Socket apparatus particularly adapted for LGA type semiconductor devices

[0002] This application contains subject matter also disclosed in copending, coassigned application Ser. No. 09/961,658 filed of even date herewith.

[0003] This invention relates generally to a socket used in conducting electrical tests of semiconductor (SC) devices and more particularly to a socket for removably receiving a semiconductor device, such as an integrated circuit, and making electrical contact between the contacts of the device and respective contacts or terminals of the socket which in turn are connected to respective contact pads of a circuit substrate.

[0004] It is conventional to place a semiconductor device in a socket which, in turn, is connected to a circuit substrate and then to place the substrate into an oven so that the temperature and voltage of the semiconductor device can be raised to a selected level to conduct a stress test, called a burn-in test, to determine whether the semiconductor device meets the required manufacturing specifications.

[0005] Typically, prior art sockets used for this purpose comprise a base member formed of electrically insulative material in which an electrical contact element is mounted for each contact of the semiconductor device to be tested. The contact elements are arranged in a selected pattern relative to the semiconductor device mounting seat provided in the base and have contact portions adapted to be placed in electrical engagement with respective contacts of the semiconductor device. In one type of prior art socket the semiconductor device to be tested is placed in the semiconductor device receiving seat and a cover member, pivotably mounted to the base, is held in a closed position by means of a spring biased latch, a clip, a nubbin on an actuation arm or base, a protrusion or the like. The cover places a bias on the semiconductor device to provide a selected contact force between the device leads and the contact elements of the socket. When a semiconductor device is loaded into the socket for testing it is critical that the cover be maintained in the closed position for the duration of the test procedure, however, in typical prior art structures either the cover locking mechanism is cumbersome and time consuming to apply, such as a clip, or it is subject to accidental dislodgement with consequent unintended and untimely opening. Another problem associated with this type of socket having a pivotably mounted cover relates to the angled application of force to the semiconductor device sometimes causing damage to the semiconductor device. That is, due to the pivoting movement of the cover, typically the upper inside edge of the semiconductor device closest to the pivotable connection of the cover to the base is the first portion of the device to engage the cover and it receives a force the direction of which changes as the cover is pivoted until the bottom surface of the cover comes into a parallel position with the top surface of the semiconductor device. This angled force, i.e., force which is not normal to the top of the SC, can damage the SC device.

[0006] It is an object of the present invention to provide a socket which overcomes the above noted limitations of the prior art. Another object of the invention is to provide a socket having a pivotably mounted cover which has a locking mechanism for maintaining the cover in the closed position which is simply and quickly locked and unlocked and yet which is not subject to accidental or unintended unlocking. Another object of the invention is the provision of a socket having a pivotably mounted cover which avoids damaging semiconductor devices loaded therein. It is a further object of the invention to provide a socket which is highly reliable in operation and economical to manufacture.

[0007] Briefly, a socket made in accordance with a first embodiment of the invention comprises a cover pivotably mounted to a base to enclose a semiconductor device removably received for testing purposes. A locking mechanism for maintaining the cover in the closed position during the testing procedure includes a locking pin extending laterally from the base which interacts with an over center linkage mechanism. The linkage mechanism includes a first handle link pivotably mounted on the cover, providing a first axis immovable relative to the cover, a second locking link rotatably mounted to the cover having a locking pin receiving catch at one end thereof and having another end pivotably connected to an end of a third interconnecting link providing a second axis movable relative to the cover and with another end of the third link pivotably connected to the first link providing a third axis movable relative to the cover. When the cover is pivoted toward the closed position with the handle of the first link extending away from the cover, the first link is pivoted toward the cover bringing the locking pin receiving catch into engagement with the locking pin and the end of the cover frame into engagement with the locking pin bar and continued pivotal motion results in the third movable axis moving with snap action from one side of an imaginary line extending between the first and second axes to the other side thereof to thereby securely lock the cover in the closed position. Over center movement is limited by engagement of the second locking link with the first handle link. In a modified embodiment, the locking pin is attached to the second locking link and a locking catch member is pivotably mounted on the base for interaction with the locking pin. In this embodiment the cover can be opened either by raising (pivoting) the first handle link for manual operation or by applying a force to the pivotably mounted locking catch member.

[0008] In one embodiment the cover is integrally formed with a heat sink while in another embodiment a separately formed heat sink is independently mounted on the cover for sliding movement through a heat sink receiving aperture formed in the cover. According to a feature of the latter embodiment, the heat sink is preferably mounted on the cover with a first spring connection adjacent the hinged end of the cover and with second and third spring connections on the opposite end of the cover to ameliorate an even application of force to a semiconductor device disposed in the semiconductor receiving seat of the base. According to another feature of an embodiment of the invention, a boss having an outer configuration generally matching but preferably slightly less than that of a die of a semiconductor device to be received in the socket extends downwardly from the heat sink for engagement with a semiconductor device received in the socket. According to yet another feature, one or more pressure bars are slidably mounted for flexible movement in a pair of slots in the bottom surface of the cover for engaging the outer portions of the semiconductor device received in the socket.

[0009] In a modified embodiment the bottom surface of the heat sink is provided with a recessed portion for use with semiconductor devices having packaging features which extend above the die portion(s) and/or to move the initial engagement of the heat sink with the semiconductor device to a location slightly inboard of the outer periphery of the SC die.

[0010] Other objects, advantages and details of the socket of the invention appear in the following detailed description of preferred embodiments of the invention, the detailed description referring to the drawings in which common reference characters are used to designate the same parts throughout the drawings and in which:

[0011] FIG. 1 is a perspective view of a socket made in accordance with a first embodiment of the invention in the closed position;

[0012] FIG. 2 is a perspective view of the FIG. 1 socket in the opened position;

[0013] FIG. 3 is a side elevational view, partly broken away, of the FIG. 2 (opened position) socket;

[0014] FIG. 4 is a top view of the FIG. 2 socket;

[0015] FIG. 5 is a front elevational view of the FIG. 2 socket;

[0016] FIG. 6 is a side elevational view of the FIG. 1 (closed position) socket;

[0017] FIG. 7 is a top view of the FIG. 6 socket;

[0018] FIG. 8 is a front elevational view of the FIG. 6 socket;

[0019] FIG. 9 is an enlarged, simplified portion of the FIG. 6 socket showing the linkage mechanism used in locking the socket in the closed position;

[0020] FIG. 10 is a bottom plan view of the cover of another embodiment of the invention, FIG. 10ais a top plan view thereof, FIG. 10bis a side elevational view thereof and FIG. 10cis a front elevational view, partly in cross section, thereof;

[0021] FIG. 11 is a simplified cross sectional view showing the FIG. 10 cover with a separate heat sink and details of pressure bars on either side of the heat sink;

[0022] FIG. 12 is a top plan view of the heat sink of FIG. 11 and FIG. 12ais a side elevational view thereof;

[0023] FIG. 13 is a simplified cross sectional view showing details of the mounting arrangement of the FIG. 12 heat sink on the cover;

[0024] FIG. 14 is a side elevational view of another embodiment of the invention incorporating a modified heat sink movably mounted on the cover of the socket;

[0025] FIG. 15 is a top view of the FIG. 14 socket;

[0026] FIGS. 16 is a front elevational view of the FIG. 14 socket;

[0027] FIG. 17 is a bottom plan view of a modified heat sink for the FIG. 14 socket and FIG. 17ais a front elevational view, partly in cross section, thereof;

[0028] FIG. 18 is a simplified cross sectional view similar to FIG. 13 of the modified heat sink and showing details of the mounting arrangement of both heat sink embodiments on the cover and also showing the socket mounted on a circuit board;

[0029] FIG. 19 is a top plan view of the base of another embodiment of the socket shown in FIG. 20 and FIG. 19ais a cross sectional view taken through FIG. 19;

[0030] FIGS. 20 and 21 are a top plan view and a side elevational view, respectively, of another embodiment of the invention showing a modified locking mechanism;

[0031] FIGS. 22a-22cshow intermediate positions of the FIGS. 20, 21 socket being released (opened) by an automatic mechanism, not shown;

[0032] FIGS. 23a-23dshow intermediate positions of the FIGS. 20, 21 socket being released (opened) manually; and

[0033] FIG. 24 is a side elevational view of a modification of the FIGS. 20, 21 embodiment.

[0034] A first preferred embodiment of the invention will be described with reference to FIGS. 1-9. Socket 10 made in accordance with the invention comprises a base 12 with an integral cover and heat sink 14 pivotably mounted at a first end to the base through shaft 16 (FIG. 2) disposed in slot 12band locked therein by a suitable retainer such as washers 12fretained by the head of screws 12d. Base 12 is formed with a semiconductor device seat 12aexposing a contact mounting plate 18 having a selected array of contacts 18a(FIG. 4). Seat 12ais configured to be complimentary in shape with a selected semiconductor device SC (FIG. 2) so that device SC to be tested received in seat 12awill have its contacts on its lower surface (not shown) aligned and in engagement with respective contacts 18a. Spring members 12k(FIG. 4) can be provided to bias a device SC received in seat 12atoward a known reference location. A temperature sensor, such as a thermocouple or the like, may be mounted in an aperture 14aof cover 14, if desired, to monitor the temperature of the semiconductor device during the test procedure.

[0035] Socket 10 includes a locking mechanism 20 having a first portion of a locking member in the form of a locking pin 20aextending laterally outwardly from each side of a locking bar 12emounted on base 12 at the second end thereof opposite to the first end and essentially serving as part of the base and a linkage mechanism preferably provided on each side of cover 14 at the second end comprising a handle or first link 22 which is generally U-shaped with the free distal ends 22aserving as a first end of link 22. Ends 22aare pivotably connected to cover 14 by screws 22eat opposite sides thereof at hubs 14bforming a first axis 1 (see FIG. 9) which is immovable relative to cover 14. The second ends 22bof the first link are interconnected by handle or bight portion 22c. The second ends 22bare movable toward and away from cover 14 between closed and opened positions, respectively and are biased toward the opened position by a suitable spring 22dreceived on screws 22eand having an end received in hole 22fof first link 22 and another end (not shown) trained around screw 24e.

[0036] A locking or second link 24 is rotatably mounted at screw 24eto each side of cover 14 at a point intermediate to first and second ends with the first end 24ahaving a second portion of a locking member in the form of a locking pin receiving catch 24b.

[0037] An interconnecting or third link 26 for each linkage side having first and second ends 26a, 26b, respectively, has its first end 26apivotably connected to the second end 24cof second locking link 24 forming a second axis 2 (FIG. 9) movable relative to cover 14 and its second end 26bpivotably connected to the first handle link at a third axis 3 (FIG. 9) movable relative to cover 14. With particular reference to FIG. 9, the third axis 3 is disposed in a position on one side of an imaginary line 4 drawn between axes 1 and 2 when the handle or second end of link 22 is in a position away from the cover maintaining the locking pin receiving catch 24bout of alignment with the locking pin 20a. The locking mechanism is actuated by pivoting cover 14 toward the closed position while maintaining the second end of link 22 in a position away from the cover thereby allowing the locking pin receiving catch to pass by locking pin 20a. The second end of link 22 is then pivoted toward the cover and the locking pin receiving catch comes into engagement with locking pin 20aand surface 14gof cover 14 engages surface 12gof locking bar 12eand with the third axis 3 snapping over to the other side of imaginary line 4. It should be noted that in order for the over center position of axis 3 to be stable, the distance between the surface of the catch which engages the locking pin 20aand surface 14gof the cover which engages top surface 12gis less than the bottom of locking pin 20aand the top surface 12gof the locking bar mounted on the base with cover 14 tightly biased against locking bar 12e. Continued movement of second locking link 24 and third axis 3 is limited by engagement of surface 24dof second end 24cof locking link 24 with handle link 22 as seen in FIG. 9.

[0038] In the locked position described above, the cover is securely maintained in that position, insensitive to vibration, until the second end of first handle link 22 is pivoted away from the cover.

[0039] In the embodiment described above, the cover also serves as an integrally formed heat sink to conduct heat away from the semiconductor device being tested in order to prevent excessive heating thereof. In the FIGS. 10-20 modified embodiments, a heat sink member is shown movably mounted on the cover so that the force used in obtaining the required contact force for the many individual contact matings between the contact elements in the contact mounting plate and respective contacts or leads of the semiconductor device can be separated from the force used to provide a thermal coupling between the heat sink and the semiconductor device being tested and can be independently controlled.

[0040] With reference to FIGS. 10-10c, cover 28 comprises a bottom wall 28aand opposed upstanding sidewalls 28b. Hub 14bis formed at one end of each sidewall for mounting of link 22 and, at the opposite end of each sidewall, ears 14care provided for pivotal mounting to shaft 16, described with reference to FIG. 2. Ears 14care provided with a laterally extending bore 14dfor receipt of shaft 16. Ears 14care preferably bifurcated at 14eto enhance stability of the mounting of the cover to the base. Springs 16aare conveniently placed about shaft 16 between the bifurcated ears and are used to bias cover 28 (and 14 of the first embodiment) toward the open position. A heat sink receiving aperture 28cis centrally located in bottom wall 28afor slidably receiving therethrough a stepped portion of heat sink 30 to be discussed.

[0041] Parallel extending slots 28dare formed in the bottom surface of bottom wall 28aon either side of aperture 28bclosely adjacent thereto and extending in a direction generally parallel to sidewalls 28b. As seen in FIGS. 10cand 11, countersunk bores 28eextend through bottom wall 28aat each end of slots 28d. A pin 28fhaving a head 28gis received in each bore 28ewith the head disposed in the countersunk portion recessed from the top surface of wall 28a. Pins 28fare received through a respective hole in flexible strip 28hof suitable material such as silicone rubber having a selected durometer to provide a compressable mount and the end of the pins are fixedly attached to a pressure bar 28kslidably received in each slot 28d, the pressure bars extending beyond the lower surface of bottom wall 28aand being adapted to place a flexible clamping force on the outer margins of a semiconductor device received in the semiconductor device seat of the base. Although two such pressure bars are described, it is within the purview of the invention to use a single pressure bar or more than two pressure bars, if desired. Further, other compressible elements can be employed in place of flexible strip 28hsuch as a spring element, if desired.

[0042] FIGS. 12 and 12ashow one type of heat sink adapted for use with cover 28. Heat sink 30 comprises a bottom wall 30aand upstanding spaced-apart heat transfer fins 30b. A stepped portion 30c, complimentary in shape with aperture 28c, extends downwardly from bottom wall 30aand boss portion 30d, complimentary in shape with the die portion of a semiconductor device to be placed in the semiconductor device seat of the base but slightly smaller in length and width, extends further downwardly from stepped portion 30c. Fins 30bare cut back from mounting holes 30e. With reference to FIGS. 12, 13 and 18, heat sink 30 is received on cover 28 with stepped portion 30creceived through apertures 28c. Mounting apertures 30eare aligned with threaded bores 28m. A threaded member 30fis received in each mounting aperture and threaded into a respective threaded bore 28mwith the head of each threaded member 30fspaced a selected amount from a spring seat on bottom wall 28aand a coil spring 30gis disposed between each head and the head sink. The coil spring is selected to provide the desired force to be applied to the semiconductor device through boss 30d(FIG. 12) or the lower surface of heat sink 30′ of FIG. 18, to be discussed. Preferably, and as shown, three mounting bores 30eare used in mounting the heat sink to the cover with two bores 30ebeing disposed adjacent the end of the cover which swings open and spaced apart, for example, somewhat more than the width of aperture 28c, and the third bore 30ebeing centrally disposed adjacent to the pivoted mounted end of the cover. In this way, the application of even force to the semiconductor device is ameliorated to provide a suitable heat conductive coupling without exerting excessive force.

[0043] The socket shown in FIGS. 14-18 is shown with a heat sink modified to accommodate certain flip chip, non-encapsulated semiconductor packages when the backside of the die is contacted directly by the heat sink. That is, the inner surface of the heat sink member which engages the semiconductor package is recessed at 30mand provided with a flat central portion 30nto accommodate a selected profile. Also shown in FIGS. 17, 17ais an optional bore 30pto provide access, if desired, for a temperature sensor.

[0044] FIG. 18 also shows a socket made in accordance with the invention as it would be used mounted on a circuit board 32 having an array of contacts 32ainterconnected to the matching array of contacts of the contact mounting plate. Preferably, a back-up plate 36 and insulator 38 are attached to the socket through the circuit board to maintain rigid support and prevent bowing of the circuit board. Suitable machine screws are received through the base of the socket, the circuit board, insulator and back-up plate with nut to fasten the several components together and provide desired contact force between the socket and circuit board. Typically, a circuit board will have many sockets mounted on the board for placement in an oven and simultaneous testing.

[0045] With reference to FIGS. 19-23, another embodiment is shown which relates to a locking and linkage mechanism used for either automatic or manual operation. FIGS. 19, 19ashow a base 12′ formed with a semiconductor device seat 12a′ having a slightly different configuration from that shown in FIG. 1. A slot 12b′ is formed along one end for receipt of shaft 16 for pivotably connecting the cover and bores 12c′ are formed at the opposite end for receipt of a locking member, to be described. Also shown in FIG. 19 is a slot 12hwhich is open to seat 12a′ for placement of a suitable spring member (not shown) for biasing an SC device toward a reference surface, much like springs 12kshown in FIG. 4. As shown in FIG. 21, first link 22′; is pivotably connected to cover 34 as in the FIGS. 1-9 embodiment. Second locking link 24′ is rotatably connected to the cover at a location 24e′ intermediate first and second ends 24a′, 24c′. A second locking member portion in the form of a pin 24fextends laterally between the second links disposed at each side of socket 10′. The second end 24c′ is pivotably connected to third interconnecting link 26′ as in the FIGS. 1-9 embodiment. Third interconnecting link 26′ is pivotably connected at one end to second link 24′ and at its other end to first handle link 22′. This provides the same first axis 1 immovable relative to cover 34, second axis 2 movable relative to cover 34 and third axis 3 movable between an unlocked position on one side of an imaginary line running through axes 1 and 2 and a locked position on the other side of the imaginary line.

[0046] The first locking member portion in the present embodiment takes the form of a pivotably mounted locking member 27 (see FIGS. 20, 21) centrally disposed at the front end of socket 10′ and pivotably mounted at 12c′ of base 12′ (FIG. 19) and formed with a force receiving release surface 27band a locking pin catch 27a. In addition to socket locking pin 24f, second locking link 24′ is also provided with a system locking and release pin 24gspaced a selected distance from socket locking pin 24f. Second link 24′ is also provided with a follower surface 24hwhich cooperates with a cam surface 22gof first link 22′. In this embodiment, third axis 3 is maintained stable by system locking and release pin 24gtightly biased against cover 34.

[0047] With reference to FIGS. 22a-22c, an automated release is effected by applying a force on release surface 27bby a suitable mechanism, not shown, but indicated by arrow A in FIG. 22a. Locking member 27 is pivoted away from cover 34 thereby moving locking pin catch 27aaway from locking pin 24fallowing cover 34 to pivot to the opened position shown in FIG. 22cunder the influence of suitable spring members, not shown.

[0048] FIGS. 23a-23dshow intermediate steps in manually opening of cover 34. FIG. 23areflects the locked position while FIG. 23bshows first handle link 22′ pivoted causing cam surface 22fto rotate second locking link 24′ moving axis 3 to the unlocked position and bringing release pin 24ginto engagement with release surface 27bof locking member 27 (FIG. 23c) indicated by arrow B in FIG. 23bcausing it to pivot moving locking pin catch 27aaway from locking pin 24f(FIG. 23c) to allow cover 34 to pivot to the open position shown in FIG. 23d.

[0049] In this embodiment, over-center motion of axis 3 (FIG. 21) is limited by engagement of follower surface 24hwith first handle link 22′ as shown in FIG. 21.

[0050] FIG. 24 shows a modification 10″ of the FIGS. 20, 21 embodiment in which the socket locking pin 24f, extending between the respective second or locking links 24″ at each side of the socket, serves both to inter-engage with catch 27ato hold the cover in the closed position when the linking mechanism is locked as well as to interact with cover 34 at surface 34afor locking the mechanism. The locking and stabilizing function performed by system locking and release pin 24gbiased against cover 34 in the FIGS. 20, 21 embodiment and by surface 14gof cover 14 biased against surface 12gof locking bar 12eof the FIGS. 1-9 embodiment is performed in the FIG. 24 embodiment by pin 24ftightly biased against surface 34aof cover 34.

[0051] In the FIG. 24 embodiment, starting at the closed, locked socket position, as the handle link 22 is pivoted away from the cover once axis 3 moves to the opposite side of the imaginary line between axes 1 and 2. Rotation of links 26″ and 24″ cause pin 24fto move downwardly and inwardly toward the center of the socket resulting in separation of the pin and locking catch 27afor manual release. As in the FIGS. 20, 21 embodiment, a downward force on locking member 27 as indicated by arrow A, will rotate locking member 27 downwardly resulting in separation in the automated mode of operation.

[0052] It should be understood that the invention includes all modifications and equivalents of the described embodiments falling within the scope of the appended claims.