Protective Overlayer Material and Electro-Optical Coating Using Same

This invention relates to electro-optical coatings for modulation of electromagnetic radiation and more particularly to thin-film materials and coatings used as protective overlayers for electrochromic devices having an all-thin-film structure.

An electrochromic material changes its optical properties in response to an electrically driven change in its state of oxidation or reduction. In order to make use of the optical modulation in practical applications, the electrochromic material can be incorporated into a multilayer coating. The multilayer structure provides a means of supplying electronic current over the optical switching area of the coating and a counter electrode layer which undergoes reversible reduction and oxidation reactions. The counter electrode provides a means for charge-balancing the reduction-oxidation reactions in the electrochromic film and is necessary to achieve a large number of reversible optical switching cycles. An ion conducting layer with a high electronic resistivity separates the electrochromic film from the counter electrode layer. During the optical switching process, counter ions are transported between the electrochromic and counter electrode layers to preserve charge neutrality within the electrochromic coating. The counter ions are usually H.sup.+ or Li.sup.+. Structures of electrochromic devices incorporating these basic elements have been described in prior art patent and scientific literature. Examples include: thin film coatings using H.sup.+ ion transport between WO.sub.3 and IrO.sub.2 (Takahashi et al., U.S. Pat. No. 4,355,414, September 1992); and, thin film coatings using Li.sup.+ ion transport between WO.sub.3 and Li.sub.y CrO.sub.2+x (Cogan and Rauh, U.S. Pat. No. 5,080,471, June 1992).

In many applications, electrochromic coatings will encounter elevated temperatures, high levels of solar irradiance, and a wide range of humidities. Chemical, photothermal, and photochemical degradation may accompany these environmental stresses. Of particular importance in determining the severity of degradation is the role played by water (H.sub.2 O) in the layers in the electrochromic coating. Both hydration and dehydration of the electrochromic coatings during service may result in degradation and decline in useful switching performance. For example, in electrochromic coatings using Li.sup.+ ions, the layers are often hygroscopic and absorb H.sub.2 O from the ambient air. The absorbed H.sub.2 O reacts with the lithiated electrochromic layers causing a decrease in optical switching range and, in coatings for visible transmittance or reflectance modulation, also the appearance of haze. In electrochromic coatings employing the H.sup.+ ion, loss of H.sub.2 O by dehydration in dry atmospheres may result in a severe reduction in optical switching speed. The reduction in speed is due to a decrease in H.sup.+ ion conductivity of the electrochromic and ion conducting layers which must be partially hydrated to achieve the desired level of ionic conductivity.

If a thin film electrochromic coating is to have a useful lifetime in any practical application, a means of preventing exchange of H.sub.2 O between the electrochromic coating and the ambient environment is necessary. Although there is an extensive body of literature on thin-film coatings for protecting integrated circuits and optical elements such as filters and lenses, there is very little prior art concerning the protection of electrochromic coatings exposed to the environment. Effectiveness as a barrier to H.sub.2 O transport is a key property of a protective overlayer for electrochromic coatings. However, prior art coatings used to protect integrated circuits and optics have not demonstrated appropriate optical properties in combination with the required hermeticity to H.sub.2 O transport.

Optically, the protective overlayer must have a high transmittance in the wavelength range for which the electrochromic coating is being used to modulate radiation. For coatings used in visible modulation, a high transmittance in the 400-700 nm wavelength range is required while coatings for solar modulation must be transparent from 350-2500 nm. Transparency at wavelengths shorter than 350 nm is usually not required since it is often desirable to prevent transmission of the solar ultraviolet. Other desirable properties of the overlayer include a high electronic resistivity to prevent the overlayer acting as an electronic short between the transparent conductors or the electrochromic layer and counter electrode; a high hardness to provide protection against abrasion; and low intrinsic film stress to prevent delamination of the coating.

A variety of materials have been investigated as thin-film hermetic coatings. In integrated circuit (IC) fabrication, dielectric passivation, such as silicon dioxide or silicon nitride, deposited by low pressure chemical vapor deposition (LPCVD) or plasma enhanced chemical vapor deposition (PECVD), is typically used as a barrier layer to H.sub.2 O and ion migration. For most IC devices, an additional encapsulant such as an epoxy is used in conjunction with the dielectrics. As will be shown by example, conventional semiconductor passivation has either inadequate H.sub.2 O barrier properties or inappropriate optical properties for overlayers on electrochromic coatings. IC passivation is also deposited at elevated temperatures, >350.degree. C., which cannot be tolerated by most electrochromic coatings, particularly those relying on H.sub.2 O Of hydration to maintain a high H.sup.+ ion conductivity. Other materials such as amorphous silicon carbide (Hiraki, et al U.S. Pat. No. 4,647,472, March 1987) have been described for semiconductor passivation. Amorphous silicon carbide has excellent properties as a H.sub.2 O barrier but, as will be shown by example, has poor transmittance in the visible region of the spectrum.

Prior art methods of protecting electrochromic devices using H.sup.+ ions have been described by Agrawal et al (U.S. Pat. No. 5,216,536, Jun. 1, 1993) and Shabrang (U.S. Pat. No. 5,136,419, Aug. 4, 1992). Agrawal et al reveal a moisture control layer comprised of a water reservoir material in conjunction with a moisture permeable barrier layer that prevents dehydration of the electrochromic coating. This approach to preventing dehydration has the disadvantage of limited optical transmittance due to the reservoir and barrier materials. The improvement described by Shabrang is to operate an electrochromic coating in an atmosphere containing an inert gas and vapor of high dielectric constant material (for example, water vapor) enclosed in a double-pane window in which the electrochromic coating is on an interior surface. This approach is deficient in that it is limited to a double-pane configuration and that, at low temperatures, the vapor will condense on the interior surface thereby compromising optical clarity and promoting chemical degradation.

The invention described, herein, is intended to overcome the deficiencies of prior art approaches to protecting electrochromic devices and to provide a means of protecting both H.sup.+ and Li.sup.+ counter ion electrochromic coatings against H.sub.2 O egress and ingress for periods of time appropriate for commercial applications that include, but are not limited to, electrochromic displays, sunglasses, automobile sunroofs, and large-area architectural glass for building windows.

The present invention provides an electro-optical coating with a protective overlayer that is substantially impervious to the transport of H.sub.2 O, the protective overlayer having a high transmittance in the visible and solar regions of the electromagnetic spectrum. The protective overlayer comprises one or more layers of thin-film materials, one of which is amorphous hydrogenated silicon oxycarbide (a-SiOC:H).

FIG. 1 is a cross-sectional view of an electrochromic device in a preferred embodiment of the present invention in which a protective overlayer of a-SiOC:H is used to prevent moisture ingress or egress.

FIG. 2 shows a comparison of the spectral transmittance of a-SiC:H (N.sub.2 O/CH.sub.4 =0) and of a-SiOC:H films formed by the PECVD process using different N.sub.2 O/CH.sub.4 reactive gas ratios.

FIG. 3 shows an infrared transmittance spectrum of a-SiOC:H in one embodiment of the present invention.

FIG. 4 is a schematic view of the apparatus used to measure leakage currents through protective overlayer materials.

FIG. 5 shows leakage currents measured through an a-SiOC:H film deposited at a substrate temperature of 100.degree. C.

FIG. 6 shows leakage currents measured through a ZrO.sub.2 film deposited at a substrate temperature of 100.degree. C.

FIG. 7 shows leakage currents measured through an ITO (tin-doped indium oxide) transparent conductor film deposited at a substrate temperature of 175.degree. C.

FIG. 8 shows leakage currents measured through a prior art film of amorphous PECVD SiO.sub.2 deposited at a substrate temperature of 100.degree. C.

FIG. 9 shows the spectral transmittance range of a prior art electrochromic coating.

FIG. 10 shows the spectral transmittance range of an electrochromic coating of the present invention having the structure shown in FIG. 1 wherein the protective overlayer is a-SiOC:H.

FIG. 11 shows the spectral transmittance range of an electrochromic coating of the present invention having a protective overlayer comprising a film of ZrO.sub.2 and a film of a-SiOC:H.

Referring to FIG. 1, a cross-sectional view of an electrochromic device is shown in a preferred embodiment of the present invention. The device contains six layers disposed sequentially over a substrate (10) which, for applications involving modulation of visible and solar radiation, is usually glass or plastic. Layers 11 and 15 are thin-film, transparent electronic contacts. Preferred materials for the transparent contacts (11 and 15) include tin-doped indium oxide (ITO) or fluorine-doped tin oxide (SFO) with a sheet resistivity of <30.OMEGA./sq. Layer 14 is an electrochromic material such as amorphous or crystalline WO.sub.3 or MoO.sub.3 with a preferred thickness of less than 500 nm. Layer 12 is an anodically coloring counter electrode such as IrO.sub.2 or NiO for H.sup.+ systems or Li.sub.y CrO.sub.2+x, V.sub.2 O.sub.5, Nb.sub.2 O.sub.5, TiO.sub.2, and mixed-oxides of V and Cr for Li.sup.+ systems. Separating the electrochromic layer (14) and counter electrode layer (12) is an ion-conducting layer (13) that has a high electronic resistivity. The ion-conducting layer (13) may transport H.sup.+ or Li.sup. + ions, depending on the choice of electrochromic material and counter electrode. For example, choosing WO.sub.3 and Li.sub.y CrO.sub.2+x as electrochromic layer and counter electrode, respectively, necessitates the use of a Li.sup.+ conducting layer while choosing WO.sub.3 and IrO.sub.2 requires a H.sup.+ conducting layer. Preferred materials for the ion conducting layer are hydrated Ta.sub.2 O.sub.5 for H.sup.+ systems and Li.sub.2 O-B.sub.2 O.sub.3 for Li.sup.+ systems. Layer 16 of FIG. 1 is the protective overlayer of the present invention which contains one or more films, at least one of which is a-SiOC:H. The a-SiOC:H is preferably 1 .mu.m thick or less.

A preferred method of forming the amorphous silicon oxycarbide films is PECVD from silane (SiH.sub.4) and methane (CH.sub.4) gas mixtures to which an oxidizer such as oxygen (O.sub.2) or nitrous oxide (N.sub.2 O) is added. The general PECVD process is well known to artisans of vacuum coating technology and is only briefly described herein. The PECVD apparatus comprises a vacuum pumped chamber containing two planar electrodes which are typically 1-3 cm apart. The electro-optical coating is placed on one of the electrodes which is usually heated with a resistive element embedded in the electrode. The other electrode is connected to a high frequency power supply that will typically operate at a frequency between 50 kHz and 13.56 MHz. The reactive gas mixture is introduced into the chamber at a well-controlled flow rate and the gas pressure controlled by modulating the flow rate or by the use of a variable-sized orifice between the chamber and vacuum pumps. When the power supply is energized, a plasma of the reactive gas constituents forms between the electrodes causing an a-SiOC:H film to deposit on the surface of the electro-optical coating. Typical PECVD conditions used to produce a-SiOC:H overlayers on electrochromic coatings are listed in Table 1. Another preferred method of depositing a-SiOC:H films is sputtering from a Si target using a reactive gas mixture that includes methane and either oxygen or nitrous oxide.

A significant improvement in the density and hardness of the a-SiOC:H films deposited using the PECVD process revealed in Table 1 is obtained if the surface being coated is electrically isolated from the heated electrode on which the substrates are placed. Electrical isolation modifies the electrical potential the substrates attain during coating, which results in an increase in ion bombardment during a-SiOC:H deposition. The increased ion bombardment results in densification and improved hardness of the films. For most electro-optical coatings of the present invention, which typically use glass substrates, the electronic isolation occurs without modification to the apparatus since the glass is itself electronically insulating. If, however, the design of the electro-optical device is such that its upper surface is in electrical contact with the heated electrode, improved a-SiOC:H film properties are obtained if a thin insulating plate is placed between the device and the electrode. Glass or alumina are suitable materials for the insulating plate.

In prior art, the use of amorphous silicon carbide (a-SiC:H) as a protective overlayer for integrated circuit elements has been taught by Hirahi et al (U.S. Pat. No. 4.647.472, March 1987) and Bolz et al (U.S. Pat. No. 5,238,866, August 1993). Both teach the use of the PECVD process using silane and methane as reactive gases. Bolz et al further teach the addition of phosphine (PH.sub.3) to the reactive gas mixture to increase the electronic conductivity of the a-SiC:H for improved compatibility with blood. Hiraki et al also teach the addition of impurities of hydrogen, nitrogen, oxygen and a halogen (e.g. Cl of F) for the purpose of maintaining low base-collector leakage currents in semiconductor devices. The impurity content of the a-SiC:H being preferably less than 10% of the stoichiometric composition of the compound formed between the impurity element and silicon.

Prior art a-SiC:H and doped a-SiC:H films are not appropriate as protective overlayers for electrochromic coatings because they are poorly transmissive in the visible spectrum and exhibit a yellow color. This deficiency in transmittance of a-SiC:H is illustrated by the transmittance spectra shown in FIG. 2 which compares the transmittance of a-SiC:H with a-SiOC:H films prepared with different N.sub.2 O/CH.sub.4 ratios in the plasma during PECVD. The spectra shown in FIG. 2 are for films deposited on quartz substrates. The a-SiC:H spectrum, labeled N.sub.2 O/CH.sub.4 =0 in FIG. 2, shows that a-SiC:H films are absorbing in the blue region of the spectrum, from 380 nm to 500 nm, and are thus yellow. The transmittance of the a-SiC:H film, weighted to the photopic response of the human eye using the 1931 CIE response curves as described in the Handbook of Optics (W. G. Driscoll. editor, McGraw-Hill 1978), was 63%. In comparison, a-SiOC:H films deposited with N.sub.2 O/CH.sub.4 ratios of 1/8 or greater have photopic transmittance values exceeding 89%. In addition to having poor visible transmittance, films of a-SiC:H exhibit an electronic resistivity of 10.sup.13 -10.sup.14 .OMEGA.-cm. Although this resistivity is high, it may still lead to undesirable electronic contact between layers in the electrochromic coating if the a-SiC:H is used as a protective overlayer. The electronic contact is likely to occur at the edges of the coating where the different layers are exposed. The contact causes internal shorting with a consequent reduction in the time the coating will retain a set optical state without power consumption. The a-SiOC:H of the present invention has an electronic resistivity of >10.sup.16 .OMEGA.-cm which is at least two orders of magnitude higher than a-SiC:H.

The improved transmittance of the a-SiOC:H films is due to a shift in the optical absorption edge to shorter wavelengths as the oxygen concentration in the films increases. The oxygen concentration is controlled by the O.sub.2 /CH.sub.4 or N.sub.2 O/CH.sub.4 gas flow ratios used during deposition, higher ratios producing films with a higher oxygen content. The optical absorption edge is the minimum energy of light necessary to promote a charge carrier from the valence to conduction band of the material. The energy of light and the corresponding wavelength are related by E=hc/.lambda. where E is the energy of the light, c the speed of light, .lambda. the wavelength, and h Planck's constant. In general, light with a wavelength larger than the absorption edge (lower energy) is transmitted by the material while light of shorter wavelength (higher energy) is absorbed. This concept is familiar to skilled artisans and methods in which the absorption edge is calculated from spectral data are well known. Values for the absorption edge were calculated for the a-SiC:H and a-SiOC:H spectra shown in FIG. 2 by modeling the absorption using the relationship

where .alpha. is the absorption coefficient, A a constant, and E.sub.o the absorption edge. The optical absorption edge for the a-SiC:H film was 2.12 eV (wavelength 585 nm) which is in the blue region of the visible spectrum. The wavelength (.lambda..sub.o) corresponding to the absorption edge is calculated from E.sub.o by the equation .lambda..sub.o =1241/E.sub.o, where E.sub.o is in units of eV and .lambda..sub.o in nm. As the N.sub.2 O/CH.sub.4 ratio increases, the absorption edge moves to higher energies and the a-SiOC:H films become increasingly transmissive in the blue and near-ultraviolet regions of the spectrum. For the a-SiOC:H film deposited with a N.sub.2 O/CH.sub.4 ratio of 1/8, the absorption edge has moved to 3 eV (415 nm) and the photopic transmittance has increased to 89%. The effect of increasing the N.sub.2 O/CH.sub.4 ratio on the optical properties of the a-SiOC:H films are detailed in Table 2.

At higher O.sub.2 /CH.sub.4 or N.sub.2 O/CH.sub.4 reactive gas ratios, the carbon content of the a-SiOC:H is reduced and a film with properties similar to SiO.sub.2 is produced. Although SiO.sub.2 films are highly transparent over the entire solar spectrum, they have poor hermetic properties as shown by the leakage current measurements described in Example 1. At a bias of -5 V, the leakage currents are on the order of 10.sup.-5 A which is comparable with the ITO transparent conductor and orders of magnitude higher than a-SiOC:H.

Thus, it is seen that a-SiC:H and a-SiO.sub.2 are deficient as protective overlayers for electrochromic coatings because of poor transmittance and poor hermeticity, respectively. Careful choice of the O.sub.2 /CH.sub.4 or N.sub.2 O/CH.sub.4 ratio during deposition, however, produces films of a-SiOC:H that have the hermetic properties of a-SiC:H and the solar transmittance characteristics of a-SiO.sub.2. In addition to their desirable optical and hermetic properties, the a-SiOC:H films are deposited at low substrate temperatures and still retain these characteristics. The a-SiOC:H films used in the examples cited herein were deposited at a substrate temperature of 100.degree. C., which is low compared with the 350.degree. C. or higher temperatures used for SiO.sub.2 and other conventional PECVD dielectric passivation materials. The feature of low substrate temperature deposition greatly increases the utility of a-SiOC:H as a protective overlayer for electrochromic coatings since many of the properties of materials used in both H.sup.+ and Li.sup.+ counter ion systems are degraded at elevated temperatures. Films of a-SiOC:H deposited at temperatures below 100.degree. C. can also be used as protective overlayers for electrochromic coatings although the degree of hermetic protection will be reduced.

The effect of the low temperature deposition process on the molecular structure of the a-SiOC:H films is revealed qualitatively by infrared spectral measurements. The infrared spectra contain absorption peaks corresponding to various vibrational modes of different interatomic bonds in the films. An infrared transmittance spectrum of PECVD a-SiOC:H, deposited at 100.degree. C., is shown in FIG. 3. Absorption due to the stretching, bending and rocking modes of the Si-O bond is present at wavenumbers of 1030, 800, and 460 cm.sup.-1, respectively. An absorption band for Si--C is present at .about.740 cm.sup.-1, as a shoulder on the Si-O bending band. In addition, there is a band at 890 cm.sup.-1, indicative of short chain polysilane segments of formula (SiH.sub.2).sub.n. The polysilane segments result from incomplete reaction of SiH.sub.4 at the 100.degree. C. substrate temperature used in the film deposition. The presence of the 890 cm.sup.-1 band indicates that the low temperature films have a molecular structure that is somewhat polymeric in nature. As the substrate temperature or RF power density during deposition increase, the (SiH.sub.2).sub.n band intensity decreases and the a-SiOC:H becomes less polymeric. The a-SiOC:H material of the present invention, therefore, retains the hermeticity and optical transmittance necessary for protective overlayer applications while exhibiting a range of molecular structure.

Following the convention used in prior art (Bolz, U.S. Pat. No. 5,238,866), the chemical formula for the amorphous silicon oxycarbide of the present invention is written as a-SiOC:H (a=amorphous). A chemical composition for the a-SiOC:H films has not been specified since the PECVD and sputtering processes can produce films that have a wide compositional range and still embody the essential features of the present invention. For example, when N.sub.2 O is used as a source of oxygen or when N.sub.2 is used as a diluent gas for SiH.sub.4, some nitrogen is incorporated into the a-SiOC:H. Since the chemical reactions in the PECVD process are incomplete at low deposition temperatures, some H is also incorporated in the films if SiH.sub.4 is used as a precursor material. Furthermore, precise compositional analysis of thin films containing light elements such as H, C, N, Si, and O is difficult, and different analysis techniques are often not in agreement. The formula a-SiOC:H is not meant to indicate a specific oxygen/carbon ratio, nor H or N content in the film. The a-SiOC:H films of the present invention are differentiated from prior art a-SiC:H or doped a-SiC:H films by 1) the optical absorption edge of the a-SiOC:H films which should be 3 eV (415 nm) or greater to provide transparency to visible radiation and 2) by their low transport rates for H.sub.2 O.

In a further embodiment of the invention, the a-SiOC:H film is combined with other optically transparent films to improve the hermeticity or transmissive properties of the protective overlayers It is well known, for example, that multilayer coatings of materials with appropriate indices of refraction and film thickness can be used as antireflection coatings or optical filters. The index of refraction of a-SiOC:H depends on the composition of the film, but is typically 1.6 at a wavelength of 550 nm. This index is similar to that of cerium fluoride which can be used in a variety of antireflection coatings in the solar region of the spectrum (specific designs are discussed by H. A. MacLeod in "Thin-Film Optical Filters," McGraw-Hill, N.Y. 1989). Skilled artisans of optical coating technology will understand that there are many possible multilayer coating designs, using a-SiOC:H for one or more layers, that might be used to modify the optical switching characteristics of an electrochromic coating.

To illustrate the superior properties of a-SiOC:H as a protective overlayer for electrochromic coatings, the rate of H.sub.2 O and ion transport through the films was determined using leakage current measurements. In this measurement technique, the a-SiOC:H film is deposited onto a thermally oxidized Si wafer. A portion of the a-SiOC:H film is placed in contact with an aqueous electrolyte of composition 0.1M NaCl. A platinum electrode is placed in the electrolyte and an external power supply is used to apply a voltage between the Pt electrode and Si substrate. The current flowing between the Pt electrode and the coated Si wafer is measured as a function of the applied voltage. The resulting steady-state DC current at each voltage level is related to the rate at which H.sub.2 O is transported through the a-SiOC:H to the Si/SiO.sub.2 interface. At this interface the H.sub.2 O is either reduced or oxidized, depending on the magnitude and polarity of the applied voltage bias, giving rise to the faradaic current measured in the external circuit. FIG. 4 shows the experimental apparatus used to make the leakage current measurements. When protective overlayer materials with good H.sub.2 O barrier properties are evaluated, the magnitude of the currents is extremely small, often less than 10.sup.-13 A, and care in the design of the measurement apparatus and choice of equipment must be taken.

An example of the leakage currents measured through an a-SiOC:H film of the present invention, subjected to a voltage vias of .+-.5 V, is shown in FIG. 5. At a bias of -5 V volts the maximum current observed was 7.times.10.sup.-13 A. For comparison, the leakage current response of ZrO.sub.2, a protective overlayer material used in prior art optical coatings, is shown in FIG. 6. At -5 V, the leakage through the ZrO.sub.2 is >2.5.times.10.sup.-7 A, more than 5 orders of magnitude greater than that observed with a-SiOC:H. To illustrate the importance of protective overlayers for electrochromic coatings, the leakage currents measured through a film of tin-doped indium oxide (ITO) used as a transparent electrode are shown in FIG. 7. The ITO was deposited at a substrate temperature of 175.degree. C. and is typical of the outer transparent conductor layers (layer 15 in FIG. 1) in electrochromic coatings. The leakage currents through the ITO film are >10.sup.-4 A at both the -5 V and 5 V bias levels. The leakage currents measured through PECVD amorphous SiO.sub.2 are shown in FIG. 8. At -5 V the current through the PECVD SiO.sub.2 film is 1.5.times.10.sup.-7 A, approximately 5 orders of magnitude larger than observed with a-SiOC: H.

An estimate of the transport rate of H.sub.2 O through the protective overlayers can be obtained from the leakage current measurements. For the purpose of illustration, we assume that the leakage currents at the -5 V bias are due to reduction of H.sub.2 O in accordance with the reaction

Since the reaction requires one H.sub.2 O molecule per electron, the leakage current per unit area can be used to calculate a H.sub.2 O transport rate using ##EQU1## where R is the rate of H.sub.2 O transport (molecules/sec-cm.sup.2), j the leakage current density (A/cm.sup.2), F Faraday's constant (96,300 Coulombs/equivalent) and N.sub.o is Avogadro's number (6.02.times.10.sup.23 molecules/equivalent). From the a-SiOC:H leakage current data shown in FIG. 5, the current at -5 V is -7.times.10.sup.-13 A. Since the area of the film exposed to the electrolyte is 0.6 cm.sup.2, the rate of H.sub.2 O transport through the a-SiOC:H is 7.times.10.sup.6 molecules/sec-cm.sup.2. For the prior art ZrO.sub.2 protective overlayer, the leakage currents shown in FIG. 6 indicate a H.sub.2 O transport rate of 2.6.times.10.sup.12 molecules/sec-cm.sup.2. The PECVD SiO.sub.2 films have a transport rate of 1.6.times.10.sup.12 molecules/sec-cm.sup.2. From the comparison of H.sub.2 O transport rates, it is apparent that the a-SiOC:H has exceptionally low transport rates compared with prior art materials that might be used for the protection of electro-optical coatings.

The electronic resistivity of a-SiOC:H and a-SiC:H were determined from the slope of the current-voltage response of films deposited on ITO-coated glass. Electrical contact pads of Au were deposited on the a-SiC:H and a-SiOC:H films and the current flow through the films measured in response to a voltage applied between the ITO and the Au pads. The resistivity of the a-SiC:H was 3.times.10.sup.13 .OMEGA.-cm. The a-SiOC:H was too resistive for an accurate measurement and a lower bound of 10.sup.16 .OMEGA.-cm was estimated from the current-voltage data. The electronic conductivity of the a-SiOC:H is comparable with SiO.sub.2 or Si.sub.3 N.sub.4 dielectric coatings used in conventional IC passivation while the a-SiC:H is more conductive.

Film stress in PECVD a-SiOC:H was calculated from changes in the curvature of a Si wafer before and after coating with a 400 nm thick a-SiOC:H film. The wafer curvature was measured using the laser interferometry method which is well known in the semiconductor industry. The stress in the a-SiOC:H was compressive and ranged from 96-107 MPa. The stress in an a-SiC:H film deposited under similar conditions was also compressive but much higher, 417-504 MPa. The low film stress in the a-SiOC:H minimizes delamination failure in protective overlayers and allows the overlayers to be used with electrochromic coatings on flexible polymer as well as glass substrates.

A thin-film electrochromic coating was formed on a glass substrate by sequential vacuum deposition of the following layers: a transparent conductor of ITO, a counter electrode of Li.sub.y CrO.sub.2+x ; a Li.sup.+ ion conductor of Li.sub.2 O-B.sub.2 O.sub.3 ; an electrochromic film of amorphous WO.sub.3 ; and, a second transparent conductor of ITO. Details of the deposition processes are taught in Cogan and Rauh, U.S. Pat. No. 5,080,471. The minimum and maximum transmittance spectra of the coating are shown in FIG. 9 at an applied voltage of .+-.3 V. The coating has a luminous (photopic) transmittance range of 9% to 74% at these switching voltage levels. The electrochromic coating was then placed in a commercial PECVD system and a protective overlayer of a-SiOC:H deposited on the coating using the process conditions provided in Table 1. The thickness of the as-deposited a-SiOC:H was approximately 500 nm. The minimum and maximum transmittance spectra of the coating at .+-.3 V after a-SiOC:H deposition are shown in FIG. 10. The luminous transmittance range of the coating with the a-SiOC:H is 7% to 79%.

A thin-film electrochromic coating was formed on a glass substrate in the manner described in Example 3. A protective overlayer comprising a 190 nm thick film of e-beam evaporated ZrO.sub.2, deposited at a substrate temperature of 100.degree. C., and a 500 nm thick film of a-SiOC:H deposited in accordance with the conditions described in Table 1 was then deposited over the coating. FIG. 11 shows the spectral transmittance range of the coating. The photopic transmittance (T.sub.1) varied from 11% to 77%.