US 5,214,601 AGrant

Bit Line Structure for Semiconductor Memory Device Including Cross-Points and Multiple Interconnect Layers

Issue Date:1993-05-25

•7 Claims

•16 Drawing Sheets

Abstract

A semiconductor memory device of folded bit line structure includes a cross portion in at least one portion of each bit line pair so that values of coupling capacitance with adjacent bit line pairs are equal to each other with respect to the paired bit lines. Preferably, the respective bit line pairs are equally divided into 4N (N being an integer), although advantages of the invention may be obtained with division of the bit lines into 3N, and the cross parts are provided at dividing points so that bit line pairs having the cross parts at the same dividing points are arranged on alternate pairs of bit lines. In a preferred embodiment, the cross parts are provided in regions for forming restore circuits or sense amplifiers. In a further embodiment, a dummy word line for selecting dummy cells for providing a reference potential is selected according to the position of a selected word line.

Metadata

Assignee

Mitsubishi Denki Kabushiki Kaisha

Inventors

Hideto Hidaka
Kazuyasu Fujishima
Yoshio Matsuda

Application Information

Application Number:US 8766908

Filing Date:1992-04-28

Priority Date:1986-12-11

Art Unit:232

Classifications

IPC:

G11C 506G11C 11407

Field of Search:

36551;63;190;210;206;205;149

Patent Drawings (16 sheets)

Description

Background of the Invention

1. Field of the Invention

The present invention relates to bit line structure for a semiconductor memory device, and more particularly, it relates to structure of bit lines for preventing information signal readout errors in a dynamic type semiconductor memory device.

2. Description of the Prior Art

FIG. 1 shows an exemplary structure of a general semiconductor memory device.

Referring to FIG. 1, the semiconductor memory device comprises a memory cell array 100 which is formed by a plurality of memory cells arrayed in the form of a matrix of rows and columns, an address buffer 101 which receives externally supplied address signals Ext.ADD to output internal row address signals A.sub.0 to A.sub.n and internal column address signals B.sub.0 to B.sub.m, a row decoder 102 which receives the internal row address signals A.sub.0 to A.sub.n to select a corresponding row from the memory cell array 100, a (I/O and sense amplifier) part 104 which is formed by a sense amplifier portion for detecting and amplifying information appearing on respective columns of the memory cell array 100 and an I/O portion for connecting the information amplified by the sense amplifier portion to an output buffer 103, a column decoder 105 which selects a column from the memory cell array 101 in response to the internal column address signals B.sub.0 to B.sub.m to transmit information on the selected column to the output buffer 103 through the I/O portion of the (I/O and sense amplifier) part 104 and the output buffer 103 which receives the information on the column selected by the column decoder 105 through the I/O part to output the same. It is to be noted that FIG. 1 shows only a data read system of the semiconductor memory device.

FIG. 2 shows the structure of a bit line part of the conventional dynamic type semiconductor memory device, which bit line part corresponds to a region enclosed by broken lines in FIG. 1.

FIG. 2 only shows two word lines WL.sub.0 and WL.sub.1, two bit lines BL and BL, two dummy word lines DWL.sub.0 and DWL.sub.1 and a sense amplifier SA, for convenience of illustration.

A column of memory cells are connected to each of the word lines WL.sub.0 and WL.sub.1 while a row of memory cells are connected to each of the bit lines BL and BL.

The bit lines BL and BL are paired to form the so-called folded bit line. Therefore, memory cells are provided at intersections between the word line WL.sub.0 and the bit line BL and between the word line WL.sub.1 and the bit line BL respectively. Although not shown in the figure, memory cells are similarly provided at intersections between the bit line BL and alternate word lines as well as between the bit line BL and alternate word lines.

A sense amplifier SA for detecting and amplifying a potential difference on the paired bit lines BL and BL is formed by cross-coupled NMOS transistors. This sense amplifier SA is activated in response to a sense amplifier activating signal .phi..sub.S, to pull down a lower potential of one of the bit lines BL and BL to a low potential (ground potential).

The sense amplifier activating signal .phi..sub.S is supplied to the gate of a switching transistor Q.sub.2. One conducting terminal of the switching transistor Q.sub.2 is connected to the ground potential and the other conducting terminal is connected to first conducting terminals of both MOS transistors of the sense amplifier SA. Second conducting terminals of the MOS transistors of the sense amplifier SA are connected with the bit lines BL and BL respectively.

The dummy word lines DWL.sub.0 and DWL.sub.1 are provided with dummy cells DC.sub.0 and DC.sub.1 for supplying a reference potential during operation of the sense amplifier SA. The dummy cell DC.sub.0 is provided at the intersection between the dummy word line DWL.sub.0 and the bit line BL, and the dummy cell DC.sub.1 is provided at the intersection between the dummy word line DWL.sub.1 and the bit line BL.

Each of memory cells MC.sub.0 and MC.sub.1 for storing information is a one-transistor/one-capacitor type memory cell which has a memory cell capacitor CS for storing information in the form of charges and a transfer gate TG being turned on/off in response to the word line potential for connecting the memory cell capacitor CS to the bit line BL or BL.

Each of the dummy cells DC.sub.0 and DC.sub.1 is structured similarly to the memory cell, and stores a quantity of charge equal to half that stored in the memory cell capacitor in a high-level state.

Transfer gates Q.sub.1 and Q.sub.1 ' are provided in order to connect a bit line pair selected in response to a column address signal from the column decoder 105 to a pair of data input/output lines I/O and I/O. The transfer gate Q.sub.1 connects the bit line BL to the data input/output line I/O, and the transfer gate Q.sub.1 ' connects the bit line BL to the data input/output line I/O. These transfer gates Q.sub.1 and Q.sub.1 ' are supplied at their gates with the output of the column decoder 105.

With reference to FIG. 1, description is now briefly made of an operation for data reading.

Each bit line is precharged at the potential V.sub.CC until a word line is selected and the potential of the selected word line rises. Then, when a word line (e.g., WL.sub.0) is selected by the output of the row decoder 102, the dummy word line DWL.sub.1 is simultaneously selected so that the memory cell MC.sub.0 is connected to the bit line BL.sub.1 and the dummy cell DC.sub.1 is connected to the bit line BL.sub.1. The dummy cells DC.sub.1 and DC.sub.0 store quantities of charges of 1/2 V.sub.CC C.sub.S, where V.sub.CC is a supply potential and C.sub.S is a capacitance of a memory capacitor.

A potential responsive to the information stored in the memory cell MC.sub.0 appears on the bit line BL.sub.1, which potential on the bit line BL.sub.1 is higher or lower than a potential on the bit line BL.sub.1, whereby a potential difference is caused between the bit lines BL.sub.1 and BL.sub.1. Then the sense amplifier activating signal .phi..sub.S goes high and the transfer gate Q.sub.2 enters an ON state, thereby to activate the sense amplifier SA. Thus, the potential difference between the paired bit lines BL.sub.1 and BL.sub.1 is amplified (the one of the bit lines having lower potential is discharged to the ground potential level). Then the transfer gates Q.sub.1 and Q.sub.1 ' enter ON states by the output of the column decoder 105, so that the bit lines BL.sub.1 and BL.sub.1 are connected to the data input/output lines I/O and I/O respectively, to read out the data.

The potentials appearing on the bit lines may be calculated as described below.

FIG. 3 illustrates parasitic capacitance present on each bit line. Each of the bit lines BL.sub.0 to BL.sub.2 and BL.sub.0 to BL.sub.2 has capacitance C.sub.1 with respect to the ground potential (fixed potential), capacitance C.sub.2 with respect to the bit line paired with the same and capacitance C.sub.3 with respect to the bit line of the adjacent bit line pair. It is assumed here that each bit line has length l and the memory cell capacitor CS has capacitance C.sub.s.

Each memory cell stores charges of C.sub.s V.sub.CC (V.sub.CC writing) in "H" storage and 0 (0 V writing) in "L" storage. "V.sub.CC writing" and "0 V writing" indicate potentials supplied to the bit lines in information writing respectively.

Each dummy cell for supplying the reference potential to the bit line stores charges of 1/2 C.sub.s V.sub.CC (1/2 V.sub.CC writing in capacitance C.sub.s etc.).

Each bit line is precharged at the potential V.sub.CC until a word line is selected by the output of the row decoder 102 and the potential of the selected word line rises at a potential exceeding V.sub.CC.

With reference to FIG. 3, consider that the memory cells connected to the bit line BL.sub.1 are selected and dummy cells are connected to the bit line BL.sub.1. In this case, a dummy word line is so selected that the selected memory cells are connected to one of paired bit lines and the dummy cells are connected to the other bit line.

When the selected word line rises at a potential exceeding V.sub.CC, potentials on the bit lines BL.sub.1 and BL.sub.1 are provided as follows:

In case of "L" reading: ##EQU1##

In case of "H" reading": ##EQU2## where .DELTA.V(BL.sub.0), .DELTA.V(BL.sub.1), .DELTA.V(BL.sub.1) and .DELTA.V(BL.sub.2) represent potential variations appearing on the bit lines BL.sub.0, BL.sub.1, BL.sub.1 and BL.sub.2 respectively.

Since precharge levels of the bit lines BL.sub.1 and BL.sub.1 are equally at V.sub.CC, the potential difference between the bit lines BL.sub.1 and BL.sub.1 is obtained from the expressions (1)-(3) and (2)-(3) as follows: ##EQU3## Sign "+" indicates "H" reading and sign "-" indicates "L" reading.

In the above expression (4), the first term in the right side of the equation represents original readout potential difference, and the second term in the right side expresses noise components from the bit lines BL.sub.0 and BL.sub.2 of the adjacent bit line pairs through capacitive coupling.

FIG. 4 shows exemplary changes of bit line potentials in data reading. Shown in FIG. 4 are voltage waveforms in such case that "L" is read on a bit line BL and "L" is read on a bit line BL of an adjacent bit line pair.

Lowering in readout voltage on a bit line caused by capacitive coupling noise with respect to an adjacent bit line pair is also described in IBM Journal of Research and Development, Vol. 29, No. 3, May 1985, pp. 277-288 by Peter E. Cottrel et al. This literature shows that the readout voltage is reduced in the ratio of ##EQU4## (K: proportional constant) to 1.

When a semiconductor memory device is increased in storage capacitance and the memory size is decreased, the bit line pitch is also reduced. In this case, the interval between adjacent bit line pairs is also reduced and the capacitance C.sub.3 between the bit line pairs is increased, whereby the second term in the right side of the expression (4) is increased. Namely, influence by potentials in bit lines of adjacent bit line pairs is increased, whereby readout voltage on the bit lines may be extremely damaged and potential difference .DELTA.V.sub.S on the bit line pair may be reduced. Thus, the sense amplifier SA cannot correctly detect and amplify the potential difference on the bit line pair, whereby the readout margin is lowered and the soft error rate is deteriorated, leading to a malfunction.

Since the conventional dynamic type semiconductor memory device is in the aforementioned structure, readout voltage difference is reduced by capacitive coupling noises between adjacent bit line pairs as the semiconductor memory device is implemented with higher density of integration which causes capacitance between adjacent bit lines to be increased, whereby the soft error rate is deteriorated and the readout margin is lowered, leading to a malfunction.

Japanese Patent Laying-Open Gazette No. 60-254489 described structure of reducing noise components caused by capacitive coupling between adjacent bit line pairs. In this prior art example, two bit lines forming a bit line pair are intersected with alternate bit line pairs so that the two bit lines are alternately adjacent to bit lines of adjacent bit line pairs. However, although noise components caused by capacitive coupling can be reduced with respect to bit line pairs having intersections, since such intersections of the bit lines are provided with respect to alternate bit line pairs, noises caused by capacitive coupling cannot be reduced with respect to bit line pairs provided with no such intersections. Namely, no consideration is made on reduction of noises in the bit line pairs provided with no intersections.

Japanese Published Patent Application (KoKai) No. 62-51096 describes a memory device formed by alternately arranged bit line pairs intersected in even portions and bit line pairs intersected in odd portions. Although this prior art example shows a memory device in which the bit lines are precharged at the V.sub.CC level, no consideration is made on presence of dummy cells. Further, no consideration is made on unbalanced capacitance distribution in a pair of bit lines caused by an intersection and increase in bit line length caused by provision of such intersections.

Summary of the Invention

An object of the present invention is to provide a semiconductor memory device which can eliminate influence exerted on readout voltage by capacitive coupling noises caused by capacitance between bit line pairs to completely prevent lowering of readout voltage amplitude.

Another object of the present invention is to provide a semiconductor memory device including bit line pairs having cross points, which can always connect dummy cells for providing a reference voltage to a bit line being paired with a bit line to which selected memory cells are connected.

Still another object of the present invention is to provide a semiconductor memory device including bit line pairs having cross points, which can prevent increase in bit line length.

In the semiconductor memory device according to the present invention, each bit line pair has a cross point in at least one portion so as to equalize values of capacitance formed by bit lines of bit line pairs and those of adjacent bit line pairs.

Such cross points are preferably suitably provided in points for equally dividing the bit line pairs into 4N (N being an integer) in the longitudinal direction.

Further, such cross points are preferably formed as part of a restore circuit for stepping up a higher potential one of each bit line pair and/or a sense amplifier circuit for detecting and amplifying a potential difference on the bit line pair.

A memory device of a dummy cell system includes bit line pairs having cross points, and a dummy word line decoder for connecting dummy cells to a reference bit line paired with a bit line to which memory cells are connected by a selected word line.

In the aforementioned structure, the respective bit line pairs have cross points in appropriate positions so that capacitive coupling noises applied to the bit lines of the bit line pairs from those of adjacent bit line pairs respectively can be absolutely equalized, whereby lowering of a readout voltage difference appearing on the bit line pairs in information reading can be prevented and the readout margin can be improved.

Further, the bit line length is not increased since the cross points are provided in the sense amplifier circuit parts or the restore circuit parts.

Further, since the dummy word line for selecting dummy cells is selected in correspondence to the selected word line by the dummy cell decoder, the dummy cells are reliably connected to the reference bit line and no malfunction is caused in the memory device.

These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

Brief Description of the Drawings

FIG. 1 schematically shows the entire structure of a generally employed basic semiconductor memory device;

FIG. 2 shows the structure of a bit line part of the conventional semiconductor memory device;

FIG. 3 conceptually shows capacitance incident to each bit line;

FIG. 4 is a waveform diagram showing potential changes in a bit line pair in data reading;

FIG. 5 shows the structure of a bit line part of a semiconductor memory device according to an embodiment of the present invention;

FIG. 6 shows the structure of a bit line part according to another embodiment of the present invention;

FIG. 7 shows the structure of a bit line part according to still another embodiment of the present invention;

FIG. 8 is a diagram for illustrating a problem caused when the semiconductor memory device according to the present invention is applied to a conventional semiconductor memory device of a dummy cell system;

FIG. 9 shows an improved example of a dummy cell system semiconductor memory device according to the present invention;

FIG. 10 shows an exemplary structure of a dummy word line decoder for selecting dummy word lines as shown in FIG. 9;

FIG. 11 shows another improved example of a dummy cell system semiconductor memory device according to the present invention;

FIG. 12 illustrates the layout of cross points of bit line pairs according to the present invention;

FIG. 13 shows an exemplary arrangement of bit line pairs, restore circuits and sense amplifiers in case of applying the present invention to a memory device having sense amplifiers and active restore circuits;

FIG. 14 shows still another improved example of the present invention with reference to the layout of a sense amplifier part provided with cross points;

FIG. 15 shows the layout of a sense amplifier part formed by conventional cross-coupled transistors; and

FIG. 16 shows a further improved example of the present invention.

Description of the Preferred Embodiments

FIG. 5 shows the structure of bit lines of a semiconductor memory device according to an embodiment of the present invention.

Referring to FIG. 5, illustrated are four bit line pairs BL.sub.0 and BL.sub.0, BL.sub.1 and BL.sub.1, BL.sub.2 and BL.sub.2 and BL.sub.3 and BL.sub.3. Symbol l represents the length of each bit line. Each bit line is divided in quarters into blocks a, b, c and d by dividing points CP.sub.1, CP.sub.2 and CP.sub.3. The paired bit lines cross with each other at the dividing points CP.sub.1 to CP.sub.3 in the following manner:

(1) The paired bit lines BL.sub.0 and BL.sub.0 cross with each other at the even numbered dividing point CP.sub.2.

(2) The paired bit lines BL.sub.1 and BL.sub.1 cross with each other at the odd numbered dividing points CP.sub.1 and CP.sub.3.

(3) The paired bit lines BL.sub.2 and BL.sub.2 cross with each other at the dividing point CP.sub.2.

(4) The paired bit lines BL.sub.3 and BL.sub.3 cross with each other at the dividing points CP.sub.1 and CP.sub.3.

Namely, paired bit lines crossing at the dividing point CP.sub.2 and those crossing at the dividing points CP.sub.1 and CP.sub.3 are alternately arranged. In other words, odd numbered bit line pairs cross at the dividing points CP.sub.1 and CP.sub.3 and even numbered bit line pairs cross at the dividing point CP.sub.2 as shown for the paired bit lines BL.sub.0 and BL.sub.0.

The bit line pairs are provided with sense amplifiers SA.sub.1 to SA.sub.4 for detecting and amplifying a potential difference on the bit line pairs. Transfer gates Q.sub.10 and Q.sub.10 ', Q.sub.11 and Q.sub.11 ', Q.sub.12 and Q.sub.12 ' and Q.sub.13 and Q.sub.13 ' are provided in order to connect a pair of bit lines to data input/output lines I/O and I/O in response to output from a column decoder 105.

The sense amplifiers SA.sub.1 to SA.sub.4 are activated in response to a sense amplifier activating signal .phi..sub.S to detect and amplify the potential difference on the bit line pairs.

Assuming that the bit lines have the capacitance as shown in FIG. 3, capacitive coupling noises applied to the respective bit lines from adjacent bit line pairs in signal reading are expressed as follows, in consideration similar to the aforementioned case of the prior art:

(1) The bit line BL.sub.1 is adjacent to the bit lines BL.sub.0, BL.sub.2, BL.sub.2 and BL.sub.0 in the blocks a, b, c and d respectively. On the other hand, the bit line BL.sub.1 is adjacent to the bit lines BL.sub.2, BL.sub.0, BL.sub.0 and BL.sub.2 respectively. With employment of .alpha. and .gamma. in the expression (4), capacitive coupling noises .DELTA.V(BL.sub.1)' and .DELTA.V(BL.sub.1)' applied to the bit lines BL.sub.1 and BL.sub.1 are as follows: ##STR1## As obvious from the above expressions, .DELTA.V(BL.sub.1)' is equal to .DELTA.V(BL.sub.1)'.

(2) The bit line BL.sub.2 is adjacent to the bit lines BL.sub.1, BL.sub.1, BL.sub.3 and BL.sub.3 and the bit line BL.sub.2 is adjacent to the bit lines BL.sub.3, BL.sub.3, BL.sub.1 and BL.sub.1 in the blocks a, b, c and d respectively. Therefore, capacitive coupling noises .DELTA.V(BL.sub.2)' and .DELTA.V(BL.sub.2)' applied to the bit lines BL.sub.2 and BL.sub.2 in signal reading are as follows: ##STR2## As obvious from the above expressions, .DELTA.V(BL.sub.2)' is equal to .DELTA.V(BL.sub.2)'.

Thereafter in a similar manner, capacitive coupling noises applied to each of paired bit lines from adjacent bit lines are absolutely equal to each other with respect to all of the bit line pairs.

(3) Also in case where the bit lines BL.sub.0 and BL.sub.0 are located at a memory array end, capacitive coupling noises .DELTA.V(BL.sub.0)' and .DELTA.V(BL.sub.0)' applied to the bit lines BL.sub.0 and BL.sub.0 from adjacent bit lines are as follows: ##STR3## It is clear that .DELTA.V(BL.sub.0) is equal to .DELTA.V(BL.sub.0).

In the embodiment as hereinabove described, capacitive coupling noises applied to the respective paired bit lines from adjacent bit line pairs in signal reading are absolutely equal to each other, whereby influence by the second term in the right side of the expression (4) can be completely eliminated. Namely, the readout voltage difference .DELTA.V.sub.S as shown in FIG. 4 can be increased as compared with the prior art. Thus, lowering of readout voltage difference caused by capacitive coupling noises from adjacent bit line pairs can be absolutely eliminated, and, thereby, the readout margin is enlarged and the soft error rate is improved.

FIG. 6 shows the structure of bit lines according to a second embodiment of the present invention.

Referring to FIG. 6, cross points are further added at a bit line end point CP.sub.4 (end point close to sense amplifiers) to odd numbered bit line pairs (BL.sub.0 and BL.sub.0, BL.sub.2 and BL.sub.2, . . . ), dissimilarly to the bit line structure as shown in FIG. 5.

It is impossible to lay out bit line cross points at dividing points CP.sub.1, CP.sub.2 and CP.sub.3 such that stray capacitance distribution is completely symmetrical with respect to each pair of bit lines. In the above discussion, calculation is performed on the assumption that capacitance incident to each bit line is uniformly distributed over the longitudinal direction of the bit line. When there is only one bit line cross point which is not symmetrical in configuration, distribution of stray capacitance of the bit line pair may be unbalanced.

With respect to the even numbered bit line pairs (BL.sub.1 and BL.sub.1, BL.sub.3 and BL.sub.3, . . . ) in the embodiment as shown in FIG. 5, it is possible to implement balanced capacitance distribution for the entire bit line pairs since the cross points are provided in two portions of the dividing points CP.sub.1 and CP.sub.3. Assuming that the bit lines are of aluminum (Al) layers and interconnection layers intersectable with the same are of polysilicon layers, for example, unbalanced distribution of stray capacitance in the bit line pair can be avoided by preparing the bit lines BL.sub.1 and BL.sub.1 by an Al layer and a polysilicon layer respectively at the dividing point CP.sub.1 and by preparing the bit lines BL.sub.1 and BL.sub.1 by a polysilicon layer and an Al layer respectively at the dividing point CP.sub.3.

The embodiment as shown in FIG. 6 is adapted to implement the effect similar to that of the aforementioned discussion, by providing cross points serving as dummy points in the odd numbered bit line pairs (BL.sub.0 and BL.sub.0, BL.sub.2 and BL.sub.2, . . . ) at the end point CP.sub.4. Thus, balanced capacitance distribution can be implemented with respect to all of the bit line pairs.

Although each of the bit lines is divided into four blocks of equal length in the above embodiment so that the paired bit lines cross at appropriate points, the number of such division may be an integral multiple of four such as eight or twelve, to attain an effect similar to that of the above embodiment.

FIG. 7 shows the structure of bit lines, which are equally divided into eight blocks. Referring to FIG. 7, the bit line structure as shown in FIG. 6 is repeated twice in the longitudinal direction of the bit lines, and it is clear that an effect similar to that of the structure as shown in FIG. 6 can be attained by such structure.

Although the bit lines are precharged at the supply voltage level V.sub.CC in the aforementioned embodiment, the present invention is also applicable to the case of a bit line precharge level of 1/2 V.sub.CC.

A memory device of the aforementioned dummy cell system may malfunction when a conventional dummy word line selecting method is simply applied. Referring again to FIG. 2, the dummy word line DWL.sub.1 is selected when the word line WL.sub.0 is selected and the dummy word line DWL.sub.0 is selected when the word line WL.sub.1 is selected in the conventional dummy word line selecting method. In other words, the dummy word line DWL.sub.1 is selected when an even numbered word line (WL.sub.0, WL.sub.2, . . . ) is selected, and the dummy word line DWL.sub.0 is selected when an odd numbered word line (WL1, WL3, . . . ) is selected.

FIG. 8 shows the structure of the memory device as shown in FIG. 6, to which the conventional dummy cell system is applied. Referring to FIG. 8, circles in intersections between word lines (WL.sub.0, WL.sub.0 ', WL.sub.1, WL.sub.1 ', . . . ) and bit lines depict the arrangement of memory cells. Further, circles in intersections between dummy word lines DWL.sub.0 and DWL.sub.1 and the bit lines indicate the arrangement of dummy cells.

As shown in FIG. 8, the memory cells are alternately arranged such that the memory cells selected by the word line WL.sub.0 are connected to bit lines BL.sub.0, BL.sub.1, BL.sub.2, BL.sub.3, . . . and the memory cells selected by the word line WL.sub.0 ' being adjacent to the word line WL.sub.0 are connected to the bit lines BL.sub.0, BL.sub.1, BL.sub.3, . . . , for example. Each bit line pair is divided in quarters into four blocks a, b, c and d.

The dummy cells are arranged similarly to the memory cells such that the dummy cells selected by the dummy word line DWL.sub.0 are connected to the bit lines BL.sub.0, BL.sub.1, BL.sub.2, BL.sub.3, . . . and the dummy cells selected by the dummy word line DWL.sub.1 are connected to the bit lines BL.sub.0, BL.sub.1, BL.sub.2, BL.sub.3, . . . , for example.

Considering that it is necessary to connect the dummy cells to bit lines (reference side bit lines) opposite to those to which the memory cells are connected, with reference to FIG. 8,

(1) the dummy word line DWL.sub.1 may be selected when the word line WL.sub.0 in the block a is selected and the dummy word line DWL.sub.0 may be selected when the word line WL.sub.0 ' in the block a is selected.

(2) When the word line WL.sub.1 or WL.sub.1 ' in the block b is selected, half the total bit line pairs are necessarily in nonconformance regardless of whether the dummy word line DWL.sub.0 or DWL.sub.1 is selected.

(3) The dummy word line DWL.sub.0 may be selected when the word line WL.sub.2 in the block c is selected and the dummy word line DWL.sub.1 may be selected when the word line WL.sub.2 ' in the block c is selected, similarly to the case of (1).

(4) When the word line WL.sub.3 or WL.sub.3 ' in the block d is selected, the situation is similar to the case of (2).

Thus, the conventional dummy cell system is not applicable to the case of such bit line pairs including cross points.

Such a disadvantage can be overcome by structuring dummy word lines and a dummy word line selecting decoder in the following manner:

FIG. 9 illustrates an improved example of the semiconductor memory device according to the present invention.

The improved device as shown in FIG. 9 has two pairs of dummy word lines DWL.sub.0, DWL.sub.1, DWL.sub.2 and DWL.sub.3 on both sides of cross points CP.sub.4 of bit line pairs, dissimilarly to the structure of FIG. 8. Each of the dummy word lines is provided with dummy cells (shown by circles in FIG. 9) at intersections with alternate bit lines. The dummy word lines DWL.sub.0 and DWL.sub.3 are provided with dummy cells in intersections with lower ones of the respective paired bit lines in the figure, while the dummy word lines DWL.sub.1 and DWL.sub.2 are provided with dummy cells in intersections with upper ones of the paired bit lines in the figure. One of the four dummy word lines DWL.sub.0 to DWL.sub.3 is selected in response to the block to which a selected word line belongs.

Respective blocks a to d of the bit line pairs are addressed by two-bit row addresses. Mapping by row addresses RA.sub.i and RA.sub.j (where i.noteq.j) is as follows:

block a: RA.sub.i =RA.sub.j =0

block b: RA.sub.i =0, RA.sub.j =1

block c: RA.sub.i =1, RA.sub.j =0

block d: RA.sub.i =RA.sub.j =1

Word lines WL.sub.0, WL.sub.0 ', WL.sub.1, WL.sub.1 ', . . . are mapped with row addresses RA.sub.k (k.noteq.i, k.noteq.j) as follows:

Namely, the word lines having memory cells in intersections with upper ones of the paired bit lines in FIG. 9 are addressed by RA.sub.k =0 and the word lines having memory cells in intersections with lower bit lines are addressed by RA.sub.k =1.

In the memory device of the structure as shown in FIG. 9, dummy cells can be always connected to reference bit lines (bit lines providing reference voltage in sensing operation) by selecting the dummy word lines DWL.sub.0 to DWL.sub.3 in response to the selected word line as follows:

(1) Within the block a:

when WL.sub.0 is selected: DWL.sub.0

when WL.sub.0 ' is selected: DWL.sub.1

(2) Within the block b:

when WL.sub.1 is selected: DWL.sub.2

when WL.sub.1 ' is selected: DWL.sub.3

(3) Within the block c:

when WL.sub.2 is selected: DWL.sub.1

when WL.sub.2 ' is selected: DWL.sub.0

(4) Within the block d:

when WL.sub.3 is selected: DWL.sub.3

when WL.sub.3 ' is selected: DWL.sub.2

Namely, the dummy word lines are selected as shown in the following Table 1 with respect to values of the aforementioned three-bit row addresses RA.sub.i, RA.sub.j and RA.sub.k :

FIG. 10 shows exemplary structure of a dummy word line decoder.

With reference to FIG. 10, description is made on the structure and operation of the dummy word line decoder according to the present invention.

A dummy word line DWL.sub.0 is provided with a negative logic AND gate (NOR gate) A.sub.0 for receiving three-bit row addressess RA.sub.i, RA.sub.j and RA.sub.k, a negative logic AND gate A.sub.0 ' which receives three-bit row addresses RA.sub.i, RA.sub.j and RA.sub.k, a NOR gate N.sub.0 which receives outputs from the negative logic AND gates A.sub.0 and A.sub.0 ', an inverter V.sub.0 which inverts an output from the NOR gate N.sub.0, a MOS transistor T.sub.0 which receives an output from the inverter V.sub.0 at its gate and a MOS transistor T.sub.0 ' which receives the output from the NOR gate N.sub.0. The MOS transistors T.sub.0 and T.sub.0 ' are connected in series, while one conducting terminal of the MOS transistor T.sub.0 is supplied with a dummy word line driving signal .phi..sub.R and one conducting terminal of the MOS transistor T.sub.0 ' is connected to a reference (ground) potential. The junction between the MOS transistors T.sub.0 and T.sub.0 ' is connected to a dummy word line DWL.sub.0. The negative logic AND gates are positive logic NOR gates, which output "H" when all of input signals are "L". When the MOS transistor T.sub.0 is in an ON state and the MOS transistor T.sub.0 ' is in an OFF state, the word line driving signal .phi..sub.R is transmitted to the dummy word line DWL.sub.0, so that the dummy word line DWL.sub.0 is selected. The word line driving signal .phi..sub.R is generated at the time for driving the selected word line.

In a manner similar to the dummy word line DWL.sub.0, the dummy word line DWL.sub.1 is provided with a NOR gate N.sub.1 which receives outputs from negative logic AND gates A.sub.1 and A.sub.1 ', an inverter V.sub.1 which receives an output from the NOR gate N.sub.1, a MOS transistor T.sub.1 which receives an output from the inverter V.sub.1 at its gate for transmitting the word line driving signal .phi..sub.R to the dummy word line DWL.sub.1 and a MOS transistor T.sub.1 ' which receives the output from the NOR gate N.sub.1 at its gate for discharging the dummy word line DWL.sub.1. The negative logic AND gate A.sub.1 is supplied with row addresses RA.sub.i, RA.sub.j and RA.sub.k. The negative logic AND gate A.sub.1 ' is supplied with row addresses RA.sub.i, RA.sub.j and RA.sub.k.

The dummy word line DWL.sub.2 is similarly provided with a NOR gate N.sub.2 which receives outputs from negative logic AND gates A.sub.2 and A.sub.2 ', an inverter V.sub.2 which receives an output from the NOR gate N.sub.2, a MOS transistor T.sub.2 which transmits the word line driving signal .phi..sub.R to the dummy word line DWL.sub.2 in response to an output from the inverter V.sub.2 and an MOS transistor T.sub.2 ' which discharges the dummy word line DWL.sub.2 in response to the output from the NOR gate N.sub.2. The negative logic AND gate A.sub.2 is supplied with row addresses RA.sub.i, RA.sub.j and RA.sub.k and the negative logic AND gate A.sub.2 ' is supplied with row addresses RA.sub.i, RA.sub.j and RA.sub.k.

The dummy word line DWL.sub.3 is similarly provided with a NOR gate N.sub.3 which receives outputs from negative logic AND gates A.sub.3 and A.sub.3 ', an inverter V.sub.3 which receives an output from a NOR gate N.sub.3, an MOS transistor T.sub.3 which transmits the dummy word line driving signal .phi..sub.R to the dummy word line DWL.sub.3 in response to an output from the inverter V.sub.3 and an MOS transistor T.sub.3 ' which discharges the dummy word line DWL.sub.3 in response to the output from the NOR gate N.sub.3. The negative logic AND gate A.sub.3 is supplied with row addresses RA.sub.i, RA.sub.j and RA.sub.k, and the negative logic AND gate A.sub.3 ' is supplied with row addresses RA.sub.i, RA.sub.j and RA.sub.k.

When an output of a negative logic AND gate is "H" in the aforementioned structure, the dummy word line driving signal .phi..sub.R is transmitted to a corresponding dummy word line. The output of the negative logic AND gate goes high when all of inputs are "L". Therefore, the decoder as shown in FIG. 10 satisfies the relation between the selected word line and the selected dummy word line as shown in Table 1.

Thus, according to this embodiment, a dummy cell system applicable to a bit line system including cross points can be easily implemented by adding or arranging a set of dummy cells and dummy word lines (for two dummy word lines) which are absolutely similar to the conventional dummy cell system on both sides of the cross point CP.sub.4.

In the above description, the word lines WL.sub.0 and WL.sub.0 ' are representative of those included in the block a. This also applies to other word lines in the block a, as well as to other blocks. Selection of a single word line is performed by remaining row address.

The dummy word lines are not necessarily arranged in the positions of the above embodiment, but may be located on both sides of other cross points.

Although the aforementioned embodiment is applied to the device as shown in FIG. 6, the present invention is also applicable to other devices such as those shown in FIGS. 5 and 7.

FIG. 11 shows a semiconductor memory device according to a second improved example of the present invention. In this case, dummy cells are arranged continuously with respect to every third adjacent pair of bit lines for crossing bit lines with respect to dummy word lines DWL.sub.2 and DWL.sub.3 and in a portion per bit line pair. Consequently, two dummy cells are connected to each bit line. Thus, parasitic capacitance caused by capacitive coupling between a bit line and the dummy cells can be made identical in the respective bit lines, and capacitance distribution in a single bit line can be balanced. Arrangement of the dummy cells is thus modified with respect to parts of dummy word lines so that the dummy cell system can be implemented with no difficulty even if all of the four dummy word lines DWL.sub.0 to DWL.sub.3 are arranged on one side of a cross point. In this case, a decoder for the dummy word lines DWL.sub.0 to DWL.sub.3 may be absolutely identical to that shown in FIG. 10.

The aforementioned example is adapted to improve a memory device of the dummy cell system. Description is now made on another improved example which can be applied to a memory device of, e.g., a 1/2 V.sub.CC precharge system having no dummy cell.

As hereinabove described, cross points are provided in the respective bit line pairs and connection of a bit line in the cross points is performed by alternately employing Al layers and polysilicon layers to make the distribution stray capacitance uniform in the respective bit line pairs in the present invention. In this case, however, the bit line length is excessively increased by provision of such cross points, whereby the area may be disadvantageously increased in view of layout.

FIG. 12 is a plan view showing the layout of cross points of paired bit lines. Referring to FIG. 12, the bit lines are formed by interconnection layers of low-resistance metal such as aluminum. Bit lines BL.sub.0 and BL.sub.2 are connected at cross points CP by polysilicon layers through contact holes 31. Memory cells cannot be connected in the cross points CP in this structure, and hence the bit line length is inevitably increased. Description is now made of a technique of providing cross points without increasing bit line length. In order to illustrate a further improved example with no regard to presence/absence of dummy cells, the following description is made of the case where each bit line pair is provided with a sense amplifier, for detecting and amplifying a potential difference on the bit line pair, and an active restore circuit, for stepping up the higher potential bit line to supply voltage V.sub.CC.

FIG. 13 shows the structure of the further improved example of the present invention.

Referring to FIG. 13, each of sense amplifiers 5 is formed by cross-coupled n-channel MOS transistors Q.sub.1 and Q.sub.2 (Q.sub.1 ' and Q.sub.2 ').

Sources of the n-channel MOS transistors Q.sub.1 and Q.sub.2 (Q.sub.1 ' and Q.sub.2 ') are connected to a common source line S.sub.1. The common source line S.sub.1 is connected to a ground potential V.sub.SS through an n-channel MOS transistor Q.sub.10 which enters an ON state in response to a sense amplifier activating signal .phi..sub.S. The sense amplifier 5 discharges the one of the bit lines having lower potential to ground potential in response to the sense amplifier activating signal .phi..sub.S.

The active restore circuit 6 is formed by cross-coupled p-channel MOS transistors Q.sub.3 and Q.sub.4 (Q.sub.3 ' and Q.sub.4 '). Sources of the p-channel MOS transistors Q.sub.3 and Q.sub.4 (Q.sub.3 ' and Q.sub.4 ') are connected to a signal line S.sub.2. The signal line S.sub.2 is connected to the supply potential V.sub.CC through a p-channel MOS transistor Q.sub.11 which enters an ON state in response to a restore circuit activating signal .phi..sub.R. The active restore circuit 6 charges (re-charges) the higher potential one of the bit lines to the supply potential V.sub.CC in response to the restore circuit activating signal .phi..sub.R.

In the structure of FIG. 13, the bit line pairs are equally divided into four blocks a, b, c and d.

As shown in FIG. 13, the cross points CP.sub.1 and the sense amplifiers 5 are provided between the blocks a and b, and cross points CP.sub.3 and the active restore circuits 6 are provided between the blocks c and d.

FIG. 14 is a plan view showing an exemplary layout of the cross points CP.sub.1 and the sense amplifiers.

As shown in FIG. 14, the gate of a transistor Q.sub.1 formed in an active region 42a is formed by a polysilicon layer 41, which is connected to a metal interconnection layer 40 of aluminum etc. forming a bit line BL.sub.0 through a contact hole 45. The source of the transistor Q.sub.1 is connected to a common source line S.sub.1 through a contact hole 46a, and the drain thereof is connected to a bit line BL.sub.0 through a contact hole 46b. The gate of a transistor Q.sub.2 is formed by a polysilicon layer 41 and connected to the bit line BL.sub.0 through a contact hole 45, while its source is connected to a signal line S.sub.2 through a contact hole 46a and its drain is connected to the bit line BL.sub.0 through a contact hole 46b.

Description is now made of a pair of bit lines BL.sub.1 and BL.sub.1 having a cross point CP.sub.1. The bit line BL.sub.1 (metal interconnection layer) is connected to the gate (polysilicon layer) of a transistor Q.sub.1 ' through a contact hole 45.

The source of the transistor Q.sub.1 ' is connected to a signal line S.sub.2 through a contact hole 46a, and its drain is connected to the bit line BL.sub.1 through a contact hole 46b. The gate (polysilicon layer 41) of a transistor Q.sub.2 ' is connected to the bit line BL.sub.1 through a contact hole 45 and its source is connected to the signal line S.sub.1 through a contact hole 46a, while its drain is connected to the bit line BL.sub.1 through a contact hole 45b. The bit lines and signal lines are formed by metal interconnection layers, and the gates of the transistors are formed by polysilicon layers.

As is clear from FIG. 14, the cross point of the bit line BL.sub.1 is formed to overlap with the gate of the transistor Q.sub.1 ' in a manner substantially similar to conventional layout of sense amplifiers as shown in FIG. 15, so that such cross point causes no increase in bit line length. Referring to FIG. 14, reference numerals 42a and 42b indicate n-channel transistor active regions.

In this example, the manner of intersection of the paired bit lines is identical to that of the device as shown in FIG. 5, so that capacitive coupling noises applied to the bit line pairs from adjacent bit lines are completely cancelled. Active restore circuits are also provided at the cross point parts to include cross points in structure similar to that shown in FIG. 14. In this case, the transistors Q.sub.1, Q.sub.1 ', Q.sub.2 and Q.sub.2 ' may be replaced by Q.sub.3, Q.sub.3 ', Q.sub.4 and Q.sub.4 '.

FIG. 16 shows the structure of a memory cell array according to a further improved example of the present invention. This example is different from that shown in FIG. 13 in that respective bit lines are equally divided into three blocks a, b and c so that sense amplifiers SA and cross points CP.sub.1 are provided between the blocks a and b and active restore circuits AR and cross points CP.sub.2 are arranged between the blocks b and c, to remove portions of only cross points. Since the bit lines are equally divided into three blocks, capacitive coupling noises, which can be completely removed in the case of the four equally divided blocks, are merely reduced to 1/3, while portions of only cross points, which cause increase in bit line length, can be completely removed.

Although the cross points are provided in the sense amplifier parts and the active restore circuits included in the semiconductor memory device in each of the aforementioned improved examples, a similar effect can be attained by a device having only sense amplifiers provided with cross points.

According to the present invention as hereinabove described, one or more cross points are provided in each bit line pair so that values of capacitance between respective ones of the paired bit lines and adjacent bit line pairs are equal to each other, whereby lowering of readout voltage difference can be prevented, and the readout margin is expanded while the soft error rate is improved.

Further, when dummy word line decoder means is provided for selecting one from a plurality of dummy word lines so that the same is connected to a bit line paired with that to which selected memory cells are connected, a dummy cell system applicable to a device having bit line pairs including cross points can be implemented to improve reliability.

In addition, when cross points on respective bit line pairs for substantially equalizing values of capacitance between respective ones of paired bit lines and adjacent bit line pairs are provided in sense amplifier parts and/or active restore circuit parts, excessive increase in bit line length in circuit layout can be advantageously prevented.

Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims.

Claims

What is claimed is:

1. A semiconductor memory device comprising a plurality of memory cells arrayed in the form of a matrix of rows and columns, a plurality of bit lines each connected with a column of said plurality of memory cells, said plurality of bit lines arrayed in bit line pairs and a plurality of sense amplifiers, each of said sense amplifiers connected to a respective pair of bit lines for detecting and amplifying a potential difference between the bit lines of the respective pair of bit lines, said matrix having a plurality of dividing points, dividing said matrix into portions of substantially equal length along the direction of the length of said bit lines, said bit line pairs formed with cross-points at said dividing points in which bit line locations are interchanged such that the capacitance between a first bit line of each bit line pair and both bit lines of a respective adjacent bit line pair are substantially equal, adjacent bit line pairs each having a number of cross-points which is exactly divisible by two, the capacitance between each bit line of any bit line pair and ground being substantially equal, said bit lines of said bit line pairs having cross-points including parallel portions and intersecting portions, said parallel portions formed in a first layer, said intersecting portions located at said cross points, at least one of the intersecting bit line portions at each cross point comprising an interconnect layer different from said first layer, each of the bit lines of any bit line pair having the same number of interconnect layers.

2. A semiconductor memory device in accordance with claim 1, wherein all bit line pairs have the same number of cross points.

3. A semiconductor memory device in accordance with claim 1, wherein said bit line pairs further include cross-points at points outside said matrix of memory cells.

4. A semiconductor memory device comprising a plurality of memory cells arrayed in the form of a matrix of rows and columns, a plurality of pairs of bit lines each connected with a column of said plurality of memory cells, and a plurality of sense amplifiers, each of said sense amplifiers connected to a respective pair of bit lines for detecting and amplifying a potential difference between the bit lines of the respective pair of bit lines, said matrix having a plurality of dividing points, dividing said matrix into portions of substantially equal length along the direction of the length of said bit lines, said pairs of bit lines including cross-points at said dividing points and at points at one end of said bit lines in which bit line cross-points are alternately arranged in a row direction such that the capacitance between a first bit line of each bit line pair and the first bit line of a respective adjacent bit line pair and the capacitance between the first bit line of each bit line pair and a second bit line of the respective adjacent bit line pair are substantially equal, each bit line pair having a number of cross-points which is exactly divisible by two, the capacitance between each bit line of any bit line pair and ground being substantially equal; said cross points of said bit lines of said bit line pairs including parallel portions and intersecting portions, said parallel portions being formed in a first layer, said intersecting portions located at said cross points, at least one of the intersecting bit line portions at each cross point comprising an interconnect layer different from said first layer, each of the bit lines of any bit line pair having the same number of interconnect layers.

5. A semiconductor memory device in accordance with claim 4, wherein all bit line pairs have the same number of cross points.

6. A semiconductor memory device comprising a plurality of memory cells arrayed in the form of a matrix of rows and columns, a plurality of bit lines each connected with a column of said plurality of memory cells, said plurality of bit lines arrayed in bit line pairs and a plurality of sense amplifiers, each of said sense amplifiers connected to a respective pair of bit lines for detecting and amplifying a potential difference between the bit lines of the respective pair of bit lines, said matrix having a plurality of dividing points, dividing said matrix into portions of substantially equal length along the direction of the length of said bit lines, said bit line pairs formed with cross-points at said dividing points in which bit line locations are interchanged such that the capacitance between one bit line of any bit line pair and ground is substantially equal to the capacitance between the other bit line of said any bit line pair and ground, alternate bit line pairs each having a number of cross-points which is exactly divisible by two, the remaining bit line pairs having no cross-points, said bit lines of said bit line pairs having cross-points including parallel portions and intersecting portions, said parallel portions formed in a first layer, said intersecting portions located at said cross points, at least one of the intersecting bit line portions at each cross point comprising an interconnect layer different from said first layer, each of the bit lines of any bit line pair having the same number of interconnect layers.

7. A semiconductor memory device comprising a plurality of memory cells arrayed in the form of a matrix of rows and columns, a plurality of bit lines each connected with a column of said plurality of memory cells, said plurality of bit lines arrayed in bit line pairs and a plurality of sense amplifiers, each of said sense amplifiers connected to a respective pair of bit lines for detecting and amplifying a potential difference between the bit lines of the respective pair of bit lines, said matrix having a plurality of dividing points, dividing said matrix into portions of substantially equal length along the direction of the length of said bit lines, said bit line pairs formed with cross-points at said dividing points in which bit line locations are interchanged such that the capacitance between one bit line of any bit line pair and ground is substantially equal to the capacitance between the other bit line of said any bit line pair and ground, said bit lines of said bit line pairs having cross-points including parallel portions and intersecting portions, said parallel portions formed in a first layer, said intersecting portions located at said cross points, at least one of the intersecting bit line portions at each cross point comprising an interconnect layer different from said first layer, each of the bit lines of any bit line pair having the same number of interconnect layers.

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Abstract

Description