Process for the Production of Bipolar Transistors and Complementary MOS Transistors on a Common Silicon Substrate

1. A process for the simultaneous production of bipolar transistors and complementary MOS transistors on a p-doped silicon substrate which comprises: (a) implanting n-doping ions into said substrate to form buried n.sup.+ -doped zones, (b) applying a doped epitaxial layer to the entire surface of said substrate, (c) applying a double layer of silicon oxide and silicon nitride over said surface, (d) producing field oxide regions to separate the active transistor zones in said substrate by local oxidation using the silicon nitride layer as an oxidation mask, (e) producing n-zones and p-zones in said substrate by implanting n- and p-doping ions and simultaneously producing zones for a deeply extending collector terminal, (f) removing the oxide/nitride double layer, (g) producing a first insulating layer over the entire surface with a thickness sufficient to provide an etch-stop layer for the subsequent structuring of the base contact layer structure, (h) etching away said first insulating layer from the bipolar transistor zones at least in the base zone and the emitter zone, (i) depositing a p.sup.+ -conducting layer of polysilicon, a metal silicide or a double layer of polysilicon and metal silicide over the entire surface, (j) depositing a second insulating layer over the entire surface, (k) etching the two layers to produce vertical sidewalls therein, to expose the substrate and define the base zone of said bipolar transistors, (l) implanting boron ions to form an active base zone in said substrate, (m) depositing a third insulating layer over the entire surface to provide edge coverages of said p.sup.+ -conducting layer and said second insulating layer, (n) anisotropically etching said substrate to form lateral insulating strips at the sidewalls of the p.sup.+ -conducting layer structures and to etch free the substrate surfaces in the active zones of the MOS transistors and in the collector zone of the bipolar transistors, (o) applying a gate insulating layer on the MOS transistors, (p) depositing a first polysilicon layer over the entire surface to a thickness of less than 150 nm, and doping said layer with phosphorus ions, (q) structuring said first polysilicon layer and the underlying gate insulating layer such that the silicon substrate surface is exposed in the emitter and collector zones, (r) depositing a second polysilicon layer over the entire surface to a thickness of from 100 to 300 nm, (s) structuring said first and second polysilicon layers to produce gate electrodes of the MOS transistors and the collector and emitter contact zones of said bipolar transistors, (t) implanting phosphorus ions to produce the source/drain terminal zones of the n-channel MOS transistors, (u) implanting arsenic ions to produce the source/drain zones of the n-channel transistors and to dope the emitter and collector zones of the bipolar transistors, (v) implanting boron ions to produce the source/drain zones of the p-channel transistors, (w) applying an intermediate layer serving as an insulating oxide, (x) subjecting the substrate to a high temperature on the order of 900.degree. C. to diffuse arsenic into the source/drain zones and into the emitter and collector zones as well as to diffuse boron into the source/drain zones and into the base contact zones, and (y) applying metallic electrodes.

2. A process according to claim 1 wherein process step (1) is carried out without photo-resist masking.

3. A process according to claim 1 wherein between process steps (t) and (u) the sidewalls of the gate electrodes of the MOS transistor, of the collector and emitter contacts, and of the base contact covered by said third insulating layer are provided with an additional SiO.sub.2 layer.

4. A process according to claim 1 in which prior to the formation of said metallic electrodes, the contacts of all the active zones of the transistors except for the base terminal zone of the bipolar transistor are provided with a metallization by the selective deposition of a metal silicide or a metal which forms a silicide.

5. A process according to claim 1 wherein following process step (c), silicon etching is carried out in the field oxide zones to obtain a planar surface.

6. A process according to claim 1 wherein prior to process step (d) boron implantation is carried out to produce channel-stop zones beneath the field oxide zones.

7. A process for the simultaneous production of self-adjusted bipolar transistors and complementary MOS transistors on a doped silicon substrate which comprises: providing active zones for the MOS transistors in said substrate, applying a protective oxide layer over said active zones, said protective oxide layer having a thickness sufficient to function as an etch-stop layer for the structuring of the subsequently formed base contact layer structure, applying a gate electrode material consisting of a first layer of (a) polysilicon or (b) a double layer of polysilicon and metal silicide over the entire surface, doping said polysilicon layer with phosphorus, removing the doped layer and oxide layer from the zones where the bipolar transistors are to appear, depositing a second polysilicon layer over the entire surface, structuring the first and second polysilicon layers with a photoresist mask to produce gate electrodes and emitter and collector contact zones, and implanting lightly doped source/drain terminal zones of the n-channel MOS transistors using the same photoresist mask used for structuring said gate electrodes and emitter.