Method of fabricating thin film transistor flat panel display

[0002] 1. Field of the Invention

[0003] The present invention relates to a method of fabricating a flat panel display. In particular, the present invention relates to a method of fabricating a thin film transistor (TFT) flat panel display.

[0004] 2. Description of the Related Art

[0005] FIGS. 1A to 1D illustrate the conventional method of fabricating a TFT liquid crystal flat panel display. Referring to FIG. 1A, a gate electrode 2 is formed on a substrate 1, and then an insulating layer 3 is formed to cover the gate electrode 2. Then, an amorphous silicon layer 40 and a silicon nitride 50 are formed on the insulating layer 3. Referring to FIG. 1B, an etching stopper 5 is formed by etching the silicon nitride 50. Referring to FIG. 1C, a doping silicon layer 6 (to be n+ doped amorphous silicon) is formed on the etching stopper 5 and the amorphous silicon 40. Referring to FIG. 1D, a metal layer is formed on the substrate 1, and then is etched to form a source electrode 7 and a drain electrode 8. Finally, a passivation layer 9 is formed. In the etching process, part of the metal layer and the doping silicon layer 6 are removed, and the etching stopper 5 is used for preventing the amorphous silicon layer 40 form etching damage.

[0006] The conventional method can be used to fabricate TFT flat displays; however it still has the spaces for improvement and simplification.

[0007] In order to improve and simplify the above-mentioned conventional manufacturing steps, the present invention proposes a new method of fabricating a TFT flat panel display, merely requiring four mask processes.

[0008] The present invention proposes a method of fabricating a TFT flat display is characterized by: (1) using the first mask process for patterning the first conductive layer/gate insulating layer/amorphous silicon layer of the TFT, (2) using the second mask process for defining the passivation layer and the etching stopper, (3) using the third mask process for forming the Source/Drain, and (4) using the fourth mask process for forming the pixel electrode, whereby simplifying the fabricating process of the TFT flat panel display.

[0009] The present invention can be more fully understood by reading the subsequent detailed description in conjunction with the examples and references made to the accompanying drawings, wherein:

[0010] FIGS. 1A to 1D illustrate, in a cross-sectional view, the conventional method of fabricating a TFT liquid crystal flat panel display.

[0011] FIGS. 2A to 2D illustrate, in a top view, the fabricating process of the first embodiment according to the present invention.

[0012] FIGS. 3A to 3D illustrate, in a cross-sectional view, the fabricating process of the first embodiment according to the present invention.

[0013] FIGS. 4A to 4D illustrate, in a cross-sectional view, the fabricating process of the second embodiment according to the present invention.

[0014] FIGS. 5A to 5D illustrate, in a top view, the fabricating process of the third embodiment according to the present invention.

[0015] FIGS. 6A to 6D illustrate, in a cross-sectional view, the fabricating process of the third embodiment according to the present invention.

[0016] FIGS. 7A to 7D illustrate, in a top view, the fabricating process of the fourth embodiment according to the present invention.

[0017] FIGS. 8A to 8D illustrate, in a cross-sectional view, the fabricating process of the fourth embodiment according to the present invention.

[0018] FIGS. 9A to 9C illustrate, in a top view, the fabricating process of the fifth embodiment according to the present invention.

[0019] FIGS. 10A to 10C illustrate, in a cross-sectional view; the fabricating process of the fifth embodiment according to the present invention.

[0020] FIGS. 3A to 3D illustrate, in a cross-sectional view, the fabricating process of the first embodiment according to the present invention. In FIGS. 3A˜3D, a thin film transistor (TFT) is formed on the I area (gate area) and a gate pad structure is formed on the II area. The I area in FIGS. 3A to 3D corresponds to the cross section view along the A-A′ direction in FIGS. 2A to 2D. The II area in FIGS. 3A to 3D corresponds to the cross section view along the B-B′ direction in FIGS. 2A to 2D.

[0021] Referring to FIGS. 2A and 3A, a first conductive layer 101, an insulating layer 102 and a semiconductor layer 103 are sequentially formed on a transparent substrate 100. A scanning line structure (DL), a gate pad structure (DLp) and a gate structure (DLg) are formed after patterning the semiconductor layer 103, the insulating layer 102 and the first conductive layer 101. The gate pad structure DLp is formed at one end of the scanning line DL. The gate structure DLg extends from one side of the scanning line structure DL and the semiconductor layer 103 in the gate structure DLg serves as the channel layer of the TFT. In general, the substrate 100 is made of glass or quartz materials, the first conductive layer 101 is metal, the insulating layer 102 is silicon oxide (SiN_x), and the semiconductor layer 103 is amorphous silicon serving as a gate electrode.

[0022] Referring to FIGS. 2B and 3B, a passivation layer 104 is formed to cover the scanning line structure DL, the gate structure DLg and the gate pad structure DLp on substrate 100. The passivation layer 103 is then patterned to form a first and second openings op1 and op2 in the gate structure DLg and a third opening op3 in the gate pad structure DLp to expose the corresponding semiconductor layer 103. The above-mentioned a passivation layer is made of silicon nitride (SiN_x) or other organic polymer.

[0023] Referring to FIGS. 2C and 3C, a doping silicon layer 105 and a second conductive layer 106 are formed on substrate 100. The conductive layer 106 is made of metal and the doping silicon layer is made of n+ doped silicon. The doping silicon layer 105 and the second conductive layer 106 are then patterned to form a signal line SL, a source S and a drain D on the gate structure DLg. The signal line SL is perpendicular to the scanning line structure DL. The doping silicon layer 105 in the source S and drain D are electrically connected to the semiconductor layer 103 through the openings op1 and op2.

[0024] The passivation layer 104 between op1 and op2 serves as an etching stopper IS (or an island etching stopper). The etching stopper IS is used to prevent the semiconductor layer 103 (over the gate structure DLg) from damages when etching the doping silicon layer 105 and the second conductive layer 106.

[0025] Referring to FIGS. 2D and 3D, the semiconductor layer 103 and the insulating layer 102 in the gate pad structure DLp are etched to expose the conductive layer 101 in the opening op3. Then, a transparent electrode layer 107 is formed on the substrate 100 and covers the source S, the drain D and the gate pad structure DLp. Finally, the electrode layer 107 is patterned to form a pixel electrode PL electrically connected to the drain D and a dummy signal line FS covering the source S and the signal line SL. The etched electrode layer 107 is electrically connected to the first conductive layer 101 of the gate pad structure DLp.

[0026] The above-mentioned electrode layer 107 is preferably made of indium tin oxide (ITO). The electrode layer 107 also covers the side walls of the conductive layers 106 of the source S and drain D.

[0027] FIGS. 4A to 4D illustrate, in a cross-sectional view, the fabricating process of the second embodiment according to the present invention. The top view of the fabricating process of the second embodiment is the same as that depicted in FIGS. 2A to 2D. Only difference between the fabrication methods that described in first embodiment and in this present second embodiment is that a second insulating layer 202 forms on the semiconductor layer 103 to protect it.

[0028] Referring to FIGS. 2A and 4A, a first conductive layer 101, a first insulating layer 102, a semiconductor layer 103 and a second insulting layer 202 are sequentially formed on a transparent substrate 100. A scanning line structure (DL), a gate pad structure (DLp) and a gate structure (DLg) are formed after patterning the second insulting layer 202, the semiconductor layer 103, the first insulting layer 102 and the first conductive layer 101. The second insulating layer 202 is preferably made of silicon nitride (SiN_x).

[0029] Referring to FIGS. 2B and 4B, a passivation layer 104 is formed to cover the scanning line DL, the gate DLg and the gate pad DLp on the substrate 100. The passivation layer 104 and the second insulating layer 202 are then patterned to form a first and second openings op1 and op2 on the gate structure DLg and a third opening op3 on the gate pad structure DLp to expose the semiconductor layer 103.

[0030] Referring to FIGS. 2C and 4C, a doping silicon layer 105 and a second conductive layer 106 are formed on the substrate 100. The second conductive layer 106 is made of metal and the doping silicon layer is made of n+ doped silicon. The doping silicon layer 105 and the second conductive layer 106 are patterned to form a signal line SL, a source S and a drain D on the gate structure DLg. The doping silicon layers 105 in the source S and drain D are electrically connected to the semiconductor layer 103 through the openings op1 and op2.

[0031] The passivation layer 104 and the second insulting layer 202, between the first and second openings op1 and op2, serve as a etching stopper IS (or a island etching stopper) for preventing the semiconductor layer 103 (channel layer) from damages when etching the second conductive layer 106 and the doping silicon layer 105.

[0032] Referring to FIGS. 2D and 4D, the semiconductor layer 103 and the first insulating layer 102 in the third opening op3 on the gate pad structure DLp are removed first to reveal the first conductive layer 101 in the third opening op3. Then a transparent electrode layer 107 is formed on the substrate 100 and covers the source S, the drain D and the gate pad structure DLp. Finally, the electrode layer 107 is patterned to form a pixel electrode PL which is electrically connected to the drain D through the openings op2, and a dummy signal line FS which is electrically connected to the source S through the opening op1, covering the signal line SL. The etched electrode layer 107 is electrically connected to the first conductive layer 101 of the gate pad structure DLp through the third openings op3.

[0033] In this embodiment, a thin silicon nitride layer (the second insulating layer 202) is further formed on the semiconductor layer 103 to prevent the semiconductor layer from oxidation due to long-timely exposing to the air.

[0034] FIGS. 5A to 5D illustrate, in a cross-sectional view, the fabricating process of the third embodiment according to the present invention. In FIGS. 6A˜6D, a thin film transistor (TFT) is formed on the I area (gate area) and a gate pad structure is formed on the II area. The I area in FIGS. 6A to 6D correspond to the cross section view along the A-A′ direction in FIGS. 5A to 5D. The II area in FIGS. 6A to 6D correspond to the cross section view along the B-B′ direction in FIGS. 5A to 5D.

[0035] Referring to FIGS. 5A and 6A, a first conductive layer 101, an insulating layer 102, a semiconductor layer 103 are sequentially formed on a transparent substrate 100. Then, a scanning line structure (DL), a gate pad structure (DLp) and a gate structure (DLg) are formed after patterning the semiconductor layer 103, the insulating layer 102 and the first conductive layer 101. The gate pad structure DLp is formed at one end of the scanning line DL. The gate structure DLg extends from one side of the scanning line DL and the semiconductor layer 103 in the gate structure DLg serves as a channel layer of the TFT. In general, the substrate 100 is made of glass or quartz materials, the first conductive layer 101 is metal, the insulating layer 102 is silicon oxide, and the semiconductor layer 103 is amorphous silicon serving as a gate electrode.

[0036] Referring to FIGS. 5B and 6B, a passivation layer 104 is formed to cover the scanning line DL, the gate structure DLg and the gate pad structure DLp on substrate 100. The passivation layer 103 is then patterned to form a first and second openings op1 and op2 in the gate structure DLg and a third opening op3 in the gate pad structure DLp to expose the corresponding semiconductor layer 103. The above-mentioned a passivation layer is made of silicon nitride (SiN_x) or other organic polymer.

[0037] Referring to FIGS. 5C and 6C, a doping silicon layer 105 and a second conductive layer 106 are formed on the substrate 100, and then are patterned to form a stack structure on the gate structure DLg, and a signal line SL perpendicular to the scanning line structure DL. The doping silicon layer 105 of the stack structure is electrically connected to the semiconductor layer 103 on the gate structure DLg through the openings op1 and op2.

[0038] Referring to FIGS. 5D and 6D, the semiconductor layer 103 and the first insulting layer 102 in the opening op3 on the gate pad structure DLp are removed to reveal the first conductive layer 100 in the opening op3 on the gate pad structure DLp. Then, a transparent electrode layer 107 is formed on the substrate 100. Next, the electrode layer 107 and the stack structure (that is the second conductive layer 106 and the doping silicon layer 105 cover the gate structure DLg) are patterned to form a source S and a drain D over the gate structure DLg. Moreover, a pixel electrode PL is also formed by patterning the electrode layer 107. The pixel electrode PL is electrically connected to the drain D. The patterned electrode 107 also covers the gate pad structure DLp and is electrically connected to the first conductive layer 101 of the gate pad structure DLp through the third opening op3.

[0039] The above mentioned electrode layer 107 is preferably made of indium tin oxide ITO and uncovers the sidewalls of the second conductive layer 106 of the source S and drain D to reduce the size of the TFT channel.

[0040] FIGS. 7A to 7D illustrate, in a top view, the fabricating process of the third embodiment according to the present invention. In FIGS. 8A to 8D, a thin film transistor (TFT) is formed on the I area (gate area) and a gate pad structure is formed on the II area. The I area in FIGS. 8A to 8D correspond to the cross-sectional view along the A-A′ direction in FIGS. 7A to 7D. The II area in FIGS. 8A to 8D correspond to the cross-sectional view along the B-B′ direction in FIGS. 7A to 7D.

[0041] Referring to FIGS. 7A and 8A, FIGS. 7B and 8B, a first conductive layer 101, an insulating layer 102, a semiconductor layer 103 and the passivation layer 104 are formed on a substrate 100. Patterning of the above layers form a scanning line structure (DL), a gate pad structure (DLp) and a gate structure (DLg). The openings op1, op2 and op3 are formed on the gate structure DLg and the gate pad structure DLp to expose the semiconductor layer 103. The detailed fabrication process is the same as that described in the first embodiment; therefore not described in this embodiment for brevity. Further, a second insulating layer (not shown in figures) can be formed on the semiconductor layer 103 for protection.

[0042] Referring to FIGS. 7C and 8C, a second conductive layer 106 is formed and patterned on the passivation layer 104. The patterned second conductive layer 106 serves as a signal line SL perpendicular to the scanning line structure DL.

[0043] Referring to FIGS. 7D and 8D, a doping silicon layer 105 and a transparent electrode layer 107 are sequentially formed on the substrate 100 and cover the signal line SL and the gate structure DLg. Then, the doping silicon layer 105 and the electrode layer 107 are patterned to form a source S and a drain D on the gate structure DLg, and a first part TK1 and a second part TK2, as depicted in FIGS. 7D and 8D. Furthermore, the first part TK1 covers the signal line SL and is electrically connected to the source S. The second part TK2 serves as a pixel electrode PL and electrically connects to the drain D. The doping silicon layers 105 of the source S and the drain D is electrically connected to the semiconductor layer 103 through the openings op1 and op2 on the gate respectively.

[0044] Finally, the conductive layer 101 exposes in the opening op3 by removing the insulating layer 102 and the semiconductor layer 103 on gate pad structure DLp.

[0045] FIGS. 9A to 9C illustrate, in a top view, the fabricating process of the third embodiment according to the present invention. In FIGS. 10A to 10C, a thin film transistor (TFT) is formed on the I area (gate area) and a gate pad structure is formed on the II area. The I area in FIGS. 10A to 10C correspond to the cross-sectional view along the A-A′ direction in FIGS. 9A to 9C. The II area in FIGS. 10A to 10C correspond to the cross-sectional view along the B-B′ direction in FIGS. 9A to 9C.

[0046] Referring to FIGS. 9A and 10A, a first conductive layer 101, an insulating layer 102 and a semiconductor layer 103 are formed on a substrate 100. The above layers are patterned to form a scanning line structure (DL), a gate pad structure (DLp) and a gate structure (DLg) on the substrate 100. The gate pad structure DLp is formed at one end of the scanning line structure DL. The gate structure DLg extends from one side of the scanning line structure DL and the semiconductor layer 103 in the gate structure DLg serves as a channel layer of the TFT.

[0047] Referring to FIGS. 9B and 10B, a passivation layer 104 and a second conductive layer 106 are formed sequentially on the substrate 100. Then, the second conductive layer 106 and the passivation layer 104 are patterned to cover the scanning line structure DL, the gate structure DLg and the gate pad structure DLp and further form a signal line SL. The signal line SL is perpendicular to the scanning line structure DL. In additional, a first and a second openings op1 and op2 are formed in the gate structure DLg and a third opening op3 is formed in the gate pad DLp. The semiconductor layer 103 exposes in the openings op1, op2 and op3.

[0048] Referring to FIGS. 9C and 10C, a doping silicon layer 305 and a transparent electrode layer 107 are sequentially formed on the substrate 100. The doping silicon layer is electrically connected to the semiconductor layer 103 through the openings op1 and op2. Then, the electrode layer 107 and the doping silicon layer 305 are patterned to form a source S and a drain D on the gate structure DLg. Furthermore, the first part T1 of the electrode layer 107 covers the signal line SL. The second part T2 of the electrode layer 107 forms a part of the source S. The third part T3 of the electrode layer 107 forms a pixel electrode PL, covering the drain D. The first conductive layer 101 exposes on the gate pad DLp by removing of the semiconductor layer 103 and the insulating 102 in the openings op3.

[0049] Finally, while the invention has been described by way of examples and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed several embodiments. On the contrary, it is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the art. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.