US 5,082,747 AGrant

Magnetic Recording Disk and Sputtering Process and Apparatus for Producing Same

Issue Date:1992-01-21

•24 Claims

•12 Drawing Sheets

Abstract

A magnetic thin film recording disk includes a substrate of a hard electroless plated nickel surface that has been textured to encourage a circular anisotropic orientation of crystal growth during a pass-by sputtering in a continuous production line. A thin film chromium nucleating layer that is substantially free of any oxidation that would affect the recording properties is subsequently deposited, and then a thin film magnetic layer of a cobalt alloy, having a desired circular anisotropic crystal growth, is deposited through the sputtering process. The resulting magnetic thin film recording disk is then coated with a thin film of a carbon protective material.

Metadata

Inventor

Virgle L. Hedgcoth

Application Information

Application Number:US 4643399

Filing Date:1990-01-12

Priority Date:1985-11-12

Art Unit:111

Classifications

IPC:

H01F 100

Field of Search:

428612;634;611;627;651;652;667;928;65;336;409;694;198;900

Patent Drawings (12 sheets)

Description

Brief Description of the Drawings

FIG. 1 is a schematic illustration of a direct current planar magnetron sputtering process line;

FIG. 2 is a schematic perspective view of the production line;

FIG. 3 is a cross-sectional diagram of a magnetic film recording disk of the present invention;

FIG. 4 is a graph of a one revolution read/back voltage envelope showing amplitude modulation characteristics of a recording disk as a result of sputtering at a low argon pressure;

FIG. 5 is a one revolution read back voltage envelope showing amplitude modulation characteristics as a result of the sputtering process being conducted in a high pressure argon gas;

FIG. 6 is a graph of amplitude modulation versus argon sputtering pressure;

FIG. 7 is a graph of switching field distribution versus argon sputtering pressure;

FIG. 8 is a graph of switching field distribution versus radial roughness;

FIG. 9 is a schematic illustration of process for applying circumferential texturing to a disk substrate;

FIG. 10 is a graph of coercivity versus thickness of the chromium layer;

FIG. 11 is a perspective view of a cobalt nickel crystal structure;

FIG. 12 is a perspective view of a chromium crystal structure, and

FIG. 13 is a combined graph of the hysteresis loop and the relationship of switching field distribution.

Description of the Preferred Embodiments

The following description is provided to enable any person skilled in the thin film deposition art to make and use the invention and sets forth the best modes contemplated by the inventor of carrying out his invention. Various modifications, however, will remain readily apparent to those skilled in these arts, since the generic principles of the present invention have been defined herein specifically to provide a relatively economical process for manufacturing thin film magnetic disks of an improved structure on a production basis. Referring to FIGS. 1 and 2, a direct current planar magnetron sputtering production assembly line 2 is shown and comprises from left to right a loading table 4 for receiving a disk carrier 6, an entrance lock chamber 8 having an outer entrance lock 10 and an inner entrance lock 12.

The main deposition chamber 14 is subdivided into a preliminary chamber 16 and sputtering chambers 18, 20 and 22, respectively. An exit chamber 24 is the final chamber of the main deposition chamber 14 and is positioned before the exit lock chamber 26. Finally, an unload table 28 is provided along the production line.

As can be seen, the disk carrier 6, which is a flat multi-operational metal support plate, is transported through a series of rollers in a uni-directional travel from the load table 4 to the unload table 28. An inner lock valve 30 and an exit lock valve 32 are positioned on either side of the exit lock chamber 26. The main deposition chamber 14 includes a series of partition walls having central apertures for dividing the respective sputtering chambers. A rotary mechanical pump (not shown) is used to lower the pressure in the entrance lock chamber 8 to a pressure of about 0.5.times.10.sup.-2 torr. Subsequently, a cryogenic pump continues to lower the pressure to 2.times.10.sup.-5 torr, prior to the entrance lock chamber 8 being backfilled with relatively pure argon (99.99%) at a pressure of 2.times.10.sup.-2 torr. The entrance lock chamber pump 34 is complemented with a pair of main deposition chamber pumps 36 and 38. Finally, an exit lock chamber pump 40 is provided to evacuate the exit lock chamber 26.

The disk carrier 6 is particularly designed to be maintained in a vertical plane as it passes through the main desposition chamber 14. The first sputtering chamber 18 is provided with four direct current planar magnetron sputtering sources 42 for providing a nucleating layer. The sources 42 are approximately five inches wide by fifteen inches in length and are approximately 3/8 of an inch thick with direct water cooling. The main deposition chamber 14 is also filled with argon at a pressure of 2.times.10.sup.-2 torr. This pressure range is relatively high for a DC planar magnetron sputtering system since it is usually preferably to operate at a much lower pressure to maximize the deposition rate of the target material. The use of the relatively high pressure of argon gas for a DC planar magnetron sputtering procedure is specifically to prevent direct collision of the ions with the substrate disk at low angles of incidence as the disk carrier 6 progressively moves through the assembly line 2. Usually the speed of the substrate transport system for the disk carrier 6 is a velocity within a range of 1 to 10 mm/sec, with a typical average speed of 3 mm/sec.

The next sputtering chamber 20 provides the magnetic layer and includes two magnetron sputtering sources 44 positioned on either side of the line of travel of the disk carrier 6. The target dimensions are approximately the same as the nucleating targets 42 and can, for example, be cobalt/nickel alloy source 44. Finally, sputtering chamber 22 includes a protective coating source 46, such as carbon, that again comprises a pair of sources one on each side of the line of travel of the disk carrier 6. Each of the sources are essentially line sources with cosine distribution of their emission profile. The target spacing for an opposing pair is 51/2 inches with a target to substrate spacing of approximately 21/2 inches preferred. The target source to substrate distance is preferably maintained within a range of 2 to 4 inches.

The direct current planar magnetron sources 42, 44 and 46 can use both permanent magnets or electro magnets for plasma confinement. Each source is independently powered by constant current 10 kw direct power supply.

Referring to FIG. 3, a substrate 50 can be selected from glass, an electroless plated nickel over aluminum alloy 15 where the aluminum alloy is 5086, pure aluminum or a polycarbonate or a polyetheramide plastic. The substrate dimensions can be in the range of 95 mm to 230 mm in outer diameter with a thickness of 0.035 to 0.080 inches. The arithmetic average of the substrate smoothness should be about 75 to 100 angstroms. The nuclearing layer 52 can be selected from chromium and titanium. Preferably, chromium is selected in the preferred embodiment.

As shown in FIG. 12, the chromium underlayer 52 provides a BCC (body centered cubic) structure with a (110) orientation of its crystalographic plane parallel to the plane of the substrate disk 50. This (110) orientation provides the appropriate lattice parameter to initiate the epitaxial growth in the magnetic thin film layer of a HCP (hexagonal close packed) phase with a (101 0) orientation that is the "C" axis is parallel to the substrate 50. Reference can be had to FIG. 11 to show such an orientation of a cobalt/ nickel alloy. As can be appreciated by these skilled in this field, it is highly desirable to have the hexagonal close pack phase (HCP) of the magnetic thin film layer orientated parallel to the plane of the disk for longitudinal recording. Generally, the depositing of the magnetic film material, such as the cobalt/nickel film, directly on a glass or aluminum substrate will obtain a FCC (Face Center Cubic) structure. However, the use of a nucleating layer will provide the preferred orientation.

The thickness of the nucleating layer of chromium is within a range of 1000 to 5000 angstroms. A preferred thickness for the nucleating layer can be approximately 3000 angstroms of chromium. The magnetic layer 54 can be selected from one of cobalt, a cobalt/nickel alloy, a cobalt/chromium alloy and a cobalt/vanadium alloy. In the cobalt/nickel alloys a range of 0 to 35% nickel and 65% to 100% cobalt could be utilized while in the cobalt/chromium alloys a range of 5 to 25% chromium could be utilized, and in the cobalt/vanadium alloys a 5 to 25% range of vanadium could be utilized. The thickness of the magnetic layer is approximately 200 to 1200 angstroms and is preferably in the range of approximate 750 angstroms.

Finally, a protective overcoat 56 is provided for wear resistance and corrosion resistance. It is believed that titanium carbide, Boron carbide and tungsten carbide could be utilized. The preferred protective overcoating is carbon having a layer thickness in the range of 200 to 800 angstroms with 300 angstroms being an approximate preferred coating thickness.

To achieve a high volume production with a continuous on-line sputtering process, disk carriers 6 are progressively moved through apertures in each of the sputtering chambers 18, 20 and 22. The purpose of providing a nucleating layer 52 is to permit a "C" axis texture to be formed in the subsequent magnetic layer 54 in a random manner. A problem has occurred, however, in that an anisotropic "C" axis texture is promoted by an early arrival of chromium atoms as the substrate enters through the aperture of the chamber 18 and the very large angle of incidence resulting from the movement of the substrates during the constant sputtering process. This anisotropy of the "C" axis causes an anisotropy of coercivity which will produce a severe once around amplitude modulation in an output signal recorded on the magnetic layer 52. This is a particularly objectionable property for a high density longitudinal recording. This problem is graphically disclosed in FIG. 4 wherein a plus or minus 25% amplitude modulation has been experienced.

The present invention by providing a relatively high argon pressure relative to a direct current planar magnetron sputtering process, removes this problem of anisotropic orientation by providing a random distribution of the sputtered atoms (presumably resulting from a collisional phenomena with the argon atoms at the relatively high pressure). Referring specifically to FIG. 6, the relationship between the amplitude modulation of the read/back voltage and the argon sputtering pressure is graphically disclosed. As can be seen from this graph, higher pressure reduced the modulation while lower pressures would increase the modulation.

Referring to FIG. 7, the relationship to switching field distribution (SFD) is disclosed for the magnetic layer as it varies with the argon sputtering pressures. The SFD ar lower pressures is correspondingly low, and at the higher pressures the SFD value is high. It is believed that this occurs because the larger and more uniform grain size is promoted at lower pressures and more variant grain sizes are promoted at higher pressures.

A lower SFD value, typically below 0.20 is particularly advantageous for high density magnetic recording since such values allow a high resolution of the recording bit transitions. By comparing FIGS. 6 and 7, it can be seen that the low argon pressures have an advantage with regard to the SFD value but provide a disadvantage with regard to amplitude modulation. Thus, a design factor in the present invention is a compromise in providing an argon pressure such as a range of 2.0 to 4.0.times.10-2 torr. In operation, the present invention could utilize a plasma gas pressure range from 1.times.10.sup.-2 torr. Operation below 1.times.10.sup.-2 torr can increase the amplitude modulation by a +15% operation above 7.5.times.10.sup.-2 torr permits the columnar structure of the thin film to become too porous and rough for permitting the recording head to fly close to the disk surface. As those skilled in the art know, the closer the recording head can fly to the recording disk, the more efficient will be the read and write recording. Recording heads typically fly above the surface of the disk, supported by an air cushion at a distance of 6 to 12 micro inches. Irregularities on the surface of the recording disk that could interfere or contact the recording head must be avoided.

FIG. 4 and FIG. 5 are representations of oscilloscope voltage traces for one revolution of travel around a disk circumference while sending the read/back signal from a high frequency 2 F MFM written pattern. FIG. 4 shows the read/back voltage modulated by +25% which is an unacceptable value for present day magnetic recording read/write channels.

FIG. 5 shows the read/back voltage modulated by +5% which is a value necessary for the highest performance from a magnetic recording disk device.

The read/back signal amplitude modulation shown in FIG. 4 is caused by anisotropic orientation of the HCP "C" axis of the cobalt/nickel layer shown in FIG. 11. This anisotropic orientation is in the plane of the disk parallel to the direction of traverse passing the sputtering sources due to the sputtering of all layers at lower pressures (typically below 2.0.times.10.sup.-2 torr) and consequently inducing a low angle of incidence columnar film growth in preference to the direction of the substrate as it passes the sources.

This HCP "C" axis anisotropy causes the resulting film coercivity to have a similar directional anisotropy and consequently causes variations in the read/back signal voltage at varying circumferential positions as the head travels around the disk in one revolution.

FIG. 5 shows a reduced modulation amplitude of the read/back voltage signal due to a sputtering operation at higher pressures (typically 2.0.times.10.sup.-2 to 4.0.times.10.sup.-2 torr).

Sputtering at these higher pressures causes collisional scattering of sputtered atoms before they reach the substrate and hence a more random film structure, which includes the random orientation of the HCP "C" axis of the cobalt/nickel layer in the plane of the disk, thereby eliminating any low angle of incident effects.

To improve the magnetic recording density, it is important to provide a relatively high squareness to the hysteresis loop as disclosed in FIG. 13. The randomizing of the "C" axis by the increased gas pressure of the present invention lowers the amplitude modulation but only provides a modest squareness to the hysteresis loop.

The present invention has discovered that circumferential texturing or abrading of the disk surface can cause the "C" axis to orientate in a circumferential direction and thereby supply a more intense uniform continuous read/back signal to the flying head with a resulting very square hysteresis loop. Thus, a preliminary abrading of the substrate as shown in FIG. 9 is an advantage of the present invention. As mentioned earlier, one of the design goals in this art is to permit the recording head to fly as close as possible to the surface of the recording disk. The abrading step on the substrate would appear to be contrary to this teaching. In fact, excessive roughness to the substrate will provide a limitation to the closeness by which the head can fly to the finished recording disk.

In FIG. 9, a substrate 58, such as a nickel plated aluminum member is positioned on a rotating shaft 60 and rotated at a speed less than 200 rpm. A diamond impregnated polyester tape 62 is applied to both sides of the disk substrate 58 to abrasively remove the nickel plating from the substrate in the shape of concentric grooves 66 roughly proportional to the size of the diamond abrasive in the tape. Generally, the particle size of the abrasive is typically in the range of 0.1 to 1.0 microns. This circumferential texturing can be accomplished by rotating the substrate 58 while pressing the diamond impregnated polyester tape 62 against both sides of the disk in the presence of a fluid coolant, like kerosene, supplied through a nozzle 64. The coolant not only controls the temperature of the abrading process but also acts to remove any microscopic abraded debris.

Referring to FIG. 8, the relationship between the switching field distribution (SFD) and the radial roughness of the finished disk due to circumferential texturing is disclosed. As the disk surface radial roughness increases due to a deliberate circumferential grooving the SFD decreases. A low SFD is a desirable parameter for high density recording. It is believed that the physical cause of this effect is the preferential orientation of the "C"--axis of the HCP phase of, for example, a cobalt/nickel magnetic layer along a circumferential textural line. It is also believed that this occurs primarily due to any shadowing effects of the hills and valleys of the texturing. The roughness factor should be in the range of 50 to 500 angstroms. A roughness factor below 50 angstroms promotes higher switching field distribution and permits a more random "C" axis orientation. A roughness or hill-to-valley distance above 500 angstroms can interfere with the fly characteristics of the recording head.

Referring again to FIGS. 1 and 2, a substrate disk, such as an electroless plated nickel over aluminum alloy, with the aluminum alloy being 5086 can be circumferentially textured as shown in FIG. 9 to a radial roughness factor of 200 angstroms prior to being loaded on to the disk carrier 6. Usually, the substrates are preparatorily cleaned with deionized water, a detergent of a non-ionic surfactant and ultrasonics (10 to 60 kilohertz). The substrates can also be inserted into a vapor phase of a trichlorotrifluoroethane vapor dryer. The substrate can also be preliminarily heated to 100 degrees Centrigrade as an additional preparatory step.

The cleaned and heated substrate can then be loaded onto disk carrier 6 which then subsequently enters the entrance lock chamber 8, and when the outer door is closed the entrance lock chamber can be evacuated by a rotary mechanical pump and then subsequently by a cryogenic pump 34. The lock chamber 8 is filled with argon gas at a pressure of 2.times.10.sup.-2 torr. The main deposition chamber 14 has been previously evacuated and pumped to a base pressure of 2.times.10.sup.-7 torr as a result of the two cryogenic pumps 36 and 38. This chamber is also filled with argon gas at a pressure of 2.times.10.sup.-2 torr. The disk carrier 6 then moves at a constant velocity through the respective sputtering chambers 18 through 22. Power is supplied to all of the sputtering sources, as more particularly seen in FIG. 2 and a plasma is initiated over each source to commence the sputtering. The entrance lock inner door or valve 12 opens and the vertically orientated disk carrier 6 moves forward at a speed of approximately 3 mm/sec. 3 kw of power are supplied to each of the four chromium sources 42 which are utilized for the nucleating layer 52 as shown in FIG. 3. 2.5 kw of power is supplied to each of the two cobalt/nickel layer sources and 2.5 kw is supplied to each of the two carbon protective layer sources. As the disk carrier 6 traverses past each of the deposition sources, they are uniformly coated, first with a nucleating layer 52, then the magnetic layer 54 and finally the protective layer 56. The actual substrate temperature will advantageously be maintained by a heater 15 in a temperature range of 75 degrees Centigrade to 250 degrees Centigrade. A temperature below 75 degrees Centigrade will not permit a reliable adhesion of the thin film layers while a temperature above 250 degrees Centigrade can create a warp in the substrate disk and can cause the nickel phosphorous layer to become magnetic. It is believed that this may be caused by the migration of the phosphorous to the grain boundaries at the higher temperature.

The actual thickness layer of the nucleating layer of chromium is within the range of 1000 to 5000 angstroms, and FIG. 9 discloses a graph of coercivity versus the chromium layer thickness. This graph was derived for a cobalt/nickel 80:20 alloy thickness with an argon pressure of 2.times.10.sup.-2 torr and a substrate temperature of 200 degrees Centigrade. As can be seen, for a given cobalt/nickel layer thickness coercivity increases with increasing chromium thickness and for a given chromium thickness coercivity decreases with an increasing cobalt/nickel thickness.

A magnetic layer, such as a cobalt/nickel alloy is deposited within the range of 200 to 1500 angstroms, and finally a protective coating, such as carbon, is deposited within the range of 200 to 800 angstroms. The disk carrier then transports the finished coated magnetic recording disk to the exit lock chamber 26 which has been previously evacuated and pumped to 2.times.10.sup.-5 torr and then back filled with argon to 2 .times.10.sup.-2 torr. The interlock valve 30 is closed and the exit lock 32 is vented to atmospheric pressure with argon in less than 20 seconds. The disk carrier 6 exits the exit lock 32 and the finished recording disks are unloaded for quality control testing. The empty disk carriers 6 are returned for reloading for a subsequent production cycle.

Referring to FIG. 13, the switching field distribution (SFD) defines a measure of the change in the drive field requirements to switch the magnetic domains of the magnetic layer. Graphically, this parameter is defined by means of an unintegrated differential curve. By constructing a horizontal line at a vertical coordinate of one half the peak value, two points of the intersection result are defined as the horizontal distance between these points. Delta H is defined as the horizontal distance between these points. SFD is defined as divided by the coercivity Hc. Hc is shown as the width of the hysteresis loop shown at the bottom of the graph of FIG. 13.

While the above features of the present invention teach apparatus, process and an improved magnetic recording disk, it can be readily appreciated that it would be possible to deviate from the above embodiments of the present invention and, as will be readily understood by those skilled in the art, the invention is capable of many modifications and improvements within the scope and spirit thereof. Accordingly, it will be understood that the invention is not to be limited by the specific embodiments but only by the spirit and scope of the appended claims.

Claims

I claim:

1. A magnetic thin film recording disk comprising: a substrate having an electroless plated nickel surface layer, the substrate including aluminum, the substrate characterized by a physically abraded surface having a series of physical circumferential texturing of hills and valleys prior to any sputtering operation to encourage a circular anisotropic orientation of crystal growth during sputtering, the hill-to-valley distance being within the range of 50 to 500 Angstroms; a thin film chromium nucleating layer having a body centered cubic structure with a (110) orientation of its crystalographic plane parallel to a plane of the substrate; a thin film magnetic layer of a cobalt alloy disposed on the nucleating layer with an epitaxial growth of a hexagonal close packed phase with a C axis parallel to the plane of the substrate, and a thin film carbon protective film disposed on the magnetic layer.

2. The recording disk of claim 1 wherein a magnetic switching field distribution is less than 0.20.

3. The recording disk of claim 1 wherein the substrate is a 5086 aluminum alloy.

4. The recording disk of claim 1 wherein the cobalt alloy layer has a (1010) phase orientation.

5. The recording disk of claim 1 wherein the hill-to-valley distance is less than 500 Angstroms.

6. The recording disk of claim 1 wherein the hill-to-valley distance is approximately 200 Angstroms or less.

7. The recording disk of claim 6 wherein the chromium nucleating layer is substantially free of any oxidation that would effect the recording properties.

8. The recording disk of claim 1 wherein the carbon layer is within 200 to 800 Angstroms in thickness.

9. The recording disk of claim 1 wherein the thickness of the magnetic layer is approximately 750 Angstroms.

10. A magnetic thin film recording disk comprising: a polycarbonate substrate having an arithmetic smoothness of approximately 75 to 100 Angstroms, the substrate having circumferential features of hill-to-valley sizes of 50 to 500 Angstroms; a first metallic nucleating layer over the polycarbonate substrate; a second coating layer over the first coating layer, the second coating layer forming a thin film magnetic layer of a cobalt alloy, and a third coating layer over the second coating layer.

11. The recording disk of claim 10 wherein a magnetic switching field distribution is less than 0.20.

12. The recording disk of claim 10 wherein the cobalt alloy layer has a (1010) phase orientation.

13. The recording disk of claim 12 wherein the hill-to-valley distance is less than 500 Angstroms.

14. The recording disk of claim 12 wherein the hill-to-valley distance is approximately 200 Angstroms.

15. The recording disk of claim 12 wherein the carbon layer is within 200 to 800 Angstroms in thickness.

16. The recording disk of claim 15 wherein the thickness of the magnetic layer is approximately 750 Angstroms.

17. A magnetic thin film recording disk comprising: a substrate including a glass material, the substrate characterized by a surface having circumferential texturing of hills and valleys prior to any sputtering operation to encourage a circular anisotropic orientation of crystal growth during sputtering, the hill-to-valley distance being within the range of 50 to 500 Angstroms; a thin film chromium nucleating layer deposited on the substrate surface having a body centered cubic structure with a (110) orientation of its crystalographic plane parallel to a plane of the substrate; a thin film magnetic layer of a cobalt alloy disposed on the nucleating layer with an epitaxial growth of a hexagonal close packed phase with a C axis parallel to the plane of the substrate and a (1010) phase orientation, and a thin film carbon protective film disposed on the magnetic layer.

18. The recording disk of claim 17 wherein the hill-to-valley distance is 200 Angstroms or less.

19. The recording disk of claim 17 wherein a magnetic switching field distribution is less than 0.20.

20. The recording disk of claim 17 wherein the hill-to-valley distance is approximately 200 Angstroms.

21. The recording disk of claim 20 wherein the carbon layer is within 200 to 800 Angstroms in thickness.

22. The recording disk of claim 21 wherein the thickness of the magnetic layer is approximately 750 Angstroms.

23. A magnetic thin film recording disk comprising: a substrate having an electroless plated nickel surface layer, the substrate including aluminum, the substrate characterized by a physically abraded surface having a series of physical circumferential texturing of hills and valleys prior to any sputtering operation to encourage a circular anisotropic orientation of crystal growth during sputtering, the hill-to-valley distance being within the range of 50 to 500 Angstrom; a thin film chromium nucleating layer having a body centered cubic structure with a (110) orientation of its crystalographic plane parallel to a plane of the substrate; a thin film magnetic layer of a cobalt alloy disposed on the nucleating layer with an epitaxial growth of a hexagonal close packed phase with a C axis parallel to the plane of the substrate, and with a cobalt concentration greater than 65 wt. %; and a thin film carbon protective film disposed on the magnetic layer.

24. A magnetic thin film recording disk comprising: a substrate having an electroless plated nickel surface layer, the substrate including aluminum, the substrate characterized by a physically abraded surface having a series of physical circumferential texturing of hills and valleys prior to any sputtering operation to encourage a circular anisotropic orientation of crystal growth during sputtering, the hill-to-valley distance being 200 Angstroms or less; a thin film chromium nucleating layer having a body centered cubic structure with a (110) orientation of its crystalographic plane parallel to a plane of the substrate, the chromium film layer being substantially free of any oxidation that would affect the recording properties; a thin film magnetic layer of a cobalt alloy disposed on the nucleating layer with an epitaxial growth of a hexagonal close packed phase with a C axis parallel to the plane of the substrate, and with a cobalt concentration greater than 65 wt. %; and a thin film carbon protective film disposed on the magnetic layer.

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Abstract

Description