Cuffed Tape Wrap and Fill Wound Capacitor

This invention relates to wrap and fill capacitors, particularly to surface mount wrap and fill capacitors.

Direct mounting of electrical components, such as capacitors, is widely practiced in the production of high density electronic packages. Connections to a circuit board are made by reflow soldering or similar means. Generally, the component has been required to have external terminal leads in order to provide a multiplicity of such components on a board to achieve the desired package density and compatibility with other components. Previous methods of surface mounting wound capacitors are deficient both for relatively high costs and the presence of the protruding terminal leads. Further, many applications involved exposure of the element to environmental stresses which severely strained the element.

U.S. Pat. No. 4,603,373 discloses a metallized wound capacitor in which first and second elongated dielectric webs are convolutely arranged in a capacitor roll. A third dielectric web is wound about the capacitor roll to form a protective wrap. The third web has a first and a second metallic foil band secured to the side of the third web remote from the capacitor roll and each band is disposed adjacent a respective end of the roll. The bands serve as terminals which may be electrically connected to a circuit board. Although this construction offers many advantages, it is not amenable to sealing and, therefore, has limited utility.

A wrap and fill capacitor having a cuffed tape outer wrapping is provided. The cuff comprises a thin conductive foil folded about the sides of a high temperature resistant dielectric tape. The device is particularly suited for surface mounting.

FIG. 1a is a perspective view of an unsealed capacitor element having a thin conductive foil cuff tape wrap.

FIG. 1b is a view of the tape with the cuff prior to wrapping around the capacitor winding.

FIG. 1c is typical capacitor winding.

Referring now to FIG. 1a, the capacitor of this invention comprises a pressed capacitor winding 10 wrapped with a high temperature resistant tape 12 having conductive foil cuffs 14.

The capacitor winding is prepared by methods known to those skilled in the art, typically from strips or webs of a dielectric having electrically conductive material disposed thereon. Usually, two or more such webs are wound together with a layer of dielectric between the conductive layers to insulate the electrodes from each other. Optionally, the capacitor winding may be pressed into some desired shape. Various methods of fabrication and types of materials may be employed in the manufacture of capacitor windings and this invention is not limited to any specific winding technology.

Referring now to FIG. 1b, the high temperature resistant tape 12 is illustrated with conductive cuffs 14 prior to wrapping. The tape is prepared from a high temperature resistant material, such as a polyamide. A preferred polyamide tape is that sold by Dupont under the mark Kapton polyamide. Adhesive is applied to the region of the tape between the cuffs to bond the tape to the capacitor winding. The adhesive may be a pressure sensitive adhesive or a hot melt adhesive. Optionally, adhesive is applied to the interior of the cuff surface to improve the adhesion of the cuff to the tape. There is, however, no adhesive on the exterior surfaces of the cuff. The cuff may be prepared from any flexible conductive material. Metal foil, such as copper or tin-copper foil is preferred. It is not necessary that the cuff be symmetrically disposed about the edges of the tape.

The width of the capacitor winding 10 is such as to fit between foil cuffs 14. After wrapping the capacitor winding with the cuffed tape, the recessed ends of the winding are sprayed with a zinc/tin alloy. The entire device is masked before spraying so as to avoid overspraying the exterior of the device. The spray provides electrical contact between the capacitor winding and the cuff. The ends are then sealed with an appropriate sealing means, such as a high temperature epoxy or silicon resin. The device is then tin zippered to bond the copper to itself and the copper is tin plated. The fully assembled element is thus a sealed capacitor having integrated electrodes, ideally suited for surface mounting.

In one embodiment 0.5 mil thick Cu foil was formed into cuffs extending 1/16 inch around both edges of a 3/8 inch wide, 1 mil thick Kapton polyamide tape having a pressure sensitive adhesive on the tape surface (Permacel 221 tape). A 1/4 inch capacitor winding was then wrapped with 11/2 turns of this tape and the element finished. It is envisioned that this process can be performed continuously with the capacitor winding moving directly to the tape wrapping step.

Although the present invention has been described with reference to particular embodiments, this description should not be construed as placing any undue limitations on the invention as claimed herein.