Method of Patterning a Transparent Conductor

1. Field of the Invention

The present invention relates to a method of patterning a transparent conducting film and particularly to a method of patterning a transparent conducting film formed on a substrate including silicon.

For a light detecting part such as an imaging device, an amorphous silicon (a-Si) film suitable for receiving the visible light, an amorphous silicon carbide (a-SiC) film or a multilayered film thereof is of them are used and as a transparent conducting film, an indium (In).tin (Sn).oxide film (ITO film), for example. Therefore, processing of such a film is a very important fabrication process in the imaging device fabrication process.

2. Description of the Related Art

FIGS. 1(a).about.(e) are schematic sectional views for explaining a part of the conventional fabrication process of an imaging device.

FIG. 1(a) shows a sample immediately before formation of a transparent conducting film, where a multilayered film consisting of a-SiC film/a-Si film/a-SiC film is formed as the light receiving part. The structures shown in FIGS. 1(a).about.(e) are called the "sample" in the respective steps.)

In FIG. 1(a), the reference numeral 1 denotes a silicon substrate; 2, a silicon oxide film (SiO.sub.2 film) for device separation; 3, an interlayer insulation film; 4, a transistor for amplification; 5, Al wiring; 6, a PSG (phosphosilicate glass) film for flattening; 7, a light receiving part consisting of an a-SiC film 7d/a-Si film 7c/a-SiC film 7b. In this FIGURE, a collector electrode for the charges generated through photoelectric conversion, a charge storage diode and a CCD (Charge Coupled Device) for transferring charges have the well known structure and these are not illustrated.

As shown in FIG. 1(b), a sample of FIG. 1(a) is put into a sputtering apparatus, substrate temperature is raised (up to about 150.degree. C.) and thereafter a first transparent conducting film 8 consisting of ITO is formed by the sputtering on the a-SiC film 7d. Here the substrate is heated to improve adhesive strength between the substrate and the transparent conducting film and also to improve light receiving characteristics.

Next, as shown in FIG. 1(c), a resist pattern 9 is formed on the first transparent conducting film 8 and this first transparent conducting film 8 is then removed by etching using the aqueous solution of ferric chloride (FeCl.sub.3) with the resist pattern 9 used as the mask. Such wet etching is carried out here because since the vapor pressure of indium (In) and tin (Sn) is low, and consequently an etching rate is low for the dry etching of ITO.

As shown in FIG. 1(d), after the a-SiC film 7d/a-Si film 7c/a-SiC film 7b is etched by nitrogen trifluoride (NF.sub.3), the PSG film 6 on the Al wiring 5 is selectively etched and thereby an aperture 10 is formed. Thereafter, this sample is put into the sputtering apparatus and a second transparent conducting film 11 is formed on the sample surface under the same conditions as as existed during formation of the first transparent conducting film 8. Thereby, the Al wiring 5 is connected to the second transparent conducting film 11 through the aperture 10.

Finally, as shown in FIG. 1(e), a resist pattern 12 is formed on the second transparent conducting film 11 and the second transparent conducting film 11 is etched by the FeCl.sub.3 aqueous solution with the resist pattern used as the mask. As explained above, a leadout electrode 11c is formed, completing an imaging device.

In above fabrication process, since the sample is kept at about 150.degree. C. during formation of the first transparent conducting film 8 of the light receiving part, an interfacial reacted layer 8a is generated by reaction ITO and Si at the interface between the first transparent conducting film 8 and a-SiC film 7d, as shown in FIG. 2(a). This interfacial reacted layer 8a by reaction does not easily dissolve into the aqueous solution of FeCl.sub.3. Therefore, when the etching time is set longer in order to perfectly remove the interfacial reacted layer 8a shown in FIG. 2(a), the lateral etching of the first transparent conducting film 8b, where ITO does not react with Si, proceeds as shown in FIG. 2(b), and a part A, where only the interfacial reacted layer 8a remains on the a-SiC film 7d, is generated. When this condition is observed from the direction where the light is incident, the periphery of the first transparent conducting film is partly protruded and recessed. Therefore, the protruded and recessed regions are also generated in the periphery of the a-SiC film 7d/a-Si film 7c/a-SiC film 7b by the successive etching. As a result, a leak current of the imaging device fabricated increases.

In order to avoid such phenomenon, the ITO film is formed under a lower temperature, then the ITO film may be peeled easily and light transmissivity becomes small so that it can no longer be put into the practical use.

As shown in FIG. 1(d), the phenomena conducted on the first transparent conducting film 8 are also generated even after formation of the second transparent conducting film 11 made of ITO film. Namely, as shown in FIG. 3(a), a side product layer 11a is generated by reaction of ITO and Si included in the PSG film 6 at the interface between the second transparent conducting film 11 and PSG film 6. Therefore, if it is attempted to perfectly remove the interfacial reacted layer 11a at the time of etching the second transparent conducting film 11 as shown in FIG. 1(e), only the ITO film 11b is etched in the lateral direction shown in FIG. 3(b), and consequently the etchant sometimes reaches the Al wiring 5. In this case, the Al wiring 5 may be etched because the etchant includes chlorine. As a result, a problem occurs in that quality of imaging device is deteriorated occurs.

As explained above, a method of etching the transparent conducting film, such as ITO, to be used for the imaging device, which provides an adequate etching rate and giving which produces no adverse effect on the device characteristics, has been not found yet.

It is an object of the present invention to provide a method of etching the transparent conducting film on a substrate including Si with an adequate etching rate.

It is another object of the present invention to provide a method of etching the transparent conducting film on a substrate including Si without deteriorating device characteristics.

It is a further object of the present invention to provide a method of patterning the transparent conducting film on a substrate including Si with high accuracy.

The objects of the present invention described above may be attained by conducting the etching method comprising the steps forming a transparent conducting film, such as ITO, on a substrate including Si and executing wet etching of the transparent conducting film with a halogenide etchant and then dry etching with a reactive gas including a halogen, with a resist pattern formed on the transparent conducting film used as the mask.

When a transparent conducting film, for example, idium.tin oxide film (ITO film), aluminum.zinc oxide film (AZO film), indium oxide film (In.sub.2 O.sub.3 film), tin oxide film (SnO.sub.2 film) or zinc oxide film (ZnO film) is grown under the temperature of 100.degree. C. or higher, the interfacial reacted layer produced by reaction of ITO, AZO, In.sub.2 O.sub.3, SnO.sub.2, ZnO and Si are respectively formed at the interface between the substrate and the transparent conducting film. ITO, AZO, In.sub.2 O.sub.3, SnO.sub.2, ZnO films are etched at an adequate etching rate by the halogenide echant but the interfacial reacted layer does not easily dissolve by reaction into the halogenide etchant. However, since the interfacial reacted layer includes Si, it is etched at an adequate etching rate by the dry etching using the reactive gas including the halogen but ITO, AZO, In.sub.2 O.sub.3, SnO.sub.2, ZnO films have the property not to be dry-etched by the gas described above.

Accordingly, on the occasion of etching the transparent conducting film formed on the substrate including Si, the adequate etching rate may be maintained by conducting such etching process consisting of two steps i.e. the upper layer part of transparent conducting film (the region where the interfacial reacted layer by reaction with Si is not formed) is wet-etched by the halogenide etchant and thereafter the interfacial reacted layer is dry-etched with the reactive gas including halogen element. Therefore, amount of side etching of the transparent conducting film of the upper layer may be remarkably reduced.

As a result, the patterning of the transparent conducting film can be made with high accuracy by matching with the size of the pattern of etching resistant film, for example, a resist pattern. Simultaneously, increase of leak current due to irregular etching in the periphery of the light receiving region can be prevented and deterioration of characteristics based on the etching of the electrode can also be prevented.

FIG. 1(a) is a schematic sectional view of a sample immediately before a transparent conducting film is formed and after a multilayered film consisting of a-SiC film/a-Si film/a-SiC film is formed as the light receiving part;

FIG. 1(b) is a schematic sectional view of a sample where a first transparent conducting film consisting of ITO is formed on the a-SiC film;

FIG. 1(c) is a schematic sectional view of a sample where the first transparent conducting film is pattern-etched by the aqueous solution of ferric chloride (FeCl.sub.3);

FIG. 1(d) is a schematic sectional view of a sample where the a-SiC film/a-Si film/a-SiC film is etched by nitrogen trifluoride (NF.sub.3); the PSG film on the Al wiring is selectively etched to form apertures; and thereby the second transparent conducting film is formed at the surface;

FIG. 1(e) is a schematic sectional view of a sample where the second transparent conducting film is pattern-etched by the aqueous solution of FeCl.sub.3 ;

FIG. 2(a) is a schematic sectional view of a sample where an interfacial reacted layer is formed at the interface between the first transparent conducting film and the a-SiC film;

FIG. 2(b) is a schematic sectional view of a sample where the lateral etching proceeds in the region wherein ITO does not react with Si among the a-SiC film, and only the interfacial reacted layer remains unetched and is left on the a-SiC film;

FIG. 3(a) is a schematic sectional view of a sample where interfacial reacted layer is generated at the interface between the second transparent conducting film and the PSG film;

FIG. 3(b) is a schematic sectional view of a sample where only the ITO film is etched in lateral and the Al wiring is exposed;

FIG. 4(a) is a schematic sectional view of a sample immediately before formation of the transparent conducting film after a multilayered film consisting of a-SiC film/a-Si film/a-SiC film is formed as the light receiving part;

FIG. 4(b) is a schematic sectional view of a sample where the first transparent conducting film consisting of an ITO film is formed on the a-SiC film by the sputtering method;

FIG. 4(c) is a schematic sectional view of a sample where the ITO film is pattern-etched by the 35% aqueous solution of ferric chloride (FeCl.sub.3);

FIG. 4(d) is a schematic sectional view of a sample where a interfacial reacted layer is pattern-etched by the plasma etching method using the nitrogen trifluoride (NF.sub.3);

FIG. 4(e) is a schematic sectional view of a sample where the multilayered film consisting a-SiC film/a-Si film/a-SiC film is etched, the PSG film on the Al wiring is selectively etched to form an aperture, and thereafter the second transparent conducting film consisting of ITO film is formed by the sputtering method;

FIG. 4(f) is a schematic sectional view of a sample where the ITO film is pattern-etched by the 35% aqueous solution of ferric chloride (FeCl.sub.3);

FIG. 4(g) is a schematic sectional view of a sample where an interfacial reacted layer is etched by the plasma etching method using NF.sub.3 and thereby leadout electrodes are formed;

FIG. 5(a) is a schematic sectional view of a sample where the ITO layer is etched by the 35% aqueous solution of ferric chloride (FeCl.sub.3) and a interfacial reacted layer remains almost unetched;

FIG. 5(b) is a schematic sectional view of a sample showing that the amount of side etching of the ITO film is remarkably less even after the interfacial reacted layer is etched by NF.sub.3 ;

FIG. 6(a) is a schematic sectional view of a sample where the ITO film formed on the PSG film is pattern-etched by the 35% aqueous solution of ferric chloride (FeCl.sub.3) and an interfacial reacted layer remains almost unetched;

FIG. 6(b) is a schematic sectional view of a sample showing that the amount of side etching of the ITO film is remarkably less even after the interfacial reacted layers etched by NF.sub.3 ; and

FIG. 7 is a graph indicating the current-voltage characteristics of photo current and dark current of the a-Si photodiode to which the present invention is applied.

The preferred embodiment of the present invention will be explained with reference to FIGS. 4 to 7. The like elements are denoted by the like reference numerals in above figures.

FIGS. 4(a) to 4(g) are schematic sectional views for explaining an embodiment in such a case that the etching method of the transparent conducting film of the present invention is applied to a method of fabricating an imaging device.

FIG. 4(a) indicates the condition immediately before the transparent conducting film is formed and after a multilayered film consisting of the a-SiC film/a-Si film/a-SiC film is formed as the light receiving part.

In FIG. 4(a), the reference numeral 13 denotes a Si substrate; 14, a SiO.sub.2 film for device separation; 15, an interlayer insulation film; 16, a transistor for amplification; 17, Al wiring; 18, a PSG film for flattening; 19, a light receiving region consisting of a-SiC film/a-Si film/a-SiC film. A collector electrode for charges generated through photoelectric conversion, a diode for charge storage and a CCD for charge transfer are not illustrated.

A sample as shown in FIG. 4(b) is put into the sputtering apparatus and is kept at the temperature of about 150.degree. C. During this period, the first transparent conducting film consisting of ITO film is formed on the a-SiC film 19d by the sputtering method. In this case, an interfacial reacted layer 20a of Si and ITO is formed at the interface between the a-SiC film 19d and the first transparent conducting film 20. A part 20b of the ITO where no interfacial reacted layer exists is left at the upper layer.

As shown in FIG. 4(c), a resist pattern 21 is formed on the ITO film 20b and the ITO film 20b is etched, first, at 30.degree. C. to 60.degree. C. by the aqueous solution of ferric chloride (FeCl.sub.3) with this resist pattern 21 used as the mask. The most desirable temperature is 40.degree. C. Moreover, concentration of this aqueous solution is allowed in the range from 30% to 40% but the most desirable concentration is 35%. In this case, the etching rate is 200.about.1000 .ANG./min. As the etchant, hydrochloric acid (HCl), or a mixed acid of hydrochloric acid and nitric acid (HNO.sub.3), hydroiodic acid (HI) and hydrobromic acid (HBr) may also be used, in addition to the ferric chloride aqueous solution.

Thereafter, as shown in FIG. 4(d), the interfacial reacted layer 20a is etched by the plasma etching method using the nitrogen trifluoride (NF.sub.3) gas. The conditions of this plasma etching are as follow, for example. The NF.sub.3 of 150 SCCM is supplied to the plasma etching chamber and the pressure is kept at 0.3 to 1.0 Torr but the most desirable pressure is 0.6 Torr. The sample is kept at 60.degree. C. The plasma generating frequency is 13.56 MHz and the power is ranged from 0.05 W/cm.sup.2 to 0.3 W/cm.sup.2. Under these conditions, the etching rate for a-Si is set at 2000 .ANG./min.

As shown in FIG. 5(a), the interfacial reacted layer 20a is almost unetched and remains after the etching by the 35% aqueous solution of the ferric chloride (FeCl.sub.3) and therefore the etching process is switched to the plasma etching. The Si included in the interfacial reacted layer 20a is etched because it reacts with NF.sub.3 to generate silicon tetrafluoride (SiF.sub.4). Therefore this etching is carried out at the adequate etching rate. Accordingly, the side etching amount of ITO film 20b can be reduced remarkably as shown in FIG. 5(b).

Therefore, the first transparent conducting film 20 can be patterned with high accuracy in line with the resist pattern 21. Moreover, since the light receiving part 19 under the resist pattern 21 is always covered with the ITO film 20b, deterioration of hetero junction at the light receiving part can be prevented. Thereafter, as shown in FIG. 4(e), the a-SiC film 19d/a-Si film 19c/a-SiC film 19b are etched under similar conditions and the PSG film 18 on the Al wiring 17 is selectively etched to form the aperture 22. The sample is then put into the sputtering apparatus, and kept at 150.degree. C., and the second transparent conducting film 23 consisting of ITO film is formed by the sputtering method. Thereby, the Al wiring 17 and the second transparent conducting film 23 are connected through the aperture 22. In this process, like the process of FIG. 4(b), the interfacial reacted layer 23a produced by reaction of Si included in the PSG film 18 and ITO is formed at the interface of the PSG film 18 and the second transparent conducting film 23. The ITO film 23b other than the interfacial reacted layer 23a remains on the upper layer of second transparent conducting film 23 without generating a interfacial reacted layer by reaction.

Next, as shown in FIG. 4(f), after the resist pattern 24 is formed on the second transparent conducting film 23, the ITO film 23b is etched by the aqueous solution of ferric chloride (FeCl.sub.3) with such resist pattern 24 used as the mask. As shown in FIG. 6(a), the interfacial reacted layer 23a is not easily etched by the aqueous solution and remains as it is.

Thereafter, as shown in FIG. 4(g), the interfacial reacted layer 23a is etched by the plasma etching method using NF.sub.3 to form a leadout electrode 23c. Also, in this case, because the interfacial reacted layer 23a includes Si, NF.sub.3 has the adequate etching rate for the interfacial reacted layer 23a. As shown in FIG. 6(b), the interfacial reacted layer 23a and ITO film 23b are patterned with high accuracy depending on the resist pattern 24, and the Al wiring 17 as the lower layer is never etched, unlike FIG. 3(b).

Finally, the resist pattern 24 is removed to complete an imaging device.

FIG. 7 shows respective current-voltage characteristics of the photo current (I.sub.Ph) and dark current (I.sub.d) of the a-Si photo diode fabricated through application of the present invention. Also in FIG. 7, the current-voltage characteristics of the photo current (I.sub.Ph) and dark current (I.sub.d) of the a-Si photo diode fabricated through the conventional etching method are shown for the purpose of comparison. In this figure, a curve (1) is the current-voltage characteristic of the a-Si photo diode fabricated by the etching method of the present invention, while a curve (2) is the current-voltage characteristics of the same a-Si photo diode fabricated by the conventional etching method. As is obvious from this figure, ld and l.sub.pN of the a-Si photo diode fabricated by the etching method of the present invention show only a small change in the voltage range from 0 to 10 volts. This means that the etching method of the present invention nearly eliminates any increase of leak current.

In this embodiment, NF.sub.3 has been used as the gas for plasma etching the interfacial reacted layer of ITO and Si, but following gases also provide similar effect as NF.sub.3. In this case, the other conditions may be the same as that for NF.sub.3 or may be slightly changed as required.

The gas for plasma etching the interfacial layer may include florine (F.sub.2), nitrogen triluoride (NF.sub.3), tetrafluoromethane (CF.sub.4), hexafluoroethane (C.sub.2 F.sub.6), octafluoropropane (C.sub.3 H.sub.8), hydrogen fluoride (HF), chlorine (Cl.sub.2), tetrachloromethane (CCl.sub.4), hydrogen chloride (HCl), dichlorosilane (SiH.sub.2 Cl.sub.2), tetrachloro-difluoroethane (C.sub.2 F.sub.2 Cl.sub.4), trifluoromethane (CHF.sub.3), bromine (Br.sub.2), and hydrogen bromide (HBr).