Method of forming a barrier film and method of forming wiring structure and electrodes of semiconductor device having a barrier film

[00002] This is a Continuation-in-Part application of U.S. patent application Ser. No. 09/530,588, filed May 5, 2000, which is national phase of PCT Application No. PCT/JP98/04983, filed Nov. 5, 1998, which was not published under PCT Article 21 (2) in English, the entire contents of the said national phase (U.S. patent application Ser. No. 09/530,588) being incorporated herein by reference.

[00003] 1. Field of the Invention

[00004] The present invention relates to a method of forming a barrier film and to a method of forming the wiring structure and electrodes of semiconductor device having a barrier film.

[00005] 2. Description of the Related Art

[00006] Generally, in the manufacture of a semiconductor integrated device such as a semiconductor integrated circuit, various processes such as film-formation, oxidative diffusion and etching are repeatedly applied onto a semiconductor wafer to form a large number of transistor, capacitors and resistance, and thereafter these elements are connected with each other through wiring patterns. Furthermore, in order to meet persistent demands for a high-performance integrated circuit as well as for a multi-functional integrated circuit, it is now required to further reduce the line width of wiring patterns and to further enhance the integration of the semiconductor elements. Moreover, a multi-layered structure has come to be employed in which circuits themselves are stacked one another with an insulating layer being interposed therebetween.

[00007] Since the electric resistance of the wirings or connecting portions is caused to increase due to a decrease in cross-sectional area thereof under the aforementioned circumstances, there is an increasing trend to employ copper, as a wiring material, in place of aluminum which has been generally employed up to date due to the facts that copper is highly resistant to electromigration and relatively low in resistivity even though copper cannot be so easily formed into a film as compared with aluminum.

[00008] As for the gate electrode to be employed in a transistor element, the polycide layer structure consisting of a doped polysilicon and a molybdenum silicide or tungsten silicide layer and titanium silicide layer stacked on the doped polysilicon layer has been generally employed. However, with a view to further promote the operation speed and to further lower the resistivity of gate electrode in conformity with the recent trend of further enhancing the integration of semiconductor devices by reducing the line width of wiring to not more than 0.1 μm and of further miniaturizing the semiconductor chip, there have been studied various measures, e.g. measures to dispose a poly-metal gate structure which is replaced the upper silicide layer of the polycide-layered gate electrode by a single metal layer, for example, a tungsten layer, or measures to direct dispose a metal layer on the surface of gate oxide film of a metal-gate structure where even the polysilicon layer is omitted.

[00009] Incidentally, copper and tungsten are known to be highly active as they are employed singly, so that they can be easily reacted with other kinds of element. For example, metal copper is high in diffusion coefficient, so that it can be easily diffused into a layer of Si or SiO₂, thereby generating the segregation thereof and crystal defects (copper is allowed to react with Si to form copper silicide). As a result, not only the electric resistance of the gate electrode is caused to increase, but also the exfoliation thereof (the exfoliation from the mixing layer of copper) is caused to easily occur.

[00010] On the other hand, when the upper layer of gate electrode of polycide-layered structure is constituted by a metal tungsten film, the silicon atoms in a doped polysilicon layer constituting the lower layer of the polycide-layered gate electrode are allowed to interdiffuse and react with the tungsten of the metal tungsten film, thereby giving rise to the formation of tungsten silicide exhibiting a high electric resistance.

[00011] It is conceivable, for the purpose of preventing the reaction between the metal copper and the metal tungsten, to employ a barrier metal such as TiN (titanium nitride) which has been conventionally employed. However, since this TiN layer has high resistivity, and is also not so effective as a diffusion barrier to copper and tungsten, this TiN layer cannot be employed as a preferable barrier metal. In particular, the barrier properties of this TiN layer to Cu are very poor.

[00012] Furthermore, in order to meet the recent demands for further enhancing the integration, multilayer structure and operation speed of semiconductor integrated circuit, it is desired, when the gate electrode for example is taken up as one example, to make each gate electrode layer thinner so as to lower the electric resistance thereof and to make aspect ratio higher on the occasion of etching work of the gate electrode.

[00013] However, as the thinning of polysilicon film, for example, constituting a gate electrode is further enhanced, there will be raised a problem that the polysilicon film is high resistivity. It is also conceivable in this case to interpose a conventionally known TiN film as a barrier metal between the tungsten film and the polysilicon layer. In this case however, a barrier metal such as TiN film is high electric resistance and is unsatisfactory for use as a diffusion barrier for copper (because the barrier film is also inevitably made thinner).

[00014] Further, with respect to the problem of the disposal of residual gas in a film-forming step, it is proposed in U.S. Pat. No. 6,015,590 that in order to effectively form a thin film, at least 99% of the residual gas should be discharged. According to this U.S. Patent, the apparatus thereof is designed such that not only the capacity thereof but also the cross-section of piping become as minimum as possible so as to achieve an effective evacuation. Furthermore, the apparatus according to this U.S. Patent is also designed in such a manner that a dead space which makes it difficult to perform the purging of gas can be prevented from being generated. Additionally, according to this U.S. Patent, since the capacity of the chamber is designed to become as minimum as possible, the gas flow therein would be inevitably caused to spread as substantially a planer flow to thereby form a “flat” flow pattern. However, according to this U.S. Patent, since the design of apparatus is extremely restricted for the purpose of effectively perform the deposition of thin film, it is difficult to actually employ it in combination with a conventional CVD chamber.

[00015] Therefore, the objects of the present invention are to provide a method of forming a barrier film (barrier metal) which is effective as a barrier for a metal copper film as well as for a metal tungsten film, and to provide a method of forming a wiring structure and an electrode for a semiconductor device, the wiring structure and electrode comprising respectively the barrier film. A further object of the present invention is to provide a method of forming a gate electrode which is capable of exhibiting excellent properties even if it is made thinner.

[00016] In order to achieve the aforementioned objects, there is provided, according to the present invention, a method of forming a barrier metal which is designed to be interposed between a metal layer and an insulating layer, both constituting a multi-layered structure of semiconductor device, the method being characterized in that a substrate having the insulating layer formed thereon is placed at a predetermined position inside a processing vessel forming a processing space, and a predetermined processing gas is introduced into the processing vessel under a predetermined processing pressure, thereby allowing a refractory metal nitride or a refractory metal silicon nitride to be deposited on the insulating layer by way of atomic layer deposition.

[00017] Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.

[00034] Now, embodiments of the present invention will be explained with reference to drawings.

[00035] FIG. 1 is an enlarged sectional view showing a barrier metal applied to a Cu dual damascene wiring. FIG. 2 is an enlarged sectional view showing a barrier metal applied to a contact hole. FIGS. 3A to 3C show respectively an enlarged sectional view showing a barrier metal applied to a gate electrode. FIG. 4 is an enlarged sectional view showing a barrier metal applied to a capacitor electrode.

[00036] The dual damascene process for forming Cu dual damascene wiring as shown in FIG. 1 is employed for forming a multi-layered structure of wiring so as to attain a high-performance and multi-functional device in a semiconductor integrated device, i.e. a semiconductor integrated circuit. This dual damascene process is featured in that the wirings and via-plugs are simultaneously formed so as to enable an upper wiring layer to be connected with a lower wiring layer, thereby making it possible to reduce the number of steps as well as the manufacturing cost for forming the wirings and to minimize the aspect ratio.

[00037] In FIG. 1, reference numeral 2 is a substrate such as a semiconductor wafer, and 4 is a lower wiring layer (conducting layer) formed on a surface of the substrate 2. The periphery of the lower wiring layer 4 is insulated by an interlayer insulating film 6 consisting of SiO₂, plasma-enhanced-TEOS SiO₂, SiOF, CF_x (x=1-4), an organic SOG film (MSQ), an inorganic SOG film (HSQ), and a porous SiO₂ film, an organic Si polymer film, a C-, H-containing SiO₂ film of low dielectric constant. The lower wiring layer 4 can be constituted by metal copper for example. Between the insulating film 6 and the metal copper 4 is interposed a ultrathin barrier metal 14A which is designed to prevent the diffusion of the metal copper 4 according to the present invention. This barrier metal 14A may be constituted by a refractory metal nitride film such as WN_x, TaN_x, MoN_x, NiN_x, HfN_X (x=0.1-2), Z_yN_X, RuN_X, and PrN_X; or by a refractory metal silicon nitride film such as WSi_xN_y, TaSi_xN_y, MoSi_xN_y, NiSi_xN_y, ZrSi_xN_y, HfSi_xN_y or RuSi_xN_yor PrSi_XN_y (x=0.01-2, y=0.02-2). On the surfaces of the lower wiring layer 4 and of the insulating film 6, there is deposited a SiN film 15 functioning as an etch-stopper on the occasion of etching work. Reference numeral 8 is an interlayer insulating film consisting, just like the interlayer insulating film 6, of SiO₂ to be formed by way of SOG (Spin On Glass), plasma-enhanced-TEOS SiO₂, SiOF, CF_x (x=1-4), an organic SOG film (MSQ), an inorganic SOG film (HSQ), and a porous SiO₂ film, an organic Si polymer film, a C-, H-containing SiO₂ film of low dielectric constant. This interlayer insulating film 8 is deposited so as to cover the SiO₂ insulating film 6 and the lower wiring layer 4. Since this interlayer insulating film 8 is formed, for example, by coating an insulating film of low dielectric constant (not more than 3, more preferably 1.5-3) as mentioned above, a wiring layer consisting of a low dielectric layer and a copper layer structure of relatively high operation speed can be realized.

[00038] Reference numeral 10 is a via-hole formed in the interlayer insulating film 8 so as to expose part of the lower wiring layer 4, and 12 is a wiring groove formed in the surface of the interlayer insulating film 8. Reference numeral 14 is a ultrathin barrier metal made of a refractory metal nitride film or a refractory metal silicon nitride film, for example, WN_X (x=0.1-2), WSi_xN_y (x=0.01-2, y=0.02-2), which is formed on an inner wall surface of the via-hole 10 and on an inner wall surface of the wiring groove 12. Reference numeral 16 is an upper wiring layer (conducting layer) formed of metal copper for example. On the occasion of forming this upper wiring layer 16, the via-hole 10 is also filled with this metal copper, thereby simultaneously forming a via-hole plug 16A.

[00039] In this case, the line width L1 of the wiring 16 is 1 μm or less, for example about 0.2 μm. The thickness L2 of the barrier metal 14 is within the range of 0.0001 to 0.05 μm, more preferably 0.0005 to 0.01 μm.

[00040] As described above, since the barrier metal 14 which is ultra-thin in thickness and made of a refractory metal nitride film WN_x or a refractory metal silicon nitride film WSi_xN_y is interposed between the upper wiring layer 16 constituted by a thin copper film and the interlayer insulating film 8 formed by way of SOG, as well as between the via-hole plug 16A made of metal copper and the interlayer insulating film 8 in the dual damascene process, the metal copper can be prevented from diffusing into the interlayer insulating film 8 from the via-hole plug 16A as well as from the upper wiring layer 16. As a result, it is now possible to prevent the generation of segregation such as CuSi or of crystal defects. Therefore, the electric resistance of the via-hole plug 16A and the upper wiring layer 16 can be maintained at a low level. Additionally, since the adhesiveness of the upper wiring layer 16 is not deteriorated by the barrier metal 14, it is possible to prevent the metal copper from being inadvertently peeled off. Furthermore, since this wiring structure is constituted by an insulating film of low dielectric constant and a metallic wiring of low electric resistance, it is possible to enhance the operation speed of the device.

[00041] By the way, in a modified embodiment of the above-described structure, any one of the lower wiring layer 4 and the upper wiring layer 16 may be formed of a metal selected from the group consisting of Al, W, Cu, Au, Ag and Pt, and the other wiring layer may be formed of a metal selected from the group consisting of W, Cu, Al, Au, Ag and Pt. If both wiring layers 4 and 16 are to be formed using W, it is preferable to form a nucleation film of W at first, the main W film being subsequently allowed to grow by making use of this nucleation film as an origin.

[00042] FIG. 2 shows one embodiment wherein the barrier metal of the present invention is applied to a contact hole. In FIG. 2, reference numeral 18 is a source or drain region (conductive layer or a layer of dopant diffusion region which can be formed by diffusing a dopant into a Si surface layer) of transistor which is formed in the substrate 2. For the convenience of explanation, the reference numeral 18 is assumed herein as indicating the source region. Reference numeral 20 is an interlayer insulating film employed for entirely covering and insulating the transistor including the source region 18. This insulating film 20 is constituted, in the same manner as explained with reference to FIG. 1, by an insulating film of low dielectric constant. By the way, this insulating film 20 may be formed using plasma-enhanced-TEOS SiO₂, SiOF or CF_x (x=1-4). Reference numeral 22 is a contact hole which is formed so as to expose the surface of the source region 18. In order to secure a contact resistance between a wiring 24 (to be explained hereinafter) and the source region 18, this contact hole 22 is provided at the bottom thereof with a layer of metal silicide 17 such as TiSi, CoSi, NiSi, MoSi, etc. After the deposition of the metal silicide layer 17, an ultra-thin layer of barrier metal 14 constituted by a refractory metal nitride film or a refractory metal silicon nitride film, for example, WN_x, WSi_xN_y is formed on the entire inner wall of the contact hole 22 as well as on the upper surface of the interlayer insulating film 20. Thereafter, metal copper is deposited all over the surface of the substrate including the interior of the contact hole 22 by means of a reflow or plating method, a CVD method or a PVD method to thereby fill the contact hole 22 with the metal copper, thus concurrently forming a contact hole plug 24A and wiring (conducting layer) 24.

[00043] In this case also, since an ultra-thin layer of barrier metal 14 constituted by a refractory metal nitride film or a refractory metal silicon nitride film is interposed between the interlayer insulating film 20 and the contact hole plug 24A made of metal copper as well as between the interlayer insulating film 20 and the wiring 24 made of metal copper, it is now possible to prevent the metal copper from diffusing into the underlying substrate or into the interlayer insulating film 20. Therefore, it is possible to prevent the segregation of the metal copper (the generation of CuSi, etc.) constituting the plug 24A and the wiring 24, and also to prevent the generation of crystal defects, thereby making it possible not only to maintain the resistivity of these plug 24A and wiring 24 to a low level, but also to prevent the adhesion of these plug 24A and wiring 24 from being deteriorated and hence to prevent these plug 24A and wiring 24 from being exfoliated.

[00044] By the way, in the foregoing embodiment, the drain or source region 18 having a conductive diffusion zone is formed on a Si substrate. In this case, the wiring 24 may be formed of Al, W, Pt, Ag or Au.

[00045] FIG. 3A shows one example where an ultra-thin barrier metal according to the present invention is applied to a gate electrode (polymetal electrode). In FIG. 3A, reference numerals 18 and 19 represent respectively a source region and a drain region of a transistor device formed in the surface of the substrate 2 with a thin gate oxide film 26 being interposed between these source and drain regions. A gate electrode 28 is formed on the surface of this gate oxide film 26. This gate electrode 28 is constituted by a 3-ply structure wherein, for example, a phosphorus-doped polysilicon layer 30, an ultra-thin barrier metal 14 constituted by a refractory metal nitride film or a refractory metal silicon nitride film, for example, WN_x, WSi_xN_y to be formed according to the present invention by means of an ALD (atomic layer deposition) method, and a metal layer 32 made of tungsten are successively laminated onto the gate oxide film 26. The barrier metal may be a laminated structure of a refractory metal silicon nitride and a refractory metal nitride. Since this polymetal gate electrode structure is constructed in such a manner that a silicide layer is omitted from the conventional polycide electrode, the thickness of the resultant structure can be reduced, thereby making it possible to increase the operation speed of transistor and to further enhance the integration of transistor.

[00046] In this case also, since the ultra-thin barrier metal 14 of the present invention is interposed between the polysilicon layer 30 and the metal layer 32, the silicon atoms in the polysilicon layer 30 and the metallic atoms of the metal layer 32 can be prevented from being interdiffused with each other. As a result, the metal layer 32 can be prevented from being turned into an electrically highly resistive silicide or from generating pits (vacancies) between the polysilicon layer and the metal layer. Thus, the metal layer 32 is prevented from being increased in electric resistance as well as from being exfoliated.

[00047] By the way, in the aforementioned polymetal gate electrode structure, the metal layer 32 may be formed of Cu, Al, Au, Ag or Pt. Further, the gate oxide film 26 may be formed of any one of the compounds selected from SiO₂, SiOF, CF_x (x=1-4), compounds exhibiting as high dielectric constant as 3-30 such as Ta₂O₅, Al₂O₃, HfO₂, ZrO₂, PZT, SBT, ZrSi_xO_y, HfSi_xO_y, IrO, RuO, Pr₂O₃ and La₂O₃, and any combination of these compounds. Further, it will be more advantageous if the gate oxide film 26 is formed by means of an ALD (atomic layer deposition) method as this ALD method enables a more densified gate oxide film to be formed. FIG. 3B shows another example where the ultra-thin barrier metal 14 is applied to a metal gate electrode. In FIG. 3B, reference numeral 120 represents Si substrate, 121 represents a gate oxide film (made of SiO₂, SiOF, CF_x (x=1-4), compounds exhibiting as high dielectric constant as 3-30 such as Ta₂O₅, Al₂O₃, HfO₂, ZrO₂, PZT, SBT, ZrSi_xO_y, HfSi_xO_y, IrO, RuO, Pr₂O₃ and La₂O₃, or any combination of these compounds, or a film of any of these compounds which is formed by means of the ALD method), and 121 represents a metal layer (Cu, W, Al, Au, Ag or Pt). Since this metal gate electrode structure enables a transistor to be operated at a higher speed as compared with the polymetal electrode, this electrode structure is useful in enhancing the integration of transistor devices having a line width of 0.1 μm or less. By the way, if the metal layer 124 is to be formed using W, it is preferable, as shown in FIG. 3C, to form a nucleation film 124a of W at first, the main W film 124b being subsequently allowed to grow by making use of this nucleation film as an origin.

[00048] FIG. 4 shows one example wherein an ultra-thin barrier metal to be formed by means of the ALD method according to the present invention is applied to a capacitor electrode to be formed on the upper side of a transistor.

[00049] A lower electrode 141 serving as one of the electrodes of capacitor and constituted by a polysilicon layer for instance is formed inside the contact hole which is formed on the surface of a substrate 140. An ultra-thin barrier metal 14 is formed on the surface of the lower electrode 141, and for example, a Ta₂O₅ layer serving as a dielectric layer 143 of the capacitor is formed on the barrier metal 14. Further, on the dielectric layer 143 also, there is deposited the ultra-thin barrier metal 14, on which a TiN layer for example is formed as an upper electrode 144 of the capacitor. This ultra-thin barrier metal 14 is constituted by a refractory metal nitride film or a refractory metal silicon nitride film, for example, WN_x, WSi_xN_y, both films being formed by means of the ALD method. As a result, oxygen or metals constituting the dielectric layer 143 of the capacitor can be prevented from diffusing into the polysilicon layer of the lower electrode 141, thereby making it possible to prevent the generation of an electrically high-resistant silicide or oxide and hence to prevent any increase in electric resistance of the lower electrode 141 and any decrease in capacitance of the dielectric layer 143. By the way, the lower electrode 141 may be formed of Ru, Ir, TiN, Pt, Ag, Au, etc. As for the dielectric layer 143 of the capacitor, it is possible to employ a dielectric material such as PZT(Pb(Zr_1-xTi_x)O₃), SBT(Pb(SrB₂Ta₂O₄), ZrSi_xO_y, HfSi_xO_y, IrO, RuO, etc. As for the upper electrode 144, it is possible to employ a material which is excellent in barrier properties and low in electric resistance such as TiN, WN_x, WSi_xN_y, TiSi_xN_y, TaSi_xN_y, TaN, and any one of these compounds which are formed by means of the ALD method.

[00050] Next, a method of forming an ultra-thin barrier metal film by means of the ALD method will be explained.

[00051] FIG. 5 shows a schematic structure of a processing apparatus for forming the aforementioned ultra-thin barrier metal. First of all, this processing apparatus will be explained. As shown in FIG. 5, this processing apparatus comprises a cylindrical processing vessel 34 made of aluminum for instance, and a mounting pedestal 36 is positioned inside the processing vessel 34 for mounting a substrate 2 thereon. This mounting pedestal 36 is provided therein with a resistance heater 38 for heating the substrate 2 to a predetermined process temperature. By the way, instead of using the heater 38, a heating lamp may be employed for heating the substrate 2, the heating lamp being disposed below the processing vessel 34.

[00052] The processing vessel 34 and the mounting pedestal 36 are individually grounded. The mounting pedestal 36 also serves as a lower electrode in a case where a high frequency is used. The processing vessel 34 is provided at the bottom thereof with an exhaust port 40, which is connected through a vacuum pump 42 with an evacuating system. A loadlock chamber 44 is attached via a gate valve 41 to the sidewall of the processing vessel 34, thereby enabling the substrate 2 to be transferred therefrom to the processing vessel 34 or vice versa.

[00053] At the top portion of the processing vessel 34, there is mounted, through an insulating material 46, a shower head portion 48 having numerous gas spray holes 50. The shower head portion 48 is connected, via a switch 54A and a matching circuit 54, with a high frequency power source 56 of 450 KHz or 13.56 MHz for instance, thereby making it possible, if required, to apply a high frequency power to the shower head portion 48, thus utilizing the shower head portion 48 as an upper electrode to perform a plasma process. This plasma process may be performed, other than the aforementioned method, by applying a high frequency power to the lower electrode or to both of the upper and lower electrodes.

[00054] This shower head portion 48 is connected with a plurality of gas sources each through an on-off valve 58 and a mass flow controller 60. The valve 58 may be also a fast-changeover valve such as a rotary valve or a piezoelectric valve. As for the gas source, it may be optionally selected, depending on specific requirements, from a WF₂ source 62, an MMH (monomethyl hydrazine) source 64, an SiH₄ (silane) source 66, an NH₃ source 68, a N₂ source 70, an Ar source 72, a H₂ source 74, a ClF₃ source 75, etc. Further, disilane (Si₂H₆) or dichlorosilane (SiH₂Cl₂) may be substituted for SiH₄ gas. By the way, reference numeral 57 denotes a first gas-introducing pipe which is connected with the gas sources 64, 68 and 70. Reference numeral 59 denotes a second gas-introducing pipe which is connected with the gas sources 62, 66, 72, 74 and 75. Reference numeral 43 denotes a gas supply port which is attached to the processing vessel 34 and with which the second gas-introducing pipe 59 is connected. Reference numeral 45 denotes a gas supply port which is attached to the processing vessel 34 and with which the first gas-introducing pipe 57 is connected. Reference numeral 47 denotes a middle stage diffusion plate having a plurality of gas spray ports 55, reference numeral 49 an upper stage diffusion plate having the gas supply ports 43 and 45, and reference numeral 52 a lower stage diffusion plate having a plurality of gas spray ports 50 and 51. Reference numeral 53 denotes a space formed between the lower stage diffusion plate 52 and the middle stage diffusion plate 47, and reference numeral 54 a space formed between the upper stage diffusion plate 49 and the middle stage diffusion plate 47. Since the space 54 is communicated with the gas spray ports 55 and 51, a first gas is permitted to be introduced into the chamber 34. At the same time, since the gas supply port 43, the gas spray port 50 and the space 53 are communicated with each other, a second gas is permitted to be introduced into the chamber 34. According to this structure, it is possible to enable the first gas and the second gas to be introduced into the chamber 34 without permitting these gases to be mixed together in the shower head portion 48, and at the same time, to enable the first gas and the second gas to be alternately introduced into the chamber 34. It is possible in the aforementioned structure to employ a plurality of nozzles substituting for the shower head portion 48.

[00055] Next, a method of forming an ultra-thin barrier metal film by means of the ALD method according to the present invention by making use of the apparatus constructed as explained above, as well as a method of forming a wiring structure comprising the ultra-thin barrier metal film will be explained specifically.

[00056] In this text, an embodiment where a dual damascene wiring (see FIG. 1) is formed by means of the aforementioned Cu dual damascene process will be explained as one example. By the way, this method of forming a barrier metal can be applied in the same manner to the case where this barrier metal is applied to the contact hole and the gate electrode even though the processes before and after the step of forming the barrier metal may differ from those of this method.

[00057] (1) The formation of a WN_x barrier metal by means of the ALD method.

[00058] First of all, a method of forming the WN_x barrier metal in one step will be explained. At first, by making use of a separate apparatus differing from the processing apparatus shown in FIG. 5 and by means of a known method, an SiN layer 15 is formed as an etch-stop film on the surface of an SiO₂ insulating layer 6 as well as on the surface of a lower wiring 4 formed in the insulating layer 6 of the substrate 2 as shown in FIG. 6A. Then, by means of SOG, an SiO₂ interlayer insulating film 8 is formed all over the SiN layer 15. Thereafter, by way of a known process, a first groove 12a is formed, by means of dry etching, in this interlayer insulating film 8 in such a manner as to follow the wiring pattern (FIG. 6B). Furthermore, the portions of the SiO₂ interlayer insulating film 8 and of the SiN layer 15, which correspond to a predetermined region in the first groove 12a, are etched to such an extent as to expose the underlying wiring 4 to thereby form a second groove (via-hole) 12b. Thus, a dual damascene hole 12 comprising the first groove 12a and the second groove 12b is formed (FIG. 6C).

[00059] After finishing the aforementioned treatments to the substrate 2, the resultant substrate 2 is transferred to the processing apparatus shown in FIG. 5, in which the process for forming a barrier metal in the substrate 2 is initiated.

[00060] Upon finishing the mounting of the substrate 2 on the mounting pedestal 36 of the processing vessel 34, the processing vessel 34 is closed air-tight. Then, while keeping the substrate 2 in a predetermined processing pressure, a predetermined processing gas is introduced into the processing vessel 34 from the shower head portion 48 and at the same time, the processing vessel 34 is evacuated so as to maintain the interior of the processing vessel 34 at a predetermined process pressure, thereby performing the process of forming the barrier metal. As for the process gas to be employed in this case, it is possible to employ a gas comprising WF₆ gas and SiH₄ gas (reducing gas) and a gas comprising NH₃ (MMH) gas for nitriding, both of which are individually introduced, through a separate channel, into the processing vessel 34 in which a barrier metal 14 having a predetermined thickness and consisting of a WN_x film is allowed to deposit by means of the ALD (atomic layer deposition) (FIG. 6D). It is possible, as other kinds of gas, to employ Ar, N₂ and H₂ gases.

[00061] More specifically, as illustrated in the steps of forming an ALD-WN_x layer shown in FIG. 7A, a first step 76 for supplying a gas comprising WF₆ gas, a second step 75 for supplying a gas comprising SiH₄ gas (reducing gas) and a third step 77 for supplying a gas comprising NH₃ (MMH) gas for nitriding may be alternately repeated a plurality of times with a purging step 78 being interposed between succeeding steps so as to evacuate the processing vessel while feeding thereto an inert gas such as Ar gas (or it may be N₂ or He) (of course it is possible in this case to perform only the evacuation without performing the purging) (alternatively, it is also possible to form the ALD-WN_x layer by supplying the mixed gas comprising WF₆ gas and SiH₄ gas (reducing gas) to form a W film in a first step, thereafter, supplying a gas comprising NH₃ (MMH) gas for nitriding the W film to form WNx in a second step, as following steps shown in FIG. 7B). In this case, the gas comprising WF₆ gas of the first step 76 is reduced by the gas comprising SiH₄ gas of the second step 75, thereby allowing the deposition of a W layer. Then, this W layer is nitrided by the gas comprising NH₃ (MMH) gas of the third step 77, thereby allowing the barrier metal 14 consisting of a WN_x film to be formed. In this case, if the period extending from a given first step 76 to the next first step 76 is assumed as being one cycle, the process shown in FIG. 7A undergoes two cycles. However, there is not any particular limitation regarding to the number of cycle to be taken in the process, since the number of cycle depends on the thickness of the film formed in one cycle. In the process shown in FIG. 7A, the gas comprising NH₃ (MMH) gas may be supplied before supplying the gas comprising SiH₄ gas. Further, the period T1 of the first step 76, the period T2 of the second step 75, and the period T3 of the third step 77 extend respectively from 0.1 to 60 seconds, preferably from 0.5 to 30 seconds. Further, the period of the purging step 78 extends from 0 to 60 seconds, preferably from 0 to 30 seconds. Moreover, the purging step 78 may be executed by only performing the evacuation of the processing vessel 34. On the occasion of exchanging a kind of gas for a different kind of gas in each of the steps 75, 76, 77 and 78, the quantity of the residual gas of the previous step in the processing vessel 34 should preferably be reduced to a level of 1 to 30% based on the entire capacity of the processing vessel 34, or alternatively, a total quantity of the residual gas of the previous step which is kept free inside the processing vessel 34 plus the residual gas of the previous step which is adsorbed on the inner wall of the processing vessel 34 should preferably be reduced to a level of 1 to 30% based on the entire capacity of the processing vessel 34. Alternatively, the interior of the processing vessel 34 should preferably be evacuated to a vacuum degree of 0.1 Torr or so. When the interior of the processing vessel 34 is evacuated to such a level as described above, the residual materials of the previous step can be sufficiently removed for the next step. However, even if the residual materials of the previous step is left remained at a level of 1 to 30% based on the entire capacity of the processing vessel 34, the film to be formed under such a condition would be sufficiently high in density as well as in barrier property, depending on the presence of any dead spaces for a gas in the processing vessel 34.

[00062] In this embodiment, an 8-inch wafer is used as the substrate 2, and the flow rate of each of the process gases should be: about 2 to 100 sccm, preferably 5 to 50 sccm for the WF₆ gas, about 10 to 300 sccm, preferably 10 to 150 sccm for the SiH₄ gas, and about 1 to 100 sccm (1 to 50 sccm), preferably 50 to 100 sccm (1 to 30 sccm) for the NH₃ (MMH) gas (in the case of the wafers having a diameter of more than 8 inches, the quantity of gas to be employed should preferably be at least one time as large as the quantity of gas to be employed for the 8-inch wafer, more preferably 1.5 to 6 times as large as the quantity of gas to be employed for the 8-inch wafer, the quantity of gas to be employed increasing in proportion to the capacity of the chamber). The process temperature should preferably be in the range of 200 to 500° C., more preferably about 300 to 450° C., and the process pressure should preferably be in the range of about 0.5 to 80 Torr, more preferably 1 to 20 Torr. The film-forming rate during one cycle should preferably be 1 to 200 angstroms/cycle, more preferably 1 to 50 angstroms/cycle. If dichlorosilane is to be employed in place of silane as a reducing gas, the process temperature should be adjusted to the range of about 400 to 650° C. with other conditions such as the gas flow rate and the process pressure being the same as described above. It is possible as another kind of reducing gas to employ disilane, H₂. By the way, these numeral values or ranges including the values or ranges to be set forth hereinafter represent merely one example, so that they can be appropriately changed in order to obtain optimum conditions.

[00063] It is possible, by means of the aforementioned ALD method, to form an ultra-thin and high density barrier metal 14 constituted by a refractory metal nitride film. Of course, it is possible to apply these steps to the formation of the barrier metal 14A.

[00064] When the formation of the barrier metal 14 is accomplished in this manner, the substrate 2 is taken out of the processing apparatus, and metal copper as a wiring metal is deposited in the form of sheet on the surface of the substrate 2 by means of CVD method or PVD method. Concurrent with the aforementioned deposition of metal copper, the dual damascene hole 12 is filled with the metal copper by means of electrolytic or nonelectrolytic plating method, CVD method or coating method (spin coating). It is possible, in this manner, to fill the via-hole 12b with a metal copper plug 16A concurrent with the filling of the first groove 12a with metal copper for constituting the upper wiring 16 (FIG. 6E). By the way, the via-hole 12b may be filled with Al by means of a reflow, CVD or PVD method.

[00065] Thereafter, the substrate having metal copper deposited in this manner is taken out of the processing apparatus and is subjected to a CMP (Chemical Mechanical Polishing) treatment to thereby remove any redundant metal copper that has been deposited on the surface of the substrate, thus forming the upper wiring pattern (FIG. 6F). It is possible in this manner to accomplish the formation of the Cu dual damascene wiring.

[00066] In this embodiment, NH₃ gas was employed as a nitriding gas for forming the barrier metal 14. However, MMH gas or any kind of gas containing N may be substituted for the NH₃ gas. Additionally, if required, an inert gas such as Ar gas, N₂ gas or He gas may be employed as a carrier gas. Moreover, nitrogen radicals as well as hydrogen radicals to be generated through the formation of plasma using N₂ gas, N₂+H₂ gases, N₂+NH₃ gases, and H₂+NH₃ gases, may be utilized for the nitridation and the reduction. It is of course possible to employ dichlorosilane, disilane, etc. substituting for the SiH₄ gas.

[00067] (2) The formation of a WSi_xN_y barrier metal by means of the ALD method.

[00068] Next, a method of forming a WSi_xN_y barrier metal by means of the ALD method will be explained. Since the method of forming a WSi_xN_y barrier metal is identical with the aforementioned process excepting the step shown in FIG. 6D, only the process to be performed in the step of FIG. 6D will be explained. In this step, a mixed gas comprising WF₆ gas and SiH₄ gas, and another gas consisting of NH₃ gas are alternately introduced as process gases, through a separate channel, into the processing vessel, in which a barrier metal 14 having a predetermined thickness and consisting of a WSi_xN_y film is allowed to deposit by means of the ALD (atomic layer deposition). It is also possible to employ Ar, N₂ and H₂ gases. In this case, the step of forming an ALD-WSi_xN_y film as shown in FIG. 7B is performed. Namely, a first step 81 for supplying a mixed gas comprising WF₆ gas and SiH₄ gas, and a second step 77 for supplying another gas comprising NH₃ gas (or MMH gas) may be alternately repeated a plurality of times with a purging step 78 being interposed between these steps so as to evacuate the processing vessel while feeding thereto an inert gas such as Ar gas (of course it is possible in this case to perform only the evacuation without performing the purging). In this case, a WSi film is formed by the mixed gas comprising WF₆ gas and SiH₄ gas of the first step 81 (a ratio of the flow rate of SiH₄ gas to that of WF₆ gas in the steps shown in FIG. 7B is larger than a ratio of the flow rate of SiH₄ gas to that of WF₆ gas in the steps shown in FIG. 7A). Then, this WSi film is nitrided by the gas comprising NH₃ gas of the second step 77, thereby allowing the barrier metal 14 consisting of a WSi_xN_y film to be formed. In the process shown in FIG. 7B, the gas comprising NH₃ (MMH) gas may be supplied before supplying the gas comprising SiH₄ gas. On the occasion of exchanging a kind of gas for a different kind of gas in each of the steps 77, 78 and 81, the quantity of the residual gas of the previous step in the processing vessel 34 should preferably be reduced to a level of 1 to 30% based on the entire capacity of the processing vessel 34, or alternatively, a total quantity of the residual gas of the previous step which is kept free inside the processing vessel 34 plus the residual gas of the previous step which is adsorbed on the inner wall of the processing vessel 34 should preferably be reduced to a level of 1 to 30% based on the entire capacity of the processing vessel 34. Alternatively, the interior of the processing vessel 34 should preferably be evacuated to a vacuum degree of 0.1 Torr or so. When the interior of the processing vessel 34 is evacuated to such a level as described above, the residual materials of the previous step can be sufficiently removed for the next step. However, even if the residual materials of the previous step is left remained at a level of 1 to 30% based on the entire capacity of the processing vessel 34, the film (ultrathin barrier metal constituted by a refractory metal silicon nitride) to be formed under such a condition would be sufficiently high in density as well as in barrier property, depending on the presence of any dead spaces for a gas in the processing vessel 34. Further, when an 8-inch wafer is used as the substrate 2, the flow rate of each of the process gases should be: about 2 to 100 sccm, preferably 5 to 50 sccm for the WF₆ gas, about 10 to 300 sccm, preferably 10 to 150 sccm for the SiH₄ gas, and about 1 to 100 sccm, preferably 1 to 50 sccm for the NH₃ gas (in the case of the wafers having a diameter of more than 8 inches, the quantity of gas to be employed should preferably be at least one time as large as the quantity of gas to be employed for the 8-inch wafer, more preferably 1.5 to 6 times as large as the quantity of gas to be employed for the 8-inch wafer, the quantity of gas to be employed increasing in proportion to the capacity of the chamber). The process temperature should preferably be in the range of 200 to 500° C., more preferably about 300 to 450° C., and the process pressure should preferably be in the range of about 0.5 to 80 Torr, more preferably 1 to 20 Torr. The film-forming rate during one cycle should preferably be 1 to 200 angstroms/cycle, more preferably 1 to 50 angstroms/cycle.

[00069] In this embodiment, the kinds of process gas to be employed herein can be limited to only two kinds, thereby making it possible to extremely simplify the structure of the gas supply system. Further, in this case also, MMH gas or any kind of gas containing N may be substituted for the NH₃ gas. Moreover, nitrogen radicals as well as hydrogen radicals to be generated through the formation of plasma using N₂ gas, N₂+H₂ gases, N₂+NH₃ gases, and H₂+NH₃ gases, may be utilized for the nitridation and the reduction. It is of course possible to employ dichlorosilane or disilane, substituting for the silane gas.

[00070] (3) Another method of forming a WSi_xN_y barrier metal by means of the ALD method.

[00071] Next, another method of forming a WSi_xN_y barrier metal in two steps will be explained. In this case, upon finishing the step shown in FIG. 6C, a step of forming a WSi layer is performed at first in the processing apparatus shown in FIG. 5. As for the processing gas to be employed on this occasion, a gas comprising WF₆ gas, a gas comprising SiH₄ gas, and a gas comprising NH₃ gas (or MMH gas) are employed. These gases are individually and alternately supplied by making use of a carrier gas such as Ar gas, N₂ gas or H₂ gas to thereby enable a WSi_xN_y film to be deposited on the substrate. In this case also, the WSi film is deposited to a predetermined thickness by means of the ALD (atomic layer deposition). Specifically, as shown in FIG. 7C, a first step 76 for supplying a gas comprising WF₆ gas, a second step 75 for supplying a gas comprising SiH₄ gas and a third step 77 for supplying a gas comprising NH₃ gas (or MMH gas) may be alternately repeated a plurality of times with a purging step 78 being interposed between these steps so as to evacuate the processing vessel while feeding thereto an inert gas such as Ar gas (of course it is possible in this case to perform only the evacuation without performing the purging). In the aforementioned method of forming the barrier metal shown in FIG. 7A, the SiH₄ gas functions as a reducing agent for reducing the WF₆ gas. Whereas in this method of forming the barrier metal as illustrated in FIG. 7C, the flow rate of the SiH₄ gas supplied in the second step 75 is more than that supplied in the second step 75 in FIG. 7A to positively react W with Si, thereby producing the WSi film. On the occasion of exchanging a kind of gas for a different kind of gas in each of the steps 75, 76, 77 and 78 in this embodiment, the quantity of the residual gas of the previous step in the processing vessel 34 should preferably be reduced to a level of 1 to 30% based on the entire capacity of the processing vessel 34, or alternatively, a total quantity of the residual gas of the previous step which is kept free inside the processing vessel 34 plus the residual gas of the previous step which is adsorbed on the inner wall of the processing vessel 34 should preferably be reduced to a level of 1 to 30% based on the entire capacity of the processing vessel 34. Alternatively, the interior of the processing vessel 34 should preferably be evacuated to a vacuum degree of 0.1 Torr or so. When the interior of the processing vessel 34 is evacuated to such a level as described above, the residual materials of the previous step can be sufficiently removed for the next step. However, even if the residual materials of the previous step is left remained at a level of 1 to 30% based on the entire capacity of the processing vessel 34, the film (ultra-thin barrier metal constituted by a refractory metal silicon nitride) to be formed under such a condition would be sufficiently high in density as well as in barrier property, depending on the presence of any dead spaces for a gas in the processing vessel 34. By the way, the flow rate of the processing gases, the process temperature and the process pressure in this method may be the same as those of the method illustrated in FIG. 7A. By the way, when the nitridation process is performed by making use of MMH gas in place of NH₃ gas, the film-forming process can be executed at a lower temperature, and at the same time, the generation of by-products can be further inhibited, thus making it very advantageous in terms of solving the problems of particles.

[00072] If NH₃ gas is to be employed, it is preferable to perform the purging of the processing vessel 34 by making use of Ar gas or N₂ gas at an interval between the film-forming step and the nitridation step to thereby remove the WF₆ gas or the NH₃ gas. In particular, if NH₃ gas is to be employed in place of MMH gas in the nitridation step, it is preferable to remove the WF₆ gas prior to the nitridation process, because of the fact that if the WF₆ gas is permitted to remain inside the processing vessel, a side reaction product which can be hardly removed such as ammonium fluoride or a reaction product between ammonia and fluoride gas would be permitted to be produced. More specifically, the quantity of the residual gas of the previous step in the processing vessel 34 should preferably be reduced to a level of 1 to 30% based on the entire capacity of the processing vessel 34, or alternatively, the interior of the processing vessel 34 should preferably be evacuated to a vacuum degree of 0.1 Torr or so. When the interior of the processing vessel 34 is evacuated to such a level as described above, the residual materials of the previous step can be sufficiently removed for the next step. By the way, if NH₃ gas is to be employed, the process temperature should be set to within the range of about 300 to 450° C.

[00073] The nitridation step may be performed in such a manner that a gas comprising N₂ gas, NH₃ gas, MMH gas, H₂ gas or a mixed gas consisting of any combination of these gases is fed to the processing vessel, and then, a switch 52 is turned on to apply a high frequency power to the upper electrode (shower head portion) 48, to the lower electrode (mounting pedestal) 36, or to both of these electrodes, thereby allowing plasma to generate inside the processing vessel and hence supplying active nitrogen atoms to the processing vessel to perform the nitridation treatment. On this occasion, the quantity of the N-containing gas to be fed thereto should preferably be within the range of about 50 to 1000 sccm. As for the Ar gas, the quantity thereof should preferably be within the range of about 50 to 1000 sccm, and as for H₂ gas, the quantity thereof should preferably be within the range of about 200 to 1000 sccm. The process temperature should preferably be within the range of about 200 to 500° C., and the process pressure should preferably be within the range of 0.1 to 10 Torr.

[00074] The ultra-thin barrier metal 14 that has been formed according to each of the aforementioned methods was confirmed, as a result of the tests on the properties thereof, as capable of exhibiting a sufficient barrier property to oxygen atom or to metallic atoms.

[00075] Next, the polymetal gate electrode and the method of forming the gate electrode according to the present invention will be explained.

[00076] Now, the gate electrode 28, which has been explained with reference to FIG. 3A will be explained more specifically. FIG. 9 is an enlarged view of the region of the gate electrode shown in FIG. 3A. In this case, one example wherein tungsten nitride (WN_x) is employed as a material for the barrier metal 14 will be explained. As explained with reference to FIG. 3A, the source and drain regions 18 and 19 where a conductive atom is diffused are disposed on both sides of the gate oxide film 26 of the substrate 2 which is constituted by a semiconductor wafer made of monocrystalline silicon for instance. As a material for the gate oxide film 26, a silicon oxide film (SiO₂) is employed in this embodiment.

[00077] The polysilicon layer 30 which is phosphorus-doped for instance is formed by means of a know method and by making use of a separate film-forming apparatus as described above. Thereafter, the resultant substrate W is transferred to the film-forming apparatus as shown in FIG. 5.

[00078] When it is desired to form a WN_x film constituted by an ultra-thin barrier metal, as shown in FIG. 8A, an ultra-thin barrier metal 14 made of the WN_x film is formed at first to a predetermined thickness on the surface of the polysilicon layer 30 by the same ASD-WN_x-forming step as that shown in FIG. 7A. Thereafter, a tungsten layer 32 is formed on the barrier metal 14 inside the same processing vessel 34 (a W film-forming step 80). In this step of forming this tungsten layer 32, a thermal CVD method is employed using, as a processing gas, a mixed gas comprising WF₆ gas and H₂ gas, and at the same time, using Ar, N₂ and H₂ gases, thereby depositing a W film having a predetermined thickness. The thickness of each layer on this occasion is selected so as to conform with the design rule of the memory corresponding to the capacity of 1 G bits for instance, i.e. about 20 angstroms for the gate oxide film 26, about 500 angstroms for the polysilicon layer 30, about 50 angstroms for the ultra-thin barrier metal 14 (deposited by means of the ALD), and about 500 angstroms for the metallic layer (tungsten layer) 32. As described above, if the metal layer 32 is to be formed by making use of W, a nucleation film-forming step 82 for W is performed at first using WF₆ gas, the flow rate of which being smaller than that to be employed in a W layer-forming step 80 (for example, using WF₆ gas at a flow rate of 1 to 20 sccm) after the ALD-WN_x film-forming step as shown in FIG. 8C. Thereafter, the main step of forming the W film (the step 80) is performed by making use of this nucleation film as an origin.

[00079] As the gate electrode 28 is formed in this manner, the oxide film 26, the polysilicon layer 30, the ultra-thin barrier metal 14 and tungsten layer 32 are sequentially formed. Since both of the ultra-thin barrier metal 14 (deposited by means of the ALD) and the tungsten layer 32 are formed of the same metallic material (i.e. tungsten) with each other, they can be successively deposited in the same film-forming apparatus, thus making it unnecessary to perform the operation of loading and unloading the substrate, and hence improving the productivity.

[00080] Further, since the W layer and the WN_x layer formed by means of the ALD and constituted by an ultra-thin barrier metal are formed in this manner for constituting the polymetal gate electrode, the electric resistance of the gate electrode can be extremely minimized, and the adhesivity between these layers as well as the heat resistance of these layers can be enhanced, thus enabling them to exhibit excellent barrier properties. In particular, since it is possible to retain such a sufficient barrier properties as described above even if the thickness of the barrier metal 14 is reduced to as thin as 50 angstroms or so, the barrier metal 14 is useful for enhancing the integration of semiconductor integrated circuit through the thinning and multi-layering thereof.

[00081] By the way, the steps of forming the gate electrode wherein the ultra-thin barrier metal 14 to be formed by means of the ALD is formed of WSi_xN_y is shown in FIGS. 8B and 8D. In the method of FIG. 8B, an ultra-thin barrier metal 14 consisting of a WSi_xN_y film and to be formed by means of the ALD is formed to a predetermined thickness on the surface of the polysilicon layer 3 in the same ALD-WSi_xN_y film-forming step as illustrated in FIG. 7B. Thereafter, by making use of a gas comprising WF₆ and H₂, a tungsten layer 32 is formed on the surface of the ultra-thin barrier metal 14 formed by means of the ALD in the same processing vessel 34 (the W film-forming step 80). On the other hand, in the method of FIG. 8D, a nucleation film-forming step 82 for W is performed at first using WF₆ gas, the flow rate of which being smaller than that to be employed in a W layer-forming step 80 (for example, using WF₆ gas at a flow rate of 1 to 20 sccm) after the ALD-WSi_xN_y film-forming step. Thereafter, by making use of a gas comprising WF₆ and H₂, the main step of forming the W film (the step 80) is performed by making use of this nucleation film as an origin.

[00082] Next, one example of the metal gate electrode-forming method illustrated in FIG. 3B will be explained with reference to FIG. 10A.

[00083] First of all, a Si wafer 120 is prepared (step Si), and the natural oxide film formed on the surface of the Si wafer 120 is removed (step S2). According to an ordinary method of removing the natural oxide film formed on the surface of wafer, by making use of a prescribed wet cleaning apparatus, the wafer is dipped in a mixed solution consisting, for example, of hydrofluoric acid and water (1% HF solution) to thereby remove the natural oxide film. It is also possible to employ another method wherein a hydrofluoric vapor phase natural oxide film-removing apparatus (HF Vapor Phase Decomposition System (VPDS)) which is disclosed in U.S. Pat. No. 5,474,641 (invented by the present inventor) is mounted on a cluster tool to thereby continuously perform the removal of natural oxide film and the formation of film. This natural oxide film-removing apparatus is constructed as shown in FIG. 11. Namely, a vessel 300 is provided with gas supply ports 316A and 316B, to each of which an HF gas source 312 and an Ar gas source 314 are connected through a gas supply line 310. Further, the vessel 300 is also provided with exhaust ports 330A and 330B, to each of which an exhaust system (not shown) is connected through an exhaust valve 302. Moreover, the gas supply ports 316A and 316B are respectively connected with a cleaning gas inlet portion comprising a diffusion space S and a large number of cleaning gas discharge port 140, and communicated with a processing chamber C formed inside the vessel 300. This chamber C is provided therein with a supporting mechanism 320 having a substrate-rotating mechanism, thereby enabling the wafer 120 to be supported by the supporting mechanism 320. If a natural oxide film is to be removed by making use of this natural oxide film-removing apparatus, a gas comprising HF vapor gas (vaporized gas with HF solution) is introduced at first, via the gas supply line 310, into the chamber C from the HF vapor gas source 312 with the exhaust valve 302 being kept closed. When the chamber C is filled with a predetermined quantity of the gas comprising HF vapor gas, the supply of the gas comprising HF vapor gas is stopped, and the resultant state is allowed to maintain for a predetermined period of time (for example, 5 to 300 seconds). As a result, the natural oxide film is caused to decompose by the gas containing HF vapor gas. The residual materials thus decomposed and remaining on the surface of the wafer 120 are caused to rotate by the rotating function of the supporting mechanism, and the exhaust valve 302 is opened to supply Ar gas (or H₂, N₂, He gas) from an Ar gas source 314 into the chamber C, thereby allowing the residual materials on the surface of the wafer 120 as well as the HF vapor-containing gas existing inside the chamber C to be discharged therefrom. By repeating the aforementioned processes, it is possible to effectively remove the natural oxide film and hence to permit a clean Si surface (preferably, a Si surface which is terminated with hydrogen atom) to be exposed on the surface of wafer. By the way, in FIG. 11, reference number 509 denotes a steam supply source for cleaning after VPDS HF process. Reference number 507 also denotes a pure water supply source for cleaning after VPDS HF process.

[00084] As an alternative method, the natural oxide film formed on the surface of the wafer 120 can be removed by making use of a plasma which is damageless to the substrate, or a microwave plasma to be generated using a plane antenna provided with a plurality of slits for instance. A chamber in an apparatus for generating the plasma need to have a clean inside-space without impurity causing deterioration of property of elements. One example of the apparatus for realizing the aforementioned method is shown in FIG. 12. Specifically, Ar gas and H₂ gas are introduced into the chamber of the apparatus, thereby allowing plasma to generate. As a result, the natural oxide film SiO₂ formed on the surface of wafer is reduced by the H radicals generated in the plasma and at the same time, etched by the Ar ion to remove the natural oxide film. Since the microwave plasma to be generated using a plane antenna is very low in electron density of plasma, i.e. 1 eV or less, the plasma sheath voltage to be generated between the plasma and the surface of wafer is as very low as several volts (if this voltage is too high, the ion is accelerated to give a damage to the substrate. Whereas the parallel plate type high-frequency plasma is 50 eV or so in plasma sheath voltage). Therefore, the natural oxide film formed on the surface of wafer can be removed without the surface of wafer being damaged by the Ar ion, thereby enabling a clean Si surface (a Si surface which is terminated with hydrogen atom) to be exposed on the surface of wafer.

[00085] After finishing the removal of redundant natural oxide film formed on the surface of the wafer 120 as described above, the wafer 120 is transferred to an ultra-thin Si-containing barrier seed layer-forming device by making use of the same apparatus as shown in FIG. 12. Then, O₂ gas or N₂ gas for example is introduced into the apparatus to generate microwave plasma, thereby enabling the surface of the Si wafer 120 to be directly oxidized or nitrided, thus forming an SiO₂ film 121, an Si_xN_y film or a silicon oxynitride film on the surface of the Si wafer 120 (step S3). Alternatively, the SiO₂ film may be formed by making use of O₃ gas or O₂ gas while employing an ultraviolet lamp in place of the microwave plasma. The SiN film may be formed by making use of N₂ gas or NH₃ gas while employing an ultraviolet lamp. The silicon oxynitride film may be formed by making use of a gas selected from the group consisting of N₂O gas, NO gas, N₂ gas+O₂ gas and/or O₃ gas, and NF₃ gas+O₂ gas and/or O₃ gas, while employing an ultraviolet lamp. Herein, one example where an SiON film constituted by an ultra-thin Si-containing barrier seed layer is formed by making use of the apparatus shown in FIG. 12 using microwave will be explained.

[00086] First of all, a wafer 130 is mounted on a mounting pedestal 152. Then, the gate valve is closed to close the interior of a vacuum vessel 150, after which the inner atmosphere of the vacuum vessel 150 is discharged through an exhaust pipe 153 by means of a vacuum pump 155 to evacuate the interior of the vacuum vessel 150 to a predetermined vacuum degree. Thereafter, the aforementioned processing gas is introduced into the vacuum vessel so as to maintain a predetermined pressure. On the other hand, a microwave of 2.45 GHz (3 kW) for instance is permitted to generate from a microwave power source 161 and introduced, as guided by a wave-guide 163, into the vacuum vessel 150 through a radial line slot antenna (RLSA) 160 which is made of copper for instance and through a gas supply chamber 154, thereby enabling plasma to generate at a plasma region P which is located at an upper portion of the vacuum vessel 150. As for the frequency of the microwave, it may be in the range of 1 to 20 GHz. As for the electric power, it may be in the range of 1 to 10 kW.

[00087] In this case, the microwave is transmitted as a rectangular mode through a rectangular wave-guide 163D and subsequently, converted into a circular mode at a coaxial-to-waveguide transducer 163C. Thereafter, this microwave of circular mode is transmitted through a cylindrical coaxial waveguide 163B, expanded at a circular waveguide 163A and emitted from the slots 160a of the RLSA 160, thereby enabling the microwave to be introduced through a first gas supply portion 154 into the vacuum vessel 150.

[00088] Then, the pressure inside the vacuum vessel is set to fall within the range of 0.1 m Torr to 1 Torr, and the temperature of the mounting pedestal 152 is adjusted so as to heat the wafer 130 at a temperature ranging from 20 to 500° C., during which Ar gas, N₂ gas, H₂ gas and O₂ gas are introduced, as processing gases, from a second gas supply portion 172 into the vacuum vessel at flow rates of 50 to 5000 sccm, 10 to 500 sccm, 10 to 200 sccm and 0.1 to 100 sccm, respectively, preferably at flow rates of 500 to 2000 sccm, 25 to 100 sccm, 15 to 50 sccm and 1 to 10 sccm, respectively. By the way, these processing gases may be introduced through the first gas supply portion 154. As plasma gas, Ne gas, He gas, Kr gas, Xe gas may be introduced.

[00089] The gases introduced in this step are activated (radicalization) by the plasma flow that has been generated in the vacuum vessel 150, thereby enabling the activated oxynitrogen in this plasma to react with the Si constituting the surface of the wafer 130 to oxynitride the surface of the wafer 130, thus forming an SiON film. The activated hydrogen in the plasma in this case is effective in suppressing the generation of sputtering from the surface of the wafer 130, thereby enhancing the efficiency of the oxynitridation of Si. When this oxynitridation of Si is performed for a period ranging from 1 to 30 seconds, an ultra-thin Si-containing barrier seed layer constituted by an SiON film and having a thickness of 0.1 to 3 nm can be formed.

[00090] By the way, it is possible in this case to introduce N₂O gas and NO gas into the vacuum vessel in place of aforementioned N₂ gas and O₂ gas. Further, NH₃ gas may be employed in place of N₂ gas. If an SiO film is to be formed, it can be formed using an inert gas, H₂ gas and O₂ gas. Further, if an SiON film is to be formed, a thermal SiO₂ film which has been formed in advance on the surface of wafer may be nitrided by making use of the aforementioned nitriding gas in microwave plasma to thereby form the SiON film. Alternatively, an oxidizing treatment and a nitriding treatment may be alternately applied to a Si substrate to thereby form the SiON film.

[00091] It is also conceivable to form an ultra-thin SiN film on the surface of the aforementioned ultra-thin Si-containing barrier seed layer so as to enhance the barrier property of the barrier seed layer for preventing the diffusion of metallic atom or oxygen atom which are contained in the overlying layer. The method of forming such an ultra-thin SiN film can be executed as follows. First of all, the wafer 130 is taken out of the vacuum vessel 150 and transferred to a separate plasma processing unit (not shown). Then, while maintaining the conditions of the interior of the processing unit at such ranges that, for example, 200 to 500° C. in the temperature of the wafer 130 and, for example, 0.1 m Torr to 1 Torr in the process pressure, SiH₄ gas is introduced through the first gas supply portion 154 into the processing chamber at a flow rate of 15 sccm to 100 sccm, and at the same time, Xe gas (alternatively, it may be Ar or He) and H₂ gas are respectively introduced from the second gas supply portion 172 at a flow rate of 500 to 2000 sccm and 20 to 200 sccm, respectively, thereby generating plasma. As a result of this process, the gases thus introduced are caused to dissociate, decompose and react with Si by the effects of the plasma, thereby enabling an ultra-thin SiN film to be deposited on the SiO₂ or SiON film of the ultra-thin Si-containing barrier seed layer formed on the wafer 130. As for the source of plasma, it may be RF plasma, remote plasma or microwave plasma. NH₃ gas may be used instead of N₂ gas.

[00092] Next, a ferroelectric film (dielectric constant: 5-30) consisting of a High K material (high dielectric material) such as Al₂O₃, ZrO₂, HfO₂, IrO₂, Ta₂O₅, SBT, PZT, ZrSi_xO_y, Hf_xSi_xO_y, La₂O₃, Gd₂O₃, RuO and Pr₂O₃ is deposited on the surface of the ultra-thin Si-containing barrier seed layer by means of a prescribed apparatus (such as a sputtering apparatus, a CVD apparatus, etc.) (step S4). More specifically, if an Al₂O₃ film is to be formed for instance, TMA (trimethyl aluminum) and water (steam or water vapor) are alternately fed to thereby deposit the Al₂O₃ film. By the way, the High K materials may be formed by means of the ALD method.

[00093] Upon finishing the aforementioned process, an ultra-thin barrier metal 14 constituted by a refractory metal nitride film or a refractory metal silicon nitride film, for example, WN_x or WSi_xN_y is formed by means of the ALD (atomic layer deposition) (the cycle of FIG. 7 is repeated) as mentioned above (step S5). Then, a W film 124 is deposited thereon (step S6). A specific example of the gate electrode layer structure formed as mentioned above is shown in FIGS. 13A and 13B. In these FIGS., the reference numeral 170 represents a High K film made of one of the aforementioned High K materials, 171 represents an ultra-thin Si-containing barrier seed layer, and 173 represents a polysilicon film. Further, specific steps of forming another gate electrode structure shown in FIG. 13B are shown in FIG. 10C. In this case, the Si-containing barrier seed layer is constituted by a gate oxide film or an oxynitride film without the High K film being formed, and an ultra-thin barrier metal layer constituted by a refractory metal nitride or a refractory metal silicon nitride is directly formed by means of the ALD on the Si-containing barrier seed layer as shown in FIG. 10C. The details of these steps are the same as those of FIG. 10A, and hence the explanation of these steps will be omitted herein.

[00094] Next, if a wiring layer 124 for constituting a wiring layer is to be formed on the surface of the barrier metal layer, it is preferable to form a nucleation film of W at first, the main W film being subsequently allowed to grow by making use of this nucleation film as an origin. However, the nucleation film of W may be omitted, and hence the W film may be directly formed on the surface of the ultra-thin barrier metal 14 formed by means of the ALD. Further, if both of the ultra-thin barrier metal 14 and the W film are formed by means of the ALD method, they can be formed according to the method shown in FIG. 7 or FIG. 8.

[00095] The gate electrode according to the present invention and the ordinary gate electrode according to the prior art are evaluated on their properties, the results being shown in FIG. 14.

[00096] In FIG. 14, Comparative Examples 1 and 2 represent the conventional gate electrodes. As clearly seen from FIG. 14, Examples 1-7 of the present invention are excellent not only in both electric resistance and heat resistance which are important characteristics for the gate electrode, but also in both response speed and leakage current. Whereas, in the case of Comparative Example 1, although it is excellent in heat resistance, the electric resistance thereof which is a very important feature is considerably large and the response speed thereof is also slow, and hence the Comparative Example 1 is not preferable. In the case of Comparative Example 2 also, the electric resistance thereof is large and the response speed thereof is also slow, and hence the Comparative Example 2 is not preferable. Therefore, the semiconductor device to be manufactured by making use of the ultra-thin barrier metal formed by means of the ALD according to the present invention is useful in enhancing the integration and operation speed of the device to be manufactured in future.

[00097] In the foregoing embodiments, the explanation thereof has been made taking one example wherein the gate oxide film 26 is constituted by a thermal SiO₂. However, the present invention is not limited to such embodiments, and hence the gate oxide film 26 may be constituted by an SiO₂ film or an SiON film which can be formed by exposing the surface of aforementioned Si substrate to activated oxygen and/or activated nitrogen so as to oxidize, nitride or oxynitride the surface of aforementioned Si substrate, or constituted by an oxide film which can be obtained by depositing a High K film on the surface of the aforementioned SiO₂ film or SiON film, the High K film being selected from tantalum oxide (Ta₂O₅), IrO, SBT, PZT, ZrSi_xO_y, HfSi_xO_y, HfO₂, ZrO₂, La₂O₃, Pr₂O₃, Ga₂O₃, etc.

[00098] In the formation of the ultra-thin barrier metal film, the WN_x or WSi_xN_y which are to be employed in the aforementioned ALD according to the examples of the present invention can be removed, as in the case of other main films, by way of dry cleaning wherein a gas comprising ClF₃ gas is introduced into the chamber. When a redundant film that has been adhered onto the inner wall of the chamber is removed by way of dry-cleaning every moment after finishing the film-forming process of a suitable number of wafers (for example, one lot (25 sheets)), the generation of particles can be suppressed due to the removal of redundant film that has been adhered onto the inner wall of the chamber, thereby making it possible to form a film of excellent quality.

[00099] In the embodiments of the present invention, the explanation thereof has been made taking one example wherein tungsten was employed as a refractory metallic material for the ultra-thin barrier metal constituted by a refractory metal nitride film or a refractory silicon nitride film. However, the present invention is not limited to such embodiments, and hence it is possible to employ, for example, molybdenum (Mo), Ti, Ta, Co, Zu, Hf, Nb, Ni, La, Ga, Pr, etc. as a refractory metallic material for the ultra-thin barrier metal. Further, in the foregoing embodiments, the explanation thereof has been made taking one example wherein a semiconductor wafer was employed as a substrate. However, the present invention is not limited to such embodiments, and hence it is of course possible to employ, for example, an LCD substrate, a glass substrate, compound semiconductor substrate, etc. as the substrate.

[00100] Further, the embodiments of the present invention may be modified such that the processing gas may be introduced in the form of vapor phase pulses into the processing space. In this case, this processing step may comprise a step of evacuating a reaction space between two successive vapor phase pulses by connecting the reaction space to a pump so that substantially all of the reactants remaining in the reaction space and adsorbed on the inner walls of the reaction space are removed to a level of less than 1-30% prior to the inflow of a second pulse of said two successive vapor phase pulses; and a step of feeding an inactive gas into the reaction space simultaneous with the evacuating step.

[00101] The ultra-thin barrier metal is formed by means of ALD, using WF₆ gas, in the foregoing embodiments of the present invention(see FIGS. 7 and 8). Nonetheless, WN_x and WSi_xN_y may be formed by using carbonyle metal gas such as hexacarbonyl tungsten (W(CO)₆). In this case, the steps 76 and 81 (FIGS. 7 and 8) of feeding WF₆ gas are replaced by the steps of feeding gas containing W(CO)₆. If WF₆ gas or the like is utilized, the fluorine atoms will diffuse into the lower layers and damage the lower layers. By contrast, if hexacarbonyl tungsten (W(CO)₆) is used, no lower layers will be damaged by the fluorine atoms. In view of this, the use of hexacarbonyl tungsten (W(CO)₆) is advantageous.

[00102] FIG. 15 illustrates a gas supply system 561 for supplying a gas containing W(CO)₆ gas. The system 561 comprises a supply line 541 and a vessel 542. The supply line 541 supplies material gas and carrier gas. The vessel 542 contains hexacarbonyl tungsten 543, i.e., the material. Since hexacarbonyl tungsten 543 remains in solid phase at room temperature, the vessel 542 has a heater 560 for heating hexacarbonyl tungsten 543. The heater 560 heats the hexacarbonyl tungsten 543 to 50 to 200° C., preferably to 100 to 160° C. A carrier gas feeding line 545 and a pipe 546 are respectively connected to one end of the supply line 541 via a change valve 549. An Ar gas source 553 is connected to one end of the pipe 546 via an on-off valve 534. An exhausting line 556 is connected to the middle part of the supply line via a change valve 548. A material gas emission line 600 is connected to the middle part of the supply line via an on-off valve 533. Ar gas is supplied from the Ar gas source 553 into the vessel 542 through the pipe 546 and the carrier gas feeding line 545. Then, hexacarbonyl tungsten that has been heated and vaporized is guided into the supply line 541 via the material gas emission line 600. The gas emission line 600 has its one end inserted into hexacarbonyl tungsten 543 contained in the vessel 542. The other end of the supply line 541 is connected to the gas inlet port 43 of the processing vessel (chamber) shown in FIG. 5 for instance. The change valves 548 and 549 perform switching between the supply of hexacarbonyl tungsten gas to the processing vessel and the discharging of hexacarbonyl tungsten gas. To discharge the material gas from the supply line 541, the on-off value 533 is closed and the change valve 548 is connected to the exhausting line 556. Thus, Ar gas supplied from the Ar gas source 553 is discharged through the supply line 541 and the exhausting line 556. A heater 558 surrounds the supply line 541 and extends from the vessel 542 to the processing vessel shown in FIG. 5. The heater 558 heats the supply line 541 to a predetermined temperature (e.g., 100 to 160° C.) and maintains the line 541 at this temperature. This prevents the hexacarbonyl tungsten gas from returning into the solid state. As FIG. 15 shows, a mass flow controller 559 is provided for controlling the flow rate at which hexacarbonyl tungsten gas is supplied. By the way, mass flow controller (MFC) may be arranged at the middle part of the pipe 546 to control Ar gas for controlling W(CO)₆ gas.

[00103] The present invention differs from the invention disclosed in U.S. Pat. No. 6,015,590. As pointed out above, the specification of U.S. Pat. No. 6,015,590 asserts that at least 99% of the residual gas should be removed for forming a thin film effectively. In fact, however, almost the same effect as attained in U.S. Pat. No. 6,015,590 can be obtained even if the residual gas is permitted to remain in a processing chamber at a ratio of 1 to 30% as in the present invention. The apparatus disclosed in the U.S. patent specification is designed to minimize both the volume and the cross-section of the piping. The method according to the present invention can achieve almost the same effect as the invention disclosed in the U.S. patent, though it uses a CVD chamber of ordinary structure.

[00104] In addition, the apparatus of the U.S. patent is designed not to have any dead space where the gas can hardly purged. Generally, projecting components exist in the conventional chambers. In the chambers, pipes and the like give rise to dead spaces. The method according to the present invention can form thin films by means of ALD, even if the chamber has dead spaces.

[00105] Moreover, in the apparatus of the U.S. patent, which is designed to reduce the volumetric capacity of the chamber as much as possible, the gas inevitably spreads, forming a substantially planar flow pattern, or a “flat” flow pattern. By contrast, the method according to the present invention can use the conventional CVD apparatus that forms gas streams of down flow.

[00106] Moreover, in the foregoing embodiments of the present invention(see FIG. 10A), a ferroelectric film consisting of a High K material(high dielectric material) is deposited on the surface of the ultra-thin Si-containing barrier seed layer. In this case, specifically in case that oxide-dielectric film such as Ta₂O₅ is deposited on the surface of the ultra-thin Si-containing barrier seed layer, a depletion of oxygen in the dielectric film occurs so that the crystal structure become unstable. This causes any leak current. To prevent this, it is needed to produce any active oxygen while irradiating ultraviolet ray, thereby striking the active oxygen to the dielectric film to decrease depletion of oxygen in the dielectric film. For this purpose, annealing is achieved at a temperature ranging from 300 to 700° C. for 1-30 minutes, preferably for 3-15 minutes under the atmosphere of a gas containing oxygen or ozone, while irradiating ultraviolet ray to produce any active oxygen. In this case, the temperature of a substrate is 300° C.-800° C., preferably 400° C.-700° C., the concentration of O₃ is 2-10%, preferably 5-8% and the illumination of UV ray is 100-500 mw/cm². As for the UV lamp, it may be an excimer lamp or a mercury lamp. The gas containing oxygen may be formed from plasma such as ICP or RLSA. The ozone may be formed from the gas containing oxygen by a ozone-generating apparatus (In general generating step of O₃, small quantity of N₂ gas is added (for example, in quantities of 1% of quantities of O₂ gas) as impurity gas. In this case, NOx gas is produced so that environment may be polluted). In this case, Addition gas such as inert gas or mixed gas comprising inert gas and H₂ gas is used to improve the rate of generating of O₃ generated by the ozone-generating apparatus. As for inert gas, it may be Ar gas, N₂ gas, Ne gas, Kr gas or Xe gas. The addition gas may be introduced in extremely small quantities, for example, in quantities not more than 1% of quantities of the gas containing oxygen, preferably in quantities not more than 0.5% of quantities of the gas containing oxygen, more preferably in quantities not more than 0.1% of quantities of the gas containing oxygen, thereby suppressing generation of NO_x.

[00107] Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.