LED package including a frame

[0001] 1. Field of the Invention

[0002] The present invention relates to a power LED package module, and especially to a power LED package for increasing efficiency of heat dissipation and separating electrical conduction and heat conduction.

[0003] 2. Description of Related Art

[0004] According to the manufacturing technology of LEDs and the increasing expansion of the application range of LEDs, it is necessary to increasingly raise the brightness of LEDs. The first method to achieve this goal is to increase the light-emitting efficiency of LEDs or photoelectrical exchange efficiency of LEDs. The second method is to increase the power of LEDs. The second method is a popular method in manufacturing. The temperature of the PN junctions is increasingly raised according to the increase of the input current in a light-emitting chip of LEDs. The excessive temperature of the PN junctions reduces the power of the light emission of LEDs. Moreover, the support of the light-emitting chip and the package body has different thermal expansion coefficients, so that the rate of the contraction and expansion are different. Therefore, the light-emitting chip bears a larger mechanical force and reduces or loses the capability of the light emission. Hence, it is important to solve the problem of heat dissipation in a LED package module for holding the PN junctions at a lower temperature.

[0005] Referring to FIG. 1, the T.W. Pat. 433553 provides a LED package heat-dissipating structure, which comprises a heat-dissipating block 10a, a conductive pin 11a, a light-emitting chip 12a, a heat-conducting pipe 13a and a package body 15a. The heat-dissipating block 10a is fixed on a bottom portion of the conductive pin 11a. The light-emitting chip 12a is arranged on a top portion of the conductive pin 11a. The heat-conducting pipe 13a is connected to a heat-dissipating body of a PCB 14a and the heat-dissipating block 10a. The heat-dissipating block 10a, a conductive pin 11a and a light-emitting chip 12a are packaged via the package body 15a.

[0006] However, the heat-dissipating block 10a is arranged on the bottom portion of the conductive pin 11a, so that electrical conduction and heat conduction occur together between the light-emitting chip 12a and the conductive pin 11a. When the LED package heat-dissipating structure is connected on the PCB 14a, the conductive pin 11a will transmit the high heat of the solder to the light-emitting chip 14a. The high heat damages the light-emitting chip 12a and reduces the lifetime.

[0007] Referring to FIG. 2, the U.S. Pat. No. 6,274,924 B1 provides another LED package heat-dissipating structure, which comprises a heat-exchanging block 20a, frame body 30a, light-emitting chip 40a, heat-conducting piece 50a and an optical lens 60a. The frame body 30a includes a metal structure with a fixed shape and a plastic structure with a receiving space. The heat-exchanging block 20a is embedded in the receiving space of the plastic structure. The light-emitting chip 40a and the heat-conducting piece 50a are respectively arranged to one another in series on the heat-exchanging block 20a. The light-emitting chip 40a is connected to a metal of the frame body 30a, and the optical lens 60a is attached on the plastic structure to form a LED package structure for separating the heat conduction and electrical conduction. As is evident, the LED package structure of related art is structurally complex, so it increases costs.

[0008] The primary object of the present invention is to provide a power LED package module. The power LED package module includes a conductive pin and a support separated from each other in order to prevent heat conduction from communicating with electrical conduction as well as to avoid conducting heat from the conductive pin to the light-emitting chip. The power LED package module further includes a package body, and a chip heat-conducting support with a part exposed outside the package body to connect with a heat-dissipating element for increasing the efficiency of the heat dissipation and lifetime. The chip heat-conducting support also has the advantages of simpler structure and cheaper cost than the related art.

[0009] In order to achieve the above objects, the present invention provides a power LED package module comprising a frame, a chip heat-conducting support, at least one light-emitting chip and a package body.

[0010] The frame has at least two conductive pins and a support. The conductive pins and the support are separated from each other. The chip heat-conducting support is connected to the support. The light-emitting chip is arranged on the chip heat-conducting support and electrically connects to the conductive pins.

[0011] The package body connects to the conductive pins, the support and the chip heat-conducting support, and the one light-emitting chip is packaged on the chip heat-conducting support. A part of the chip heat-conducting support is exposed from the package body.

[0012] Furthermore, the present invention provides a frame of a power LED package module comprising a plurality of supports, a plurality of conductive pins and a plurality of connected portions.

[0013] Each of the supports has a plurality of support pins and a plurality of ring bodies. Each of the ring bodies is connected to a side portion of the corresponding support pin. Each of the ring bodies is connected to a corresponding chip heat-conducting support. The conductive pins are parallel to the corresponding supports. Each of the connected portions is connected vertically to the corresponding support pin and corresponding two of conductive pins.

[0014] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.

[0026] Referring to FIG. 3, the present invention provides a power LED package module. The power LED package module includes a frame 10, a chip heat-conducting support 20, a light-emitting chip 30 and a package body 40. The frame 10 has four conductive pins 11 and a support 15. The light-emitting chip 30 is arranged on the chip heat-conducting support 20. The chip heat-conducting support 20 connects with the support 15. The package body 40 is disposed on the four conductive pins 11, the support 15 and the chip heat-conducting support 20, in order to package the light-emitting chip 30 on the chip heat-conducting support 20 and expose a part of the chip heat-conducting support 20. Then, when the power LED package module electrically connects to a PCB, the exposure of the part of the chip heat-conducting support 20 contacts against the PCB or a heat-dissipating device for increasing the efficiency of heat dissipation. The four conductive pins 11 and the support 15 are separated from each other for avoiding heat dissipation and electric conduction in the same passageway, and increasing the life of the light-emitting chip 30 by avoiding the heat conducted to the light-emitting chip 30. The chip heat-conducting support 20 with a larger volume has a larger heat capacity for reducing the effect of sudden heat shock, when external temperature is raised suddenly.

[0027] Referring to FIG. 4, the present invention provides a plurality of frames 10. Each of the frames 10 is a flat frame, and has four conductive pins 11, a support 15 and a connected portion 19. The support 15 has two support pins 16, and a ring body 17 that is connected to the two support pins 16. The two support pins 16 are arranged on two opposite sides of the ring body 17, and every two of the four conductive pins 11 are correspondingly arranged on two opposite sides of the support pin 16. Every two of the four conductive pins 11 and the corresponding support pin 16 are connected together by the connected portion 19. The chip heat-conducting support 20 includes a heat-conducting body 21, a projected portion 22, a ring protrusion 23, and a concave light-reflecting portion 24. The projected portion 22 is projected from a topside of the heat-conducting body 21. The concave light-reflecting portion 24 is formed on a topside of the projected portion 22. The ring protrusion 23 surrounds external edge of the projected portion 22. The heat-conducting body 21 can be a rectangular shape. The ring body 17 of the support 15 surrounds the external edge of the ring protrusion 23 and contacts against the topside of the heat-conducting body 21.

[0028] Referring to FIGS. 3 and 4, firstly the light-emitting chip 30 is received in the concave light-reflecting portion 24 of the chip heat-conducting support 20. Then, the light-emitting chip 30 is electrically connected to two of the four conductive pins 11 by two conductive wires 50, respectively. Moreover, the package body 40 is glued on the four conductive pins 11, the support 15 and the chip heat-conducting support 20, in order to package the light-emitting chip 30 on the concave light-reflecting portion 24 of the chip heat-conducting support 20, and expose a bottom portion and a side portion of the heat-conducting body 21. The four conductive pins 11 are exposed outside the package body 40. Furthermore, the package body 40 has a protruding optical lens corresponding to the light-emitting chip 30. Finally, the connected portion 19 and a part of the support pins 16 that is exposed outside the package body 40 are cut.

[0029] Referring to FIGS. 5 and 6, the package body 40 includes a light-nonpenetrating portion 41 and a light-penetrating portion 42. Firstly, the chip heat-conductive support 20 and the support 15 are fixed to each other by machine. Then the conductive pins 11, the support 15 and the chip heat-conductive support 20 are packaged by an impenetrable package colloid to form the light-nonpenetrating portion 41 to expose of a part of the heat-conductive support 20. The package body 40 has a receiving portion 43 formed on the light-penetrating portion 42. Moreover, the light-emitting chip 30 on the heat-conductive support 20 and the conductive pins 11 are exposed for easy welding work. Finally, the receiving portion 43 is filled with a penetrable package colloid to form the light-penetrating portion 42 and a protruding optical lens.

[0030] Referring to FIG. 7, the chip heat-conducting support 20 is made of at least one material such as copper, aluminum, silver, diamond, silicon, molybdenum or aluminum oxide. The chip heat-conducting support 20 further includes two concaves 25 formed at each of the two opposite sides thereof. The ring body 17 has two clamping pieces 18 formed at each of the other two opposite sides thereof and corresponding to the two concaves 25. The chip heat-conductive support 20 and the support 15 are fixed to each other by machine or are glued manually. Then, the clamping pieces 18 are bent and clamped to the corresponding concaves 25 of the chip heat-conductive support 20.

[0031] Referring to FIG. 8, the present invention further comprises a heat-conducting board 60 arranged between the chip heat-conducting support 20 and the light-emitting chip 30 for conducting effectively heat from the light-emitting chip 30 to the chip heat-conducting support 20.

[0032] Referring to FIGS. 9 and 10, there are two embodiments of the present invention. Each of the four conductive pins 11 has a part that is exposed outside the package body 40, and the exposed parts are bended to form four inserted type pins that are perpendicular to the bottom face of the package body 40 (as in FIG. 9), or to form four surface attachment type pins with L-shapes (as in FIG. 10) for connecting to the PCB 70.

[0033] Referring to FIG. 10, the chip heat-conducting support 20 has a bottom face that is contacted against a heat-dissipating device, such as the PCB 70 or a heat-dissipating element. Hence the chip heat-conducting support 20 can be used to reduce the effect of sudden heat shock, when the external temperature is raised suddenly.

[0034] Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.