High current capacity socket with side contacts

[0002] 1. Field of the Invention

[0003] The present invention is generally related to a high current capacity socket, and more particular to a high current capacity socket with side contacts fixed on side walls of the socket.

[0004] 2. Description of the related art

[0005] High current capacity socket is used to transmit signals and carry current between a printed circuit board and an integrated circuit package. Such a high current capacity socket for receiving an integrated circuit package includes an insulative base defining a number of passageways therein and corresponding terminals received in the passageways respectively. The integrated circuit package has a plurality of pins extending from the integrated circuit package downwardly and received into the passageways to engage with the terminals. Pins to transmit the signals and pins to carry current and also a number of grounding pins are all mounted on the integrated circuit package. Accordingly, the passageways in the base of the socket must receive all the pins. A related art is shown in FIG. 8, a conventional CPU socket 6 for receiving a CPU 7 includes an insulative base 61 defining a number of passageways 611 and a plurality of terminals 63 received in the passageways 611 wherein the terminals 63 involve signal terminals, current terminals and grounding terminals. This will inevitably enlarge size of the CPU 7, thus, size of the CPU socket 6 should be enlarged accordingly. As a result, manufacture of the socket will be more difficult and the socket will occupy more space on a circuit board.

[0006] Hence, an improved high capacity socket is required to overcome the disadvantages of the prior art.

[0007] Therefore, an object of the present invention is to provide a high current capacity socket having side contacts fixed on a sidewall of the socket.

[0008] Another object of the present invention is to provide a high current capacity socket having side contacts to transmit current and grounding of the socket.

[0009] To achieve the above-mentioned objects, a high current capacity socket to receive an integrated circuit package having a number of pins extending downwardly thereof comprises a base and a number of side contacts. The base has a bottom plate, a number of passageways defined on the bottom plate, a sidewall extending upwardly from the bottom plate, a receiving room defined in the center of the bottom plate for receiving the integrated circuit package and a number of terminals received in the passageways. The side contacts are secured to the sidewall for engaging with the conductive spots of the integrated circuit package. Each of the side contacts has a connecting portion, a number of finger-like arms and a number of solder pads corresponding to the arms. The arms each have a dimple thereon. The integrated circuit package has an insulative housing. A number of circuit paths are formed in the insulative housing electrically engaging with a number of pins and a chip-module packaged in the insulative housing. The pins extend vertically from the integrated circuit package for inserting into the passageways. Some of the circuit paths exposed at a side of the insulative housing and form conductive spots. When the integrated circuit package is received into the receiving room of the bottom plate, the pins of the integrated circuit package will be inserted into the passageways to engage with the terminals. The dimples of the side contacts engage with the conductive spots that are exposed out of the insulative housing. In another embodiment, the base has another sidewall extending upwardly from the bottom plate of the base opposite to the one sidewall.

[0010] Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.

[0011] FIG. 1 is an exploded view of a high current capacity socket in accordance with the present invention;

[0012] FIG. 2 shows a side contact in accordance with the present invention;

[0013] FIG. 3 an perspective view of the high current capacity socket in accordance with the present invention;

[0014] FIG. 4 is a cross section of the high current capacity socket in accordance with the present invention; and

[0015] FIG. 5 is a view showing the staggered arrangement of current contacts and grounding contacts on the same side of an integrated circuit package having the same height for engaging with corresponding conductive spots in accordance with the first embodiment of the present invention.

[0016] FIG. 6 is a view showing the arrangement of the current contacts on one side and the grounding contacts on the other side of the integrated circuit package in accordance with a second embodiment of the present invention.

[0017] FIG. 7 is a view showing that the current contacts and the grounding contacts have different height for engaging with corresponding conductive spot in accordance with a third embodiment of the present invention.

[0018] FIG. 8 is a cross sectional view of a prior art high current capacity socket.

[0019] Referring to FIG. 1, a high current capacity socket 1 in accordance with the present invention includes a base 10 and a number of side contacts 20. The base 10 has a bottom plate 100 and a pair of sidewalls 101 extending upwardly from opposite sides of the bottom plate 10. A number of passageways 102 are defined in the bottom plate 10 and a number of terminals 11 (shown in FIG. 4) are received in corresponding passageways 102. The sidewalls 101 and the bottom plate 100 define a receiving room 104 to receive an integrated circuit package 30 having a plurality of pins 301 extending downwardly.

[0020] Referring to FIG. 2, each of the side contact 102 has a connecting portion 201, three finger-like arms 202 extending upwardly from the connecting portion 201 and three solder pads 203 corresponding with the arms 202. Each of the arms 202 defines a dimple 2021 at a top end thereof. A pair of barbs 2010 are defined on opposite sides of the connecting portion 201 to secure the side contacts 20 in the sidewalls 101 of the base 10.

[0021] Referring to FIGS. 1, 3 and 4, the integrated circuit package 30 to be received in the receiving room 104 includes an insulative housing 300, a chip-module (not shown) and a number of circuit paths (not shown) packaged in the insulative housing 300. A number of conductive spots 302 expose at sides of the insulative housing 300 to electrically connect with the dimples 2021 of the side contacts 20. The chip-module and the number of conductive spots 302 are electrically connected via the number of circuit paths packaged in the insulative housing 300. The integrated circuit package 30 is inserted in the receiving room 104 and the pins 301 are received in the passageways 102 to connect with terminals 11. By this arrangement, the conductive spots 302 are ensured to engage with the dimples 2021 of the side contacts 20. Each of the solder pads 203 has a solder ball 40 thereunder to transmit current to the printed circuit board 50 or for grounding purpose.

[0022] There are several ways of setting the side contacts 20 on the sides of the integrated circuit package 30. FIG. 5 shows the first embodiment of the present invention in which the side contact 20 includes current contact 20aand grounding contact 20bof the same height that are staggered on the same side of the integrated circuit package 30. Referring to FIG. 6, the current contacts 20aand grounding contacts 20bcan also be provided on different sides of the sidewalls 101 of the base 10.

[0023] Referring to FIG. 7, the side contacts 20 have different height to differentiate the current contacts 20afrom the grounding contacts 20b. The current contacts 20ahave a smaller height than the grounding contacts 20band are staggered on the same side of the integrated circuit package 30.

[0024] It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.