Heat sink system

[0002] This is a Divisional Application of U.S. application Ser. No. 09/364,322, filed on Jul. 29, 1999, which is now pending.

[0003] 1. Field of the Invention

[0004] The present invention relates to a heat sink system, and particularly to a heat sink system having a fan.

[0005] 2. Description of Prior Art

[0006] As computer technology continues to advance, central processing units and chipsets in computers have faster operational speeds and larger functional capabilities. Heat produced within a computer enclosure increases greatly due to the increase in the operational speed. It is desirable to dissipate the heat quickly, for example using a heat sink system assembled within the computer enclosure, so that the computer chips operate in their normal temperature range. This will assure the quality of data operation, storage and transfer.

[0007] A conventional heat sink system includes a heat sink and a fan mounted on the chip. The heat produced by the chip is first transferred to the heat sink attached to the chip, and is then dissipated by the fan mounted on the heat sink. As chips get faster and produce more heat, the size of the heat sink must be correspondingly increased. However, increasing the size of the heat sink is not in line with the trend toward miniaturization in the computer industry. Furthermore, the surface area of a heat sink is limited by practical consideration in manufacturing technology.

[0008] Accordingly, an object of the present invention is to provide a heat sink system for dissipating heat away from a heat generating element.

[0009] In a preferred embodiment of the present invention, a heat sink system, assembled within a computer enclosure for introducing ambient air though an opening of the computer enclosure to dissipate heat away from a heat generating element, comprises a fan duct, a heat pipe and a fan. The fan duct has a surface coupled to the computer enclosure near the opening. The fan duct defines a first hole in communication with the opening and a second hole substantially within an interior of the computer enclosure. The heat pipe is attached and connected between the heat generating element and the fan duct. The fan is assembled within the first hole of the fan duct.

[0010] Other objects and advantages of the present invention will be understood from the following description of a heat sink system according to preferred embodiments of the present invention shown in the accompanying drawings, in which:

[0011] FIG. 1 is a perspective view of a heat sink system embodying the concepts of the present invention in accordance with a first embodiment;

[0012] FIG. 2 is a perspective view of a second embodiment of a heat sink system in accordance with the present invention; and

[0013] FIG. 3 is a perspective view of a third embodiment of a heat sink system in accordance with the present invention.

[0014] For facilitating understanding, like components are designated by like reference numerals throughout the various embodiments shown in the attached drawing figures.

[0015] FIG. 1 shows a heat sink system of the present invention comprising a heat pipe 10, a fan duct 20 and a fan 30. The fan duct 20 is a square hollow metallic shell attached to a computer enclosure 40 forming an opening (not shown). A surface of the fan duct 20 coupled to the computer enclosure 40 defines a first hole (not shown) in communication with the opening of the computer enclosure thereby communicating with an exterior of the computer enclosure 40. A second hole 22 is defined in a surface opposite the first hole and in communication with an interior of the computer enclosure 40. The fan 30 is assembled within the first hole for aspirating cold air from the exterior into the fan duct 20. The heat pipe 10 includes a main body 12 and two attaching portions 14 at opposite ends of the main body 12. The two attaching portions 14 are attached to a heat generating element 60 (such as a chip) and the fan duct 20, respectively. Working fluid in a liquid state at a nonoperating temperature, such as water, is filled within the main body 12.

[0016] Thus, heat can be conducted away from the heat generating element 60 toward the fan duct 20 due to convection of the liquid and due to the liquid changing to a gaseous state. Cold air is aspirated from the exterior through the first hole and the fan duct 20 and out of the second hole 22 whereby heat accumulating in the fan duct 20 is dissipated. Since the heat pipe 10 has a high conductibility, since the fan duct 20 has a large surface area and since the fan 30 aspirates cold air for enhancing convection, the heat sink system of the present invention provides beneficial heat dissipation qualities.

[0017] Referring to FIG. 2, the heat sink system of a second embodiment of the present invention includes a heat pipe 10, a fan duct 20, a fan 30 and a computer enclosure 40. The fan duct 20 is a square hollow plastic shell having a side surface attached to the computer enclosure 40 having an opening (not shown). The side surface of the fan duct 20 defines a first hole 24 in communication with the opening of the computer enclosure 40 thereby communicating with an exterior of the computer enclosure 40. A second hole 22 is defined in a top surface of the fan duct 20 and in communication with an interior of the computer enclosure 40. The fan 30 is attached to the top surface of the fan duct 20 and engages with the second hole 22 for aspirating cold air from the exterior through the fan duct 20 to the interior. The heat pipe 10 includes a main body 12 and two attaching portions 14 at both ends of the main body 12. The two attaching portions 14 are attached to a heat generating element 60 (such as a chipset) and the computer enclosure 40 at a position proximate the fan 30, respectively. Working fluid in a liquid state at a nonoperating temperature, such as water, is filled within the main body 12.

[0018] Thus, heat can be conducted away from the heat generating element 60 toward the computer enclosure 40 due to convection of the liquid and the liquid changing to a gaseous state. The cold air is aspirated from the first hole 24 through the fan duct 20 and out of the second hole 22. The cold air then exits the fan 30 and directly strikes the computer enclosure 40 whereby heat accumulating on the computer enclosure 40 is dissipated. Furthermore, the computer enclosure 40 having a large surface area promotes dissipation of heat to the exterior.

[0019] Referring to FIG. 3, the heat sink system of a third embodiment of the present invention includes a heat pipe 10, a fan duct 20, a fan 30, a computer enclosure 40 and a folded fin 50. The fan duct 20 is a square hollow plastic shell having a side surface attached to the computer enclosure 40 forming an opening (not shown). The side surface of the fan duct 20 defines a first hole 24 in communication with the opening of the computer enclosure 40 thereby communicating with an exterior of the computer enclosure 40. A second hole 22 is defined in a top surface and in communication with an interior of the computer enclosure 40. The fan 30 is assembled in the second hole 22 for aspirating cold air from the exterior through the fan duct 20 and into the interior. The folded fin 50 bent from a metallic plate in the shape of a waveform is attached to the computer enclosure 40 facing the fan 30. The heat pipe 10 includes a main body 12 and two attaching portions 14 at opposite ends of the main body 12. The two attaching portions 14 are attached to a heat generating element 60 (such as a chip) and the folded fin 50, respectively. Working fluid in a liquid state at a nonoperating temperature, such as water, is filled within the main body 12.

[0020] Thus, heat can be conducted from a heat generating element 60 toward the folded fin 50 and the computer enclosure 40 due to convection of the liquid and the liquid changing to a gaseous state. Cold air is aspirated from the first hole 24 through the fan duct 20 and toward the computer enclosure 40 whereby heat accumulated on the folded fin 50 having a large surface area and the computer enclosure 40 is dissipated. Furthermore, the computer enclosure 40 having a large surface area promotes quick dissipation of the heat to the exterior.

[0021] It is understood that the invention may be embodied in other specific forms without departing from the spirit of the central characteristics thereof. Thus, the present examples and embodiments are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.