US 5,079,129 AGrant
Negative Photoresist Based on Polyphenols and Epoxy Compounds or Vinyl Ethers
Issue Date:1992-01-07
•13 Claims
Abstract
The present invention relates to a negative photoresist consisting essentially of The resist can be developed under aqueous-alkaline conditions. a) at least one solid film-forming polyphenol, b) at least one compound which contains at least two epoxide groups or at least two vinyl ether groups or at least one epoxide and vinyl ether group in the molecule, c) at least one cationic photoinitiator for component b) and d) if appropriate customary additives.
Metadata
Assignee
- Ciba-Geigy Corporation
Inventors
- Martin Roth
- Kurt Meier
Application Information
Application Number:US 4451341
Filing Date:1989-11-30
Priority Date:1986-08-06
Art Unit:157
Classifications
IPC:
G03F 7029G03F 7033G03F 7037G03F 7004
Field of Search:
430522280;288;281;176;90531;66;121;120;129;141;142;146
Patent Drawings
This patent does not have any drawings.
Description
Preparation Examples
Example 1
Copolymer of p-maleimidylphenol and butyl vinyl ether: ##STR10##
The following components are introduced into a 2.5 liter sulfating flask equipped with a stirrer, thermometer, reflux condenser and nitrogen inlet and outlet:
After rendering the system inert with nitrogen, the suspension is heated by an oil bath, while stirring. At an internal temperature of about 66.degree. , the polymerization starts with considerable generation of heat. The oil bath is removed and the mixture is cooled with an ice bath until the vigorous reflux of the MEK subsides. The mixture is then heated by the oil bath at a temperature of 75.degree. for 7 hours. GPC then shows virtually complete conversion of the monomer.
For analytical purposes, a sample of the polymer solution is precipitated in water and the solid polymer is filtered off and dried in vacuo (0.01 mbar) at 130.degree. C. for several hours.
M.sub.w =80430 GPC, polystyrene standards
M.sub.n =32336 GPC, polystyrene standards
Hydroxyl group content =4.10 equivalents/kg (titrimetrically).
USE EXAMPLES
Example I
2 coating formulations are prepared as follows:
A cleaned, copper-lined printed circuit board is coated under yellow light with the solutions in a wet film thickness of 100 .mu.m by means of a doctor blade. The film is dried at 80.degree. C. for 30 minutes. The thickness of the photosensitive coating is about 40 .mu.m. It is exposed through a Stouffer Sensitivity guide (optical density increments = 0.15) in addition to a Stouffer resolution guide. The light source is a 5,000 watt metal-halogen lamp (Sylvania M 061) at a distance of 65 cm from the vacuum frame. The exposure time is 15 seconds. The board is then heated at 100.degree. C. for 10 minutes, cooled to room temperature and developed in developer A at 20.degree. for 90 seconds.
Result
The step wedge copied has 12-13half-tone steps (form Ia) or 13-14 half-tone steps (form Ib). The resist image can be used, for example, as an electroplating resist for the semi-additive technique.
Developer A
75.0 g of sodium metasilicate pentahydrate
0.4 g of Supronic .sup..RTM. B50 (ABM Chemicals Ltd., Stockport Cheshire GB); wetting agent 925.0 g of deionized water
Example II
Coating Solution
Copper-lined laminates are coated with this solution as described in Example I and the film is dried to give a coating about 40 .mu.m thick. After exposure according to Example I, the board is heated at 120.degree. C. for 10 minutes, cooled and developed with dilute developer A (A:H.sub.2 O=1:1).
Result
Exposure time: 15 seconds
Heat treatment: 10 minutes/120.degree.
Development time: Developer A : H.sub.2 O =1:1 v/v 20.degree. C.
60 seconds
Step wedge copied: last step imaged =No. 14
The resist image developed can be used as an etch mask for etching away the copper in customary baths (for example FeCl.sub.3 solution).
Example III
The production of a negative offset plate which can be developed under aqueous-alkaline conditions is described here.
Coating Solution
The coating solution of Example II (40% in MEK/MCS 1:1) is diluted to 10% solids content with MEK/MCS 1:1. The solution is applied to an electrolytically roughened anodized aluminium sheet (offset plate substrate) by means of whirler-coating (30 seconds at 500 revolutions/minute) and is dried at 80.degree. for 15 minutes. A coating weight of 1.3 g/m.sup.2 results. The coating is exposed through a Stouffer test wedge as described in Example I. The light source in this case is a 2,000 Watt metal-halogen lamp at a distance of 75 cm from the vacuum frame. After the exposure, treatment with heat and development are carried out. The developed image is inked with oily black printing ink as is customary in lithography.
Result
Exposure time: 10 seconds
Heat treatment: 10 minutes/120.degree. C.
Development time: Developer A : H.sub.2 O =1:1 v/v 20.degree. C.
45 seconds
Step wedge copied: Last step imaged =No. 13
This printing plate allows a high print run as a result of the good mechanical (wear) properties of the cross-linked image portions.
Example IV ##STR11##
A 2.5 litre, sulfating flask equipped with a stirrer, thermometer, reflux condenser and nitrogen inlet and outlet is charged with the following components:
50.0 g (0.264 mol) of p-maleimidylphenol
270.6 g (2.37 mol) of allyl glycidyl ether
0.9 g of .alpha.,.alpha.'-azobisisobutyronitrile (AIBN).
After the system has been rendered inert with nitrogen, the suspension is heated with an oil bath, while stirring. At an internal temperature of about 70.degree. C., the polymerization starts, with considerable generation of heat. The oil bath is removed and the mixture is cooled with an ice bath for about 10 minutes. It is then heated by the oil bath at a temperature of about 70.degree. C. for 7 hours. The yellowish suspension is introduced into 4,000 ml of toluene, with thorough stirring, and the precipitate is filtered off and dried in vacuo at 60.degree. C. for 14 hours. The solid product is dissolved in acetone and precipitated again from toluene. After drying in vacuo, the colourless solid copolymer is isolated.
Elemental analysis
% found: C 62.07 H 6.60 N 3.92
M.sub.w =4,600 Gel permeation chromatography (polystyrene
M.sub.n =2,529 standards)
Composition of the random copolymer: p-Maleimidylphenol/allyl glycidyl ether = 40.6/59.4 mol % (from elemental analysis)
Epoxide group content, = 3.7 equivalents/kg (titrimetrically)
Coating Solution
A copper-lined laminate is coated with the solution analogously to Example I. Dry coating weight = about 25 g/m.sup.2. After exposure according to Example I, the laminate is heated at 120.degree. C. for 10 minutes and developed with developer A.
Result
Exposure time: 15 seconds
Heat treatment: 10 minutes/120.degree.
Development time: Developer A 20.degree. C. 30 seconds
Wedge copy: Last step imaged = No. 9
Example V
Coating Solution
Processing is carried out analogously to that described under Example I:
Exposure time: 45 seconds;
Curing : 20 minutes at 110.degree. C.
Result: The step wedge copied has 8-9 half-tone steps.
Example VI
Coating Solution
Processing is carried out by a procedure analogous to that described under Example I:
Exposure time: 45 seconds
Curing : 20 minutes at 110.degree. C.
Result: The step wedge copied has 2-3, half-tone steps.
Example VII
Coating Solution
Processing is carried out by a procedure analogous to that described under Example I:
Exposure time: 45 seconds
Curing : 20 minutes at 60.degree. C.
Result: The step wedge copied has 10-11 half-tone steps.
Example VIII
Coating Solution
Processing is carried out by a procedure analogous to that described under Example I:
Exposure time: 45 seconds
Curing : 20 minutes at 100.degree. C. -Result: The step wedge copied has 6-7 half-tone steps.
Example IX
Coating Solution
Processing is carried out by a procedure analogous to that described under Example I:
Exposure time: 45 seconds;
Curing : 20 minutes at 50.degree. C.
Result: The, step wedge copied has 10 half-tone steps.
Example X
Coating Solution
The coating solution is applied to a printed circuit board with a 100.mu. wire doctor. The initially wet film is dried at 80.degree. C. for 30 minutes. Exposure is carried out with the exposure apparatus described in Example I. The board is exposed for 45 seconds through a mask which covers the lands. The exposed board is precured at 110.degree. C. for 10 minutes and then developed in developer A for 90 seconds and post-cured at 135.degree. C. for 1 hour. The board coated with flux (solution of 26 g of pure rosin in 100 ml of isopropanol) is placed with the coating underneath on a hot solder bath (consisting of 50% of lead and 50% of tin) at 270.degree. C.. After 10 seconds, the board is removed from the solder bath, cooled, freed from the flux by washing with isopropanol and dried with compressed air.
Result: The coating shows no visible change such as cracks, bubbles, pores, or adhering residues of tin/lead at all.
Example XI
Example X is repeated with the modification that the epoxide 2,2,6,6-tetra-(2,3-epoxy-1-propoxy-methyl)-cyclohexan-1-ol is replaced by the same amount of glycerol polyglycidyl ether (Grilonit G 1705, EMS-CHEMIE AG). Result: No visible change in the coating after the solder bath (10 seconds/270.degree. C.)
Example XII
Coating Solution
The coating solution is applied to a copper-lined epoxide board with an electrostatic spray coating unit with a high-speed rotating bell (T = 25,000 rpm) under a field strength of 0.3 kV/mm.
After drying at 80.degree. C., a uniform coating 50 .mu.m thick is obtained.
Exposure through a mask with a printed circuit image (45 seconds), curing (20 minutes at 110.degree. C.) and development are carried out according to Example I.
The board is treated in an electroplating copper bath in accordance with the following working plan:
cleaning by dipping for 1 minute in a solution of BUZ-R at 25.degree. C. (Dr. Ing. Max Schlotter GmbH and Co. AG),
rinsing with running water for 1 minute,
gentle etching in a solution of 120 g of ENPLATE AD485 (IMASA AG, Dallikon, Switzerland) and 20 ml of concentrated sulfuric acid per litre of water,
acid copper bath AC from Erne AG, Dallikon, 75 minutes at about 25.degree. C. and a current density of 3 A/dm.sup.2,
rinsing with tap water.
After the board has been subjected to electroplating treatment, the resist shows no damage such as bubbles, cracks and the like and can be removed cleanly by stripping with 1N sodium hydroxide solution/isopropanol 10:1. The copper coating obtained is about 50 .mu.m thick.
Claims
What is claimed is:
1. A composition consisting essentially of a) at least one solid film forming polyphenol which has such a content of phenolic hydroxyl groups to render the composition soluble or swellable in an aqueous-alkaline developer solution, wherein the polyphenol is selected from the group consisting of i) a novolak which is derived from a binuclear or mononuclear substituted or unsubstituted phenol and a C.sub.1 -C.sub.6 alkehyde; ii) a copolymer of a vinyl compound with no carboxyl groups and an alkenylphenol which contains the structural element of formula I ##STR12## in which R is hydrogen or methyl and R.sup.1, R.sup.2 and R.sup.3 independently of one another are hydrogen, C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 -alkoxy, halogen or methylol; and iii) a copolymer of a vinyl compound with no carboxyl groups and a N-hydroxyphenylmaleimide which contains the structural element of formula II ##STR13## wherein R.sup.4 independently is C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 -alkoxy, halogen, m is 1,2 or 3, n is 0,1,2,3 or 4 and the sum of m and n is at most 5; b) at least one compound, different from a), which contains at least two epoxide groups or at least two vinyl groups or at least one epoxide and one vinyl ether group in the molecule, and c) at least one cationic photoinitiator for component b) selected from the group consisting of onium salts with weakly nucleophilic anions and metallocene salts.
2. A composition according to claim 1, in which component b) is at least one compound which contains at least two epoxide groups in the molecule.
3. A composition according to claim 1, in which component b) is derived from a polyglycidyl ether of a novolak formed by reaction of formaldehyde with a phenol, diglycidyl ethers of aliphatic diols and cycloaliphatic epoxy resins.
4. A composition according to claim 1, in which component b) is a polyglycidyl compound which can be dispersed in water in the non-cured state.
5. A composition according to claim 4, in which component b) is a polyglycidyl ethel of tetramethylol-cyclohexanol or -cyclohexanone or a di- or triglycidyl glycerol ether.
6. A composition according to claim 1, in which the photoinitiator c) is selected from the compounds of the formulae XI, XII and XIII ##STR14## in which h is 1 and j is 1 or h is 2 and j is 0, and R.sup.16 and R.sup.17, where h=1 and j=1, independently of one another are monovalent carbocyclic-aromatic C.sub.6 -C.sub.18 radicals which are unsubstituted or carry 1 to 3 substituents, and R.sup.16, in the case where h=2 and j=0, is a divalent, carbocyclic-aromatic C.sub.12 -C.sub.18 radical which is unsubstituted or carries 1 to 3 substituents, R.sup.18, R.sup.19, R.sub.20, R.sub.21 and R.sub.22 independently of one another assume one of the meanings of R.sup.17, L is selected from the group consisting of B, P, As and Sb, Q is a halogen atom, or some of the radicals Q in one anion LQ.sub.M.sup.- can also be hydroxyl groups, and m is an integer which corresponds to the valency of L reduced by one.
7. A composition according to claim 1, in which the photoinitiator c) is a compound of the formula XIV ##STR15## in which s is 1 or 2, t is 1, 2, 3, 4 or 5, X is a non-nucleophilic anion, R.sup.23 is a .pi.-arene and R.sup.24 is an anion of a .pi.-arene.
8. A composition consisting essentially of a) at least one solid film forming polyphenol which has such a content of phenolic hydroxyl groups to render the composition soluble or swellable in an aqueous-alkaline developer solution, wherein the polyphenol is selected from the group consisting of i) a novolak which is derived from a binuclear or mononuclear substituted or unsubstituted phenol and a C.sub.1 -C.sub.6 aldehyde; ii) a homo- or copolymer of an alkenylphenl which contains the structural element of formula I ##STR16## in which R is hydrogen or methyl and R.sup.1, R.sup.2 and R.sup.3 independently of one another are hydrogen, C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 -alkoxy, halogen or methylol; and ii) a homo- or copolymer of N-hydroxyphenylmaleimide which contains the structural element of formula II ##STR17## wherein R.sup.4 independently is C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 -alkoxy or halogen, m is 1 2 or 3, n is 0,1,2,3 or 4 and the sum of m and n is at most 5; b) at least one compound, different from a), which contains at least two epoxide groups or at least two vinyl groups or at least one epoxide and one vinyl ether group in the molecule, and c) a least one cationic photoinitiator for component b) selected from the group consisting of onium salts with weakly nucleophilic anions and metallocene salts; wherein said composition contains 30-100 mol %, based on total polymer, of structural units of the formula II and formula III, the proportion of radicals of the formula II, based on the total amount of II and III, making up 5 to 95 mol % ##STR18## ##STR19## in which A is selected from the group of radicals consisting of halogen, cyano and structural units of the formulae IV to IX ##STR20## in which R.sup.5 and R.sup.7 independently of one another are hydroxyl or glycidyl groups of the formula Xa or Xb ##STR21## R.sup.6 and R.sup.8 independently of one another are C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 -alkoxy or halogen, o and q independently of one another are 0,1,2 or 3, p and r independently of one another are 0,1,2,3,4 or 5, and the sums, o=p and q=r are at most 5, R.sup.9 is hydrogen, C.sub.1 -C.sub.20 -alkyl, a glycidyl radical of the formula Xa or a radical of the formula VII, R.sup.10 is hydrogen, C.sub.1 -C.sub.20 -alkyl, cycloalky with 5 to 7 ring C atoms, phenyl, naphthyl or benzyl, R.sup.11 is hydrogen, C.sub.1 -C.sub.20 -alkyl or a glycidyl radical of the formula Xa and the groups R.sup.12 and R.sup.13 independently of one another are hydrogen, C.sub.1 -C.sub.20 -alkyl, cycloalkyl with 5 to 7 ring C atoms, substituted or unsubstituted aryl or aralkyl or a clycidyl radical of the formula Xa, or, together with the common nitrogen atom, form a five- or six-membered heterocyclic ring, and R.sup.14 and R.sup.15 independently of one another are hydrogen or methyl.
9. A composition according to claim 8, containing copolymers with 50-100 mol %, based on the total polymer, of structural units of the formulae II and III.
10. A composition according to claim 8, in which the binder essentially consists of structural elements of the formulae II and III, the proportion of elements II making up 10-80 mol %, based on the amount of II and III.
11. A composition according to claim 8, in which A is selected from the group consisting of radicals of the formulae IV, V, VI, VIII and IX, R.sup.5 and R.sup.7 are glycidyl groups of the formulae Xa or Xb, R.sup.9, R.sup.11 and at least one of the radicals R.sup.12 or R.sup.13 are a glycidyl group of the formula Xa and o and q independently of one another are 1, 2, or 3.
12. A composition according to claim 8, in which A is a group of the formula VI and R.sup.9 is a group of the formula Xa, or in which A is a group of the formulae IV or V, R.sup.5 and R.sup.7 are glycidyl groups of the formula Xb, o and q are 1 or 2 and p and r are 0.
13. A composition according to claim 8, containing copolymers with at least 50 mol %, based on the total polymer, of structural elements of the formulae II and III and, as the residual amount, structural elements which are derived from vinyl compounds with no carboxyl groups selected from the group consisting of styrene, esters or amides of .alpha., .beta.-unsaturated acids, nitriles of .alpha.,.beta.-unsaturated acids, halogen-containing vinyl compounds, vinyl esters and vinyl ethers.
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