US 5,173,582 AGrant
Charged Particle Beam Lithography System and Method
Issue Date:1992-12-22
•6 Claims
•15 Drawing Sheets
Abstract
A charged particle beam lithography system includes a beam source of a charged particle beam, a beam shaping aperture for providing a predetermined cross section to the charged particle beam, a first focusing system for focusing the charged particle beam on a first crossover point located on the optical axis, a second focusing system provided between the first crossover point and an object for focusing the charged particle beam on a second crossover point located on the optical axis, a beam deflection system for deflecting the electron beam such that the beam is displaced on the surface of the object, a stage for supporting the object, a mask provided in a vicinity of said first focusing system, and an addressing system for selectively deflecting the charged particle beam such that the charged particle beam is passed through a selected aperture on the mask. The addressing system includes an electrostatic deflector for variable shaping of the charged particle beam and an electromagnetic deflector for deflecting the charged particle beam such that the charged particle beam is selectively passed through a selected one of the plurality of apertures except for the predetermined aperture.
Metadata
Assignee
- Fujitsu Limited
Inventors
- Kiichi Sakamoto
- Hiroshi Yasuda
- Akio Yamada
Application Information
Application Number:US 5857775
Filing Date:1990-09-20
Priority Date:1989-10-31
Art Unit:216
Classifications
IPC:
B23K 1500
Field of Search:
219250121.25;121.26;121.19;121.20396 R;396 ML;492.2
Patent Drawings (15 sheets)
Description
Cross-Reference to Related Applications
The present invention is a continuation-in-part application of the U.S. patent application Ser. No. 429,500 filed by Sakamoto et al. on Oct. 31, 1989 entitled "CHARGED PARTICLE BEAMS LITHOGRAPHY SYSTEM AND A METHOD THEREOF".
Background of the Invention
The present invention generally relates to charged particle beam lithography and more particularly to a charged particle beam lithography system suitable for writing a semiconductor pattern on a semiconductor wafer and a method of writing such a pattern at a high speed.
With the continuous demand to increase the integration density of integrated circuits, new lithography technique such as electron beam lithography or X-ray lithography is now under intensive study. Some of them are already in use.
In the case of the electron beam lithography, an extremely fine patterning according to the micron- or submicron-rule is possible by using a focused electron beam having an extremely small beam spot which may have a diameter of one micron or less. Conventionally, a so-called Gaussian beam having a circular beam spot with the Gaussian distribution for the electron intensity in the beam or a so-called shaped beam having a shaped beam cross section, which may be rectangular or triangular for example, is used while moving a stage supporting a wafer continuously or stepwise. In any of these techniques, however, there is a limitation in the speed of patterning because of the essential nature of the electron beam lithography in which the pattern is written on the wafer by the electron beam in "one stroke".
In the electron beam lithography, there is a problem in that the number of shots is increased when an electron beam having a small beam diameter is used and as a result, there arises a problem that a long time is needed when exposing or filling a large area of the wafer. For example, one hundred shots are needed when exposing a square pattern having a size of 10 .mu.m.times.10 .mu.m by an electron beam having a square cross section with a beam size of 1 .mu.m.times.1 .mu.m. When the beam size is 0.5 .mu.m .times.0.5 .mu.m, on the other hand, four hundred shots becomes necessary. Associated therewith, the throughput of the patterning is further deteriorated.
In order to avoid the foregoing problem of excessive increase in the number of shots, a system shown in FIG. 1 is conventionally used in which an electron beam produced by an electron gun 1 is deflected by an electrostatic deflector 4 after passing through a shaping aperture 2 and an electromagnetic lens 3 such that the electron beam selectively falls on a designated pattern 6a provided on a stencil mask 5 in a form of aperture having a predetermined shape corresponding to the elementary pattern of the semiconductor device to be patterned. After passing through the mask 5, the electron beam now having a shape corresponding to the selected pattern 6a is focused on a wafer 7 by electron lenses 8 and 9. On the mask 5, there is further provided a rectangular or triangular aperture 6b and the cross section of the electron beam can be changed as desired by directing the electron beam to hit at least a part of the aperture 6b by controlling the electrostatic deflector 4. By controlling the deflector 4 such that only a small part of the electron beam is passed through the aperture 6b, the size of the electron beam is reduced. When the deflector 4 is controlled such that a large part of the electron beam is passed through the aperture 6b, the size of the electron beam is increased.
FIG. 2(A) shows a typical prior art mask 5 in more detail. The mask 5 generally comprises a silicon base body 5a on which a plurality of regions 6 are defined, wherein the predetermined patterns such as patterns 6a.sub.-1 -6a.sub.-3 are formed in the region 6 in a form of the aperture as is clearly seen from the cross sectional view of FIG. 2(B). Note that the regions 6 are defined within an area 5b of the mask which can be addressed by the deflection of the electron beam B. Further, there is provided a single large cutout corresponding to the aperture 6b in one of the regions 6 as shown in FIG. 2(A) for variable shaping of the electron beam B.
After the foregoing shaping of the electron beams, the beam B having a desired cross section is moved over the wafer 7 by a deflection system (not shown) provided above the wafer 7 and a semiconductor pattern 7a comprising a repetition of patterns such as the pattern 6a.sub.-3 and the like is written as a result of the movement of the beam B relative to the wafer 7 as shown in FIG. 2(C). In FIG. 2(C), a marginal area written on the wafer 7 is represented as an area 7b.
Such electron beam lithography using the mask is effective in patterning a semiconductor device particularly when the device comprises a repetition of a limited number of fundamental or elementary patterns such as dynamic random access memory (DRAM). Thus, there are proposed a number of variations based on this technique as described in the Japanese Laid-open Patent Application No. 52-119185 in which the fundamental patterns are arranged on the mask in a row and column formation or as in the Japanese Laid-open Patent Application No. 62-260322 in which the designed patterns and the aperture for the variable shaping of the electron beam are provided on a diaphragm.
In the foregoing electron beam lithography system, it should be noted that the electrostatic deflector 4 is used to deflect the electron beam. As the electrostatic deflector has a response time of about 0.1-1 usec, the system can change the size and shape of the spot of the electron beam quickly between one shot and a next shot. However, the electrostatic deflector cannot produce a large beam deflection because of the practical limitation in the voltage applicable across a pair of electrodes forming the deflector. When an excessive voltage is applied to the electrostatic deflector, there is a substantial risk that an electrical discharge is established between the electrodes and the control of the electron beam is lost. Thus, the deflection angle which can be obtained by the electrostatic deflector is limited and associated therewith, there is a problem in that the number of patterns which can be selected on the mask is limited.
Further, the prior art system of FIG. 1 has a problem in that the electron lens 8 has a spherical abberation and an image formed on the wafer 7 in correspondence to the spot of the electron beam passed through the designed pattern tends to be blurred when the selected pattern is located at a marginal area far from the optical axis of the electron lens 8.
Furthermore, there is another problem in the prior art system in that the image focused on the wafer 7 by the electron beam is undesirably demagnified. Referring to FIG. 3 showing a part around the lens 8 in an enlarged scale, the electron beam incident to the lens 8, which may comprise a first lens 8a and a second lens 8b as shown in the drawing, obliquely along a first path A (referred to as a beam A) is spread relative to the electron beam incident perpendicularly to the lens 8 along a second path B passing straight through the center of the lens (referred to as a beam B). As a result, a relatively large proportion of the electron beam A is stopped by the designed pattern 6a as compared to the beam B, which is interrupted by the pattern 6b, even when the size of the aperture is identical in the pattern 6a and the pattern 6b. When the electron beams thus shaped by the mask 5 is focused by the second lens 8b at a crossover point C, the angular aperture for the electron beam A becomes smaller than the that of the electron beam B and the image of the pattern focused on the wafer 7 by the beam A is undesirably compressed or demagnified.
Summary of the Invention
Accordingly, it is a general object of the present invention to provide a novel and useful charged particle beam lithography system wherein the problems aforementioned are eliminated.
Another and more specific object of the present invention is to provide a charged particle beam lithography system wherein a large variety of patterns are provided on a mask and a desired pattern is selectively used by deflecting a charged particle beam a large deflection angle.
Another object of the present invention is to provide a charged particle beam lithography system, wherein a variable shaping of the beam can be performed instantaneously between sucessive shots.
Another object of the present invention is to provide a charged particle beam lithography system wherein blurring of a focused pattern caused by the spherical abberation of an electromagnetic lens is eliminated.
Another object of the present invention is to provide a charged particle beam lithography system wherein undesirable demagnification of a focused pattern on a semiconductor wafer is eliminated.
Another object of the present invention is to provide a charged particle beam lithography system wherein large deflections of a charged particle beam for addressing various patterns on a mask are produced by an electromagnetic deflector while a small deflection for variable shaping of the beam are produced by an electrostatic deflector.
Another object of the present invention is to provide a charged particle beam lithography system wherein variable shaping of the beam is achieved by passing the beam through a variety of the patterns on a mask. According to the present invention, a large number of patterns on the mask can be employed for variably shaping the beam and a desired beam pattern can be produced easily and efficiently.
Another object of the present invention is to provide a charged particle beam lithography system for exposing an semiconductor wafer by selectively passing a charged particle through a plurality of apertures provided on a mask. The system comprises electrostatic deflection means and at least one electromagnetic deflection means for shaping the charged particle beam. The electromagnetic deflection means deflects the charged particle beam such that the beam is passed through a selected one of the apertures of the mask so as to cause the cross section of the charged particle beam to have a predetermined shape and the electrostatic deflection means deflects the charged particle beam such that the beam is passed through a particular aperture on the mask for providing the beam with variably shaped cross section. According to the present invention, a number of predetermined patterns can be selected by deflecting the charged particle beam through larges angles by using the electromagnetic deflection means and the efficiency of the patterning process is improved. Further, the shape of the charged particle beam can be changed instantaneously by using the electrostatic deflector and the efficiency of the patterning is improved also in this case.
Another object of the present invention is to provide a charged particle beam lithography system for exposing an semiconductor wafer by selectively passing a charged particle beam through one or another of a plurality of apertures provided on a mask which in turn is provided inside an electromagnetic lens system. The system includes a first deflector means for deflecting the charged particle beam proceeding along an optical axis away from the optical axis, second deflector means for deflecting the charged particle beam deflected by the first deflector means such that the beam passes through the selected aperture in a direction substantially perpendicular to the mask, third deflector means for deflecting the charged particle beam which has passed through the mask back toward the optical axis and fourth deflector means for deflecting the charged particle beam deflected by the third deflector means such that the electron beam again travels along the optical axis. ,According to the present invention, spherical aberrations of the electron magnetic lens systems are eliminated by displacing a charged particle beam away from the optical axis while maintaining a parallel relationship between the path of the beam and the optical axis after the beam has entered into the lens system and by returning the beam to the optical axis before the charged particle beam has exited from the lens system. Further, the problem of undesirable demagnification of the image associated with the oblique incidence of the charged particle beam into the electromagnetic lens system is successfully eliminated as the charged particle beam entering and exits from the electromagnetic lens system along a path which substantially coincides with the optical axis.
Another object of the present invention is to provide a method of writing a semiconductor pattern on a semiconductor wafer using a charged particle beam which has been passed selectively through one of a plurality of apertures provided on a mask provided in an electron lens system. The method includes the steps of deflecting a charged system, particle beam proceeding along an optical axis selectively to one of said apertures by energizing first deflection means, deflecting the charged particle beam deflected by the first deflector means by energizing second deflection means such that the beam passes through the selected aperture in a direction substantially perpendicular to the mask, energizing third deflection means to deflect the charged particle beam which has passed through the mask back toward the optical axis, and deflecting the charged particle beam deflected by the third deflector means by energizing fourth deflection means such that beam again proceeds along the optical axis, wherein said third and fourth deflection means are respectively energized as linear functions of a parameter .theta..sub.p.sup.s representing the lateral offset of the charged particle beam passing through the selected aperture on the mask and another parameter .theta..sup.b representing the angular offset of the foregoing charged particle beam passing through the mask in accordance with the equations
wherein x stands for the electric energization of the third deflection means, y stands for the electric energization of the fourth deflection means and .pi. and .beta. are constants. According to the present invention, the adjustment of the charged particle beam for beam alignment is performed easily since the lateral offset and the angular offset of the charged particle beam can be performed independently. It is to be noted that when the parameters x and y are changed independently, in other words when the third and fourth deflection means are energized independently, the lateral offset and the angular offset of the charged particle beam passing through the mask are changed simultaneously and proper alignment of the beam becomes extremely difficult.
Other objects and further features of the present invention will become apparent from the following detailed description when read in conjunction with attached drawings.
Brief Description of the Drawings
FIG. 1 is a schematical view showing a prior art electron beam lithography system;
FIGS. 2(A) and (B) are diagrams showing a prior art mask used in the system of FIG. 1;
FIG. 2(C) is a diagram showing an example of the patterns written on a wafer in the system of FIG. 1;
FIG. 3 is an enlarged view showing a part of the system of FIG. 1;
FIG. 4 is a diagram showing an overall construction of the electron beam lithography system according to an embodiment of the present invention;
FIG. 5 is a diagram showing a region of a mask used in the system of FIG. 4 which can be addressed by the electron beam;
FIG. 6 is a diagram showing an actual construction of the mask used in the system of FIG. 4;
FIG. 7 is an enlarged view showing a part of the system of FIG. 4;
FIG. 8 is a diagram showing a second embodiment of the electron beam lithography system according to the present invention;
FIG. 9 is a diagram showing a modification of the system of FIG. 8;
FIG. 10 is a functional block diagram showing the operation of a third embodiment;
FIG. 11 is a flowchart corresponding to the functional block diagram of FIG. 10;
FIGS. 12A-12D are diagrams showing the variable shaping achieved by the third embodiment of the invention;
FIG. 13 is a diagram showing a part of the system of FIG. 8 in an enlarged scale;
FIG. 14 is a flowchart for explaining the beam alignment in the system of FIG. 8;
FIGS. 15(A) and (B) are diagrams showing the independent correction for lateral offset and angular offset of the electron beam according to the present invention; and
FIG. 16 is a diagram showing a state in which the alignment of the electron beam is completed.
Detailed Description
FIG. 4 shows the overall construction of an electron beam lithography system according to an embodiment of the present invention.
Referring to FIG. 4, an electron beam B produced by an electron gun 10, after adjustment by an electron beam adjusting system 11, is shaped by passing through an aperture 12 and is focused at a crossover point 14x by an electron lens 14. The beam B is then enters to an electron lens 16 to be described and is focused at a second crossover point 16x. In the vicinity of the lens 16, a mask 34 to be described is provided and the electron beam is shaped by passing through the aperture 12 and the mask 34. Further, the electron beam is passed through demagnification lenses 20 and 22, and after passing through a round aperture 23, is converged by an objective lens system 24 such that a pattern carried on the mask 34 is formed on a semiconductor wafer 26 which in turn is held by a stage 28. The lens system 24 further includes an electromagnetic main deflector 24a and an electrostatic sub-deflector 24b for deflecting the electron beam on the wafer 26 so that the electron beam is moved over the surface of the wafer 26 to a desired position.
The system of the present invention further comprises the foregoing stencil mask 34 carrying a plurality of apertures in the vicinity of or within the lens 16, and an electrostatic deflector 30 as well as an electromagnetic deflector 32 are further provided above the mask 34 for deflecting the electron beam B to a desired position on the mask 34. As illustrated in FIG. 3, the deflector 30 and the deflector 32 are provided between the electron lens 14 and the electron lens 16.
FIG. 5 shows the general construction of the mask 34. On the mask 34, there is defined an area 71 which can be addressed by the electron beam B and a number of regions 72 are defined on the area 71 in correspondence to the region 6 of the prior art mask of FIG. 2(A). As the electromagnetic deflector 32 is used for addressing the regions 72 on the mask 34, the area 71 can be set substantially larger than the area 5b of the prior art mask 5 and a large variety of patterns such as a pattern 73a or 73b can be provided on the mask 34 without difficulty. In one example, the area 71 may have a size of 2-5 mm. In correspondence thereto, a range of deflection of about .+-.2.5 .mu.m is needed for the electron beam. By using the electromagnetic deflector 32, such an area is easily covered.
FIG. 6 shows an actual construction of the mask 34. Referring to FIG. 6, a number of the patterns 73 typically having a size of about 300-500 .mu.m for each edge are arranged in the area 71 in a row and column formation except in the vicinity of a rectangular cutout 75 which is provided at a generally central part of the mask 34 close to the optical axis L for the variable shaping of the electron beam. As the variable beam shaping is performed by shifting or offsetting the electron beam B relative to the cutout 75, the pattern 73 should be positioned away from the vicinity of the cutout so as to avoid the leakage of the shifted electron beam B through a neighbouring pattern 73. Note that a reference marker 79 is provided at a suitable place on the mask 34 for mask alignment.
Using the mask of FIG. 6, a large variety of patterns 73 can be provided on the mask 34. Thus, one can perform the patterning efficiently by selecting one of the patterns 73 and writing the selected pattern in one shot. Note that a shot for such a predetermined pattern would take a long time if the pattern to be written using a plurality of shots of a finely focused electron beam having a submicron size, for example. This means that the use of an electromagnetic deflector 32, having a large response time which may be about 0.1-1 msec, does not creates inconveniences such as a decrease of efficiency in the patterning process. On the other hand, the variable shaped beam is used to write an irregular pattern by changing the size and shape of the beam in each shot. This means that the desired pattern must be written using a plurality of shots while the size and shape of the beam in each shot is changed. Thus the variable shaping of the beam must be accomplished instantaneously. For this purpose, the present invention uses an electrostatic deflector 30 having a fast response time which may be about 0.1-1 usec in combination with the cooperating cutout 75 provided in a vicinity of the optical axis.
FIG. 7 shows the foregoing selection of the pattern 73 and the cutout 75 in the system of FIG. 4. Referring to the drawing showing a part of the system of FIG. 4 on an enlarged scale, the electron beam B passing along an optical axis L is deflected by the electromagnetic deflector 32 as illustrated by a continuous line or a broken line. After the deflection, the electron beam is returned to the path extending along the optical axis L by the focusing action of the electron lens 16 which focuses the electron beam to the crossover point 16x located on the optical axis L. The electron beam B thus passed through the lens 16 is then passed through the mask 34 at a selected aperture on the mask as already described before passing through the crossover point 16x. After passing through the crossover point 16x the electron beam is demagnified by the lenses 22 and 20 and is focused on a surface of the wafer 26 by the objective lens 24. The electron beam is further moved over the surface of the wafer 26 by the main and sub-deflectors 24a and 24b.
The operation of the system of FIG. 4 is as follows.
The electron beam lithography system of the present embodiment uses a control system which comprises a central processing unit (CPU) 40 and a large capacity storage means such as a magnetic storage disk 42 or a magnetic storage disk 44 in which a control program and the like for controlling the system are stored. When a shot using a variable shaped beam is selected by the program, the CPU 40 sends a command to a pattern controller 50 via an interface 46 and a data memory 48, and the pattern controller 50 produces control data specifying the deflection angle of the electron beam B in correspondence to the desired beam size and shape. This control data is then applied to the electrostatic deflector 30 in the form of a control voltage after digital-to-analog conversion in a D/A converter 51. The D/A converter 51 produces a control voltage corresponding to the desired angle of deflection and the electron beam B is moved over the mask 34 of FIG. 6 such that only the desired portion of the electron beam is passed through the cutout 75. As already noted, the response of the electrostatic deflector is instantaneous and a series of continuous shots can be achieved at a high speed while the size and shape of the beam is changed for shot.
On the otherhand, when a shot by an electron beam shaped according to one of the predetermined patterns 73 is selected by the program, the CPU 40 sends a command to the pattern controller 50 via the interface 46 and the data memory 48 similarly to the foregoing case, whereby the pattern controller 50 produces control data specifying a deflection angle of the electron beam for addressing the selected pattern 73 and the control data is converted into a control current to be supplied to the electromagnetic deflector 32 by a D/A converter 52. Responsive to the control current, the electron beam B is deflected by the foregoing specified angle and the electron beam moves over the mask 34 to the selected pattern 73. As a result of the use of the electromagnetic deflector 32, the angle of deflection of the electron beam B can be set large and a large number of patterns 73 can be provided on the mask 34.
The pattern controller further supplies control data to a blanking controller 54 responsive to a command by the CPU 40 when the exposure is to be interrogated. Responsive to the control data, the blanking controller 54 produces blank control data and the blank control data is supplied to another electrostatic deflector 36 after a digital-to-analog conversion in a D/A converter 55. Responsive thereto, the electron beam is shifted from the optical path L passing through the pinhole 23 and the electron beam disappears from the surface of the wafer 26.
Further, the electron beam is moved over the surface of the wafer 26 responsive to the command signal from the CPU 40 which is supplied to a sequential controller 56 via the interface 46. Thus, the sequential controller 56 produces data specifying the position of the electron beam on the wafer 26 and the data is supplied to a deflection controller 57. The deflection controller 57 in turn produces a first set of deflection control data representing the angle of deflection of the electron beam to be achieved by the main deflector 24a and a set of second deflection control data representing the angle of deflection of the beam to be achieved by the sub-deflector 24b. The first deflection control data set is then converted to a deflection control current by a D/A converter 58 and is supplied to the main deflector 24a. Similarly, the second deflection control data set is converted to a deflection control voltage by a D/A converter 59 and is applied to the sub-deflector 24b.
Further, the sequential controller 56 supplies stage control data specifying a desired position of the stage 28 to a stage controller 61 responsive to the command from the CPU 40, and the stage controller changes the position of the stage according to the stage control data supplied thereto. Further, the position of the stage 28 is monitored by a laser interferometer 60 and the deflection angle of the electron beam on the wafer 26 is adjusted according to the result of the positional measurement of the stage 28 by the laser interferometer 60.
A second embodiment of the present invention is illustrated in FIG. 8 where the parts corresponding to those parts already described with reference to the preceding drawings are given identical reference numerals and the description thereof will be omitted.
Referring to FIG. 8, the electron lens 16 used in this embodiment comprises an upper lens 16a located at a side of the mask 34 closer to the electron gun 10 and a lower lens 16c located at the other side of the mask 34 closer to the stage 26. Thus, the electron lens 16 of this embodiment forms a lens system. Further, the embodiments of FIG. 8 uses four electromagnetic deflectors 32a-32d provided between the electron lens 16a and the electron lens 16c in place of the electromagnetic deflector 32.degree.. Two of the deflectors (32a and 32b) are disposed above the mask 34 and the remaining two deflectors (32c and 32d) are disposed below the mask. The electromagnetic deflectors 32a-32d are energized by control currents S.sub.1 -S.sub.4 supplied from the pattern controller 50. In FIG. 8, the D/A converter 52 is omitted for the sake of simplicity. Typically a current of about .+-.2-3 amperes is supplied as the control currents S.sub.1 -S.sub.4 while applying a voltage of about .+-. 30 volts to the electrostatic deflector 30.
Responsive to the control current S.sub.1 produced by the pattern controller 50 under the control of the CPU 40, the electromagnetic deflector 32a produces a magnetic field + A as shown in the drawing. On the other hand, the electromagnetic deflector 32b located between the electromagnetic deflector 32a and the mask 34 produces a magnetic field - A having a same magnitude but an opposite direction as also illustrated in the drawing. Further, the electromagnetic deflector 32c located below the mask 34 is supplied with the control current S.sub.3 from the pattern controller 50 and produces a magnetic field - A which is identical to the magnetic field produced by the electromagnetic deflector 32b. Further, the electromagnetic deflector 32d produces a magnetic field + A which is identical to the magnetic field produced by the electromagnetic deflector 32a.
When the electron beam B traveling along the optical axis L is passed through the upper electron lens 16a, the electron beam is deflected away from the optical axis L by the action of the magnetic field + A of the electromagnetic deflector 32a. The electron beam thus deflected is then deflected again by the magnetic field - A of the electromagnetic deflector 32b acting in the opposite direction with an equal strength and the electron beam assumes a path extending parallel to the optical axis L but offset therefrom. Thus, the electron beam B passes through the mask 34 perpendicularly. After passing through the mask 34, the electron beam is again deflected by the magnetic field - A produced by the electromagnetic deflector 32c toward the optical axis L through the same deflection angle as that when the beam is deflected by the electromagnetic deflector 32b. Upon returning to the optical axis L, the electron beam B is further deflected by the magnetic field + A produced by the electromagnetic deflector 32d through a deflection angle which is the same as that when the beam is deflected by the electromagnetic deflector 32a. As a result, the electron beam B is aligned with the optical axis L and passes through the lower electron lens 16c along the optical axis L. In other words, the electron beam B enters to and exits from the lens system 16 substantially along the optical axis L even when the electron beam B is deflected for selectively addressing a desired pattern on the mask 34.
As a result, the problem of spherical abberation is entirely eliminated. Further, the problem of unwanted demagnification of the image on the wafer 26 associated with the oblique incidence of the electron beam to the lens system 16 is entirely eliminated. Further, as a result of use of the electromagnetic deflectors, a large deflection angle is achieved and a wide variety of patterns on the mask 34 can be addressed by the electron beam B as desired similarly to the foregoing embodiment.
It is advantageous if the control currents S2 -S4 are determined uniquely by the control current S1 in the controller 50 as the control currents S2-S4 are in principle dependent on the control current S1. By calibrating the actual deflection angle of the deflectors 32a-32d in advance, automatic determination of the control currents S2-S4 by the control current S1 becomes possible. By doing so, the load of the controller 50 can be reduced and the efficiency of the patterning process is improved.
When deflecting the electron beam B by the electrostatic deflector 30 (FIG. 4) for the variable shaping of the beam, the deflection angle is generally small. Thus, the construction of the deflector 30 for achieving the entering and exiting of the electron beam B in coincidence with the optical axis L is not absolutely necessary. However, a similar deflector arrangement for realizing this can be easily constructed from FIG. 8 as shown in FIG. 9. Referring to FIG. 9 which shows a modification of the system of FIG. 8, four electrostatic deflectors 30a-30d are provided in place of the electrostatic deflector 30 of FIG. 4. Two of these detectors (30a and 30b) are located above the mask 34 and two of them (30c and 30d) are located below the mask 34. Each of the electrostatic deflectors 30a-30d is supplied with one of control voltages V.sub.1 -V.sub.4 from the pattern controller 50 under the control of the CPU 40 and the deflectors deflect the electron beam B similarly to the case of FIG. 8. For this purpose, the pattern controller 50 controls the voltages V.sub.1 -V.sub.4 such that an electric fields having a same magnitude A but directions are established across pairs of electrodes forming the deflectors. Thus, an electric field + A is formed by the electrostatic deflector 30a responsive to the control voltage V.sub.1, an electric field - A is formed by the electrostatic deflector 30b responsive to the control voltage V.sub.2, an electric field - A is formed by the electrostatic deflector 30c responsive to the control voltage V.sub.3 and an electric field + A is formed by the electrostatic deflector 30d responsive to the control voltage V.sub.4. Other operational principles are obvious from the foregoing description for the system of FIG. 8 and further description of this system will be omitted. Typically, a voltage of about .+-.200-250 V is applied for a deflection angle of .+-.1-1.5 mm. According to this modification, a very quick deflection of the electron beam is possible. Although the angle of deflection achieved by this system is smaller than that obtained by the system of FIG. 8, the system is effective when used in the case where a small deflection is needed with a very quick response.
In the embodiment of FIG. 8 or FIG. 9, a doublet lens system is used for the electron lenses 16a and 16b in order to correct the rotation of the image. Such a rotation of the image is caused by the mask provided in the optical path of the electron beam. Conventionally, the rotation of the image has been corrected by rotating the mask. However, the rotation of the mask 43 in the system of the present invention is not preferable as such a rotation of the mask 34 causes a displacement of the patterns on the mask. The correction for the rotation of the image itself can be performed by a singlet electromagnetic lens. However, if such a singlet lens is used, the intensity of the magnetic field is also changed responsive to the rotation correction and the parallelism of the electron beam is lost or degraded.
In the present system, the electron lens 16a is formed as a doublet lens system comprising a first lens coil 16a.sub.1 driven by a first power source 161 and a second lens coil 16a.sub.2 driven by a second power source 162 as shown in FIG. 8 so as to correct the rotation of the electron beam on the mask 34. For example, if the overall number of turns of the coils in the doublet lens system is one thousand, the first coil 6a.sub.1 may be turned for five hundred times and the second coil 16a.sub.2 may be turned also for five hundred times and a current I is supplied to each of the coils with mutually opposing directions. When the current I is supplied as such, the strength of the magnetic field, being proportional to I.sup.2, is not affected by the direction of the current flowing through each of the coils but the angle of rotation of the image does change as it is proportional to I. Thus, by changing the ratio of the current I flowing through the first coil and second coil while maintaining the square of the overall current level at I.sup.2, one can control the rotation of the image as desired. Thus, the rotation of the beam on the mask 34 can be easily corrected by adjusting the driving current supplied to each of the coils forming the doublet lens 16a. Similarly, the lower electron lens 16c is constructed as a doublet lens system comprising a first lens coil 16a.sub.3 and a second lens coil 16a.sub.4 driven by power sources 163 and 164 so as to correct the rotation of the image focused on the wafer 26. Note that the correction of rotation of the beam by any lens coil provided below the lens 16c without using the doublet construction for the lens 16c is unrealistic as such a correction, performed each time the mask is replaced, inevitably invites change of strength of the magnetic field.
According to the description for the foregoing embodiments, it will be apparent that the deflection of the beam for small angles such as the case of variable shaping of the beam or small shifts of the beam is made by electrostatic deflectors having a quick response while the deflection of the beam for large angles is made by electromagnetic deflectors.
A third embodiment of the present invention will be described with reference to FIGS. 11, 12 and 13A-13D.
In the foregoing first and second embodiments of the present invention, the throughput of the exposure process is significantly improved by selectively addressing the patterns 37 on the stencil mask 34 by the electron beam as already described. On the other hand, it is not practical to provide all of the patterns 73 used for exposure on one stencil mask 34, as the number of such patterns 73 is numerous while the area that the electron beam can scan is still limited even when electromagnetic deflectors are used. In other words, an excessively large stencil mask 34 must be used for this purpose and the electron beam cannot scan such an excessively large area even when the beam is deflected by electromagnetic deflectors. One solution to this problem would be to move the stencil mask 34. However, such a movement of the stencil mask must be made with extreme precision, and because of this, there may be a decrease in the throughput, contrary to the effort to achieve the increased throughput.
In the present third embodiment, a plurality of different patterns are exposed by using a single pattern 73 such that an effect similar to the case where the number of the patterns is increased is obtained. More specifically, in the present invention, the patterns 73 are used as the cutout for variable shaping the beam. In a typical example, one of the patterns 73 is selected in correspondence to the desired beam spot pattern, and the deviation in the size and shape of the beam spot from those of the desired beam spot pattern is corrected by correcting the beam deflection on the basis of the positional data of the designated pattern 73. For example, in a case where the designated pattern 73 has a rectangular shape with the size of 3 .mu.m.times.4 .mu.m while the desired pattern is a rectangular shape having the size of 3 .mu.m.times.2 .mu.m, correction data H representing the difference in the shape and size is outputted from the pattern controller 50. In response to the data H, the deflector 30 modifies the deflection of the electron beam, and the electron beam is shaped by the designated pattern 73 upon passage therethrough. The pattern controller 50, of course, produces the deflection control signals S1-S4 of FIG. 8 or V1-V4 of FIG. 9 for addressing the pattern 73 in combination with the deflection by the deflector 30. Thereby, the original electron beam having the size of 3 .mu.m.times.4 .mu.m is shaped by the selected pattern 73 into a beam having the size of 3 .mu.m.times.2 .mu.m. In order to provide information of the patterns 73 provided on the stencil mask 34, the data memory 48 is used to store the size and shape of the patterns 73 formed on the mask 34.
FIG. 10 is a diagram showing the operation of the present embodiment. The foregoing operation for shaping the electron beam by using the pattern 73 includes the step of selecting the designated pattern on the basis of the desired pattern, calculating the correction data H by comparing the designated pattern 73 and the desired pattern, and controlling the electron beam on the basis of the data H. In the present embodiment, all the operations are performed in the pattern controller 50. FIG. 10 shows schematically the operation performed in the controller 50 in the form of functional blocks.
Referring to FIG. 10, the desired pattern data "DATA" which is the data to be written on the substrate, is given by the CPU 40 via the interface 46 and the data memory 48. In response to the data DATA, the pattern controller 50 reads out, in a data selection block 50.sub.1, the information about the patterns 73 formed on the stencil mask 34 from the data memory 48. Further, the controller 50 selects, in the functional block 50.sub.1, one of the patterns 73 based on the DATA and controls the data memory 48 to supply information about the size and shape of the selected pattern 73 to an arithmetic block 50.sub.2. In the block 50.sub.2, the DATA is compared with the selected pattern 73 and the aforesaid correction data H is produced in response thereto. This data H is then sent to an output block 50.sub.3. In the output block 50.sub.3, the DATA addressing the selected pattern 73 is supplied from the data memory 48 under the control of the data selection block, and the corrected data to be supplied to the deflector 30 for deflecting the beams is produced. It should be noted that the addressing of the patterns 73 on the stencil mask 34 itself is made by the control signals S1-S4 or V.sub.1 -V.sub.4, similarly to the case of FIGS. 8 and 9 without incorporating the correction.
FIG. 11 shows the operation of FIG. 10 performed by the pattern controller 50 in the form of flowchart.
Referring to FIG. 11, in step 10, the DATA is given to the pattern controller 50 from the CPU 40. In a step 11, the controller 50 reads the patterns 73 formed on the stencil mask 34 from the data memory 48. Further, in step 12, one of the patterns on the stencil mask 73 is selected on the basis of the DATA.
In a step 13, the DATA is compared with the selected pattern with respect to the size and shape, and the correction data H is calculated. In step 14, the deflection control signal to be supplied to the deflector 30 is produced such that the correction by the data H is incorporated therein. In step 15, the deflection of the electron beam by the deflector 30 is corrected.
FIGS. 12A-12D show various examples of variable shaping of the electron beam using the patterns 73 on the stencil mask 34.
In the case of FIG. 12A, the selected, or addressed pattern 73 has a rectangular shape and is used to form a smaller shaped beam also having a rectangular cross section. Thereby, the beam position is shifted on the mask 34 by the vector H that corresponds to the data H calculated in the step 13 of FIG. 11. As the beam is shifted in the downward direction in the FIG. 12A, the beam spot becomes smaller.
In the case of FIG. 12B, the selected pattern 73 has a trapezoidal shape and is used to produce a shaped electron beam having a small triangular cross section from an incident electron beam having a square cross section. By shifting the electron beam along the vector H, the size of the beam is decreased.
FIG. 12C shows a case for producing an electron beam of triangular cross section with relatively large size from the trapezoidal pattern 73 according to another setting of the vector H. Further, FIG. 12D shows a case for producing an electron beam of parallelogram cross section from an incident electron beam having a rectangular cross section.
In any of FIGS. 12A-12D, it should be noted that the vector H is a two dimensional vector defined in the plane which is parallel to the plate of the substrate 26 on the stage 28. It is obvious that the size and the shape of the electron beams can be changed variously by using other settings of the vector H.
In deflecting the electron beam, it is of course possible to incorporate the correction into the deflection control signals S1-S4 or V.sub.1 -V.sub.4 of FIGS. 8 and 9 by driving the deflectors 32a-32d.
According to the present invention, the number of cutouts used for variable shaping of the electron beam is increased and a further improvement in the efficiency at the time of exposure of the semiconductor wafer is achieved.
A fourth embodiment of the present invention for controlling the electron beam in the system of FIG. 8 or FIG. 9 will be described with reference to FIG. 13. In the drawing, those parts already described with reference to the preceding drawings are given identical reference numerals and the description thereof will be omitted.
In the system of FIG. 8 or FIG. 9, it is necessary to adjust the electron beam such that the electron beam on the optical axis L is deflected and passed through a selected pattern on the mask 34 perpendicularly to the mask 34 and is returned to the optical axis L again responsive to the data specifying the selected pattern. For this purpose, a beam alignment process for adjusting the path of the electron beam is needed as the actual electron beam lithography system deviates more or less from the ideal system.
Referring to FIG. 13 showing a typical situation, the electron beam is incident somewhat obliquely to the mask 34 and as a result of the deflection by the electromagnetic deflectors 32c and 32d, the beam which exists from the lower electron lens 16b is offset from the optical axis L. As a result of such an offset, the electron beam B is focused on the wafer 26 at a position which is deviated from the desired position or is prevented from arriving at the wafer 26 through the round aperture 23. The present invention provides a method of adjusting the path of the electron beam B by factoring the offset of, the electron beam into an angular offset component .phi. representing the deviation of the beam direction from vertical and a lateral offset component .delta. representing a the lateral deviation of the beam from the properly aligned beam path, and further by manipulating these offset components .phi. and .delta. independently. Note that when such adjustment is attempted by energizing the electromagnetic deflectors 32c and 32d independently, the individual offset components are changed simultaneously and the proper adjustment of the electron beam path becomes extremely difficult. This means that it takes a long time for achieving the beam alignment and the cost of the semiconductor device manufactured using the electron beam lithography technique is increased.
FIG. 14 shows a flowchart for the beam alignment process according to the present embodiment. Referring to the drawing, the electron gun 10 is turned on in step 1 and the electron beam B is formed. In step 2, electrical energizations X.sub.1 -X.sub.4 which may be the control currents S.sub.1 -S.sub.4 to the electromagnetic deflector 32a-32d are deenergized. In other words, the electron beam B is passed straight through the electromagnetic deflectors without deflection. Step 2 may be performed simultaneously or prior to step 1. Next, the beam adjusting system 11 shown in FIG. 4 is adjusted in step 3 until the electron beam B is passed through the pinhole 23.
Next, in step 4, the electric energizations X.sub.1 -X.sub.4 are set respectively to -.theta..sub.1.sup.2 and +.theta..sub.1.sup.s such that the electromagnetic deflectors 32a-32d produce the magnetic fields + A, - A, - A and + A as already described. As a result of the energization in step 4, the electron beam is deflected as already described with reference to FIG. 8. If the alignment is ideal, the electron beam passes through an ideal path as shown in FIG. 13 by a broken line and no further adjustment is necessary.
In step 5, it is determined whether the electron beam thus deflected passes through the foregoing pinhole 23 or not. If the result is YES, the beam alignment process is completed and the process is stopped at step 6. On the other hand, if the result is NO, a parameter .theta..sub.p.sup.s for the adjustment of the lateral offset .delta. and a parameter .theta..sup.b for the adjustment of the angular offset .phi. are changed in a step 7. Further, in step 8, the electric energization X.sub.3 and the electric energization X4 for the electromagnetic deflectors 32c and 32d are produced in the pattern controller 50 according to the equations:
where .alpha. and .beta. are constants.
After step 8, the discrimination in step 5 is performed again and steps 5, 7 and 8 are repeated with a different combination of electric energizations .theta..sub.p.sup.s and .theta..sup.b until the electron beam B passes pinhole 23.
FIG. 15(A) shows the adjustment of the lateral offset .delta. of the electron beam B responsive to the change of the electric energization .theta..sub.p.sup.s and FIG. 15(B) shows the adjustment of the angular offset .phi. of the electron beam B responsive to the change of the electric energization .theta..sup.b. By changing the electric energizations X.sub.3 and X.sub.4 according to the foregoing linear combination, the adjustment for the lateral offset component .delta. in FIG. 15(A) and the adjustment of the angular offset component .phi. performed in FIG. 15(B) can be independently and the process for alignment of the electron beam becomes significantly easier. Note that FIG. 15(B) shows a relation between the parameter .alpha. and the parameter .beta.. From an elementary geometry, it will be understood that there holds a relation
where the parameters are as specified in the drawing.
Further, there holds a relation
where a is a position of the electromagnetic deflector 32c measured from the mask 34 and b is a position of the electromagnetic deflector 32d measured from the mask 34. From Eqs. (1) and (2), it is easily derived that there holds a relation .alpha./.alpha.=-b/a.
FIG. 16 shows a situation in which the beam alignment is achieved properly. Note that the electric energization X.sub.3 is increased by -.theta..sub.p.sup.s +.alpha...theta..sup.b relative to the initial value of -.theta..sub.1.sup.s and the electric energization X.sub.4 by +.theta..sub.p.sup.s +.beta..multidot..theta..sup.b.
Responsive thereto, deflection angles .theta..sub.3 and .theta..sub.4 are changed and the electron beam B returns exactly on the optical axis L.
It should be noted that the foregoing adjustment is not limited to the electromagnetic deflectors 32c and 32d but is also applicable to the electromagnetic deflectors 32a and 32b. As the adjustment of the beam path using the deflectors 32a and 32b is obvious from the foregoing description, the description for this case will be omitted.
Note that the charged particle beam is not limited to the electron beam but other charged particle beams such as proton beam or ionic beam may be used.
Further, the present invention is not limited to systems for writing a pattern on a semiconductor substrate but is also applicable to systems for writing a pattern on a reticle 26' by placing it in the place of the semiconductor wafer 26 as shown in FIG. 1.
Further, the present invention is not limited to these embodiments described heretofore but various variations and modifications may be made without departing from the scope of the invention.
Claims
What is claimed is:
1. A charged particle beam lithography system for drawing a pattern on an object using a charged particle beam, comprising: beam source means for producing and directing a charged particle beam such that the beam travels along a predetermined optical axis toward the object; beam shaping means provided along the path of the traveling charged particles beam for providing a predetermined cross section to said charged particle beam; first focusing means provided between the beam shaping means and the object for focusing the charged particle beam supplied from the beam shaping means on a first crossover point located on the optical axis; second focusing means provided between the first crossover point and the object for focusing the charged particle beam previously focused on the first crossover point on a second crossover point located on the optical axis; beam deflection means for deflecting the charged particle beam focused by the second focusing means such that the beam is displaced on the object; stage means for supporting the object; mask means provided in a vicinity of said first focusing means so as to extend substantially perpendicularly to the optical axis for interrupting the charged particle beam, said mask means defining a plurality of apertures for providing a predetermined shape to the charged particle beam when the charged particle beam is passed therethrough; addressing means for selectively deflecting the charged particle beam such that the charged particle beam is passed through a selected one of the apertures in the mask means, said addressing means comprising an electrostatic deflector for deflecting the charged particle beam such that the charged particle beam is passed through a predetermined aperture in the mask means for variable shaping of the charged particle beam, and at least one electromagnetic deflector for deflecting the charged particle beam through an angle larger than that caused by the electrostatic deflector such that the charged particle beam is selectively passed through said selected one of the apertures; memory means for storing data about size and shape of each of the plurality of apertures formed on the mask means; and pattern control means for controlling the beam deflection means such that the charged particle beam passed through the selected aperture on the mask means has a variable cross section corresponding to the pattern to be drawn on the object, said pattern control means comprising selection means for selecting one of the plurality of apertures on the mask means in correspondence to the pattern to be drawn on the object and comparison means for comparing the size and shape of the aperture selected by the selection means with size and shape of the pattern to be drawn on the object, said selection means further producing a correction signal indicative of a difference in the size and shape between the selected aperture and the pattern to be drawn on the object in response to a result of the comparison, wherein said pattern control means controls the beam deflection means in response to the correction signal such that only a part of the beam is passed through the selected aperture.
2. A charged particle beam lithography system as claimed in claim 1 in which said pattern control means controls the addressing means in response to the correction signal such that the beam passed through the selected aperture has a size and shape that are exactly the same as those of the pattern to be drawn on the object.
3. A charged particle beam lithography system as claimed in claim 1 in which said comparison means produces the correction signal as a vector representing a shifting of the beam with respect to the selected pattern on the mask means.
4. A charged particle beam lithography system for drawing a pattern on an object by a charged particle beam, comprising: beam source means for producing and directing a charged particle beam such that the beam travels along a predetermined optical axis toward the object; beam shaping means provided along the path of the traveling charged particle beam for providing a predetermined cross section to said charged particle beam; first focusing means provided between the beam shaping means and the object for focusing the charged particle beam supplied from the beam shaping means on a first crossover point located on the optical axis, said first focusing means comprising a first elecromagnetic lens for receiving the charged particle beam traveling along the optical axis from the beam shaping means for bending the path thereof such that the charged particles in the beam travel, after passing through the first electromagnetic lens, substantially parallel to each other, and a second electromagnetic lens for focusing the charged particle beam passed through the first electromagnetic lens at the first crossover point; second focusing means provided between the first crossover point and the object for focusing the charged particle beam previously focused on the first crossover point on a second crossover point located on the optical axis; beam deflection means for deflecting the charged particle beam focused by the second focusing means such that the beam is displaced on the object; state means for supporting the object; mask means provided between said first electromagnetic lens and said second electromagnetic lens for interrupting the charged particle beam, said mask means defining a plurality of apertures for providing a predetermined shape to the charged particle beam when the charged particle beam is passed therethrough; and addressing means for selectively deflecting the charged particle beam such that the charged particle beam is passed through a selected one of the apertures on the mask means, said addressing means comprising an electromagnetic deflector provided between the first electromagnetic lens and the mask means for deflecting charged particle beam away from the optical axis, a first electrostatic deflector provided between the first electromagnetic lens and the mask means for deflecting the charged particle beam away from the optical axis, a second electrostatic deflector provided between the first electrostatic deflector and the mask means for deflecting the charged particle beam deflected by the first electromagnetic deflector such that the charged particle beam travels parallel to the optical axis and is incident to the mask means perpendicularly, a third electrostatic deflector provided between the mask means and the second electromagnetic lens for deflecting the charged particle beam passed through the aperture on the mask means toward the optical axis, a fourth electrostatic deflector provided between the third electrostatic deflector and the second electromagnetic lens for deflecting the charged particle beam deflected by the third electrostatic deflector such that the charged particle beam travels on the optical axis, and means for selectively energizing either said electromagnetic deflector or said electrostatic deflectors.
5. A charged particle beam lithography system as claimed in claim 4 further comprising a controller for applying a control voltage to said first, second, third and fourth electrostatic deflectors such that the first electrostatic deflector produces a first electric field having a predetermined strength in a predetermined direction, the second electrostatic deflector produces a second electric field having an identical strength to said predetermined strength in a direction opposite to said predetermined direction, the third electrostatic deflector produces a third electric field having a strength and direction identical to that produced by the second electrostatic deflector, and said fourth electrostatic deflector produces a fourth electric field having a strength and direction identical to the field produced by the first electrostatic deflector, said control voltage being such that the charged particle beam passes through at least a part of said predetermined aperture.
6. A method of drawing a pattern on a substrate by a charge particle beam, comprising steps of: producing a charged particle beam such that the charged particle beam travels towards the substrate along a predetermined optical axis; deflecting the charged particle beam away from the optical axis; passing the deflected charged particle beam through a selected one of a plurality of apertures provided on a mask; deflecting the deflected charged particle beam back to the optical axis; and focusing the charged particle beam passed through the selected aperture onto the substrate; wherein said step of deflecting the charged particle beam away from the optical axis comprises a step of energizing an electrostatic deflector when performing a variable shaping of the charged particle beam such that a variable part of the deflected charged particle beam is passed through a predetermined aperture provided on the mask for forming a variable shaped beam, or a step of energizing an electromagnetic deflector when performing a shaping of the charged particle beam according to one of a plurality of predetermined patterns provided on the mask in a form of a plurality of patterned apertures such that the deflected charged particle beam is passed through the selected patterned aperture, said energizing steps being conducted separately and at different times.
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