Background of the Invention
The present invention relates to a vibration sensor of a type using a piezoelectric element and which is used, for example, to sense the knocking or vibration of an internal combustion engine.
In this type of vibration sensor, it is necessary to provide a resistor in parallel with the piezoelectric element in order to reduce the amount of thermally generated noise when the piezoelectric element is rapidly heated and cooled and to cope with disconnection failures involving the leads of the element. Such an arrangement is shown schematically in FIG. 1.
In the conventional vibration sensor of this type, the resistor has been provided outside the casing of the piezoelectric element. This has the drawback of additional wiring steps and the possibility of failure due to the breakage of the resistor or the cutting of its circuit leads.
Summary of the Invention
Accordingly, an object of the present invention is to eliminate the above-mentioned drawbacks of the conventional vibration sensor.
In accordance with the present invention, a resistor is provided inside the casing of the piezoelectric element connected in parallel therewith. The resistor is mounted on one surface of the piezoelectric element and is preferably made thin so as to not take up a significant amount of space inside the casing.
More specifically, the present invention provides a vibration sensor having a casing inside of which a resonant plate is received, with the piezoelectric element being mounted to the casing via a metal plate. A first electrode on one side of the piezoelectric element abuts the metal plate. This first electrode has an extended portion which is wrapped around an edge of the piezoelectric element, extending to the opposite surface thereof. A second electrode is disposed upon this opposite surface with a nonconductive gap being formed between a portion of the second electrode and the extended portion of the first electrode. In accordance with one embodiment of the invention, a resistor formed by a resistive paste bridges the gap, connecting the extended portion of the first electrode to the second electrode therethrough. In accordance with another embodiment of the invention, the resistor is formed by a thin chip.
Brief Description of the Drawings
FIG. 1 is a schematic diagram of a conventional vibration sensor;
FIG. 2 is a cross-sectional view of a vibration sensor of the invention;
FIG. 3 is a bottom view of a piezoelectric element of the vibration sensor of FIG. 2;
FIG. 4 is a top view of the piezoelectric element;
FIG. 5 is a cross-sectional view of the piezoelectric element;
FIG. 6 is a top view of a piezoelectric element of another embodiment of the invention; and
FIG. 7 is a cross-sectional view of the piezoelectric element of FIG. 6.
Description of the Preferred Embodiments
Referring now to FIG. 2, a vibration sensor of the invention will be described.
The vibration sensor includes a metal casing 9 having a cylindrical portion joined at one end to a threaded shank 10, the latter being screwed into the housing of the engine or other location where the sensor is to be employed. Above the threaded shank 10 is provided an integral post 11, upon which a metal plate 1 is fixed. A piezoelectric element 2 is mounted on the metal plate 1, the metal plate 1 and the piezoelectric element 2 together constituting a resonant plate 8. The inner chamber of the casing 9 in which the piezoelectric element 2 is received is closed by a cap 13, hermetically sealed to the upper rim of the casing 9 with a sealant 12. Terminals 14 and 15 pass through respective holes bored to the cap 13. The terminal 14 is connected via a lead wire 14a to the metal plate 1, while the terminal 15 is connected via a lead wire 15a to an electrode on the opposite surface of the piezoelectric element 2.
The piezoelectric element 2 is shown in more detail in FIGS. 3 to 5 of the accompanying drawings. Electrodes 3 and 4 are deposited on opposite surfaces of a disk-shaped body of piezoelectric material. The electrode 3 is mounted in contact with the metal plate 1. The electrode 3 has an extended electrode portion 3a which is wrapped around the edge portion of the piezoelectric body and extends across a small portion of the opposite surface. The electrode 4 has a crescent-shaped cut-out portion opposing the edge of the end portion of the extended electrode portion 3a, thus forming therebetween a gap 5 containing no conducting material. Across the gap 5 is deposited a layer of resistive material 6, such as in the form of a resistive paste. The paste may be applied by printing or the like. The resistive layer 6 thus interconnects the electrodes 3 and 4, acting as a resistor connected in parallel with the piezoelectric element.
In another embodiment shown in FIGS. 6 and 7, the layer 6 is replaced by a chip resistor 6' formed, for example, by applying a resistive paste to the surface of a thin alumina plate 7 acting as a carrier plate. The alumina plate has a slit 6'a aligned with the gap 5 so as to prevent short circuiting between the ends of the resistor. Otherwise, the piezoelectric element of this embodiment is constructed the same as that first described.
Furthermore, although a disk-shaped piezoelectric body is employed in the above-described embodiments, the invention is not limited to such a shape. For instance, the piezoelectric element can be annularly shaped, rectangularly shaped, or the like. Moreover, the supporting post 11 is not limited to a single such post, and two posts can be provided to support the resonant plate 8 at two points. Also, the piezoelectric element 2 may be mounted in a cantilevered arrangement whereby it is connected to the inner surface of the cylindrical portion of the casing 9 at one end of the element 2.
With the inventive vibration sensor as described above, the resistor connected in parallel with the piezoelectric element is provided as an integral part of the sensor. That is, it is not necessary with the invention to provide an external resistor. Accordingly, the ease of installation and the reliability of the vibration sensor are much improved compared with the conventional device. Moreover, by using a thin element as the resistor, the overall size of the devices not increased.
This completes the description of the preferred embodiments of the invention. Although preferred embodiments have been described, it is believed that numerous modifications and alterations thereto would be apparent one having ordinary skill in the art without departing from the spirit and scope of the invention.