Technical Field
This invention relates to photovoltaic cell fabrication methods and cells and panels made thereby and, in particular, to such cells and panels which are capable of being produced in a single, continuous production machine while utilizing the method.
Background Art
Photovoltaic cells for converting sunlight into electrical energy have been traditionally made of crystalline silicon. However, thin film amorphous silicon photovoltaic cells have been found to be more economically feasible from the standpoint of manufacturing costs. However, while more economically feasible than the production of crystalline silicon cells, the production of amorphous silicon cells is still quite costly.
One of the most important parameters in any resulting amorphous silicon cell is the amount of the active area of the cell which is exposed to the light. Typically, electrical connections which are necessary for the operation of the cell also block transmission of the light into the active portions of the cell. The electrical connections are generally opaque and are located between the light incident face of the cell and the active semiconductor material.
One prior art photovoltaic cell uses a plurality of point electrical contacts to a first electrode material layer which has been previously deposited onto a substrate. The point contacts are positioned in a spaced-apart relation across the surface of the substrate and extend through deposited semiconductor material. A plurality of individual pads are deposited adjacent to the deposited semiconductor material to form back electrodes. Each pad is electrically isolated from the other pads and the point contacts. First and second sets of interdigiting fingers electrically connect the point contacts and the pads, respectively. In this way, the bulk of the electrical connections are made on the back of the cell with only the point contacts in the front, resulting in an increased active area on the light incident surface of the cell.
However, electrical connections in and between such photovoltaic cells cannot be made quickly or inexpensively. Furthermore, such electrical connections should be of sufficiently low resistance to conduct electricity through and between the cells for maximum current collection. Problems arise in prior art photovoltaic cells and panels due to the relatively high power losses in thin wires or grids used for electrical connection.
Disclosure of the Invention
An object of the present invention is to provide a photovoltaic cell fabrication method and photovoltaic cell and panel made thereby wherein improved electrical connections are manufactured quickly and inexpensively.
Another object of the present invention is to provide a photovoltaic cell fabrication method and photovoltaic cell and panel made thereby wherein many of such cells can be produced in a single, continuous production machine.
Yet still another object of the present invention is to provide a photovoltaic cell fabrication method and photoelectric cell and panel made thereby wherein improved electrical connections which take up little active area of the cell but which still have relatively low resistance are made.
In carrying out the above objects and other objects of the present invention a method for making a photovoltaic cell including a layer of semiconductor material sandwiched between first and second sheet electrodes is provided. The method includes the steps of making electrical connections to the first sheet electrode through the semiconductor. The connections are electrically insulated from the second sheet electrode. The improvement comprises making an array of openings in the second sheet electrode and the layer of semiconductor material to expose the first sheet electrode to permit the electrical connections to the first sheet electrode therethrough.
Further in carrying out the above objects and other objects of the present invention, a photovoltaic cell constructed in accordance with the present invention includes a substrate, a transparent first electrically conducting sheet electrode disposed on the substrate and a layer of photovoltaic semiconductor material disposed on and in continuous electrical contact with the first sheet electrode. The cell further includes a second electrically conducting sheet electrode disposed on and in continuous electrical contact with the semiconductor material layer and an electrically insulating dielectric layer disposed on the second sheet electrode. A third electrically conducting sheet electrode is disposed on the dielectric layer and is electrically insulated from the second sheet electrode. The layer of semiconductor material, the second sheet electrode and the insulating layer have openings at isolated areas. The third sheet electrode makes electrical contact with the first sheet electrode through the openings at the isolated areas.
A photovoltaic panel constructed in accordance with the present invention includes a series of such cells wherein the third sheet electrodes of one cell is serially connected to the second sheet electrode of an adjacent cell to add the voltages developed by the cells.
Preferably, the third sheet electrode is electrically insulated from the second sheet electrode at the isolated areas.
The advantages of the fabrication method, the photovoltaic cell and the photovoltaic panel as constructed above are numerous. For example, the electrical connections necessary for the operation of the photovoltaic cell may be produced in a continuous fashion in a mass production machine so that individual wires or grids need not be used. In this way, relatively low cost solar cells and panels result. Yet another benefit of such a photovoltaic cell and panel is that the cell and panel exhibit a high amount of reliability due to the lack of human-made electrical connections.
Other advantages of the present invention will be readily appreciated as the same become better understood by reference to the following detailed description when considered in connection with the accompanying drawings.
Brief Description of the Drawings
FIG. 1 is a side view, partially broken away and in cross-section, of a photovoltaic panel constructed in accordance with the present invention, illustrating individual cells and the electrical connections therebetween;
FIG. 2 is a block diagram illustrating the various process steps for constructing the photovoltaic panel of FIG. 1, and FIGS. 3A through 3D are cross-sectional views of the photovoltaic panel illustrating its structure at selected stages during fabrication.
Best Mode for Carrying Out the Invention
Referring now to the drawing figures, there is illustrated in FIG. 1 a photovoltaic panel, generally indicated at 10, which includes a plurality of interconnected photovoltaic cells. The photovoltaic panel 10 includes a substrate in a form of a glass substrate 12. However, it is to be understood that the substrate 12 may be selected from the group consisting of metals, plastics and ceramics.
On the top surface of the glass substrate 12 there is formed a first electrically conducting sheet electrode 14 in the form of a transparent conductive oxide layer. The transparent sheet electrode 14 may be selected from the group consisting of indium tin oxide, tin oxide, indium oxide, and zinc oxide.
A barrier layer of SiO.sub.2 (not shown) is preferably disposed between the glass substrate 12 and the transparent sheet electrode 14.
A photovoltaic semiconductor layer 16 is disposed on and is in continuous electrical contact with the first sheet electrode 14. The semiconductor layer is preferably multiple layers of amorphous silicon. Included are first and second layers doped with P and N-charge carriers respectively and an intermediate layer of intrinsic amorphous silicon material.
A second electrically conducting sheet electrode or back sheet electrode 18 is disposed on and is in continuous electrical contact with the amorphous silicon layer 16. The second sheet electrode 18 is preferably made of multiple metallic layers including a thin layer of silver and a relatively thicker layer of copper deposited thereon (not shown for simplicity).
An electrically insulating dielectric polymer layer 20 is disposed on the back sheet electrode 18. The polymer is preferably of a type such as a gel-state polymer that can be screen-printed to various openings, including small circular openings and elongated lines.
A third electrically conducting sheet electrode 22 is disposed on the dielectric layer 20 and is thereby electrically insulated from the back sheet electrode 18. The third sheet electrode 22 is preferably also similarly composed of a combination of silver and copper layers. However, other conductive metallic elements or various alloys thereof could also be used.
An insulating encapsulating layer 24 is formed atop the third sheet electrode layer 22. The encapsulating layer 24 includes integrally formed, downwardly facing projections at isolation lines 26. The third sheet electrode 22 of one cell is serially electrically connected to the back sheet electrode 18 adjacent the isolation lines 26 of an adjacent cell to add the voltages developed by each of the serially interconnected cells.
Openings 19 are formed at isolated areas through the amorphous silicon layer 16, the back sheet electrode 18 and the dielectric layer 20. The third sheet electrode 22 makes electrical contact with the transparent sheet electrode 14 through the openings 19 at the isolated areas. Preferably, the isolated areas are rows of round dots. However, the isolated areas may alternatively be lines. The method of forming the openings 19 will be described in greater detail hereinbelow.
The amorphous silicon layer 16, the transparent sheet electrode 14, the back sheet electrode 18 and the dielectric layer 20 have openings 17 formed at isolation lines. The third sheet electrode 22 is disposed on and contacts the top surface of the glass substrate 12 through the openings 17 at the isolation lines. The third sheet electrode 22 is electrically insulated from the back sheet electrode 18 at the isolated openings 17 and 19 by the dielectric layer 20.
Preferably, the linear distance between any two openings 19 forming the dots is at least 10 times the diameter of any one of the dots.
Also, preferably, the sheet resistivity of the transparent electrode layer 14 is at least five times the sheet resistivity of any one of the back and third sheet electrodes 18 and 22, respectively.
At opposite ends of the panel 10 (only one of which is shown for convenience) busbars 28 are formed on the glass substrate 12. In turn, the third sheet electrode 22 is formed on the top surface of the busbars 28 as is described in detail hereinbelow. The busbars 28 are formed on the panel 10 to electrically connect the panel 10 in an electrical circuit.
Referring now to FIG. 2, there is illustrated in block diagram form, the preferred process steps in forming the structure of FIG. 1.
In the first step the glass substrate 12 is edge-washed and dried.
In the second step, silver paste is screened on the substrate 12 to form the busbars 28 as shown on FIG. 3A.
In the third step, SiO.sub.2 and SnO.sub.2 films are deposited by CVD on the heated substrate 12 including the busbars 28. The busbars 28 are fused. Then the resulting structure is tempered and cooled to 300 degrees C. to form the barrier layer (not shown) and the transparent sheet electrode 14.
In the fourth step, the still-heated glass substrate 12 is loaded into a vacuum system to form amorphous silicon P-I-N films by glow discharge, thereby forming the amorphous silicon layer 16.
In the fifth step, while in the vacuum, thin silver and thick copper films are deposited by sputtering to form the back sheet electrode 18.
In the sixth step, gel-state polymer is screened on the back sheet electrode 18 to form the dielectric layer 20. Dots and lines corresponding to the openings 17 and 19 are left open to produce the structure shown in FIG. 3A. Then the resulting structure is allowed to harden.
In the seventh step, HF and HNO.sub.3 paste is screened in the openings 17 and 19 (i.e. the dots and isolation lines) and on the bus bars areas to expose the transparent sheet electrode 14. The resulting structure is then washed.
In the eighth step, NaOH paste is screened on the openings 17 forming the isolation lines and on the busbars 28 to expose the bare glass substrate 12 and the bare busbars 28, respectively to produce the structure shown in FIG. 3B. The resulting structure is again washed.
In the ninth step, the resulting structure is flash-heated to fuse the polymer of the dielectric layer 20 to seal the edges of the back sheet electrode 18 as shown in FIG. 3C. Alternatively, a second layer of polymer may be screened leaving the openings 17 forming the dots, the interconnecting series lines between the back and third sheet electrodes 18 and 22 (i.e. adjacent the isolation lines 26) and the bus bars 28 open and sealing any pin holes that may have developed in the first dielectric layer 20.
In the tenth step, a thin silver and a thick copper film are sputtered over all areas, including the busbars 28, to form the third sheet electrode 22.
In the eleventh step, the isolation lines 26 are screen-etched in the dielectric layer 20 using NHO.sub.3 paste to produce the structure shown in FIG. 3D. The resulting structure is again washed.
Finally, in the twelfth step, encapsulant is applied to form the encapsulating layer 24 while leaving the busbars 28 open and forming the projections at the isolation lines 26 producing the photovoltaic panel shown in FIG. 1.
The panel 10 and its cells has numerous advantages. For example, the cells in the panel 10 can be quickly manufactured in an inexpensive and efficient fashion. Also, the electrical connections in the panel 10 can be produced in a single, continuous production machine without removing the substrate 12 from the machine for additional processing.
The present construction also eliminates resistance problems which have arisen in prior art photovoltaic cells due to thin wires and grids used for the electrical connections within and between cells. An added advantage of the present invention is the increased active area on the incident face of the panel 10. For example, the openings 19 allow a greater amount of light into the active area of the photovoltaic panel 10.
While the best mode for carrying out the invention has been described in detail, those familiar with the art to which this invention relates will recognize various alternative ways of practicing the present invention as defined by the following claims.