Heat sink for cooling an electronic component of a computer

[0002] 1. Field of the Invention

[0003] This invention relates to a heat sink for an electronic component of a computer and to a computer assembly having such a heat sink.

[0004] 2. Discussion of Related Art

[0005] Electronic components of computers such as processors and chipsets generate heat when being operated. To maintain functional integrity of such electronic components, it is required to maintain the temperature of these components below a predetermined maximum.

[0006] A heat sink is used for cooling such components. A heat sink has a thermal spreader which is attached or otherwise thermally connected to such an electronic component. The heat sink also has a plurality of fins extending from the thermal spreader. Heat is conducted to the thermal spreader and from the thermal spreader to the fins which provide a large surface area from which the heat can be convected to surrounding air.

[0007] Such heat sinks are usually fairly heavy and are manufactured according to fairly expensive and cumbersome extrusion processes.

[0008] The invention is described by way of example with reference to the accompanying drawings wherein:

[0009] FIG. 1 is a perspective view of a metal sheet used for constructing a heat sink according to an embodiment of the invention;

[0010] FIG. 2 is a view similar to FIG. 1 after one wall is bent out of a horizontal plane into a vertical plane;

[0011] FIG. 3 is a perspective view of a heat sink which is constructed by bending other ones of walls of the metal sheet into vertical planes;

[0012] FIG. 4 is a partially cross-sectioned perspective view of components of a computer assembly including the heat sink to illustrate flow of heat through the heat sink; and

[0013] FIG. 5 is a cross-sectional side view of components of the heat sink to illustrate transfer of heat from the heat sink to air flowing through the heat sink.

[0014] FIG. 1 of the accompanying drawings illustrates a relatively light thermally conductive metal sheet 10, of a material such as aluminum or copper, which is used for constructing a heat sink according to an embodiment of the invention. The sheet 10 is shown in a horizontal orientation. The sheet 10 is stamped so as to have a central heat plate 12, and first to fourth walls 14A-D. The plate 12 is square and has four straight edges and each wall 14A-D is attached to a respective edge of the plate 12. The plate 12 is typically less than 10,000 mm². A plurality of openings 16 are stamped in the walls 14A-D. The openings 16 are in rows and columns in a respective wall 14A-D.

[0015] FIG. 2 illustrates the metal sheet 10 after the wall 18A is bent up along a bend line 18 of a periphery of the plate 12. The wall 14A thereby extends vertically upwardly from an edge of the plate 12. The openings 16 are located over the entire wall 14A, i.e. in a lower half and in an upper half, from left to right and some of the openings are located directly above one another.

[0016] FIG. 3 illustrates a heat sink 22 which is manufactured by folding all of the walls 14B-D in a manner similar to the wall 14A. Each one of the walls, for example the wall 14B, has a respective edge contacting a respective edge of another wall, for example the wall 14D. The walls 14B and 14D are unattached to one another. The walls 14A and 14B are located between the walls 14C and 14D. All the walls 14A-D are thermally and structurally secured to the plate 12 and extend upwardly from the plate 12. The walls 14A-D form a wall structure which, when viewed from above in a direction 24, defines a square enclosure 25. The wall structure entirely surrounds the enclosure 25. The wall structure defined by the walls 14A-D has lower and upper ends 26 and 28. An entire periphery of the lower end 26 is thermally and structurally secured to the plate 12. The only communication into or out of the enclosure 25 is through the openings 16 and a month at the upper end 28.

[0017] FIG. 4 illustrates in cross-sectional view a portion of a computer assembly 30 including respective portions of a circuit board 32, an electronic component 34, and the heat sink 22. The portions of the heat sink 22 that are shown are a portion of the plate 12 and the wall 14A.

[0018] The electronic component 34 is typically a low-power electronic component such as a chipset which generates less than 10 and 20 W of heat when operated. The electronic component 34 is mounted to the board 32 and has an upper surface 36 located in a horizontal plane. A lower surface 48 of the heat plate 12 is located on top of the upper surface 36. The plate 12 is mounted in such a horizontal position utilizing an epoxy, spring clips or the like.

[0019] In use, heat generated by the electronic component 34 conducts from the electronic component 34 upwardly through the lower surface 38 into the heat plate 12. An upper surface 40 of the heat plate 12 is thereby heated.

[0020] The heat spreads in directions 42A-C horizontally to the walls 14A-D. The heat then conducts up the walls 14A-D. For example, the heat conducts first in the horizontal direction 42A in the heat plate 12 and then upwardly in directions 44 through lands between the openings 16 to an upper portion 46 of the wall 14A. The heat conducts in a similar manner through other ones of the walls 14B-D. The upper portion 46 of each wall 14A-D is thus heated.

[0021] FIG. 5 illustrates a portion of the plates 12 and the wall 14A. Heat is convected in a direction 50 from the upper surface 40 of the plate 12 to air above the upper surface 40. The air rises, thereby creating a vacuum in an area slightly above the surface 40 because it is entirely surrounded by the walls 14A-D. Because of the vacuum, air is drawn in from externally of the heat sink through lower ones of the openings 16 in the wall 14A. Heat is also convected in a direction 52 from the upper portion 46 to air located next to the upper portion 36. A natural convection path is thereby created wherein air is drawn in a horizontal direction 54 through lower ones of the openings 16 into the enclosure 25, and then flows upwardly over an inner surface 56 of the upper portion 46, where the heat is transferred thereto to continue flow of air. Air flows in a similar manner through and over the other ones of the walls 14B-D. All the air then exits through the mouth at the upper end 28 out of the enclosure 25.

[0022] It has been found that the heat sink 22 provides efficient cooling of low-power electronic components such as chipsets that generate between 10 and 20 W. No fan is required because the heat sink 22 can relatively efficiently remove heat utilizing natural convection. For enhanced thermal displation, a fan may be provided which may be located in or on the mouth at upper end 28.

[0023] It can thus be seen that a lightweight heat sink 22 is provided which is relatively inexpensive to manufacture, while still providing adequate transfer of heat.

[0024] The computer assembly further includes a housing and other components. The other components may include cards, electronic connections, disk drives, buses etc., all of which are mounted within the enclosure together with the components shown in FIGS. 1 to 4. The computer assembly may be a desktop computer having a housing defining an internal volume of between 10,000 and 20,000 cm², or be a larger server computer.

[0025] While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive of the current invention, and that this invention is not restricted to the specific constructions and arrangements shown and described since modifications may occur to those ordinarily skilled in the art.