US 4,678,936 AGrant
MOS-cascoded Bipolar Current Sources in Non-Epitaxial Structure
Issue Date:1987-07-07
•12 Claims
•3 Drawing Sheets
Abstract
A 16-bit D/A converter formed on a single monolithic chip and having two cascaded stages each including a 256-R resistor string DAC. The analog output voltage of the first stage is coupled to the second stage by two buffer amplifiers each formed by a non-epitaxial process using a P-type substrate. The amplifiers include NMOS and PMOS-cascoded bipolar current sources arranged to avoid the use of metallization to provide for electrical interconnections within the source.
Metadata
Assignee
- Analog Devices, Incorporated
Inventor
- Peter R. Holloway
Application Information
Application Number:US 9123156
Filing Date:1986-09-29
Priority Date:1984-02-17
Art Unit:254
Classifications
IPC:
H03K 320H03K 3353H01L 2702G05F 304
Field of Search:
35730732333043;42;41303;296 R;570;446;304372;315299;300;311
Patent Drawings (3 sheets)
Description
Background of the Invention
1. Field of the Invention
This invention relates to current sources formed on an integrated-circuit (IC) chip. More particularly, this invention relates to MOS-cascoded bipolar current sources such as may be used as part of a high-performance amplifier circuit. The invention is described herein for use in amplifiers employed in a cascaded two-stage D/A converter.
2. Description of the Prior Art
Susset U.S. Pat. No. 3,997,892 shows a two-stage cascaded D/A converter wherein the first stage includes a resistor-string DAC to produce a first segment voltage corresponding to a set of higher-order input bits. That voltage is directed through buffer amplifiers to the second stage converter which interpolates the selected first-stage segment voltage in accordance with the lower-order bits.
For such a converter to perform successfully at high resolutions, such as 16-bits, the inter-stage buffer amplifiers must meet extremely stringent specifications. It has been found that such specifications cannot be achieved using known techniques.
Summary of the Invention
An IC amplifier design is provided utilizing uniquely-configured MOS-bipolar current sources which significantly enhance the performance of the amplifier. These current source structures are formed using an N-well non-epitaxial IC process, and advantageously make possible inter-connections within the current source without the need for bridging metallization. Although the current sources are disclosed in an amplifier implementation, such current sources can find application in other types of integrated circuits.
Still other objects, aspects and advantages of the invention will in part be pointed out in, and in part apparent from, the following description of a preferred embodiment considered together with the accompanying drawings.
Brief Description of the Drawings
FIG. 1 is a simplified diagrammatic showing of a two-stage cascaded D/A converter;
FIG. 2 is a circuit diagram of an amplifier used in the converter of FIG. 1; and
FIGS. 3A, 3B and 3C show details of N-type and P-type MOS-cascoded bipolar current sources formed with a non-epitaxial process, and adapted for use in the amplifier of FIG. 2.
Detailed Description of a Preferred Embodiment
Referring first to FIG. 1, which is a simplified diagram of a 16-bit D/A converter, it will be seen that the device includes two cascaded stages generally indicated at 20 and 22. Each stage comprises a 256-R resistor string 24, 26. Logic circuitry 28, 30 of known type of design is used to develop the switch control signals for the respective stages. Buffer amplifier A.sub.1, A.sub.2 are employed to direct the first-stage segment output voltage to the second stage where it is applied to the ends of the resistor string 26.
The first stage resistor string 24 receives a voltage shown as +V.sub.REF AND -V.sub.REF. That voltage is divided by the resistor string into 256 nominally equal voltage segments. Any two adjacent voltage taps are selected in accordance with the upper byte (8 bits) of the 16-bit input word. Amplifier A.sub.1 transfers the voltage of one selected tap (e.g. tap 251) to the top of the second stage. Amplifier A.sub.2 transfers the voltage from an immediately adjacent tap (e.g. tap 252) to the bottom of the second stage. The output amplifier A.sub.3 produces a signal linearly interpolating the voltage drop between taps 251 and 252, weighted by the lower byte of the 16-bit input word.
Details of the switch selector system and the associated resistor string for this converter are disclosed in copending application Ser. No. 581,133, filed by the present applicant on Feb. 17, 1986, now U.S. Pat. No. 4,543,560.
FIG. 2 shows a simplified circuit diagram of an amplifier suitable for use as amplifiers A.sub.1, A.sub.2 and A.sub.3. These amplifiers were specified to settle to 16 bits in 3 .mu.s and simultaneously be high precision dc op-amps. The amplifier includes a single differential gain stage Q.sub.113, Q.sub.114, which uses an immitance inverter Q.sub.108-112 as a load, followed by an MOS/bipolar unity gain impedance buffer. This dominant pole compensated amplifier achieves an A.sub.VOL of 10.sup.6 through the use of bootstrapping. This minimizes the signal dependent V.sub.CB modulation in Q.sub.113,114 and raises the differential load impedance of the gain stage by a factor equal to the loop gain of the amplifier formed by Q.sub.108-112, and, finally, linearizes the MOS/bipolar unity gain buffer by making V.sub.DS track between M.sub.117 and M.sub.119.
To preserve open loop gain, all current sources (shown as an arrow-in-a-circle) are MOS-cascoded bipolar structures. Details of one such current source are shown at M.sub.113 and Q.sub.133. The resulting impedance enhancement afforded by the reverse voltage transfer ratio of the FET permits an Early voltage of 10.sup.6 volts to be achieved at the drain of M.sub.113. Similarly, Q.sub.104 and M.sub.105 provide the same advantage for sources originating from the positive supply, side-stepping the inherently low impedance of the split vertical/lateral PNP's which are unavoidable device problems in a non-epitaxial process. I.sub.b compensation is provided by a PMOS current reflector, operating in subthreshold, shown in part by M.sub.101-103 and Q.sub.100. The Darlington NPN/vertical output stage has an I.sub.b booster for the output VPNP, Q.sub.122. M.sub.109,110 in conjunction with Q.sub.125,126 boosts the base drive into the output when V.sub.out lags the voltage at the emitter of Q.sub.117 under negative slew. The amplifier occupies 1500 mil.sup.2 and settles to 10 ppm in 3 .mu.s.
The configuration of such P-type and N-type MOS-cascoded bipolar current sources are shown in FIGS. 3A and 3B, representing the cross-section and plan views respectively of the devices. FIG. 3C shows the electrical circuit representation of each device, approximately aligned with the corresponding elements of FIGS. 3A and 3B.
Referring now to the left-hand portion of FIGS. 3A and 3B, the non-epitaxial P-type substrate is doped to form the usual N-well 100. At the left end of the N-well is a first P-type diffusion 102 of generally rectilinear outline which serves as the drain of a PMOS device. The source of this device is formed by a second P-type diffusion 104 having its principal portion arranged as a square-shaped ring. The PMOS gate 106 is positioned between the source and drain.
Within the square ring of diffusion 104 is another P-type diffusion 108 which serves as the emitter of a lateral PNP transistor. The N-type material of the N-well serves as the base of this transistor, and connection is made to the base by an N+ diffusion 109 of generally U-shape and extending partially around the square-ring P-type diffusion 104. The collector of the LPNP is diffusion 104, shared as above by the PMOS source. Thus it will be seen that this diffusion serves as both the collector of the LPNP and the source of the PMOS device.
Since both of these functions are performed by the same diffusion, the PMOS source and the PNP collector are effectively connected together electrically, without any need for bridging metallization. That is, no additional layer of metal has to be added to the substrate to make this connection, which is illustrated in the circuit diagram of FIG. 3C at 110.
No electrode is provided for the P-type diffusion 104, since no external connection is needed to be made to the source/collector of the MOS-bipolar current source. Electrodes are provided for the PMOS drain and for the base and emitter of the LPNP transistor.
A distinct characteristic of the PMOS-bipolar current source is that the entire circuit is integrated into a single N-well, which affords important benefits in carrying out the process.
Turning now to the right-hand portion of FIGS. 3A and 3B, there is shown another N-well diffusion 112 within which is a P-type diffusion 114 containing another N-type diffusion 116. These three elements function respectively as the collector, base and emitter of an NPN transistor. Base and emitter electrodes 118, 120 are formed above the substrate to make the necessary connections.
The N-well 112 is effectively extended laterally by means of an N+ diffusion 122 which overlaps the initial N-type diffusion. The N+ diffusion reaches to a region alongside a gate electrode 124, and a further N+ diffusion 126 is made on the other side of the gate. This latter diffusion serves as the drain of an NMOS device. The source of this device is formed by the N-type material with the N-well 112.
Thus, it will be seen that the N-well 112 (which in this embodiment includes extension 122) serves as both the source of an NMOS device and the collector of an NPN transistor. Accordingly, these two elements are effectively electrically connected, as indicated at 128 in FIG. 3C, without the need for a metallization layer. The inclusion of diffusion 122, a low resistivity source-drain diffusion comparable to that routinely used in N-MOS and CMOS fabrication, is to enhance the performance of the composite structure through the reduction of the ohmic resistance diagrammatically represented as path 128 in FIG. 3C. The operation of this invention is otherwise unaffected by the omission of 122.
Although a preferred embodiment of this invention has been described hereinabove in detail, it is desired to emphasize that this has been for the purpose of illustrating the invention, and should not be considered as necessarily limitative of the invention, it being understood that many modifications can be made by those skilled in the art while still practicing the invention claimed herein.
Claims
What is claimed is:
1. In a monolithic integrated circuit chip having a P-type substrate with an N-well therein; a P-type MOS-cascoded bipolar current source connected in said monolithic integrated circuit for controlling a current thereof and comprising: first and second separate P-type diffusions in said N-well to serve as the drain and source of a PMOS device; a gate positioned between said first and second P-type diffusions; a third P-type diffusion in said N-well separate from said first and second diffusions and serving as the emitter of a lateral PNP transistor having said second P-type diffusion as its collector and said N-well as its base; electrodes making connections to said first and third P-type diffusions and to said N-well; circuit means of said integrated circuit connected to the one of said electrodes making connection with said first P-type diffusion to receive the current flowing through and controlled by said current source; power supply means connected to the one of said electrodes making connection with said third P-type diffusion to apply a supply voltage to said PNP emitter to provide for developing said current flowing through said current source; said second P-type diffusion serving in common as both the source of said PMOS device and the collector of said PNP transistor and being free of any metallization connection thereto, whereby the space of said chip above said second P-type diffusion is available to receive metallization to other circuit elements of said integrated circuit.
2. An integrated circuit as claimed in claim 1, including an N-type diffusion in said N-well to make connection between an electrode and said N-well, said N-well providing the back-gate connection for said PMOS device.
3. An integrated circuit as claimed in claim 2, wherein said second P-type diffusion surrounds said third P-type diffusion.
4. An integrated circuit as claimed in claim 3, wherein said N-type diffusion extends partially around said second P-type diffusion.
5. An integrated circuit as claimed in claim 4, wherein said second P-type diffusion is a ring at least approximately square in shape; said N-type diffusion being at least approximately U-shaped, with the two arms of the "U" extending along two respective parallel sides of the square P-type diffusion.
6. In a monolithic integrated circuit chip having a P-type substrate with an N-well therein; an N-type MOS-cascoded bipolar current source connected in said monolithic integrated circuit for controlling a current thereof and comprising: a P-type diffusion in said N-well to serve as the base of an NPN transistor; an N-type diffusion in said P-type diffusion to serve as the emitter of said NPN transistor; electrodes contacting said P-type and N-type diffusions to make connection to said base and said emitter; power supply means connected to the one of said electrodes making connection to said emitter to apply a supply potential thereto for enabling the flow of current through and controlled by said current source; said N-well serving as the collector for said NPN transistor; an N-type diffusion in said P-type substrate, externally of said N-well, to serve as the drain of an NMOS device; an electrode contacting said external N-type diffusion; circuit means of said integrated circuit connected to said electrode contacting said external N-type diffusion to carry the current flowing through and controlled by said current source; a gate for said NMOS device adjacent said external N-type diffusion; said N-well comprising N-type material extending to a region which is adjacent said gate but on the side thereof which is opposite said external N-type diffusion, said N-type material serving in common as the source of said NMOS device and as the collector of said NPN transistor and being free of any metallization connection thereto, whereby the space on said chip above said N-type material is available to receive metallization to other circuit elements of said integrated circuit.
7. An integrated circuit as claimed in claim 6, wherein said N-well includes an initial N-type diffusion, said N-type material comprising an N+ diffusion partially overlapping said initial N-type diffusion and extending to the side edge of said gate.
8. In a monolithic integrated circuit formed on a substrate, an MOS-cascoded bipolar current source connected as part of said monolithic integrated circuit to supply current of fixed value to elements thereof and comprising: first and second regions of one conductivity type diffused in said substrate to serve as the drain and the source of an MOS device, respectively; a gate positioned between said first and second diffused regions; a third region of said one conductivity type diffused in said substrate separate from said first and second regions, said third diffused region serving as the emitter of a bipolar transistor; a fourth region of a conductivity type opposite said one conductivity type diffused in said substrate between said second and third diffused regions to serve as the base of said bipolar transistor; said second diffused region serving as the collector of said bipolar transistor as well as serving as the source of said MOS device; first and second power supply terminals for said integrated circuit; and circuit means connecting said current source in series with said integrated circuit elements and between said power supply terminals so that said current source controls the flow of power supply current through said elements.
9. In a monolithic integrated circuit as in claim 8, wherein said substrate is P-type and free of any epitaxial layer.
10. In a monolithic integrated circuit as in claim 8, including an N-well diffused in said substrate to serve as one of said diffused regions and containing at least one other of said diffused regions, said one other region being of P-type.
11. In a monolithic integrated circuit as in claim 10, wherein said first, second and fourth regions are P-type and are diffused in said N-well.
12. In a monolithic integrated circuit as in claim 10, wherein said first and second regions are N-type; said N-well comprising said second region; said fourth region being of P-type and wholly located within said N-well; said third region being of N-type and wholly located within said fourth region.