Process for Manufacturing Ultra Pure Silica and Resulting Encapsulated Products

This invention relates to a process for manufacturing pure silica, and in particular, to such a process utilizing primarily industrial grade raw materials.

The need for purer silica powder is gaining importance in the electronics industry as 256 K DRAM and megabit chips are becoming mass produced. It is important that these chips be encapsulated to protect them from problems such as moisture. The term "encapsulated" as used here refers to a package which consists of micro-miniature circuit embedded in an encapsulating material. Generally the encapsulation includes resin blocks, silica and urethanes, for example. When the chips become very dense as in the case of fabricating very large scale integrated circuits (VLSI), the purity of silicon powder used to form the encapsulating material becomes extremely important. Pure silica is needed to encapsulate these chips which protects them from the environment. The relative purity of the powder is extremely important as impurities can change the electrical characteristics of the silica and create conduction paths. For example, carbon, iron, as well as other metallics within the silica powder can create conduction paths which produce short circuits within the electronic components being encapsulated. Thus, it is essential in producing silica products for use within the electronic industry, that the quantity of carbon and iron within the silica powder be maintained at a minimum. Conventional electronic grade silica used for encapsulation usually contains from about 200 to 300 ppm carbon. Furthermore, uranium and thorium, which produce alpha radiation, must be kept at a minimum as this radiation from isotopes of these elements is capable of damaging the memory functons causing so-called soft errors.

Not only must the purity of the silica powder be controlled, but also the size of the particles of the powder must be controlled. If the powder is too fine, i.e., mostly -20 microns, then excessive quantities or resin must be used in forming the encapsulating material.

It has heretofore been known that such pure silica powder can be formed by a sol-gel processby gelling, drying, milling and calcining a batch made from equal volumes of distilled tetraethylorthosilicate (hereinafter (TEOS), reagent-grade ethanol, and acidified distilled water.

The raw materials have to be subject to multiple distillations to purify the same and ultra-clean rooms required to carry out the sol-gel process.

Although relatively pure silica powder is obtained when using the above constituents, the relatively high cost of the raw materials used in the process, the relatively high level of carbon found within the silica powder, and the lack of any substantial quantity of +325 mesh particles, results in a relatively expensive and not totally commercially satisfactory product.

Accordingly, it is an object of this invention to produce a pure silica powder from relatively inexpensive raw stock material, which powder has substantially low levels of carbon, iron, uranium and thorium, and the necessary coarse particle size distribution to provide a commercially satisfactory powder.

It is also an object of the present invention to produce micro-miniature circuits encapsulated with such ulta pure silica powder.

FIG. 1 is a schematic illustration of the process of the invention; and

FIG. 2 is a diagrammatic representation of an integrated chip of the present invention.

In the following examples, TEOS has been utilized as the organic source of silica. However, other hydrolizable silicon organometallic sources, such as methyl silicate, or TMOS (tetramethylorthosilicate, also called tetramethoxysilane or methyltrimethoxysilane), can also be used. TEOS is preferably used since it reacts more slowly with water than TMOS, comes to equilibrium as a complex silanol, and in a partially hydrolyzed state is more stable over longer periods of time than the other silicon alkoxides.

Further, within the following examples, the alcohol solvent is illustrated as ethanol. However, it should be understood any alcohol such as methanol, propanol, isopropanol, and butanol also might be used. In addition, other organic solvents which are miscible in both TEOS and water may be suitably substituted for the ethanol. The foregoing would include ketones and amides like acetone, dioxane and dimethylformamide.

Similarly, although hydrochloric acid is illustrated in the examples, other acids may be used to catalyze the reaction between TEOS and water. Hydrochloric acid is preferably used because it may be easily removed from the silica powder by simple heating.

Referring to FIG. 2, there is shown a microminiature circuit; namely, an integrated circuit chip 30, wherein integrated circuit 32 is housed in package base 34 and coupled to external leads 36 through internal conductor 38. The entire unit, with the exception of the outer portions of external leads 36 is encapsulated with the pure silica of the present invention 40. The particular circuit 32, base 34, leads 36, and conductor 38 can be any conventionally used in integrated circuit chips.

The chip 30 is prepared in any commercially known manner and then encapsulated by any of the known techniques utilized with silicas used heretofore. In addition to integrated circuit chips, the pure silica of the present invention can be used for encapsulation of any other type of micro-miniature circuit which is conventionally encapsulated with silica.

Set forth below in Table I are typical analyses of electronic grade silica conventionally used as encapsulants and the pure silica of the present invention.

The invention will be further described in connection with the following examples which are set forth in purposes of illustration only.

TEOS is distilled at 173.degree. C. using a liquid cold evaporation tube to collect the silicate. Equal volumes of reagent-grade ethanol, distilled TEOS and 0.1M HCl solution made from distilled water, are mixed until a clear liquid forms approximately 5 min. It was found that the sol-gel solution should be kept acidic. High pH solutions (previous testing) produced significantly less silica gel than low pH solutions. The solution pH is preferably maintained below 2.0. It was also determined that the quantity of acidified water used in the process should be between 520-720% of the stoichiometric amount. The solution is put in a drier for 24 hours at 73.degree. C. During this time, gelation occurs. Drying is continued at 110.degree. C. for an additional 24 hours. The dry gel is then milled for 48 hours in a plastic jar with solid plastic balls. The resultant powder is screened to -150 mesh using a polyester screen. The powder is then calcined in silica saggers to 1000.degree. C. for 3 hours. The heat up rate used is 17.degree. C./hr.

Although the silica powder produced in Example 1 was satisfactory by most standards of purity, it had excessive levels of carbon and was too fine. In addition, since the process required the use of distilled and reagent grade raw materials, the process would be too costly to use on a commercial basis to produce silica powder. It was thus necessary to modify both the process and the raw materials to obviate the aforedescribed deficiencies.

In an initial attempt to reduce the raw stock cost, industrial grade TEOS was substituted for the distilled TEOS. The tested brands of TEOS were: Dynasil A purchased from the Kay Fries Co.; Pure Silbond and Condensed Silbond purchased from the Stauffer Chemical Co.; and Condensed Ethyl Silicate purchased from the Union Carbide Co. Each of the sources of TEOS was mixed with the reagent grade alcohol and 0.1M HCl solution. The gel process described above was used to produce silica powder. A chemical analysis of the silica powder resulted in a conclusion that either industrial grain Dynasil A or Union Carbide's Condensed Ethyl Silicate could be used in lieu of distilled TEOS.

A similar analysis was done to determine if industrial grade ethanol could be substituted for the reagent grade ethanol. No. 3 solvent obtained from the U.S. Industrial Chemicals Co. was used with 0.1M HCl solution, and both distilled and industrial grade Dynasil A and Union Carbide's Condensed Ethyl Silicate. A chemical analysis of silica powder produced from the above mixes using the sol-gel process revealed that industrial grade alcohol could be used with industrial grade Dynasil A TEOS, without producing unsatisfactory levels of impurities.

A similar analysis was done to determine if acidified water made with tap water could be substituted for acidified water made with distilled water. Both distilled and industrial grade TEOS and industrial grade and reagent grade alcohol were used in manufacturing silica powder using the acidified water made with distilled water, and acidified water made with tap water. An analysis of the silica powder thus produced resulted in a conclusion that distilled water must be used.

Modifications in the process were attempted to eliminate the two remaining problems, i.e., the relatively high level of carbon within the calcined silica powder and the extremely fine particle size of the powder. As described previously, the sol-gel process involves mixing the raw materials until a clear liquid is formed. The solution is then placed in a drier for 24 hours at 73.degree. C. until gelation occurs. Drying is continued at an elevated temperature, for example 110.degree. C. for an additional 24 hours. The dried gel is then milled and screened. The screened powder is then calcined.

In an attempt to coarsen the particle size distribution within the silica powder, the drying time of the gel was increased. As Table I below indicates, a slow drying schedule resulted in a coarser particle size distribution. The gel which had been slowly dried, milled and then screened to -48 mesh before calcination, had, after firing, a particle size distribution with a greater percentage of +325 mesh particles.

To further increase the quantity of +325 mesh particles, the milling time of the dried gel was decreased. As one would expect, the decreased milling time gave a significantly greater amount of +325 mesh before calcination. However, calcination essentially fragmented all of the +325 fraction to a fine powder. T,0100

Calcination of the dried and milled gel was then conducted in several different types of kilns. The data shown below in Table III indicates that air flow through the powder bed during calcination is beneficial for lowering the carbon content of the silica powder. The air should be directed upward through the powder and it is believed the intimate contact between the carbon impurities and the air results in reduction of the remaining carbon impurities as substantially all the carbon is combusted. Merely increasing ventilation by calcining within a box with the cover removed proved insufficient.

Further tests were conducted in an attempt to reduce the cost of producing the silica powder from the described sol-gel process. The test results are illustrated in Table IV below. The first tests indicated that less solvent could be used in the batch formulation. Although mixes C and D illustrated that suitable silica powder could be formed without a solvent, certain level of solvent is desired to cause the TEOS to react with the acidified water on a commercial basis. It was concluded that an ethanol-TEOS ratio by volume of 0.1 to 1:1 could be satisfactorily used.

Table V illustrates various changes made in the process to increase the quantity of coarse particles within the powder. It should be noted that samples O and P had the coarsest distributions as a result of fumed silica additions, 16 wt% and 10 wt% respectively. A coarser end product also resulted when samples were dried longer than usual, samples K and L; but the samples were not as coarse as O and P. Samples I and J were fired at 1221.degree. C., 110.degree. C. above normal. These samples showed a decreae in coarseness, possibly due to the higher thermal treatment.

Further work was conducted to produce a silica powder with extremely low levels of carbon. Also, additional work was conducted to increase the particle size of the calcined powder.

Next table VI indicates that evaporation temperatures higher than 45.degree. C. are needed to produce clear gel. Temperatures lower than 45.degree. C. resulted in amber color gel.

The above Table VII illustrates that a firing schedule of about 38.degree. C./hr to a peak temperature of 1221.degree. C. with air flow during the calcining step, results in a silica powder with a very low carbon level.

Addition of sub-micron fumed silica to the sol-gel silica gel was found to dramatically increase the particle size of the calcined powder. Apparently, fumed silica acts as "seeds" which facilitate formation of the silica network during evaporation. The 10 wt% addition of fumed silica was more effective at particle coarsening than the 16 wt% addition.

With reference to FIG. 1, the process comprises mixing a hydrolizable silicon organometallic substance, an industrial grade organic solvent and acidified water at station 12 to form a solution, heating the solution at station 14 at a temperature of from about 45.degree. C. to about 75.degree. C. to form a clear gel, further heating the gel at station 16, at a temperature from about 110.degree. C. to about 150.degree. C. to dry the gel, milling the dried gel at station 18, to form a powder, and then calcining the powder to form the pure silica powder. During the mixing step, fumed silica may be added at station 24. The fumed silica increases the particle size of the calcined silica powder. At station 22, air may be directed upward through the milled powder during the calcining step.

While a preferred embodiment of the present invention has been described and illustrated, the invention should not be limited thereto, but may be otherwise embodied within the scope of the following claims.