Package retention module coupled directly to a socket

[0002] 1. Field of the Invention

[0003] The present invention generally relates to a retention module for retaining a heat sink to a package assembly. More particularly, the present invention relates to a package assembly retention module that is coupled directly to a socket.

[0004] 2. Discussion of the Related Art

[0005] A heat sink is usually placed in contact with an electronic device, such as a Central Processing Unit (CPU), for removing heat therefrom. For higher-power devices, an integrated heat spreader (IHS) lid is generally placed between the heat sink and the electronic device to facilitate cooling the device. The electronic device is often mounted on a socket that couples to the motherboard. Various retention modules have been used for maintaining intimate contact between the heat sink and the IHS lid, or the bare package.

[0006] As shown in FIG. 5, a typical retention module is attached to the motherboard 150, often by passing the retention module through a motherboard hole 520 that is drilled into the motherboard 150 outside the perimeter of the socket 130 that couples to the motherboard 150. Drilling motherboard holes 520 takes up valuable space on the motherboard 150, approximately 25-50% more area than the socket 130 alone, thereby increasing the price of the motherboard 150. Furthermore, the area occupied by the motherboard holes 520 is close to a package 230, a space highly desirable to design engineers to place capacitors, voltage regulators, and other electrical components to optimize performance of the package 230. Holes are generally drilled into the heat sink 210 as well, so that the retention module may also pass through the heat sink 210. The heat sink 210 must extend outside the perimeter of the socket 130 that couples to the motherboard 150 to provide sufficient space for the retention module 100 to pass through. Fasteners 530, such as clamps, screws, or nuts, are then coupled to the ends of the retention module to ensure a secure contact between the heat sink 210 and the IHS lid 220 or the package 230. A tool is required to apply the fasteners 530, which makes the assembly procedure more complicated.

[0007] Furthermore, having separate retention modules may give rise to inventory issues and increase both the cost of the package system and the number of piece parts. Although typical retention modules may be required to support the large heat sinks generally required in servers, the use of such retention modules may often be unnecessary and add cost in lower-power systems.

[0008] Thus, a retention module that requires neither additional motherboard space nor modifications to the motherboard is required.

[0009] FIG. 1 illustrates a retention module according to an embodiment of the present invention,

[0010] FIG. 2 illustrates a package system according to another embodiment of the present invention;

[0011] FIG. 3 illustrates a flow chart of retaining a heat sink to a package according to an embodiment of the present invention;

[0012] FIG. 4 illustrates a flow chart of retaining a heat sink to a package according to another embodiment of the present invention; and

[0013] FIG. 5 illustrates a conventional prior art package system.

[0014] FIG. 1 illustrates a retention module according to another embodiment of the present invention. The retention module 100 includes a socket 130, at least one retention arm 120, and at least one clamping bar 110. The retention arm 120 is coupled to the socket 130. This is in contrast to the prior art retention module/spring 510 of FIG. 5, which is coupled to the motherboard 150. The socket 130 couples to a socket connector 140 on a motherboard 150. The clamping bar 110 is coupled to the retention arm 120 on the end opposite the socket 130 to secure placement of a heat sink 210 is against a surface of a package assembly. The package assembly may include a package 230 (see FIG. 2) or both an integrated heat spreader (IHS) lid 220 (see FIG. 2) and a package 230.

[0015] A second opposing retention arm 120 according to a preferred embodiment of the invention is coupled to the socket 130. The retention arms 120 define a receiving space for receiving a package assembly and a heat sink 210 (see FIG. 2).

[0016] In one embodiment of the present invention, the retention arm(s) 120 are rotatably affixed to the socket 130. This is in contrast to the prior art retention module/spring 510 of FIG. 5, which is statically affixed to the motherboard 150. According to another embodiment, a rotation pin 170 rotatably affixes the retention arm(s) 120 to the socket 130. In another embodiment, the retention arm(s) 120 include a mesh member 160, defining a receiving space for receiving a package assembly and a heat sink 210. In another embodiment of the invention, the retention arm(s) 120 are formed of wire. According to yet another embodiment, the socket 130 is plastic.

[0017] FIG. 2 illustrates a package system according to an embodiment of the present invention. The package system 200 includes a package assembly and a retention module 100. The package assembly may include a package 230 or both an integrated heat spreader (IHS) lid 220 and a package 230.

[0018] The retention module 100 includes a socket 130, at least one retention arm 120, and at least one clamping bar 110. The retention arm 120 is coupled to the socket 130. This is in contrast to the prior art retention module/spring 510 of FIG. 5, which is coupled to the motherboard 150. The socket 130 couples to the motherboard 150 via the socket connector 140. The clamping bar 110 is coupled to the retention arm 120 on the end opposite the socket 130 to secure placement of a heat sink 210 against a surface of a package assembly. The clamping bar 110 secures onto the heat sink 210, a package 230 surface, and/or an IHS lid 220 surface by an engagement fit.

[0019] FIG. 3 illustrates a flow chart for a method of retaining a heat sink to a package according to an embodiment of the present invention. Within the method, a retention module 100 having a socket 130 is coupled 310 onto a motherboard 150. A package 230 is coupled 320 to the socket 130 of the retention module 100. An integrated heat spreader (IHS) lid 220 is coupled 330 to the package 230. A heat sink 210 is coupled 340 to the IHS lid 220. According to the embodiment as illustrated in FIG. 2, the retention module 100 secures onto a heat sink 210, a package 230 surface, and/or an IHS lid 220 surface by an engagement fit.

[0020] FIG. 4 illustrates a flow chart for a method of retaining a heat sink to a package according to another embodiment of the present invention. Within the method, a retention module 100 having a socket 130 is coupled 310 onto a motherboard 150. A package 230 is coupled 320 to the socket 130 of the retention module 100. A heat sink 210 is coupled 410 to the package 230. According to the embodiment as illustrated in FIG. 2, the retention module 100 secures onto a heat sink 210 or a package 230 surface by an engagement fit.

[0021] In summary, the retention module 100 according to the present invention eliminates motherboard holes. This configuration reduces the amount of space consumed on the motherboard 150, thereby reducing the price of the motherboard 150. Furthermore, attaching the retention module(s) 100 to the socket 130, or incorporating the retention module(s) 100 and the socket 130 into a unitary member, mitigates inventory issues and decreases both the cost of the package system 200 and the number of piece parts. The retention module 100 also simplifies field assembly and disassembly. Finally, the spring force of the retention arm(s) 120 of FIGS. 1, 2, for example, may be modulated by modifying the curve and thickness of the retention arm(s) 120.

[0022] While the description above refers to particular embodiments of the present invention, it will be understood that many modifications may be made without departing from the spirit thereof. The accompanying claims are intended to cover such modifications as would fall within the true scope and spirit of the present invention. The presently disclosed embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.