This invention relates to systems for converting between digital and analog values. The system is particularly advantageous because it is constructed to operate on a monotonic basis in a simple and straightforward manner to provide accurate indications of analog values. The system is also advantageous because it is able to operate at high speeds to provide such analog indications.
Various types of equipment receive information in analog form. Such equipment includes process control equipment, measuring instruments, communication equipment and a wide variety of other equipments. Digital computers and data processing systems often receive input parameters in analog form from such equipment and convert these parameters to digital form for processing in the computer or the data processing equipment. After the analog information has been converted to digital information and has been processed, the output information from the digital computer or the data processing equipment is often converted to analog form. By converting the digital information to analog form, the user can assimilate the information in ways which would be difficult if the information remained in digital form.
As digital computers and data processing equipment have become widespread throughout industry and have even become common in the home, the need for inexpensive, simple and reliable apparatus for converting information between digital and analog forms has become of increasing concern. A considerable effort has been devoted over a period of several decades to provide for converting apparatus which is simple, inexpensive and reliable. In spite of such efforts, the converting apparatus now in use does not meet such criteria.
The converters now in use also have other longstanding problems. For example, the converters now in use may not be monotonic unless they are quite expensive and complex. By "monotonic" is meant that digital information of progressively increasing value is converted to analog information of progressively increasing value without any decrease in the analog value as the digital value progressively increases. The converting apparatus now in use also has relatively high differential and integral non-linearities unless the apparatus is quite expensive and complex. Integral nonlinearities result from errors produced in a conversion between analog and digital values over a wide range of such values. Differential nonlinearities result from errors produced in a conversion between analog and digital values over a relatively narrow range of such values.
The converters now in general use also have a problem of major proportions. This results when particular digital values are increased incrementally by a single digit. For example, problems in the converters now in use result when a binary representation of "511" is converted into a binary representation of "512". This results from the fact that the binary representation of "511" is represented by a value of "0111111111" and a binary representation of "512" is represented by "1000000000" where the least significant digit is at the right. As will be seen, the value of each binary digit changes when the decimal value changes from "511" to "512". As the binary values change from "0111111111" to "1000000000", discontinuities may occur because there is a change between a binary value of "0" and a binary value of "1" at each digital position. These discontinuities may prevent the converters from being truly monotonic. This problem even exists in converters which are made quite complex in an attempt to overcome the problem.
The problems discussed in the previous paragraph have been aggravated by the increased speeds at which the computers and data processing equipment, and their associated converters, have been operated. For example, computers and data processing systems now operate at speeds of 100 megahertz and even higher. For example, at such frequencies, the converters have increased difficulties of operating on a monotonic basis with minimal integral and differential non-linearities.
This invention provides a digital-to-analog converter which overcomes the disadvantages of the prior art. The converter operates at high frequencies such as frequencies in the order of approximately one hundred (100) megahertz (100 mhz) and provides a monotonic output, with minimal integral and differential errors, even while operating at such high frequencies.
The apparatus of this invention converts a digital value represented by first and second pluralities of digital signals into an analog value represented by the magnitude of an analog signal. In one embodiment of the invention, output members in a matrix relationship having x and y inputs respectively receive signals in first and second pluralities cumulatively representing a digital value. These signals are decoded and are respectively introduced to x and y inputs to activate a particular output member common to a selected x row and a selected y column. The output members in the preceding rows and preceding the activated output member in the selected row are also activated.
Three transistor (all of the same type) current sources provide constant currents to the activated output members. In each current source, first transistor provides the constant currents, a second transistor constitutes a switch operative in response to binary input signals, and a third transistor in receives the constant current dependent upon the binary input to the second transistor. A circuit providing first and second reference voltages and including an operational amplifier produces a resultant voltage representing the difference between the reference voltages.
The resultant voltage controls the current flowing through fourth and fifth transistors, preferably in series, thereby regulating the value of the first reference voltage. The amplifier output also regulates the current in the first transistor of each current cell, and the voltage from the fifth transistor biases the third transistor in each current cell toward a conductive state. The three transistors in each current source and the fourth and fifth transistors may be C-MOS transistors of the p type.
In the drawings:
FIG. 1 is a schematic diagram of a system including a plurality of output members for converting digital values into corresponding analog values;
FIG. 2 is a diagram of circuitry for activating individual ones of the output members shown in FIG. 1;
FIG. 3 is a diagram of circuitry for activating individual ones of the output members shown in FIG. 1;
FIG. 4 illustrates an integrated circuit chip including the matrix shown in FIG. 1, circuitry corresponding to that shown in FIGS. 2 and 3 and other circuitry included in this invention;
FIG. 5 illustrates circuitry included on the chip shown in FIG. 4 for converting output voltages from TTL logic devices external to the chip into input voltages for energizing C-Mos transistors disposed on the chip;
FIG. 6 illustrates the electrical construction of inverters included in the circuitry shown in FIG. 5;
FIG. 7 illustrates waveforms of voltages produced in the circuitry shown in FIGS. 5 and 6;
FIG. 8 illustrates waveforms of input voltages to the circuitry shown in FIG. 7 and output voltages from such circuitry;
FIG. 9 is a diagram of circuitry for providing outputs from the matrix shown in FIG. 1, such output circuitry being included on the integrated circuit chip shown in FIG. 4;
FIG. 10 illustrates waveforms of voltages and currents produced by the circuitry shown in FIG. 9; and
FIG. 11 is a schematic electrical diagram of the system formed by the electrical circuitry shown in the previous Figures.
In one embodiment of the invention, a plurality of output members 10 are disposed in a matrix arrangement generally indicated at 12. Each of the output members may be a transistor such as disclosed in application Ser. No. 383,544 filed by Henry Katzenstein or a capacitor such as disclosed in application Ser. No. 553,041 filed by Henry Katzenstein. Application Ser. Nos. 383,544 and 553,041 are assigned of record to the assignee of record of this application.
The matrix arrangement 12 may be in any form. In the embodiment shown in FIG. 1, the matrix arrangement is defined by a plurality of rows and a plurality of columns. The matrix arrangement shown in FIG. 1 provides eight rows and eight columns but any number of rows or columns may be used. Input terminals 14 are provided to each of the rows and input terminals 16 are provided to each of the columns.
Input signals in a first plurality are introduced through lines 18 to the input terminals 14 and input signals are introduced through lines 20 to the input terminals 16. The input signals to the lines 18 are in a form such that all of the signals have a binary "0" except for one signal which has a binary "1". This signal prepares all of the output members 10 to become activated in the row receiving this signal. The input signals in the lines 18 may be obtained by decoding three (3) binary signals which are coded in a pattern to indicate the particular row to be prepared for activation at each instant. The three signals are introduced to a decoder 22 which operates to decode the signals into the eight signals which are introduced to the inputs 14.
In like manner, a decoder 24 is provided to decode three input signals in a second plurality. The three (3) input signals in the second plurality are decoded into eight signals which are introduced to the inputs 16. The decoders 22 and 24 are conventional in the prior art. The signals introduced to the decoder 24 may constitute least significant bits (LSB's in FIG. 1) and the signals introduced to the decoder 22 may constitute most significant bits (MSB's in FIG. 1).
As will be seen, when a row and a column are prepared for activation, a particular one of the output members 10 common to the prepared row and the prepared column becomes activated. For example, an output member 10a common to the third row and the third column may be activated at a particular instant. This indicates that the analog value is "19" since the output member 10a is the nineteenth output member counting (in the form of a raster scan) from the top row and the left column as a starting position.
FIG. 2 illustrates a circuit, generally indicated at 30, for activating output members such as the output member 10a (FIG. 1) and all of the output members preceding the output member 10a. The circuit 30 includes an "AND" network 32 which receives a signal on a line 34 corresponding to the line 18 (FIG. 1) for the third row and also receives a signal on a line 36 corresponding to the line 20 (FIG. 1) for the third column. As a result, the "AND" network 32 in FIG. 2 provides an output when the third row and the third column become prepared for activation.
The output signal from the "AND" network 32 is introduced to an "OR" network 38 which also receives the input from a line 40. The output from the "OR" network 38 is introduced to an inverter 42 and the output from the inverter 42 is passed to a line 44. An individual circuit 30 such as shown in FIG. 2 and described above is associated with each of the output members 10 in the matrix 12.
The output member 10a is activated when signals simultaneously pass through the lines 34 and 36 to the "AND" network 32. When the output member 10a becomes activated, all of the output members 10 in the rows preceding the output member 10a become simultaneously activated. This occurs by a passage of a signal through the line 40 for the circuits 30 controlling the activation of each of the output members 10 in each of the first and second rows in FIG. 1. The signal for the line 40 for the circuits 30 controlling the activation of each of the output members in each of the first and second rows may be obtained from the signal on the input 14 to the third row.
In addition to activating all of the output members in the first and second rows, the first and second output members in the third row are simultaneously activated when the output member 10a becomes activated. The activation of the first two members in the third row may be obtained by introducing the signal on the line 44 in FIG. 2 to circuitry for controlling the operation of the output members 10 common to the third row and the first and second columns in FIG. 1. This is shown in FIG. 3, as circuitry generally indicated at 50, for the output member common to the third row and the second column in FIG. 1. As will be seen, the circuitry shown in FIG. 3 is the same as that shown in FIG. 2 except that the line 44 is connected to an "or" network 52 corresponding to the "or" network 38 in FIG. 2.
Actually, the circuitry shown in FIG. 2 can be superseded for each of the output members by the circuitry shown in FIG. 3. The circuitry shown in FIG. 2 has been included in the drawings to simplify and clarify the operation of the converter shown in FIG. 1.
As will be seen from FIGS. 2 and 3, the output member 10a and all of the output members preceding the output member 10a are simultaneously activated when the analog value is "19". Each of the activated output members 10 produces a substantially constant current when activated as by circuitry shown in FIG. 9. These constant currents in the different output members are accumulated in a single output line to provide on this output line a current having a magnitude corresponding to the analog value of "19" in the example discussed in the previous paragraphs. Since this output current is obtained from a number of output members 10 each providing a substantially constant current, the output from the converter shown in FIG. 1 is monotonic.
As will be appreciated, the circuits for activating the output members in the top row in FIG. 1 do not need the line 40 in FIG. 2 or the corresponding line in FIG. 3. This results from the fact that there are no preceding rows of output members to be activated when the output members in the top row in FIG. 1 are being activated. Furthermore, the lines corresponding to the line 36 (FIG. 2) can receive an activating voltage at all times for the output members in the first column in FIG. 1. This results from the fact that the output member common to the first column and a particular row is activated when any of the output members in that row is activated. This output member remains activated regardless of which output member in the row is thereafter activated.
The output members 10 in the matrix 12 may be disposed on an integrated circuit chip generally indicated at 60 in FIG. 4. The circuitry on the chip 60 is preferably formed by C-Mos technology. However, the logic devices in other circuits external to the chip 60 may be formed by other technology such as TTL technology. The external logic devices utilizing TTL technology provide output voltages in the range of approximately 0.4 volts to approximately 2.4 volts with the logic threshold at approximately 1.4 volts. The C-Mos transistors on the chip 60 preferably operate with input voltages of approximately 0 volts to approximately 5 volts with a logic threshold of approximately 2.5 volts. It has previously been difficult to convert the output voltages from TTL logic devices to the proper input voltages for C-Mos transistors when it has been desired to operate digital-to-analog converters at high frequencies in excess of approximately twenty-five megahertz (25 mhz).
This invention provides circuitry for converting the output voltages from the TTL logic devices to the proper input voltages to the C-Mos transistors oven with considerable variation in supply voltage temperature and C-Mos process parameters. The circuitry of this invention provides such a conversion at frequencies in excess of eighty-five megahertz (85 mhz) with 3 micron gate length C-Mos technology. This frequency is well in excess of frequencies of approximately twenty-five megahertz (25 mhz), the maximum frequency capable of being provided by comparable circuitry now in use.
The circuitry of this invention uses only one power supply in converting from TTL logic devices to C-Mos transistors at high frequencies in excess of twenty-five megahertz (25 mhz). This is in contrast to digital-to-analog converters constructed from bipolar circuitry since, although bipolar circuits are relatively fast, they generally require two (2) power supplies, one providing a positive voltage and the other providing a negative voltage.
The circuitry of this invention for converting from TTL logic devices to C-Mos circuitry is shown in FIG. 5 for each digital signal input to integrated circuit chip 60 in FIG. 4. The circuitry shown in FIG. 5 includes a line 62 connected to the output of the external TTL logic device and to an input terminal 64 on the integrated circuit chip. A resistor 65 having a suitable value such as approximately 2,000 ohms is connected between the input 64 and the drain of a transistor 66 such as a C-Mos transistor of the p-type. A pair of inverters 68 and 70 are also connected to the drain of the transistor 66 and a line 72 is connected to the output of the inverter 70. The source of the transistor 66 receives an energizing voltage as at 74. This energizing voltage may be approximately +5 volts.
The gate of the transistor 66 has a common connection with the gate of a transistor 76 which may be a C-Mos transistor of the p-type. The characteristics of the transistor 76 and will preferably match the characteristics of the transistor 66 by virtue of being close on the integrated circuit chip to the transistor 66. The source of the transistor 76 has the same energizing voltage (+5 V.) applied to it as to the source of the transistor 66. A pair of inverters 78 and 80 are disposed electrically in series between the drain of the transistor 76 and the gates of the transistors 66 and 76.
A resistor 82 and a biasing threshold voltage reference 84 are in series between the drain of the transistor 76 and a reference potential such as ground. The resistor 82 may have a suitable value such as approximately two thousand (2000) ohms and in general matches the impedance of the resistor 65. The biasing network 84 provides the logic threshold voltage such as 1.4 volts. In the preferred embodiment, the resistor 82 and the reference voltage 84 are the equivalent of a resistance divider between the power supply and the reference potential such as ground.
The inverters 68 and 70 may be constructed in a manner substantially identical to the inverters 78 and 80. As shown in FIG. 6, each of the inverters 68, 70, 78 and 80 may be constructed from a pair of C-Mos transistors such as a C-Mos transistor 83 of the n-type and a C-Mos transistor 85 of the p-type. The drains of the transistors 83 and 85 have a common connection with an output line 86. The source of the transistor 83 is connected to a reference potential such as ground and the source of the transistor 85 is provided with the same energizing potential as the sources of the transistors 74 and 76. The gates of the transistors 83 and 85 have a common connection with an input line 88.
The area occupied by the transistor 85 on the chip 60 in FIG. 4 is preferably greater by a suitable factor such as a factor of approximately three (3) than the area occupied by the transistor 83. This difference in area causes the transconductance of the transistors 83 and 85 to become matched. Typically the difference in the areas occupied by the transistors 83 and 85 on the chip 60 results from a difference in the width of the transistors on the chip. If the transistors 83 and 85 are not provided with different areas, the transconductance of the transitor 83 will be approximately three (3) times greater than the transconductance of the transistor 85.
The circuitry shown in FIG. 5 operates to regulate the input voltage applied to inverter 78 such that this input voltage is at the C-Mos logic threshold of about 2.5 volts. The transistor 76 in such circuitry is generally conductive. Current from the transistor 76 through the resistor 82 causes a level shift voltage to be produced across the resistor 82. This voltage is the difference between the C-Mos threshold determined by the inverter 78 and the voltage provided by the threshold voltage reference 84. For operation as a logic translator between TTL (logic device and a C-Mos transistor) the threshold voltage reference is set to the TTL logic threshold of 1.4 volts.
If the threshold of the inverter 68 matches the threshold of the inverter 78 and if the impedances transistors 66 and 76 and resistors 82 and 65 match, then the transistor 66 will induce the same voltage across the resistor 65 as that across the resistor 82. Thus, when the input 62 is at the TTL threshold of approximately 1.4 volts, the inverter 68 will be at the C-Mos threshold of approximately 2.5 volts.
The high speed operation of the signal carrying inverters 68 and 78 shown in FIG. 5 is facilitated by the balanced arrangement of such circuitry. Since the inverters 68 and 70 have C-Mos thresholds, the transconductances in the transistors 83 and 85 for each inverter are matched with each other. By providing such a balanced relationship in the circuitry shown in FIGS. 5 and 6, a signal such as illustrated at 90 in FIG. 7 is produced on the line 72 when an input signal representing a change between a binary "1" and a binary "0" is provided on the line 62. This signal has a relatively fast response, particularly on its leading edge, in comparison to a signal, such as that illustrated at 92 in FIG. 7, which is produced by the circuitry of the prior art. This is because, in the prior art, the threshold is changed between a C-Mos transistor (i.e. approximately 2.5 V) to a TTL logic device (i.e. approximately 1.4 V) by reducing the transconductance of a transistor corresponding to the transistor 85 relative to that of a transistor corresponding to the transistor 83.
The advantages of providing pairs of inverters such as the inverters 78 and 80 and the inverters 68 and 70 may be seen from the waveforms shown in FIG. 8. A waveform 94 in FIG. 8 illustrates the input to terminal 64 from the TTL logic device. A waveform 95 in FIG. 8 illustrates the input to the C-Mos transistor 66. A waveform 96 in FIG. 8 illustrates the signal produced by the inverter 68 in FIG. 5 and a waveform 98 in FIG. 8 illustrates the signal produced by the inverter 70 in FIG. 5. As will be seen, the signal 98 is squared relative to the signal 96. This results from the saturation of the signal from the inverter 68 by the increased amplitude provided by the inverter 70 in FIG. 5.
The circuitry shown in FIGS. 5 and 6 and described above has certain important advantages. It provides a simple and reliable conversion from the output voltages from the TTL logic devices to the input voltages to the C-Mos circuitry so that the digital-to-analog converter can be provided in C-Mos logic on an integrated circuit chip. In providing this conversion from the output voltages from the TTL logic devices to the input voltages to the C-Mos circuitry, the circuitry shown in FIGS. 5 and 6 and described above changes voltages between approximately 0.4 volts and 2.4 volts in the TTL logic devices (in representation of binary 1's and binary 0's) to voltages between approximately 1.5 and 3.5 volts as required by the C-Mos circuitry (in representation of binary 1's and binary 0's). The circuitry shown in FIGS. 5 and 6 provides such voltage conversions at frequencies in excess of eighty-five megahertz (85 mhz). The circuitry shown in FIGS. 5 and 6 provides such voltage conversions with only a single power supply providing approximately 5 volts.
The circuitry shown in FIGS. 5 and 6 also has other advantages of some importance. For example, if the inverter 78 is biased to become non-conductive and then transistor 76 is made non-conductive, signals may be introduced to the line 62 for passage to the inverter 68 with no level shift. Under such circumstances, the input circuit threshold on the line 72 is compatible with C-Mos logic external to the integrated circuit chip.
FIG. 9 illustrates circuitry for producing output signals from the matrix 12 in FIG. 1 in accordance with the activation and deactivation of the individual output members 10. The circuitry shown in FIG. 9 includes an input line 100 from an individual one of the output members 10 in FIG. 1. The input line 100 is connected to the gate of a transistor 102 such as a C-Mos transistor of the p-type. The drain of the transistor 102 is connected through a line 103 to a reference potential such as ground. The source of the transistor 102 is common with the source of a transistor 104 and with the drain of a transistor 106. The transistors 104 and 106 may be C-Mos transistors of the p-type.
The source of the transistor 106 receives an energizing potential such as approximately 5 volts. The gate of the transistor 106 receives a substantially constant bias voltage through a circuit which is shown in FIG. 11 and which will be described in detail subsequently. The gate of the transistor 104 receives a suitable biasing voltage such as a voltage of approximately 1.2 volts on a line 108. The output from the circuitry shown in FIG. 9 is produced on a line 110 which is connected to the drain of the transistor 104.
Distributed capacitances 112 (shown in broken lines in FIG. 9) exist between the gate and the source of the transistor 102 and distributed capacitances 114 (shown in broken lines in FIG. 9) exist between the gate and the drain of the transistor. These distributed capacitances are charged, during the time that the transistor 102 is nonconductive and they become discharged when the transistor 102 becomes conductive.
In output circuitry of the prior art, the discharge of a distributed capacitance corresponding to the capacitance 112 occurs through a circuit including the source and gate of a transistor and the discharge of a distributed capacitor corresponding to the capacitance 114 occurs through a circuit including the gate and drain of the transistor. However, in the prior art, such a transistor is an n-type rather than being the p-type shown for the transistor 102 in FIG. 9. As a result of the charge and discharge of such distributed capacitances, a current signal on the line 110 in FIG. 9 is produced in the n-type of transistor in the prior art with characteristics such as indicated at 116 in FIG. 10. This signal has a blip 118 which is produced upon a change from a non-conductive state to a conductive state in the operation of the n-type of transistor of the prior art. Similarly, the n-type of transistor corresponding in the prior art to the transistor 102 (p-type in this invention) produces a slow edge 119 when the state of the transistor changes from a conductive to a non-conductive state. This results from the fact that the drain of the transistor in the prior art (corresponding to the transistor 106) must swing over a larger voltage range than this invention requires. The parasitic capacitances corresponding to the capacitances 112 and 114 and the large voltage swings interfere with the operation of the output circuitry in the prior art and they slow the response of such circuitry.
When the associated one of the output members 10 (FIG. 1) is activated in this invention, it produces a signal 122 in FIG. 10 and introduces this signal to the line 100 (FIG. 9). This causes the transistor 102 to become conductive. The production of a conductive state in the transistor 102 is also facilitated because it is in series with the transistor 106. The current through the transistor 106, and therefore through the transistor 102, has a predetermined value because of the fixed bias introduced to the base of the transistor 106 through the circuitry shown in FIG. 11. When the transistor 102 becomes conductive, its parasitic capacitances 112 and 114 aid the switching of the output transistor 104 between the conductive and non-increasing states, thus increasing the switching speed of the transistor 104. Furthermore, the voltage swing at the drain of the transistor 106 is reduced and this further increases the speed of switching the transistor 104. This results in the current wave forms 124 (FIG. 10) in the line 110 in FIG. 9.
The flow of current through the transistors 106 and 104 produces a rise in voltage on the drain of the transistor 106 and on the source of the transistor 104. Since this rise in voltage is from a value of approximately +1 volts which is produced on the drains of the transistors 102 and 104 when the transistor 102 is conductive, the rise in voltage on the drain of the transistor 104 is quite fast. This is particularly true since the corresponding voltage on the drain of the n-type of transistor in the prior art corresponding to the transistor 102 (p-type in this invention) is approximately 0 volts.
As a result of the discharge of the distributed capacitances 112 and 114 through the transistor 102 in the circuitry shown in FIG. 9 when the transistor 102 becomes conductive, the slope of the signal produced on the output line 110 is more vertical than would be produced if the distributed capacitors 112 and 114 did not discharge through the transistor 102. This may be seen from a comparison of the leading edge of the signal 124 (FIG. 10) produced on the line 110 by the circuitry shown in FIG. 9 in comparison to the leading edge of a signal 126 produced on the same line by the circuitry of the prior art. Furthermore, as will be seen from the signal 124, no blips are produced in the leading and trailing edges of the signal.
The trailing edge of the output signal 124 produced by the circuitry shown in FIG. 9 is also sharper than the signal 126 produced by the circuitry of the prior art. This results from the reduced time, in comparison to the prior art, for the voltage on the drain of the transistor 104 to reach the proper value when the transistor 104 changes from a non-conductive state to a conductive state in the circuitry of this invention.
As will be seen from the above discussion, the circuitry shown in FIG. 9 and described above has certain advantages over the prior art. It provides on the output line 110 the signal 124 at a frequency in excess of eighty-five megahertz (85 mhz). It also provides the signal 124 with relatively sharp characteristics. This is in contrast to the prior art since the prior art provides the output signal 126 at a maximum frequency of approximately twenty-five megahertz (25 mhz) and with characteristics not nearly as sharp as those of the signal 124.
FIG. 11 illustrates circuitry for producing output currents from the different output members 10 in the matrix 12. The circuitry shown in FIG. 11 is disposed on the integrated circuitry chip 60 of FIG. 4. The chip 60 is illustrated in FIG. 11 by broken lines. The circuitry shown in FIG. 11 includes a pad 150 outside of the chip 60 for providing a reference voltage such as approximately 1.2 volts and a pad 152 outside of the chip 60 for providing a reference voltage such as approximately -1.2 volts. A resistance 154 is disposed electrically between the pad 150 and a reference potential such as ground.
Input terminals of an operational amplifier 156 are respectively connected to the pads 150 and 152. The output from the operational amplifier 156 is introduced to the gate of a transistor 158 such as a C-Mos transistor of the p-type. The source of the transistor 158 receives an energizing voltage such as approximately +5 volts. The drain of the transistor 158 and a source of a transistor 160 are common. Connections are respectively made from the gate and the drain of the transistor 160 to the pads 152 and 150. The transistor 160 may be a C-Mos transistor of the p-type.
The output of the operational amplifier 156 is introduced to the gates of transistors 106a, 106b, etc. corresponding to the transistor 106 in FIG. 9. Similarly, connections are made from the pad 152 to the gates of transistors 104a, 104b, etc. corresponding to the transistor 104 in FIG. 9. Transistors 102a, 102b, etc. (corresponding to the transistor 102 in FIG. 9) are respectively connected to the transistors 104a and 106a and to the transistors 104b and 104b in a manner shown in FIG. 9. Lines 110a, 110b, etc. are connected to the line 110 also shown in FIG. 9. Lines 103a, 103b, etc. correspond to the line 103 in FIG. 9.
A substantially constant current flows through a circuit including the pad 150, the resistance 154 and the reference potential such as ground. This current is balanced in the operational amplifier 156 by the current produced in the amplifier as the result of the introduction of the voltage from the pad 152 to the amplifier. The current in the operational amplifier biases the transistor 158 to a state of conductivity so that current flows through the transistors 158 and 160 to the pad 150 to correct for any imbalances between the current flowing through the operational amplifier 156 and the current flowing through the resistance 154. In this way, the bias introduced from the operational amplifier 156 to the gate of the transistor 158 is substantially constant.
The transistors 158 and 160 correspond respectively to the transistors 106a, 106b, etc., and the transistors 104a, 104b, etc. As a result, the same current flows through the transistors 106a and 104a and through the transistors 106b and 104b as flows through the transistors 158 and 160. As previously described, the transistors 106a, 104a and 102a are associated with an individual one of the output members 10 in the matrix 12 of FIG. 1 and the transistors 106b, 104b and 102b are associated with another individual one of the output members 10 in the matrix 12 of FIG. 1. As a result, each of the circuits 106a and 104a, 106b and 104b, etc., provides a substantially constant current to the output line 110 in FIGS. 9 and 11 when the associated one of the output members 10 becomes activated. The magnitude of the cumulative current on the output line 110 indicates the analog value corresponding to the value of digital signals introduced to the matrix 12 in FIG. 1. The analog indication represented by the current on the line 110 is monotonic and provides minimal integral and differential non-linearities.
Although this invention has been disclosed and illustrated with reference to particular embodiments, the principles involved are susceptible for use in numerous other embodiments which will be apparent to persons skilled in the art. The invention is, therefore, to be limited only as indicated by the scope of the appended claims.