IC Card Device

1. Field of the Invention

The present invention relates to an improvement of an IC card device which prevents its IC chip from breaking.

2. Description of the Related Art

Typical conventional IC cards have an IC and a contact portion integrated into an IC module to provide a unit structure. With the use of such a unit structure, no wirings are laid under the contact portion.

In the case where multiple IC cards and/or parts such as a keyboard and a display need to be arranged, however, it is not possible to integrate all of them into an IC module to provide a unit structure. Therefore, the ICs and the other components are arranged separate from the contact portion as disclosed in, for example, U.S. Pat. No. 4,972,580. This arrangement requires wiring between the ICs and the other components as well as wiring between each IC and the individual contacts. There is not much space left for the wiring due to the mounting space required for the ICs and components. When the ICs and the other components arranged with the contacts in between, the wirings to connect the ICs to the components cannot be laid straight, but should undesirably run around the contacts.

U.S. Pat. No. 4,697,073 teaches contact wirings laid on the top and bottom surfaces of the printed circuit board and connected to multiple segments lying on the topmost surface of the board. The contact wirings are connected to the main chip in a hole. In this case, since contact wiring patterns lie directly below the respect contacts and no contact wiring pattern lies directly below the space between contacts provided side by side on the surface of the board, the former portion of the IC card is made relatively thick while the latter portion of the IC card is made entirely thinner than the other portion. In addition, the printed circuit board on the topmost layer of the IC card has an opening formed in order to expose the contacts from the surface. When external force is applied to the IC card, therefore, stress is likely to concentrate on the thin portion, which may damage the main chip. The conventional IC card having an IC and components arranged separate from the contacts therefore has a problem on the mechanical strength in addition to the aforementioned shortcoming on the laying of the wirings.

It is therefore an object of the present invention to provide an IC card device designed to prevent that portion of the IC card lying between contacts from becoming thinner than the other portion, thus preventing an IC chip from being broken.

To achieve this object, an IC card device according to the present invention comprises printed circuit substrate for supporting at least one of electric component; contact means attached to one surface of the printed circuit substrate and having multiple terminals provided with gaps therebetween to electrically contact with an external device; and circuit printed on the printed circuit substrate for connecting the contact means and the electric component, and having a portion placed belows at least the gaps between the terminals.

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate a presently preferred embodiment of the invention, and together with the general description given above and the detailed description of the preferred embodiment given below, serve to explain the principles of the invention.

FIG. 1 is a plan view illustrating a multifunction IC card according to one embodiment of the present invention;

FIG. 2 is a plan view of the IC card in FIG. 1 with its outer packaging removed;

FIG. 3 is a diagram showing the position relationship between a contact portion in FIG. 1 and the printed wirings for that contact portion; and

FIG. 4 is a cross-sectional view of the IC card taken along the line III--III in FIG. 1.

An IC card according to a preferred embodiment of the present invention will now be described referring to the accompanying drawings

FIG. 1 illustrates the outline of the surface of a multifunction IC card 1 according to the present invention. The multifunction IC card 1 has a resin outer packaging plate 2 adhered on the surface. A magnetic stripe (hereafter referred to as "MS") 3 is provided on the outer packaging plate 2. Magnetic information is written onto or read from the MS 3 by an MS reader/writer (not shown). Various types of keys are printed at a position corresponding to a keyboard module 11 (see FIG. 2) to be described later on the outer packaging plate 2, constituting a keyboard 5. A user can input various data using the keyboard 5. The outer packaging plate 2 further has an opening 15 from where a contact portion 4 to be described in detail is exposed outside. A window 10 is provided on the outer packaging plate 2 in order to make a liquid crystal display (hereafter referred to as "LCD") 9 to be mentioned later visible from the outside.

FIG. 2 illustrates the outlook of the IC card 1 with the outer packaging plate 2 removed. The IC card 1 has a frame 6 formed of a hard resin and a printed circuit board 7, which has various electronic components mounted in the space defined by the frame 6. The metal contact portion 4 which electrically contacts to an external device is attached to the printed circuit board 7. The contact portion 4 has, for example, six terminals: an operation voltage supply terminal of a CPU in the card, a reset signal supply terminal of the CPU, an operation clock supply terminal of the CPU, a ground terminal, a data-writing voltage supply terminal and a bidirectional data transfer terminal. A gap 41 is present between the terminals. An IC chip 8 is located at part of the back surface of the contact portion 4 of the printed circuit board 7 (portion indicated by the broken line in FIG. 2). The IC chip 8 has a CPU, which performs the general control of the IC card 1, and a memory, such as an EEPROM which stores various types of information, incorporated. The LCD 9 for displaying the contents of the memory, an LCD driver 20 for driving the LCD 9, the keyboard module 11 which constitutes the keyboard as input means, a crystal oscillator 12 for supplying a clock to the CPU and a battery 13 for supplying a clock to the CPU and a battery 13 for supplying power to the electronic components of the IC card 1 are mounted on the printed circuit board 7. Copper wirings 14 which electrically connect the various electronic components to one another are printed on the printed circuit board 7, for example.

FIG. 3 is an enlarged diagram showing where the contact portion 4 is attached to the printed circuit board 7. The position of the contact portion 4 is indicated by the broken line. FIG. 4 shows a cross section of the multification IC card 1 in FIG. 1 taken along the line III--III (cross section of the contact portion 4). As shown in FIGS. 3 and 4, when the contact portion 4 is to be attached to the printed circuit board 7, the wiring 14 on the board 7 is wider at positions where the gaps 41 are located between the respective terminals of the contact portion 4 than where the terminals of the contact portion 4 are located. The wiring 14 can therefore block the gaps 41 if the contact portion 4 is attached to the printed circuit board 7. If the wiring 14 lie across the gaps 41 of the contact portion 4, the wirings 14 are arranged to perpendicularly cross the gaps 41 of the respective terminals of the contact portion 4. In other words, the gaps 41 between the terminals of the contact portion 4 are reinforced from the back by the wirings 14. The multifunction IC card 1 will not become considerably thinner at the gaps 41 of the contact portion 4 than at the other portion of the IC card 1. As a result, even if external force is applied to the contact portion 4, the stress will not concentrate on the gaps 41 between the terminals, thereby preventing the IC chip from being cracked along the gaps 41 of the contact portion 4.

As described above, the multifunction IC card according to this embodiment will not become significantly thinner at the gaps 41 of the contact portion 4 than at other portions of the card. Even with external force applied to the contact portion 4, the stress will not concentrate on the gaps 41, thus preventing a damage on the IC chip which is buried under the contact portion 4. According to this embodiment, the wirings are arranged on that portion of the printed circuit board 7 which corresponds to the gap 41 of the contact portion 4. Instead of arranging the wirings 14, a hard resin may be coated on that portion of the printed circuit board 7 which corresponds to the gaps of the contact portion 4.

Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details, and representative devices, shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.