant
U.S. Appl. No. 11/725,965, filed Mar. 20, 2007, Gang Ning, Neutral Electrolyte for a Wet Electrolytic Capacitor.Applicant
U.S. Appl. No. 11/725,966, filed Mar. 20, 2007, Gang Ning, Cathode Coating for a Wet Electrolytic Capacitor.Applicant
U.S. Appl. No. 11/725,983, filed Mar. 20, 2007, Jones et al., Anode for use in Electrolytic Capacitors.Applicant
U.S. Appl. No. 11/726,029, filed Mar. 20, 2007, Jones et al., Wet Electrolytic Capacitor Containing a Plurality of Thin Powder-formed Anodes.Applicant
Brunauer, et al., Journal of American Chemical Society, “Adsorption of Gases in Multimolecular Layers”, vol. 60, pp. 309-319, 1938.Applicant
Bauer, The Oxides of Niobium, Zeitschrift fuer anorganische und allgemeine Chemie, vol. 248, No. 1, 1941.Applicant
Magneli, et al., “Note on the Crystal Structure of Niobium Dioxide”, Acta Chem. Scand. 9, p. 1402, 1955.Applicant
Lapitskii, et al., Journal of Inorganic Chemistry, USSR, “The Formulation of Lower Oxides of Niobium and Tantalum in Some Reactions of Reduction and Oxidation”, vol. II, No. 1, pp. 122-141, 1957.Applicant
Schwartz, et al., “Niobium Solid Electrolytic Capacitors,” J. Electrochemical Society, 108(8):750-757, 1961.Applicant
Beacom, et al., “Mechanism of Addition Agent Reaction in Bright and Leveling Nickel Deposition”, Journal of the Electrochemical Society, 1961.Applicant
Z. anorg. Allg. Chemie, vol. 317, pp. 321-333, 1962.Applicant
Mifune, et al., “Niobium Solid Electrolytic Capacitors,” National Technical Report 9, 147, 1963.Applicant
Bowman, et al., “The Crystal Structure of Niobium Monoxide” Los Alamos Scientific Laboratory, University of California, 1966.Applicant
Baba, et al., J. Mining and Metallurgical Inst. Of Japan, vol. 82, No. 942, p. 855, 1966.Applicant
Feschotte, et al., “Niobium: Physico-Chemical Properties of its Compounds and Alloys” Atomic Energy Review, Special Issue No. 2, International Atomic Energy Agency pp. 57-59, Vienna, 1968.Applicant
Jackson, et al., “The Use of Niobium as an Anode Material in Liquid Filled Electrolytic Capacitors,” Electrocomponent Science and Technology, vol. 1, pp. 27-37, 1974.Applicant
Vest et al., “Electrical Conductivity in Ceramics and Glass”, Department of the Air Force, Aerospace Research Laboratories Wright-Patterson Air Force Base, Ohio, pp. 375-384, 1974.Applicant
Gannon, et al., “The Microstructure of Slightly Substoichiometric NbO2”, J. Solid State Chemistry, 20, pp. 331-345, 1976.Applicant
J. Electrochemical Society: Review and News, 24(12):408C-409C, 1977.Applicant
Palatnik, et al., “Heat Field Stability and Crystallization Peculiarities of Amorphous Nb2O5, Films” Fizika I Khimiya Obrabotki Materialov, No. 5, pp. 87-94, 1980.Applicant
Bord, et al., “Quality of Niobium Oxide Semiconductor Capacitors as a Function of Chemical Composition of the Niobium Powder,” No. 1(46):11-15, 1982.Applicant
Ivanovskiy, et al., “Method for the Production of Bulk Porous Anodes for Electrolytic Capacitors”, 1983.Applicant
Krehl, et al., “The Influence of Gas Atmospheres on the First Stage Sintering of High-Purity Niobium Powders,” Metallurgical Transactions A, vol. 15A, 1111-1116, 1984.Applicant
Orlov, et al., “Study of Oxygen Solubility in Niobium,” Izvestiya Akademii Nauk SSSR, Metally, No. 5, pp. 202-205, 1985.Applicant
Petrucci, et al., “Growth of Thin-Film Niobium and Niobium Oxide Layers by Molecular Beam Epitaxy”, J. Appl. Phys. 63 (3), pp. 900-909, 1987.Applicant
Sumin, “Study of NbO by Neutron Diffraction of Inelastic Scattering of Neutrons”, Sov. Phys. Crystallogr., 34(3), 1989.Applicant
Japanese Abstract for Publication No. 01-176226, 1989.Applicant
Japanese Abstract for Publication No. 02-038501, 1990.Applicant
Japanese Abstract for Publication No. 03-023222, 1991.Applicant
Levinskiy, et al., “Change in Porous Structure and Leakage Currents of Niobium Capacitor Anodes During Electrolytic Oxidation,” Poroshkovaya Metallurgiya, 3:56-59, 1991.Applicant
Japanese Abstract for Publication No. 04-070594, 1992.Applicant
Kuz'michevea, et al., “Superconductivity in the System Ln-Sr-Nb-O”, vol. 38(1), pp. 162-166, 1992.Applicant
Eckert, “Niobium Compounds and Alloys,” Int. J. Refractory Metals and Hard Materials, 12:335-340, 1993-94.Applicant
Yelyutin, et al., “Material For Anodes of Electrolytic and Oxide Semiconductor Capacitors”, 1994.Applicant
“Material Safety Data Sheet for NbO”, ESPI Metals (1994).Applicant
Acrivos, et al., “Dynamic Phenomena in Superconducting Oxides Measured by ESR” Phys. Rev. B: vol. 50(18), pp. 13710-13723, 1994.Applicant
Acrivos, et al., “Dynamics of Flux Motion Observed by ESR in Superconducting Oxides” Physica C (Amsterdam) 235-240, pp. 3159-3160, 1994.Applicant
Al-Kharafi, et al., “Phosphoric Acid Passivated Niobium and Tantalum EIS-Comparative Study,” Electrochimica Acta, vol. 40, No. 16:2623-2626, 1994-95.Applicant
Erarslanoglu, et al., “Oxidative Coupling of Methane Over NbO (p-type) and Nb2O5 (n-type) Semiconductor Materials”, Catalysis Letters, 38, pp. 215-218, 1995-96.Applicant
Alfa Aesar Product Catalog, 1995-1996.Applicant
Encyclopedia of Chemical Technology, vol. 17, 4th Edition, pp. 59 and 65-66, 1996.Applicant
An, et al., “High-Capacitance Supercapacitor Using a Nanocomposite Electrode of Single-Walled Carbon Nanotube and Polypyrrole”, Journal of the Electrochemical Society, 149 (8) pp. A1058-A1062, 2002.Applicant
Ramasamy, et al., “Electrochemical Characterization of a Polypyrrole/CO0.2CrOχ Composite as a Cathode Material for Lithium Ion Batteries”, Journal of Power Sources, 124, pp. 197-203, 2003.Applicant
Peabody, “Investigation of Columbium as an Electrolytic Capacitor Anode, Part II,” U.S. Army Signal Research and Development Laboratory, DA Task NR. 3A99-15-003-04, pp. 1-11, Accession No. ADO603189, Monmouth, NJ, 1962.Applicant
Mellor, “Inorganic and Theoretical Chemistry” vol. IX, pp. 856-857, 1923.Applicant
Young article, “General Characteristics of the Film-Forming Metals: The Relation Between Overpotential and the Fields in the Oxide and Across the Interfaces”, pp. 4-5 of Chapter 2.Applicant
Evans, et al., “Improved Capacitor Using Amorphous RuO2”, Evans Capacitor Company, 9th Int'l Seminar on Double Layer Capacitors and Similar Energy Storage Devices, Deerfield Beach, FL, 1999.Applicant
“Tantalum Nitride: A New Substrate for Solid Electrolytic Capacitors” by T. Tripp; Proceedings of CARTS 2000: 20th Capacitor and Resistor Technology Symposium, Mar. 6-20, 2000.Applicant