Semiconductor device having a copper interconnect layer

[0002] The present invention relates to a semiconductor device and method and apparatus for fabricating the same.

[0003] As the number of semiconductor devices integrated on a single chip has been steeply rising, the gap between adjacent interconnect layers has been drastically reduced, resulting in non-negligible increase in capacitance between these interconnect layers. In general, the larger a capacitance between interconnect layers, the lower the operating speed of a semiconductor device, because a line-to-line delay also increases accordingly. In order to prevent such decrease in the operating speed of semiconductor devices, various techniques of forming an interconnect layer with a low resistance using copper (Cu) have recently been suggested more and more often. Hereinafter, a conventional semiconductor device, including an interconnect layer of Cu, will be described with reference to FIGS. 25, 26, 27, 28, 29 and 30.

[0004] As shown in FIG. 30, this semiconductor device includes: a semiconductor substrate 1; a lower interconnect layer 2 formed on the surface of the semiconductor substrate 1; and a silicon dioxide (SiO₂) film 3 formed over the semiconductor substrate 1 to cover the lower interconnect layer 2. A trisilicon tetranitride (Si₃N₄) film 4 is deposited over the SiO₂film 3, and another SiO₂film 5 is deposited on the Si₃N₄film 4. An interlevel dielectric film is made up of the SiO₂film 3, Si₃N₄film 4 and SiO₂film 5. In this interlevel dielectric film, a through hole 6, reaching the lower interconnect layer 2, and an interconnection channel or trench 7, communicating with the through hole 6, are formed. An upper interconnect layer 13, which is in electrical contact with the lower interconnect layer 2 via the through hole 6, is formed within the interconnection channel 7.

[0005] The upper interconnect layer 13 includes: a titanium (Ti) film 8 covering the inner side faces and bottom of the through hole 6 and interconnection channel 7; a titanium nitride (TiN) film 9 deposited on the Ti film 8; a Cu film 10 deposited on the TiN film 9; and a Cu film 11 deposited on the Cu film 10. Alternatively, the upper interconnect layer 13 may include a tantalum nitride (TaN) film instead of the TiN film 9.

[0006] Such a semiconductor device may be fabricated in the following manner.

[0007] First, as shown in FIG. 25, the lower interconnect layer 2 is formed on the semiconductor substrate 1. Next, as shown in FIG. 26, the SiO₂film 3, Si₃N₄film 4 and SiO₂film 5 are deposited in this order and alternately subjected to photolithography and dry etching twice. In this manner, the through hole 6 is formed inside the SiO₂film 3 and Si₃N₄film 4, and the interconnection channel 7 is formed inside the SiO₂film 5. Then, as shown in FIG. 27, the bottom of the through hole 6 is cleaned by dry etching. And the Ti film 8 and the TiN film 9 are deposited in this order by physical vapor deposition (PVD) and chemical vapor deposition (CVD) processes, respectively.

[0008] Next, as shown in FIG. 28, the surface of the TiN film 9 is exposed to N₂plasma, thereby increasing the density of the TiN film 9. As the case may be, this process step is sometimes omitted. Thereafter, as shown in FIG. 29, the Cu film 10 is deposited by a PVD process on the surface of the TiN film 9. However, the Cu film 10 is deposited only in the central region of the semiconductor substrate 1. The reason thereof will be described later.

[0009] After the surfaces of the TiN film 9 and Cu film 10 have been cleaned with sulfuric acid (H₂SO₄), the Cu film 11 is deposited on the surface of the Cu film 10 by an electroplating technique. Finally, respective portions of the Ti film 8, TiN film 9 and Cu films 10 and 11, which are deposited on the SiO₂film 5, are removed by a chemical/mechanical polishing (CMP) technique to complete the semiconductor device shown in FIG. 30.

[0010] The reason why the Cu film 10 is deposited only in the central region of the semiconductor substrate 1 will be described. Generally speaking, it is only in the central region of a semiconductor substrate that a metal layer can be removed by a CMP technique. Thus, part of the metal layer is ordinarily left in the peripheral region of the semiconductor substrate even after the polishing. If the Cu film is left in the peripheral region of the semiconductor substrate 1, then the Cu film is likely to peel off during a subsequent process step to contaminate an apparatus for fabricating the semiconductor device. Accordingly, a technique of preventing a residue of a Cu film from being formed in the peripheral region of a semiconductor substrate 1 by depositing the Cu film only in the central region of the semiconductor substrate 1 is widely used.

[0011] If a semiconductor device is fabricated in this manner, however, the following problems are caused.

[0012] First, when a TaN film 9 is deposited by a CVD process, the connection resistance between the lower and upper interconnect layers 2 and 13 becomes high and the operating speed of the semiconductor device may decrease, because the resistivity of the TaN film 9 is high. It is probably because a large quantity of carbon (C) is contained in the TaN film 9 that the resistivity of the TaN film 9 is high.

[0013] Also, Cu atoms contained in the Cu films 10 and 11 reach the SiO₂films 3 and 5 through the TiN (or TaN) film 9. This is because the TiN (or TaN) film 9 cannot satisfactorily prevent the diffusion of the Cu atoms. The Cu atoms, which have reached the SiO₂films 3 and 5, are turned into mobile ions inside these films 3 and 5, thereby increasing the leakage current flowing between the through holes 6 and between adjacent portions of the upper interconnect layer 13. As a result, the semiconductor device is more likely to cause some failure during the operation thereof.

[0014] In addition, as shown in FIG. 29, when the Cu film 11 is deposited by an electroplating technique, a Cu film 12 is unintentionally deposited on the surface of the TiN film 9 adjacent to the Cu film 10. The adhesion of the Cu film 12 to the underlying TiN film 9 is poor. And the Cu film 12 easily peels off during the CMP process, thus considerably decreasing the yield of semiconductor devices.

[0015] An object of the present invention is providing a semiconductor device and method and apparatus for fabricating the same, which cause neither operating failures nor decrease in yield even when an interconnect layer is made of Cu.

[0016] A semiconductor device according to the present invention includes: a substrate; a first conductor film supported by the substrate; an insulating film formed on the substrate to cover the first conductor film, an opening being formed in the insulating film; and a second conductor film, which is formed within the opening of the insulating film and is in electrical contact with the first conductor film. The second conductor film includes: a silicon-containing titanium nitride layer formed within the opening of the insulating film; and a metal layer formed over the silicon-containing titanium nitride layer and mainly composed of copper.

[0017] Another semiconductor device according to the present invention includes: a substrate; a first conductor film supported by the substrate; an insulating film formed on the to substrate to cover the first conductor film, an opening being formed in the insulating film; and a second conductor film, which is formed within the opening of the insulating film and is in electrical contact with the first conductor film. The second conductor film includes: a silicon-containing titanium nitride layer formed within the opening of the insulating film; a silicon-containing metal layer formed on the silicon-containing titanium nitride layer; and a metal layer formed on the silicon-containing metal layer, the metal layer being mainly composed of copper.

[0018] A method for fabricating a semiconductor device according to the present invention includes the steps of: a) forming a first conductor film on a substrate; b) depositing an insulating film over the substrate to cover the first conductor film; c) forming an opening in the insulating film such that at least part of the opening reaches the first conductor film; and d) forming a second conductor film within the opening of the insulating film. The step d) includes the steps of: depositing a silicon-containing titanium nitride layer by a chemical vapor deposition process to cover the inner sidewall and bottom of the opening of the insulating film; bombarding the surface of the silicon-containing titanium nitride layer with ions; and depositing a metal layer on the surface of the silicon-containing titanium nitride layer.

[0019] Another method for fabricating a semiconductor device according to the present invention includes the steps of: a) forming a first conductor film on a substrate; b) depositing an insulating film over the substrate to cover the first conductor film; c) forming an opening in the insulating film such that at least part of the opening reaches the first conductor film; and d) forming a second conductor film within the opening of the insulating film. The step d) includes the steps of: depositing a titanium nitride layer by a chemical vapor deposition process to cover the inner sidewall and bottom of the opening of the insulating film; bombarding the surface of the titanium nitride layer with ions; exposing the surface of the titanium nitride layer to a silicide to form a silicon-containing titanium nitride layer; and depositing a metal layer on the surface of the silicon-containing titanium nitride layer.

[0020] Still another method for fabricating a semiconductor device according to the present invention includes the steps of: a) forming a first conductor film on a substrate; b) depositing an insulating film over the substrate to cover the first conductor film; c) forming an opening in the insulating film such that at least part of the opening reaches the first conductor film; and d) forming a second conductor film within the opening of the insulating film. The step d) includes the steps of: depositing a titanium nitride layer by a chemical vapor deposition process to cover the inner sidewall and bottom of the opening of the insulating film; bombarding the surface of the titanium nitride layer with ions; exposing the surface of the titanium nitride layer to a silicide to form a silicon-containing titanium nitride layer; exposing the surface of the silicon-containing titanium nitride layer to a silicide to form a silicon layer; and depositing a metal layer on the surface of the silicon layer.

[0021] An apparatus for fabricating a semiconductor device according to the present invention includes a chemical vapor deposition chamber and a power supply connected to the susceptor and the electrode. The chemical vapor deposition chamber includes: a vacuum chamber; a susceptor placed inside the vacuum chamber, a heating mechanism being provided in the susceptor; an exhaust port provided inside the vacuum chamber; an inlet port provided inside the vacuum chamber; and an electrode provided inside the vacuum chamber. A titanium-containing organic compound, a nitride and a silicide are introduced through the inlet port.

[0022] Still another semiconductor device according to the present invention includes: a substrate; a first conductor film supported by the substrate; an insulating film formed on the substrate to cover the first conductor film, an opening being formed in the insulating film; and a second conductor film, which is formed within the opening of the insulating film and is in electrical contact with the first conductor film. The second conductor film includes: a carbon-containing metal nitride layer formed within the opening of the insulating film; and a metal layer formed on the carbon-containing metal nitride layer. The concentration of carbon in a portion of the metal nitride layer, which is formed over the bottom of the opening of the insulating film, is lower than that of carbon in another portion of the metal nitride layer, which is formed over the inner sidewall of the opening.

[0023] Yet another semiconductor device according to the present invention includes: a substrate; a first conductor film supported by the substrate; an insulating film formed on the substrate to cover the first conductor film, an opening being formed in the insulating film; and a second conductor film, which is formed within the opening of the insulating film and is in electrical contact with the first conductor film. The second conductor film includes: a metal nitride layer formed within the opening of the insulating film; a metal nitride silicide layer formed on the metal nitride layer; and a metal layer formed on the metal nitride silicide layer.

[0024] Yet another method for fabricating a semiconductor device according to the present invention includes the steps of: a) forming a first conductor film on a substrate; b) depositing an insulating film over the substrate to cover the first conductor film; c) forming an opening in the insulating film such that at least part of the opening reaches the first conductor film; and d) forming a second conductor film within the opening of the insulating film. The step d) includes the steps of: depositing a carbon-containing metal nitride layer by a chemical vapor deposition process to cover the inner sidewall and bottom of the opening of the insulating film; bombarding the surface of the carbon-containing metal nitride layer with ions; and depositing a metal layer on the surface of the carbon-containing metal nitride layer.

[0025] Yet another method for fabricating a semiconductor device according to the present invention includes the steps of: a) forming a first conductor film on a substrate; b) depositing an insulating film over the substrate to cover the first conductor film; c) forming an opening in the insulating film such that at least part of the opening reaches the first conductor film; and d) forming a second conductor film within the opening of the insulating film. The step d) includes the steps of: depositing a metal nitride layer by a chemical vapor deposition process to cover the inner sidewall and the bottom of the opening of the insulating film; bombarding the surface of the metal nitride layer with ions; exposing the surface of the metal nitride layer to a silicide to form a metal nitride silicide layer; and depositing a metal layer on the surface of the metal nitride silicide layer.

[0026] In a semiconductor device of the present invention, the concentration of carbon contained in a metal nitride film deposited on the bottom of an opening is lower than that of carbon contained in a metal nitride film deposited on the sidewall of the opening. The lower the concentration of carbon contained, the lower the resistivity of the metal nitride. Thus, by adjusting the amount of carbon contained in a metal nitride film deposited on the bottom of an opening (e.g., a through hole), the connection resistance between the lower and upper interconnect layers can be reduced as compared with the prior art.

[0027] In another semiconductor device of the present invention, the sidewalls of the through hole and the interconnect layer are covered with a metal nitride silicide (e.g., silicon-containing titanium nitride) layer. The ability of the metal nitride silicide layer to prevent the diffusion of copper atoms is higher than that of a metal nitride layer. Accordingly, in the structure of the present invention, the concentration of copper atoms contained in the insulating layer can be lowered. As a result, the leakage current flowing between the through holes and between adjacent portions of the upper interconnect layer can be reduced as compared with the prior art.

[0028] FIG. 1 is a cross-sectional view illustrating a first embodiment of a method for fabricating a semiconductor device according to the present invention.

[0029] FIG. 2 is a cross-sectional view illustrating the first embodiment of the method for fabricating a semiconductor device according to the present invention.

[0030] FIG. 3 is a cross-sectional view illustrating the first embodiment of the method for fabricating a semiconductor device according to the present invention.

[0031] FIG. 4 is a cross-sectional view illustrating the first embodiment of the method for fabricating a semiconductor device according to the present invention.

[0032] FIG. 5 is a cross-sectional view illustrating the first embodiment of the method for fabricating a semiconductor device according to the present invention.

[0033] FIG. 6 is a cross-sectional view illustrating the first embodiment of the method for fabricating a semiconductor device according to the present invention.

[0034] FIG. 7 is a cross-sectional view illustrating a first embodiment of a semiconductor device according to the present invention.

[0035] FIG. 8 is a graph illustrating the concentrations of silicon contained in respective titanium nitride layers formed on a plane vertical to the surface of a semiconductor substrate as a function of the depth measured from the surface thereof in the first embodiment of the present invention.

[0036] FIGS. 9A and 9B are graphs illustrating the results of an x-ray photoelectron spectroscopy (XPS) analysis on the surface and inside of a silicon-containing titanium nitride layer and a titanium nitride layer formed on the plane vertical to the surface of a semiconductor substrate in the first embodiment of the present invention:

[0037] FIG. 9A illustrates the XPS spectra of Ti atoms (Ti2p) contained in the silicon-containing titanium nitride layer, which has been formed through the exposure to SiH₄; and

[0038] FIG. 9B illustrates the XPS spectra of Ti atoms (Ti2p) contained in the titanium nitride layer, which has not been exposed to SiH₄.

[0039] FIGS. 10A and 10B are graphs illustrating the results of an XPS analysis on the surface and inside of a silicon-containing titanium nitride layer and a titanium nitride layer formed on a plane vertical to the surface of a semiconductor substrate in the first embodiment of the present invention:

[0040] FIG. 10A illustrates the XPS spectra of Si atoms (Si2p) contained in the silicon-containing titanium nitride layer, which has been formed through the exposure to SiH₄; and

[0041] FIG. 10B illustrates the XPS spectra of Si atoms (Si2p) contained in the titanium nitride layer, which has not been exposed to SiH₄.

[0042] FIG. 11 is a graph illustrating the concentrations of silicon contained in respective titanium nitride layers formed on a plane parallel to the surface of a semiconductor substrate as a function of the depth measured from the surface thereof in the first embodiment of the present invention.

[0043] FIGS. 12A and 12B are graphs illustrating the results of an XPS analysis on the surface and inside of a silicon-containing titanium nitride layer and a titanium nitride layer formed on the plane parallel to the surface of a semiconductor substrate in the first embodiment of the present invention:

[0044] FIG. 12A illustrates the XPS spectra of Ti atoms (Ti2p) contained in the silicon-containing titanium nitride layer, which has been formed through the exposure to SiH₄; and

[0045] FIG. 12B illustrates the XPS spectra of Ti atoms (Ti2p) contained in the titanium nitride layer, which has not been exposed to SiH₄.

[0046] FIGS. 13A and 13B are graphs illustrating the results of an XPS analysis on the surface and inside of a silicon-containing titanium nitride layer and a titanium nitride layer formed on a plane parallel to the surface of a semiconductor substrate in the first embodiment of the present invention:

[0047] FIG. 13A illustrates the XPS spectra of Si atoms (Si2p) contained in the silicon-containing titanium nitride layer, which has been formed through the exposure to SiH₄; and

[0048] FIG. 13B illustrates the XPS spectra of Si atoms (Si2p) contained in the titanium nitride layer, which has not been exposed to SiH₄.

[0049] FIG. 14 is a cross-sectional view illustrating an embodiment of an apparatus for fabricating a semiconductor device according to the present invention.

[0050] FIG. 15 is a cross-sectional view illustrating a second embodiment of a method for fabricating a semiconductor device according to the present invention.

[0051] FIG. 16 is a cross-sectional view illustrating the second embodiment of the method for fabricating a semiconductor device according to the present invention.

[0052] FIG. 17 is a cross-sectional view illustrating the second embodiment of the method for fabricating a semiconductor device according to the present invention.

[0053] FIG. 18 is a cross-sectional view illustrating the second embodiment of the method for fabricating a semiconductor device according to the present invention.

[0054] FIG. 19 is a cross-sectional view illustrating the second embodiment of the method for fabricating a semiconductor device according to the present invention.

[0055] FIG. 20 is a cross-sectional view illustrating a second embodiment of a semiconductor device according to the present invention.

[0056] FIG. 21 is a graph illustrating in comparison respective thicknesses of a silicon-containing titanium nitride layer deposited on plane vertical to the surface of a semiconductor substrate and a silicon-containing titanium nitride layer deposited on a plane parallel thereto in the second embodiment of the present invention.

[0057] FIGS. 22A and 22B are graphs illustrating the XPS spectra of Ti atoms (Ti2p) contained in the surfaces and inside of a silicon-containing titanium nitride layer formed on a plane vertical to the surface of a semiconductor substrate and a silicon-containing titanium nitride layer formed on a plane parallel thereto, respectively, in the second embodiment of the present invention.

[0058] FIGS. 23A and 23B are graphs illustrating the XPS spectra of Si atoms (Si2p) contained in the surfaces and inside of a silicon-containing titanium nitride layer formed on a plane vertical to the surface of a semiconductor substrate and a silicon-containing titanium nitride layer formed on a plane parallel thereto, respectively, in the second embodiment of the present invention.

[0059] FIG. 24 is a graph illustrating respective concentrations of silicon contained in a silicon-containing titanium o nitride layer formed on a plane parallel to the surface of a semiconductor substrate and in a silicon-containing titanium nitride layer formed on a plane vertical thereto as a function of the depth measured from the surface thereof in the second embodiment of the present invention.

[0060] FIG. 25 is a cross-sectional view illustrating a conventional method for fabricating a semiconductor device.

[0061] FIG. 26 is a cross-sectional view illustrating the conventional method for fabricating a semiconductor device.

[0062] FIG. 27 is a cross-sectional view illustrating the conventional method for fabricating a semiconductor device.

[0063] FIG. 28 is a cross-sectional view illustrating the conventional method for fabricating a semiconductor device.

[0064] FIG. 29 is a cross-sectional view illustrating the conventional method for fabricating a semiconductor device.

[0065] FIG. 30 is a cross-sectional view illustrating a conventional semiconductor device.

[0066] FIG. 31 is a cross-sectional view illustrating a third embodiment of a method for fabricating a semiconductor device according to the present invention.

[0067] FIG. 32 is a cross-sectional view illustrating the third embodiment of the method for fabricating a semiconductor device according to the present invention.

[0068] FIG. 33 is a cross-sectional view illustrating the third embodiment of the method for fabricating a semiconductor device according to the present invention.

[0069] FIG. 34 is a cross-sectional view illustrating the third embodiment of the method for fabricating a semiconductor device according to the present invention.

[0070] FIG. 35 is a cross-sectional view illustrating the third embodiment of the method for fabricating a semiconductor device according to the present invention.

[0071] FIG. 36 is a cross-sectional view illustrating the third embodiment of the method for fabricating a semiconductor device according to the present invention.

[0072] FIG. 37 is a cross-sectional view illustrating a third embodiment of a semiconductor device according to the present invention.

[0073] FIG. 38 illustrates an exemplary arrangement for an apparatus for fabricating the semiconductor device according to the present invention.

[0074] FIG. 39 illustrates an exemplary arrangement for another apparatus for fabricating the semiconductor device according to the present invention.

[0075] FIG. 40 is a cross-sectional view illustrating a fourth embodiment of a method for fabricating a semiconductor device according to the present invention.

[0076] FIG. 41 is a cross-sectional view illustrating the fourth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0077] FIG. 42 is a cross-sectional view illustrating the fourth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0078] FIG. 43 is a cross-sectional view illustrating the fourth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0079] FIG. 44 is a cross-sectional view illustrating the fourth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0080] FIG. 45 is a cross-sectional view illustrating a fourth embodiment of a semiconductor device according to the present invention.

[0081] FIG. 46 is a cross-sectional view illustrating a fifth embodiment of a method for fabricating a semiconductor device according to the present invention.

[0082] FIG. 47 is a cross-sectional view illustrating the fifth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0083] FIG. 48 is a cross-sectional view illustrating the fifth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0084] FIG. 49 is a cross-sectional view illustrating the fifth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0085] FIG. 50 is a cross-sectional view illustrating the fifth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0086] FIG. 51 is a cross-sectional view illustrating the fifth embodiment of the method for fabricating a semiconductor device according to the present invention.

[0087] FIG. 52 is a cross-sectional view illustrating a fifth embodiment of a semiconductor device according to the present invention.

[0088] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0089] A first exemplary embodiment of the present invention will be described with reference to FIGS. 1, 2, 3, 4, 5, 6 and 7.

[0090] As shown in FIG. 7, the semiconductor device of the first embodiment includes: a semiconductor substrate (e.g., single crystalline silicon substrate) 101; a lower interconnect layer (or first conductive film) 102; and a silicon dioxide (SiO₂) film 103. On the semiconductor substrate 101, integrated circuit devices such as transistors are formed although not shown in FIG. 7. The lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101. And the SiO₂film 103 is deposited on the semiconductor substrate 101 to cover the lower interconnect layer 102. In this specification, the “semiconductor substrate 101” collectively refers to a single crystalline silicon substrate, integrated circuit devices such as transistors formed on the surface thereof, and an insulating film formed on surface of the single crystalline substrate to cover the integrated circuit devices. The lower interconnect layer 102 is made of a conductor such as tungsten (W), aluminum (Al) or copper (Cu).

[0091] A trisilicon tetranitride (Si₃N₄) film 104 is deposited over the SiO₂film 103, and another SiO₂film 105 is deposited on the Si₃N₄film 104. An interlevel dielectric film is made up of the SiO₂film 103, Si₃N₄film 104 and SiO₂film 105. In the surface of this interlevel dielectric film, an opening is formed. The opening includes a through hole 106, reaching the lower interconnect layer 102, and an interconnection channel, or trench 107, communicating with the through hole 106. An upper interconnect layer 113, which is in electrical contact with the lower interconnect layer 102 via the through hole 106, is formed within the interconnection channel 107. The width of the interconnection channel 107 is in the range from about 100 nm to about 2,000 nm, for example, and the depth thereof is in the range from about 100 nm to about 1,000 nm, for example. Also, in this embodiment, the inner diameter of the through hole 106 is set equal to the width of the interconnection channel 107. Although a single through hole 106 is illustrated in FIG. 7, a plurality of through holes 106 are actually formed in a single interconnection channel 107 at various intervals of about 0.1 μm to about 2 μm.

[0092] The upper interconnect layer 113 includes: a titanium (Ti) film 108 covering the inner side faces and bottom of the through hole 106 and interconnection channel 107; a titanium nitride (TiN) film 109 deposited on the Ti film 108; a silicon-containing TiN (TiSiN) film 110 formed on the TiN film 109; a Cu film 111 deposited on the surface of the TiSiN film 110; and another Cu film 112 deposited on the Cu film 111.

[0093] In this embodiment, the TiN film 109 will be regarded as including vertical portions 109aand horizontal portions 109bif necessary. The vertical portions 109aare formed on the inner sidewalls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 109bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101. In the same way, the TiSiN film 110 will also be regarded as including vertical portions 110aand horizontal portions 110bif necessary. The vertical portions 110aare also formed on the inner side-walls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 110bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101.

[0094] It should be noted that the lower interconnect layer 102 is not necessarily the first-level interconnect layer, but may be an i^th-level interconnect layer of a multilevel interconnection structure including a number N of interconnect layers (where N is an integer equal to or larger than 3, i is also an integer and 1≦i≦N) In this case, the upper interconnect layer may be a j^th-level interconnect layer (where j is an integer and 1<j≦N).

[0095] In such a structure, the leakage current flowing between the through holes 106 and between adjacent portions of the upper interconnect layer 113 can be reduced as compared with the prior art. The reason thereof is as follows.

[0096] In this embodiment, the sidewall of the interconnection channel 107 is covered with the TiSiN film 110. Silicon contained in the TiSiN film 110 is in the form of Si—N bonds. Since the Si—N bonds are much less likely to react with Cu atoms, the ability of the TiSiN film 110, including the Si—N bonds, to prevent the diffusion of Cu atoms is much higher than that of the TiN film. Accordingly, it is harder for the Cu atoms, contained in the Cu films 111 and 112, to reach the SiO₂films 103 and 105. In other words, the concentration of Cu atoms in the SiO₂films 103 and 105 hardly increases. As a result, the leakage current flowing between the through holes 106 and between adjacent portions of the upper interconnect layer 113 can be reduced as compared with the prior art.

[0097] The concentration of Si in the TiSiN film 110awill be described. If the concentration of Si in the TiSiN film 110ais less than 5 atomic percent, then the ability of the TiSiN film 110ato prevent the diffusion of the Cu atoms, which have been supplied from the Cu film 111, declines. As a result, an increased amount of leakage current flows between the through holes 106 and between adjacent portions of the upper interconnect layer 113. This is why the concentration of Si in the TiSiN film 110ais preferably 5 atomic percent or more.

[0098] Next, the thickness of the TiSiN film 110awill be described. If the TiSiN film 110ais thinner than 1 nm, then the ability of the TiSiN film 110ato prevent the diffusion of the Cu atoms, which have been supplied from the Cu film 111, declines. As a result, an increased amount of leakage current flows between the through holes 106 and between adjacent portions of the upper interconnect layer 113. On the other hand, if the TiSiN film 110ais thicker than 50 nm, then the percentage of the Cu films 111 and 112 accounting for the entire cross-sectional area of the upper interconnect layer 113 decreases. As a result, the line resistance of the upper interconnect layer 113 increases and the operating speed of the semiconductor device decreases. This is why the thickness of the TiSiN film 110ais preferably in the range from 1 nm to 50 nm, both inclusive.

[0099] Next, the thickness of the TiSiN film 110bwill be described. The resistivity of the TiSiN film (i.e., about 3,000 μΩcm) is higher than that of the TiN film (i.e., about 200 μΩcm). Thus, if the TiSiN film 110bis too thick, then the connection resistance between the lower and upper interconnect layers 102 and 113 increases, thus decreasing the operating speed of the semiconductor device. This is why the TiSiN film 110bis preferably thinner than the TiSiN film 110a.

[0100] In this embodiment, the semiconductor device may be fabricated by the following process.

[0101] First, as shown in FIG. 1, the semiconductor substrate 101, on which integrated circuit devices such as transistors (not shown) are formed, is prepared, and the lower interconnect layer 102 is formed on the semiconductor substrate 101. The lower interconnect layer 102 may be formed by depositing an Al film on the surface of the semiconductor substrate 101 by a sputtering technique, for example, and then patterning the Al film into a predetermined shape by photolithography and dry etching techniques.

[0102] Next, as shown in FIG. 2, the SiO₂film (thickness: about 100 nm to about 2,000 nm) 103, Si₃N₄film (thickness: about 5 nm to about 50 nm) 104 and SiO₂film (thickness: about 100 nm to about 1,000 nm) 105 are deposited in this order by a plasma enhanced CVD process. Then, these films are alternately subjected to photolithography and dry etching twice, thereby forming the through hole 106 inside the SiO₂film 103 and Si₃N₄film 104 and the interconnection channel 107 inside the SiO₂film 105.

[0103] Next, as shown in FIG. 3, the bottom of the through hole 106 is cleaned by dry etching using argon (Ar) and hydrogen (H₂) gases. Then, the Ti film (thickness: about 0.5 nm to about 10 nm) 108 is deposited by a physical vapor deposition (PVD) process and the TiN film 109 is deposited to be 20 nm thick by a chemical vapor deposition (CVD) process. The TiN film 109 may be deposited by the CVD process in the following manner. The semiconductor substrate 101, on which the Ti film 108 has already been deposited, is heated to 350° C. within a vacuum chamber. When the semiconductor substrate 101 reaches its steady temperature, tetrakisdimethyl titanium (TDMAT), diluted with helium (He), is introduced into the vacuum chamber. In this case, the amount of TDMAT introduced is adjusted at such a value that the partial pressure of TDMAT inside the vacuum chamber becomes 3 Pa. The TDMAT introduced is thermally decomposed on the surface of the Ti film 108. As a result, the TiN film 109 is deposited thereon.

[0104] Subsequently, as shown in FIG. 4, the surface of the TiN film 109 is exposed to nitrogen (N₂) plasma, in which positive ions such as N₂ions are contained. The plasma is generated under the conditions controlled to vertically accelerate these positive ions toward the semiconductor substrate 101. Accordingly, the TiN film 109bdeposited on the plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision. As a result, the density of the TiN film 109 increases. On the other hand, since the TiN film 109adeposited on the planes substantially vertical to the surface of the semiconductor substrate 101 does not receive the impact of ion collision, the density thereof does not increase. The plasma exposure may be carried out using a parallel plate plasma generator, for example, under the conditions that pressure of the N₂gas inside the chamber is in the range from about 10 Pa to about 1,000 Pa and power applied is in the range from about 200 W to about 2,000 W.

[0105] Then, as shown in FIG. 5, the surface of the TiN film 109 is exposed to silane (SiH₄) gas. This process is performed with the semiconductor substrate 101, which has already been exposed to the N₂plasma, heated within the vacuum chamber and with the SiH₄gas introduced into the vacuum chamber. In this case, the amount of the SiH₄gas introduced is adjusted at such a value that the partial pressure of the SiH₄gas inside the vacuum chamber becomes 3 Pa. As a result, the TiSiN films 110aand 110bare formed on the TiN films 109aand 109b, respectively. As will be described in detail later, the TiSiN film 110bbecomes thinner than the TiSiN film 110a.

[0106] Thereafter, as shown in FIG. 6, the Cu film (thickness: about 5 nm to about 200 nm) 111 is deposited on the surface of the TiSiN film 110 by a PVD process. However, the Cu film 111 is deposited only in the central region of the semiconductor substrate 101. After the Cu film 111 has been deposited, the surfaces of the TiSiN film 110band the Cu film 111 are cleaned with sulfuric acid (H₂SO₄). Then, the Cu film (thickness: about 100 nm to about 1,000 nm) 112 is deposited on the surface of the Cu film 111 by an electroplating technique. In this process step, the Cu film does not grow on the surface of the TiSiN film 110b. The reason thereof will be described in greater detail later.

[0107] Finally, respective portions of the Ti film 108, TiN film 109, TiSiN film 110band Cu films 111 and 112, which are deposited on the SiO₂film 105, are removed by a chemical/mechanical polishing (CMP) technique to complete the semiconductor device shown in FIG. 7. Thereafter, respective process steps for forming additional upper-level interconnect layers are performed if necessary.

[0108] Next, it will be described the reaction, through which the TiSiN film 110ais formed on the surface of the TiN film 109aas a result of the exposure to the SiH₄gas.

[0109] FIG. 8, FIGS. 9A and 9B and FIGS. 10A and 10B illustrate the results of analysis on this reaction by x-ray photoelectron spectroscopy (XPS). FIG. 8 illustrates the concentration of Si atoms in the TiN film 109aas a function of the depth measured from the surface thereof. As can be clearly understood from FIG. 8, if the TiN film 109ais exposed to the SiH₄gas, a large amount of Si is contained in the TiN film 109a. Since the concentration of the Si atoms changes continuously, it is difficult to define the thickness thereof. Supposing the portion of the TiN film 109awhere the concentration of Si is 5 atomic percent or more is called the “TiSiN film” for the sake of convenience, a TiSiN film 110awith a thickness of 10 nm is formed as a result of the exposure to the SiH₄gas.

[0110] FIGS. 9A and 9B illustrate the XPS spectra of Ti atoms (Ti2p) contained in the TiSiN film 110a, which has been formed as a result of the exposure to SiH₄, and in the TiN film 109a, which has not been exposed to SiH₄, respectively. FIGS. 10A and 10B illustrate the XPS spectra of Si atoms (Si2p) contained in the TiSiN film 110a, which has been formed as a result of the exposure to SiH₄, and in the TiN film 109a, which has not been exposed to SiH₄, respectively.

[0111] As can be clearly seen from FIG. 10A, the existence of Si—N bonds is recognized on the surface and inside of the TiSiN film 110a, which has been formed as a result of the exposure to SiH₄. In contrast, in the TiN film 109a, which has not been exposed to SiH₄, no Si—N bonds are observed as shown in FIG. 10B. Since the Si—N bonds are much less likely to react with Cu atoms than Ti—N bonds, the ability of the TiSiN film 110a, including the Si—N bonds, to prevent the diffusion of Cu atoms is much higher than that of the TiN film. As can also be seen from FIGS. 10A and 10B, the number of Ti—O bonds decrease as a result of the exposure to SiH₄.

[0112] A similar reaction is also caused on the surface of the TiN film 109b. The results of XPS analysis on this reaction are shown in FIG. 11, FIGS. 12A and 12B and FIGS. 13A and 13B. FIG. 11 illustrates the concentration of Si atoms in the TiN film 109b, which has been exposed to SiH₄, as a function of the depth measured from the surface thereof. As can be clearly understood from FIG. 11, if the TiN film 109bis exposed to SiH₄, a large amount of Si is contained in the TiN film 109b. However, unlike the case of the TiN film 109adescribed above, the concentration of Si atoms in the TiN film 109bdrastically decreases with the depth measured from the surface. In accordance with the definition described above, the thickness of the TiSiN film 110bformed through the exposure to SiH₄is 4 nm, which accounts for about 40% of the thickness of the TiSiN film 110a. This is because the density of the TiN film 109bincreases as a result of the exposure to the N₂plasma.

[0113] FIGS. 12A and 12B illustrate the XPS spectra of Ti atoms (Ti2p) contained in the TiSiN film 110b, which has been formed as a result of the exposure to SiH₄, and in the TiN film 109b, which has not been exposed to SiH₄, respectively. FIGS. 13A and 13B illustrate the XPS spectra of Si atoms (Si2p) contained in the TiSiN film 110b, which has been formed as a result of the exposure to SiH₄, and in the TiN film 109b, which has not been exposed to SiH₄, respectively.

[0114] As can be seen from FIG. 12B, Ti—O bonds are dominant on the surface of the TiN film 109bthat has not been exposed to SiH₄. This is because titanium dioxide (Tio₂) has been formed on the surface of the TiN film 109bas a result of a reaction with oxygen in the air. On the other hand, Si—N bonds are dominant on the surface of the TiSiN film 110bthat has been formed through the exposure to SiH₄as shown in FIG. 13A. The existence of Ti—N bonds is also recognized on the surface of the TiSiN film 110b.

[0115] Next, the reason why the Cu film does not grow on the surface of the TiSiN film 110bduring the electroplating will be described.

[0116] As shown in FIG. 12B, TiO₂has been formed on the surface of the TiN film 109bthat has not been exposed to SiH₄. However, this TiO₂is completely removed during H₂SO₄cleaning performed prior to the electroplating. Accordingly, during the electroplating, TiN comes into direct contact with the plating solution. Since TiN is a good electron conductor, TiN can easily donate ions to Cu ions contained in the plating solution. As a result, the Cu film abnormally grows on the surface of the TiN film 109b. On the other hand, on the surface of the TiSiN film 110b, which has been formed through the exposure to SiH₄, the Si—N bonds are dominant. The reactivity of Si—N bonds with H₂SO₄is extremely low, as is clear from the fact that Si₃N₄is insoluble in H₂SO₄. Thus, the TiSiN film 110bis not removed even when the film is cleaned with H₂SO₄. Also, since the Si—N bonds are so-called “covalent bonds”, the valence electrons forming the bonds are strongly bound to the inner nucleus, and therefore do not contribute to the reduction reaction of the Cu ions. That is to say, since no electrons are donated from the surface of the TiSiN film 110 to Cu ions contained in the plating solution, no Cu film abnormally grows on the TiSiN film 110b.

[0117] Next, the thickness of the TiN film 109 during the deposition thereof will be described. If the thickness of the TiN film 109 is 1 nm or less, a TiSiN film 110 with a sufficient thickness cannot be formed even if the TiN film 109 is exposed to SiH₄. As a result, the ability of the TiSiN film 110 to prevent the diffusion of Cu atoms declines and an increased amount of leakage current flows between the through holes 106 and between adjacent portions of the upper interconnect layer 113. On the other hand, if the TiN film 109 is thicker than 50 nm, then the percentage of the Cu films 111 and 112 accounting for the entire cross-sectional area of the upper interconnect layer 113 decreases. As a result, the line resistance of the upper interconnect layer 113 increases and the operating speed of the semiconductor device decreases. This is why the thickness of the TiN film 109 during the deposition thereof is preferably in the range from 1 nm to 50 nm, both inclusive.

[0118] Next, a preferable temperature range of the semiconductor substrate 101 during the formation of the TiSiN film 110 will be described. If the temperature of the semiconductor substrate 101 is lower than 300° C., then the reaction of the TiN film 109 with SiH₄, which results in the TiSiN film 110, proceeds at a lower rate. Accordingly, it takes a considerably longer time to form the TiSiN film 110. Nevertheless, if the temperature of the semiconductor substrate 101 is higher than 500° C., then the properties of the lower interconnect layer 102 and the SiO₂films 103 and 105 are likely to degrade. This is why the temperature of the semiconductor substrate 101 during the formation of the TiSiN film 110 is preferably in the range from 300° C. to 500° C., both inclusive.

[0119] Next, a preferable partial pressure range of SiH₄during the formation of the TiSiN film 110 will be described. If the partial pressure of SiH₄is lower than 1 Pa, then the reaction of the TiN film 109 with SiH₄, resulting in the TiSiN film 110, proceeds at a lower rate. Accordingly, it takes a considerably longer time to form the TiSiN film 110. This is why the partial pressure of SiH₄during the formation of the TiSiN film 110 is preferably 1 Pa or higher.

[0120] Next, an apparatus used for fabricating this semiconductor device will be described with reference to FIG. 14. This apparatus includes: a vacuum chamber 114; a susceptor 115 placed inside the vacuum chamber 114; an upper electrode 121 placed within the chamber 114 to face the susceptor 115; and a radio frequency power supply 122 connected to the susceptor 115 and upper electrode 121. A heating mechanism 116 is built in the susceptor 115. The vacuum chamber 114 includes exhaust port 117, TDMAT inlet port 118, N₂inlet port 119 and SiH₄inlet port 120.

[0121] This apparatus for fabricating a semiconductor device operates as follows.

[0122] First, the inside of the vacuum chamber 114 is opened to the air, and the semiconductor substrate 101, on which the Ti film 108 has already been deposited, is placed on the susceptor 115. Then, the vacuum chamber 114 is evacuated through the exhaust port 117. After the evacuation is over, the heating mechanism 116 is activated, thereby heating the semiconductor substrate 101 through the susceptor 115. The output of the heating mechanism 116 is adjusted at such a value that the steady temperature of the semiconductor substrate 101 becomes 350° C. When the temperature of the semiconductor substrate 101 reaches the steady temperature, a TDMAT gas diluted with He is introduced into the chamber 114 through the TDMAT inlet port 118. As a result, the TDMAT is thermally decomposed on the surface of the Ti film 108, whereby the TiN film 109 is deposited thereon. After a predetermined time has passed, the supply of TDMAT through the TDMAT inlet port 118 is stopped and N₂is introduced through the N₂inlet port 119 into the chamber 114 instead. When the partial pressure of N₂inside the vacuum chamber 114 is stabilized, power is supplied from the radio frequency power supply 122 to the susceptor 115 and upper electrode 121, thereby generating N₂plasma inside the vacuum chamber 114. As a result, the TiN film 109adeposited on a plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision and the density thereof increases. After a predetermined time has passed, the radio frequency power supply 122 is stopped and the supply of N₂through the N₂inlet port 119 is also stopped. Then, SiH₄is introduced through the SiH₄inlet port 120. As a result, the TiSiN film 110 is formed on the surface of the TiN film 109. Finally, the operation of the heating mechanism 116 is stopped, the vacuum chamber 114 is opened to the air and then the semiconductor substrate 101 is ejected.

[0123] Next, a second exemplary embodiment of the present invention will be described with reference to FIGS. 15, 16, 17, 18, 19 and 20. In FIGS. 15 through 20, the same components as those illustrated in FIGS. 1 through 7 are identified by the same reference numerals, and the detailed description thereof will be omitted herein.

[0124] As shown in FIG. 20, the semiconductor device of the second embodiment includes: a semiconductor substrate 101; a lower interconnect layer 102; and an SiO₂film 103. On the semiconductor substrate 101, integrated circuit devices such as transistors are formed although not shown in FIG. 20. The lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101. And the SiO₂film 103 is deposited on the semiconductor substrate 101 to cover the lower interconnect layer 102.

[0125] An Si₃N₄film 104 is deposited over the SiO₂film 103, and another SiO₂film 105 is deposited on the Si₃N₄film 104. An interlevel dielectric film is made up of the SiO₂film 103, Si₃N₄film 104 and SiO₂film 105. In the interlevel dielectric film, a through hole 106, reaching the lower interconnect layer 102, and an interconnection channel 107, communicating with the through hole 106, are formed. An upper interconnect layer 113, which is in electrical contact with the lower interconnect layer 102 via the through hole 106, is formed within the interconnection channel 107. The upper interconnect layer 113 includes: a Ti film 108 covering the inner side faces and bottom of the through hole 106 and interconnection channel 107; a TiSiN film 123 deposited on the Ti film 108; a Cu film 111 deposited on the TiSiN film 123; and another Cu film 112 deposited on the Cu film 111.

[0126] In this embodiment, the TiSiN film 123 will be regarded as including vertical portions 123aand horizontal portions 123bif necessary. The vertical portions 123aare formed on the inner sidewalls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 123bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101.

[0127] The structure of the second embodiment is different from that of the first embodiment in that no TiN film is interposed between the Ti film 108 and the TiSiN film 123 in this embodiment as shown in FIG. 19. The ability of the TiSiN film 123 to prevent the diffusion of Cu atoms is higher than that of the TiN film, as described above. Thus, in the structure of this embodiment, the leakage current flowing between the through holes 106 and between adjacent portions of the upper interconnect layer 113 can be further reduced than the first embodiment. Even if no TiN film is interposed between the Ti film 108 and TiSiN film 123 as in this embodiment, the concentration of Si in the TiSiN film 123ais preferably 5 atomic percent or more as already described in the first embodiment. The thickness of the TiSiN film 123ais preferably in the range from 1 nm to 50 nm, both inclusive. Also, the TiSiN film 123bis preferably thinner than the TiSiN film 123a.

[0128] Hereinafter, a method for fabricating this semiconductor device will be described with reference to the accompanying drawings.

[0129] First, as shown in FIG. 15, the lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101. Next, as shown in FIG. 16, the SiO₂film (thickness: about 100 nm to about 2,000 nm) 103, Si₃N₄film (thickness: about 5 nm to about 50 nm) 104 and SiO₂film (thickness: about 100 nm to about 1,000 nm) 105 are deposited in this order. Then, these films are alternately subjected to photolithography and dry etching twice, thereby forming the through hole 106 inside the SiO₂film 103 and Si₃N₄film 104 and the interconnection channel 107 inside the SiO₂film 105. Next, as shown in FIG. 17, the bottom of the through hole 106 is cleaned by dry etching. Then, the Ti film (thickness: about 0.5 nm to about 10 nm) 108 is deposited by a PVD process and the TiSiN film (thickness: about 1 nm to about 50 nm) 123 is deposited by a CVD process.

[0130] The TiSiN film 123 may be deposited by the CVD process in the following manner. The semiconductor substrate 101, on which the Ti film 108 has already been deposited, is heated up to 350° C. within a vacuum chamber. When the semiconductor substrate 101 reaches its steady temperature, TDMAT, diluted with He, and SiH₄are simultaneously introduced into the vacuum chamber. In this case, the amounts of TDMAT and SiH₄introduced are adjusted at such values that the partial pressures of TDMAT and SiH₄inside the vacuum chamber becomes 6 Pa and 1 Pa, respectively. The TDMAT introduced reacts with SiH₄on the surface of the Ti film 108, whereby the TiSiN film 123 is deposited thereon. In this embodiment, the thickness of the TiSiN film 123 deposited is 20 nm.

[0131] Subsequently, as shown in FIG. 18, the surface of the TiSiN film 123 is exposed to N₂plasma. In this case, the TiSiN film 123bdeposited on the plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision effectively. As a result, the density of the TiSiN film 123 increases. On the other hand, since the TiSiN film 123adeposited on the planes substantially vertical to the surface of the semiconductor substrate 101 hardly receives the impact of ion collision, the density thereof does not change. The effect of the N₂plasma exposure on the TiSiN films 123aand 123bwill be described in greater detail later.

[0132] Thereafter, as shown in FIG. 19, the Cu film (thickness: about 5 nm to about 200 nm) 111 is deposited by a PVD process on the surface of the TiSiN film 123. However, the Cu film 111 is deposited only in the central region of the semiconductor substrate 101. After the Cu film 111 has been deposited, the surfaces of the TiSiN film 123band the Cu film 111 are cleaned with H₂SO₄. Then, the Cu film (thickness: about 100 nm to about 1,000 nm) 112 is deposited thereon by an electroplating technique. In this process step, the Cu film does not grow on the surface of the TiSiN film 123b. Finally, respective portions of the Ti film 108, TiSiN film 123band Cu films 111 and 112, which are deposited on the SiO₂film 105, are removed by a CMP technique to complete the semiconductor device shown in FIG. 20.

[0133] FIG. 21 illustrates thicknesses of the TiSiN films 123aand 123b, which have been exposed to the N₂plasma. These thicknesses are measured with a transmission electron microscope (TEM). As is clear from FIG. 21, the TiSiN film 123bis thinner than the TiSiN film 123a. This is because the density of the TiSiN film 123bhas increased after the TiSiN film 123bhas received the impact of ion collision due to the exposure to the N₂plasma.

[0134] The results of an XPS analysis on the compositions and chemical structures of the TiSiN films 123aand 123bare illustrated in FIGS. 22A and 22B and FIGS. 23A and 23B. FIGS. 22A and 22B illustrate the XPS spectra of Ti atoms (Ti2p) contained in the TiSiN films 123aand 123b, respectively. FIGS. 23A and 23B illustrate the XPS spectra of Si atoms (Si2p) contained in the TiSiN films 123aand 123b, respectively. As can be clearly seen from FIGS. 23A and 23B, Si contained in the TiSiN films 123aand 123bis in the form of Si—N bonds. Thus, the TiSiN film 123acan effectively prevent the diffusion of Cu atoms. Also, since Si—N bonds are dominant on the surface of the TiSiN film 123b, no Cu film abnormally grows on the surface of the TiSiN film 123b.

[0135] FIG. 24 illustrates the concentrations of Si atoms in the TiSiN films 123aand 123bas a function of the depth measured from the surface thereof. As can be clearly understood from FIG. 24, a large amount of Si is contained on the surface and inside of both the TiSiN films 123aand 123b. The concentration of Si in the TiSiN film 123ais higher than that of Si in the TiSiN film 110ain the first embodiment. Thus, if a semiconductor device is fabricated by the method of this embodiment, the leakage current flowing between the through holes 106 and between adjacent portions of the upper interconnect layer 113 can be further reduced than the first embodiment.

[0136] Next, a preferable temperature range of the semiconductor substrate 101 during the deposition of the TiSiN film 123 will be described. If the temperature of the semiconductor substrate 101 is lower than 250° C., then the reaction of TDMAT with SiH₄proceeds at a lower rate. Accordingly, it takes a considerably longer time to deposit the TiSiN film 123. On the other hand, if the temperature of the semiconductor substrate 101 is higher than 450° C., then the thermal decomposition reaction of TDMAT enters a so-called “mass-transport limited regime”. As a result, the step coverage of the TiSiN film 123 decreases. This is why the temperature of the semiconductor substrate 101 during the deposition of the TiSiN film 123 is preferably in the range from 250° C. to 450° C., both inclusive.

[0137] Next, preferable partial pressure ranges of TDMAT and SiH₄during the formation of the TiSiN film 123 will be described. If the partial pressures of TDMAT and SiH₄are lower than 3 Pa and 0.5 Pa, respectively, then the reaction resulting in the TiSiN film 123 from TDMAT and SiH₄proceeds at a lower rate. As a result, it takes a considerably longer time to form the TiSiN film 123. This is why the partial pressures of TDMAT and SiH₄during the formation of the TiSiN film 123 are preferably 3 Pa or higher and 0.5 Pa or higher, respectively.

[0138] Next, the thickness of the TiSiN film 123 during the deposition thereof will be described. If the thickness of the TiSiN film 123 is 1 nm or less, a TiSiN film 123awith a sufficient thickness cannot be formed even if the Ti film 108 is exposed to the N₂plasma. As a result, the ability of the TiSiN film 123 to prevent the diffusion of Cu atoms declines and an increased amount of leakage current flows between the through holes 106 and between adjacent portions of the upper interconnect layer 113. On the other hand, if the TiSiN film 123 is thicker than 50 nm, then the percentage of the Cu films 111 and 112 accounting for the entire cross-sectional area of the upper interconnect layer 113 decreases. As a result, the line resistance of the upper interconnect layer 113 increases and the operating speed of the semiconductor device decreases. This is why the thickness of the TiSiN film 123 during the deposition thereof is preferably in the range from 1 nm to 50 nm, both inclusive.

[0139] The semiconductor device of this embodiment can be fabricated by operating the fabricating apparatus shown in FIG. 14 in the following manner. First, the inside of the vacuum chamber 114 is opened to the air, and the semiconductor substrate 101, on which the Ti film 108 has already been deposited, is placed on the susceptor 115. Then, the vacuum chamber 114 is evacuated through the exhaust port 117. After the evacuation is over, the heating mechanism 116 is activated, thereby heating the semiconductor substrate 101 through the susceptor 115. The output of the heating mechanism 116 is adjusted at such a value that the steady temperature of the semiconductor substrate 101 becomes 350° C. When the temperature of the semiconductor substrate 101 reaches the steady temperature, TDMAT, diluted with He, and SiH₄are introduced into the chamber 114 through the TDMAT inlet port 118 and the SiH₄inlet port 120, respectively. As a result, the TDMAT reacts with SiH₄on the surface of the Ti film 108, whereby the TiSiN film 123 is deposited thereon. After a predetermined time has passed, the supply of TDMAT and SiH₄is stopped, and N₂is introduced through the N₂inlet port 119 into the chamber 114 instead. When the partial pressure of N₂inside the vacuum chamber 114 is stabilized, power is supplied from the radio frequency power supply 122 to the susceptor 115 and upper electrode 121, thereby generating N₂plasma inside the vacuum chamber 114. As a result, the TiSiN film 123adeposited on a plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision and the density thereof increases. After a predetermined time has passed, the radio frequency power supply 122 is stopped and the supply of N₂through the N₂inlet port 119 is also stopped. Finally, the operation of the heating mechanism 116 is stopped, the vacuum chamber 114 is opened to the air and the semiconductor substrate 101 is ejected.

[0140] Next, a third exemplary embodiment of the present invention will be described with reference to FIGS. 31, 32, 33, 34, 35, 36 and 37. In FIGS. 31 through 37, the same components as those illustrated in FIGS. 1 through 7 are identified by the same reference numerals, and the detailed description thereof will be omitted herein.

[0141] As shown in FIG. 37, the semiconductor device of the third embodiment includes: a semiconductor substrate 101; a lower interconnect layer 102; and an SiO₂film 103. On the semiconductor substrate 101, integrated circuit devices such as transistors are formed although not shown in FIG. 37. The lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101. And the SiO₂film 103 is deposited on the semiconductor substrate 101 to cover the lower interconnect layer 102.

[0142] An Si₃N₄film 104 is deposited over the SiO₂film 103, and another SiO₂film 105 is deposited on the Si₃N₄film 104. An interlevel dielectric film is made up of the SiO₂film 103, Si₃N₄film 104 and SiO₂film 105. In the interlevel dielectric film, a through hole 106, reaching the lower interconnect layer 102, and an interconnection channel 107, communicating with the through hole 106, are formed. An upper interconnect layer 113, which is in electrical contact with the lower interconnect layer 102 via the through hole 106, is formed within the interconnection channel 107.

[0143] The upper interconnect layer 113 includes: a Ti film 108 covering the inner side faces and bottom of the through hole 106 and interconnection channel 107; a TiN film 109 deposited on the Ti film 108; a TiSiN film 110 deposited on the TiN film 109; a Cu film 111 deposited over the TiSiN film 110; and another Cu film 112 deposited on the Cu film 111. And a copper silicide (Cu₃Si) film 125 is further formed in the interface between the TiSiN film 110 and Cu film 111.

[0144] In this embodiment, the TiN film 109 will be regarded as including vertical portions 109aand horizontal portions 109bif necessary. The vertical portions 109aare formed on the inner sidewalls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 109bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101. In the same way, the TiSiN film 110 will also be regarded as including vertical portions 110aand horizontal portions 110bif necessary. The vertical portions 110aare formed on the inner sidewalls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 110bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101.

[0145] In such a structure, the leakage current flowing between the through holes 106 and between adjacent portions of the upper interconnect layer 113 can be reduced as compared with the prior art. In addition, the resistance of the through hole 106 and upper interconnect layer 113 against electromigration can be improved. This is because the Cu₃Si film 125 formed in the interface between the TiSiN film 110 and Cu film 111 can improve the adhesion between the TiSiN film 110 and Cu film 111, and therefore Cu atoms are less likely to move.

[0146] Hereinafter, a method for fabricating this semiconductor device will be described with reference to the accompanying drawings.

[0147] First, as shown in FIG. 31, the lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101. Next, as shown in FIG. 32, the SiO₂film (thickness: about 100 nm to about 2,000 nm) 103, Si₃N₄film (thickness: about 5 nm to about 50 nm) 104 and SiO₂film (thickness: about 100 nm to about 1,000 nm) 105 are deposited in this order. Then, these films are alternately subjected to photolithography and dry etching twice, thereby forming the through hole 106 inside the SiO₂film 103 and Si₃N₄film 104 and the interconnection channel 107 inside the SiO₂film 105. Next, as shown in FIG. 33, the bottom of the through hole 106 is cleaned by dry etching. Then, the Ti film (thickness: about 0.5 nm to about 10 nm) 108 is deposited by a PVD process and the TiN film 109 is deposited by a CVD process. Subsequently, as shown in FIG. 34, the surface of the TiN film 109 is exposed to N₂plasma. In this case, the TiN film 109bdeposited on the plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision effectively. As a result, the density of the TiN film 109bincreases. On the other hand, since the TiN film 109adeposited on the planes substantially vertical to the surface of the semiconductor substrate 101 hardly receives the impact of ion collision, the density thereof does not change.

[0148] Then, as shown in FIG. 35, the surface of the TiN film 109 is exposed to SiH₄gas. In this process step, if the semiconductor substrate 101 is heated up to 300° C. or more and the surface of the TiN film 109 is exposed to the SiH₄gas for 15 seconds or more, then the TiSiN films 110aand 110bare formed on the respective surfaces of the TiN films 109aand 109b. Also, at this point in time, an Si film (thickness: about 1 to about 10 nm) 124 is grown on the surface of the TiSiN film 110.

[0149] Thereafter, the Cu film (thickness: about 5 nm to about 200 nm) 111 is deposited on the surface of the Si film 124 by a PVD process. However, the Cu film 111 is deposited only in the central region of the semiconductor substrate 101. The Si film 124 and the Cu film 111 immediately react with each other to form the Cu₃Si film 125 as shown in FIG. 36. After the surfaces of the Cu film 111 and Cu₃Si film 125 have been cleaned with H₂SO₄, the Cu film (thickness: about 100 nm to about 1,000 nm) 112 is deposited by an electroplating technique. In this process step, the Cu film 112 does not grow on the exposed surface region of the Si film 124. This is because a highly insulating SiO₂film has been formed on the exposed surface of the Si film 124 during the transportation in the air and no ions are reduced in that part.

[0150] Finally, respective portions of the Ti film 108, TiN film 109, TiSiN film 110, Cu₃Si film 125 and Cu films 111 and 112, which are deposited on the SiO₂film 105, are removed by a CMP technique to complete the semiconductor device shown in FIG. 37.

[0151] In this embodiment, the Si film 124 and Cu film 111 are preferably deposited continuously within vacuum. This is because if the Si film 124 is exposed to the air before the Cu film 111 is deposited, then an SiO₂film is unintentionally formed on the surface of the Si film 124 to interfere with the reaction between the Si film 124 and Cu film 111. Such a continuous film deposition is realized using an apparatus for fabricating a semiconductor device with such an arrangement as that shown in FIG. 38. The apparatus shown in FIG. 38 includes: a chemical vapor deposition (CVD) chamber 126 with the construction shown in FIG. 14, for example; and a copper deposition chamber 127 connected to the CVD chamber 126. And these chambers 126 and 127 are linked together via a reduced pressure transport chamber 128.

[0152] Next, a fourth exemplary embodiment of the present invention will be described with reference to FIGS. 40, 41, 42, 43, 44 and 45. In FIGS. 40 through 45, the same components as those illustrated in FIGS. 1 through 7 are identified by the same reference numerals, and the detailed description thereof will be omitted herein.

[0153] As shown in FIG. 45, the semiconductor device of the fourth embodiment includes: a semiconductor substrate 101; a lower interconnect layer 102; and an SiO₂film 103. On the semiconductor substrate 101, integrated circuit devices such as transistors are formed although not shown in FIG. 45. The lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101. And the SiO₂film 103 is deposited on the semiconductor substrate 101 to cover the lower interconnect layer 102.

[0154] An Si₃N₄film 104 is deposited over the SiO₂film 103, and another SiO₂film 105 is deposited on the Si₃N₄film 104. An interlevel dielectric film is made up of the SiO₂film 103, Si₃N₄film 104 and SiO₂film 105. In the interlevel dielectric film, an opening is formed. The opening includes: a through hole 106 reaching the lower interconnect layer 102; and an interconnection channel 107 communicating with the through hole 106. An upper interconnect layer 113, which is in electrical contact with the lower interconnect layer 102 via the through hole 106, is formed within the interconnection channel 107.

[0155] The upper interconnect layer 113 includes: a Ti film 108 covering the inner sidewalls and bottom of the through hole 106 and interconnection channel 107; a tantalum nitride (TaN) film 130 formed on surface of the Ti film 108; a Cu film 111 deposited on the TaN film 130; and another Cu film 112 deposited on the Cu film 111.

[0156] In this embodiment, the TaN film 130 will be regarded as including vertical portions 130aand horizontal portions 130bif necessary. The vertical portions 130aare formed on the inner sidewalls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 130bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101. The concentration of carbon in the horizontal portions 130bof the TaN film 130 is lower than that in the vertical portions 130athereof.

[0157] In this structure, the connection resistance between the lower and upper interconnect layers 102 and 113 can be lower than that of a conventional structure. The reason is as follows.

[0158] The connection resistance between the lower and upper interconnect layers 102 and 113 is essentially determined depending on the resistivity of the TaN film 130 deposited over the bottom of the through hole 106. In this embodiment, the horizontal portion 130bof the TaN film 130 exists over the bottom of the through hole 106, while the vertical portions 130aof the TaN film 130 exist over the sidewall of the through hole 106. And the concentration of C in the horizontal portion 130bis lower than that of C in the vertical portions 130a. The lower the concentration of C in a TaN film, the lower the resistivity of the TaN film. Accordingly, by lowering the concentration of C in the horizontal portion 130bof the TaN film 130, the connection resistance between the lower and upper interconnect layers 102 and 113 can be reduced as compared with the prior art.

[0159] Hereinafter, a method for fabricating this semiconductor device will be described with reference to the accompanying drawings.

[0160] First, as shown in FIG. 40, the lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101.

[0161] Next, as shown in FIG. 41, the SiO₂film (thickness: about 100 nm to about 2,000 nm) 103, Si₃N₄film (thickness: about 5 nm to about 50 nm) 104 and SiO₂film (thickness: about 100 nm to about 1,000 nm) 105 are deposited in this order. Then, these films are alternately subjected to photolithography and dry etching twice, thereby forming the through hole 106 inside the SiO₂film 103 and Si₃N₄film 104 and the interconnection channel 107 inside the SiO₂film 105.

[0162] Next, as shown in FIG. 42, the bottom of the through hole 106 is cleaned by dry etching. Thereafter, the Ti film (thickness: about 0.5 nm to about 10 nm) 108 is deposited by a PVD process and then the TaN film 130 is deposited to be about 20 nm thick by a CVD process. The CVD deposition of the TaN film 130 may be performed in the following manner. The semiconductor substrate 101, on which the Ti film 108 has already been deposited, is heated up to 400° C. within a vacuum chamber. At a point in time the semiconductor substrate 101 reaches its steady temperature, pentakisdimethylamide tantalum (Ta(NMe₂)₅) is introduced into the vacuum chamber, along with ammonium (NH₃). The Ta(NMe₂)₅and NH₃introduced react with each other on the surface of the Ti film 108, whereby the TaN film 130 is deposited thereon.

[0163] Subsequently, as shown in FIG. 43, the surface of the TaN film 130 is exposed to plasma generated within ammonium (NH₃). In this plasma, positive ions such as NH₂ions are contained. The plasma is generated under the conditions controlled to vertically accelerate these positive ions toward the semiconductor substrate 101. Accordingly, the TaN film 130bdeposited on the plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision. As a result, the density of the TaN film 130bincreases, and C contained in the TaN film 130bdissociates itself into the vapor. On the other hand, since the vertical portion 130aof the TaN film 130 deposited on the planes substantially vertical to the surface of the semiconductor substrate 101 do not receive the impact of ion collision, the density thereof does not increase. As a result, the TaN film 130bbecomes thinner than the TaN film 130a, and the concentration of C in the TaN film 130bbecomes lower than that in the TaN film 130a. The plasma exposure may be carried out using a parallel plate plasma generator, for example, under the conditions that in-chamber pressure of the NH₃gas is in the range from about 10 Pa to about 1,000 Pa and power applied is from about 200 w to about 2,000 W.

[0164] Thereafter, as shown in FIG. 44, the Cu film 111 is deposited by a PVD process on the surface of the TaN film 130. Then, the surface of the Cu film 111 is cleaned with H₂SO₄, and the Cu film 112 is deposited on the surface of the Cu film 111 by an electroplating technique.

[0165] Finally, respective portions of the Ti film 108, TaN film 130 and Cu films 111 and 112, which are deposited on the SiO₂film 105, are removed by a CMP technique to complete the semiconductor device shown in FIG. 45.

[0166] Next, a fifth exemplary embodiment of the present invention will be described with reference to FIGS. 46, 47, 48, 49, 50, 51 and 52. In FIGS. 46 through 52, the same components as those illustrated in FIGS. 40 through 45 are identified by the same reference numerals, and the detailed description thereof will be omitted herein.

[0167] As shown in FIG. 52, the semiconductor device of the fifth embodiment includes: a semiconductor substrate 101; a lower interconnect layer 102; and an SiO₂film 103. On the semiconductor substrate 101, integrated circuit devices such as transistors are formed although not shown in FIG. 52. The lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101. And the SiO₂film 103 is deposited on the semiconductor substrate 101 to cover the lower interconnect layer 102.

[0168] An Si₃N₄film 104 is deposited over the SiO₂film 103, and another SiO₂film 105 is deposited on the Si₃N₄film 104. An interlevel dielectric film is made up of the SiO₂film 103, Si₃N₄film 104 and SiO₂film 105. In the interlevel dielectric film, an opening is formed. The opening includes a through hole 106 reaching the lower interconnect layer 102, and an interconnection channel 107 communicating with the through hole 106. An upper interconnect layer 113, which is in electrical contact with the lower interconnect layer 102 via the through hole 106, is formed within the interconnection channel 107.

[0169] The upper interconnect layer 113 includes: a Ti film 108 covering the inner sidewalls and bottom of the through hole 106 and interconnection channel 107; a TaN film 130 deposited on the surface of the Ti film 108; a tantalum nitride silicide (TaSiN) film 131 formed on the TaN film 130; a Cu film 111 formed on the TaSiN film 131; and another Cu film 112 deposited on the Cu film 111.

[0170] In this embodiment, the TaN film 130 will be regarded as including vertical portions 130aand horizontal portions 130bif necessary. The vertical portions 130aare formed on the inner sidewalls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 130bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101. Similarly, the TaSiN film 131 will also be regarded as including vertical portions 131aand horizontal portions 131bif necessary. The vertical portions 131aare formed on the inner sidewalls of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially vertical to the surface of the semiconductor substrate 101. On the other hand, the horizontal portions 131bare formed on the bottoms of the through hole 106 and interconnection channel 107, i.e., on respective planes substantially parallel to the surface of the semiconductor substrate 101.

[0171] The structure of the semiconductor device of the fifth embodiment is different from that of the semiconductor device of the fourth embodiment in that the TaSiN film 131 is additionally formed on the surface of the TaN film 130 as shown in FIG. 52. The ability of the TaSiN film 131 to prevent the diffusion of Cu atoms is higher than that of the TaN film 130. Accordingly, by adopting the structure of the fifth embodiment, the leakage current flowing between the through holes 106 and between adjacent portions of the upper interconnect layer 113 can be further reduced than the fourth embodiment.

[0172] Next, the thickness of the TaSiN film 131bwill be described. The resistivity of the TaSiN film 131bis higher than that of the TaN film 130bthat has been exposed to NH₃plasma. Thus, if the TaSiN film 131bis too thick, then the connection resistance between the lower and upper interconnect layers 102 and 113 increases, thus decreasing the operating speed of the semiconductor device. This is why the TaSiN film 131bis preferably thinner than the TaSiN film 131a.

[0173] Hereinafter, a method for fabricating this semiconductor device will be described with reference to the accompanying drawings.

[0174] First, as shown in FIG. 46, the lower interconnect layer 102 is formed on the surface of the semiconductor substrate 101.

[0175] Next, as shown in FIG. 47, the SiO₂film (thickness: about 100 nm to about 2,000 nm) 103, Si₃N₄film (thickness: about 5 nm to about 50 nm) 104 and SiO₂film (thickness: about 100 nm to about 1,000 nm) 105 are deposited in this order. Then, these films are alternately subjected to photolithography and dry etching twice, thereby forming the through hole 106 inside the SiO₂film 103 and Si₃N₄film 104 and the interconnection channel 107 inside the SiO₂film 105.

[0176] Next, as shown in FIG. 48, the bottom of the through hole 106 is cleaned by dry etching. Thereafter, the Ti film 108 is deposited by a PVD process and then the TaN film 130 (thickness: about 1 nm to about 50 nm) is deposited by a CVD process.

[0177] Subsequently, as shown in FIG. 49, the surface of the TaN film 130 is exposed to NH₂plasma. As a result, the TaN film 130bdeposited on the plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision. Accordingly, the density of the TaN film 130bincreases, and C contained in the TaN film 130bdissociates itself into the vapor. On the other hand, since the vertical portions 130aof the TaN film 130 deposited on the planes substantially vertical to the surface of the semiconductor substrate 101 do not receive the impact of ion collision, the density thereof does not increase. As a result, the TaN film 130bbecomes thinner than the TaN film 130a, and the concentration of carbon in the TaN film 130bbecomes lower than that in the TaN film 130a.

[0178] Next, as shown in FIG. 50, the surface of the TaN film 130 is exposed to disilane (Si₂H₆). This process is performed with the semiconductor substrate 101, which has already been exposed to the NH₃plasma, heated up to 400° C. within the vacuum chamber and with Si₂H₆introduced into the vacuum chamber. As a result, the TaSiN films 131aand 131bare formed on the TaN films 130aand 130b, respectively. The TaSiN film 131bbecomes thinner than the TaSiN film 131a. This is because Si₂H₆is less likely to diffuse into the TaN film 130bthat has its density increased through the exposure to the NH₃plasma.

[0179] Thereafter, as shown in FIG. 51, the Cu film (thickness: about 5 to about 200 nm) 111 is deposited by a PVD process on the surface of the TaSiN film 131. Then, the surface of the Cu film 111 is cleaned with H₂SO₄, and the Cu film 112 is deposited on the surface of the Cu film 111 by an electroplating technique.

[0180] Finally, respective portions of the Ti film 108, TaN film 130, TaSiN film 131 and Cu films 111 and 112, which are deposited on the SiO₂film 105, are removed by a CMP technique to complete the semiconductor device shown in FIG. 52.

[0181] The semiconductor device of the fifth embodiment may be fabricated by using the apparatus shown in FIG. 14. In this embodiment, however, Ta(NMe₂)₅, NH₃and Si₂H₆gases are introduced through the inlet ports 118, 119 and 120 of the vacuum chamber 114.

[0182] This apparatus for fabricating a semiconductor device operates as follows. First, the inside of the vacuum chamber 114 is opened to the air, and the semiconductor substrate 101, on which the Ti film 108 has already been deposited, is placed on the susceptor 115. Then, the vacuum chamber 114 is evacuated through the exhaust port 117. After the evacuation is over, the heating mechanism 116 is activated, thereby heating the semiconductor substrate 101 through the susceptor 115. The output of the heating mechanism 116 is adjusted at such a value that the steady temperature of the semiconductor substrate 101 becomes 400° C. When the temperature of the semiconductor substrate 101 reaches its steady temperature, Ta(NMe₂)₅and NH₃gases are introduced through the inlet ports 118 and 119, respectively. As a result, Ta(NMe₂)₅reacts with NH₃on the surface of the Ti film 108 to deposit the TaN film 130 thereon. After a predetermined time has passed, the supply of Ta(NMe₂)₅is stopped. When the partial pressure of Ta(NMe₂)₅residual inside the vacuum chamber 114 reaches a sufficiently small value, power is applied from the radio frequency power supply 122 to the susceptor 115 and the upper electrode 121, thereby generating NH₃plasma inside the vacuum chamber 114. As a result, the TaN film 130bdeposited on a plane parallel to the surface of the semiconductor substrate 101 receives the impact of ion collision and the density thereof increases. After a predetermined time has passed, the radio frequency power supply 122 is stopped and the supply of NH₃is suspended. Then, Si₂H₆is introduced through the inlet port 120. As a result, the TaSiN film 131 is formed on the surface of the TaN film 130. Finally, the operation of the heating mechanism 116 is stopped, the vacuum chamber 114 is opened to the air and then the semiconductor substrate 101 is ejected.

[0183] The present invention has been described by way of five illustrative embodiments. However, the present invention is in no way limited to these embodiments.

[0184] For example, in the foregoing embodiments, a so-called “dual damascene” process, in which both the through hole 106 and interconnection channel 107 are formed continuously and then filled in with a metal such as the Cu film 112, is employed. Alternatively, a “single damascene” process, in which either the through hole 106 or interconnection channel 107 is formed and then filled in with a metal such as the Cu film 112, may also be employed.

[0185] Also, in the foregoing embodiments, SiO₂and Si₃N₄are used as materials for insulating upper and lower interconnect layers from each other. If necessary, any other appropriate materials may be used instead. Examples of such materials include SiO₂containing an impurity such as fluorine (F), and an organic compound with insulating properties.

[0186] Moreover, in the foregoing embodiments, the Ti film 108 is deposited on the surface of the SiO₂film 105 and inside the through hole 106. However, depending on the type of a conductor material for the lower interconnect layer 102, the Ti film 108 need not be deposited.

[0187] Nevertheless, if the through hole 106 and interconnection channel 107 are filled in with copper, the Ti film 108 is preferably deposited. This is because the Ti film 108 can contribute to aligning the crystallographic orientations of the copper filled, thus increasing the resistance against electromigration. In this case, the Ti film 108 and the TiN film 109, TiSiN film 123 or TaN film 130 are preferably deposited continuously within vacuum. Such a continuous film deposition is realized using an apparatus for fabricating a semiconductor device such as that shown in FIG. 39. The apparatus shown in FIG. 39 includes a titanium deposition chamber 129 connected to the CVD chamber 126. And these chambers 126 and 129 are linked together via a reduced pressure transport chamber 128. Alternatively, the CVD chamber 126 may be linked together with both the copper and titanium deposition chambers 127, 129 via the reduced pressure transport chamber 128 although not shown in FIG. 39.

[0188] Furthermore, in the second embodiment, TDMAT is used as a source material for the TiN film 109 and TiSiN film 123. Alternatively, any other titanium-containing organic compound may also be used. Examples of such compounds include tetrakisdiethyl titanium (TDEAT) and tetrakisethylmethyl titanium (TEMAT).

[0189] In the fourth and fifth embodiments, tantalum nitride is used as a metal for preventing the diffusion of Cu atoms. Optionally, any other metal nitride may be used. Examples of such metal nitrides include tungsten nitride (WN) and molybdenum nitride (MoN). WN may be synthesized by using, instead of Ta(NMe₂)₅, an amino complex or imide complex of tungsten as a source material. One example of such complexes is bis(tertiarybutylimide)-bis(tertiarybutylamide) tungsten. MoN may be synthesized by using, instead of Ta(NMe₂)₅, an amino complex or imide complex of molybdenum as a source material. One example of such complexes is bis(dimethylamide)-bis(tertiarybutylimide) molybdenum.

[0190] In the second embodiment, the TiN film 109 and the TiSiN film 123 are exposed to plasma generated within N₂. Alternatively, any other nitrogen compound may also be used. Examples of such gases include ammonium (NH₃) and hydrazine (N₂H₄).

[0191] In the fourth and fifth embodiments, the TaN film 130 is exposed to plasma generated within NH₃. Alternatively, any other nitrogen compound may also be used. Examples of such gases include nitrogen (N₂) and hydrazine (N₂H₄).

[0192] In the first and second embodiments, SiH₄is used for depositing the TiSiN films 110 and 123. Alternatively, any other appropriate silicide may be used instead. Examples of such compounds include disilane (Si₂H₆) and trisilane (Si₃H₈).

[0193] In the fourth and fifth embodiments, Si₂H₆is used for forming the TaSiN film 131. Alternatively, any other appropriate silicide may be used instead. Examples of such compounds include silane (SiH₄) and trisilane (Si₃H₈).

[0194] Although the Cu film 111 is deposited by a physical vapor deposition process, the Cu film 111 may be deposited by a chemical vapor deposition process, for example.

[0195] In the foregoing embodiments, the Cu film 112 is deposited by an electroplating technique. However, any other deposition technique may be used, so long as the through hole 106 and interconnection channel 107 can be filled in. One example of such deposition techniques is an electroless plating technique.

[0196] Furthermore, in the foregoing embodiments, a thin film is exposed to a plasma to bombard the thin film with ions. Alternatively, any other technique, like ion implantation, may also be used.

[0197] While the present invention has been described in a preferred embodiment, it will be apparent to those skilled in the art that the disclosed invention may be modified in numerous ways and may assume many embodiments other than that specifically set out and described above. Accordingly, it is intended by the appended claims to cover all modifications of the invention which fall within the true spirit and scope of the invention.