Compositions, Epoxized Compositions, a Heat Curable Resin Composition, an Epoxy Resin Composition, Radically Polymerized Compositions, a Curable Resin Composition and a Polymer Having Epoxy Groups

The present invention relates to novel compositions comprising a compound having vinyl groups as side chains and epoxidized compositions thereof.

Furthermore, the present invention also relates to heat curable resin compositions which comprise the above-mentioned compositions and a radical initiator, aim epoxy resin composition and a curing agent.

Still further, the present invention relates to another compositions comprising compounds having vinyl groups as side chains, epoxidized compositions thereof, radically polymerized compositions, curable resin compositions prepared by the epoxidized compositions, and a polymer having epoxy groups.

Epoxy resins which have been widely used industrially include the so-called epi-bis type epoxy resins which are produced by reacting bisphenol A with epichlorohydrin.

These resins have advantages, e.g., various products can be obtained, which can vary from liquid to solid state, and they can be cured at room temperatures with polyamines because of the high reactivity of the epoxy resins.

However, cured products thereof are defective in that outdoor durability is poor; electric properties such as anti-tracking property, etc., are poor; and the heat distortion temperature is low, although they do have desirable the characteristics of good water resistance and strength,

Recently, epoxy resins prepared by reacting a phenolic resin or a novolak resin with epichlorohydrin have been used as resins for encapsulating VLSI(very large scale integrated circuit), a light emitting or receiving device, etc.

But, chlorine contained in the resins, typically in an amount of several hundreds ppm, causes the problem of a deterioration of the electric properties of such electronic devices.

Epoxy resins having excellent electric properties and heat resistance, and which do not contain chlorine are known. These include certain alicyclic epoxy resins which are produced by an epoxidation reaction of a compound having a 5-membered or 6-membered cycloalkenyl structure.

The epoxy group in these resins is a so-called inner epoxy group, and curing is usually carried out with acid anhydride by heating.

However, since their reactivity is low, they cannot be cured with polyamines at room temperature, and therefore, the use of the alicyclic epoxy resins has so far been technically restricted.

As alicyclic epoxy resins, those having a structure represented by formula (X-I) or (X-II) are presently used commercially. ##STR1##

(X-I) is used as a heat resistant epoxy diluent, because of its verylow viscosity.

However, it has the disadvantage of possessing high toxicity andcauses the problem of poisoning upon contact with the skin of the humanbody. (X-II) contains only a small amount of impurities and has a low colorhue, and the cured products produced therewith have a high heat distortiontemperature.

However, many epoxy resins suffer from the problem of poor waterresistance due to the presence of ester bonds.

In addition, because epoxy resins (X-I) and (X-II) have lowviscosity, it is impossible to apply molding systems for solid epoxyresins, such as transfer molding, etc., thereto.

From the above viewpoint, novel alicyclic epoxy resins havingoxycyclohexane units and ether bonds were taught in Japanese PatentExamined Publication (Kokoku) Nos. 31493/1989, 10471/1992 (equivalent toU.S. Pat. No. 4,565,859).

However, the above epoxy resins have lower softening temperatures.

In addition, not only the overcoming of the above described problems,but also the number of methods or objects involving the use of epoxy resinshave grown, and so have the desired characteristics of such epoxy resins;for example, a demand for epoxy resins having excellent various propertieshas increased.

From the above viewpoint, and as a result of intensive studies by thepresent inventors, it was found that softening temperatures of epoxy resinscan be readily adjusted in a wide range by incorporating ester units inplace of ether units into main chain of the molecule.

Furthermore, unsaturated carboxylic esters having vinyl groups areuseful as, for example, curing agents for an acrylic rubber.

Allyl methacrylate is known as a typical unsaturated carboxylic esterhaving vinyl groups.

However, in the case that allyl methacrylate is used as a curingagent for an acrylic rubber, there is a tendency of easy gelation tobecause of its high reactivity.

On the other hand, glycidyl (meth)acrylate and 3,4-epoxycyclohexylmethyl(meth)acrylate are known as an unsaturated carboxylic ester havingepoxy groups.

Recently in particular, it has been taught that 3,4-epoxycyclohexylmethyl(meth)acrylate can be used as a coating composition to be cured bya cationic curing reaction, for example, in Japanese Patent UnexaminedPublication (Kokai) Nos.108048/1988, 108049/1988(equivalent to U.S. Pat.No. 4,772,672), (Kokai) Nos.123814/1989, 123817/1989(equivalent to U.S. Pat. No.4,923,945), (Kokai) Nos.129018/1989, 129019/1989(equivalent to U.S. Pat. No.4,927,884), etc.

However, the reaction control is difficult because 3,4epoxycyclohexylmethyl(meth)acrylate has an epoxy group directly bondedto the cyclohexane ring resulting in high reactivity with the cationiccuring agent.

In the above-mentioned prior arts, the problem is solved by using amacromonomer in which 3,4-epoxycyclohexylmethyl (meth)acrylate is radicallypolymerized with a monomer having silicone atoms, etc.

On the other hand, glycidyl (meth)acrylate often shows a too lowreactivity even by combination with various curing agents.

Furthermore, glycidyl (meth)acrylate includes chlorine because ofthe use of epichlorohydrin as a starting material, whereby cured articlesor coating layers therefrom have a tendency of being adversely affected.

From the above viewpoint, and as a result of intensive studies by thepresent inventors, it was found that the problem can be solved by anunsaturated carboxylic ester or ether composition having epoxy groups.

An object of the present invention is to provide novel compositionscomprising compounds having vinyl groups as a side chains and epoxidizedcompositions thereof. These novel compositions are useful as powdercoating compositions, radically polymerized compositions, epoxy resincompositions, compositions for encapsulating, compositions for solderresist inks and (photo)curable compositions.

The present, compositions can be prepared by a reaction of (a) with(b), by a reaction of (b) and (c) with (a) described below, and by anepoxidation reaction thereof; wherein

(a) is a compound having at least one vinyl group and one epoxy group inthe molecule;

(b) is at least one of a polybasic compound, an anhydride thereof, apolymer having carboxylic groups at terminal portions and a polymerhaving carboxylic groups as side chains;is at least one organic compound having at least one active hydrogen

(c) is at least one organic compound having at least one active hydrogenatom.

The present epoxy compositions provide excellent properties of beingadjustable in softening temperatures in coating layers, etc.

Another object of the present invention is to provide an anothercomposition comprising compounds having vinyl groups as side chains andepoxidized composition thereof, which are useful as an unsaturated monomerradically polymerized compositions and a curable resin composition,

The compositions can be prepared by a reaction of (a) with (d)described below, and by an epoxidation reaction thereof; wherein

(a) is a compound having at least one vinyl group and one epoxy group inthe molecule;

(d) is at least one of an unsaturated monocarboxylic compound or anunsaturated monocarboxylic ester having a hydroxyl group.

The composition comprising compounds having vinyl groups as sidechains is useful as an unsaturated monomer which is capable of copolymerizingwith other monomers.

Furthermore, the epoxidized composition is useful for a curable resincomposition, inks, various coatings and insulating varnishes, etc.

The present invention is described hereinafter in more detail.

According to a first aspect of the present invention, there isprovided a composition (I) comprising compounds having vinyl groups as sidechains.

The composition (I) comprising a compound having vinyl groups as sidechains can be obtained by the reaction of (a) with (b) ; wherein

(a) is a compound having at least one vinyl group and one epoxy group inthe molecule

(b) is at least one of a polybasic compound, an anhydride thereof, apolymer having carboxylic groups at terminal portions and a polymerhaving carboxylic groups as side chains.

According to a second aspect of the present invention, there isprovided another composition (II) comprising compounds having vinyl groupsas side chains.

The composition (II) comprising a compound having vinyl groups as sidechains can be obtained by reacting (c) with (b), and subsequently with (a),or by a simultaneous reaction of (c), (b) and (a) ; wherein

(a) is a compound having at least one vinyl group and one epoxy group inthe molecule

(b) is at least one of a polybasic compound, an anhydride thereof, apolymer having carboxylic groups at terminals and a polymer havingcarboxylic groups as side chains

(c) is at least one organic compound having at least one active hydrogenatom.

According to a third aspect of the present invention, there isprovided other composition (III) comprising compounds having vinyl groupsas side chains.

The composition (III) comprising compounds having vinyl groups as sidechains can be obtained by a reaction of (a) with (d); wherein

(a) is a compound having at least one vinyl group and one epoxy group inthe molecule

(d) is at least one of an unsaturated monocarboxylic compound or anunsaturated monocarboxylic ester having a hydroxyl group.

The compound(a) having at least one vinyl group and one epoxy groupin the molecule, which is a common starting material in the first, secondand third aspects of the present invention, can be mainly represented bygeneral chemical formula described below; ##STR2## <wherein, n is an integer of from 1 to 5, R.sup.1 and R.sup.2 are a hydrogen atom oran alkyl group or substituted phenyl group having carbon numbers of from1 to 5, R.sup.2 and R.sup.3 are a hydrogen atom or an alkyl group having carbonnumbers of from 1 to 50, and R.sup.2 and R.sup.3 may be taken together to form aring structure>.

Specific illustrative examples of the compound(a) include 4-vinylcylohexene-1-oxide,5-vinylbicyclo 2.2.1!hepto-2-en-2-oxide,limonene monoxide, trivinylcyclohexane monoxide, divinylbenzene monoxide, butadienemonoxide and 2-epoxy-9-decene.

Furthermore, allylglycidylether which is represented by generalformula described below; ##STR3## in which n1 and n2 are an integer of from 0 to 380, respectively,glycidylstyryl ether which is represented by general formula as describedbelow; ##STR4## in which n is an integer of from 0 to 30, are also included.

Still further, the following compounds; ##STR5## in which n is an integer of from 0 to 30, ##STR6## in which n1, n2 and n3 are an integer of from 0 to 30, respectively,n1+n2+n3 is an integer of from 1 to 30, can be also used as a compound(a)having at least one vinyl group and one epoxy group in the molecule.

One or more of the above-mentioned compounds(a) can be used.

It is noted that there can be additionally used a monoepoxide suchas ethylene oxide, propylene oxide, cyclohexeneoxide, styrene oxide, alphaolefinepoxide, etc. and or a diepoxide such as vinylcyclohexenediepoxide,3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexaneca rboxylate, etc., togetherwith the compound(a) having at least one vinyl group and one epoxy groupin the molecule.

Successively, the compound(b) which is also a common startingmaterial in the first and second aspects of the present invention, isdescribed below.

The compound(b) includes a polybasic compound or an anhydridethereof, a polymer having carboxylic groups at terminal portions and apolymer having carboxylic groups as side chains.

Polybasic compounds or anhydrides thereof include aliphatic oraromatic polybasic compounds and anhydrides thereof.

Aromatic polybasic compounds and anhydrides thereof include, forexample, phthalic anhydride, isophthalic acid, terephthalic acid andtrimellitic anhydride.

Aliphatic polybasic compounds and anhydrides thereof include, forexample, tetrahydrophthalic acid, 4-methylhexahydrophthalic acid,hexahydrophthalic acid, adipic acid, maleic acid and anhydrides thereof,fumaric acid, sebacic acid and dodecanoic acid, etc.

Polymers having carboxylic groups at terminal portions include apolyether or polyester compound having carboxylic groups at terminalportions prepared by a reaction of a polybasic acid with, for example, apolyethyleneglycol, polypropyleneglycol, a polytetramethyleneglycol, apolybutyleneglycol, a polycyclohexeneglycol and a polyvinylcyclohexeneglycol, a polybutadiene having carboxylic group at terminal positions anda polycaprolactone having carboxylic groups at terminal positions.

Polymers having carboxylic groups as side chains include, forexample, acrylic (co)polymers.

One or more of the compound(b) can be used.

Successively, the compound(c) is described below.

The compound(c) which is at least one organic compound having atleast one active hydrogen atom, and which is a starting material in onlythe second aspect of the present invention, includes alcohols, phenols,carboxylic acids, amines and thiols, a polymer having hydroxyl groups atterminal positions and a polymer having hydroxyl groups as side chains.

As alcohols, either monohydric alcohols or polyhydric alcohols maybe used. For instance, aliphatic alcohols such as methanol, ethanol,propanol, butanol, pentanol, hexanol, octanol; aromatic alcohols such asbenzyl alcohol; polyhydric alcohols such as ethylene glycol, diethyleneglycol, triethylene glycol, polyethylene glycol, propylene glycol,dipropylene glycol, 1,3-butanediol, 1,4-butanediol, butanetriol, pentanediol,1,6-hexanediol, neopentyl glycol, neopentyl glycol oxypivalate,cyclohexanedimethanol, glycerine, diglycerine, polyglycerine, trimethylolpropane,trimethylol ethane, pentaerythritol, dipentaerythritol, ahydrogenated bisphenol A, a hydrogenated bisphenol F, a hydrogenatedbisphenol S, etc., are included.

Phenols include phenol, cresol, catechol, pyrogallol, hydroquinone,hydroquinone monomethylether, bisphenol A, bisphenol F, 4,4'-dihydroxybenzophenone,bisphenol S, an adduct of ethyleneoxide to bisphenol A, anadduct of propyleneoxide to bisphenol A, phenol resins, cresol novolakresins, etc.

A polymer having hydroxyl groups at terminal positions includespolyvinyl alcohol, partially hydrolyzed products of polyvinyl acetate,starch, cellulose, cellulose acetate, cellulose acetate butylate,hydroxyethyl cellulose, acrylic polyol resins, styrene-allyl alcoholcopolymer resins, styrene-maleic acid copolymer resins, alkyd resins,polyester polyol resins, polyester carboxylic acid resins, polycaprolactonepolyol resins, polypropylene polyol, polytetramethylene glycol, polycarbonatepolyols,and a polybutadiene having hydroxyl groups, cellulosepolymers such as hydroxylethyl celluloses, cellulose acetates, etc.

A polymer having hydroxyl groups as side chains includes an acrylic(co)polymer having hydroxyl groups.

Carboxylic acids include formic acid, acetic acid, propionic acid,butyric acid, fatty acids of animal and vegetable oil and fats, fumaricacid, maleic acid, adipic acid, dodecanedioic acid, trimellitic acid,pyromellitic acid, polyacrylic acid, phthalic acid, isophthalic acid,terephthalic acid, etc.

In addition, compounds having a hydroxyl group together with acarboxylic acid group such as lactic acid, citric acid, oxycaproic acid,are included.

Amines include monomethylamine, dimethylamine, monoethylamine,diethylamine, propylamine, monobutylamine, dibutylamine, pentylamine,hexylamine, cyclohexylamine, octylamine, dodecylamine, 4,4'-diaminodiphenylmethane,isophorondiamine, toluenediamine, hexamethylene diamine, xylenediamine, diethylene triamine, triethylene tetramine, ethanolamine, etc.

Thiols include mercaptans such as methyl mercaptan, ethyl mercaptan,propyl mercaptan, phenylmercaptan, etc., mercaptopropioic acid orpolyhydric alcohol esters of mercaptopropioic acid, such as ethylene glycolbismercapto propionate, trimethylolpropane trimercapto propionate,pentaerythritol pentamercaptopropioic acid, etc.

Still further, the compounds having at least one active hydrogen atommay have an unsaturated double bond in their structure, examples of whichinclude allyl alcohol, acrylic acid, methacrylic acid, 2-hydroxyethyl(meth)acrylate, 3-cyclohexenemethanol, tetrahydrophthalic acid, etc.

One or more of such compounds having active hydrogen atoms can beused.

And successively, the compound(d) which is a starting material inonly the third aspect of the present invention, is described below.

The compound(d) is at least one selected from the group consistingof an unsaturated monocarboxylic compound or an unsaturated monocarboxylicester having a hydroxyl group.

The specific examples of the compound(d) include acrylic acid,methacrylic acid, 2-hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth) acrylate,2-hydroxybutyl(meth)acrylate, 2-hydroxyethyl(meth)acrylatemodified by epsilon-caprolactone, 4-hydroxybutyl(meth)acrylate modified byepsilon-caprolactone.

It is noted that although acrylic acid, methacrylic acid, 2-hydroxyethyl(meth)acrylateare included in the above-mentioned compound(c)as a compound having at least one active hydrogen atom, these compoundshave a different role in compound(d).

The composition(I) comprising compounds having vinyl groups as sidechains in the, first aspect of the present invention can be prepared by thefollowing process.

The process is a ring opening reaction of an epoxy ring withcarboxylic groups, resulting in an accompanying esterification reactionbetween residual carboxylic groups and hydroxyl groups derived from thering opening reaction of an epoxy ring.

In the process, the compound(a) is allowed to react with thecompound(b) in the mixing ratio of (a) with respect to (b) of generallyfrom 0.4 to 5.0 by mol, preferably, from 0.5 to 3.0 by mol.

Where the mixing ratio of the compound(a) is less than 0.4, theamount of vinyl groups in the composition comprising a compound havingvinyl groups as side chains becomes lower, resulting in the relativeincrease of carboxylic group at terminal positions and resulting inunreacted compound(b) partially remaining.

Where the mixing ratio of the compound(a) is more than 5.0, therelative amount of hydroxyl group at terminal positions increases,resulting in unreacted compound(a) partially remaining.

In the ring opening reaction of epoxy ring with carboxylic groups,a catalyst may be used in order to promote the ring opening reaction.

Catalysts include tertiary amines such as dimethyl benzylamine,triethylamine, tetramethyl ethylenediamine, tri-n-octylamine, quaternaryammonium salts such as tetramethyl ammonium chloride, tetramethyl ammoniumbromide, tetrabutyl ammonium bromide, alkyl ureas such as tetramethyl ureaand alkyl guanidine such as tetramethyl guanidine, etc.

One or more of the catalysts may be used.

These catalysts are used in the concentration of generally from 0. 1 to 5.0% by weight, and preferably from 0.5 to 3.0%, based on the weightof the compound(a).

The reaction can be carried out at the temperature of from 50.degree. to 200.degree. C.,preferably from 100.degree. to 180.degree. C.

The second aspect of the invention includes a two step reaction inwhich the compound(b) is first allowed to react with the compound(c) toprepare a compound having carboxyl groups at terminal positions and thenthe compound having carboxyl groups at terminal positions is allowed toreact with the compound(a), and or one step reaction by a simultaneousaddition of (c), (b) and (a).

The above-mentioned two step reaction includes a ring openingreaction of epoxy ring with carboxylic groups, resulting in an accompanyingesterification reaction between residual carboxylic groups and hydroxylgroups derived from the ring opening reaction of an epoxy ring.

In the above-mentioned two step reaction, 20-70 parts of carboxylicgroup in the compound(b) is preferably allowed to react with 80-30 partsof active hydrogen atom in the compound(c) in order to prepare the compoundhaving carboxylic groups at terminal positions.

Successively, the compound having carboxylic groups at terminalpositions is allowed to react with the compound(a) at mixing ratio of thecompound(a) with respect to the compound having carboxylic groups atterminal positions of generally from 0.4 to 5.0 by mol, preferably, from0.5 to 3.0 by mol.

In the above-mentioned one step reaction, catalyst may preferably beused. Examples of catalysts include tin compounds such as stannousoctylate or dibutyl tin laurate or titanium compounds such as tetrabutyltitanate.These catalysts are used in the concentration of generally from10 ppm to 1000 ppm, and preferably from 50 to 500 ppm, based on the totalweight of the starting compounds.

The reaction can be carried out at the temperature of from 180.degree. to 240 .degree. C.One or more of the catalysts may be used. In the one step reaction,the compound(c) may be allowed to react with together with (a) and (b) inthe mixing ratio as described hereinabove.

Furthermore successively, there is described a preparation processof a composition(III) comprising compounds having vinyl groups as sidechains, which is a third aspect of the present invention.

In the, preparation process, the compound(a) is allowed to react withthe compound(d) in the mixing molar ratio of (a)/(d) from 0.1 to 100,preferably from 1 to 5.

Where the mixing ratio of (a)/(d) is less than 0.1, the resultingcomposition inevitably includes only minor amounts of the compounds havingvinyl groups as side chains.

On the other hand, where the mixing ratio of (a)/(d) is more than100, the resulting composition inevitably includes the compounds having ahigher molecular weight.

The preparation process includes an esterification reaction in whichthe compound(a) is allowed to react with an unsaturated monocarboxyliccompound, and an etherification reaction in which the compound(a) isallowed to react with an unsaturated monocarboxylic ester having a hydroxylgroup.

In the esterification reaction, there may be preferably usedcatalysts described below.

Catalysts include tertiary amines such as triethylamine, benzyldimethylamine,quaternary ammonium salts such as tetrabutyl ammoniumchloride or tetrabutyl ammonium bromide, and the like; secondary aminesalts such as acetic or formic salts of diethylamine; hydroxides of alkalimetals or alkali earth metals such as KOH, NaOH, Ca(OH).sub.3 and the like;alkali salts or alkali earth salts such as sodium acetate, calcium acetate;cyclic compounds having nitrogens such as imidazoles or diazabicycloundecene,and the like; phosphorous compounds such as triphenylphosphine ortributylphosphine and the like.

In the etherification reaction, there may be preferably usedcatalysts described below.

Catalysts include amines such as methylamine, ethylamine, propylamine,piperazine, and the like; organic bases such as pyrizines, imidazoles,and the like; organic acids such as quaternary ammonium salts such astetrabutyl ammonium bromide, and the like; formic acid, acetic acid,propionic acid and the like; inorganic acids such as sulfuric acid,hydrochloric acid, and the like; alcoholates of alkali metals such assodium methylate and the like; alkalis such as KOH, NaOH, and the like;Lewis acids such as BF.sub.3, ZnCl.sub.2, AlCl.sub.3, SnCl.sub.4, and the like; or complexcompounds of the Lewis acids, and organometallic compounds such as triethylaluminum, diethyl zinc, and the like.

These catalysts are used in a concentration of from 0.01 to 10% byweight, and preferably from 0.1 to 5%, based oil the weight of the startingmaterials.

The esterification reaction can be carried out at the temperatureof from 5.degree. to 150.degree. C., preferably from 80.degree. to 120.degree. C.

The etherification reaction can be carried out at the temperatureof from -20.degree. to 150.degree. C., preferably from 0.degree. to 150.degree. C.

The esterification and etherification reactions can be also carriedout in the presence of solvent.

A solvent having active hydrogen atoms cannot be used, e.g., ketonessuch as acetone, methyl ethyl ketone, methyl isobutyl ketone, and the like.On the other hand, aromatic solvents such as benzene, toluene, xylene, andthe like and ethers, aliphatic hydrocarbons, and esters can be used.

Furthermore, the esterification or etherification reaction in orderto prepare the composition (III) can be also preferably carried out in thepresence of a polymerization inhibitor for the purpose of preventingradically thermal polymerization of (meth)acrylic groups.

It is generally known that molecular state oxygen can be used as theradically thermal polymerization inhibitor for (meth)acrylic group.

Furthermore, two groups of specific polymerization inhibitors can bemore effectively used together with molecular state oxygen.

The first group of the polymerization inhibitor includes hydroquinone,hydroquinone monomethylether, p-benzoquinone, cresol, t-butylcatechol, 2,4-dimethyl-6-t-butylphenol, 2-tert-butyl-4-methoxy phenol, 3-tert-butyl-4-methoxy phenol, 2,6-di-tert-butyl-p-cresol, 2,5-dihydroxy-p-quinone,piperidine, ethanolamine, alpha-nitroso-beta-Naphtol, diphenylamine,phenothiazine, N-nitrosophenylhydroxyl amine, N,N-diethylhydroxylamine, etc.

The second group of the polymerization inhibitor includes phosphoricacid, potassium phosphate, sodium phosphate, ammonium hydrogen phosphate,pyrophosphoric acid, potassium pyrophosphate, sodium pyrophosphate, 2ethylhexyl pyrophosphate,potassium 2-ethylhexyl phosphate, sodium 2-ethylhexyl phosphate,tripolyphosphoric acid, potassium tripolyphosphate,and sodium tripolyphosphate.

Although one or more of the first or second polymerization inhibitorscan be used, more preferably, both of the first compound and secondcompound can be, in combination, used together with molecular oxygen,resulting in generating a synergistic effect.

An example of specific molecular state oxygen is air.

Air may be introduced into either liquid phase or gas phase in thereaction vessel. Furthermore nitrogen gas is generally introduced intothe reaction vessel in order to prevent forming an explosive gas mixture.

Although higher oxygen/nitrogen volume ratio is more effective forthe purpose of preventing radical polymerization of (meth)acrylic group,it is more than 0.01%, preferably from 3 to 5% depending upon the kindof solvent .

Furthermore, although oxygen and nitrogen may be independentlyintroduced, it is important that equipment in the reaction vessel arearranged safely so that an explosive gas mixture is not even partiallyformed.

The amount used of the first polymerization inhibitors rangesgenerally from 0.005 to 5%, more preferably from 0.001 to 0.1% by weightbased on the unsaturated carboxylic acid or the ester thereof dependingupon the kinds of starting materials and various reaction conditions.

The amount used of the second polymerization inhibitors rangesgenerally from 0.001 to 1%, more preferably from 0.01 to 0.2% by weight.

The polymerization inhibitors may be charged either in the form ofpowders or a solution with solvents.

It is noted that the polymerization inhibitors can be also preferablyused in the epoxidation reaction of the composition (III) describedhereinafter.

Furthermore, it is noted that in the case of using 2-hydroxyethylacrylateas an unsaturated carboxylic ester having a hydroxyl group which isan initiator, the composition (III) having vinyl groups as side chains canbe represented by the general chemical formula as shown below;

<wherein, r is an integer of from 1 to 100 which depends upon the mixingratio of 2-hydroxyethylacrylate with respect to the compound(a) having atleast one vinyl group and one epoxy group in one molecule, Y is a residualgroup which has at least one vinyl group as a side chain derived from thecompound(a)>.

According to a fourth aspect of the present invention, there isprovided an epoxy composition (XI) in which there are epoxidized vinylgroups as side chains in the above-mentioned compositions prepared by thereaction of (b) with (a).

According to a fifth aspect of the present invention, there isprovided an epoxy composition (XII) in which there are epoxidized vinylgroups as side chains in the above-mentioned compositions prepared by thesimultaneous addition reaction of (a), (b) and (c).

According to a sixth aspect of the present invention, there isprovided an epoxy composition (XIII) in which there are epoxidized vinylgroups as side chains in the above-mentioned composition prepared by thereaction of (a) with (d).

The three types of epoxy compositions in the fourth, fifth and sixthaspects can be prepared by the epoxidation reactions of the respectivecompositions(I), (II) and (III) comprising compounds having vinyl groupsas side chains in the first, second and third aspects of the invention,with an epoxidation agent.

An epoxidation agent such as a peracid or various hydroperoxides canbe used in the epoxidation.

For example, the peracids include performic acid, peracetic acid,perpropionic acid, perbenzoic acid, trifluoroperacetic acid, etc.

Of these, peracetic acid is the preferred epoxidation agent, becauseit is prepared on an industrial basis at an economical price and has highstability.

The hydroperoxides include hydroperoxide, tertiarylutylhydroperoxide,cumeneperoxide, metachloroperbenzoic acid, etc.

When carrying out the epoxidation reaction, a catalyst can optionallybe used. For example, an alkali such as sodium carbonate, or an acid suchas sulfuric acid, can be used as a catalyst in the case of using peraceticacid. Furthermore, it is possible to obtain a catalytic effect, forexample, using a mixture of tungstic acid and sodium hydroxide togetherwith hydrogen peroxide, or hexacarbonylmolybdenum together with tertiarybutyl hydroperoxide in the case of using hydroperoxides.

The epoxidation reaction is carried out in the absence or thepresence of a solvent, while adjusting the reaction temperature accordingto the apparatus and the properties of the raw materials.

The temperature range of the reaction can be selected according tothe reactivity of the epoxidation agents to be used.

In the case of peracetic acid which is a preferred epoxidation agent,the preferred temperature range is from 0.degree. to 70.degree. C.

If it is under 0.degree. C., the reaction velocity is slow, and if it is over70.degree. C., a decomposition of peracetic acid tends to occur.

Furthermore, in the case of tertiarybutylhydroperoxide/molybdenumdioxide diacetyl acetate which is an example of a hydroperoxide, it ispreferably from 20.degree. C. to 150.degree. C., based on the same reason.

The use of solvents is effective for lowering the velocity ofreaction of the raw materials and stabilizing the epoxidation agent bydilution.

In the case of peracetic acid, preferred solvents include aromaticcompounds, ether compounds and ester compounds.

In particular, ethyl acetate or xylene are the preferred solvents.

For example, in the case of peracetic acid, there can be also usedan alkali such as sodium carbonate and an acid such as sulfuric acid as acatalyst.

The molar ratio of the epoxidation agent to be used with respect tothe unsaturated bonds is selected according to the proportion of theunsaturated bonds to be desirably retained.

When preparing compositions having many epoxy groups, an equal orhigher molar ratio of the epoxidation agents to the unsaturated bonds ispreferably used.

However, a molar ratio of more than 10 to the unsaturated bonds isdisadvantageous, because of economy and of the side reactions describedhereinafter, in the case of peracetic acid, a preferable molar ratio is 1 to 5.

Substituted groups are produced by the side reaction between epoxygroups and acetic acid is by-produced and contained in the desired product,depending upon the epoxidation conditions together with the epoxidation ofdouble bonds.

At least one of additives as described hereinafter can be added inorder to prevent such adverse affects:phosphoric acid, potassium phosphate, sodium phosphate, ammonium hydrogenphosphate,pyrophosphoric acid, potassium pyrophosphate, sodium pyrophosphate,potassium 2-ethylhexyl pyrophosphate, sodium 2-ethylhexyl tripolyphosphate,potassium 2-ethylhexyl tripolyphosphate, tripolyphosphoric acid,potassium tripolyphosphate and or sodium tripolyphosphate, sodium 2-ethylhexyltetrapolyphosphate, potassium 2-ethylhexyl tetrapolyphosphate.

The addition amount is generally from 10 ppm to 10,000 ppm, andpreferably from 50 ppm to 1,000 ppm.

It is noted that such additives are described hereinabove as one ofpolymerization inhibitors for the composition(III) in the third aspect ofthe present invention.

It generally appears that the addition effect depends upon inactivationof metals derived from the reaction vessel or materials by chelating.

Flushing with water is preferably carried out for the purpose ofremoving minor amounts of impure components in the reaction.

The amount of water used in flushing is generally from 0.1 to 10 foldsamounts, preferably from 1 to 5-folds amounts, based on the reactioncrude solution volume.

Furthermore, an aqueous alkali solution can be used in order toremove minor amounts of acids, and further water can be used in order towash.

An aqueous solution of an alkalis material such as NaOH, KOH, K.sub.2 CO.sub.3,Na.sub.2 CO.sub.3, KHCO.sub.3, NaHCO.sub.3 and NH.sub.3 can be used.

Of them, aqueous solutions of NaOH, Na.sub.2 CO.sub.3, NaHCO.sub.3 can be preferablyused from the view point of solutions separability and economy.

The concentration used can optionally be selected over a broad range.

The aqueous alkali flushing and water flushing can be carried out ina temperature of generally from 10.degree. to 90.degree. C., and preferably is from 10.degree. to50.degree. C.

After water flushing and settling, the organic layer in which desiredepoxidized products are included is separated from the water layer,followed by removing materials having low boiling points, to obtain theproduct.

For example, low boiling materials such as solvents are removed bydistillation. The distillation condition for removing the low boilingcomponents is from 50.degree. to 200.degree. C., and preferably from 800.degree. to 160.degree. C.

Furthermore, the degree of pressure reduction can be allowed to reactby adjusting depending upon the boiling points of the solvents.

The reactions can be carried out by various processes such as acontinuous process or a batch process.

In the case of the batch process, the starting materials and additivesare preferably charged firstly into a reaction vessel, and then anepoxidizing agent is supplied dropwise.

In the case of the continuous process, the starting materials,an epoxidation agent and additives are supplied continuously into thereaction vessel, and product is continuously taken out of the vessel.

The reaction vessel includes various types such as a completelymixable type or a piston flow type, etc.

The desired epoxidized products can be separated from reaction crudesolutions by various engineering procedures.

According to a seventh aspect of the present invention, there isprovided a heat-curable resin composition which comprises a composition (I)or (II) as described hereinabove, a compound having polymerizable doublebonds and a radical initiator.

Examples of the compound having polymerizable double bonds includecompounds having a styrene type double bond such as styrene, vinyl toluene,chlorostyrene and divinylbenzene; (meth)acrylic esters such as methylmethacrylate, ethyl methacrylate, methyl acrylate and ethyl acrylate; allylesters such as diallylphthalate and a prepolymer thereof; vinyl ethers suchas ethylvinylether and butylvinylether; allyl compounds such as diethyleneglycolbisallylcarbonateand a polymer thereof; unsaturated dicarboxyliccompound such as maleic acid, maleic anhydride and fumaric acid; maleimidessuch as N-phenylmaleimide and N,N'-phenylenebismaleimide derived fromphthalic anhydride; arid unsaturated polyester resins derived from phthalicanhydride, and the like.

One or more of the above-mentioned compounds can be used.

The mixing ratio of the compound(I) or (II) with respect tothe compound having polymerizable double bonds is from 95/5 to 5/95.

Examples of the radical initiator include benzoyl peroxide, t-butylperbenzoateand t-butylcumylperoxide, and the like.

One or more of the above-mentioned compounds can be used.

The radical initiator can be used in the mixing ratio of fromgenerally 0.1 to 5%, preferably from 0.5 to 3% based on the total weightof the compound(I) or (II) and the compound having polymerizable doublebonds.

Where it is less than 0.1%, curable velocity is lower.

On the other hand, where it is more than 5%, there is a tendencythat a cured article exhibits excessive rigidness or foaming.

Furthermore, an accelerator for curing can be optionally used in theheat-curable resin composition of the present invention.

Examples of the accelerator include cobalt naphtate, cobaltoctoenate, manganese naphtate, dimethyl aniline, pyrizine, phenylmorphorine,N,N-dimethylaniline, N,N-dimethylparatoluizine, and the like.

Still further, various additives can be optionally used in the heat-curableresin composition of the present invention.

Examples of the additives include a filler for strengthening such asalumina, titanium, oxide, talc, clay, kaolin, fiber glass, potassiumtitanate fiber, metallic fiber, ceramic fiber, carbon fiber, calciumcarbonate, silica, carbon black, powdered glass; colorants, pigments, moldreleasing agents, thermal stabilizers, anti-oxidants, ultraviolet rayabsorbents, foaming agents, flame retardant agents, anti-staining agentsand coupling agents, and the like.

In addition, the heat-curable resin composition of the presentinvention can be also used as a coating composition by diluting withsolvents.

According to an eighth aspect of the present invention, there isprovided an epoxy resin composition which comprise the epoxy composition(XI)or (XII) as described hereinabove, and a curing agent having afunctional group being capable of reacting with an epoxy group.

Examples of the curing agent having a functional group being capableof reacting with an epoxy group include a carboxyl-terminated polyesterresin having at least two carboxylic groups; phenol type curing agent suchas bisphenol A, bisphenol F, novolak type phenol resins and novolak typecresol resins aromatic polyamine type curing agents such-as m-phenylenediamine, diaminodiphenyl methane, diaminodiphenyl sulfone and an adductthereof; polyamide resins; carboxylic anhydrides such as phthalicanhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, ethyleneglycol bis(anhydrotrimellitate),glyceroltris(anhydrotrimellitate), an alicyclic acid anhydride such asmaleic anhydride, succinic anhydride, tetrahydrophthalic anhydride,methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalicanhydride, etc., and polyhydric alcohol adducts thereof;polymercaptan resins; dicyandiamide; and complex compounds of borontrifluoride, and the like; amines such as ethylenediamine, diethylenetriamine,triethylenetetramine, isophoronediamine, benzyldimethylamine,xylenediamine, methaphenylenediamine, diaminodimethylsulfone, diaminodiphenylmethane, polymethylenediamine, etc., and or imidazoles such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole,2-phenylimidazole, etc.; dicyandiamide and derivativesthereof, polyamide resins which are prepared by a reaction of an aliphaticpolyamine with an aliphatic acid such as a saturated aliphatic acid, a dimeracid or a trimer acid, an organic acid hydrazide, melamine and derivativesthereof, a trifluoroboric compound such as a trifluoroborate-amine complex,a compound having silanolic hydroxyl groups, and the like; organic basessuch as phosphines, quaternary ammonium salts such as tetrabutyl ammoniumbromide, and the like; Lewis acids such as BF.sub.3, ZnCl.sub.2, AlCl.sub.4, SnCl.sub.4, and thelike; and organo metallic compounds such as triethylaluminum, diethyl zinc,BF.sub.3 complexes such as BF3/piperidine complex, and the like.

Furthermore, examples of the curing agent having a functional groupbeing capable of reacting with an epoxy group also include a cationicpolymerization initiator of the following formulae such as a diazoniumsalt such as ##STR7## a sulfonium salt such as R.sub.3 -SMX.sub.R.sup.31, ##STR8## an iodonium salt such as R-I.sup.+ -R MX.sub.R.sup.-,a metal complex such as ##STR9## a sulfonium acetone such as ##STR10## a sulfone compound such as ##STR11## in the above formulae, B is ##STR12## P is ##STR13## R is selected from hydrogen, an alkyl group, phenyl group, an aryl groupand a hydroxyalkyl group, which may be identical or different from eachother, MX.sub.R, is at least one group selected from the group consisting of SbF.sub.6,AsF.sub.6, PF.sub.5 and BF.sub.4 !, a silicone compound having a property of generating asilanol group, or a complex of an aluminum compound by photo-irradiation.

The specific silicone compound is preferably a silicone compoundhaving one group selected from the group consisting of a peroxysilanegroup, an o-nitrobenzyloxy group, and an alpha-ketosilyl group.

Specific silicone compounds having a peroxysilane group are representedby the formula (R.sup.x1).sub.R --Si(O--O--R.sup.x2).sub.4-n in the formula, R.sup.x1 and R.sup.x2 hydrogen, a halogen atom, an alkyl group selected from the group consistingof, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, t-butyl,sec-butyl, n-pentyl, methoxy, ethoxy and chloromethyl or an aryl groupselected from the group of, for example, phenyl, naphthyl, anthranyl,benzyl, which may be identical or different from each other, and which canhave a substituent selected from the group of a halogen atom, a nitrogroup, a cyano group, a methoxy group, etc., and n is a natural number of0 to 3!.

Silicone compounds have specific formulae are described hereinafter ##STR14##

Specific silicone compounds having an o-nitrobenzyloxy group aredescribed hereinafter. ##STR15##

In the above formula, R.sup.1, R.sup.2 and R.sup.3 are hydrogen, a halogen atom, vinylgroup, an aryl group, a substituted or an unsubstituted alkyl group havinga carbon number of from 1 to 10, an alkoxy group having a carbon number offrom 1 to 10, a substituted or an unsubstituted aryl group, a substitutedor an unsubstituted aryloxy group and or a siloxy group, respectively,which may be identical or different from, each other; R.sup.4 is hydrogen, asubstituted or an unsubstituted alkyl group having a carbon number of from1 to 10, or a substituted or an unsubstituted phenyl group; R.sup.5, R.sup.6, R.sup.7 andR.sup.8 are hydrogen, nitro group, cyano group, hydroxy group, mercapto group,a halogen atom, an acetyl group, an aryl group, an alkyl group having acarbon number of from 1 to 5, an alkoxy group having a carbon number offrom 1 to 5, a substituted or an unsubstituted aryl group, a substitutedor an unsubstituted aryl group and or an aryloxy group, respectively, whichmay be identical or different from each other; and p, q and r are each anatural number of 0 to 3, respectively, and have a relationship of1<p+q+r<3!.

Substituted or unsubstituted alkyl groups having a carbon number offrom 1 to 10 include methyl, ethyl, propyl, n-butyl, t-butyl, pentyl,chloromethyl, chloroethyl, fluoromethyl and cyanomethyl, etc., and specificalkoxy groups having a carbon number of from 1 to 10 include a methoxy,ethoxy, n-propoxy and or n-butoxy, etc.

Substituted or unsubstituted aryl groups include a phenyl, p-methoxyphenyl,p-chlorophenyl, p-trifluoromethylphenylvinylmethylphenyl(o-nitrobenzyloxy)silane,t-butylme thylphenyl(o-nitrobenzyloxy)silane,triethyl(o-nitrobenzyloxy)silane, tri(2-chloroethyl)-o-nitrobenzyloxysilane,tri(p-trifluoromethylphenyl)-o-n itrobenzyloxysilane,trimethyl alpha-(o-nitrophenyl)-o-nitrobenzyloxy!silane , dimethylphenyl alpha-(o-nitrophenyl)-o-nitrobenzyloxy!silane, methylphenyldi alpha-(o-nitrophenyl)-o-nitrobenzyloxy!silane, triphenyl(alpha-ethyl-o-nitro benzyloxy)silane,trimethyl(3-methyl-2-nitrobenzyloxy)silane,dimethylphenyl (3,4,5-trimethoxy-2-nitrobenzyloxy)silane, triphenyl(4,5,6-trimethoxy-2-nitrobenzyloxy)silane,diphenylmethyl(5-methyl -4-methoxy-2-nitrobenzyloxy)silane,triphenyl(4,5-dimethyl-2-nitrobenzyloxy) silanevinylmethylphenyl(4,5-dichloro-2-nitrobenzyloxy)silane, triphenyl(2,6-dinitrobenzyloxy)silane,diphenylmethyl(2,4-nitrobenzyloxy)si lane,triphenyl(3-methoxy-2-nitrobenzyloxy)silane, vinylmethylphenyl(3,4-dimethoxy-2-nitrobenzyloxy)silane,dimethyldi(o-nitro benzyloxy)silane,methylphenyldi(o-nitrobenzyloxy)silanevinylphenyldi(o-nitr obenzyloxy)silane,t-butylphenyldi(o-nitrobenzyloxy)silane, diethyldi(o-nitrobenzyloxy)silane, 2-chloroethylphenyldi(o-nitrobenzyloxy)silane, diphenyldi(o-nitrobenzyloxy)silane,diphenyldi(3-methoxy-2-nitrobenzyloxy) silane,diphenyldi(3,4-dimethoxy-2-nitrobenzyloxy)silane, diphenyldi(2,6-dinitrobenzyloxy)silane,diphenyldi(2,4-dinitrobenzyloxy)sil ane, methyltri(o-nitrobenzyloxy)silane,phenyltri(o-nitrobenzyloxy)silane, p-bis(o-nitrobenzyloxydimethylsilyl)benzene,1,1,3,3-tetraphenyl-1,3-di(o-n itrobenzyloxy)siloxane,and 1,1,3,3,5,5-hexaphenyl-1,5-di(o-nitrobenzyloxy) siloxane.

Furthermore, a silicone compound can be used, such as a siliconecompound produced by a reaction between a SiCL-containing silicone resinand o-nitrobenzyl alcohol, a silicone compound having an alpha-ketosilylgroup which is represented by the following formula; ##STR16## (wherein L, m and n are each a natural number of 0 to 3, respectively;L+m+n is 3 or less than 3; R.sup.9, R.sup.10 and R.sup.11 represent a hydrocarbon group suchas an alkyl group having a carbon number of 1 to 10, an aryl group, anallyl group, vinyl group, an allyloxy group and an alkoxy group having acarbon number of 1 to 10, respectively, which can have a substituent suchas a halogen atom, nitro group, cyano group and or methoxy group, whichsubstituents may be identical or different from each other).

Specific compounds having an alpha-ketosilyl group include ##STR17##

The mixing amount of the above described silicone compound isgenerally from 0.2 to 20% by weight, and preferably from 1 to 10% byweight, based on the weight of epoxy resin composition.

Where the amount is smaller than 0.1% by weight, curing of the epoxyresin is not sufficient.

On the, other hand, where the amount is larger than 20% by weight,although available, it is not preferable because of costs and a problemcaused by compounds derived from decomposition of the catalyst.

Furthermore, an aluminum compound can also be used as a photocationicpolymerization initiator for the present epoxy resin compositions.

Specific aluminum compound includes trismethoxy aluminum, trisethoxyaluminum, trisisopropoxy aluminum, trisphenoxy aluminum, trisparamethylphenoxyaluminum, isopropoxy diethoxyaluminum, trisbutoxy aluminum,trisacetoxy aluminum, trisstearato aluminum, trisbutylate aluminum,trispropionato aluminum, trisisopropionato aluminum, trisacetylacetonatoaluminum, tristrifluoroacetylacetonatoaluminum, trishexafluoroacetylacetonatoaluminum, trisethylacetonato aluminum, trissalicylaldehydato aluminum,trisdiethylmalolato aluminum, trispropylacetoacetato aluminum,butylacetoacetato aluminum, trisdipivaloylmethanato aluminum, diacetylacetonatodipivaloylmethanatoaluminum.

The above-mentioned compounds are represented by formulae ##STR18##

At least one of the above described aluminum compounds can be used,in a general amount of from 0.001 to 10% by weight, and preferably from1 to 5% by weight, based on the weight of the present epoxy resincomposition.Where the amount is less than 0.001% by weight, sufficient properties,for example, tensile strength or tensile elongation, etc., cannotbe attained in the cured products.

On the other hand, where the amount is larger than 10% by weight,it is not preferable because of costs and a problem of a tendency oflowering in the resistance to moisture.

One or more curing agents can be used.

The epoxy resin compositions of the present invention which comprisesthe epoxy composition(XI) or (XII) and a curing agent can provideencapsulating resin compositions, for example, for a light emitting orreceiving device, a resin composition for solder resist inks and coatingcompositions, for example, such as a powder coating composition and photocurablecompositions .

Preferred curing agents should be selected according to the varioususes from the above-mentioned curing agents.

Furthermore, an accelerator for curing can be optionally usedtogether with the curing agent according to uses.

Examples of the accelerator include water, alcohols such as ethanol,propanol, isopropanol, cyclohexanol, ethyleneglycol, carboxylic acids suchas acetic acid, propionic acid, succinic acid or hexahydrophthalic acid,amines such as ethylenediamine, diethylenetriamine, and the like, dependingupon the kind of the curing agents to be used.

For example, in the case that the epoxy resin compositions are usedfor an encapsulating resin composition, an acid anhydride which is a curingagent and an amine which is an accelerator for curing are used, incombination and a novolak type phenol resin which is a curing agent ispreferably used together with imidazoles which are an accelerator forcuring.

Furthermore, in the case that the epoxy resin compositions are usedfor a photo-curable composition, the above-mentioned organic aluminumcompounds and silicone compounds should be used in combination.

And, in the case of using for a photo-curable composition, curing iscarried out by photo-irradiation.

For example, there can be used an ultraviolet ray having a wavelengthrange of from 180 to 700 nm.

The irradiation period of time also depends upon the kind of theepoxy resin compositions, the kind of the above-mentioned curing agents,and the kind of the irradiation source.

Generally, it is from 10 seconds to 30 minutes, and preferably, itis from 20 to 60 seconds.

Furthermore, the temperature for photo-curing during heating alsodepends upon the kind of the above-mentioned curing agents it is usuallyfrom 20.degree. to 200.degree. C., and preferably, is from 60.degree. to 100.degree. C.

Still further, the temperature for postcuring after the photo-curingalso depends upon the kind of the above-mentioned curing agents; itis usually from 50.degree. to 200.degree. C., and preferably, is from 100.degree. to 1800.degree. C.

There can be used a low-pressure mercury lamp, a high-pressuremercury lamp, a carbon arc lamp, a xenon lamp, an argon glow dischargelamp, a metal halide lamp, etc., as a discharging source of irradiationrays.

On the other hand, for example, in the case that the epoxy resincompositions are used for a powder coating composition, a carboxyl-terminatedpolyester resin having at least two carboxylic groups, novolaktype phenol resins and acid anhydrides, etc, are more preferably selectedfrom the above-mentioned curing agents.

A process for preparing a powder coating composition and a processfor producing the carboxyl-terminated polyester resin having at least twocarboxylic groups are representatively described in detail hereinafter.

A polyhydric alcohol and a polycarboxylic acid or an anhydridethereof are charged into a reactor.

When the mole number of the polyhydric alcohol is n, the polycarboxylicacid or hydride thereof is added in an amount of (n+1) mole numberto obtain a carboxyl-terminated polyester resin.

The polyester resin can be synthesized according to the followingreaction scheme. ##STR19##

An appropriate reaction temperature is from 100 to 230 C.

Removal of water allows the reaction to proceed so that the yieldof ester increases.

This reaction may proceed in the absence of any catalyst, but acatalyst conventionally used for esterification reaction may also be used.

The examples of a catalyst include sulfuric acid, p-toluene sulfonicacid, titanium compounds such as tetrabutyl titanate, and the like.

The examples of a polycarboxylic acid or an anhydride thereof includeisophthalic acid, terephthalic acid, cyclohexane dicarboxylic acid,succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid,azelaic acid, maleic acid, sebacic acid, fumaric acid, dodecanoic acid,hexahydrophthalic acid, methylhydrophthalic acid, tetrahydrophthalic acid,methyltetrahydrophthalic acid, an anhydride of an aliphatic tricarboxylicacid such as 1,2,3-propane tricarboxylic acid, an anhydride of an aromatictricarboxylic acid such as trimellitic acid or hemimellitic acid, and/oran anhydride of alicyclic tricarboxylic acid such as 6-methylcyclohexe-4-en-1,2,3-tricarboxylic acid,pyromellitic di-anhydride or benzophenon-3,3', 4,4'-tetracarboxylicdi-anhydride.

It is possible to use either one kind of a polycarboxylic acid oranhydride thereof or a mixture composed of two or more kinds thereof.

The examples of a polyhydric alcohol include ethylene glycol,propylene glycol, 1,4-butanediol, 1,3-butylene glycol, 1,4-butylene glycol,2-methylpropanediol, 1,6-hexanediol, 1,2-dodecane diol, neopentyl glycol,cyclohexanediol, glycerine, trimethylolpropane, pentaerythritol, and/ordipentaerythritol, neopentyl glycol hydroxy pivalate, 1,4-cyclohexanedimethanol,an ethylene oxide adduct of bisphenol A, 1,4-hydroxyquinone and thelike.

It is possible to use either one kind of a polyhydric alcohol, or amixture composed of two or more kinds thereof.

A polyester resin to be used in the present invention should includeat least two carboxylic groups per molecule; in the case of less than two,crosslinked structures cannot be formed in a coating layer.

The acid value of the carboxyl-terminated polyester resin having atleast two carboxylic groups in the molecule is preferably in the range offrom 15 to 100.

When the acid value is less than 15, reactivity of the polyesterresin is low, and amount of crosslinked structures does not increase.

On the other hand, if the acid value is larger than 100, themolecular weight of the polyester resin is lower, and a solid polyestercannot be obtained. Also, in the case that the equivalent of epoxy resinis mixed with the polyester resin, the content of the polyester resin ismeaninglessly lower.

It is also noted that a larger acid value corresponds to lowermolecular weight, whereas a smaller acid value corresponds to highermolecular weight .

Preferable polyester resin to be used is solid at room temperatures,with a glass transition temperature in the range of from 40.degree. to 80.degree. C.

The mixing ratio of epoxy groups to carboxyl groups is preferably inthe range of from 0.5/1 to 1.5/1 based on a chemical equivalent basis.

If it is more than 1.5/1, the residual epoxy groups after curing arerelatively rich.

On the other hand, if the mixing ratio is less than 0.5/1, and thenthe residual carboxylic groups after curing are relatively rich.

Neither of these cases are preferable, because of formation ofthermally and optically unstable coating layers.

Furthermore, the powder coating compositions of the present inventioncan optionally include an accelerator for curing epoxy resins.

These accelerators are preferably used in a range of not more than10 parts by weight, and more preferably of not more than 5 parts by weight,based on 100 parts by weight of the powder coating composition.

If the composition contains not less than 10 parts by weight of thecuring accelerator, it is not preferable because of adverse effects on theproperties of the resulting coated layer.

The accelerator for curing epoxy resins can be mixed either at thesame time of mixing of the resins or immediately before use.

Examples of the adding auxiliary substances include pigments, flowcontrol agents, an agent for preventing blocking, ultraviolet ray absorber,antioxidant agent, and/or antistatic agent and levelling agents, deaeratingagents such as benzoin, a flame-proofing agent and the like, which can beoptionally mixed into the powder coating compositions of the presentinvention.

Furthermore, other epoxy resins such as a bisphenol A type epoxyresin, a bisphenol F type epoxy resin, a novolak type epoxy resin, analicyclic epoxy resin, or an epoxy diluent such as styrene oxide and butylglycidylether can be optionally mixed into the powder coating compositions.

The above-mentioned components in the present invention and optionaladding auxiliary substances conventionally used in the manufacture ofpowder paints or varnishes are mixed, followed by kneading, at a temperatureof from 80 C. to 120 C. with a melting kneader such as a heated mixingroll or an extruder, followed by cooling after kneading sufficiently, andthen crushing with a crusher to obtain a powder composition having aparticle size which is between 0.1 and 250 microns, and preferably from10 to 75 microns.

The above-mentioned process is one of melting-blend processes.

Also, drying-blend processes in which the essential components aremixed in the form of powders and spraying-dry processes in which theessential components are dissolved into a non-flammable solvent and sprayedinto high temperature gas atmosphere while evaporating the solvents toobtain the powder coating compositions, can be used when preparing thepowder coating compositions.

The powder coating compositions can be coated onto substrates, andparticularly desirably onto metal articles charged with electrostaticelectricity, by use of a fluidized bed coating technique or by use of anelectrostatic spray gun and the like.

It is noted that other conventional epoxy resins and variousadditives can be optionally mixed depending upon the uses of the presentepoxy resin compositions.

Examples of the other conventional epoxy resins include an epi-bistype epoxy resin, a novolak type epoxy resin, a glycidyl ether type epoxyresin and an alicyclic epoxy resin, and the like.

Examples of the additives include a filler such as alumina, titaniumoxide, talc, clay, kaolin, fiber glass, potassium titanate fiber, metallicfiber, ceramic fiber, carbon fiber, calcium carbonate, silica, carbonblack, powdered glass; dyes, pigments, releasing agents, thermalstabilizers, anti-oxidants, ultraviolet ray absorbents, foaming agents,flame-proofing agents, coupling agents and anti-staining agents, and thelike.

According to a ninth aspect of the present invention, there isprovided a radically (co)polymerized composition which comprises in whichthe compositions(III) as described hereinabove is radically (co)polymerizedin the presence of a polymerization initiator, and optionally at least onevinyl monomer.

According to a tenth aspect of the present invention, there isprovided a radically (co)polymerized composition which comprises in whichthe compositions(XIII) as described hereinabove are radically (co)polymerizedin the presence of a polymerization initiator, and optionally at leastone vinyl monomer.

The radical (co)polymerizations can be carried out, for example, bya solution (co)polymerization in the presence of solvents or a suspension(co)polymerization in the presence of dispersion media while stirring, ata temperatures range of from60.degree. to 180.degree. C., a polymerization period of from1 to 40 hours and under the presence of a radical (co)polymerizationinitiator, which are conventionally known radical (co)polymerizationprocesses.

For example, examples of the solvents include hydrocarbons such asheptane, toluene, xylene, octane; esters such as ethyl acetate, n-butylacetate, isopropyl acetate, methylcellosolve acetate, butylcarbitolacetate; ketones such as methyl ethyl ketone, methyl isobutyl ketone anddiisobutylketone, and the like; alcohols such as ethanol, n-butanol, sec-butanol,isobutanol, and the like; ethers such as n-butylether, dioxane,ethyleneglycol monomethylether, ethyleneglycol monoethylether, and thelike. One or more solvents can be used.

Examples of the radical polymerization initiators include peroxidessuch as benzoyl peroxide, t-butylperoxy-2-ethylhexanoate, and the like; azocompounds such as azobis-isobutyro nitrile, azobis-dimethyl varelonitrile,and the like, which are conventionally known radical polymerizationinitiators.

According to an eleventh aspect of the present invention, there isprovided an epoxidized polymer composition obtained by epoxidizing aradically (co)polymerized composition of the ninth aspect as describedabove, with an epoxidation agent.

The examples of the epoxidation agents include the epoxidation agentssuch as the various peracids as previously-mentioned(in the fourth, fifthand sixth aspects). And, the epoxidation reaction conditions can be alsocarried out as previously-mentioned.

According to an twelfth aspect of the present invention, there isprovided a curable resin composition which comprises a (co)polymer obtainedby (co)polymerizing an epoxy composition(XIII) as described hereinabove,a cationic polymerizing initiator and optionally other epoxy resin havingat least one epoxy group.

Examples of the cationic polymerizing initiator include cation-generatingsubstances selected from the previously-mentioned(in the eighthaspect) various curing agents other than carboxyl terminated polyesterresins and organic acid anhydrides.

Specifically, there are included organic bases, organic acidsinorganic acids, alkalis, alkolates, organic metals, Lewis acids, complexesthereof, diazonium salts, sulfonium salts, iodonium salts, sulfoniumacetone compounds, silanol group-generating silicone compounds, aluminumcompounds, etc.

Examples of other epoxy resin having at least one epoxy group whichis an optional component, include various epoxy resins such as the abovementionedepoxy compositions(XI) add (XII), epi-bis type epoxy resins,novolak type epoxy resins, imide type epoxy resins, urethane type epoxyresins, epoxidized polybutadienes, various alicyclic epoxy compounds suchas 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, a lactone-adductthereof, 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-cyclohexanecarboxylate,a lactone-adduct thereof, 4-vinylcyclohexene-1-oxide, 5-vinylbicyclo 2.2.1!hepto-2-ene-2-oxide, limonene oxide, trivinylcyclohexanemonoxide,divinylbenzenemonoxide, butadiene monoxide, 2-epoxy-9-decene,allylglycidyl ether, glycidylstyrylether, ##STR20## styrene oxide, etc.

The use amount of the cationic polymerizing initiator is generallyfrom 0.001 to 20 parts by weight, preferably from 0.1 to 5% by weightbased on the total amount of the compositions.

Furthermore, the use amount of the other epoxy resin which is anoptional component is generally from 0 to 95% by weight, preferably from10 to 80% by weight based on the total amount of the compositions.

The present invention is specifically illustrated by the following Examples, but the scope of the invention is not quite limited by the Examples.

Preparation of a composition(II) comprising compounds having vinyl groups as side chains!

74.1% (1.0 mol) of butanol as a compound(c), 925.2 g (6.0 moles) of hexahydrophthalic anhydride as a compound(b) and 3.72 g of tetramethyl ammonium chloride were charged into a reaction vessel having a capacity of 3 L equipped with a reflux condenser, a dropwise funnel, a stirrer and a tube for supplying nitrogen gas, followed by being sufficiently mixed.

Successively, the reaction vessel was heated while introducing nitrogen gas and allowed to continuously react while stirring.

Heating was stopped when the temperature reached 85.degree. C.

The temperature of the reaction vessel was raised to 140.degree. C. according to the progress of the reaction of butanol with hexahydrophthalic anhydride.

It was confirmed by a gas-chromatography analysis that residual butanol was in trace.

In succession, 744.0 g(6.0 moles) of 4-vinylcyclohexene-1-oxide as a compound(a) was added dropwise over 1 hour while maintaining at the temperature of 100.degree. C. and allowed to react.

After completion of the dropwise addition, aging was further continued for 2 hours at 150.degree. C.

It was confirmed by a gas-chromatography analysis that residual 4-vinylcyclohexene-1-oxide was in trace and the conversion of 4-vinyl-cyclohexene-1-oxide was 99.6%.

The crude reaction solution was removed from the reaction vessel and cooled to room temperatures on a releasing paper to obtain a polymer having vinyl groups which has an iodine value of 86.9 (g/100 g).

The polymer was designated as A-1!

The polymer A-1! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The NMR analysis was carried out in CDCl.sub.3 and at 35 plus/minus 0.1.degree. C., with JNM-EX270 analyzer manufactured by Nihon Denshi, Ltd.

The FT-IR analysis was carried out by a KBr method, with FT-IR-5300 analyzer manufactured by Nihon Bunko Industries, Ltd.

The spectra are assigned as described below.

By the above assignments, it was confirmed that the polymer A-1! has the following chemical structure. ##STR21##

Furthermore, n=5.4 (average) was confirmed in the chemical structure by the .sup.1 H-NMR spectra assignments.

Preparation of a composition (II) comprising compounds having vinyl groups as side chains!

Same procedures were repeated as described in Example 1, except that 62.1 g (1.0 mol) of ethyleneglycol as a compound(c), 925.2 g (6.0 moles) of hexahydrophthalic anhydride as a compound(b) and 3.50 g of triethyl amine were used, and 744.0 g(6.0 moles) of 4-vinylcyclohexene-1-oxide as a compound(a) was added dropwise while maintaining at the temperature of 140.degree. C. to obtain a polymer having vinyl groups which has an iodine value of 87.0 (g/100 g).

The polymer was designated as A-2!

The polymer A-2! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The spectra are assigned as described below.

By the above assignments, it was confirmed that the polymer A-2! has the following chemical structure. ##STR22##

Furthermore, n+m=5.6 (average) was confirmed in the chemical structure by the .sup.1 H-NMR spectra assignments.

Preparation of a composition (II) comprising compounds having vinyl groups as side chains!

Same procedures were repeated as described in Example 1, except that 134.2 g (1.0 mol) of trimethylol propane as a compound(c), 925.2 g (6.0 moles) of hexahydrophthalic anhydride as a compound(b) and 3.50 g of tetramethyl guanidine were used, and 744.0 g (6.0 moles) of 4-vinylcyclohexene-1-oxide as a compound(a) was added dropwise while maintaining at the temperature of 180.degree. C. to obtain a polymer having vinyl groups which has an iodine value of 84.2 (g/100 g).

The polymer was designated as A-3!.

The polymer A-3! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The spectra are assigned as described below.

By the above assignments, it was confirmed that the polymer A-3! has the following chemical structure: ##STR23##

Furthermore, n+m+1=5.5 (average) was confirmed in the chemical structure by the .sup.1 H-NMR spectra assignments.

Preparation of a composition(II) comprising compounds having vinyl groups as side chains!

Same procedures were repeated as described in Example 1, except that 261.2 g (1.0 mol) of tris-2-hydroxyethylisocyanurate as a compound(c), 1008 g (6.0 moles) of methylhexahydrophthalic anhydride as a compound(b) and 3.72 g of tetraethylene diamine were used, and 744.0 g(6.0 moles) of 4-vinylcyclohexene-1-oxide as a compound(a) was added dropwise while maintaining at the temperature of 120.degree. C. to obtain a polymer having vinyl groups which has an iodine value of 75.0 (g/100g).

The polymer was designated as A-4!.

The polymer A-4! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The spectra are assigned as described below.

By the above assignments, it was confirmed that the polymer A-4! has the following chemical structure. ##STR24##

Furthermore, n+m+1=5.5 (average) was confirmed in the chemical structure by the .sup.1 H-NMR spectra assignments.

Preparation of a composition(II) comprising compounds having vinyl groups as side chains!

Same procedures were repeated as described in Example 1, except that 60.1 g (1.0 mol) of acetic acid as a compound(c), 1008 g (6.0 moles) of methylhexahydrophthalic anhydride as a compound(b) and 4.50 g of tetramethyl ammonium chloride were used, and 913.2 g(6.0 moles) of limonene oxide as a compound(a) was added dropwise over 1.5 hour while maintaining at the temperature of 80.degree. C.

After completion of the dropwise addition, the reaction temperature was raised 150.degree. C., and aging was continued for 2 hours to confirm the conversion of limonene oxide of 99.7% and to obtain a polymer having vinyl groups which has an iodine value of 76.0 (g/100 g).

The polymer was designated as A-5!.

The polymer A-5! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The spectra are assigned as described below.

By the above assignments, it was confirmed that the polymer A-5! has the following chemical structure. ##STR25##

Furthermore, n=5.5 (average) was confirmed in the chemical structure by the .sup.1 H-NMR spectra assignments.

Preparation of a composition(I) comprising compounds having vinyl groups as side chains!

1328.9 g (8.0 moles) of phthalic acid as a compound(b), 500 g (5.0 moles) of allylglycidylether and 154 g (2.0 moles) of 1,2-epoxy-9-decene as a compound(a) and 2.1 g of tetramethyl ammonium chloride and 50 ppm of stannous octylate were charged into a reaction vessel having a capacity of 3 L equipped with a reflux condenser, a stirrer, dropwise funnel, a tube for supplying nitrogen gas and further a tube for removing water.

Temperature in the reaction vessel was raised while introducing nitrogen gas, followed by continuously stirring after solid starting materials began to melt and change to slurry state.

Temperature was further raised to 130.degree. C. and heating was stopped.

Aging in the reaction vessel was continued for 1 hour while maintaining at 150.degree. C. to obtain an epoxy group conversion of 99.9%.

Furthermore, the temperature was raised to 180.degree. C., and then the esterification under dehydrating was carried out while raising from 180.degree. C. to 200.degree. C. over 2 hours.

Total dehydrated water was 127.3 g (theoretical amount: 126 g).

A polymer having vinyl groups which has an iodine value of 74.0 (g/100 g) was obtained. The polymer was designated as A-6!.

The polymer A-6! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The spectra are assigned as described below.

Preparation of a composition (I) comprising compounds having vinyl groups as side chains!

A reaction vessel as described in Example 1 were charged with 146.2 g (1.0 mol) of adipic acid, 304.2 g (2.0 moles) of tetrahydrophtalic anhydride and 308.4 g (2.0 moles) of hexahydrophthalic anhydride as a mixture of a compound(b) and 2.5 g of dimethylbenzyl amine.

Temperature in the reaction vessel was raised while introducing nitrogen gas, followed by continuously stirring after solid starting materials began to melt and change to slurry state.

Temperature was further raised to 130.degree. C. and heating was stopped, followed by dropwise addition of 816 g (6.0 moles) of vinylnorbornene monoxide as a compound(a) to allow reaction.

After completion of dropwise addition, aging in the reaction vessel was continued for 1 hour maintaining at 160.degree. C. to obtain an epoxy group conversion of 99.9%.

A polymer having vinyl groups which has an iodine value of 128.5 (g/100 g) was obtained. The polymer was designated as A-7!.

The polymer A-7! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The spectra are assigned as described below.

Preparation of a composition (II) comprising compounds having vinyl groups as side chains!

A reaction vessel as described in Example 1, further equipped with a tube for replaying water were charged with 530 g of a polycaprolactone (having a molecular weight of 530) as a compound(c), 584.8 g (4.0 moles) of adipic acid as a compound(b) and 2.5 g of tri-n-octylamine and 50 ppm of tetrabutyltitanate.

Temperature in the reaction vessel was raised while introducing nitrogen gas, followed by continuously stirring after solid starting materials began to melt and change to slurry state.

Temperature was further raised to 130.degree. C. and heating was stopped, followed by dropwise addition of 616 g (4.0 moles) of 1,2-epoxy-9-decene as a compound(a) to allow reaction.

After completion of dropwise addition, aging in the reaction vessel was continued for 1 hour maintaining at 145.degree. C. to obtain an epoxy group conversion of more than 99.9%.

Furthermore, the temperature was raised to 180.degree. C., and then the esterification under dehydrating was carried out while raising to from 180.degree. C. to 200.degree. C. over 2 hours.

Total dehydrated water was 72.9 g (theoretical amount: 72 g).

A polymer having vinyl groups which has an iodine value of 61.2 (g/100 g) was obtained. The polymer was designated as A-8!.

The polymer A-8! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

The spectra are assigned as described below.

Preparation of an epoxidized composition (XII)!

1000 g of ethyl acetate solution containing 45% g of the polymer A-1! was charged into a reaction vessel equipped with a condenser, a reflux cooler, a dropwise funnel, a stirrer and a tube for supplying nitrogen gas. The dropwise funnel was charged with 392 g of ethyl acetate solution containing 30% of peracetic acid, followed by adding dropwise into the reaction vessel over 1 hour while maintaining the contents in the reaction vessel at 35.degree. C.

After completion of the dropwise addition, the contents in the reaction vessel were aged while maintaining at 40.degree. C. for 5 hours to obtain peracetic acid conversion of 97.5%.

The crude reaction solution obtained was washed with 1500 ml of 3% aqueous NaOH in twice and further washed with 1500 ml of distilled water, while maintaining at from 40.degree. to 50.degree. C.

After completion of washing with water, low boiling components were evaporated from the crude reaction solution with a thin layer evaporator under from 140.degree. to 150.degree. C. and less than 5 mm Hg to obtain an epoxidized composition having an epoxy equivalent of300.

The epoxidized composition was designated as B-1!.

The epoxidized composition B-1! obtained was analyzed with a gel permeation chromatograph(CR-4A) manufactured by Shimadzu Seisakusho, Ltd.

By the gel permeation chromatography analysis, it was confirmed that the composition has MN=1590(Standardization with polystyrene standard) and MW/MN=1.77. The epoxidized composition B-1! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR.

Glass transition temperature of the epoxidized composition B-1! was 55.3.degree. C. The glass transition temperature was measured with DSC220 manufactured by Seiko Denshi Industries, Ltd., under nitrogen atmosphere and a temperature raising speed of 10.degree. C./minute

The characterization is described below.

<.sup.1 H-NMR spectra>

It was confirmed by .sup.1 H-NMR spectra assignments that absorptions due to vinyl group at delta 4.9-5.0 ppm and delta 5.8-5.9 ppm which were observed in A-1! disappeared and an absorption due to an epoxy group at delta 2.6 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectra>

It was confirmed by .sup.13 C-NMR spectra assignments that absorption due to vinyl group at delta 113.3 ppm and delta 141.2 ppm which was observed in A-1! disappeared and absorption due to an epoxy group at delta 46 ppm and delta 55 ppm appeared, and no further other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra assignments that absorption due to vinyl group at 1641 cm.sup.-1 and 912 cm.sup.-1 which was observed in A-1! disappeared and an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and further no other absorption changed.

Preparation of an epoxidized composition (XII)!

A reaction vessel as used in Example 9 was charged with 1000 g of ethyl acetate solution containing 45% of the composition A-2!, and a dropwise funnel was charged with 395 g of ethyl acetate solution containing 30% of peracetic acid and 0.05% by weight (based on peracetic acid) of potassium hexamethaphosphate, followed by dropwise addition of peracetic acid solution over 1 hour while maintaining the reaction vessel at 40.degree. C.

Same procedures described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 315 equivalents, MN=1979 (Standardization with polystyrene standard) and MW/MN=1.67. The epoxidized composition was designated as B-2!.

The epoxidized composition B-2! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR. Glass transition temperature of the epoxidized composition B-2! was 65.3.degree. C. The characterization is described below.

<.sup.1 H-NMR spectra>.

It was confirmed by .sup.1 H-NMR spectra assignments that absorption due to vinyl group at delta 4.9-5.0 ppm and delta 5.8-5.9 ppm which was observed in A-2! disappeared and an absorption due to an epoxy group at delta 2.6 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectrum>.

It was confirmed by .sup.13 C-NMR spectra assignments that absorption due to vinyl group at delta 113.3 ppm and delta 141.9 ppm which was observed in A-2! disappeared and absorption due to an epoxy group at delta 46.5 ppm and delta 56.0 ppm appeared, and further no other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra assignments that absorption due to vinyl group at 1641 cm.sup.-1 and 912 cm.sup.-1 which was observed in A-2! disappeared and an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and further no other absorption changed.

Preparation of an epoxidized composition (XII)!

A reaction vessel as used in Example 9 was charged with 1000 g of ethyl acetate solution containing 35% of the composition A-3!, and a dropwise funnel was charged with 321 g of ethyl acetate solution containing 30% (0.6 fold mol based on vinyl group) of perbenzoic acid and 0.05% by weight (based on perbenzoic acid) of sodium dioctyl tripolyphosphate, followed by dropwise addition of perbenzoic acid solution over 1 hour while maintaining the reaction vessel at 40.degree. C.

Same procedures described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 558 equivalents, MN=2540 (Standardization with polystyrene standard) and MW/MN=1.98. The epoxidized composition was designated as B-3!.

The epoxidized composition B-3! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR. Glass transition temperature of the epoxidized composition B-3! was 55.3.degree. C. The characterization is described below.

<.sup.1 H-NMR spectra>

It was confirmed by .sup.1 H-NMR spectra assignments that absorption due to vinyl group at delta 4.9-5.0 ppm and delta 5.8-5.9 ppm which was observed in A-3! disappeared and an absorption due to an epoxy group at delta 2.6 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectra>

It was confirmed by .sup.13 C-NMR spectra assignments that absorption due to vinyl group at delta 113.3 ppm and delta 141.9 ppm which was observed in A-3! disappeared and absorption due to an epoxy group at delta 46.3 ppm and delta 56.4 ppm appeared, and further no other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra assignments that absorption due to vinyl group at 1641 cm.sup.-1 and 912 cm.sup.-1 which was observed in A-3! disapand an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and further no other absorption changed.

Preparation of an epoxidized composition(XII)!

A reaction vessel as used in Example 9 was charged with 800 g of ethyl acetate solution containing 60% of the composition A-4!, and a dropwise funnel was charged with 660 g of ethyl acetate solution containing 30% of perbenzoic acid and 0.05% by weight (based on perbenzoic acid) of sodium pyrophosphate, followed by dropwise addition of perbenzoic acid solution over 1 hour while maintaining the reaction vessel at 50.degree. C.

Same procedures described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 380 equivalents, MN=3570 (Standardization with polystyrene standard) and MW/MN=2.68.

The epoxidized composition was designated as B-4!.

The epoxidized composition B-4! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR. Glass transition temperature of the epoxidized composition B-4! was 62.5.degree. C. The characterization is described below.

<.sup.1 H-NMR spectra>

It was confirmed by .sup.1 H-NMR spectra assignments that absorption due to vinyl group at delta 4.9-5.0 ppm and delta 5.8-5.9 ppm which was observed in A-4! disappeared and an absorption due to an epoxy group at delta 2.6 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectra>

It was confirmed by .sup.13 C-NMR spectra assignments that absorption due to vinyl group at delta 113.2 ppm and delta 141.7 ppm which was observed in A-4! disappeared and absorption due to an epoxy group at delta 46.3 ppm and delta 56.4 ppm appeared, and further no other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra assignments that absorption due to vinyl group at 1641 cm.sup.-1 and 912 cm.sup.-1 which was observed in A-4! disappeared and an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and further no other absorption changed.

Preparation of an epoxidized composition(XII)!

A reaction vessel as used in Example 9 was charged with 158 g of aqueous solution containing 70% of cumenhydroxyperoxide modified by 50 g of anhydrous magnesium sulfate, 1000 ml of toluene and 4.70 g of molybdenum dioxide diacetylacetonate.

800 g of toluene solution containing 30% of the composition A-5! was charged into a dropwise funnel, followed by gradual dropwise addition to allow to react over 20 hours while maintaining the reaction vessel at 50.degree. C. Unreacted cumenhydroxyperoxide was decomposed with sodium hydrosulphite and further toluene solution layer was dehydrated with anhydrous magnesium sulphate.

Same procedures described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 370 equivalents, MN=2247 (Standardization with polystyrene-standard) and MW/MN=1.72.

The epoxidized composition was designated as B-53!.

The epoxidized composition B-5! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR. The characterization is described below.

<.sup.1 H-NMR spectra>.

It was confirmed by .sup.1 H-NMR spectra assignments that an absorption due to vinyl group at delta 4.6-4.7 ppm which was observed in A-5! disappeared and an absorption due to an epoxy group at delta 2.6 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectra>

It was confirmed by .sup.13 C-NMR spectra assignments that absorption due to vinyl group at delta 108.2 ppm and delta 148.3 ppm which was observed in A-5! disappeared and absorption due to an epoxy group at delta 45.5 ppm and delta 5.62 ppm appeared, and further no other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra assignments that absorption due to vinyl group at 1650 cm.sup.-1 and 890 cm.sup.-1 which was observed in A-5! disappeared and an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and no further other absorption changed.

Preparation of an epoxidized composition(XI)!

A reaction vessel as used in Example 9 was charged with 193 g of aqueous solution containing 70% of tert-butanol modified by 50 g of anhydrous magnesium sulfate, 1000 ml of toluene and 5.50 g of molybdenum hexacarbonyl.

1000 g of toluene solution containing 40% of the composition A-6! was charged into a dropwise funnel, followed by gradual dropwise addition to allow to react over 15 hours while maintaining the reaction vessel at 40.degree. C. Unreacted tert-butanol was decomposed with sodium hydrosulphite and further toluene solution layer was dehydrated with anhydrous magnesium sulphate.

Same procedures described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 296 equivalents, MN=2114 (Standardization with polystyrene standard) and MW/MN=2.02. The epoxidized composition was designated as B-6!.

The epoxidized composition B-6! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR. The characterization is described below.

<.sup.1 H-NMR spectra>

It was confirmed by .sup.1 H-NMR assignments that an absorption due to vinyl group at delta 4.9-5.0 ppm which was observed in A-6! disappeared and an absorption due to an epoxy group at delta 2.6 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectra>

It was confirmed by .sup.13 C-NMR assignments that absorption due to vinyl group at delta 114.0 ppm, delta 136.0 ppm and delta 148.3 ppm which was observed in A-6! disappeared and absorption due to at, epoxy group at delta 45.8 ppm and delta 56.8 ppm appeared, and further no other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra assignments that absorption due to vinyl group at 1641 cm.sup.-1 and 912 cm.sup.-1 which was observed in A-6! disappeared and an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and no further other absorption changed.

Preparation of an epoxidized composition(XI)!

A reaction vessel as used in Example 9 was charged with 1000 g of diethylether solution containing 30% of the composition A-7! and 800 ml of ethanol solution containing 400 ml of 35% aqueous hydroperoxide, followed by maintaining the reaction vessel at 25.degree. C.

100 ml of NaOH(5 molarity) was added dropwise while vigorously stirring over 1 hour, resulting in raising to 25.degree.-35.degree. C.

The reaction solution was stirred for 3 hours while maintaining at 35.degree. C. 800 ml of distilled water was added into the reaction solution, followed by extracting with 200 ml of diethylether three times.

Mixed diethylether solution was washed with 200 ml of distilled water two times, and further washed with 200 ml of an aqueous solution containing 5% of potassium iodide.

Same procedures as described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 220 equivalents, MN=1545 (Standardization with polystyrene standard) and MW/MN=1.67.

The epoxidized composition was designated as B-7!.

The epoxidized composition B-7! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR. The characterization is described below.

<.sup.1 H-NMR spectra>

It was confirmed by .sup.1 H-NMR that absorption due to vinyl group at delta 5.0 ppm, 5.8 ppm and 5.8-5.9 ppm which was observed in A-7! disappeared and an absorption due to an epoxy group at delta 2.6 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectra>

It was confirmed by .sup.13 C-NMR that absorption due to vinyl group at delta 113.0-114.0 ppm, delta 127.0 ppm and delta 139-141.0 ppm which was observed in A-7! disappeared and absorption due to an epoxy group at delta 45.8 ppm and delta 56.8 ppm appeared, and further no other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra that absorption due to vinyl group at 1649 cm.sup.-1 and 910 cm.sup.-1 which was observed in A-7! disappeared and an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and no further other absorption changed.

Preparation of an epoxidized composition(XII)!

A reaction vessel as used in Example 9 was charged with 800 g of a diethylether solution containing 40% of the composition A-8! and 500 ml of an ethanol solution containing 200 ml of a 35% aqueous hydroperoxide, followed by maintaining the reaction vessel at 20.degree. C.

60 ml of NaOH(5 molarity) was added dropwise while vigorously stirring over 1 hour, resulting in raising to 20.degree.-30.degree. C.

The reaction solution was stirred for 3 hours while maintaining at 30.degree. C. 500 ml of distilled water was added into the reaction solution, followed by extracting with 150 ml of diethylether three times.

Mixed diethylether solution was washed with 150 ml of distilled water two times, and further washed with 150 ml of an aqueous solution containing 3% of potassium iodide.

Same procedures as described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 460 equivalents, MN=1870 (Standardization with polystyrene standard) and MW/MN=2.15.

The epoxidized composition was designated as B-8!.

The epoxidized composition B-8! obtained was analyzed by .sup.1 H-NMR, .sup.13 C-NMR and FT-IR. The characterization is described below.

<.sup.1 H-NMR spectra>

It was confirmed by .sup.1 H-NMR spectra assignments that absorption due to vinyl group at delta 4.9-5.0 ppm and 5.8-5.9 ppm which was observed in A-8! disappeared and an absorption due to an epoxy group at delta 2.7 ppm appeared, and further no other absorption changed.

<.sup.13 C-NMR spectra>

It was confirmed by .sup.13 C-NMR spectra assignments that absorption-due to vinyl group at delta 114.0 ppm and delta 139 ppm which was observed in A-8! disappeared and absorption due to an epoxy group at delta 45.8 ppm and delta 56.8 ppm appeared, and further no other absorption changed.

<FT-IR>

It was confirmed by FT-IR spectra assignments that absorption due to vinyl group at 1641 cm.sup.-1 and 912 cm.sup.-1 which was observed in A-8! disappeared and an absorption due to an epoxy group at 869 cm.sup.-1 appeared, and no further other absorption changed.

Preparation of an epoxidized composition(XII)!

A reaction vessel as used in Example 9 was charged with 1000 g of an ethyl acetate solution containing 50% of the composition A-1!, followed by maintaining the solution at 60.degree. C.

588 g of ethyl acetate solution containing 30%(molar ratio of 1.5 based on vinyl groups) of peracetic acid and 0.05 wt % (based on peracetic acid) of tetrapolyphosphoric acid were charged into a dropwise funnel, and gradually added dropwise into the reaction vessel while maintaining at 60.degree. C. After completion of dropwise addition, the reaction solution was maintained at 60.degree. C. for aging for 3 hours.

Same procedures as described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 323 equivalents, MN=1590 (Standardization with polystyrene standard) and MW/MN=1.80.

The epoxidized composition was designated as B-9!.

Preparation of an epoxidized composition (XII)!

A reaction vessel as used in Example 9 was charged with 1000 g of ethyl acetate solution containing 50% of the composition A-1!, followed by maintaining the solution at 60.degree. C.

235 g of ethyl acetate solution containing 30% (molar ratio of 0.6 based on vinyl groups) of peracetic acid and 0.05 wt % (based on peracetic acid) of tetrapolyphosphoric acid were charged into a dropwise funnel, and gradually added dropwise into the reaction vessel while maintaining at 60.degree. C. After completion of dropwise addition, the reaction solution was maintained at 60.degree. C. for aging for 3 hours.

Same procedures as described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 540 equivalents, an iodine value of 31, MN=1585 (Standardization with polystyrene standard) and MW/MN=1.82. The epoxidized composition was designated as B-10!.

Preparation of an epoxidized composition(XII)!

A reaction vessel as used in Example 9 was charged with 1000 g of ethyl acetate solution containing 50% of the composition A-1!, followed by maintaining the solution at 60.degree. C.

118 g of ethyl acetate solution containing 30% (molar ratio of 0.3 based on vinyl groups) of peracetic acid and 0.05 wt % (based on peracetic acid) of tetrapolyphosphoric acid were charged into a dropwise funnel, and gradually added dropwise into the reaction vessel while maintaining at 60.degree. C. After completion of dropwise addition, the reaction solution was maintained at 60.degree. C. for aging for 3 hours.

Same procedures as described in Example 9 were carried out to obtain an epoxidized composition having an epoxy value of 1016 equivalents, an iodine value of 55, MN=1580 (Standardization with polystyrene standard) and MW/MN=1.79. The epoxidized composition was designated as B-11!.

Preparation of an unsaturated carboxylic ether composition(III) comprising compounds having vinyl groups!

130 g (1.0 mol) of 2-hydroxyethylmethacrylate as a compound(d), 372 g (3.0 moles) of 4-vinylcyclohexene-1-oxide as a compound(a) were charged into a jacketed reaction vessel having a capacity of 2 liter equipped with a reflux condenser, a dropwise funnel, a stirrer and a tube for supplying nitrogen gas.

Successively, 10% ethyl acetate solution containing 3.6 g of BF.sub.3, etherate was added dropwise over 2 hours to allow to react while maintaining the reaction vessel at 50.degree. C.

After completion of dropwise addition, it was confirmed by a gas-chromatography that 4-vinylcyclohexene-1-oxide almost disappeared.

Successively, 480 g of ethyl acetate was further added into a reaction solution, followed by washing with 500 g of water twice to obtain 958 g of ethyl acetate solution containing a solid content of 46.3%.

It was confirmed by a gas-chromatography that 2.1% of 2-hydroxyethylmethacrylate was contained in the reaction solution obtained.

Successively, 50 g of ethyl acetate solution obtained was charged into a round-bottom flask to be attached to a rotary evaporator to evaporate low boiling components under reduced pressures and jacket temperature of 50.degree. C. to obtain 23 g of an unsaturated carboxylic composition(III) having vinyl groups which is a desired viscous composition having a viscosity of 3600 cp/25.degree. C.

The composition was designated as A-9!.

The composition A-9! obtained was analyzed by GPC C-R4A: manufactured by Shimadzu Seisakusyo, Ltd.

It was confirmed that the composition A-9! obtained is a mixture having a distribution composed of 2-hydroxyethylmethacrylate(n=0) not added by 4-vinylcyclohexeneoxide, a compound(n=1) added by 1 mol of 4-vinylcyclohexeneoxide, a compound(n=2) added by 2 mol of 4-vinylcyclohexeneoxide, . . . , and having MN=564 (Standardization with polystyrene standard) and MW/MN=1.35, by the GPC analysis.

Furthermore, .sup.1 H-NMR, .sup.13 C-NMR and IR analysis were carried out.

.sup.1 H-NMR, .sup.13 C-NMR analysis were carried out in CDCl.sub.3 and at room temperatures, with JNM-EX90 analyzer manufactured by Nihon Denshi, Ltd.

The IR analysis was carried out by coating on a NaCl plate with IR-435 analyzer manufactured by Shimadzu Seisakusyo, Ltd.

The spectra are assigned as described below.

n=approximately 3.7 was confirmed by the .sup.1 H-NMR spectra assignments.

n is an average mol number of 4-vinylcyclohexene-1-oxide added to 2-hydroxyethylmethacrylate.

Preparation of an epoxidized composition(XIII)!

400 g ethyl acetate solution containing 46.3% of the composition A-0! obtained in Example 20 was charged into a jacketed reaction vessel having a capacity of 2 liter equipped with a reflux condenser, a dropwise funnel from which peracetic acid is charged, a stirrer and a tube for supplying nitrogen gas.

Successively, the dropwise funnel was charged with 280 g of ethyl acetate solution containing 30% of peracetic acid and 0.2 g of sodium 2ethylhexyl tripolyphosphate was added to dissolve.

The ethyl acetate solution of peracetic acid was added dropwise into the reaction vessel over approximately 4 hours while maintaining the reaction temperature of 50.degree. C., additionally followed by maintaining at 50.degree. C. over 6 hours.

Successively, 680 g of purified water was added and stirred for 30 minutes, followed by settling at 50.degree. C. to separate into two solution layers.

After maintaining for 30 minutes at 50.degree. C., the separated lower solution layer was gradually removed, followed by adding 300 g of ethyl acetate and 800 g of a purified water.

After stirring for 30 minutes and settling for 30 minutes at 50.degree. C., followed by removing lower solution layer.

Further, 700 g of a purified water was added and stirred for 30 minutes at 50.degree. C., followed by settling for 30 minutes at 50.degree. C. to separate into two solution layers.

The separated lower solution layer was gradually removed to obtain 650 g of ethyl acetate solution having solid content of 30.1%.

It was confirmed by a gas-chromatography analysis that 0.9% of unreacted 2-hydroxyethylmethacrylate remained in the ethyl acetate solution obtained.

Successively, the upper layer solution was charged into a thin-layer evaporator under the conditions of 50.degree. C., from 20 to 50 mm Hg and 300 cc/hour to obtain 180 g of an unsaturated carboxylic ester composition having epoxy groups which is a desired product.

The unsaturated carboxylic ester composition having the following properties was designated as

The unsaturated carboxylic ester composition having epoxy groups B-12! was analyzed by NMR and IR to obtain the following spectra.

The spectra are assigned as described below.

It was confirmed by the assignments of .sup.1 H-NMR spectra that averaged addition mol numbers of cyclohexene-1-oxide units having substituted groups to 2-hydroxyethylmethacrylate are approximately 3.9.

Furthermore, the conversion of vinyl group to epoxy group was approximately 85%.

Preparation of an unsaturated carboxylic ether composition(III) comprising compounds having vinyl groups and then an epoxidized composition(XIII)!

300 g of toluene and !4 g of benzyl triethyl ammonium as a catalyst were charged into a flask equipped with a stirrer, a tube for supplying nitrogen gas and a dropwise funnel, followed by heating at 80.degree. C.

200 g of 1,2-epoxy-9-decene, 112 g of methacrylic acid and 0.1 g of p-methoxy phenol were charged into the dropwise funnel, followed by dropwise addition into the flask while maintaining at 80.degree. C. over 10 hours to allow to react.

The reaction was stopped at an epoxide conversion of 95%, followed by washing and separating with 200 g of water twice to obtain 534 g of an unsaturated carboxylic composition(III) having vinyl groups.

Successively, 500 g of the composition obtained above was charged into a 2-liter reaction vessel equipped with a condenser, a tube for supplying nitrogen gas and a dropwise funnel in which 300 g of ethyl acetate solution containing 30% of peracetic acid in which 0.2 g of sodium 2-ethylhexyl tripolyphosphate was dissolved were charged, followed by dropwise addition while heating at 50.degree. C. over 4 hours, and then aging for 5 hours to complete the reaction, followed by washing and separating with 800 g of water thrice and evaporating an organic solution layer with a thin-layer evaporator to obtain 262 g of an unsaturated carboxylic composition(XIII) having epoxy groups.

The composition exhibited the following properties.

Preparation of a radically copolymerized composition comprising compounds having epoxy groups in which the composition(XIII) is copolymerized!

70 g of xylene and 3 g of perbutyl Z were charged into a flask equipped with a stirrer, a reflux condenser and a tube for supplying nitrogen gas, followed by heating at approximately 110.degree. C.

Successively, a mixture composed of 50 g of the composition obtained in Example 21, 50 g of styrene as monomers and 2.5 g of perbutyl 0 as an initiator was added dropwise into the above xylene solution over 3 hours under nitrogen atmosphere, and further allowed to react for 10 hours to obtain 160 g of a desired copolymer solution.

The copolymer solution was a transparent liquid having a number average molecular weight of 5200, an epoxy value of 720 equivalents and a solid content of 59%.

The copolymer solution was designated as resin solution R-1!.

Preparation of a radically copolymerized composition comprising compounds having epoxy groups in which the composition(XIII) is copolymerized!

67 g of xylene and 2.5 g of perbutyl Z were charged into a flask equipped with a stirrer, a reflux condenser and a tube for supplying nitrogen gas, followed by heating at from 110.degree. to 120.degree. C.

Successively, a mixture composed of 50 g of the composition obtained in Example 22, 38 g of methylmethacrylate, 12 g of ethylhexylacrylate as monomers and 2.5 g of perbutyl 0 as an initiator was added dropwise into the above xylene solution over 3 hours under nitrogen atmosphere, and further allowed to react for 7 hours to obtain 165 g of a desired copolymer solution.

The copolymer solution was a transparent liquid having a number average molecular weight of 6500, an epoxy value of 860 equivalents and a solid content of 61%.

The copolymer solution was designated as resin solution R-2!.

Preparation of a radically polymerized composition comprising compounds having epoxy groups in which the composition(XIII) is polymerized!

70 g of xylene and 2.5 g of perbutyl Z were charged into a flask equipped with a stirrer, a reflux condenser and a tube for supplying nitrogen gas, followed by heating at from 110.degree. to 2O.degree. C.

Successively, a mixture composed of 100 g of the composition obtained in Example 22 as a monomer and 3 g of perbutyl 0 as an initiator was added dropwise into the above xylene solution over 3 hours under nitrogen atmosphere, and further allowed to react for 7 hours to obtain 165 g of a desired polymer solution.

The polymer solution was a transparent liquid having a number average molecular weight of 4000, an epoxy value of 440 equivalents and a solid content of 60%.

The copolymer solution was designated as resin solution R-3!.

Tests for powder coatings with the epoxidized compositions obtained in Examples 9-12 and a carboxyl-terminated polyester resin!

The epoxidized compositions obtained in Examples 9-12 were used for preparing powder coating compositions.

<Preparation I of a polyester resin>

2383 parts of diethylene glycol, 4037 parts of cyclohexane dicarboxylic acid and 0.07 parts of tetrabutyl titanate were charged into a 4-necked reaction vessel equipped with a stirrer, a thermometer, a tube for supplying nitrogen gas and a condenser equipped with a tube for dehydration, followed by being heated and then by initiating of dehydration at the period of the temperature of approximately 140.degree. C.

The temperature raised to 220.degree. C. with the progress of dehydration.

The reaction was stopped at the amount of dehydrated water of 805 parts to obtain a polyester resin having an acid value of 20(KOH/g).

The polyester resin was designated as P-1!.

<Preparation II of a polyester resin>

Same procedures as described above was repeated, except that 2080 parts of neopentyl glycol, 3066 parts of adipic acid and 0.05 parts of tetrabutyl titanate were charged to obtain a polyester resin having an acid value of 34.6(KOH/g) at the amount of dehydrated water of 720 parts.

The polyester resin was designated as P-2!.

<Preparation III of a polyester resin>

Same procedures as described above was repeated, except that 767 parts of 1,6-hexanediol, 1095 parts of adipic acid and 0.02 parts of tetrabutyl titanate were charged to obtain, a polyester resin having an acid value of 70.2(KOH/g) at the amount of dehydrated water of 234 parts.

The polyester resin was designated as P-3!.

<Preparation of powder coating compositions>

The resulting polyester resins P-1! to P-3! obtained, a commercially supplied polyester resins (P2400 having an acid value of 37 and a glass transition temperature of 63.degree. C. supplied by DSM Resin, Ltd., designated as P-4! and Upicacoat GV-610 having softening temperature of 90 C., an acid value of 52 supplied by Japan Upica, Ltd., designated as P-5!, and the epoxidized compositions from B-1! to B-3! obtained and Modaflow Powder-II as a flow control agent (supplied by Monsanto Chemicals Co., Ltd.) and benzoin as a deaerating agent and titanium oxide and triphenyl phosphine as a curing catalyst were mixed with a Brabender type mixer at temperatures of from 75 to 85 C., respectively in the mixing ratio of as described in Table 1, followed by being crushed after cooling to obtain a powder coating composition, respectively.

For references, a bisphenol A type epoxy resin (Epikote 1004 supplied by Yuka Shell, Ltd.), triglycidyl isocyanurate(Araldite PT-810 supplied by Chiba-Geigy Co., Ltd.) and an alicyclic epoxy resin (EHPE-3150 supplied by Daicel Chemical Industries, Ltd.) were mixed as described above, respectively in the mixing ratio of as described in Table 1, followed by being crushed after cooling to obtain a powder coating composition, respectively.

<Powder coating layers test>

Successively, the resulting powder coating compositions were coated onto mild steel plates processed by zinc phosphate, respectively, by an electrostatic coating process, followed by curing at a temperature of 180 C. for a period of 50 minutes to obtain coating layers having a thickness of 45 microns.

Note:

(1) Triphenyl phosphine, Modaflow Powder-II, benzoin and titanium oxide were mixed in the mixing ratio of 0.5 parts, 1 part, 0.3 part and 50 parts, respectively.

(2) E-1, E-2 and E-3 correspond to Araldite PT-810, Epikote 1004 and EHPE-3150, respectively.

(3) E, M and B in solvent resistance tests represent no-scratch/no-frosting, slightly frosting and scratch/frosting, respectively.

The solvent resistance tests were carried out by strong abrasion of twenty times on the coating layers of 10 cm length with a gauze in which xylene is saturated.

(4) E and M in storage stability tests represent no-change and slight change, respectively.

The storage stability tests were evaluated by a change of melting viscosity in the powder coating compositions after storing for one-month in 40.degree. C.

(5) E, M and B in outdoor durability tests represent no-change, slightly-yellowing and yellowing, respectively.

The outdoor durability tests were evaluated by a change of color in the coating layers after exposing for 500 hours in a Sunshine Weather-Ometer.

(6) E, M and B in blocking tests represent no-blocking, slightly-blocking and blocking, respectively.

The blocking was evaluated by outer appearances in the powder coating compositions after storing for one month in 40.degree. C.

Tests for powder coatings with the epoxidized compositions obtained in Examples 9-12 and a phenol novolak resin!

<Preparation of powder coating compositions>

Respective 1 equivalent of the epoxidized compositions from B-1! to B-4! obtained in Examples from 9 to 12, 1.1 equivalent of commercially supplied phenol novolak resin as a curing agent, 0.7 wt %(based on the total resins) of 2-undecylimidazole as an accelerator for curing, 150 parts (based on 100 parts of the total resins) of titanium oxide as a pigment and 30 parts (based on 100 parts of the total resins) of silica powder as an inorganic filler were mixed with a mixer, followed by being melted and mixed with a Brabender type mixer at temperatures of from 65 to 80 C., and further being crushed with a crusher after cooling to obtain powder coating compositions having an average particle sizes range of from 80 to 100 microns.

Furthermore, for references, a bisphenol A type epoxy resin (Epikote-1004 supplied by Yuka-Shell, Ltd.) and an alicyclic epoxy resin (EHPE-3150 supplied by Daicel Chemical Industries, Ltd.) were mixed as described above, respectively in the mixing ratio of as described in Table 2, followed by being crushed after cooling to obtain a powder coating composition, respectively.

<Powder coating layers test>

Successively, the resulting powder coating compositions were coated onto mild steel plates processed by zinc phosphate, respectively, by an electrostatic coating process, followed by curing at a temperature of 180 C. for a period of 50 minutes to obtain coating layers having a thickness of 45 microns. The results are shown in Table 2.

Note:

(1) E, G, and B in solvent resistance tests represent no-scratch/no-frosting, slightly frosting and scratch/frosting, respectively.

The solvent resistance tests were carried out by strong abrasion of twenty times on the coating layers of 10 cm length with a gauze in which xylene 1is saturated.

(2) E, G, M and B in water resistance tests represent no-frosting/no-blistering, slightly frosting, slightly-blistering/slightly-frosting and frosting/blistering, respectively.

The water resistance was evaluated by observation of the surface layers after 240 hours immersing in a water reservoir constantly maintained at 50.degree. C. The glossiness retention values (%) were calculated by glossiness values measured with a glossiness tester before and after immersing.

(3) E, G and M in outdoor durability tests represent no-change, slightly-yellowing and yellowing, respectively.

The outdoor durability was evaluated by a change of color in the coating layers after exposing for 500 hours in a Sunshine-Weather-Ometer.

(4) E and M in storage stability tests represent no-change and slight change, respectively. The storage stability tests were evaluated by a melting viscosity as a fluidity in the powder coating compositions after storing for one-month in 40.degree. C.

(5) E, M and B in blocking tests represent no-blocking, slightly-blocking and blocking, respectively.

The blocking was evaluated by outer appearances in the powder coating compositions after storing for one-month in 40.degree. C.

Tests for encapsulating compositions with the epoxidized compositions obtained in Examples 9 and 11 and an acid anhydride !

The epoxy compositions B-1! and B-2! were mixed with 4-methylhexahydrohthalic anhydride(Rikacid MH-700 manufactured by Shin-Nihon Rika, Ltd.) as a curing agent and benzyl dimethylamine as a catalyst for curing in the mixing ratio as described hereinafter;

followed by being melted and mixed in 120.degree. C. for 5 minutes, and successively being defoamed under reduced pressures and further cured in a mold to obtain cured articles.

Precuring was carried out at 120.degree. C. for 1 hour, and postcuring was further carried out at 160.degree. C. for 6 hours in an oven.

Outer appearances, hardness and heat distortion temperatures of the cured articles obtained are shown in Table 3.

Heat distortion temperatures were measured based on JIS-K-6911.

Furthermore, for reference, same procedures as described above were repeated, except that a commercially supplied bisphenol A diglycidyl ether(Epikote 828 manufactured by Yuka-Shell, Ltd.) and cresol novolak epoxy resin (Epotode YDCN-702 manufactured by Toro Kasei, Ltd.) were used in place of the present compositions

Table 3 clearly shows that the present epoxy compositions for encapsulating are useful, particularly, for light emitting or receiving devices because of its excellent transparency and heat distortion temperatures without a loss of mechanical properties.

Tests for encapsulating compositions with the epoxidized compositions obtained in Examples 10 and 11 and a novolak type phenol resin!

Respective 150 parts by weight of the epoxy compositions B-2!, B-3! and 50 parts by weight of a novolak type phenol resin (PSF-4300 manufactured by Gun-ei Chemical Industries, Ltd.) and 1 part by weight of 2-undecylimidazole(C11Z manufactured by Shikoku Kasei Industries, Ltd.) were mixed with 400 parts by weight of a fused silica powder under ordinary temperatures, followed by being kneaded under from 90.degree. to 95.degree. C. and then by being crushed after cooling thereof to obtain a molding composition.

The molding composition obtained was tabletized, followed by being preheated and then being molded with a transfer molding machine equipped with a die heated under 170.degree. C. and cooled to obtain a cured article.

Furthermore, for reference, same procedures as described above were repeated except that 100 parts by weight of a cresol novolak type epoxy resin (epoxy equivalent value of 201) was used in place of the epoxy compositions of the present invention.

Results are shown in Table 4.

Note:

(1) In the Thermal cycle resistance tests, cracked numbers were counted relating to tested pieces in which a copper plate having 25L.times.25W.times.3t(mm) was encapsulated in the respective cured articles having 30L.times.25W.times.5t(mm), which pieces were placed in thermostatically controlled ovens maintained at -40.degree. C. and +200.degree. C., respectively, with 15 cycles at 30 minutes interval.

(2) In the Pressure-cooker test, an electric device having 2 aluminum wires was encapsulated in the molding compositions at 170.degree. C. for 3 minutes with a transfer molding machine, followed by curing at 180.degree. C. for 8 hours. And then, 100 pieces of the electric devices were placed in under a high pressure steam atmosphere of 120.degree. C.

The period of time (hour) through which a breaking down of the wire occurs in 50% of 100 pieces was measured.

The Table 4 clearly shows that the present epoxy compositions are more excellent in heat resistance, moisture heat resistance and flexural strength.

Tests for a solder resist composition with the epoxidized composition obtained in Example 10, and dicyandiamide and imidazoles!

150 parts by weight of the epoxy composition B-1!, 6 parts by weight of dicyandiamide, 0.7 part by weight of 2-ethyl-4-methylimidazole, 10 parts by weight of talc, 40 parts by weight of diethyleneglycol monoethylacetate and a green-colored dye were kneaded with a roller having three rolls, followed by being kneaded to obtain a solder resist ink.

The composition was cured at 150.degree. C. and for 80 minutes to obtain a cured article.

Tests for a solder resist composition with the epoxidized composition obtained in Example 11, and bisphenol A and imidazoles!

150 parts by weight of the epoxy composition B-1!, 70 parts by weight of bisphenol A, 1 part by weight of 2-ethyl-4-methylimidazole, 10 parts by weight of silica, 50 parts by weight of diethyleneglycol monoethylacetate and a green-colored dye were kneaded with a roller having three rolls, followed by being kneaded to obtain a solder resist ink.

The composition was cured at 120.degree. C. and for 10 minutes to obtain a cured article. The results in the Application Examples 5 and 6 are collectively shown in Table 5.

Preparation of a curable composition comprising a radically polymerized composition comprising compounds having epoxy groups in which the composition(XIII) is polymerized and a cationic polymerization initiator! R-1!, R-2! and R-3! as a radically polymerized composition and ER-1!, ER-2!, ER-3!, ER-4! and ER-5! as described below; ##STR26## as an epoxy resin having at least one epoxy group which is an optional component were mixed with a cationic polymerization initiator which includes trisacetylacetonate aluminum TAAA!, trisethylacetate aluminum TEA-ACA!, triphenyl(o-nitrobenzyloxy) silane TPONBS!, t-butyldiphenyl(5-methyl-2-nitrobenzyloxy)silane TBDPH! and Degacure K-126 manufactured by Degussa AG), respectively, in the mixing ratio as shown in Table 6.

The mixed compositions were coated on, a glass plate in the thickness of 50 g/m.sup.2 (wet), followed by heating to evaporate solvents by irradiation with a metal halide lamp having 80 W/cm, keeping a irradiation distance of 6.5 cm for 100 seconds, further being aged at room temperatures for 1 week.

The results are also shown in Table 6.

Preparation of a curable composition comprising a radically polymerized composition comprising compounds having epoxy groups in which the composition(XIII) is polymerized and a cationic polymerization initiator!

R-1!, R-2! and R-3! as a radically polymerized composition and

ER-1!, ER-4! as described hereinabove and ER-6! as described below; ##STR27## as an epoxy resin having at least one epoxy group which is an optional component were mixed with a cationic polymerization initiator which includes trisethylacetoacetate aluminum TEAACA!, diphenyl silanediol DSD!, diphenydimethoxy silane DDMS! and aniline/borontrifluoride complex ABTFC!, respectively, in the mixing ratio as shown in Table 7.

The mixed compositions were coated on a glass plate in the thickness of 50 g/m.sup.2 (wet), followed by heating at 80.degree. C. and for 3 minutes to evaporate solvents and postcured at temperatures as shown in Table 6, further being aged at room temperatures for 1 week.

The results are also shown in Table 7.

Note:

In the Application Examples 7-15 and Comparative Application

Examples 1 and 2, the Gel fraction tests were carried out at 20.degree. C. and 65% relative humidity, as undissolving amounts after 24 hours immersion in tetrahydrofuran.

The clinging ability tests were carried out at 20.degree. C., 65% relative humidity, as strippability in cross-cut tests with adhesive tapes. In the clinging ability tests, Gs represent "Good" and Bs represent "Bad".

While the invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing, from the spirit and scope thereof.