Thermal heating board

[0002] This invention is described in my Provisional Patent Application, Ser. No. 60/110,693, filed Dec. 3, 1998 and now expired and is a continuation in part of Utility Patent Application, Ser. No. 09/451,324, filed Nov. 30, 1999 and now abandoned.

[0003] This invention relates to construction material and is particularly directed to improved thermal heating modules for application of hydronic radiant heating in new and existing construction.

[0004] The concept of heating an area by heating the floor surface has been known since Roman times. In more recent times, such systems were formed by metal or plastic pipes embedded in concrete slabs or attached under a subfloor or sandwiched in between layers of flooring thereto by various means and by laying flooring or subflooring on top of these. More recently it has been proposed to have combinations of boards and pipes in various configurations installed either above or below a subfloor as well as integrated structural subfloor systems with an integral metal plate However, these systems have been found to be relatively inefficient in transferring heat to desired area or have been too expensive to install or have been dimensionally too thick to be usefull in retrofit applications or have had sound transmission problems due to thermal contraction 1 and expansion of poorly connected component parts, or use uncommon building practices and sequencing of installation and have been somewhat useful to new construction. Also, inserting the pipe into the grooves of the prior art boards has been unsatisfactory. Frequently, the pipe would come loose and pop out of place, causing problems with laying overflooring and the like. Thus, none of the prior art thermal heating boards have been entirely satisfactory.

[0005] These disadvantages of the prior art are overcome with the present invention and an improved hydronic radiant heating system is provided which is simple and inexpensive to install and which can be applied equally well to new or existing construction and to floors, walls or ceilings, while providing efficient heating to the desired area and ensuring that the pipes are retained within the system.

[0006] These advantages of the present invention are preferably attained by providing an improved hydronic radiant heating system comprising a non-structural board formed of thermally conductive material and having at least one undercut recess formed in the upper surface of said board, a pipe releasably retained within said undercut recess, and a film of metal covering the upper surface of said board.

[0007] Accordingly, it is an object of the present invention to provide an improved hydronic radiant heating system.

[0008] Another object of the present invention is to provide an improved hydronic radiant heating system which is simple and inexpensive to install.

[0009] An additional object of the present invention is to provide an improved hydronic radiant heating system which can be applied equally well to new or existing construction, while providing efficient heating to the desired area.

[0010] A further object of the present invention is to provide an improved hydronic radiant heating system comprising a simple board rather than a complex assembly of parts.

[0011] An additional object of the present invention is to provide an improved hydronic radiant heating system which can be applied to floors, walls and ceilings.

[0012] Another object of the present invention is to provide an improved hydronic radiant heating system comprising a board that lends itself to modules which can easily be laid out and installed.

[0013] An additional object of the present invention is to provide an improved hydronic radiant heating system that lends itself to mass production with associated cost savings.

[0014] A further object of the present invention is to provide an improved hydronic radiant heating system comprising a board having a thermally conductive coating whose thickness can be varied to compensate for the conductivity of the board to achieve a desired overall thermal performance.

[0015] An additional object of the present invention is to provide an improved hydronic radiant heating system comprising a board having a groove with undercut grooves for releasably retaining a pipe within said groove.

[0016] A specific object of the present invention is to provide an improved hydronic radiant heating system comprising a nonstructural board formed of thermally conductive material having an undercut recess formed in one surface of said board and having a pipe releasably retained within said recess,

[0017] Another specific object of the present invention is to provide an improved hydronic radiant heating system comprising a nonstructural board having an undercut recess formed in one surface of said board, a pipe releasably retained within said recess, and a coat of thermally conductive material applied to said surface of said board having a thickness sufficient to compensate for the thermal characteristics of said board to provide desired overall thermal performance for said system.

[0018] These and other objects and features of the present invention will be apparent from the following detailed description, taken with reference to the figures of the accompanying drawing.

[0019] FIG. 1ais a vertical section through a floor heating system embodying the present invention;

[0020] FIG. 1bis a view, similar to that of FIG. 1a, showing a pipe inserted into the recess of the heating system of FIG. 1;

[0021] FIG. 2ais a view, similar to that of FIG. 1a, showing an alternative form of the floor heating system of FIG. 1;

[0022] FIG. 2bis a view, similar to that of FIG. 2a, showing a pipe inserted into the heating system of FIG. 2a;

[0023] FIG. 3ais a view, similar to that of FIG. 1a, showing a layer of metal foil attached to the surface of a board similar to that of FIG. 1a;

[0024] FIG. 3bis a view, similar to that of FIG. 3a, showing the metal foil having been slit;

[0025] FIG. 3cis a view, similar to that of FIG. 3a, showing the metal foil pressed into the recess of the board of FIG. 3a;

[0026] FIG. 4ais a view, similar to that of FIG. 1, showing an alternative form of the heating system of FIG. 1; and

[0027] FIG. 4bis a view, similar to that of FIG. 4a, showing a pipe installed in the heating system of FIG. 4a.

[0028] In the form of the present invention chosen for purposes of illustration in the drawing, FIG. 1ashows a hydronic radiant heating system, indicated generally at 10, comprising a supporting board 12 having a recess 14 formed in the upper surface 16 of the board 12 and having a pipe 18 located within the recess 14, with a coat 20 of thermally conductive material, such as metal spray, metal foil or the like deposited on the upper surface 16 of the board 12. As seen in FIG. 1b, the recess 14 is undercut, providing an opening 15 with flanges 17 which overlie the pipe 18 after the pipe 18 has been inserted into the recess 14. The pipe 18 sufficiently resilient to allow the pipe 18 to be inserted through the opening 15 and to snap back to overlie the pipe 18, as seen in FIG. 1b. This serves to releasably retain the pipe 18 and ensures that the pipe 18 cannot become dislodged or otherwise displaced. The supporting board 12 may be a wooden board or, if desired, may be plywood, fiberboard, recycled material or other suitable supporting material.

[0029] In use, the hydronic radiant heating system 10 is applied over a suitable subfloor over wall framing, under ceiling framing or over a concrete slab or over an existing floor, then the pipe 18 is forced into recess 14 so that flanges 17 overlie and releasably retain the pipe 18 and the finished floor, wall or ceiling goods are installed over the hydronic radiant heating system 10. (In the case of its use for radiant hydronic ceiling heat the finished goods are installed below the board 12) Heated water or the like is circulated through the pipe 18 and transfers heat by conductivity and radiation through the new floor to the desired area. The thermally conductive coat 20 can be varied to compensate for the varying conductive qualities of the supporting board 12. Thus, the thickness of the thermally conductive coat 20 could vary proportionally to the thermal properties of the supporting board 12. (More conductive board would have a thinner coating, while less conductive board would have a thicker coating.) The thermally conductive coat 20 may be applied to the upper surface 16 of the supporting board 12 by spraying or by applying one or more layers of metal foil or the like. Thus, the thickness of the coat 20 can be extremely thin, yet serves to effectively and efficiently transfer heat from the pipe 18 to the coat 20 and, hence, to the desired area.

[0030] FIGS. 2aand 2bshow an alternative form of the heating system of FIG. 1awherein two supporting boards 12 and 12′ are provided and the conductive coating 20 is applied between the boards 12 and 12′. This would allow the components to be manufactured separately and, subsequently, to be laminated together at a convenient time and location.

[0031] FIG. 3ashows the board 12 having a layer of metal foil 20 attached to the board 12 by suitable means, such as adhesive 21, and overlying the recess 14.

[0032] Obviously, if desired, the metal layer 20 could be applied by plating or other well known means. After the metal layer 20 has been attached to the board 12, the metal layer is slit, as seen at 22 in FIG. 3b, and the portions of thematel layer 20 are then pressed into the recess 14, as seen at 23 in FIG. 3c. This provides a very simple and inexpensive means of manufacturing the board of FIG. 1a.

[0033] FIG. 4ashows an alternative form of the board 12 having the surface 13 of the recess 14 serrated or otherwise prepared to frictionally retain the pipe 18 when the pipe 18 is forcefully inserted into the recess 14.

[0034] Obviously, numerous variations and modifications can be made without departing from the spirit of the present invention. Therefore, it should be clearly understood that the form of the present invention described above and shown in the accompanying drawing is illustrative only and is not intended to limit the scope of the present invention.