Background of the Invention
1. Field of the Invention
The present invention relates to a semiconductor device, and more particularly, to an output buffer circuit of the semiconductor device.
2. Description of the Related Art
A prior art output buffer circuit is constructed by a logic circuit for generating first and second data signals each having a voltage level between a ground level GND and a high voltage V.sub.DDL such as 3V, level shift circuits for changing the high voltage level (=V.sub.DDL) of the first and second data signals to a higher voltage level V.sub.DDH such as 5V, and an output circuit formed by a P-channel metal oxide semiconductor (MOS) transistor and an N-channel MOS transistor powered by the ground level GND and the high voltage V.sub.DDH. The P-channel MOS transistor is controlled by the level-shifted first data signal, and the N-channel MOS transistor is controlled by the level-shifted second data signal. Thus, an output signal having a voltage level between the ground level GND and the high voltage V.sub.DDH is obtained from the output circuit. This will be explained later in detail.
In the above-mentioned prior art output buffer circuit the voltage V.sub.DDH, which is larger than the maximum voltage V.sub.DDL within an internal circuit including the control circuit and the level shift circuits, is applied between the gate and source (the gate and drain) of each of the transistors of the output circuit. Therefore, if the breakdown voltage of the transistors of the output circuit has the same breakdown voltage as the transistors within the internal circuit, the transistors are so deteriorated that the reliability of the semiconductor device is reduced.
In order to enhance the reliability of the semiconductor device, a special manufacturing process different from a manufacturing process for the internal circuit is performed upon the output circuit. For example, the gate silicon oxide layer of the transistors of the output circuit is made thicker than that of the transistors within the internal circuit, which, however, increases the manufacturing cost.
Summary of the Invention
It is an object of the present invention to provide an output buffer circuit including an output circuit having a low breakdown voltage, thus decreasing the manufacturing cost.
According to the present invention, in an output buffer circuit, a logic circuit generates first and second data signals each having a voltage level between a low voltage and a first high voltage. A level shift circuit receives the first data signal and generates a third data signal having a voltage between a first intermediate voltage and a second high voltage higher than the first voltage. An output circuit includes first and second P-channel MOS transistors and first and second N-channel MOS transistors powered by the low voltage and the second high voltage. A gate of the first P-channel MOS transistor receives the third data signal, a gate of the second P-channel MOS transistor receives a second intermediate voltage between the low voltage and the second high voltage, a gate of the first N-channel MOS transistor receives the second data signal, and a gate of the second N-channel MOS transistor receives a third intermediate voltage.
The source-gate (gate-drain) voltage of each of the transistors of the output circuit is smaller than the difference between the low voltage and the second high voltage.
Brief Description of the Drawings
The present invention will be more clearly understood from the description as set forth below, as compared with the prior art, with reference to the accompanying drawings, wherein:
FIG. 1 is a circuit diagram illustrating a prior art output buffer circuit;
FIG. 2 is a table showing the relationship among the signals of the circuit of FIG. 1;
FIG. 3 is a circuit diagram illustrating a first embodiment of the output buffer circuit according to the present invention;
FIG. 4 is a table showing the relationship among the signals of FIG. 3;
FIG. 5 is a timing diagram showing the operation of the circuit of FIG. 3;
FIG. 6 is a circuit diagram illustrating a second embodiment of the output buffer circuit according to the present invention; and
FIG. 7 is a table showing the relationship among the signals of FIG. 6.
Description of the Preferred Embodiments
Before the description of the preferred embodiments, a prior art output buffer circuit will be explained with reference to FIGS. 1 and 2.
In FIG. 1, reference numeral 100 designates a control circuit for generating output signals D.sub.1 and D.sub.2 in accordance with an input data signal D.sub.in. The control circuit 100 is enabled by an enable signal EN. The control circuit 100 includes an inverter 101 for receiving the enable signal EN, a NAND circuit 102 for receiving the input data signal D.sub.in and the enable signal EN to generate a data signal D.sub.1, and a NOR circuit 103 for receiving the input data signal D.sub.in and the output signal of the inverter 101 to generate a data signal D.sub.2.
The control circuit 100 is powered by a power supply voltage V.sub.DDL such as 3V. In this case, as shown in FIG. 2, when the enable signal EN is low (=0V), the data signals D.sub.1 and D.sub.2 are V.sub.DDL and 0V, respectively, regardless of the input data signal D.sub.in. On the other hand, as shown in FIG. 2, when the enable signal EN is high (=V.sub.DDL) and the input data signal D.sub.in is low (=0V), the data signals D.sub.1 and D.sub.2 are both V.sub.DDL, while, when the enable signal EN is high (=V.sub.DDL) and the input data signal D.sub.in is high (=V.sub.DDL), the data signals D.sub.1 and D.sub.2 are both 0V.
A level shift circuit 200 is provided to receive the data signal D.sub.1 of the control circuit 100. That is, the high level (=V.sub.DDL) of the data signal D.sub.1 is pulled by the level shift circuit 200 to a power supply voltage V.sub.DDH such as 5V. The level shift circuit 200 includes cross-coupled P-channel MOS transistors 201 and 202, switching N-channel MOS transistors 203 and 204, and inverters 205 and 206. The level shift circuit 200 is powered by the power supply voltage V.sub.DDH.
When the data signal D.sub.1 is low (=0V), the transistors 203 and 204 are turned OFF and ON, respectively. As a result, the voltages at nodes N.sub.201 and N.sub.202 are made higher and lower, respectively, so that the transistors 201 and 202 are turned ON and OFF, respectively. Thus, the voltage at the node N.sub.202 becomes 0V, and therefore, a data signal D.sub.1 ' becomes 0V.
On the other hand, when the data signal D.sub.1 is high (=V.sub.DDL), the transistors 203 and 204 are turned ON and OFF, respectively, As a result, the voltages at nodes N.sub.201 and N.sub.202 are made lower and higher, respectively, so that the transistors 201 and 202 are turned OFF and ON, respectively. Thus, the voltage at the node N.sub.202 becomes V.sub.DDL, and therefore, the data signal D.sub.1 ' becomes V.sub.DDH.
Also, the level shift circuit 200' is provided to receive the data signal D.sub.2 of the control circuit 100 to generate a data signal D.sub.2 '. The level shift circuit 200' has the same configuration as the level shift circuit 200. Therefore, when the data signal D.sub.2 is low (=0V), the data signal D.sub.2 ' is low (=0V), and when the data signal D.sub.2 is high (=V.sub.DDL), the data signal D.sub.2 ' is high (=V.sub.DDH).
Thus, in the relationship between the data signals D.sub.1 and D.sub.2 and the data signals D.sub.1 ' and D.sub.2 ' as shown in FIG. 2, the high level voltage V.sub.DDL is changed to the high level voltage V.sub.DDH.
An output circuit 300 receives the data signals D.sub.1 ' and D.sub.2 ' to generate an output data signal D.sub.out at an output terminal OUT. The output circuit 300 includes a P-channel MOS transistor 301 and an N-channel MOS transistor 302.
The output circuit 300 is powered by the power supply voltage V.sub.DDH. Therefore, when the data signals D.sub.1 ' and D.sub.2 ' are high (=V.sub.DDH) and low (=0V), respectively, the output data signal D.sub.out is in a high impedance state. When the data signals D.sub.1 ' and D.sub.2 ' are both high (=V.sub.DDH), the output data signal D.sub.out is low (=0V), while, when the data signals D.sub.1 ' and D.sub.2 ' are both low (=0V), the output data signal D.sub.out is high (=V.sub.DDH).
The relationship among the enable signal EN, the input data signal D.sub.in and the output data signal D.sub.out is shown in FIG. 2.
In the output buffer circuit of FIG. 1, note that a state where (D.sub.1 ', D.sub.2 ')=(0V, V.sub.DDH) never occurs, so that the transistors 301 and 302 are never turned ON, simultaneously.
In the output buffer circuit of FIG. 1, a voltage V.sub.DDH larger than the maximum voltage V.sub.DDL within an internal circuit including the control circuit 100 and the level shift circuits 200 and 300 is applied between the gate and source (gate and drain) of each of the transistors 301 and 302. Therefore, if the breakdown voltage of the transistors 301 and 302 has the same breakdown voltage as the transistors within the internal circuit, the transistors 301 and 302 are so deteriorated that the reliability of a semiconductor device is reduced.
In a prior art semiconductor device, in order to enhance the reliability of the semiconductor device, a special manufacturing process different from a manufacturing process for the internal circuit is performed upon the output circuit 300. For example, the gate silicon oxide layer of the transistors 301 and 302 is made thicker than that of the transistors within the internal circuit, which, however, increases the manufacturing cost.
In FIG. 3, which illustrates a first embodiment of the present invention, an output buffer circuit is constructed by a control circuit 1, a level shift circuit 2, an output circuit 3 and an intermediate voltage generating circuit 4.
The control circuit 1 has the same configuration as the control circuit 100 of FIG. 1. That is, the control circuit 1 generates data signals D.sub.1 and D.sub.2, so that the data signal D.sub.1 is supplied to the level shift circuit 2 and the data signal D.sub.2 is supplied directly to the output circuit 3.
The intermediate voltage generating circuit 4 generates an intermediate voltage V.sub.PM and transmits it to the level shift circuit 2 and the output circuit 3.
The intermediate voltage generating circuit 4 is constructed by a series of P-channel MOS transistors 401 through 405, a resistor 406 and a N-channel MOS transistor 407 on the side of the power supply voltage V.sub.DDH. In this case, the transistors 401, 402 and 403 are diode-connected, and the transistors 404 and 405 are short-circuited. Also, the intermediate voltage generating circuit 4 is constructed by a non-doped N-channel MOS transistor 408 and an N-channel MOS transistor 409 on the side of the power supply voltage V.sub.DDL. The gate of the transistor 408 is controlled by the voltage at a node N.sub.401 between the transistor 405 and the resistor 406 which is
where V.sub.thp is a threshold voltage of the P-channel MOS transistors.
Also, the transistors 407 and 409 form a current mirror circuit.
Further, an N-channel MOS transistor 410 is connected between the sources of the transistors 407 and 409 and the ground terminal GND, and is controlled by a control signal ST through an inverter 411. Thus, in a standby state or the like (ST="1" (=V.sub.DDL)), the transistor 410 is turned OFF, thus decreasing the power dissipation.
The intermediate voltage V.sub.PM is derived from a node N.sub.402 between the transistors 408 and 409. The intermediate voltage V.sub.PM is about the same as the voltage at the node N.sub.401, i.e.,
In this case, the intermediate voltage V.sub.PM fluctuates in accordance with the voltage V.sub.DDH. and satisfies the following formula:
where V.sub.DDL .gtoreq.V.sub.DDH -3.vertline.V.sub.thp .vertline.
Note that, if a connection between nodes N.sub.403 and N.sub.404 is opened, the transistor 404 is diode-connected, and therefore, the formula (1) is replaced by
In addition, if a connection between nodes N.sub.405 and N.sub.406 is opened, the transistor 405 is diode-connected, and therefore, the formula (2) is replaced by
Thus, the intermediate voltage V.sub.PM can be adjusted by opening the connections between the source-gate of the transistor 404 (405) using a laser trimming method or the like.
On the other hand, the power supply voltage V.sub.DDL is supplied as another intermediate voltage to the level shift circuit 2 and the output circuit 3.
The level shift circuit 2 is formed by modifying the level shift circuit 200 of FIG. 1. Note that the level shift circuit 200' of FIG. 1 is not provided.
That is, in the level shift circuit 2, P-channel MOS transistors 207 and 208 controlled by the intermediate voltage V.sub.PM and the N-channel MOS transistors 209 and 210 controlled by the intermediate voltage V.sub.DDL are added to the elements of the level shift circuit 200 of FIG. 1. The transistors 207 and 209 are connected in series between the transistors 201 and 203, and the transistors 208 and 210 are connected in series between the transistors 202 and 204. Also, the level shift circuit 2 is powered by the power supply voltage V.sub.DDH.
When the data signal D.sub.1 is low (=0V), the transistors 203 and 204 are turned OFF and ON, respectively. As a result, the voltages at nodes N.sub.203 and N.sub.204 are made higher and lower, respectively. In this case, since the voltage at the gate of the transistor 209 is fixed at V.sub.DDL, the voltage at the node N.sub.203 increases up to
where V.sub.thn is a threshold voltage of the N-channel MOS transistors. Also, the voltage at the node N.sub.204 becomes 0V, and therefore, the voltage at the node N.sub.202 is made lower. As a result, the transistor 201 is turned ON to increase the voltage at the node N.sub.201, thus turning OFF the transistor 202. In this case, since the voltage at the gate of the transistor 202 is fixed at V.sub.PM, the voltage at the node N.sub.202 decreases down to
On the other hand, when the data signal D.sub.1 is high (=V.sub.DDL), the transistors 203 and 204 are turned ON and OFF, respectively. As a result, the voltages at nodes N.sub.203 and N.sub.204 are made lower and higher, respectively.
In this case, since the voltage at the gate of the transistor 210 is fixed at V.sub.DDL, the voltage at the node N.sub.204 increases up to
Also, the voltage at the node N.sub.203 becomes 0V, and therefore, the voltage at the node N.sub.201 is made lower. As a result, the transistor 202 is turned ON to increase the voltage at the node N.sub.202, thus turning ON the transistor 202. Therefore, the voltage at the node N.sub.202 increases up to V.sub.DDH.
Thus, as shown in FIG. 4, the low level (=0V) of the data signal D.sub.1 is changed to the low level (=V.sub.PM +.vertline.V.sub.thp .vertline.) of the data signal D.sub.1 ', and the high level (=V.sub.DDL) of the data signal D.sub.1 is changed to the high level (=V.sub.DDH) of the data signal D.sub.1 '.
The output circuit 3 includes a P-channel MOS transistor 303 and an N-channel MOS transistor 304 in addition to the transistors 301 and 302 of the output circuit 300 of FIG. 1.
The data signal D.sub.1 ' is applied to the gate of the transister 301, and the intermediate voltage V.sub.PM is applied to the gate of the transistor 303. On the other hand, the data signal D.sub.2 is applied to the gate of the transistor 302, and the voltage V.sub.DDL is applied to the gate of the transistor 304. The output terminal OUT is connected to a node between the transistors 303 and 304.
When the enable signal EN is low (=0V), V.sub.DDH, 0V, V.sub.PM and V.sub.DDL are applied to the gates of the transistors 301, 302, 303 and 304, respectively. As a result, the transistors 301 and 302 are both turned OFF, so that the output signal D.sub.out as well as the voltage at nodes N.sub.301 and N.sub.302 are in a high impedance state, as shown in FIG. 4 (state I).
When the enable signal EN is high (=V.sub.DDL) and the input data signal D.sub.in is low (=0V), V.sub.DDH, V.sub.DDL, V.sub.PM and V.sub.DDL are applied to the gates of the transistors 301, 302, 303 and 304, respectively. As a result, the transistors 301 and 302 are turned OFF and ON, respectively, so that the output data signal D.sub.out as well as the voltage at the node N.sub.302 is decreased to 0V, however, the voltage at the node N.sub.301 is decreased to V.sub.PM +.vertline.V.sub.thp .vertline., as shown in FIG. 4 (state II). In this case, the source-gate voltage and gate-drain voltage of the transistor 301 are
Also, the source-gate voltage and gate-drain voltage of the transistor 303 are
Any of the values (4), (5), (6) and (7) are smaller than V.sub.DDH.
When the enable signal EN is high (=V.sub.DDL) and the input data signal D.sub.in is high (=V.sub.DDL), V.sub.PM +.vertline.V.sub.thp .vertline., ON, V.sub.PM and V.sub.DDL are applied to the gates of the transistors 301, 302, 303 and 304, respectively. As a result, the transistors 301 and 302 are turned OFF and ON, respectively, so that the output data signal D.sub.out as well as the voltage at the node N.sub.301 is increased to V.sub.DDH, however, the voltage at the node N.sub.302 is increased to V.sub.DDL -V.sub.thn, as shown in FIG. 4 (state III). In this case, the source-gate voltage and gate-drain voltage of the transistor 302 are
Also, the source-gate voltage and gate-drain voltage of the transistor 304 are
Any of the values (8), (9), (10) and (11) are smaller than V.sub.DDH.
Thus the transistors 301 through 304 of the output circuit 3 can have the same breakdown voltage as the internal circuit including the control circuit 1, the level shift circuit 2 and the intermediate voltage generating circuit 4. For example, the gate silicon oxide layer of the output circuit 3 can be the same as that of the internal circuit.
As shown in FIG. 5, which is a timing diagram showing the operation of the output buffer circuit of FIG. 3, the state II of FIG. 4 occurs from time t1 to time t2, the state III of FIG. 4 occurs from time t2 to time t3, and the state I occurs from time t3.
In FIG. 6, which illustrates a second embodiment of the present invention, an intermediate voltage generating circuit 5 is added to the element of the output buffer circuit of FIG. 3. That is, the intermediate voltage generating circuit 5 generates an intermediate voltage V.sub.NM instead of the intermediate voltage V.sub.DDL of FIG. 3 and transmits it to the level shift circuit 2 and the output circuit 3.
The intermediate voltage generating circuit 5 is constructed by a series of N-channel MOS transistors 501 through 506, a resistor 507 and an N-channel MOS transistor 508 controlled by the standby signal ST between the power supply voltage V.sub.DDL and the ground level GND. In this case, the transistors 501, 502, 503 and 504 are diode-connected, and the transistors 505 and 506 are short-circuited. Therefore, the intermediate voltage V.sub.NM is 4.multidot.V.sub.thn.
Note that, if a connection between nodes N.sub.501 and N.sub.502 is opened, the transistor 505 is diode-connected, and therefore, the intermediate voltage V.sub.NM is 5.multidot.V.sub.thn. If a connection between nodes N.sub.503 and N.sub.504 is opened, the transistor 506 is diode-connected, and therefore, the intermediate voltage V.sub.NM is 6.multidot.V.sub.thn.
Thus, the intermediate voltage V.sub.NM can be adjusted by opening the connections between the source-gate of the transistor 505 (506) using a laser trimming method or the like.
The operation of the output buffer circuit of FIG. 6 is substantially the same as that of the output buffer circuit of FIG. 3, as shown in FIG. 7. In FIG. 7, note that the voltage at the node N.sub.302 in the state III is V.sub.NM -V.sub.thn.
As explained hereinabove, according to the present invention, since the voltage applied to the source-gate (gate-drain) of each of the transistors of the output buffer circuit is decreased, the output buffer circuit can be manufactured simultaneously with the internal circuit without a special manufacturing step, which can decrease the manufacturing cost.