Compact heat sink module

[0002] 1. Field of the Invention

[0003] The present invention relates to a compact heat sink module and more particularly to a heat sink module that is adapted to be retained on a CPU disposed in a thin notebook computer and that effectively carries heat away from the CPU.

[0004] 2. Description of Related Art

[0005] The twin trends of faster computing speeds and size reduction of computers leads to a particular problem concerning effective heat dissipation from the central processor units of the computers. Usually a heat sink device having a plurality of fins and a fan is fitted to a CPU so that heat is rapidly evacuated from the interior of the computer and the CPU in particular. If that heat is not dispersed quickly the CPU will soon overheat and become defective thereby leading to considerable inconvenience and costs to the user. With the increasing popularity of laptop and notebook computers nowadays a problem arises in that there is insufficient space within these slim device to house an effective fin array and fan.

[0006] A significant drawback of current fin arrays is that the size thereof necessary to effectively disperse the heat is in fact too large for the casing of the computer. The flanges are necessarily large in order to effectively disperse the heat from the CPU.

[0007] To overcome the shortcomings, the present invention provides a compact and efficient heat sink module to mitigate and obviate the aforementioned problems.

[0008] The objective of the present invention is to provide a compact and effective heat sink module for installing in a notebook computer.

[0009] Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a perspective view of a first embodiment of the compact heat sink module in accordance with the present invention;

[0011] FIG. 2 is a perspective view of a second embodiment of the compact heat sink module in accordance with the present invention;

[0012] FIG. 3 is a top view of the first embodiment of the compact heat sink module in accordance with the present invention; and

[0013] FIG. 4 is a schematic view of the first embodiment of the compact heat sink module in accordance with the present invention.

[0014] With reference to FIG. 1, a first embodiment of a compact heat sink module (1) is shown. The heat sink module (1) connected separably on a CPU (not shown) includes a base (10), and a body (20) connected on the base (10) for connecting separably. A plurality of tongs (100) corresponding to the body (20) are formed on a top surface of the base (10) to fix the body (20) of the heat sink module (1) on the base (10).

[0015] The body (20) comprises an assembling device (21) fixed on the base (10) by attachment with the tongs (100), a conducting block (22) connected to the assembling device (20) for separably connecting to the CPU (not shown), at least one conductor (23) connected to the assembling device (21) for conducting heat from conducting block (22), and a fan (30) mounted to a center position of the base (10). The assembling device (21) is formed as a metal frame with two ends close to each other for connecting with the conductors (23) and the conducting block (22). The electric fan (30) is surrounded by the conductors (23) and the conducting block (22). The conducting block (22) includes an upper portion (220) and a lower portion (221) separable from the upper portion (220) whereby the conducting block (22) is able to be easily mounted on the assembling device (21). Each conductor (23) comprises a plurality of conducting plates (231) stacked together. Each conducting plate (231) is U shaped, and when stacked together a gap (232) is defined between the adjacent conducting plates (231) to easily disperse heat from the conductor (23). A through hole (233) is defined in the center of each conducting plate (231) whereby the assembling device (21) can extend through the conductors (23). At least one connector (301) is formed on a bottom of the fan (30) to secure the fan (30) to the base (10).

[0016] Referring to FIG. 2, a second embodiment of the heat sink module (1a) is shown wherein the difference between the assembling device (21) of the first embodiment and an assembling device (21a) of the second embodiment is that the assembling device (21a) is complete metal ring.

[0017] With reference to FIG. 3, a top view of the first embodiment of the heat sink module (1) is shown. A surface of the upper portion (220) connects to a CPU (not shown) for dissipating heat from the CPU, and then the heat from the conducting block (22) is conducted through the assembler device (21) to each conductor (23). As the fan (30) is surrounded by the assembling device (21), when the fan (30) operates air is sequentially drawn from an exterior of a computer casing in which the CPU is housed, through the conductors (23) and around the conductor block (22), and thus each conductor (23) carries heat from conducting block (22) away. More particularly, the plurality of gaps (232) define a broad heat exchange space of the conductor (23) and an standing arrangement of the gaps is in accordance with a direction of a vortex caused by the fan (30), as shown FIG. 4.

[0018] As per the above description, the assembled elements of the heat sink are particularly compact and of a low profile so that the heat sink module is suitable for installation in a notebook computer.

[0019] Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.