Composite Heat Sink

1. Field of the Invention

The present invention generally relates to a heat sink for removing heat from an electronic device, such as a computer central processing unit, and in particular to a composite heat sink which enhances air flow circulation and increases surface area for facilitating heat dissipation.

2. The Prior Art

With the rapid development of the electronics industry, the speed of electronic devices has increased considerably resulting in a large amount of heat generated during operation of the device. The heat must be properly dissipated in order to maintain an acceptable operation temperature of the device. To enhance heat removal, a heat sink is often attached to the electronic device. Examples of heat sinks are disclosed in U.S. Pat. Nos. 5,621,615 and 5,630,469 which comprise a base from which a number of fins extend. The base is directly mounted to an electronic device for conducting heat from the electronic device to the fins where heat transfer due to convection and radiation results.

The conventional heat sink, however, has a limited efficiency when removing heat from an electronic device. Thus, a more efficient heat sink is requisite.

Accordingly, an object of the present invention is to provide an efficient heat sink which has a composite structure for enhancing air flow and increasing surface area thereby facilitating heat dissipation.

To achieve the above object, a heat sink in accordance with the present invention comprises a bottom face adapted to be positioned on an electronic device to remove heat therefrom and a top face on which a central fin assembly and two end fin assemblies are fixed by means of screws. The central fin assembly is located between the end fin assemblies and a space is defined between the central fin assembly and each end fin assembly for receiving a clip to secure the heat sink to the electronic device. The central fin assembly has a number of fins defining passages therebetween through which air flows. Each end fin assembly has a number of fins defining passages therebetween through which air flows. The number of fins of the central fin assembly is greater than that of the end fin assemblies whereby the central fin assembly has a larger surface area for facilitating heat dissipation, while the end fin assemblies have larger passages for reducing resistance to air flowing therethrough. Preferably, the number of passages of the central fin assembly is a multiple of that of the end fin assemblies whereby each passage of the end fin assemblies is aligned with a number of passages of the central fin assembly for facilitating smooth air flow therebetween.

The present invention will be apparent to those skilled in the art by reading the following description of preferred embodiments thereof, with reference to the accompanying drawings, in which:

FIG. 1 is an exploded view of a heat sink in accordance with the present invention;

FIG. 2 is an assembled view of FIG. 1;

FIG. 3 is a cross-sectional view taken along line III--III of FIG. 2; and

FIG. 4 is a perspective view of a heat sink in accordance with another embodiment of the present invention.

Referring to the drawings and in particular to FIGS. 1 and 2, a heat sink constructed in accordance with the present invention comprises a base plate 10 having a bottom face 11 adapted to be positioned on and in direct contact with an electronic device (not shown), such as a computer central processing unit, from which heat is to be removed, and a top face 12 on which a central fin assembly 30 is mounted. Two end fin assemblies 20 are also mounted to the top face 12 of the base plate 10 proximate opposite longitudinal ends of the central fin assembly 30.

The central fin assembly 30 comprises a bottom wall 34 positioned on the top face 12 of the base plate 10 and a plurality of fins 31 extending from the bottom wall 34. The fins 31 are spaced from each other a predetermined first distance to define a plurality of first passages 32 therebetween. The central fin assembly 30 also comprises a top wall 35 with top ends of the fins 31 being fixed thereto.

Each end fin assembly 20 comprises a bottom wall 24 positioned on the top face 12 of the base plate 10 and a plurality of fins 21 extending from the bottom wall 24. The fins 21 are spaced from each other a predetermined second distance to define a plurality of second passages 22 therebetween. The end fin assembly 20 also comprises a top wall 25 with top ends of the fins 21 being fixed thereto.

Referring also to FIG. 3, the central and end fin assemblies 30, 20 are fixed to the top face 12 of the base plate 10 by means of fasteners, such as screws 40. The screws 40 extend through holes 16 defined in the base plate 10 and engage with screw holes 26, 36 defined in the bottom walls 24, 34 of the end and central fin assemblies 20, 30 for securing the end and central fin assemblies 20, 30 to the base plate 10. Preferably, the through holes 16 have countersinks in order to provide surface contact between the bottom face 11 of the base plate 10 and the electronic device.

To avoid the formation of a gap between the top face 12 of the base plate 10 and the bottom walls 24, 34 of the end and central fin assemblies 20, 30, a thermal conductive material may be additionally provided therebetween. The thermal conductive material may be thermal grease or thermal tape.

The second distance between adjacent fins 21 of the end fin assembly 20 is a multiple of the first distance between adjacent fins 31 of the central fin assembly 30. For example, the second distance may be two or three times the first distance. In other words, the number of first passages 32 is two or three times that of the second passages 22 of the end fin assembly 20. Thus, two or three first passages 32 are aligned with each second passage 22 of each end fin assembly 20 and a smooth air flow from the second passages 22 to the first passages 32 is obtained.

Since the number of the first passages 32 is a multiple of that of the second passages 22, the number of the fins 31 of the central fin assembly 30 is also a multiple, at least substantially, of that of the end fin assemblies 20. Thus, the total surface area of the central fin assembly 30 is increased thereby increasing the amount of heat transferred from the fins 31 through the passages 32 by means of convection and radiation.

Furthermore, a reduced number of the second passages 22 exhibits less resistance for air to flow therethrough thereby facilitating heat dissipation.

Preferably, a space 50 is defined between each end fin assembly 20 and the central fin assembly 30 for receiving a clip (not shown) which secures the heat sink to the electronic device.

In another embodiment of the present invention, the central fin assembly, designated by reference numeral 30' for distinction, is provided with transverse channels 37 as shown in FIG. 4. The transverse channels 37 facilitate air circulation and also increase the total surface area of the central fin assembly 30'. Both lead to an increased efficiency of heat transfer away from the central fin assembly 30'.

Although the present invention has been described with reference to preferred embodiments, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.