Process for Making a Metal Wall of a Package Used for Accommodating Electronic Elements

1. A process for making a metal wall enclosure of a package having an interior space therewithin for housing an electronic element, the metal wall enclosure comprising a metal sidewall and an integral bottom plate, the metal sidewall having upper and lower parallel edges spaced apart by a transverse dimension therebetween defining the height of the sidewall and, further, having a predetermined perimetrical dimension and configuration including transversely extending, angled corners, the sidewall thereby having an interior surface surrounding and defining an opening therethrough, and the integral bottom plate having an upper main surface having one edge portion, corresponding to one portion of the lower edge of the predetermined perimetrical configuration of the metal wall enclosure, integrally and continuously connected with the corresponding lower edge portion of the metal sidewall, the remaining lower edge portions of the metal sidewall being received and secured on the upper main surface of the integral bottom plate, the integral bottom plate thereby closing the corresponding lower edge opening of the metal sidewall, the process comprising; forming a planar metal strip, having first and second, substantially parallel major surfaces, so as to have a lateral dimension between opposite ends thereof which corresponds to the predetermined perimetrical dimension of the sidewall and to have a pair of parallel edges, spaced by a transverse dimension corresponding to the height of the metal sidewall, and an integral bottom plate, the integral bottom plate extending integrally and continuously at the corresponding edge portion thereof from an edge portion of the planar metal strip defining the corresponding lower edge portion of the metal sidewall; selectively forming at least one aperture in at least one of the planar metal strip and the integral bottom plate, the at least one aperture being formed at a position and being of a size for receiving therein a corresponding conductor element, the conductor element providing a connection therethrough, and thus from the exterior of the package and through the metal wall enclosure to the electronic element to be housed in the package; forming first grooves in the first major surface of the strip respectively corresponding to the transversely extending, angled corners of the metal sidewall and forming a second groove in the first major surface of the strip extending along the respectively corresponding edge portions of the metal sidewall and the integral bottom plate at which the same are integrally and continuously connected, and forming third transverse grooves in the second major surface of the strip, respectively corresponding to and aligned with the first transverse grooves, the third transverse grooves extending to a lesser extent into the strip than the first grooves relatively to the second and first major surfaces, respectively, of the strip and forming a fourth groove extending into the strip from the second major surface thereof aligned with the second groove, the fourth groove extending to a lesser extent into the strip than the second groove from the respective second and first major surfaces thereof; folding the strip along the aligned first and third transverse grooves for producing the transversely extending, angled corners and so as to dispose the opposite ends of the strip in abutting relationship, thereby forming the metal sidewall of the predetermined configuration surrounding an opening therethrough, and folding the integral bottom plate, relatively to the folded and formed metal sidewall, along the respective, aligned second and fourth grooves thereby to dispose the remaining lower edge portions of the metal sidewall, as formed by the folded strip, on the upper major surface of the integral bottom plate, the integral bottom plate thereby closing the corresponding, lower edge opening of the metal sidewall; and forming the metal wall enclosure by affixing and hermetically sealing, together, the abutting ends of the strip, as folded to form the metal sidewall, and the remaining bottom edge portions of the metal sidewall, as formed by the folded strip, and the upper major surface of the integral bottom plate.

2. A process as recited in claim 1, wherein each of the grooves has a V-shaped cross-section.

3. A process as recited in claim 1, wherein each of the grooves has a U-shaped cross-section.

4. A process as recited in claim 1, further comprising forming the first grooves and folding the strip so as to form a metal sidewall of a rectangular configuration in a plane parallel to the lower edge of the metal sidewall.

5. A process as recited in claim 1, further comprising: maintaining the metal sidewall, as disposed at the lower edge thereof on the upper major surface of the integral bottom plate and with the opposite ends of the strip, as folded to form the metal sidewall, in abutting relationship and, simultaneously, affixing and hermetically sealing the abutting ends of the metal sidewall, as formed by the folded strip, and the remaining lower edge portions of the metal sidewall, as formed by the folded strip, to the integral bottom plate.

6. A process as recited in claim 1, further comprising, prior to folding the strip, shaping at least one of the opposite, transverse ends of the strip such that the abutted ends of the strip, when folded to form the metal sidewall, define a transverse recess therebetween.

7. A process as recited in claim 6, further comprising disposing an adhesive material in the transverse recess for affixing and hermetically sealing the abutted ends together.

8. A process as recited in claim 7, wherein the adhesive is a solder and the abutted ends are affixed together and hermetically sealed to each other by a soldering process which causes the solder to flow into and fill the transverse recess.

9. A process as recited in claim 8, wherein the bottom edge of the metal sidewall, as formed by the folded strip, is affixed and hermetically sealed to the integral bottom plate by a soldering process.