Background of the Invention
The present invention is generally directed to a circuit for providing a temperature insensitive voltage, and more particularly to a bandgap voltage generator.
Bandgap voltage generators provide a specific low voltage that is desirably insensitive to temperature. The voltage is typically equal to the bandgap potential of silicon at 0.degree. Kelvin, approximately 1.2 volts, although other low voltages may be provided. The generated voltage is used in variety of applications, including CMOS integrated circuits.
Bandgap generators, such as disclosed in U.S. Pat. No. 5,144,223 to Gillingham, have moved away from the use of amplifiers because of the current they consume, especially in low power operations. The present invention solves the current consumption problem and is able to use an amplifier efficiently in a 5 volt system.
Accordingly, it is an object of the present invention to provide a novel circuit for providing a voltage that is insensitive to temperature that obviates the problems of the prior art.
It is another object of the present invention to provide a novel circuit for generating a bandgap voltage in which a feedback loop for an amplifier includes a high impedance output current mirror for controlling the current across a resistor.
It is yet another object of the present invention to provide a novel bandgap generator in which an amplifier feedback loop includes a high impedance output current mirror for providing proportional currents to a pair of resistors that are connected to the amplifier, where one resistor feeds a temperature sensitive voltage to a first amplifier input, and a voltage is provided to a second amplifier input from a combination of a temperature sensitive voltage across a second transistor from which the bandgap voltage may be tapped and an offsetting voltage.
It is still another object of the present invention to provide a novel circuit for providing a bandgap voltage for a five volt system, the circuit having a pair of bipolar transistors with a common collector and bases connected to a reference voltage source, a first resistor connected in series with an emitter of a first of the bipolar transistors, an amplifier with a first terminal connected to the first resistor and a second terminal connected to an emitter of a second bipolar transistor, a second resistor connected in series with an emitter of the second bipolar transistor, the second resistor being tapped for providing a bandgap voltage, and in which an amplifier feedback loop provides proportional currents to the two resistors.
It is a further object of the present invention to provide a novel circuit for generating a bandgap voltage in which a feedback loop for an amplifier includes a high impedance output current mirror that is controlled by series connected field effect transistors that provide control signals to the gates of field effect transistors in the current mirror.
It is yet a further object of the present invention to provide a novel circuit for generating a bandgap voltage in which a feedback loop for an amplifier includes a current mirror that is controlled by an array of series connected field effect transistors, the current mirror including two pairs of field effect transistors for providing a high impedance output and that have their gates connected to the controlling field effect transistors.
It is still a further object of the present invention to provide a novel circuit for generating a bandgap voltage for biasing an entire semiconductor chip that is insensitive to temperature, and is independent of power supply variations and of trimming of the bandgap.
These and many other objects and advantages of the present invention will be readily apparent to one skilled in the art to which the invention pertains from a perusal of the claims, the appended drawings, and the following detailed description of the preferred embodiments.
Brief Description of the Drawings
FIG. 1 is a block diagram of an embodiment of the present invention.
FIG. 2 is a circuit diagram of a preferred embodiment of the present invention.
Description of Preferred Embodiments
With reference now to FIG. 1, an embodiment 10 of the present invention may include a reference circuit 12 for providing a first voltage V1 across a first resistor 14 that has a positive voltage/current temperature coefficient. A negative temperature coefficient base-to-emitter voltage from reference circuit 12 generates a second voltage V2 that is also temperature dependent. An amplifier 20 determines the difference between the first and second voltages V1 and V2 and provides an output that is fed through a feedback loop 22 to current mirror 16. Feedback loop 22 includes a control circuit 24 for enabling high output impedance operation of current mirror 16. The current from resistor 14 is mirrored in current mirror 16 to generate a voltage across a second resistor 18. The voltage drop across second resistor 18 combines with the negative temperature coefficient base-to-emitter voltage from reference circuit 12 so that second resistor 18 may be tapped with tap 26 to provide the desired temperature insensitive bandgap voltage.
A preferred embodiment of the present invention is illustrated in FIG. 2 in which numerical designations of similar features from FIG. 1 have been retained to facilitate an understanding thereof. The circuit of FIG. 2 is particularly adapted for a five volt system, and the reference voltage may be set to the half point for the power supply, namely 2.5 volts, although other voltages may be used from zero to five volts, or as appropriate for systems of other voltages. A .DELTA.V.sub.BE voltage may be generated by bipolar transistors Q1 and Q2 across resistor R1. The negative input of amplifier 20 may be connected to the emitter of transistor Q1, while the positive input of amplifier 20 may be connected to resistor R1 at an end opposite resistor R1's connection to the emitter of transistor Q2. The voltage across resistor R1 may be determined from
where Vt is the voltage equivalent of temperature (approximately 26 mV at 300.degree. K.) and Jcx is the current density of transistor Qx. The sizes of transistors Q1 and Q2 may be selected to meet particular output requirements and in the embodiment of FIG. 2 transistor Q2 may be ten times larger than transistor Q1. In this particular embodiment Ic1 (the collector current of transistor Q1) may be made ten times larger than Ic2 by sizing the MOS current 10 to 1, with Jc1/Jc2 thus being equal to 100, and with .DELTA.V.sub.BE being about 120 mV.
Amplifier 20 has a feedback loop that includes control circuit 24 and current mirror 16. Control circuit 24 may include plural series connected field effect transistors (FETs) for providing control inputs to current mirror 16. In the embodiment of FIG. 2 there are three FETs, each having their gate connected to their drain. FETs M10 and M12 also have their gate connected to their source to be diode connected. FETs M11 and M12 operate together as a diode connected device.
Current mirror 16 may include two pairs of series connected FETs that each have their gate connected to their drain. The control signals for the gates may be provided from control circuit 24, such as in the manner shown. The control signal for FETs M5 and M6 may be provided from between FETs M11 and M12, and the control signal for FETs M7 and M8 may be provided from between FETs M10 and M11. This connection allows FETs M5 and M6 to remain in the high impedance mode while allowing the bandgap voltage to operate closer to ground.
The bandgap voltage may be determined from:
where V.sub.BE1 =Vt*ln(Ic1/Is1), and Is1 is proportional to the area of the emitter of transistor Q1 and Ic1=(.DELTA.V.sub.BE /R1)*10, where 10 is the current ratio of the bottom MOS current transistors in this embodiment, and where V.sub.R3A =Ic1*R3A=(.DELTA.V.sub.BE /R1)*10*R3A.
The reference voltage may be obtained from a voltage division of supply voltage by two resistors of the same type, and thus the reference voltage has no temperature coefficient. For example, with further reference to FIG. 2 the reference voltage may be obtained with resistors 34 and 36 which divide V.sub.DD (the power supply voltage) to make the reference voltage, and thus the bandgap voltage, dependent on V.sub.DD so that the bandgap voltage can be used as a reference voltage for a semiconductor chip which is independent of temperature and which tracks power supply variations. V.sub.BE1 has a negative temperature coefficient while VR3A has a positive temperature coefficient. Thus, the temperature effect on the bandgap voltage may be cancelled by properly sizing R3A.
In operation, if the plus terminal of amplifier 20 goes higher than the negative terminal, the output voltage of amplifier 20 would increase and the current through M10, M11, and M12 would also go up. The mirrored currents in MS, M6, M7 and M8 would also increase, increasing the voltage drop across R1. The additional drop across R1 forces the negative terminal of amplifier 20 to be the more positive terminal, decreasing the output voltage from amplifier 20. The circuit is thereby brought into equilibrium to provide a temperature insensitive bandgap voltage.
The bandgap voltage may be set as needed by dividing resistor 18 into resistors R3A and R3B and adjusting the values of the two resistors. The tap 26 may be controlled by zener zap diodes to program the desired voltage. The operating current of the system is not affected by movement of tap 26 that adjusts the bandgap voltage. The operating current is affected by the value of R1 and, in a second order, by the total value of R3, rather than the individual values of R3A and R3B.
In further embodiments, and with continued reference to FIG. 2, FETs M11 and M10 may have their current mirrored through current mirror 30 (comprising, for example, FETs M14 and M15) into a diode connected MOS device, such as FET M16. This current may be used to bias cascode configured structures, such as the combination of FETs M27 and M28. With several cascode structures attached, a bias star configuration may be generated for an entire chip.
A start-up circuit 32 may also be provided. Circuit 32 may include a FET M13 that may be a weak pull up diode. FETs M17 and M18 may form one of the cascode current sources used to self bias the bandgap. FETs M17 and M18 may be wired to a diode connected device, such as FET M19, to generate a lower bias voltage for amplifier 20.
While preferred embodiments of the present invention have been described, it is to be understood that the embodiments described are illustrative only and the scope of the invention is to be defined solely by the appended claims when accorded a full range of equivalence, many variations and modifications naturally occurring to those of skill in the art from a perusal hereof.