Background of the Invention
1. Field of the Invention
The present invention relates to voltage generating circuits of semiconductor devices, and more particularly to a back-bias voltage generating circuit for preventing electron injection into the substrate that is appropriate for a semiconductor device having CMOS transistors.
2. Description of the Prior Art
As illustrated in FIG. 1, a conventional back-bias generating circuit receives oscillating signals in the form of an alternate current waveform through inverter X4. The back-bias generating circuit also includes first pumping portion 100 having node N2, to which input driving signals are applied, and second pumping portion 200 having node N12, to which input driving signals are applied through inverter X5.
First pumping portion 100 includes PMOS transistor M1 coupled at its source to power source VCC and NMOS transistor M2, the gates of which are connected to node N2 and the drains of which are connected in common with each other and also connected to the gate of NMOS transistor M5, the source of which is grounded to ground terminal VSS. The drain of NMOS transistor M5 is connected through node N5 to the source of NMOS transistor M2. Inverters X1, X2 and X3 and pumping capacitor M4 are connected in series between nodes N2 and N5, forming nodes N6 to N8. NMOS transistor M3 has its drain connected to node N5. The gate and source of NMOS transistor M3 are connected together and to back-bias terminal VBB.
Second pumping portion 200 includes PMOS transistor M6, three NMOS transistors M7, M8 and M10, three inverters X6, X7 and X8, and pumping capacitor M9. Except for receiving input signals through inverter X5, these circuit elements are arranged in the same manner as with the circuit elements of first pumping portion 100.
Therefore, oscillation signal OSC is passed through inverter X4 to invert a high potential signal into a low potential signal, and vice versa. A low potential signal at node N2 is applied to the gates of PMOS transistor M1 and NMOS transistor M2, and PMOS transistor M1 is turned on, and NMOS transistor M2 is turned off. During the saturation condition of PMOS transistor M1, power source VCC causes NMOS transistor M5 to turn on.
At the same time, the low potential signal is inverted through three inverters X1, X2 and X3 into a high potential signal, and thus VCC is applied to one end of pumping capacitor M4. The other electrode of pumping capacitor M4 is connected to node N5, and thus VSS is applied to the other electrode.
Thereafter, oscillation signal OSC is reversed and passed through inverter X4 to invert the low potential signal into a high potential signal. The high potential signal at node N2 is applied to the gates of PMOS transistor M1 and NMOS transistor M2, and PMOS transistor M1 is turned off, and NMOS transistor M2 is turned on. Thus, NMOS transistor M5 turns off.
At the same time, the high potential signal of node N2 is inverted through three inverters X1, X2 and X3 into a low potential signal, and thus VSS is applied to one end of pumping capacitor M4. The other electrode of pumping capacitor M4 is connected to node N5 which is now in a floating state or connected to terminal VBB through transistor M3.
Pumping capacitor M4 has a coupling effect with the other electrode of the pumping capacitor, which becomes a negative voltage lower (more negative) than VSS.
Therefore, when the voltage difference between node N5 and back-bias terminal VBB approaches a threshold voltage, switching NMOS transistor M3 is turned on, and the voltage on back-bias terminal VBB may be lowered by the charge of the pumping capacitor.
Similarly, second pumping portion 200 is operated identically to first pumping portion 100, but the input driving signal is applied through inverter X5 to node N12, and the pumping signal opposite to that of pumping capacitor M4 is generated at pumping capacitor M9. First and second pumping portions 100 and 200 are pumped in turn in opposite phase to each other.
The conventional back-bias generating circuit causes the voltage values of common nodes N5 and N14 to be lowered in to a high degree over the back-bias voltage VBB. FIG. 4 is a waveform illustrating the voltages of VBB and node N5. During the time when the voltage of node N5 becomes lower than the voltage on terminal VBB, an increase in the number of electrons injected from the nodes of the pumping capacitors into the substrate may be caused, which thereby may result in abnormal operation of a cell such as latch-up.
Also, the applying of the back-bias voltage to a switching transistor requires substantial time for dropping the back-bias voltage by a desirous voltage because the conductance value of the switching transistor is small.
Accordingly, it is an object of the present invention to provide a back-bias voltage generating circuit of a semiconductor device for keeping a stable back-bias voltage at a predetermined level.
Another object of the present invention is to provide an inner voltage generating circuit of a semiconductor device for preventing electron injection into a substrate appropriate for a semiconductor device.
Another object of the present invention is to provide a back-bias voltage generating circuit of a semiconductor device for compensating the pumping voltage with respect to the back-bias voltage.
Still another object of the present invention is to provide a back-bias voltage generating circuit of a semiconductor device for enhancing the conduction property of a switching portion .with respect to the back-bias voltage.
Summary of the Invention
In order to achieve these features and objects, the present invention comprises a driving signal generating portion for receiving oscillating signals from an oscillator such as a ring oscillator and generating the driving signals of a low signal and a high signal in turn; a first pumping portion for charging the input driving signal at one end of a pumping capacitor so as to achieve a voltage at the other end of the pumping capacitor that is lower than a back-bias voltage; a second pumping portion for charging another input driving signal at one end of a pumping capacitor so as to achieve a voltage at the other of the pumping capacitor that is lower than a back-bias voltage; a first switching portion that is turned on by a voltage higher than a back-bias voltage in order to be connected to a back-bias voltage terminal when the output of the first pumping portion is below the back-bias voltage; and a second switching portion for being turned on by a voltage higher than a back-bias voltage in order to be connected to a back-bias voltage terminal when the output of the second pumping portion is below the back-bias voltage.
Brief Description of the Drawings
The present invention will now be explained in detail by reference to the accompanying drawings, in which:
FIG. 1 is a conventional back-bias voltage generating circuit of a semiconductor device having two pumping portions;
FIG. 2 is a back-bias voltage generating circuit of a semiconductor according to the present invention with reduced electron injection into the substrate;
FIGS. 3A and 3B are waveform diagrams illustrating signals at various terminals/nodes with the present invention;
FIG. 4 is a waveform diagram illustrating the relationship between the voltage on a node of a pumping portion and the voltage on a back-bias terminal according to a conventional circuit; and,
FIG. 5 is a waveform diagram illustrating the relationship between the voltage on a node of a pumping portion and the voltage on a back-bias terminal in accordance with the present invention.
Detailed Description of the Invention
FIG. 2 illustrates a back-bias voltage circuit of the present invention provided with first pumping portion 100 and second pumping portion 200, which are analogous to the pumping portions discussed with reference to FIG. 1, and a detailed discussion of these portions is omitted here.
The back-bias voltage circuit comprises driving signal generating portion 300 and two switching portions 400 and 500 arranged in the front and rear, respectively, of first and second pumping portions 100 and 200 as illustrated.
Driving signal generating portion 300 includes two NOR gates G1 and G2, each of the output terminals of which are coupled to an input terminal of the other in order to form a flip-flop configuration. Therefore, the oscillating signal as illustrated in FIG. 3A in the form of an alternate current wave is applied to one terminal of gate G1 and an inverter X10, simultaneously. The output at node N20, inverted by inverter X10, is applied to one terminal of gate G2. The outputs at node N21 and node N22 appear as "non-intermittent" square waves as illustrated in FIG. 3B.
First and second pumping portions 100 and 200 receive their input driving signals through inverters X11 and X12, respectively. The configurations of first and second pumping portions 100 and 200 are analogous to those of FIG. 1.
First switching portion 400 includes NMOS transistor M3, the gate of which is connected to the gate of NMOS transistor M10 in second pumping portion 200. Herein, the gate of NMOS transistor M10 is connected to node 13, which is the common connection point between PMOS transistor M6 and NMOS transistor M7 in second pumping portion 200.
Similarly, second switching portion 500 includes NMOS transistor M8, the gate of which is connected to the gate of NMOS transistor M5 in first pumping portion 100. Herein, the gate of NMOS transistor M5 is connected to node 3, which is the common connection point between PMOS transistor M1 and NMOS transistor M2 in first pumping portion 100.
The driving signal generating portion 300 operates as follows. When the oscillating signal is lowered from a high level to a low level, the signal at node N20 is inverted passing through inverter X10, and subsequently the signal at node N22 becomes a low level. Thereafter, NOR gate G1 outputs a high level signal at node N21. On the contrary, when the oscillating signal is raised from a low level to a high level, the signal at node N21 becomes a low level, and thereafter the signal at node N22 passed through NOR gate G2 becomes a high level. As a result, the signals at nodes N21 and N22 can avoid overlapping at the high level as illustrated in FIGS. 3A and 3B.
The signals at nodes N21 and N22 are input driving signals with respect to each of pumping portions 100 and 200, and are passed through inverters X11 and X12 to invert the input driving signals.
A low level signal at node N2 is applied to the gates of PMOS and NMOS transistors M1 and M2, and PMOS transistor M1 is turned on, and NMOS transistor M2 is turned off. During the saturation condition of PMOS transistor M1, the power source VCC causes NMOS transistor M5 to turn on, and thus node N5 is maintained at the VSS voltage level.
At the same time, the low level signal is inverted through three inverters X1, X2 and X3 into a high level signal that is applied to one end of pumping capacitor M4. Therefore, the voltage between the two electrodes of pumping capacitor M4 increases to a voltage of VCC. That is, the one end of pumping capacitor M4 is charged with VCC, and the common node N5 is at ground level VSS.
Thereafter, the input driving signal changes from the low level signal to the high level signal, or vice versa.
The high level signal at node N2 is applied to the gates of PMOS and NMOS transistors M1 and M2, and PMOS transistor M1 is turned off, and NMOS transistor M2 is turned on. Thus, NMOS transistor M5 turns off, and node N5 assumes a floating state.
At the same time, the high level signal of node N2 is inverted through three inverters X1, X2 and X3 into a low level signal, and thus VSS is applied to one electrode of pumping capacitor M4. The other electrode of pumping capacitor M4 is connected to node N5, which is now in a floating state.
Due to the coupling effect of pumping capacitor M4, the voltage of the electrode of pumping capacitor M4 connected to node N5 becomes a negative voltage below VSS (negative with respect to VSS).
On the other hand, at this moment, node N12 is in a low level state, and this low level signal is applied to PMOS and NMOS transistors M6 and M7, and PMOS transistor M6 is turned on, and NMOS transistor M7 is turned off, and thus node N13 is at a voltage level of VCC. Thus, transistor M3 turns on by the voltage level of node N13, and the other electrode of pumping capacitor M4 connected to node N5 is connected to the VBB terminal through transistor M3.
At same time, the low level signal of node N12 is applied to PMOS and NMOS transistors M6 and M7, and PMOS transistor M6 turns on, and NMOS transistor M7 turns off, and NMOS transistor M10 is turned on. The low level signal is inverted through three inverters X6, X7 and X8 into a high level signal applied to one end of pumping capacitor M9. The other end of pumping capacitor M9 is connected to VSS through transistor M10, and transistor M8 is turned off due to the low voltage level of node N3. Thus, node N14 is maintained at a voltage level of VSS, and the voltage of node N17 increases to the voltage level of VCC, and electrons at node N14 drift to the ground terminal VSS.
Next, when the oscillating signal is reversed into the high level, switching NMOS transistors M3 and M8 are operated opposite to that of the above description. As a result, first and second pumping portions 100 and 200 cause switching NMOS transistors M3 and M8 to be pumped in turn.
Herein, it is noted that one of the switching NMOS transistors is turned off to form the pumping portion, and the other switching NMOS transistor is turned on to have the higher conductance. In other words, according to the output voltage of a ring oscillator, the back-bias voltage and a power source are applied in turn to one of the gates of the switching NMOS transistors, thereby remarkably enhancing the pumping efficiency. FIG. 5 is a waveform diagram illustrating the voltage of node N5 and back-bias terminal VBB according to the present invention.
Also, as illustrated in FIG. 4, with the conventional back-bias voltage generating circuits discussed above, a problem may arise in that electrons are injected from the electrode of the pumping capacitor into the substrate due to the voltage of node N5 being lower than the voltage VBB. But, as illustrated in FIG. 5, with the present invention, when the voltage at one end of the pumping capacitor is being lowered below the voltage of the back-bias terminal, the voltage is applied through the switching NMOS transistor to the back-bias terminal because the switching NMOS transistor is turned on by a voltage level of VCC, thereby preventing electron injection from the junction of the pumping capacitors into the substrate.
Furthermore, as shown in FIG. 2, the signals at nodes N21 and N22 are not simultaneously made into a high level, and the signals at nodes N5 and N14 do not simultaneously become a high level. With the present invention, it is very easy to prevent the reversing flow of currents from the back-bias terminal VBB into nodes N5 and N14.
Accordingly, the present invention has a voltage lower than a back-bias voltage for a short period, but is kept at a voltage identical to or higher than the back-bias voltage to increase the pumping efficiency.
Although various preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and/or substitutions are possible without departing from the scope and spirit of the present invention as disclosed in the claims.