Field and Background of the Invention
The present invention relates to a passive magnetic position sensor consisting of an electrically non-conductive, non-magnetic substrate on which a resistance layer and a soft-magnetic, electrically conductive bending-beam structure are arranged, the resistance layer and bending-beam structure being arranged at a constant distance apart partially one above the other. The distance apart is selected so that under the action of a magnet device guided along the overlapping region of bending-beam structure and resistance layer, contact is made between resistance layer and soft-magnetic bending-beam structure.
Position sensors are known in which, in order to set different resistance values, conductor-path and resistance-path are arranged one above the other, separated galvanically from each other, on a substrate. The conductive path is of comb shape and is connected on one side firmly to the substrate while its freely movable ends are opposite the resistance layer. A magnet device which is connected to the moving object is guided along the overlapping region of resistance path and conductive path. Depending on the position of the magnet device, the corresponding freely movable end of the conductive path is pulled onto the resistance path and electric contact thus established. The freely movable ends of the conductive path tap off different voltages from an electric circuit as a function of the place where the contact is made.
This has the disadvantage that the structure of the resistance path does not permit a precise adaptation of the voltage which drops over the resistance.
Summary of the Invention
It is an object of the invention to provide a position sensor which permits a precise tapping off of the voltage, operates with little wear, and is structurally easy to produce.
In accordance with the invention, the resistance layer (2) is electrically conductive and has, in its longitudinal direction, a meandering structure (3) which is adjoined by the comb-like taps (4) which have contact surfaces (4a) on the regions lying opposite the soft-magnetic bending-beam structure.
The advantage of the invention resides in the improvement of the contactability. The comb-like development with adjoining contact surfaces of the resistance layer serves to increase the sensitivity and improve the local resolution.
According to a feature of the invention, the resistance layer (2) is applied by vaporization or sputtering onto the insulating substrate (1).
In this way, a substantially longer conductive path and thus larger resistance ranges, preferably between 500 .OMEGA. and 2 k .OMEGA., can be produced on the same area.
In order to reduce the contact resistance, both the contact surfaces (4a) of the resistance layer (2) and the bending-beam structure which is freely movable on one side are coated with gold.
The insulating, non-magnetic substrate (1) which bears the resistance layer and the bending-beam structure consists either of a ceramic, glass or plastic plate or a glass-coated or insulation-coated metal plate.
In order to obtain a good electrical insulation of the resistance path and bending-beam structure outside of the contact region determined by the magnet device, the two of them are separated in space by a spacer.
The distance between resistance path and bending-beam structure is preferably produced by spacers which are contained in an adhesive and by which the resistance path or bending-beam structures are fastened to the insulating substrate. The spacers have in this connection an average size of 0.1-0.2 mm.
According to another embodiment, the soft-magnetic bending-beam structure (8) is gold-plated in the region of the contact surfaces (10).
Further according to the invention, the soft-magnetic bending-beam structure (8) is completely gold-plated.
Yet further, the resistance layer (2) and the bending-beam structure (8) are separated by spacers (7).
Moreover, the spacer (7) is a metal foil on which the soft-magnetic bending-beam structure (8) is fastened.
Still further, the spacer (7) is fastened by a temperature-resistant, gasification-poor adhesive both to the bending-beam structure (8) and also to the substrate (1).
According to another feature, the natural longitudinal curvature of the soft-magnetic bending-beam structure (8) can be used to obtain spacing.
Still further, the invention provides that the magnetic device is a permanent magnet (11).
Also by the invention, the permanent magnet (11) covers in its dimensions at least two bending-beams (9) of the soft-magnetic bending-beam structure (8).
Still further by the invention, the permanent magnet (11) is arranged movably on and spaced from the side of the resistance layer (2) facing away from the bending-beam structure (8).
Yet further with the invention, the resistance layer (2) and the bending-beam structure (8) are linear or arcuate.
Also the invention provides that the bending-beam structure (8) is supported on one or both sides.
Still further according to the invention, the insulating substrate (1) serves at the same time as housing wall which is closed by a housing cover (16).
Brief Description of the Drawings
With the above and other objects and advantages in view, the present invention will become more clearly understood in connection with the detailed description of preferred embodiments, when considered with the accompanying drawings, of which:
FIG. 1 is a view of the position sensor of the invention;
FIG. 2 is a showing of a portion of the position sensor of the invention;
FIG. 3 shows a resistance layer in arcuate shape;
FIG. 4 shows a bending-beam structure in arcuate shape;
FIG. 5 is a diagrammatic showing of the principle of operation of the position sensor; and
FIG. 6 is a diagrammatic showing of a cross section through the housing.
Detailed Description of the Preferred Embodiments
Identical features are provided with the same reference numerals in all figures.
FIG. 1 shows the construction of a linear passive magnetic position sensor based on a thin-film arrangement.
A non-magnetic, electrically non-conductive substrate 1 bears a metallic, low-ohmic and thus conductive resistance layer 2, which is developed in comb-shape.
As can be noted from FIG. 1, the resistance layer 2 has a region 3 which extends meandering between two electric terminals 5 and 6. Each meander is adjoined in each case by a tap 4 which is partially coated with gold and forms a closed contact surface 4a.
The resistance layer 2 is applied by sputtering or vaporization onto the insulating substrate 1 and adjusted to a small temperature coefficient (<100 ppm/K). The structuring of the resistance layer 2 is effected photolithographically by lacquer technique or etching or lift-off technique. The resistance value is determined by a suitable layout, by a corresponding film thickness or by the selection of the alloy. Typical conductive path widths in the case of the present meandering structure are 10 to 100 .mu.m.
The meandering structure of the resistance layer 2 can be applied by vaporization or sputtering or be printed on a carbon or conductive-plastic film. Development as thick-film is also possible. A linearization or balancing of the precise film resistance is effected in this connection by laser, electronic beam, or other abrasive method.
On the substrate 1, parallel to the resistance layer 2, there is arranged a spacing foil 7 on which a comb-shaped bending-beam structure 8 in the form of a soft-magnetic foil is applied. In accordance with FIG. 2, the comb-shaped soft-magnetic foil 7 consists of bending beams 9 supported on one side. The bending beams 9 are developed with a waist 12 in their center region. The freely movable end 10 of the bending beam 9 which adjoins this waist 12 is coated galvanically with a thin film of gold in order to reduce the contact resistance. The formation of the waist 12 in each of the bending beams 9 leads to an optimizing of the magnet sensitivity.
The spacing foil 7 holds the freely movable ends 10 of the bending-beam structure 8 at a defined distance from the contact surfaces 4a of the resistance layer 2.
The spacing foil 7 is fastened by a temperature-stable, gasification-free adhesive both to the bending-beam structure 8 and to the insulating substrate 1. In order to produce an electric connection, the spacing foil 7 is developed metallically.
The spacing foil 7 can be dispensed with if the adhesive itself contains spacers, for instance broken glass of grain size, which assume the function of the spacer. The soft-magnetic foil 8 is itself electrically conductive. Furthermore, the natural longitudinal curvature of the bending-beam structure 8 can be utilized to obtain the spacing of the bending beams 9 from the contact surfaces 4a of the resistance layer 2.
The resistance layer 2 is connected via the terminals 5 and 6, preferably electrically, to ground and the operating voltage U.sub.B. On the bending-beam structure 8 there is present the signal voltage U.sub.OUT which is variable in the range from 0 V to U.sub.B and represents the position of a permanent magnet 11.
As can be noted from FIG. 5, the freely movable ends 10 of the bending beams 9 overlap the contact surfaces 4a of the resistance layer 2. Resistance path 2 and bending-beam structure 8 are so aligned that either the contact surfaces of both ends point in one direction or lie overlapping each other.
The permanent magnet 11, which is disposed movably on and at a distance from the side of the resistance layer 2 facing away from the soft-magnetic bending-beam structure 8, is moved in the region of the overlapping of the contact surfaces 4a of the resistance layer 2 by the freely movable ends 10 of the unilaterally supported bending beams 9.
The freely movable ends 10 of the bending beams 9 of the soft-magnetic foil 8 are pulled by the magnetic field of the permanent magnet 11 onto the contact surfaces 4a of the resistance layer 2 and contacted. Depending on the position in which the permanent magnet 11 produces a short circuit, a given tap of the resistance layer 2 is produced at this place by the terminal U.sub.OUT.
The width of the permanent magnet 11 is such that several freely movable ends 10' of the bending-beam structure 8 which lie alongside of each other are contacted simultaneously with the corresponding contact surfaces 4a of the resistance layer 2 and thus act redundantly.
The resolution of the position sensor described is (100/n)%, in which n is the number of contact divisions (bending beams 9). In the middle region a resolution of (100/2n)% is obtained.
FIGS. 3 and 4 show an arcuate development of the resistance layer 2 and the bending-beam structure 8.
In order to improve the adaptation of the characteristic curve it is also possible to effect a development of the bending-beam structure 8 and/or of the meandering of the resistance layer 2 which is not equally divided.
Outside the measurement range of the position sensor, the resistance layer 2 as well as the bending-beam structure 8 each has an opposite contact region which is not shown (warning contact), upon the contacting of which by the permanent magnet the user of the position sensor is notified that the measurement range has been left.
The insulating substrate 1 which bears the resistance layer 2 and the soft-magnetic foil 8 consists of a ceramic plate. However, the use of glass or plastic supports or glass-coated or insulation-coated metal plates is also conceivable.
In another embodiment, the spacing foil 7 and the bending-beam structure 8 are pressed against the insulating substrate 1 by a clamped pressure plate, not shown.
The insulating substrate 1, which bears the resistance layer 2, the spacing foil 7, as well as the soft-magnetic foil 8, serves at the same time as housing wall of the position sensor, which is closed by a housing cover 16.
Upon the use of a metallic housing cover 16, the cover can be completely tinplated for protection against corrosion and in order to improve the solderability. The material of the cover has in this connection a coefficient of expansion to which the material of the insulating substrate 1 is adapted.
The closed, pre-tinned housing of the position sensor is soldered.
Instead of the metallic housing cover 16, a solderable metallized ceramic cover can also be used.
A further possibility consists in bonding the housing cover 16 to the substrate by adhesive or a meltable foil.
Concurrently with application of the resistance layer 2 to the insulating substrate 1, a metal layer 3 is applied as surrounding edge onto the insulating substrate 1 for the encapsulating of the position sensor. In order to improve the solderability, the metal layer 15 is gold-plated.
In order to produce the electric connections, pins 14 are passed through the insulating substrate 1 as shown in FIGS. 3 and 6 and are soldered or welded there hermetically tight, and thus in fluid-resistant manner, to the contact surfaces 5, 6 of the resistance layer 2 and U.sub.OUT of the bending-beam structure 8.
The pins 14 can be relieved from pressure by the sleeves 15 which are pushed over the pins from the outside of the housing.
By a suitable layout, the contact pins 14 can be developed as triple plug pins in the case of potentiometric wiring or double plug pins in the case of operation as position-dependent resistance.
The plug pins can, however, also be developed as 2- or 3-pole plug injection moldings for direct soldering into the position sensor.