Fiber optic connector with micro-alignable sensing fiber and associated fabrication method

[0003] The present invention relates generally to fiber optic connectors and associated fabrication methods and, more particularly, to fiber optic connectors especially useful for making precisely aligned optical connections between embedded optical fibers at a structural splice in a composite structure.

[0004] Fiber optic connectors are commonly employed to align and to interconnect one or more optical fibers with a variety of optical devices or with other optical fibers. For example, fiber optic connectors can be mounted on end portions of a pair of fiber optic cables, each of which include a number of optical fibers. The optical fibers of the fiber optical cables can, for example, transmit data or control signals between various remote devices, such as sensors or actuators, and a central control computer, such as a flight controller of an aircraft. The fiber optic connectors can then be interconnected such that the optical fibers of a first fiber optic cable are aligned with the optical fibers of a second fiber optic cable.

[0005] In order to efficiently transmit signals between optical fibers, the fiber optic connectors must precisely align the individual optical fibers such that the optical signals transmitted therethrough are efficiently coupled from fiber to fiber. Such alignment is particularly essential in connecting single mode optical fibers which generally have a light transmitting core of approximately 2-10 micrometers in diameter and which must be precisely aligned with the light-transmitting core of another single mode optical fiber of similar size in order to efficiently transmit optical signals therethrough.

[0006] In order to effectively couple optical signals from fiber to fiber, a fiber optic connector must maintain the precise alignment of the individual optical fibers in a predetermined manner such that the optical fibers will remain aligned as the fiber optic connector is mated with another fiber optic connector or with other types of optical device. Therefore, a variety of methods have been developed to align individual optical fibers prior to sealing the optical fibers within the fiber optic connector.

[0007] For instance, U.S. Pat. No. 5,606,635 teaches an improved fiber optic connector and associated fabrication method which includes a substrate and at least one microactuator mounted on the substrate and at least one microactuator mounted on the substrate and adapted for relative movement therewith such that an optical fiber which is mounted to the microactuator can be precisely aligned. By precisely positioning the optical fibers, such as with respective lens elements (viz., graded index lens elements), the fiber optic connector of the '635 patent efficiently couples the aligned optical fibers, such as single mode optical fibers, with other optical devices, including other optical fibers. Additionally, the microactuator used in the fiber optic connector described in the '635 patent is controllably positioned relative to the substrate so as to precisely align the optical fiber mounted thereto after the connector housing has been hermetically sealed so as to further enhance the precision with which the optical fibers can be aligned. The positioning means described in the '635 patent for the microactuators is a bimorphic actuator formed of two different materials that respond differently to electrical stimuli such that a deflection created in the bimorphic actuator by electrical stimuli can be used to controllably position a carrier body to which an optical fiber is fixed. Two or three bimorphic actuators are described as usable in the '635 patent such that the carrier holding the optical fiber can be controllably positioned in first, second or third orthogonal directions.

[0008] While the fiber optic connector of U.S. Pat. No. 5,606,635 provides a significant improvement over previous active fiber micro-aligner actuator technologies, further improvements are nonetheless desired in the fiber optic connector field. For example, fiber optic circuits and sensors that are embedded in composite structures, such as fiber-reinforced plastics (e.g., a cured prepreg of carbon fiber reinforced epoxy) are desirable over other types of sensors, e.g., surface attached-optical fibers or metallic wires or strain gages, for a number of reasons. Namely, embedded fiber optic circuits and sensors have many benefits over alternative types of sensors, such as well-tolerating the composite manufacturing process; they do not degrade the composite strength; they are EMI and EMP insensitive; they are non-magnetic and are transparent to radar; they provide increased sensitivity as compared to conventional strain gauges; the embedded optical sensors are multiplexable and, therefore, require fewer egress points; and they are relatively lightweight.

[0009] In implementation, however, the embedded fiber-to-embedded fiber coupling first requires the fiber to be egressed from the composite structure, and it secondly requires special protection from being sheared off during the manufacturing process. Clean trimmed fiber optics eliminate this vulnerability but require micron tolerances, which are too large. Previously, hand alignment of each individual fiber at the component's edge egress has been used. However, such a manual approach makes it infeasible to correct for tolerance errors in a fielded system.

[0010] As can be appreciated, inadequate fiber optic coupling has been a barrier preventing single mode and multimode fiber optic sensors systems from being incorporated into composite structures, i.e., structures having embedded fiber optics. This dilemma is driving the use of alternative sensor technologies and less desirable surface attachment processes. For instance, surface attached optical fibers are vulnerable to damage and cannot measure important strains and temperatures unlike the embedded case.

[0011] Therefore, prior to the present invention, a need has existed for an optical connector which is capable of providing optical coupling between two structurally spliced machined composite components in which there are edge egressed embedded single mode fiber optics.

[0012] The invention meets the above needs and overcomes the deficiencies of the prior art by providing an improved fiber optic connector providing precise optical transmission between optical fibers and associated fabrication methods.

[0013] The inventive fiber optic connector has a micro-alignable sensing coupling fiber located between a pair of collimating lens arranged within a connector housing as employed to couple optical fibers. More specifically, the inventive connector has a connector housing comprising a base side, first and second sidewalls upstanding from the base side that are spaced apart in relation to each other, and the first sidewall defining at least one aperture through which optical signals are transmitted into the housing from an input optical fiber and the second sidewall defining at least one aperture through which optical signals are transmitted out of the housing to an output optical fiber, respectively, where the optical fibers are located in fixed positions outside the housing. A pair of optical lens elements are contained within the housing which collimate optical signals transmitted between the respective optical fibers, and the lens elements have inner end faces facing each other in spaced apart relation and outer end faces facing a respective end of one of the optical fibers. A sensing optical fiber is co-axially positioned between the pair of optical lens elements inside the housing where the sensing fiber comprises a discrete length of optical fiber comprising a longitudinal central portion and input and output terminal ends, wherein each terminal end of the sensing fiber is independently micropositionable in three orthogonal directions relative to one of the optical lens elements. A pair of micro-aligners are contained within the housing and attached to the housing, wherein each micro-aligner holds one of the respective terminal ends of the sensing fiber, and each micro-aligner induces movement to the associated terminal end of the sensing fiber in a set of three orthogonal directions to controllably position each terminal end of the sensing fiber relative to a respective optical lens. A photodetector subsystem is provided capable of independently assessing the optical alignment of each terminal end of the sensing fiber relative to either the associated input or output fiber, respectively, and this information is useable to direct the movement forces being induced by the micro-aligners on the terminal ends of the sensing fiber.

[0014] With this arrangement, the intervening sensing fiber can be used to transmit optical signals between the input and output fibers of respective separate composite structures to be spliced in a highly efficient, aligned manner without the need to bring the optical fibers per se into close proximity to each other. By precisely optically aligning the sensing fiber with the optical fibers without requiring direct physical contact and proximity, the fiber optic connector of the present invention can efficiently couple the optical signals carried by the input and output optical fibers, such as single mode optical fibers or multimode fiber optic sensors systems, between separate composite structures, i.e., structures having embedded fiber optics. In addition, the micro-aligner also can be controllably positioned so as to permit precise alignments of the fiber ends of the sensing fiber after the connector housing containing the lens has been hermetically sealed so as to further enhance the precision with which the optical fibers can be aligned and permit in-the-field implementation. Thus, the micro-aligner can be used to precisely position the sensing fiber such that the optical signals being transmitted between the input and output fibers located outside the connector can be collimated.

[0015] One suitable type of micro-aligner that can be used to precisely position the fiber ends of the sensing fiber in the practice of this invention, includes a fiber holding means for receiving one of the terminal ends of the sensing fiber, in which the held terminal end of the sensing fiber is independently movable in any of three orthogonal directions relative to the associated optical lens. One exemplary micro-aligner useful for accomplishing this function has a carrier upon which the fiber terminal end is held, and the carrier is provided with first and second in-plane (viz., x-axis and y-axis) microactuators for inducing in-plane movement of the carrier and held optical fiber in respective first and second orthogonal directions along the surface plane of the carrier, and a third microactuator for inducing out-of-plane (viz., z-axis) movement of the carrier and held optical fiber in a third direction that is orthogonal to said first and second orthogonal directions. The carrier is positioned within a recess of a stationary alignment housing as defined by a base and upright sidewalls. The carrier includes first and second biasing means biased against sidewalls of the stationary alignment housing to thereby impose counter forces against which the respective first and second in-plane microactuators on the carrier must act and overcome (as well as the stiction/friction associated with moving the carrier across the surface of the base, the forces associated with the wire bonds and all other forces typically encountered in aligning and bonding optical fibers) to induce in-plane movement of the carrier relative to the optical device. Backstops are provided on the carrier to limit the return movement of the in-plane microactuators. When the first and second (in-plane) microactuators are at rest, the counterforce biasing means establish an equilibrium in-plane reference position of the unitary movable carrier in a corner of alignment housing. This three-axes active lens micro-aligner enables the precise alignment of the optical signals being transmitted between the optical lenses. This three axes active micro-aligner as used in the fiber optic connector enables the precise alignment of an sensing fiber with the optical lenses located in the connector housing.

[0016] In one advantageous embodiment, the inventive fiber optic connector is used for optical coupling of optical fibers in two spliced composite parts. For instance, the inventive connector can be used to couple an array of embedded edge trimmed single mode fiber optics in the primary structure to an array of single mode fiber optics in an attached sub-structure. More specifically, the inventive fiber optic connector is capable of providing optical coupling between two structurally spliced machined composite components in which there are edge egressed embedded single mode fiber optics. The inventive fiber optic connector permits rapid mating of component edges, allowing the rapid misalignment to be eliminated by the micro-aligners located inside the connector housing. The inventive fiber optic connector enables affordable optical connection with sub-micron alignment tolerances to be made after the embedded fiber optics are machined off at the egress point during a standard composite trimming process.

[0017] This invention makes also it possible to fabricate modular, composite structures that have integrated microelectronic devices and optical circuitry. The modularity permits the fabrication of a common primary structure and then using the quick release connectors and interchangeable devices tailor the structure to meet any unique mission objectives.

[0018] Also, this invention permits the use of embedded fiber optic sensors and signal conduits in fieldable systems. The fiber optic connector of the present invention makes correction for tolerance errors possible for a fielded system.

[0019] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which a preferred embodiment of the invention is shown. Like numbers refer to like elements throughout.

[0020] FIG. 1 is a perspective view of the fiber optic connector of the present invention, and as partially cut-away for the sake of clarity, being used to optically couple optical fibers at the edges of two composite structural parts.

[0021] FIG. 2 is a schematic representation of the fiber optic connector shown in FIG. 1 in which only a portion of the respective components of the connector are illustrated for the sake of clarity.

[0022] FIG. 3 is a schematic representation of the optical relationship of the optical fibers being coupled as well as the sensing fiber and the GRIN lens components of the fiber optic connector shown in FIG. 1.

[0023] FIG. 4A is an enlarged perspective view of a micro-aligner used inside the connector housing in accordance with one embodiment of the invention.

[0024] FIG. 4B is another enlarged perspective view of the micro-aligner according to FIG. 4A showing including a cut-away view of a portion of the alignment housing structure thereof and without the lens element illustrated for the sake of clarity.

[0025] FIG. 5 is a perspective view of a thermal arch beam actuator used as the in-plane (x-axis) actuator in the micro-aligner shown in FIG. 4A.

[0026] FIG. 6A is a cross section of the z-axis bimorphic microactuator used in the micro-aligner subsystem shown in FIG. 4A taken along line A-A′ of FIG. 4B when the z-axis actuator is at rest.

[0027] FIG. 6B is a cross section of the z-axis bimorphic microactuator used in the micro-aligner subsystem shown in FIG. 6A taken along line A-A′ of FIG. 6B when the z-axis actuator is activated.

[0028] FIG. 7 is a graphical representation showing the coupling efficiency of a fiber optic connector according to FIG. 1 with the coupling factor value achieved plotted as a function of the amount of initial fiber offset.

[0029] FIG. 8 is a detailed schematic representation of the optical relationship of the sensing fiber and photodetection system of the fiber optic connector of FIG. 1.

[0030] FIG. 9 is a schematic representing an optical measuring system for analyzing the alignment of the sensing fiber relative to the input and output fibers being coupled by the inventive connector shown in FIG. 1.

[0031] FIGS. 10 and 11 are schematics representing alternative optical measuring systems from FIG. 9 for analyzing the alignment of the sensing fiber relative to the input and output fibers being coupled by the inventive connector shown in FIG. 1.

[0032] Corresponding reference characters indicate corresponding parts throughout the drawings. The drawings should not be construed as necessarily being drawn to scale.

[0033] Referring now to the figures, and particularly to FIG. 1, a fiber optic connector 100 has an exterior structure formed as a housing 101 including a base side 104 and opposite sidewalls 102 and 103 upstanding from the base side 104. While the connector housing 101 can be comprised of a variety of materials, the connector housing of one embodiment is comprised of metal, such as stainless steel, and, in a more specific embodiment, is comprised of KOVAR™ brand stainless steel. Preferably, the housing 101 is comprised of a material which has a coefficient of thermal expansion which closely matches the coefficient of thermal expansion of the lens elements 105 and 106.

[0034] Fiber optics are embedded in composite structures 111 and 112 bordering the fiber optic connector 100 for which optical coupling will be effected. The sidewalls 102 and 103 of the connector housing 101 define apertures into which the ends 108 and 107, respectively, of lens elements 105 and 106, respectively, are pre-installed and fixedly attached, such as by heat fusion or adhesive bonding. The lenses 105 and 106, in conjunction with intervening sensing fiber 121, permit optical signal transmission between the exposed input optical fiber 109 extending from the edge surface 111′ of first composite structure 111 into the interior of the housing 101 and from the interior of the housing 101 back out to exposed output fiber 110 extending into edge surface 112′ of second composite structure 112. As appreciated, FIG. 1 only shows edge portions of the composite structures 111 and 112 as the rest of the structures thereof do not interact directly with the fiber optic connector 100 of interest.

[0035] The connector 100 is adhesively attached to the composite structures 111 and 112 prior to executing alignment of the lenses 105 and 106. The input optical fiber 109 and an output optical fiber 110 have exposed terminal ends 109′ and 110′ (see FIG. 2), respectively, that are brought into close proximity with the with the outer facing surfaces 105″ and 106″ of lenses 105 and 106, respectively, and then they are fixed in position, preferably flush (i.e., in direct contact), in relation to the windows of housing 101 by use of conventional adhesives or solders used for opto-electronic packaging or the same type of resin that is used in the composite structures 111 and 112. The bond of the input and output fibers 109 and 110 to the ends 107 and 108 of lenses 105 and 106, respectively, can be effected such as by using a transparent epoxy resin of a conventional nature to opto-electronic packaging. The optical fibers, both input and output, preferably are individually aligned with a respective aperture/window defined in the adjoining sidewall of the connector housing 101. While FIG. 1 illustrates four input optical fibers to be aligned with four output optical fibers via the fiber optic connector 100, it will be appreciated that the invention is applicable to the coupling of a single pair of fibers or any plural number of fiber pairs within practical reason.

[0036] A pair of refractive lens elements 105 and 106 are disposed within the housing 101 in a co-axial orientation to each other. The lenses 105 and 106 collimate optical signals transmitted via the respective optical fibers 109 and 110. The lens elements 105 and 106 have end faces 105′ and 106′ respectively (see FIG. 2) facing each other in spaced apart relation, and end faces 105″ and 106″ (see FIG. 2), respectively, facing a respective end of one of the optical fibers 109 and 110. The lens elements 105 and 106 are fixedly attached to housing base 104 so that lenses 105 and 106 are stationary in position within the connector housing 101. In one preferred embodiment, the lens elements disposed within the connector housing are first and second graded refractive index lenses, such as graded index (GRIN) lens elements.

[0037] Optical coupling of fibers 109 and 110 is achieved by way of micro-alignment of an intermediate segment of coupling or sensing fiber 121 arranged within the housing 101 at a location between the lenses 105 and 106. The sensing optical fiber 121 is co-axially positioned between the pair of optical lens elements 105 and 106 inside the housing 101. A pair of three-dimensional micro-aligners 10 and 10′ are contained within the housing 101 and attached to the base 104 of the housing for the purpose of independently micro-aligning the opposite distal ends of the sensing fiber 121 relative to closest optical lens 105 or 106. Although one preferred design of micro-aligners 10 and 10′ is exemplified herein, it will be understood that the micro-aligners 10 and 10′ can be any 3-axis microaligner used or useful for aligning optical fibers in three orthogonal directions within submicron tolerances, such as the microaligner device described in U.S. Pat. No. 5,602,955, which teachings are incorporated herein by reference. Also, for purposes of simplifying the illustration of the overall connector device in FIG. 1, details of the micro-aligners 10 and 10′ subcomponents are omitted, which details are discussed in great detail in connection with FIGS. 4A-4B herein.

[0038] As schematically shown in FIG. 2, the incident light from input fiber 109 is directed into a first GRIN lens 105, by directly bonding the input fiber 109 to the lens 105. The output of the first GRIN lens 105 is focused onto the input terminal end 122 of sensing fiber 121, then passes through main or central section 124 until emitted at the far terminal end 123 of sensing fiber 121 where it then propagates onto the second GRIN lens 106. The sensing fiber 121 is optically coupled to a photo detector 119 using optical coupling material 120. Micro-aligners 10 and 10′ are implemented at each respective sensing fiber end 122 and 123, respectively, of the sensing fiber 121 to correct for any positional errors introduced previously during bonding of the fibers 109 and 110 to the lenses 105 and 106, respectively. That is, as shown in FIG. 2, each micro-aligner 10 and 10′ holds one of the respective terminal ends 122 and 123 of the sensing fiber 121, and each micro-aligner 10 and 10′ induces movement to the associated terminal end of the sensing fiber in a set of three orthogonal directions to controllably position each terminal end of the sensing fiber relative to a respective optical lens 105 or 106. More structural details on micro-aligners 10 and 10′ are set forth below. As will be appreciated, micro-aligners 10 and 10′ are not drawn to scale in FIG. 2 in order to better show the optical circuit.

[0039] As indicated in FIG. 2, the sensing fiber 121 comprises a discrete length of optical fiber comprising a longitudinal central or main portion 124 and input and output terminal ends 122 and 123, respectively, wherein each terminal end of the sensing fiber 121 is independently micropositionable in three orthogonal directions relative to one of the optical lens elements by use of one of micro-aligners 10 and 10′ described in greater detail below. The sensing fiber can be very short in length as long as it is long enough to have sufficient flexibility such that its ends can be translated by the micro-aligners 10, 10′. For example, the sensing fiber can be about 2 cm long for use in combination with the micro-aligners as exemplified herein. A photodetector 119 underlies the central portion 124 of the sensing fiber 121 and it is optically coupled to the central portion 124 of the sensing fiber 121 with coupling material 120. The coupling material 120 is an optical indexing material that applied in a flowable state such that it flows intimately around at least the lower circumferential section of sense fiber 121 that faces photodetector 119 to encase such section, and coupling material also contacts photodetector 119 to provide a medium therebetween, and then the coupling material 120 is solidified in situ. For example, the coupling material 120 can be a hemispherical glob of a U.V.-curable, transparent epoxy having a radius of about 1 mm where used with an approximately 2 cm long sensing fiber 121. The hardened coupling material 120 must have the capability to transmit light that is being internally reflected within the sensing fiber from the sense fiber 121 to the photodetector 119.

[0040] One method for determining whether the sensing fiber 121 is precisely aligned within the optical circuit encompassing fiber 109 to lens 105 to sensing fiber 121 to lens 106 to fiber 110, is illustrated in FIG. 8. Light travels from right to left in FIG. 8. The light, L1 or L1′, comes from fiber 109 and passes through lens 105. Actuator 10 (not drawn to scale) moves the end 122 of sensing fiber 121 using feedback from photodetector 119. The optical fiber segment 121 has a conventional construction involving a cladding 121asurrounding a core 121b, and the fiber segment 121 is a total internal reflector of light at the air-glass interface along its circumferential surface such that no loss of light occurs at that interface. When the fiber ends 122 and 123 are both properly aligned by their respective micro-aligners 10 and 10′, the input light L1 will pass through the core 121b(indicated by dashed lines in the figure) and exit at the opposite end of the fiber with no loss. If, on the other hand, the end 122 of fiber 121 receiving the input light is not yet in precise alignment, then input light L1′ instead will enter the cladding portion of fiber 121 where it will be reflected within the fiber 121 until reaches the interface of the fiber 121 at middle section 124 where the light will escape from the cladding 121aand be transmitted into optically indexed matching material 120, e.g., a U.V.-cured epoxy of appropriately index matched optical properties. Once the reflected light L1′ enters coupling material 120, it will be conducted to photodetector 119 as indicated in FIG. 8. Therefore, the optimal alignment of end 122 of sensing fiber 121 with input fiber 109 can be determined as function of the light power detected at detector 119, viz., the light detected by detector 119 will be a minimum where end 122 of sensing fiber 121 is in best alignment with fiber 109 and lens 105. As will be appreciated, this protocol so far only resolves the alignment of fiber end 122 of sensing fiber 121, and the precision of the alignment of fiber end 123 of sensing fiber 121 still needs to be accomplished.

[0041] For example, after aligning fiber end 122 in the above manner, in order to determine the optimal alignment position for the opposite fiber end 123 of sensing fiber 121, the direction of light can be reversed to send input light from fiber 110 into fiber end 123 of sensing fiber 121, and in a similar manner as previously used to align opposite fiber end 122 as discussed above, and the light sensed at the photodetector 119 can be monitored to learn where the optimal alignment position is for fiber end 123. Alternatively, forward traveling light L1, as inputted from optical fiber 109 into fiber end 122, could be monitored directly at an opposite free end of optical fiber 110 (i.e., opposite to end 110′ bonded to lens face 106″, see FIG. 2). That is, and as illustrated in FIG. 9, a second photodetector 119′ located external to connector housing 101 could be optically coupled to an opposite remote end 110″ of the output fiber 110 that egresses composite structure 112 for purposes of aligning fiber end 123 of sensing fiber 121. The measurement taken by photodetector 119′ is then analyzed and processed using feedback control circuitry FC1 to move micro-aligner 10′ until fiber end 123 is properly positioned for optimal coupling to fiber 110. This provides an alternative mechanism for measuring the precision of the alignment being provided at the output side (i.e., fiber end 123) of the sensing fiber 121 as a function of the micro-alignments being induced by respective micro-aligner 10′.

[0042] However, if the light power being coupled into fiber 110 cannot be directly measured, e.g., because the remote end of fiber 110 is entirely embedded in composite structure 112, then the above approaches for aligning fiber end 123 will not be possible. In this regard, one of several other alternate light measuring schemes also could be used to align fiber end 123 of sensing fiber 121, as will be described below.

[0043] In one such scheme illustrated in FIG. 10, a measuring method can make use of optical time division reflectometry (OTDR) to discriminate a forward going pulse from a reverse going reflected pulse in sensing fiber 121. The forward going pulse is used to align fiber end 122 affixed to micro-aligner 10 in the manner described above using photodetector 119 and coupling material 120, and this light is launched from the fiber end 123 of sensing fiber 121 affixed to micro-aligner 10′ into lens element 106 and onto the optically polished end 110′ of fiber 110. The micro-aligner 10′ is dithered back and forth and up and down, viz., spiral and out, searching for a reflected pulse coming back into sensing fiber 121 which is detected by photodetector 119, indicating that light was successfully launched from fiber end 123 of sensing fiber 121 into the fiber 110′. The light can be reflected back by using a simple cleaved mirror M1 at the remote opposite end 110″ of fiber 110 where embedded in composite structure 112, and more light could be reflected back if this fiber end 110″ is coated with a metallic or dielectric high reflectance coating. As a time delay will be associated with reflected pulses from mirror M1 as compared to the forward going pulses, the photodetection system can be operated making use of OTDR so as to discriminate between any reflected light that might be associated with the forward pulses as differentiated from reverse going reflected pules.

[0044] In another scheme illustrated in FIG. 11, a light measuring method makes use of a directional fiber coupler 121′ and two photodetectors 119A and 119B arranged inside the connector housing 101. The photodetector 119A is optically coupled to optical fiber stem 124′ via an optically indexed matching material 120A, while photodetector 119B is optically coupled to optical fiber stem 124″ via an optically indexed matching material 120B. The stem 124′ carries reverse going transferred light to photodetector 119A that is obtained from light reflected from cleaved mirror M1 at the remote end 110″ of fiber 110, while the stem 124″ carries forward going transferred light to photodetector 119B which is being received from fiber 109, as indicated by the directional arrows in FIG. 10. The directional fiber coupler 121′ can be made by fusing two pieces of fiber optic together such that the desired amount of light, e.g., about 1%, is transferred from a primary carrier fiber to the either stem 124′ or 124″ of other fiber for analysis by photodetection. In this way, the sampled or transferred light can be used to assess the optical alignments being achieved at each fiber end 122 and 123. The beneficial aspect about the directional fiber coupler 121′ is that it can be used to preferentially split off the forward and reverse going light as between the first photodetector 119A and second photodetector 119B. In this configuration of FIG. 10, no OTDR will be needed which would require high speed circuitry. The directional coupler 121′ can be made by methods known in the art of fiber optics.

[0045] In the above manners, the fiber optic connector 100 of this invention provides independent alignment capability relative to each of the two ends 122 and 123 of the sensing fiber 121, enabling correction of tolerance errors at both the input fiber 109 and output fiber 110.

[0046] The terminal ends 122 and 123 of sensing fiber 121 can be aligned with the optical fibers 109 and 110 either prior to or following the hermetic sealing of the connector housing 101. The hermetic sealing of the housing 101 can be accomplished by affixing a cover plate thereto by conventional methods. In embodiments in which the ends of sensing fiber 121 are aligned prior to sealing the connector housing 101, such as during manufacturing, the ends of sensing fiber 121 can be aligned with respect to the respective optical fibers 109, 110 as described above, and, thereafter, the connector housing 101 can be sealed. For example, a lid 116 can be secured, such as by seam sealing, to the connector housing 101 following alignment of the ends of the sensing fiber 121. In addition, the relative positions of the ends of the sensing fiber, as supported by respective micro-aligners aligners 10 and 10′, can be fixed prior to sealing the connector housing 101, such as by activating a radiation-curable adhesive, such as an ultraviolet light-curable adhesive, mutually in contact with both an alignment frame (feature 17 in FIG. 4A, and described in detail below) of a micro-aligner 10 (or 10′) and the underlying fiber optic connector base side 104. The connector housing 101 can include a transparent window through which a laser or other appropriate light source can be directed so as to activate the adhesive or solder and bond the alignment frame of the micro-aligner 10 (or 10′) to the base side 104. As an alternative, the hermetically sealed connector housing 101 can include an additional lead which is electrically connected to the base side 104 in the vicinity of the heat-activatable adhesive such that the adhesive can be resistively heated and the alignment frame of the micro-aligner 10 (or 10′) can be thereby be bonded to the base side 104.

[0047] Alternatively, in embodiments in which the ends of the sensing fibers 121 are aligned after hermetically sealing the connector housing 101, the fiber optic connector 100 can also include a plurality of electrical pins (not shown) extending through the rear surface of the connector housing 101 to provide electrical access to each of the microactuators (i.e., features 15, 16 and 19 of FIG. 4A, discussed in greater detail below) of the micro-aligner 100. In particular, electrical leads can interconnect the pins with respective ones of the x-, y-, and z-axis microactuators, and, more particularly, with bonding pads disposed on the opposed end portions of each microactuator. Accordingly, by applying appropriate electrical stimuli to predetermined ones of the electrical pins, each optical lens 105, 106 can be individually positioned in first, second, and third orthogonal directions relative to the respective optical fiber 109 or 110 after the connector housing 101 has been hermetically sealed.

[0048] By transmitting predetermined optical signals through the optical fibers 109 and 110 and by detecting the resulting optical signals transmitted by the respective ends 122 and 123 of sensing fiber 121, the relative alignment of each optical fiber with its respective lens element can be determined. In order to obtain the maximum output power, the end surface of the optical fiber is preferably aligned at the focal point of the respective lens element. Thereafter, the relative positions of the ends of sensing fiber 121 can be fixed by bonding the alignment frame (feature 17 in FIG. 4A) to the base side 104 of the housing 101, such as by activating an adhesive mutually in contact with both the alignment frame and the base side in the manner described above.

[0049] Composite structures 111 and 112 in FIG. 1 can be a standard organic carbon composite structure fabricated with standard techniques, e.g., lay-up or fiber placement. Embedding an optical electrical flexcircuit simultaneously embeds the fiber optic (109, 110) and electrical conduit in the structure during the manufacturing process. The connector region shown in FIG. 1 is machined off and optically polished using standard polishing techniques suitable for optical surfaces. The fiber optic connector 100 is attached to the primary structure 111 making electrical connection to the power bus (not shown) and completing the electrical circuit for the remaining structure 112. The secondary structure 112 is keyed and attached to the primary structure 111. The fiber optic connector 100 is subsequently powered and the optical circuit is completed.

[0050] Referring to FIG. 4A, a preferred micro-aligner device 10 for use in this invention for providing independently controllable micro-positioning of a lens element 105 is shown in more detail. The micro-aligner 10 controllably positions lens element 105 held and supported therein to precisely align it with an input optical fiber 109 located fixed in position outside window 107 of the connector housing as described above (see FIGS. 1, 3). The micro-aligner 10 controllably positions the lens 105 to precisely align it with an associated optical fiber. The optical fiber 109 (FIG. 1) may be a single mode, multi-mode or polarization preserving optical fiber. In addition, the optical fibers may have a lensed facet or a cleaved end facet without deviating from the scope of the invention.

[0051] Micro-aligners 10 and 10′ have the same design for purposes of this invention, and only differ as to their position within the housing and thus the terminal end of the sensing fiber 121 to which they are respectively dedicated. Therefore, insofar as to design and construction, a reference herein to micro-aligner 10 will be understood to be equally applicable to micro-aligner 10′. Thus, the construction and operation described in connection with micro-aligner 10 and input terminal end 122 of sensing fiber 121 with reference to FIG. 4A is equally applicable to the arrangement of micro-aligner 10′ and output terminal end 123 of sensing fiber 121.

[0052] A micro-aligner (10, 10′) must include a fiber holding and supporting means for receiving a fiber end, and the micro-aligner must be able to manipulate the held fiber independently in any of three orthogonal directions (i.e., x-, y-, and z-axis directions) relative to the associated optical fiber (located outside the connector housing) within precise submicron tolerances, preferably within about 1.0 μm or less. The micro-aligner 10 must be small enough to easily fit within the housing enclosure 101, which housing can involve sizes of approximately 5×4×1 mm³, while still being robust and durable to tolerate in-the-field utilizations and handling and the like.

[0053] As shown in FIG. 4A, micro-aligner 10 has a carrier substrate 14 upon which its various components are fabricated. The end 122 of sensing fiber 121 is precisely attached in an optical groove 20 formed in carrier 14. The carrier substrate is a unitary body, and it rests on a base 9 of an alignment housing 17. The tip 122′ of input terminal end 122 of sensing fiber 121 preferably extends off the carrier 14 only an extremely small distance or is arranged with the end of the groove 20 at the side face of carrier 14 such that the end 122 of the fiber 121 is rectilinear and it does bend or arch from the carrier 14.

[0054] The alignment housing 17 of the micro-aligner 10 is a frame-like body disposed in fixed relation to optical fiber 121. The alignment housing 17 includes sidewalls 17′ upstanding from base 9 along four sides and can include openings in the sidewalls on two opposing sides of the alignment housing 17 to accommodate positioning of a fiber end 122 in groove 20. The size of the recess formed by the sidewalls 17′ is selected to slightly exceed the dimensions of the carrier 14 while being close enough to permit spring biasing to be created between the sidewalls of the alignment support structure and the carrier, as will be described in greater detail below. In a preferred embodiment, the alignment housing will include four upright sidewalls 4, 5, 6, and 7 arranged on base 9 such that a pair of parallel sidewalls is provided normal to each of the x-direction (i.e., walls 5, 7) and the y-direction (i.e., walls 4, 6) that together with base 9 define a recess 29 therein that will receive carrier 14 for reasons that will become apparent from the following descriptions.

[0055] The alignment housing 17 is preferably formed of a thermally conductive material to serve as a heat sink. In addition, the alignment support structure can also draw heat from the underside of the carrier 14. In one exemplary embodiment, the alignment support structure is comprised of a metallic material, such as copper or nickel. The alignment support structure can be a micromachined cavity or box formed by a variety of processes, such as by LIGA processing methods for making alignment structures, such as those described in U.S. Pat. No. 5,602,955, which teachings are incorporated herein by reference. In this way, the alignment housing 17 has the sidewalls 17′ and base 9 formed as an integral body.

[0056] The carrier 14 sits on the base 9 of the alignment housing structure 17 by virtue of gravity and the springs 21 and 22 which act to hold it in housing recess 29, and it is not bonded or otherwise attached thereto. Thus, carrier 14 is freely slidable over base 9 once any inter-frictional forces therebetween are overcome. In one preferred embodiment, substrate 14 comprises a layer of polished silicon. Other semiconductor materials that can be micromachined are also usable for substrate 14. The side length dimensions and thickness of carrier 14 can be relatively small, for example, the side dimensions each can be less than or equal to 5 mm and thickness can be approximately 0.5 mm.

[0057] It is to be understood that groove 20 can be formed by a variety of processes, such as etching, and may have a variety of other cross-sectional shapes without deviating from the scope of the invention. For instance, channel 20 can be a groove having a v-shaped cross section with opposing side walls defining an angle of approximately 55° with respect to the top surface 14′ of substrate 14, such as a cylindrical optical body-holding groove of the type described in U.S. Pat. No. 5,602,955, which teachings are incorporated herein by reference. For a bulk silicon wafer carrier, this type of groove can be formed by an anisotropic wet etch of the wafer surface with potassium hydroxide, or anisotropic plasma etch, and the like, according to techniques well known in the semiconductor processing arts, such as by anisotropic etching in the carrier substrate 14 in two different directions or orientations, such as <110> and <100>. A groove also can be formed by laser cutting of the wafer surface. Preferably, the V-shaped groove preferably should be made deep and wide enough so that the sensing fiber end 122 is initially positioned (cradled) in the groove slightly below (e.g., approximately 5 μm below) its final predicted aligned position.

[0058] Alternatively, in lieu of groove 20, an LIGA channel can be defined in its body for receiving and holding the fiber end 122 in a fixed relation thereto. An optical bonding agent or solder, for example, could be used to fiber end 122 within an LIGA channel to maintain it in a fixed position relative to carrier 14. For example, a conventional optical glass bonding agent, such as Gould GlasSolder™ bonding agent, or a high temperature fluxless solder, such as gold/tin eutectic alloy solder, can be used to bond fiber end 122 to carrier substrate 14. As known to those skilled in the art, the surface of fiber 121 is preferably metallized with titanium, platinum and gold, for example, which improves the bond within an LIGA channel. Whether holding means 20 is a groove or LIGA channel, carrier substrate 14 constitutes a carrier for holding fiber end 122 in a fixed relation thereto.

[0059] The aforesaid active micro-aligner 10 includes first and second in-plane actuators 15 and 16 for effecting the in-plane alignment in the orthogonal in-plane (x-and y-axes) directions of the fiber end 122 held by the micro-aligner 10, while a third actuator 19 is used for effecting the out-of-plane (z-axis) alignment of the fiber end 122 held by the micro-aligner 10. The preferred constructions of the in-plane and out-of-plane microactuators are described in greater detail below.

[0060] Referring to FIG. 4A, in order to induce in-plane alignment of the fiber end 122 as held on carrier 14 with an associated optical fiber located outside the connector housing 101, the micro-aligner 10 includes two orthogonally positioned in-plane actuators, including x-direction actuator 15 and y-direction actuator 16, respectively, which are adapted to move carrier 14 relative to stationary alignment housing 17 and the associated optical fiber in respective planar orthogonal x- and y-directions respectively, extending in a plane defined by the surface 14′ of substrate 14. In turn, this permits the fiber end 122 to be precisely aligned with an associated optical fiber in the in-plane directions.

[0061] In one embodiment, x-direction actuator 15 and y-direction actuator 16 are thermally actuated arch beam actuators. More specifically, and still referring to FIG. 4A, when such a thermally actuated arch beam actuator 16 is activated, its beam 25 moves relative to the stationary alignment housing 17 and its sidewalls 17′ and base 9. Beam 25 moves along an orthogonal in-plane direction 16″ (see FIG. 5), which is opposite to the y-direction indicated in FIG. 4A, until beam 25 comes into contact with the immediately confronting stationary sidewall 4 among sidewalls 17′ of alignment housing 17 and creates an opposing force pushing the carrier 14 away from the sidewall 4 in the y-direction. The other in-plane thermally actuated arch beam microactuator 15 interacts in a similar manner via its beam 25′ with another sidewall 5 among sidewalls 17′ of the alignment housing 17 to push carrier 14 in an x-direction that is orthogonal to the y-direction.

[0062] The counterforce return springs 21 and 22 provide counter biasing forces that the x-direction actuator 15 and y-direction actuator 16 must act against and ultimately overcome, respectively, when activated to impart in-plane movement to carrier 14. Counter force spring 22 is shown in more detail in FIG. 4B, which cuts away a portion of the alignment housing sidewalls 17′ for sake of illustration only. The counterforce springs 21 and 22 are biased against respective stationary walls 6 and 7 of alignment housing 17 to create respective biasing forces pushing the carrier 14 back into reference corner 17″ of alignment housing 17 when the in-plane actuators 15 and 16 are both de-activated, and the carrier 14 is held in place as wedged into corner 17″ as the equilibrium condition of the micro-aligner 10 until either or both of the in-plane actuators 15 and/or 16 are again activated. More specifically, when either or both are actuated, arch beam actuators 15 and 16 overcome the counter bias force provided by springs 21 and 22, respectively, as well as the frictional forces between carrier 14 and the alignment housing base 9, and the bending moments of the leads 2 connected to pads 3, to move carrier 14 in the desired in-plane direction.

[0063] As illustrated in more detail in FIG. 5 with respect to the y-direction thermally actuated arch beam actuator 16, and as equally applicable to x-direction thermally actuated arch beam actuator 15, the thermally actuated arch beam actuator 16 generally includes a plurality of arches 23 supported between a pair of side support structures or pads 24 and suspended over diaphragm 28 formed in the underlying surface 14′ of substrate 14 by undercut etching of the substrate 14. Advantageously, such actuators 16 (and 15) are comprised of a single material so that they are less expensive and less complicated to fabricate than, for example, bimorphic actuators made from two materials. Although FIG. 5 illustrates actuator 16 as having four arches 23, the number of arches 23 may vary (e.g., 2-20). A cantilever beam 25 extends across the arches 23. The cantilever beam 25 has a rounded distal end 25aoriented towards the alignment housing sidewall 4 (or 5).

[0064] When heated by a heater 26, thermal expansion causes the arches 23 to bend in a direction determined by their orientation, namely, in the direction 16″ indicated in FIG. 5 (and FIG. 4B). As a result of the bending of arches 23, beam 25 moves along direction 16″ towards and ultimately against sidewall 4 of the alignment housing 17 (see FIG. 4A). In a preferred embodiment, a polysilicon resistive heater positioned, or located, in close proximity to each actuator 15 or 16 (i.e., directly below the arches 23) embodies the heater 26. Thus, heater 26 provides heat to arches 23 when electrically stimulated for urging beam 25 towards and ultimately against bearing surface 4.

[0065] As a result, each beam 25, 25′ of the respective thermally actuated arch beam actuators 16, 15, respectively, can be electronically controlled to independently apply a positive force to the carrier 14 effective to overcome the opposite biasing force of the associated retainer springs 21, 22, respectively, causing the carrier 14 to move in the opposite direction to the direction of force being applied by either beam 25, 25′ against a sidewalls 4, 5 of the alignment housing 17. This allows for controlled positioning of the carrier 14 relative to the optical device 13 (and the alignment housing base 9) in an in-plane direction. The top surface of base 9 and the bottom surface of carrier 14 are preferably polished which reduces friction between the two features. Alternatively, the bottom surface of movable carrier 14 is coated with TEFLON® in order to reduce frictional forces between the top surface of a base 9 and the bottom surface of carrier 14.

[0066] In general, the direction of arches 23 determines the direction in which actuator 16 (or 15) bends, or deflects, and the amount of this movement is a function of the current supplied to polysilicon resistive heater 26. Thus, controlling the current supplied to heater 26 controls the deflection of actuator 16 and, consequently, controls the position of carrier 14 relative to optical device 13. Accordingly, in-plane microactuators 15 and 16 controllably position carrier 14 relative to the input (or output) optical fiber to precisely align the fiber end 122 in groove 20 (or as bonded to an LIGA channel 20) with the associated optical lens and input or output optical fiber in the respective x- and y-directions.

[0067] As also illustrated in FIG. 4A, micro-aligner 10 has connections or leads 2 to a current supply (not shown) which supplies current to the polysilicon heaters 26 to resistively heat the respective arch beam actuators 15, 16. Return lead 2′ is connected to bonding bad 3′. In order to facilitate this electrical stimulation of heaters 26, bonding pads 3 and 3′, preferably thin films of a conductive material (e.g., gold), are formed on opposite end portions of the resistive element of each heater 26 for connection to the leads 2 from a current supply. Preferably, the heaters 26 can comprise a resistive element having a serpentine-pattern beneath the arches 23 of each in-plane microactuator 16 (and 15), which heats when energized with current. A cavity is provided by etching the underside of carrier 14 below a portion of each in-plane actuator 15 and 16 to form diaphragm 28 (see FIG. 5) to help thermally isolate heaters 26 from the rest of micro-aligner 10.

[0068] As shown in FIG. 4A, for example, backstops 27 and 27′ are located on carrier 14 behind both the opposite distal ends (25a,25b;FIG. 5) of beam 25 and beam 25′, respectively, to delimit the amount of return movement of respective beams after distension prevent the arches from buckling when the beam returns.

[0069] In another embodiment of this invention, the x-direction actuator 15 and y-direction actuator 16 can be bimorphic actuators, such as the type described in U.S. Pat. No. 5,602,955, which teachings are incorporated herein by reference.

[0070] To induce out-of-plane positioning alignment of the fiber end 122 with the associated lens in a third direction, i.e., the z-axis direction indicated in FIG. 4A, that is orthogonal to the aforesaid two in-plane (x,y) directions, a third microactuator 19 is provided on the carrier 14 which, when activated, effectively deflects the carrier 14 upward in a normal direction away from the direction of the alignment housing base 9. This three-axes active micro-aligner 10 enables the precise optical alignment of the fiber end 122 with a lens located off the carrier.

[0071] Preferably, the z-direction actuator 19 is a bimorphic-type actuator formed on the carrier 14. Advantageously, the bimorphic actuator 19 is adapted to controllably position carrier 14 in the z-direction relative to the base 9 of the alignment housing 17 and the respective lens 105 or 106. In general, layers of two materials which respond differently to thermal stimulation embody bimorphic actuator 19. In general, a resistive heater is sandwiched between the two layers to controllably introduce the thermal stimulation.

[0072] For example, FIG. 6A shows the z-axis actuator 19 when at rest. The z-axis actuator 19 includes a diaphragm structure 30 having a distal end 31 and the diaphragm structure is formed by undercut etching a portion of the silicon substrate 14, as defined between two parallel relief channels 19′ (see FIG. 4A) formed through carrier substrate 14. Distal end 31 of z-axis actuator 19 is adjacent yet spaced from sidewall 4 of alignment housing 17. The processing used to form cantilever-like structures in the surface of a silicon substrate by anisotropic wet etching is known to those skilled in the art. The bimorphic actuator 19 includes two layers of materials which have different coefficients of thermal expansion, such as a layer of nickel 32 (or copper) disposed on silicon, and the metal layer has a larger coefficient of thermal expansion than silicon. The thin film resistive heater 33 is formed on the silicon substrate 14 in the desired pattern by similar techniques as described elsewhere herein relative to resistive heaters 26 used for the in-plane microactuators 15 and 16.

[0073] In order to facilitate electrical stimulation of the bimorphic actuators, bonding pads 18 (FIG. 4A), typically comprised of a conductive material, such as gold, can be formed on opposed end portions of the bimorphic actuator 19 such that an electrical current can be established therebetween via leads 2″ connected to a power supply (not shown). Then, referring again to FIG. 6A, the metallic layer 32 can be deposited on the silicon 14 and thin film heater 33 by a variety of methods, including preferential sputtering, directed evaporation, and electroplating, with departing from the spirit and scope of the present invention.

[0074] FIG. 6B is a cross section of the z-axis microactuator of z-axis actuator taken along lone A—A′ of FIG. 4B when the z-axis actuator is activated by inducing thermal stimulation through resistive heater 33. Upon heating via thin film resistive heater 33, the distal end 31 of the diaphragm 30 is caused to deflect downward, which, in turn, creates a counterforce pushing upward the carrier 14 (via diaphragm 30) a displacement distance ‘d’ in the z-direction which effectively displaces the fiber end 122 positioned thereon in the z-direction. In this embodiment, the micro-aligner 10 includes current supply means for providing current to the resistive heater 33 of bimorphic actuator 19. In one embodiment, this can be accomplished by leads 2″ extending to respective pins disposed within the connector housing 101, similar to that described in U.S. Pat. No. 5,606,635 in the context of a opto-electronic package, which teachings are incorporated herein by reference.

[0075] In this embodiment, the amount of the deflection of bimorphic actuator 19 is proportional to the magnitude of the electrical stimulation. By therefore controlling the current supplied to the bimorphic actuator 19, the amount of the bending or deflection and, consequently, the position of the carrier 14 relative to the base 9 can be controlled since the amount of bending is generally proportional to the current supplied to the resistive heater of the bimorphic actuator. Sufficient resistive heating can be generally provided by relatively small amounts of the current, such as 10 mA, thereby reducing the power requirements for the microstructure 19 of this embodiment.

[0076] The micro-aligner 10 having the construction described above is able to displace an end of the sensing fiber 121 greater than 10 microns in any one of the x- or y-directions and displace a lens greater than 100 μm in the z-direction, at forces of >30 mN in the x- or y-directions and at a force of >100 mN in the z-direction, and a power of <1.0 watt. The movable carrier 14 can have a square or rectangular surface geometry, as indicated in FIG. 4A, although it will be understood that the configuration of the carrier 14 is not limited thereto as long as the above functional requirements are met.

[0077] As an exemplary processing scheme for fabricating micro-aligner 10 (and micro-aligner 10′), fabrication of the micro-aligner carrier chip begins with definition of a PECVD silicon nitride layer 14″ (see FIG. 4A) on a silicon wafer, to provide carrier substrate 14, which are later etched via bulk etching to form the cantilever shaped z-axis actuator 19 and the thinned substrate diaphragm regions 28 (by etching recesses into the backside of the carrier 14) at areas below the resistive heaters 26 and thermally actuated arch beam actuators 15 and 16. A low stress PECVD silicon nitride layer patterned on both sides of the silicon wafer is used for this purpose. As is known in the art, the silicon nitride layer forms a base layer which adds strength to the structure as well as a chemical barrier or etch-stop layer.

[0078] The surface micromachine layers are then patterned to form the thermal isolation structures and microheaters for the thermally actuated beam actuators 15 and 16. A thick electroplated nickel layer is patterned using the LIGA (German acronym which translates to Lithography, Plating, and Molding) technique. As known to those skilled in the art, LIGA processes are based on a combination of lithography, electroforming and molding. In fact, the acronym LIGA is derived from the German translation of lithography, electroforming and molding, namely, Lithography, Galvanoformung and Abformung. Advantageously, LIGA processes may be used to obtain relatively large height-to-width ratios which permit fabrication with precise tolerances. Thus, this step relies upon synchrotron based deep x-ray lithography.

[0079] A key aspect of LIGA patterning is the ability to define high aspect ratio structures, which is crucial for obtaining actuation in the plane of the carrier chip and for defining corresponding spring structures with high in plane compliance. LIGA also permits plating heights which are sufficiently thick to form passive fixturing guides for the fiber, precise edge reference structures, and provides convenient definition of conductor paths for actuator control input. Optical lithography ensures excellent alignment of reference structures with fiber guides and thereby provides assembly alignment accuracy within the capture range of the microactuators.

[0080] Following LIGA patterning, the movable portions of the nickel structures are released via sacrificial etching. That is, after forming the nickel structures in the surface of carrier 14 via LIGA, a chemical etch undercuts are provided to selectively release nickel structures from the carrier 14. By properly timing the etch, some nickel structures are completely undercut and, thus, released, while others remain attached to the substrate. In a preferred embodiment of the present invention, fixed structures, e.g., features 3, 3′, 18, 21, and 22 in FIG. 4A, remain attached to substrate 14 while other structures such as arches 23 and beams 25, 25′ of in-plane microactuators 15 and 16 are released by undercut etching. This result can also be accomplished by using a masked sacrificial layer.

[0081] The bulk silicon wafer of substrate 14 is then subjected to anisotropic etching to cut away portions of the substrate 14 located below diaphragm area 28 (FIG. 5) and thermally relieve the polysilicon heaters 26, using the silicon nitride layer as an etch stop. According to the invention, etching performed on the bottom side of substrate 14 stops at nitride layer 14″ which forms the diaphragm 28 on the top surface of substrate 14. Advantageously, this arrangement thermally isolates heater 26 from the other components of micro-aligner 10 and the alignment housing 17. For example, by thermally isolating fiber end 122 from heater 26, fiber end 122 may be maintained at desired temperature to prevent temperature fluctuation from altering or otherwise affecting its alignment. In addition to providing thermal isolation, the etching causes a greater percentage of the heat provided by heater 26 to be transferred to actuator 15 or 16. As a result, actuators 15 and 16 have improved deflection response and efficiency. The resulting process merges surface and bulk silicon micromachining with nickel surface micromachining via the LIGA technique.

[0082] The most real estate taken up by the anisotropic bulk micromachining is attributable to making the heaters and relief of the z-actuator. These area requirements can be eliminated by using reactive ion etching (RIE) of the silicon which can achieve through wafer etching with aspect ratios of 40:1. The micro-aligner 10 can require on the order of 1 mm²of real estate, meaning thousands of micro-aligners such as described herein can be formed per wafer surface.

[0083] Following wafer level fabrication, the individual micro-aligner devices are separated from each other using conventional dicing, and then they can be packaged as described herein.

[0084] One or more pairings of micro-aligners 10 and 10′, supporting corresponding terminal ends of a plurality of sensing fibers arranged between pairings of lenses 105 and 106, can be disposed within the fiber optic connector 101 to permit concurrent optical coupling of a plurality of input optical fibers with a plurality of output fibers, such as could useful or needed in the context of two spliced composite structural parts having embedded fiber optics. The micro-aligners 10 can precisely simultaneously provide aligned coupling of multiple input and output optical fiber pairings from two composite parts with respective lens elements of the fiber optic connector in order to collimate the optical signals transmitted therethrough.

[0085] An analysis of the fiber optic connector configuration as described in detail above was accomplished by modeling half of the system, viz., from an input fiber affixed to a GRIN lens to the micro-positionable input terminal end 122 of a sensing fiber located at the opposite side of the GRIN lens. The optical schematic for this case is shown in FIG. 3. Light 113 emanating from the end of input fiber 109 is coupled at object plane 114 into the first GRIN lens 105. The GRIN lens 105 collimates the light 113 and propagates it to an image plane 115 at the input terminal end 122 of a sensing fiber. A micro-aligner 10 holds the terminal end 122 for micro-positioning about a common longitudinal axis 117 relative to the GRIN lens 105 and input fiber 109. The fiber optic connector model constructed in this manner was analyzed optically in order to determine the range of adjustment that might be expected at the device level, for an initial fiber alignment mismatch of up to 0.2 mm. The equipment used in the tests was described above in connection with FIGS. 1, 2, and 4-6, and reference is made thereto. The microaligners used to support and micro-position respective GRIN lenses within a fiber optic connector housing were fabricated in the manner described above to a size of approximately 5×4×1 mm³. The GRIN lens was modeled using a quadratic index gradient calculated according to the manufacturer's specifications, which was determined as follows: $N\left(r\right)=N_0·\left(1-\frac{A}{2}{r}^2\right)$

[0086] For the models investigated, A=−0.231, N_o=1.591, and the GRIN lens had a 10.000000 mm thickness (length) and the lens 105 and moving sensing fiber end 122 were separated by an intervening air gap of 1.456330 mm. The input fiber 109 was assumed centered, with a numerical aperture of 0.16. The sensing fiber end 122 was arbitrarily offset from the input fiber 109 in the meridional plane in steps of 0.02 mm up to 0.2 mm, and, after each displacement step, the sensing fiber end 122 was adjusted back in aligned position using its associated microaligner (10) to correct for the offset imposed (i.e., the initial mismatch alignments). To accomplish this, both were displaced in the same direction by the same amount until the reference ray was within 0.0001 mm of the fiber position in the image plane (114). At each re-aligned position, the fiber coupling was re-computed. The analysis in this regard was done using conventional software available for this purpose, viz., Sinclair Optics' OSLO Pro 5.2 optical analysis program. Coupling, referred to herein as a fiber coupling factor, is calculated in this program by computing a normalized overlap integral between the diffraction amplitude, U(x′,y′) function in the image plane and the fiber mode pattern, ψ(x′,y′), in this case a step index function as defined below: $\text{coupling Factor}=\frac{\int \int U\left(x^{\prime },y^{\prime }\right)\psi *\left(x^{\prime },y^{\prime }\right){\mathrm{dx}}^{\prime }{\mathrm{dx}}^{\prime }}{\sqrt{\int \int U\left(x^{\prime },y^{\prime }\right)U*\left(x^{\prime },y^{\prime }\right){\mathrm{dx}}^{\prime }{\mathrm{dy}}^{\prime }\int \int \psi \left(x^{\prime },y^{\prime }\right)\psi *\left(x^{\prime },y^{\prime }\right){\mathrm{dx}}^{\prime }{\mathrm{dy}}^{\prime }}}$

[0087] The fiber core index was set to 1.55, cladding index to 1.45, and the core diameter to 6.6 microns (i.e., single mode at 1.3 micron wavelength). After analyzing the coupling factor after each displacement step in the manner indicated above, the results were recorded and they are plotted in FIG. 7. The data results shown in FIG. 7 show that a very small loss of fiber coupling occurred as a function of increasing fiber alignment mismatches corrected by the inventive device. The optical analyses using the fiber optic connector made according to this invention also revealed that the amount of fiber offset error between the two optical fibers to be optically coupled could be corrected with the same amount lens motion, which indicates a high coupling efficiency was attained with the inventive fiber optic connector system.

[0088] In view of the above, it will be, seen that the several objects of the invention are achieved and other advantageous results attained.

[0089] As various changes could be made in the above constructions and methods without departing from the scope of the invention, it is intended that all matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.

[0090] For example, it will be appreciated that the fiber optic connector of this invention can employ any three-axis micro-aligners meeting the performance and physical requirements outlined herein, and the micro-aligners are not limited to only those exemplified herein with reference to FIGS. 4A, 4B, 5 and 6.

[0091] For example, the three-axis microactuators described in U.S. Pat. No. 5,602,955, which teachings are incorporated herein by reference, alternatively could be employed as the micro-aligner (feature 10 or 10′ in FIG. 1) used to align the sensing fiber ends with the optical fibers according to this invention.