US 5,147,587 AGrant
Method of Producing Parts and Molds Using Composite Ceramic Powders
Issue Date:1992-09-15
•28 Claims
•6 Drawing Sheets
Abstract
A method and apparatus for selectively sintering a layer of powder to produce a part comprising a plurality of sintered layers. The apparatus includes a computer controlling a laser to direct the laser energy onto the powder to produce a sintered mass. The computer either determines or is programmed with the boundaries of the desired cross-sectional regions of the part. For each cross-section, the aim of the laser beam is scanned over a layer of powder and the beam is switched on to sinter only the powder within the boundaries of the cross-section. Powder is applied and successive layers sintered until a completed part is formed. Preferably, the powder comprises a plurality of materials having different dissociation or bonding temperatures. The powder preferably comprises blended or coated materials, including precursor materials which are formed into a mass at the irradiated locations, and which either react due to the laser thermal energy or in a later heat treatment to form a compound with properties different than the precursors. Examples are disclosed wherein a compound is formed which has a significantly higher melting point than that of one or more of the precursor powders. A ceramic part, such as a mold for investment casting, may be formed according to the method, where a first material (e.g., ammonium dihydrogen phosphate) has a melting point sufficiently low that it is melted so as to bind the second material (e.g., alumina). Subsequent heat treatment enables chemical reaction of the two materials to form a ceramic (e.g., aluminum phosphate) capable of withstanding high temperatures.
Metadata
Assignee
- Board of Regents, The University of Texas System
Inventors
- Harris L. Marcus
- Udaykumar Lakshminarayan
Application Information
Application Number:US 6571514
Filing Date:1991-02-19
Priority Date:1986-10-17
Art Unit:134
Classifications
IPC:
B29C 3502D04H 116B32B 3100
Field of Search:
15621926442541942862.2;89;272.4;272.8121.66;121.8;121.8522;58;113;125174;174.4;174.8 E5;8;38548
Patent Drawings (6 sheets)
Description
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic representation of the apparatus of the present invention;
FIG. 2 is a schematic showing a portion of the layered build up of a part produced in accordance with the present invention, and illustrating the raster scan pattern of the laser beam in the target area;
FIG. 3 is a block diagram depicting the interface hardware between the computer, laser and galvanometers of the present invention;
FIG. 4 is a perspective view of an example part produced in accordance with the present invention;
FIG. 5 is a sectional view with parts broken away and in phantom, of the part illustrated in FIG. 4;
FIG. 6 is a flow chart of the data metering program in accordance with the present invention;
FIG. 7 is a sectional view taken along line 7--7 of FIG. 4;
FIG. 8 illustrates in diagram form the correlation between a single sweep of the laser across the layer of FIG. 7 and the control signals of the present invention;
FIG. 9 illustrates a blend of materials in a powder;
FIG. 10 illustrates materials coated in a powder;
FIG. 11 illustrates a portion of a sintering cycle on a blend of materials as presently understood.
FIG. 12 illustrates two materials deposited prior to sintering.
FIG. 13 is a time-temperature plot of a firing sequence of a part produced by an embodiment of the invention.
FIG. 14 is a plot of shrinkage data as a function of binder volume, for varying sizes of alumina particles, according to the firing sequence of FIG. 13.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Turning now to the drawings, FIG. 1 broadly illustrates the apparatus 10 in accordance with the present invention. Broadly speaking, the apparatus 10 includes a laser 12, powder dispenser 14, and laser control means 16. In more detail, the powder dispenser 14 includes a hopper 20 for receiving the powder 22 and having an outlet 24. The outlet 24 is oriented for dispensing the powder to a target area 26, which in FIG. 1 is generally defined by the confinement structure 28. Of course, many alternatives exist for dispensing the powder 22.
The components of the laser 12 are shown somewhat schematically in FIG. 1 and include a laser head 30, a safety shutter 32, and a front mirror assembly 34. The type of laser used is dependent upon many factors, and in particular upon the type of powder 22 that is to be sintered. In the embodiment of FIG. 1, a Nd:YAG laser (for example, a Lasermetrics 9500Q) was used which can operate in a continuous or pulsed mode with a hundred-watt maximum outlet power in the continuous mode. The laser beam output of the laser 12 has a wavelength of approximately 1060 nm, which is near infrared. The laser 12 illustrated in FIG. 1 includes an internal pulse rate generator with a selectable range of about one kiloHertz to forty kiloHertz, and an approximately six nanosecond pulse duration. In either the pulsed or continuous mode, the laser 12 can be modulated on or off to selectively produce a laser beam which travels generally along the path shown by the arrows in FIG. 1.
To focus the laser beam, a diverging lens 36 and converging lens 38 are disposed along the path of travel of the laser beam as shown in FIG. 1. Using just the converging lens 38, the location of the true focal point is not easily controlled by varying the distance between the converging lens 38 and the laser 12. The diverging lens 36 placed between the laser 12 and converging lens 38 creates a virtual focal point between the diverging lens 36 and the laser 12. Varying the distance between the converging lens 38 and the virtual focal point, allows control of the five focal point along the laser beam path of travel on the side of the converging lens 38 remote from the laser 12. In recent years there have been many advances in the field of optics, and it is recognized that many alternatives are available to efficiently focus the laser beam at a known location.
In more detail, the laser control means 16 includes computer 40 and scanning system 42. In a preferred embodiment, the computer 40 includes a microprocessor for controlling the laser 12 and a CAD/CAM system for generating the data. In the embodiment illustrated in FIG. 1, a personal computer is used (Commodore 64) whose primary attributes include an accessible interface port and a flag line which generates a nonmaskable interrupt.
As shown in FIG. 1, the scanning system 42 includes a prism 44 for redirecting the path of travel of the laser beam. Of course, physical layout of the apparatus 10 is the primary consideration in determining whether a prism 44, or a plurality of prisms 44, are needed to manipulate the path of travel of the laser beam. The scanning system 42 also includes a pair of mirrors 46, 47 driven by respective galvanometers 48, 49. The galvanometers 48, 49 coupled to their respective mirrors 46, 47 to selectively orientate the mirrors 46, 47. The galvanometers 46, 47 are mounted perpendicular to each other such that the mirrors 46, 47 are mounted nominally at a right angle to each other. A function generator driver 50 controls the movement of the galvanometer 48 (galvanometer 49 is slaved to the movement of galvanometer 48) so that the aim of the laser beam (represented by the arrows in FIG. 1) can be controlled in the target area 26. The driver 50 is operatively coupled to the computer 40 as shown in FIG. 1. It will be appreciated that alternative scanning methods are available for use as the scanning system 42, including acusto-optic scanners, rotating polygon mirrors, and resonant mirror scanners.
Turning to FIG. 2 of the drawing, a portion of a part 52 is schematically illustrated and shows four layers 54-57. The aim of the laser beam, labeled 64 in FIG. 2, is directed in a raster scan pattern as at 66. As used herein, "aim" is used as a neutral term indicating direction, but does not imply the modulation state of the laser 12. For convenience, the axis 68 is considered the fast scan axis, while the axis 70 is referred to as the slow scan axis. Axis 72 is the direction of part build-up.
Turning to FIGS. 9 and 10, powders, comprising a plurality of materials by which parts may be made using the present invention, are illustrated. For simplicity, only two materials are shown in the illustrations. However, as will be apparent to one skilled in the art, a plurality of materials may comprise the powder of the present invention.
FIG. 9 illustrates a blend of first material 901 and second material 902. The materials are combined in a blend through conventional blending processes. FIG. 10 illustrates material 1002 coated with material 1001. Material 1002 is coated using conventional coating processes.
As will be further apparent to one skilled in the art, coated materials, as shown in FIG. 10, may be blended to produce a desired mix of materials.
Turning to FIG. 11, a portion of a sintering cycle, as presently understood, is illustrated. FIG. 11a illustrates a blend of materials prior to the application of energy able to produce sintering. Preferably, the materials comprising powder mass 1100 have more than one bonding or dissociation temperature. FIG. 11b illustrates powder 1100 during application of energy sufficient to promote sintering. FIG. 11b illustrates material 1101 having a lower bonding or dissociation temperature than material 1102. In a preferred embodiment, the low temperature phase material 1101 infiltrates powder mass 1100 in the volume surrounding each particle of material 1102. Additional powder components could also be added to the blend to promote infiltration. Similarly a gas phase can be used to promote infiltration and the sintering process. The gas phase may be either inert or active, preferably to either displace an undesired gas or introduce a desired gas. FIG. 11c illustrates a potential mechanism through which effects, including but not limited to, capillarity effects, allow material 1101 to infiltrate the powder mass 1100. FIG. 11d shows the part following sintering in the present invention.
Because a material having a bonding or dissociation temperature higher than the temperature to be obtained during the sintering process may be selected, the higher bonding or dissociation temperature material need not sinter but may retain its original structure. In particular, for crystalline material this enables control of epitaxial growth in the selective beam sintering process of the present invention. For example, if the higher bonding or dissociation temperature material is positioned in a particular structure that may, preferably, result in epitaxial growth from the preceding layer, only bonding or dissociating the lower bonding or dissociation temperature material enables the higher temperature material to retain its structure.
The choice of materials selected for the powder allows for a broad range of resulting sintered material. For example, a conducting material is preferably coated with an insulating polymer material to produce a powder. The powder is then distributed in the target area. The material is preferably sintered and the insulator may be removed later through a conventional process, including but not limited to a chemical method, resulting in a conductive, sintered product.
By way of further illustration, extremely hard materials may be produced using the present invention. For example, tungsten carbide/cobalt tools which, because of their extreme hardness are difficult to form or sharpen may be produced by coating tungsten carbide material with cobalt to produce a powder or by blending tungsten carbide and cobalt to produce a powder. During sintering, the cobalt preferably melts under the applied energy beam causing local infiltration of the tungsten carbide. The part that is manufactured is ready to be put into service preferably after a secondary process including, but not limited to, annealing.
By way of further illustration, copper and tin may be combined in a powder. Tin, having a lower melting temperature than copper, will melt and infiltrate the copper during sintering.
Secondary processing may also be applied to parts produced using the present invention. For example, where tin is allowed to melt and infiltrate copper during sintering, post process thermal treatment will dissolve the tin into the copper in the solid state creating bronze with minimal volume change or distortion.
By way of further illustration, metal, including but not limited to, iron or steel, may be coated with poly(methyl methacrylate) (PMMA) polymer to form a powder. Sintering enables the PMMA to flow and bind the metal. Post process thermal treatment will dissociate the PMMA and sinter the metal thus producing a final part.
Ceramic materials may be processed in this fashion as well. For example, a mixture of fluorophosphate glass powders with alumina powders will result in the glass softening and infiltrating the alumina during the sintering process. In another example, aluminum silicate, silica, or other ceramic powder can be coated with a polymer by a variety of methods, including spray drying and solvent coating. A surface active agent may be used to pretreat the ceramic powder prior to coating. This agent may be based on organosilane chemistry or other chemistries known to promote the wetability of the ceramic by the polymer and the adhesion of ceramic to polymer. Any polymer, either thermoplastic or thermoset, which can be coated on the ceramic, can be used as a binder. Typical materials include PMMA, polystyrene, various epoxy formulations, and phenolics.
Any combination of materials, including but not limited to, metals, ceramics and polymers enables production of parts in accordance with the present invention wherein at least one material in the powder has a low bonding or dissociation temperature relative to the other materials in the powder. Such a combination of materials may be incorporated into another embodiment of the invention which is particularly directed to the formation of a ceramic part, such as a mold and/or core useful in investment casting.
Referring again to FIG. 11, an example of a multiple material system useful according to this embodiment of the invention will now be described. In this embodiment of the invention, materials are selected to include a first lower temperature material which melts when irradiated by an energy beam and binds particles of a second material to define the shape and dimensions of the part. The materials are also selected so that after the part has been so defined, subsequent heating of the part enables chemical reaction between the materials, with the product of the reaction being a high temperature material, such as a ceramic, which has the shape and dimensions of the part defined by the energy beam step.
In this embodiment, low temperature powder 1101 is ammonium dihydrogen phosphate (NH.sub.4 H.sub.2 PO.sub.4), which has a melting point on the order of 190.degree. C., and high temperature powder 1102 is aluminum oxide (commonly referred to as alumina, Al.sub.2 O.sub.3), which has a melting point on the order of 2045.degree. C. The diameter of alumina powder particles 1102 may be selected to optimize the packing density of the powder mixture. It should be noted that the surface finish of the part produced by this method depends strongly on the size of alumina particles 1102, with finer powder providing smoother surface finishes. In addition, it has been found that lower purity alumina (on the order of 95% pure, with the impurities primarily TiO.sub.2) is preferable as powder 1102 than higher purity alumina (on the order of 99.99% pure), as the lower purity alumina better absorbs Nd:YAG laser energy (wavelength of 1.06.mu.). Ammonium dihydrogen phosphate powder 1101 is preferably ground and sieved to have particles with diameters on the order of 44.mu. or less, i.e., sieved through -325 mesh. According to this embodiment of the invention, the powder mixture is 80% wt. alumina powder 1102 and 20% wt. ammonium dihydrogen phosphate powder 1101. The amount of ammonium dihydrogen phosphate can range from 10% to 65% wt. of the powder mixture. For other material systems, still higher weight percentages of the low temperature phase powder may be used.
This mixture of powders 1101 and 1102 is used as the powder in the process of producing a part described hereinabove, and in the above-referenced U.S. Pat. Nos. 4,944,817, 4,863,538, and 4,938,816, and PCT publication WO 88/02677, where a part is produced in layerwise fashion by sintering selected portions of each layer of the powder by the selective application of a laser beam thereto. An example of the preferred system for performing the layerwise production of a part using this material mixture is the SLS.TM. Model 125 system manufactured and sold by DTM Corporation. In this system and method, a layer of the powder mixture is spread by way of a counter-rotating roller across the top of a target piston, to a thickness on the order of 0.005 inches, for a given layer. The temperature of the powder mixture is preferably maintained on the order of 115.degree. C.; it should be noted that lower powder temperatures, for example on the order of 20.degree. to 60.degree. C., have also been observed to provide adequate results.
In the preferred embodiment of the method, portions of the powder mixture layer are irradiated with a Q-switched Nd:YAG laser with wavelength 1.06.mu., frequency of 40 kHz, beam spot size of 0.5 mm, and incident power of 20 to 25 Watts, to define a two-dimensional slice of the part to be produced. Other laser sources, such as a CO.sub.2 laser of 10.6.mu., with the appropriate power output, can alternatively be used as the energy source. Directional control of the laser is preferably accomplished by galvanometer-controlled mirrors, scanning the powder at variable speeds consistent with laser power input requirements, and under the control of a computer workstation, such as a model 386-33 manufactured and sold by Austin Computer Systems, based on an 80386 microprocessor as manufactured and sold by Intel Corporation and preferably including a math coprocessor such as an 80387 math coprocessor manufactured and sold by Intel Corporation.
Under these conditions, the portions of the powder mixture layer irradiated by the laser are heated to a temperature in excess of 190.degree. C. Particles 1101 of ammonium dihydrogen phosphate melt into a glassy phase, and surround and bind the alumina particles 1102 in the manner shown in FIG. 11d. The above-noted parameters are sufficient so that the irradiated portions of successively processed layers will be bound to one another by molten and cooled powder 1101 in the same manner. Upon completion of all of the desired layers, the part produced by this embodiment of the method has sufficient "green" strength to be removed from the apparatus, and the non-irradiated powder removed therefrom and recycled.
In order to form a ceramic part of sufficient strength and high melting temperature, for example as useful as a mold in investment casting, after removal and cleaning, the part produced by the above method is heated to decompose the ammonium dihydrogen phosphate to form phosphorous pentoxide, and to react the phosphorous pentoxide with the bound alumina particles 1102, to form an end product of aluminum phosphate. The composite reaction of the decomposition of ammonium dihydrogen phosphate into phosphorous pentoxide, and the reaction of phosphorous pentoxide with alumina, can be expressed as follows:
Individual intermediate reactions between alumina and ammonium dihydrogen phosphate at different temperatures are given in Baumgart, et al., Process Mineralogy of Ceramic Materials (Ferdnand Enke Verlag, 1984), p. 87.
This heat treatment is preferably performed in a conventional microprocessor-controlled furnace, so that the temperature of the part can be controlled over time. The ambient atmosphere in the furnace can be air, or alternatively an inert atmosphere. FIG. 13 illustrates the preferred firing sequence for the part, using the powder mixture according to this example of the invention. The part is preferably heated slowly, with an intermediate soaking at 450.degree. C. for a duration on the order of two hours, followed by heating to the maximum temperature of on the order of 850.degree. C. The preferred maximum firing temperature for this multiple material system is between 850.degree. C. and 880.degree. C., to avoid decomposition of aluminum phosphates of certain stoichiometries. After sufficient time at the maximum temperature, for example six hours, the part is preferably cooled at a slower rate than it was heated to avoid distortion.
As a result of the post-sintering firing process, a part is produced of a high temperature ceramic, having substantially the same dimensions and shape as the part defined by the layerwise laser irradiation which melted the ammonium dihydrogen phosphate to bind the alumina particles. Microstructure analysis has shown that, after firing, the part consists of unreacted alumina particles, bound by aluminum phosphate. Each of these materials have a high melting point.
It should be noted that the firing sequence has been observed to be a significant factor in the extent to which the produced part shrinks during such firing. It has been observed that firing according to the firing sequence of FIG. 13, with the maximum temperature on the order of 850.degree. C., results in shrinkage on the order of 1.0% or less, as shown in FIG. 14.
FIG. 14 is a plot of observed shrinkage as a function of the percentage, by volume, of ammonium dihydrogen phosphate material 1101 in the powder mixture with three sizes of alumina particles 1102, each using the firing sequence of FIG. 13. Negative values of shrinkage correspond to observed dimensional growth. The maximum and minimum data points, and the arithmetic mean, are illustrated for each data point, with the lines connecting the mean shrinkage as a function of volume percentage of material 1101, for each size of particles 1102. It can be seen from FIG. 14 that the firing sequence of FIG. 13 provides shrinkage of less than 1.0% for several compositions of varying size of alumina particles 1102, and of varying volume percentages of ammonium dihydrogen phosphate 1101, in the powder mixture.
The low shrinkage observed in the firing of the part according to the sequence of FIG. 13 is believed to be due to a balancing of competing mechanisms occurring during the heat treatment. As indicated hereinabove, the firing sequence drives off ammonia gas and water vapor, necessarily resulting in loss of mass in the part, and reduction in the part density (i.e., an increase in porosity). The firing sequence is also sintering the remaining material, however, which serves to densify the part. Selection of the time and temperature conditions of the firing sequence can be achieved to balance these mechanisms, as occurs in the sequence of FIG. 13, so that the dimensions of the part after firing match the dimensions of the part prior to firing (i.e., shrinkage is very low).
An alternative approach is to continue to fire the mold after a sequence such as shown in FIG. 13, with the temperature increasing to above 1200.degree. C. to reduce the aluminum phosphate to alumina, according to the following reaction:
Alumina (Al.sub.2 O.sub.3), as discussed above, is an extremely high temperature material, with a melting point on the order of 2045.degree. C.; accordingly, a mold may be formed of alumina, suitable for higher temperature processes including the investment casting of metallic superalloys.
This reaction indicates that gaseous phosphorous pentoxide is driven off during the firing sequence. Similarly as in the prior example of lower temperature firing, the loss of mass in the part from this gaseous by-product of the reduction reaction will reduce the density in the part (i.e., increase its porosity). Opposing this density reduction, however, is the mechanism of sintering which densifies the remaining alumina during this higher temperature heat treatment. Similarly as described hereinabove for the lower temperature firing sequence, it is contemplated that selection of the time and temperature conditions of such high temperature firing can be selected so that these competing mechanisms balance. As a result, the process according to the invention can provide an extremely high temperature material, with close dimensional tolerances maintained by minimizing shrinkage via selection of the time and temperature firing conditions. Alternatively, such additional shrinkage from the reduction reaction could be taken into account in the dimensional design of the part.
In this example of the invention, the multiple material system of ammonium dihydrogen phosphate and alumina produces a part formed of aluminum phosphate (AlPO.sub.4), which has a melting point in excess of 1500.degree. C. A part produced according to this invention thus has sufficient temperature stability, and structural strength, to serve as a mold for the investment casting of metals such as lead, zinc, bronze, brass, copper, and other metals with melting points below 1500.degree. C., in the well known manner. Higher melting temperature materials, such as nickel, cobalt, and iron-based alloys, can be cast if the post-processing firing temperature is sufficiently high to form a mold of alumina, as noted hereinabove. In either case, this embodiment of the invention thus allows for the direct fabrication of an investment casting mold using the selective application of a laser to a powder, in layerwise fashion, to bind particles of one material with another, low melting point, material, followed by chemical reaction of the materials to form a ceramic capable of withstanding investment casting temperatures and stresses.
It should be noted that this mold may also include a core, or insert, which defines inside surfaces of the investment cast part produced. Alternatively, the mold produced by this process may be used as a core in combination with a conventionally formed investment cast mold. For purposes of this description, the term "mold" is intended to also refer to such a core, either in and of itself or together with a mold similarly formed.
In the direct fabrication of a mold according to this method, the design should consider the location of the parting line of the mold so that the unsintered powder can be easily removed after the laser operation and prior to firing, to allow for cleaning of the inner surfaces of the "green" part. The locations and sizes of other mold features, such as the risers, gates and sprue, can be determined according to the design rules for the casting process, rather than being limited by the mold fabrication process. Alternatively, the risers, gates, sprue, and other mold features may be separately fabricated (using conventional processes, or the method of the present invention, as desired), and attached to the mold formed according to this embodiment of the invention.
While the above example of the invention uses ammonium dihydrogen phosphate and alumina as materials 1101 and 1102, respectively, to form a higher temperature ceramic part, other material combinations are also contemplated to be useful in forming a part in the same manner. Examples of other systems include Al.sub.2 O.sub.3 --B.sub.2 O.sub.3, Al.sub.2 O.sub.3 --(NH.sub.4).sub.2 HPO.sub.4, SiO.sub.2 --B.sub.2 O.sub.3, SiO.sub.2 --P.sub.2 O.sub.5, and SiO.sub.2 --B.sub.2 O.sub.3 --P.sub.2 O.sub.5.
In another preferred embodiment of the present invention, the temperature of the powder mass may be increased using conventional heating means allowing the energy beam to merely supply a small increase of energy to produce bonding or dissociation of one of the elemental materials of the powder.
Materials comprising the powder may be chosen for each material's selective absorption of energy from a laser beam (represented by the arrows in FIGS. 11a and 11b). In the preferred embodiment shown in FIG. 11, material 1101 may be chosen to absorb the wavelength of the applied beam energy represented by the arrows while elemental material 1102 absorbs less energy thereby enabling elemental material 1101 to bond or dissociate prior to the bonding or dissociation of elemental material 1102. This absorption of energy can be achieved by either material or laser beam wavelength selection, or both, in a plurality of combinations.
Turning to FIG. 12, in yet another preferred embodiment a material 1201 is preferably deposited on surface 1200 and second material 1203 is then deposited on material 1201 prior to sintering. Materials 1201 and 1203 preferably have different bonding or dissociation temperatures.
Operation
A fundamental concept of the present invention is the build up of a part in a layer-by-layer manner. That is, a part is considered a plurality of discrete cross-sectional regions which cumulatively comprise the three-dimensional configuration of the part. Each discrete cross-sectional region has defined two-dimensional boundaries--of course, each region may have unique boundaries.
In the method, a first portion of powder 22 is deposited in the target area 26 and selectively sintered by the laser beam 64 to produce a first sintered layer 54 (FIG. 2). The first sintered layer 54 corresponds to a first cross-sectional region of the desired part. The laser beam selectively sinters only the deposited powder 22 within the confines of the defined boundaries.
There are, of course, alternative methods of selectively sintering the powder 22. One method is for the aim of the beam to be directed in a "vector" fashion--that is, the beam would actually trace the outline and interior of each cross-sectional region of the desired part. Alternatively, the aim of the beam 64 is scanned in a repetitive pattern and the laser 12 modulated. In FIG. 2, a raster scan pattern 66 is used and is advantageous over the vector mode primarily in its simplicity of implementation. Another possibility is to combine the vector and raster scan methods so that the desired boundaries of the layer are traced in a vector mode and the interior irradiated in a raster scan mode. There are, of course, trade-offs associated with the method chosen. For example, the raster mode has a disadvantage when compared to the vector mode in that arcs and lines which are not parallel to the axes 68, 70 of the raster pattern 66 of the laser beam 64 are only approximated. Thus, in some cases resolution of the part can be degraded when produced in the raster pattern mode. However, the raster mode is advantageous over the vector mode in the simplicity of implementation.
Turning to FIG. 1, the aim of the laser beam 64 is scanned in the target area 26 in a continuous raster pattern. Broadly speaking, the driver 50 controls galvanometers 48, 49 to made the raster pattern 66 (see FIG. 2). Shifting movement of the mirror 46 controls movement of the aim of the laser beam 64 in the fast scan axis 68 (FIG. 2), while movement of the mirror 47 controls movement of the aim of the laser beam 64 in the slow scan access 70.
The present position of the aim of the beam 64 is fed back through the driver 50 to the computer 40 (see FIG. 3). As described below, in more detail, the computer 40 possesses information relating to the desired cross-sectional region of the part then being produced. That is, a portion of loose powder 22 is dispensed into the target area 26 and the aim of the laser beam 64 moved in its continuous raster pattern. The computer 40 modulates the laser 12 to selectively produce a laser beam at desired intervals in the raster pattern 66. In this fashion, the directed beam of the laser 12 selectively sinters the powder 22 in the target area 26 to produce the desired sintered layer with the defined boundaries of the desired cross-sectional region. This process is repeated layer-by-layer with the individual layers sintered together to produce a cohesive part--e.g. part 52 of FIG. 2.
In operation, the wavelength of laser 12 may be varied to produce higher absorptivity of energy by selected materials in the powder relative to other materials in powder 22. In operation, blended, coated or other combinations of powders are preferably selected to produce sintered product with characteristics including but not limited to, close dimensional tolerances, structural integrity and required mechanical behavior.
Interface and Software
The interface hardware operatively interconnects the computer 40 with the laser 12 and galvanometers 47, 48. The output port of the computer 40 (see FIGS. 1 and 3) is directly connected to the laser 12 to selectively modulate the laser 12. When operated in the pulsed mode, the laser 12 is easily controlled by digital inputs to the pulsed gate input of the laser. Galvanometer 48 is driven by the function generator driver 50 to drive the beam in the fast scan axis 68 independent of any control signals from the computer 40. However, a position feedback signal from the galvanometer 48 is fed to a voltage comparator 74 as shown in FIG. 3. The other input to the comparator is connected to the digital-to-analog convertor 76 which is indicative of the least significant six bits (bits 0-5) of the user port of the computer 40. As shown in FIG. 3, the output of the voltage comparator 74 is connected to the flag line on the user port of the computer 40. When the voltage comparator determines that the feedback signal from the galvanometer 48 crosses the signal from the digital-to-analog convertor 76, the flag line goes low causing a nonmaskable interrupt. As discussed below, the nonmaskable interrupt causes the next byte of data to put out on the user port of a computer 40.
Finally, as shown in FIG. 3, the galvanometer 49 driving the aim of the laser beam 64 in the slow scan axis 70, is controlled by a second digital to analog convertor 78. The digital-to-analog convertor 78 is driven by a counter 79 which increments with each sweep of the aim of the beam 64 in the fast scan axis 68. The eight byte counter is designed to overflow after 256 scans in the fast scan axis 68 to start a new cycle or raster scan pattern 66.
Preferably, the control information (i.e. defined boundaries of the cross-sectional regions) data for each raster pattern 66 would be determined by a CAD system given the overall dimensions and configuration of the part to be produced. Whether programmed or derived, the control information data for each raster pattern 66 is stored in the computer memory as a series of eight bit words. The data format represents a pattern of "on" and "off" regions of the laser 12, versus distance along the raster pattern 66 traveled by the aim of the beam 64. The data is stored in a "toggle-point" format where the data represents the distance along each raster scan pattern 66 where the laser is modulated (i.e. turned from on to off or from off to on). Although a "bit map" format might be used, the toggle point format has been found more efficient for the production of high resolution parts.
For each eight bit word, the least significant six bits (bits 0-5) represent the location of the next toggle point--i.e. the next location for modulation of the laser 12. The next bit (bit 6) represents whether the laser is on or off immediately before the toggle point identified in the least significant six bits. The most significant bit (MSB or bit 7) is used for looping and for controlling the slow scan axis 70 of the aim of the beam 64. Because the Commodore 64 had limited memory, looping was required--it being understood that a computer 40 with more memory would not require looping.
FIG. 6 represents the flow chart for the data metering program. The data metering program is run whenever the flagline goes low causing a non-maskable interrupt (see FIG. 3). The interrupt causes the microprocessor of the computer 40 to retrieve a two byte interrupt vector which points to the location in memory where program control is transferred at interrupt. As shown in FIG. 6, the data metering program first pushes the registers onto the stack and then loads the next byte of data into the accumulator. The data word is also output to the user port with the sixth bit used to modulate the laser 12 (FIG. 3).
As shown in FIG. 6, the most significant bit (MSB or bit 7) of the data word in the accumulator is examined. If the value of the most significant bit is one, that means the end of the loop has not been reached; therefore the data pointer is incremented, registers are restored from the stack, and the data metering program is exited, returning control to the microprocessor at the location of interrupt. If the most significant bit in the accumulator is zero, the data word is the last word in the loop. If the data word is the last word in the loop, the next bit in memory is a loop counter and the following two bytes are a vector pointing to the top of the loop. As can be seen from FIG. 6, if the most significant bit equals zero (end of the loop) the loop counter (next bit) is decremented and analyzed. If the loop counter is still greater than zero, the data pointer assumes the value from the next two memory bytes after the loop counter, registers are pulled from the stack and program control returns to the location of interrupt. On the other hand, if loop counter is zero, the data pointer is incremented by three and the loop counter is reset to ten before exiting the program. It can be appreciated that the need for such looping is absolved if the memory size of the computer 40 is adequate.
Example
In FIGS. 4 and 5, an example part 52 is illustrated. As can be seen from the drawing, the example part 52 assumes an unusual shape in that it is not symmetrical and would be difficult to fabricate using conventional machining methods. For reference purposes, the part 52 includes an outer base structure 80 having an interior cavity 82 and a pillar 84 disposed within the cavity 82 (see FIG. 4). FIG. 5 shows the part 52 within the confinement structure 28 defining the target area 26 illustrated in FIG. 1. As shown in FIG. 5, some of the powder 22 is loose, while the remainder of the powder is selectively sintered to comprise the structure of the part 52. FIG. 5 is shown in vertical section with parts broken away and outlined in phantom to show the sintered cohesive portions of the part 52.
FIG. 7 shows a horizontal cross-sectional region, taken along line 7--7 of FIG. 4. FIG. 7 represents a discrete layer 86 associated with the cross-sectional region of the part being produced. As such, the sintered layer 86 of FIG. 7 is a product of a single raster pattern 66 as illustrated in FIG. 2.
For reference purposes, a sweep line through the sintered layer 86 has been labeled "L." FIG. 8 illustrates the software and hardware interface operation during the sweep L. The top graph shows the position of feedback signal from the fast axis galva 48 and the output signal of the first digital to analog convertor 76 (compare FIG. 3). The voltage comparator 74 generates an output signal to the flag line of the computer 40 every time the feedback signal and first D/A output signal cross.
In the top graph of FIG. 8, these points are labeled T to represent toggle points. As can be seen from the bottom graph of FIG. 8, the flag line generates a nonmaskable interrupt corresponding to each toggle point T. The sixth bit of each data word is analyzed and the current state of the laser 12 will reflect the value. The penultimate graph of FIG. 8 shows the laser modulation signal for the sweep line L of FIG. 7. The second graph of FIG. 8 shows that a high-going edge in the most significant bit will be encountered at the end of each sweep of the aim of the laser beam 64 in the fast scan axis 68. As shown in FIGS. 3 and 6, the counter 79 increments on a high going edge, and outputs a signal to the second digital-analog convertor 78 to drive the slow axis galvanometer 49.
As can be seen from the example illustrated in the drawing, parts of complex shape can be produced with relative ease. Those skilled in the art will appreciate that the part 52 illustrated in FIG. 4 would be difficult to produce using conventional machining methods. In particular, machine tool access would make the fabrication of cavity 82 and pillar 84 difficult, if not impossible, to produce if the part 52 were of a relatively small size.
In addition to avoiding the access problem, it will be appreciated that the production accuracy is not dependent upon machine tool wear and the accuracy of mechanical components found in conventional machine tools. That is, the accuracy and tolerances of the parts produced by the method and apparatus of the present invention are primarily a function of the quality of the electronics, the optics, and the implementing software. Of course, heat transfer and material considerations do affect the tolerances obtainable.
Those skilled in the art will appreciate that conventional machining techniques require considerable human intervention and judgment. For example, a conventional machining process, such as milling, would require creativity to make such decisions as tool selection, part segmenting, sequence of cuts, etc. Such decisions would even be more important when producing a control tape for a tape control milling machine. On the other hand, the apparatus of the present invention only requires the data relating to each cross-sectional region of the part being produced. While such data can be simply programmed into the computer 40, preferably, the computer 40 includes a CAD/CAM system. That is, the CAD/CAM portion of the computer 40 is given the overall dimensions and configurations of the desired part to be produced and the computer 40 determines the boundaries for each discrete cross-sectional region of the part. Thus, a vast inventory of part information can be stored and fed to the computer 40 on a selectable basis. The apparatus 10 produces a selected part without set-up time, part specific tooling, or human intervention. Even the complex and expensive dies associated with powder metallurgy and conventional casting techniques are avoided.
While large quantity production runs and certain part material characteristics might be most advantageously made using conventional fabrication techniques, the method and apparatus 10 of the present invention is useful in many contexts. In particular, prototype models and casting patterns are easily and inexpensively produced. For example, casting patterns are easily made for use in sand casting, lost wax casting, or other forming techniques. Further, where desired quantities are very small, such as with obsolete replacement parts, production of such replacement parts using the apparatus 10 of the present invention has many advantages. Finally, the use of the apparatus 10 may be useful where size of production facilities is a major constraint, such as on-ship or in outerspace.
Further modification and alternative embodiments of the apparatus of this invention will be apparent to those skilled in the art in view of this description. Accordingly this description is to be construed as illustrative only and is for the purpose of teaching those skilled in the art the manner of carrying out the invention. It is to be understood that the forms of the invention herein shown and described are to be taken as the presently preferred embodiments. Various changes may be made in the shape, size and arrangement of parts. For example, elements or materials may be substituted for those illustrated and described herein, parts may be reversed, and certain features of the invention may be utilized independently of the use of other features, all as would be apparent to one skilled in the art after having the benefit of this description of the invention.
Claims
We claim:
1. A method of producing a part, comprising: depositing a powder onto a target surface, said powder comprising first and second materials; heating a selected portion of said powder above the melting point of said first material so that said first material binds said second material in said selected portion to define a cross-sectional region of the part; and reacting the first and second materials in said cross-sectional region of the part to form a chemical compound of said first and second materials.
2. The method of claim 1, further comprising: depositing a second layer of said powder after said heating step and before said reacting step; and before said reacting step, heating a selected portion of said second layer of powder to define a second cross-sectional region of the part.
3. The method of claim 2, wherein said reacting step comprises: removing portions of the powder not within the defined cross-section of the part, after said step of heating said second layer of powder; and heating the part after said removing step to cause a chemical reaction.
4. The method of claim 1, wherein said heating step comprises: directing a laser beam at selected portions of said powder.
5. The method of claim 1, wherein said reacting step comprises: decomposing said first material into an intermediate material; and reacting said intermediate material with said second material.
6. The method of claim 1, wherein said first material comprises ammonium dihydrogen phosphate, and wherein said second material comprises aluminum oxide.
7. The method of claim 1, wherein said reacting step causes a gas to be driven off from said part; and wherein the temperature/time sequence of said reacting step is selected in such a manner as to control shrinkage of the part during said reacting step.
8. The method of claim 1, wherein said reacting step comprises: heating the part to a temperature which reduces the chemical compound of said first and second materials.
9. The method of claim 8, wherein a gas is driven off from said part during said reacting step; and wherein the temperature/time sequence of said heating step is selected in such a manner as to control shrinkage of the part during said reacting step.
10. A method of investment casting a part, comprising: depositing a layer of a powder onto a target surface, said powder comprising first and second materials; heating a selected portion of said powder above the melting point of said first material so that said first material binds said second material in said selected portion to define a cross-sectional region of a mold; repeating said depositing and heating steps for additional layers of said powder, to form said mold; reacting the first and second materials in said mold to form a chemical compound of said first and second materials; casting a part in said mold.
11. The method of claim 10, wherein said first material comprises ammonium dihydrogen phosphate, and wherein said second material comprises aluminum oxide.
12. The method of claim 10, wherein said reacting step comprises: removing portions of the powder not within the defined cross-section of the mold; and heating the mold after said removing step to cause a chemical reaction.
13. The method of claim 12, wherein the step of heating the mold drives a gas from said part; and wherein the temperature/time sequence of the step of heating the mold is selected in such a manner as to control shrinkage of the mold during the step of heating the mold.
14. The method of claim 10, wherein said heating step comprises: directing an energy beam at selected portions of said powder.
15. The method of claim 10, wherein said reacting step comprises: decomposing said first material into an intermediate material; and reacting said intermediate material with said second material.
16. The method of claim 10, wherein said reacting step is performed at a sufficiently high temperature to reduce the chemical compound of said first and second materials.
17. The method of claim 16, wherein a gas is driven from said part during the reduction of the chemical compound of said first and second materials; and wherein the temperature/time sequence of the reacting step is selected in such a manner as to control shrinkage of the mold during said reacting step.
18. A part produced by the method comprising the steps of: depositing a powder onto a target surface, said powder comprising first and second materials; heating a selected portion of said powder above the melting point of said first material so that said first material binds said second material in said selected portion to define a cross-sectional region of the part; and reacting the first and second materials in said cross-sectional region of the part to form a chemical compound of said first and second materials.
19. The part of claim 18, wherein said reacting step comprises: decomposing said first material into an intermediate material; and reacting said intermediate material with said second material, so that the compound is of said intermediate material and said second material.
20. The part of claim 19, wherein said part comprises particles of said second material bound by said chemical compound of said intermediate material and said second material.
21. The part of claim 20, wherein the part is a mold for investment casting.
22. The part of claim 18, wherein said first material comprises ammonium dihydrogen phosphate, and wherein said second material comprises aluminum oxide.
23. The part of claim 18, wherein the method further comprises: depositing a second layer of said powder after said heating step; and heating a selected portion of said second layer of powder to define a second cross-sectional region of the part.
24. The part of claim 23, wherein said reacting step comprises: removing portions of the powder not within the defined cross-section of the part, after said step of heating said second layer of powder; and heating the part after said removing step to cause a chemical reaction.
25. The part of claim 24, wherein a gas is driven from said part during the step of heating the part after said removing step; and wherein the temperature/time sequence of the step of heating the part after said removing step is selected in such a manner as to control shrinkage of the part.
26. The part of claim 24, wherein the step of heating the part after said removing step is at a temperature which reduces the chemical compound of said first and second materials.
27. The part of claim 26, wherein a gas is driven off from said part during the step of heating the part after said removing step; and wherein the temperature/time sequence of the step of heating the part after said removing step is selected in such a manner as to control shrinkage of the part.
28. The part of claim 24, wherein said heating step in said reacting step comprises: decomposing said first material into an intermediate material; and reacting said intermediate material with said second material, so that the compound is of said intermediate material and said second material.
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