US 7,461,560 B2Grant

Strain gauge with moisture barrier and self-testing circuit

Issue Date:2008-12-09

•101 Claims

•13 Drawing Sheets

Abstract

A structure includes a structure surface and a protective cover. The protective cover includes a circuit having a component, a moisture detector, and a radio frequency transmitter. The component is adhesively connected to the structure surface with an adhesive connection. The moisture detector is positioned to provide information about moisture in the protective cover. The circuit is for providing data derived from the component and from the moisture detector to the radio frequency transmitter for external transmission. The component may be a strain sensor. The moisture detector may be a capacitor. A moisture barrier may also be provided.

Metadata

Assignee

MicroStrain, Inc.

Inventors

Steven W. Arms
Christopher P. Townsend
Steven W. Mundell
David L. Churchill

Application Information

Application Number:US 11/091,244

Filing Date:2005-03-28

Priority Date:2005-03-28

Art Unit:2855

Classifications

IPC:

G01M5/00

Patent Drawings (13 sheets)

Description

Related US Patent Applications and Papers

[0001] This patent application is related to the following U.S. patent applications:

[0002] Ser. No. 09/731,066 to Townsend, (“the '066 application”) “Data Collection and Storage Device,” filed Dec. 6, 2000, incorporated herein by reference;
[0003] Ser. No. 10/379,223, to Hamel, et al., (“the '223 application”) “Energy Harvesting for Wireless Sensor Operation and Data Transmission,” filed Mar. 5, 2003, incorporated herein by reference;
[0004] Ser. No. 10/379,224, to Arms, et al., (“the '224 application”) “Robotic System for Powering and Interrogating Sensors,” filed Mar. 5, 2003, incorporated herein by reference; and
[0005] Ser. No. 10/769,642, to Arms, et al., (“the '642 application”) “Shaft Mounted Energy Harvesting for Wireless Sensor Operation and Data Transmission,” filed Jan. 31, 2004 incorporated herein by reference.

[0006] This patent application is also related to a paper by Arms, S. W. et al., “Power Management for Energy Harvesting Wireless Sensors.” (“the power management paper”) Proceedings SPIE Smart Structures and Smart Materials, Paper no. 5763-36, San Diego, Calif., March 2005, incorporated herein by reference.

Field

[0007] This patent application generally relates to strain gauges. More particularly it relates to a wireless strain gauge. It also relates to a strain gauge with an improved moisture barrier and with structure to test itself.

Background

[0008] The quality of data reported by a strain gauge mounted to a metallic substrate depends on the integrity of the adhesive bond between the strain sensor and the substrate. It is generally accepted that the adhesive bond (typically an epoxy) breaks down in the presence of moisture. Swelling of the epoxy due to moisture absorption results in shear stresses at the epoxy/metal interface, and over time, these shear stresses can result in failure of the epoxy bond and de-lamination of the strain gauge.

[0009] One solution to this problem, often employed on large civil structures, is to package the strain gauge within a sandwich of two hermetically sealed stainless steel ribbons. Laser or electron beam is used to provide the sealing. This strain sensitive ribbon is then spot welded to the structure under test. However, this spot welding process creates localized changes in the steel's microstructure which may be subject to higher than normal rates of corrosion. For many applications of welded structures, the creation of corrosion focus points is considered unacceptable, as these could result in degradation in the physical appearance, added maintenance costs, or even the initiation of material failure. Therefore protection against moisture is desired.

[0010] None of the systems for connecting a strain sensor to a structure have been satisfactory in providing a reliable bond that is resistant to moisture degradation without affecting structural properties. In addition, when moisture degradation occurs there has been no way to recognize that data coming from the sensor is not acceptable. Thus, a better system for connecting strain sensors to structures is needed, and this solution is provided by the following.

Summary

[0011] One aspect is a structure that includes a structure surface and a protective cover. The includes a circuit having a component, a moisture detector, and a radio frequency transmitter. The component is bonded to the structure surface with an adhesive. The moisture detector is positioned to provide information about moisture in the protective cover. The circuit is for providing data derived from the component and from the moisture detector to the radio frequency transmitter for external transmission.

[0012] Another aspect is a structure comprising a structure surface and a protective cover. The includes a component, a circuit, and a moisture barrier. The component is adhesively connected to the structure surface with an adhesive connection. The circuit includes a radio frequency transmitter. The circuit is for providing data derived from the component to the radio frequency transmitter for external transmission. The moisture barrier substantially fills the protective cover.

[0013] Another aspect is a method of mounting a strain gauge to a structure surface. The method includes providing a strain sensor, a capacitor, an adhesive and a transmitter, wherein the capacitor has a capacitance subject to change with curing or with moisture. The strain sensor is then mounted on the structure surface with the adhesive. The capacitor is mounted on the structure surface. Data derived from the strain sensor is provided to the transmitter and the transmitter transmits the data. A parameter of the capacitor is monitored to detect problems with curing or moisture.

Brief Description of Drawings

[0014] FIG. 1a is a top view of a prior art dielectrometer for cure monitoring of composite materials with a comb like structure;

[0015] FIG. 1b is a top view of a prior art humidity sensor with a comb like sructure;

[0016] FIG. 2a is a top view of one embodiment of a patterned capacitance sensor integrated with a strain gauge;

[0017] FIG. 2b is a top view of another embodiment of a patterned capacitance sensor integrated with a strain gauge in which pads are formed of windows or stripes of metal in the bonding pad area;

[0018] FIGS. 3a-3c are cross sectional views of different embodiments of the capacitance sensor integrated with the strain gauge of FIGS. 2a, 2b with air, polyimide, and epoxy dielectrics;

[0019] FIG. 4a is a schematic/block diagram of an embodiment including a sensor node and a base station in which the sensor node has both a strain gauge and a moisture sensor;

[0020] FIG. 4b is a schematic/block diagram of an embodiment including a capacitive moisture sensor and a microprocessor with an oscillator;

[0021] FIG. 5 is a flow chart showing an embodiment of a process to attach and protect a self-testing strain gauge node to a surface of a structure;

[0022] FIG. 6 is a cross sectional view of an embodiment of a temporary mounting fixture during use for attaching a strain gauge and moisture sensor to a steel structure;

[0023] FIG. 7 is a three dimensional view of an embodiment of a tape mounted protective cover for protecting a strain gauge and moisture sensor in which the protective cover includes an integrated replaceable sealed battery and openings for wax insertion;

[0024] FIG. 8 is a three dimensional view of an embodiment of a process for filling a protective cover with molten wax;

[0025] FIGS. 9a-9c are cross sectional views similar to those of FIGS. 3a-3c with an additional thin film of wax, grease, waxoyl or anticorrosion formula; and

[0026] FIGS. 10a-10c are three dimensional views of another embodiment of a tape mounted protective cover for protecting a strain gauge and moisture sensor in which the printed circuit board is mounted to the protective cover, and the protective cover also includes an integrated replaceable sealed battery and openings for wax insertion.

Detailed Description

[0027] The present inventors recognized that substantial improvement in strain sensor reliability could be achieved by providing an improved moisture barrier and by providing a self testing scheme so that delamination or other problems could be detected and the strain sensor replaced. They recognized that they could provide a for the strain sensor and fill the with wax to substantially improve resistance to moisture penetration. They also recognized that for some dielectrics capacitance of a capacitor adjacent to the strain sensor could provide data about the magnitude of moisture penetration and the potential for degradation of the epoxy bonding the strain sensor to the substrate surface to which it is mounted. They also recognized that the scheme could also be used to monitor the curing of the epoxy or of other polymers.

[0028] The structure to which the strain sensor may be attached may be a building, a bridge, or a vehicle, such as a car, a truck, a ship, construction equipment, or excavation machinery. The structure can also be the spinning shaft of a motor, pump, generator or other spinning device.

[0029] A hard-wired system that uses a comb-like structure patterned on polyimide as a dielectrometer for cure monitoring of composite materials are described in a manual, “Eumetric 100A Dielectrometer Cure Monitoring System User's Guide,” available from Holometrix, formerly Micromet, Newton Centre, Mass. and shown in FIG. 1a. The dielectrometer reflects the degree of cross-linking of the polymer chains, which can be related to strength. Higher dielectric constants indicate stronger material properties.

[0030] The dielectric constant measured in such a device is greatly influenced by the presence of moisture because the dielectric constant of air is one, but the dielectric constant of water is 80. A patterned humidity sensor developed at Dublin City University is described in a paper, “Humidity Sensors,” available at http://www.dcu.ie/˜best/hs1.htm, includes comb-like structure, as shown in FIG. 1b. This sensor uses polyimide as the moisture sensing dielectric material because of its excellent thermal and electrical stability. It also uses a silicon nitride substrate.

[0031] Such a capacitance monitoring technique has not previously been used to monitor moisture in the vicinity of a strain gauge's epoxy bond or attachment to the surface of the structure to which the strain gauge is affixed.

[0032] The present strain sensing system has the ability to monitor and report on the integrity of its own encapsulation by monitoring the moisture content of the epoxy or the moisture content adjacent to the epoxy. Self-testing of the integrity of the encapsulation is accomplished by measuring the capacitance of a capacitance sensor that is sensitive to the presence of moisture in the vicinity of the strain gauge/epoxy glue line attachment to the metal or other material of the structure to which it is affixed.

[0033] Patterned capacitance sensor 20 is integrated with and provided around the periphery of strain gauge 22, as shown in top view in FIGS. 2a, 2b. Patterned capacitance sensor 20 includes interdigitated comb metal plates 20a, 20b on polyimide substrate 24, such as a Kapton substrate, as shown in cross section in FIG. 3a. As shown, patterned capacitance sensor 20 is located on three sides of small 5000 ohm strain gauge 22, such as the Micro-Measurements model N3K-06-S022H-50C/DP. Capacitance sensor 20 is preferably un-encapsulated and its polyimide substrate 24 is preferably in direct contact with the same epoxy adhesive 26 used to affix strain gauge 22 to surface 28 of structure 30.

[0034] Capacitance sensor 20 and strain sensor 22 are both fabricated by lithographically providing metal lines 20a, 20b, 22′ on polyimide substrate 24, as shown in FIG. 3a. Sensor assembly 32, including capacitance sensor 20 and strain sensor 22, are preferably epoxy bonded with epoxy 26 to surface 28 of structure 30, such as a machine, bridge, vehicle or any other structure. In one embodiment, shown in FIG. 3a, polyimide cap 34 is provided to protect metal lines 20a, 20b, 22′ from mechanical damage. Capacitance of capacitance sensor 20 changes as moisture content of air dielectric 36 between plates 20a, 20b of capacitance sensor 20 changes.

[0035] In another embodiment, polyimide dielectric 36′, or another polymer that has a dielectric constant sensitive to the presence of moisture, is provided between plates 20a, 20b of capacitance sensor 20, as shown in FIG. 3b. Alternatively, polyimide cap 34 is omitted and mounting epoxy is itself provided on the surface of capacitance sensor 20 and between metal plates 20a, 20b to provide epoxy dielectric 36″ between plates 20a, 20b of capacitance sensor 20, as shown in FIG. 3c. Should moisture reach mounting epoxy 26, it will also be present in air dielectric 36, polyimide dielectric 36′, or epoxy dielectric 36″, and change the capacitance of capacitance sensor 20.

[0036] In another approach, capacitance of the strain sensor itself is used as the moisture sensor. While electrical contact to the surface 28 of structure 30 would provide a two plate capacitance with polyimide substrate 24 and mounting epoxy 26 serving as the dielectric in that case, no electrical contact to the structure surface is actually needed. With a high frequency signal applied across strain gauge 22, as described herein above for separate capacitance sensor 20, changes in dielectric properties in its neighborhood could be detected, including changes from moisture penetration adjacent strain gauge 22.

[0037] The change in capacitance of capacitor sensor 20 is detected by capacitance signal conditioning circuit 50, A/D converter 52, and microprocessor 54 and transmitted externally by transmitter 56 through antenna 58, as shown in FIG. 4a. These components are all located on circuit board 59 that is also bonded to surface 28 of structure 30. Base station 62 receives transmission from antenna 58 and from other sensor nodes that may be nearby. Signal conditioning circuit 50 includes, sine or square wave oscillator 70 that provides a high frequency signal to capacitive divider 72 that includes capacitance sensor 20 and reference capacitor 74. Reference capacitor 74 has an inorganic dielectric and is insensitive to changes in humidity. Output of capacitance divider 72 will track changes in capacitance in humidity sensitive capacitive sensor 20, and this signal is amplified in AC amplifier 76, rectified in full wave synchronous rectifier 78, and filtered in low pass filter 80 to provide a DC output proportional to the difference in capacitance between capacitors 20 and 74. If this number stays constant then capacitance sensor 20 has not changed and humidity has not entered. Thus, the present invention provides self-testing of the integrity of the epoxy bond between sensor assembly 32 and structure surface 28 and wireless transmission of the integrity data.

[0038] An alternative embodiment to determine change in capacitance of capacitive sensor 20 is shown in FIG. 4b. An AC signal generated by a program running on microprocessor 54 derived from the microprocessor clock is provided across outputs 82, 84 of microprocessor 54. Input 86 receives a signal resulting from RC delay across resistor 88 and capacitive sensor 20. This delay will change as moisture level increases between plates 20a, 20b of capacitive sensor 20. Microprocessor 54 detects the presence of moisture based on the delay between output signal 82 and input signal 86.

[0039] Uni-axial, bi-axial and triaxial strain gauges, such as those available from Vishay Micromeasurements, Raleigh, N.C. can be used, such as part numbers CEA-06-125UW-350, CEA-06-125UT-350, and CEA-06-125UA-350. Principal strain magnitudes and strain directions can be computed, as described in a textbook by James W. Dally & William F. Riley, “Experimental Stress Analysis”, Third Edition, Chapter 9, Strain-Analysis Methods, pp 311-315 publisher: McGraw-Hill, Inc.,. NY, N.Y. (c) 1991, 1978, 1965 by Dally and Reilly. These gauges include resistors, and the resistance changes both from changes in strain and from changes in moisture. The gauges do not include ability to detect moisture and do not include ability to distinguish a change in resistance due to a change in moisture from a change in resistance due to a change in strain. The deleterious effects of moisture and some ways to waterproof are described in the Dally & Riley book on pages 196-197. The present patent application provides a way to detect both strain and moisture and to protect against moisture.

[0040] Microprocessor 54 can receive data from capacitance sensor 20 related to any change in dielectric constant of its dielectric 36, 36′, 36″ and can report this change to base station 62, as shown in FIG. 4a. Information concerning a degraded capacitance sensor 20 that indicates the presence of moisture in dielectric 36, 36′, 36″ between plates 20a, 20b transmitted to base station 62, which will sound an alarm, store the data in memory, and mark that particular sensor assembly 32 for replacement. Sensor assemblies 32 that exhibit capacitance within a tolerance will remain in service transmitting data from surface 28 of structure 30 to which they are mounted. Thus, the present invention provides for self-testing and maintenance of sensors to ensure that they are reliably providing accurate data and that the bonding to structure surfaces has not degraded from moisture penetration.

[0041] FIG. 4a also shows an energy source, such as a battery or an energy harvesting device. These supply Vsupply to processor 54. Processor 54 can control power Vcc to capacitance signal conditioning 50 and A/D converter 52. Processor 54 can also control power Vcc′ to strain gauge 22, strain gauge signal conditioning DC AMP, and the strain gauge A/D converter. Power Vtx can also be provided to transmitter 56 under control of processor 54. Also processor 54 can write data to non-volatile memory 57. A more detailed circuit diagram for a single strain gauge bridge is provided in FIG. 16 of the '642 application. Multiple strain gauge bridges can be provided, as shown in FIG. 2 of the '066 application, which includes a multiplexer.

[0042] Strain gauges have long been bonded to metal surfaces and the process for bonding a strain gauge to a metal surface is well known in the art. A combination of heat and pressure have been used to cure a thin glue line of two-part epoxy between the strain sensing element and the metallic substrate. Over 24 hours is needed at room temperature. About two hours is needed at an elevated temperature of about 150 C. Two-part epoxy with such extended cure time has been used for best results. However, this extended time process has not been easy to deploy in the field, especially if many strain sensor nodes need be attached to a structure. Compromises are typically made to facilitate quick curing, such as the use of cyanoacrylates (super-glues) or one-part epoxies. However, these room temperature, fast-curing adhesives do not provide as strong a bond as extended cure time two-part epoxy, greatly limiting the use of such glue-bonded strain gauges for long term structural health monitoring applications.

[0043] An improved system for in-field connection of a strain gauge to a metal or non-metal structural surface, using optimum epoxy formulations, and with subsequent waterproof encapsulation of the strain gauge and its signal conditioning, data logging, and wireless communication electronics, is needed. The finished package must be low profile, durable, low cost, and suitable for long term deployment. With the self-testing feature described herein above providing wirelessly transmission of information about the ingress of moisture, such a package has potential for much wider use individually or in a network of many such nodes than currently available packages. The application of wireless sensors with data logging elements, signal conditioning electronics and bidirectional electronics has been described in the '066 patent application.

[0044] In addition to providing the self testing for moisture and the wireless transmission of this self-test data feature, the present inventors also provided an improved process to attach and protect their fully integrated, self-testing strain gauge sensor node to a surface of a structure, as shown in the flow chart in FIG. 5. In the first step, surface 28 of structure 30 to which sensor assembly 32 is to be mounted is properly cleaned, as shown in step 200. The surface can be a steel surface or it can be a plastic, composite or any other material.

[0045] In one embodiment strain gauge 22 and moisture sensing capacitance sensor 20 will have already been pre-wired to circuit board 59, or they can be integral with circuit board 59. Circuit board 59 contains supporting electronics and is fully tested for proper operation at the factory. Circuit board 59 can be fabricated of fiberglass materials, such as FR4 or of ceramic materials, such as low temperature co-fired ceramics. Circuit board 59 can also be fabricated of thin flexible insulative materials, such as polyimide. In this embodiment strain gauge 22, moisture sensing capacitance sensor 20, and circuit board 59 can be affixed to the structure using a UV-cured epoxy adhesive, as shown in step 201. UV light is provided to adhesive located under strain gauge 22, moisture sensing capacitance sensor 20, and edges of circuit board 59 accessible to UV light.

[0046] In another embodiment, circuit board 59 may be mounted to protective cover 89, as shown in FIGS. 10a-10b. In this embodiment lead wires from strain gauge 22 and moisture sensing capacitance sensor 20, affixed with a UV-cured epoxy adhesive, are plugged into a receptacle extending from circuit board 59. Circuit board 59 mounted in protective cover 89 can be protected with wax, silicone grease, or another protective material in the factory with only wires and/or a receptacle extending for mating with lead wires from strain gauge 22 and moisture sensing capacitance sensor 20. In this embodiment, protective cover 89 encloses strain gauge 22, moisture sensing capacitance sensor 20, circuit board 59, and lead wires there between.

[0047] The strain and moisture sensing elements are glued directly to the structure's steel substrate, as shown in steps 202 to, using a process more fully described herein below. For attachment to a steel portion of structure 32, magnetic mounts 90 are used to temporarily attach specially designed mounting fixture 92, as shown in step 202 and in FIG. 6. Fixture 92 includes frame 94 held in position by magnetic mounts 90.

[0048] Sensor assembly 32 is applied to surface 28 of structure 30 with epoxy as shown in step 203. Threaded plunger 96 provides compression on sensor assembly 32 including strain gauge 22 and capacitive moisture sensor 20. Threaded plunger 96 is tightened as shown in step 204, to provide compression force on sensor assembly 32.

[0049] Thermoelectric heating element 98 provides heat to more rapidly cure epoxy (not shown) beneath sensor assembly 32 while it is being compressed. Heating element 98 is turned on to cure epoxy as shown in step 205. Temperature and pressure are monitored with temperature sensor 104 and pressure sensor 102, as shown in step 206, and information may be fed back to heating element 98 and threaded plunger 96 or to the operator allowing control over the amount of pressure and heat applied to the assembly. Optionally, capacitance sensor 20 can be used to monitor the state of cure during this step, as shown in step 207 and waiting step 208, and to provide feedback about changes in the dielectric constant of the epoxy during the curing process, as described herein above for the embodiment of FIG. 3c. To accomplish this a temporary power source is provided to circuit board 59 during curing. Rubber pad 100 insures a stable pressure and an even pressure distribution during curing.

[0050] Swivel 106 allows aluminum plate 108 along with heating element 98 freedom of movement to accommodate a tilted surface. Aluminum plate 108 provides for uniform distribution of heat from heating element 98.

[0051] After curing is complete the mounting fixture is removed, as shown in step 209. Next protective cover 89 is installed on sensor assembly 32 and its supporting electronics on printed circuit board as shown in step 210. Finally remaining space in protective cover 89 is filled with wax, as shown in step 211.

[0052] An alternative method for quickly attaching a strain gauge to the substrate is to use an ultraviolet (UV) light curable epoxy. These epoxies are advantageous in that they are cured to provide a strong bond in a matter of seconds with exposure to UV light. They have advantage in that, before exposure to the UV light, the strain gauge can be re-positioned as needed, and then a few seconds exposure fixes the gauge in place. A potential problem is that UV light cannot penetrate the polyimide materials commonly used in strain gauge construction. However, the present inventors found that fiberglass resin backed strain gauges used for high performance transducers become clear when UV epoxy is placed on their backing, transmit UV, and allow UV curable epoxy to be used.

[0053] In preliminary experiments the present inventors bonded several fiberglass resin backed strain gauges from Micro-Measurements, Inc., Atlanta, Ga., with a UV curable epoxy from Epoxy Technology, Inc. Destructive testing of the glue line indicated that a strong bond had been achieved beneath the strain sensing elements. However, testing showed delamination and that the epoxy had not been cured beneath the large copper bonding tab areas. Clearly the UV light did not reach these areas. The present inventors designed a custom strain gauge with windows or stripes of metal in the copper bonding pad area to let sufficient UV light through to cure the epoxy in these areas, as shown in FIG. 2b. In addition to soldering, attachment of lead wires to these pads can be accomplished with electrically conductive UV curable epoxy, available from Allied Chemical Co., division of Honeywell, Plymouth, Minn.

[0054] In the next step in the packaging process protective cover 89 is provided and mounted on surface 28 of structure 30 to enclose sensor assembly 32 and circuit board 59 with its antenna 58, as shown in step 204 and in FIG. 7. Preferably, cover 89 is fabricated of a clear polycarbonate material. Protective cover 89 can include high strength aggressive contact adhesive tape 112, available from 3M Corp., Minneapolis, Minn., on its bottom edges for securing to surface 28 of structure 30. The technician doing the mounting will remove the protective polyethylene film (not shown) covering adhesive tape 112 and visually align battery compartment plug 114 with its mate battery connection header 115 on circuit board 59. Battery compartment plug 114 is wired to battery compartment 116 into which battery 118 can be inserted and sealed with O-ring seal 120 on threaded battery cover 122 that encloses battery 118 in threaded hole 124. Cover 89 will then be pressed onto surface 28 of structure 30 to provide a high strength bond there between.

[0055] To maintain a long life for battery 118, the power management paper describes techniques to reduce power consumption, extending the life of battery 118. These energy saving strategies are also useful when energy harvesting systems are deployed, such as those describes in the '223 patent application to Hamel and the '642 patent application to Arms. The energy harvesting methods could be used to eliminate battery 118 and energy can be stored on a capacitor, as described in these patent applications. The present inventors found that low leakage electrochemical batteries exhibited characteristics that were favorable for use with energy harvesting. Battery 118 can be a rechargeable battery and energy harvesting can be used to recharge battery. Alternatively, electromagnetic energy can be provided to recharge battery 118 as described in the '224 application. Alternatively, a charger can be plugged into the sensor node to charge battery 118.

[0056] The '642 application also provides a scheme for performing automatic and wireless shunt calibration and for adjusting offsets and gains wirelessly.

[0057] Next, wax moisture barrier 130 is provided to protect components on circuit board 59 and sensor assembly 32 including strain sensor 22 and capacitive sensor 20 as shown in FIG. 9. It is well known that microcrystalline wax is the most effective organic barrier material currently available for protecting strain gauge circuits from moisture. Wax is reported to be superior to butyl rubber and silicone rubber because both of these materials absorb moisture from the environment while wax rejects moisture. But there are several disadvantages of using wax barriers, including weak mechanical properties, a tendency to become brittle at extremely low temperatures, and a low melting point of 170 deg F. or 80 degrees C.

[0058] The present inventors found that problems associated with the weak mechanical strength of wax 130 could be avoided by providing wax 130 inside polycarbonate protective cover 89 to control and protect wax 130 from mechanical damage as shown in FIG. 8. They provided injection gun 132 filled with liquid polycrystalline wax 130 to fill protective cover 89 and encapsulate sensor assembly 32 and electronics on circuit board 59 inside cover 89 after cover 89 has been mounted to surface 28 of structure 30. Inlet filling tube 134 is connected to threaded wax inlet hole 136 of protective cover 89 using polytetraflourethylene (Teflon) tubing. Molten wax 130 is injected into cover 89 through inlet hole 136 until cover 89 is visually full of wax 130 and wax 130 begins to be extruded out of outlet hole 138 and into outlet tube 140 in cover 89, as shown in FIG. 8.

[0059] The present inventors found that a variety of protective materials can be used, including wax, grease, a foam protective agent, and anticorrosion formulas, such as ACF-50. Thin film 150 of wax, grease, waxoyl or anticorrosion formula is shown in FIGS. 9a-9c. Waxoyl is available from Waxoyl AG, Basel, Switzerland. ACF-50 is available from Lear Chemical Research Corp, Mississauga, Ontario, Canada.

[0060] The foam protective agent can be a urethane expanding foam, which can be obtained from a manufacturer, such as Fomo Products, Inc., Norton, Ohio. This urethane foam is available in many forms although a 2 component aerosol would be easiest to use in this application due to the 2 minute cure time and its ability to be sprayed through a long tube into the enclosure opening. This material is water proof, expanding, bonds to many surfaces, and is slightly flexible. The expansion will ensure that all of the components including the strain gauge and electronics are thoroughly coated.

[0061] In addition, vent 170, such as a vent provided by W. L. Gore and Associates, Inc., Newark, Del., may be provided to provide pressure equalization without allowing moisture to pass.

[0062] Protective cover 160 has a rounded convex outer surface with curvature extending from the structure surface to which it is attached, as shown in FIGS. 10a. This shape facilitates transfer of many impact loads that might shear adhesive bond 162 into compression loads. Thus a falling object is less likely to cause breakage of adhesive tape 112 holding protective cover 160 to the structure surface. Protective cover 160 includes printed circuit board 59 mounted to mounting bosses 164 on bottom surface 166 with screws 168, as shown in FIG. 10b.

[0063] Protective cover 160 also includes adhesive tape 112 for adhesively attaching protective cover 160 to a structure surface, as shown in FIG. 10c. Inlet hole 136 and outlet hole 138 are provided as described herein above, as shown in FIG. 10a. Inlet hole 136 and outlet hole 138 may be threaded to accommodate a plug and o-ring for sealing purposes after filling is complete. Gore vent 170 can be provided as well.

[0064] Battery compartment 114 is also provided with its cover 122 and o-ring seal 120. Positive return 172 extends from the positive terminal of battery 118 to printed circuit board 59. Spring 174 for the negative terminal of battery 118 is also provided.

[0065] While the disclosed methods and systems have been shown and described in connection with illustrated embodiments, various changes may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. The examples given are intended only to be illustrative rather than exclusive.

Claims

What is claimed is:

1. A system, comprising a structure and a device, wherein said structure has a structure surface, wherein said device is mounted on said structure surface, wherein said device includes a protective cover, a circuit, a strain sensor, a moisture detector, and a radio frequency transmitter, wherein said strain sensor is bonded to said structure surface with a bond susceptible to damage from moisture, wherein said circuit, said strain sensor, said moisture detector, and said radio frequency transmitter are located within said protective cover, wherein said moisture detector is positioned to provide information about moisture in said protective cover, and wherein said circuit provides data derived from said strain sensor and from said moisture detector to said radio frequency transmitter for external transmission wherein said moisture detector comprises a capacitor.

2. A system, as recited in claim 1, further comprising a thin flexible substrate, wherein said strain sensor and said moisture detector are both mounted on said thin flexible substrate, wherein said thin flexible substrate is bonded to said structure.

3. A system, as recited in claim 2, wherein said thin flexible substrate includes an insulative material including at least one from the group consisting of polyimide and fiberglass.

4. A system, as recited in claim 1, wherein said moisture detector extends on three sides of said strain sensor.

5. A system, as recited in claim 1, wherein said strain sensor includes a material having a resistance that varies with changes in strain.

6. A system, as recited in claim 1, further comprising a metal carrier, wherein said strain sensor and said moisture detector are mounted on said metal carrier, wherein said metal carrier is welded to said structure.

7. A system, as recited in claim 1, further comprising an adhesive, wherein said strain sensor is bonded to said structure with said adhesive.

8. A system, recited in claim 1, wherein said device includes a plurality of said strain sensors.

9. A system as recited in claim 1, wherein said capacitor includes a dielectric that has a dielectric constant that varies with the presence of moisture.

10. A system as recited in claim 9, wherein said dielectric includes one from the group consisting of air, polyimide, and epoxy.

11. A system as recited in claim 1, wherein said capacitor is located adjacent said strain sensor.

12. A system as recited in claim 1, wherein said strain sensor includes conductor and dielectric, wherein said strain sensor shares said conductor and dielectric with said capacitor.

13. A system as recited in claim 1, wherein said circuit includes a microprocessor connected to receive data from said strain sensor and from said moisture detector.

14. A system as recited in claim 1, wherein said device further comprises a moisture barrier.

15. A system as recited in claim 14, wherein said moisture barrier comprises a wax material.

16. A system as recited in claim 15, wherein said wax material substantially fills said protective cover.

17. A system, as recited in claim 14, wherein said moisture barrier is within said protective cover.

18. A system, as recited in claim 17, wherein said protective cover includes a first port for filling said protective cover with said moisture barrier and a second port for providing an exhaust while filling.

19. A system, as recited in claim 17, further comprising a processor, a memory, and a power supply within said protective cover.

20. A system, as recited in claim 17, wherein said protective cover is a preformed protective cover.

21. A system, as recited in claim 20, wherein said preformed protective cover includes a vent to provide pressure equalization without allowing moisture to pass.

22. A system, as recited in claim 1, further comprising a temperature sensor within said protective cover.

23. A system, as recited in claim 1, wherein said structure includes at least one from the group consisting of a building, a bridge, a vehicle, construction equipment, and excavation machinery.

24. A system, as recited in claim 23, wherein said vehicle includes a car, a truck, and a ship.

25. A system, as recited in claim 1, wherein said structure includes a spinning shaft.

26. A system, as recited in claim 25, wherein said spinning shaft is part of at least one from the group consisting of a motor, a pump, and a generator.

27. A system, as recited in claim 1, wherein said moisture detector is positioned in a vicinity of said bond to provide information about moisture in said vicinity.

28. A device, as recited in claim 1, wherein said protective cover is a preformed protective cover.

29. A device, as recited in claim 28, wherein said preformed protective cover includes a vent to provide pressure equalization without allowing moisture to pass.

30. A system, as recited in claim 1, wherein said strain sensor is bonded to said structure with a UV light curable adhesive.

31. A system, as recited in claim 30, wherein said strain sensor has a backing, wherein said backing transmits UV light.

32. A system, as recited in claim 31, wherein said backing includes fiberglass.

33. A system, as recited in claim 31, further comprising a bonding pad on said backing for providing electrical contact to said strain sensor, wherein said bonding pad includes at least one from the group consisting of a window and a stripe for facilitating UV light transmission to said UV light curable adhesive.

34. A system, as recited in claim 1, wherein said structure includes a civil structure.

35. A system, as recited in claim 1, wherein said structure includes a machine.

36. A method of monitoring, comprising:

a. providing a circuit including a moisture detector, a moisture barrier, a second electronic component, and a radio frequency transmitter, wherein said second electronic component has a function different from detecting moisture, wherein said moisture detector is located to provide information about moisture in a location including at least one from the group consisting of in said second electronic component and around said second electronic component, and wherein said moisture barrier is located to protect said second electronic component and said radio frequency transmitter from moisture, wherein said moisture detector is located to detect moisture within said moisture barrier;

b. providing a protective cover and enclosing said moisture detector, said second electronic component, said moisture barrier, and said radio frequency transmitter within said protective cover;

c. providing data derived from said second electronic component to said radio frequency transmitter for external transmission; and

d. monitoring said moisture detector.

37. A method as recited in claim 36, wherein said moisture detector includes a capacitor.

38. A method as recited in claim 37, wherein said capacitor includes a dielectric that has a dielectric constant that varies with the presence of moisture.

39. A method as recited in claim 38, wherein said dielectric includes at least one from the group consisting of air, polyimide, and epoxy.

40. A method as recited in claim 38, wherein said dielectric comprises a curable material and wherein said capacitor is sensitive to amount of curing of said curable material, wherein the method further comprises monitoring curing by monitoring capacitance of said capacitor.

41. A method as recited in claim 37, wherein said capacitor is located adjacent said second electronic component.

42. A method as recited in claim 37, wherein said second electronic component includes conductor and dielectric, wherein said second electronic component shares said conductor and dielectric with said capacitor.

43. A method as recited in claim 36, wherein said second electronic component comprises a sensor.

44. A method as recited in claim 43, wherein said sensor comprises a strain sensor.

45. A method as recited in claim 36, further comprising rejecting data from said second electronic component while moisture level determined from said moisture detector is outside a specification.

46. A method as recited in claim 36, wherein said circuit further comprises a microprocessor and a signal conditioner connected to receive data from said second electronic component and from said moisture detector.

47. A method as recited in claim 36, wherein said moisture barrier comprises a wax material.

48. A method as recited in claim 47, further comprising substantially filling said protective cover with said wax material.

49. A method as recited in claim 36, wherein said moisture barrier comprises a thin layer on said moisture detector and on said second component.

50. A method as recited in claim 36, wherein said moisture barrier comprises a foam material.

51. A method, as recited in claim 36, wherein said protective cover is a preformed protective cover.

52. A method, as recited in claim 51, wherein said preformed protective cover includes a vent to provide pressure equalization without allowing moisture to pass.

53. A method of mounting a strain sensor to a structure, comprising:

a. providing a structure and a component, said structure having a structure surface, said component including a strain sensor, a capacitor, an adhesive and a transmitter, wherein said structure is subject to strain from a source other than from said component, wherein said capacitor has a capacitance subject to change with at least one from the group consisting of curing and moisture;

b. mounting said strain sensor, said capacitor, and said transmitter on said structure surface, wherein said strain sensor is mounted on said structure surface with said adhesive, wherein said strain sensor is mounted for detecting said strain in said structure;

c. providing data derived from said strain sensor to said transmitter and transmitting said data; and

d. monitoring a parameter of said capacitor to detect problems with said at least one from the group consisting of curing and moisture.

54. A method as recited in claim 53, wherein said capacitor includes a dielectric that is sensitive to the presence of moisture.

55. A method as recited in claim 54, wherein said dielectric has a dielectric constant that varies with the presence of moisture.

56. A method as recited in claim 53, further comprising the step of rejecting data from said strain sensor while said capacitance is outside a specification.

57. A method as recited in claim 53, wherein said capacitor is located adjacent said strain sensor.

58. A method as recited in claim 53, wherein said strain sensor includes conductor and dielectric, wherein said strain sensor shares said conductor and dielectric with said capacitor.

59. A method as recited in claim 53, wherein said circuit further comprises a microprocessor and a signal conditioner connected to receive data from said strain sensor and from said capacitor.

60. A method as recited in claim 53, further comprising providing a protective cover and a moisture barrier.

61. A method as recited in claim 60, wherein said moisture barrier comprises a wax material.

62. A method, as recited in claim 60, wherein said protective cover is a preformed protective cover.

63. A method, as recited in claim 62, wherein said preformed protective cover includes a vent to provide pressure equalization without allowing moisture to pass.

64. A method as recited in claim 53, wherein said parameter is RC delay of an RC circuit including said capacitor.

65. A method as recited in claim 53, wherein said parameter is capacitance of said capacitor.

66. A system, comprising a structure and a device, wherein said structure has a structure surface, wherein said device is mounted on said structure surface, wherein said device includes a protective cover, a moisture barrier, a circuit, a strain sensor, a moisture detector, and a radio frequency transmitter, wherein said moisture barrier is within said protective cover, wherein said strain sensor is bonded to said structure surface with a bond susceptible to damage from moisture, wherein said circuit, said strain sensor, said moisture detector, and said radio frequency transmitter are located within said moisture barrier, wherein said moisture detector is positioned to provide information about moisture within said moisture barrier, and wherein said circuit provides data derived from said strain sensor and from said moisture detector to said radio frequency transmitter for external transmission.

67. A system, as recited in claim 66, further comprising a thin flexible substrate, wherein said strain sensor and said moisture detector are both mounted on said thin flexible substrate, wherein said thin flexible substrate is bonded to said structure.

68. A system, as recited in claim 67, wherein said thin flexible substrate includes an insulative material including at least one from the group consisting of polyimide and fiberglass.

69. A system, as recited in claim 66, wherein said moisture detector extends on three sides of said strain sensor.

70. A system, as recited in claim 66, wherein said strain sensor includes a material having a resistance that varies with changes in strain.

71. A system, as recited in claim 66, further comprising a metal carrier, wherein said strain sensor and said moisture detector are mounted on said metal carrier, wherein said metal carrier is welded to said structure.

72. A system, as recited in claim 66, further comprising an adhesive, wherein said strain sensor is bonded to said structure with said adhesive.

73. A system, as recited in claim 66, wherein said device includes a plurality of said strain sensors.

74. A system as recited in claim 66, wherein said moisture detector comprises a capacitor.

75. A system as recited in claim 74, wherein said capacitor includes a dielectric that has a dielectric constant that varies with the presence of moisture.

76. A system as recited in claim 75, wherein said dielectric includes one from the group consisting of air, polyimide, and epoxy.

77. A system as recited in claim 76, wherein said capacitor is located adjacent said strain sensor.

78. A system as recited in claim 66, wherein said strain sensor includes conductor and dielectric, wherein said strain sensor shares said conductor and dielectric with said moisture detector.

79. A system as recited in claim 66, wherein said circuit includes a microprocessor connected to receive data from said strain sensor and from said moisture detector.

80. A system as recited in claim 66, wherein said moisture barrier comprises a wax material.

81. A system as recited in claim 80, wherein said wax material substantially fills said protective cover.

82. A system, as recited in claim 66, wherein said protective cover includes a first port for filling said protective cover with said moisture barrier and a second port for providing an exhaust while filling.

83. A system, as recited in claim 66, further comprising a processor, a memory, and a power supply within said moisture barrier.

84. A system, as recited in claim 66, wherein said protective cover is a preformed protective cover.

85. A system, as recited in claim 84, wherein said preformed protective cover includes a vent to provide pressure equalization without allowing moisture to pass.

86. A system, as recited in claim 66, further comprising a temperature sensor within said moisture barrier.

87. A system, as recited in claim 66, wherein said structure includes at least one from the group consisting of a building, a bridge, a vehicle, construction equipment, and excavation machinery.

88. A system, as recited in claim 87, wherein said vehicle includes a car, a truck, and a ship.

89. A system, as recited in claim 66, wherein said structure includes a spinning shaft.

90. A system, as recited in claim 89, wherein said spinning shaft is part of at least one from the group consisting of a motor, a pump, and a generator.

91. A system, as recited in claim 66, wherein said moisture detector is positioned in a vicinity of said bond to provide information about moisture in said vicinity.

92. A method of monitoring, comprising:

a. providing a circuit including a moisture detector, a moisture barrier, a second electronic component, and a radio frequency transmitter, wherein said second electronic component comprises a sensor and has a function different from detecting moisture, wherein said moisture detector is located to provide information about moisture in a location including at least one from the group consisting of in said second electronic component and around said second electronic component, and wherein said moisture barrier is located to protect said second electronic component and said radio frequency transmitter from moisture, wherein said moisture detector is located to detect moisture within said moisture barrier;

b. providing data derived from said second electronic component to said radio frequency transmitter for external transmission; and

c. monitoring said moisture detector.

93. A method as recited in claim 92, wherein said moisture detector includes a capacitor.

94. A method as recited in claim 93, wherein said capacitor includes a dielectric that has a dielectric constant that varies with the presence of moisture.

95. A method as recited in claim 94, wherein said dielectric includes at least one from the group consisting of air, polyimide, and epoxy.

96. A method as recited in claim 94, wherein said dielectric includes a curable material and wherein said capacitor is sensitive to amount of curing of said curable material, wherein the method further comprises monitoring curing by monitoring capacitance of said capacitor.

97. A method as recited in claim 93, wherein said capacitor is located adjacent said second electronic component.

98. A method as recited in claim 93, wherein said second electronic component includes conductor and dielectric, wherein said second electronic component shares said conductor and dielectric with said capacitor.

99. A method as recited in claim 92, wherein said sensor comprises a strain sensor.

100. A method as recited in claim 92, further comprising rejecting data from said second electronic component while moisture level determined from said moisture detector is outside a specification.

101. A method as recited in claim 92, wherein said circuit further comprises a microprocessor and a signal conditioner connected to receive data from said second electronic component and from said moisture detector.

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Abstract

Description

Related US Patent Applications and Papers

[0001] This patent application is related to the following U.S. patent applications:

[0002] Ser. No. 09/731,066 to Townsend, (“the '066 application”) “Data Collection and Storage Device,” filed Dec. 6, 2000, incorporated herein by reference;
[0003] Ser. No. 10/379,223, to Hamel, et al., (“the '223 application”) “Energy Harvesting for Wireless Sensor Operation and Data Transmission,” filed Mar. 5, 2003, incorporated herein by reference;
[0004] Ser. No. 10/379,224, to Arms, et al., (“the '224 application”) “Robotic System for Powering and Interrogating Sensors,” filed Mar. 5, 2003, incorporated herein by reference; and
[0005] Ser. No. 10/769,642, to Arms, et al., (“the '642 application”) “Shaft Mounted Energy Harvesting for Wireless Sensor Operation and Data Transmission,” filed Jan. 31, 2004 incorporated herein by reference.