US 4,665,463 AGrant
Electrostatic Chuck
Issue Date:1987-05-12
•7 Claims
•1 Drawing Sheets
Abstract
An electrostatic chuck (1) for holding a semiconductor wafer (5) comprises a dielectric layer (4) on a supporting electrode (2). The wafer is clamped flat against the dielectric layer when a potential difference is applied between the wafer and the electrode. The dielectric is loaded with a thermally conductive material to improve the dissipation of heat generated in the wafer during a processing treatment such as exposure to an electron beam. The dielectric also has charge retention properties so that the wafer can be transported still clamped to the chuck without the need for a permanent electrical connection nor additional mechanical clamping members.
Metadata
Assignee
- U.S. Philips Corporation
Inventors
- Rodney Ward
- Ian H. Lewin
Application Information
Application Number:US 9047832
Filing Date:1986-09-04
Priority Date:1983-09-30
Art Unit:211
Classifications
IPC:
H01F 1302
Field of Search:
361269279233;234;230329;9091 M
Patent Drawings (1 sheets)
Description
An embodiment of the invention will now be described, by way of example, with reference to the accompanying drawing in which:
the single FIGURE is a cross sectional view of a semiconductor wafer held on an electrostatic chuck in accordance with the invention.
The electrostatic chuck 1 comprises an electrically conductive member in the form of a circular aluminium plate 2 which is 92 mm in diameter and 5.3 mm thick. Plate 2 is surrounded by contact means in the form of an aluminium annulus 3 having an external diameter of 150 mm and an internal diameter of 96 mm. The thickness of annulus 3 is 5.5 mm. Plate 2 is centrally disposed with respect to annulus 3. The space between the plate 2 and the annulus 3 is filled with epoxy resin, in particular Araldite (trade mark), loaded with particulate alumina or mica. A suitable loaded epoxy is commercially available from Messrs. Emerson and Cuming, Canton, Mass. U.S.A. under the trade mark Stycast 2651. Above the plate 2 the epoxy resin is filled to the level of the annulus 3 to form a dielectric layer 4. The thickness of dielectric layer 4 is approximately 200 micrometers. The upwardly directed surface of the dielectric layer 4 and the annulus 3 is made flat to within approximately .+-.5 micrometers by superfinishing. A 4 inch diameter semiconductor wafer 5 is located centrally on the chuck on the major surface remote from the electrically conductive plate 2. Over the major part of its back surface the wafer 5 is in contact with dielectric layer 4, but around its periphery it is in contact with the aluminium annulus. A portential difference V of typically 3 kv is applied between the plate 2 and the annulus 3. This results in firm effective clamping of the wafer aginst the chuck 1. However when the chick is disconnected from the voltage source V dielectric layer 4 retains charge and the residual charge is sufficient to hold the wafer firmly in place for handling and transport without the need for further retaining means. In this way the wafer can be loaded into processing apparatus, for example an electron image projector, already clamped on the chuck. Inside the processing apparatus the voltage source can be reconnected for maximum clamping during the processing treatment. Heat generated in the wafer during the processing treatment readily flows away through the dielectric layer 4 to the plate 2 which acts as a heat sink. After the processing treatment has been carried out the voltage source can be disconnected and the wafer removed from the apparatus still held in place on the chuck against because of the residual charge in the dielectric layer.
Applicants have found that the residual charge leaks away slowly allowing the wafer to be released easily after about 24 hours. If desired, however, the wafer can be released more immediately simply by prying it off, or preferably with the aid of air jets. In the latter case a duct in the form of a 4 mm diameter aperture 6 with a cicular cross-section is provided at the centre of the chuck extending through the full thickness of the dielectric layer 4 and the plate 2. A jet of air directed vertically from the back side of the chuck, i.e. the side remote from the wafer 5, through the duct 6 towards the back surface of the wafer 5, acts to lift the wafer slightly off the chuck. The wafer 5 can then be floated laterally away from the chuck on a jet of air directed horizontally across the front surface of the chuck. Alternatively, once the wafer has been lifted from the chuck by the vertical air jet the chuck can be tilted for the wafer simply to slide off.
In the light of the above description it will be evident that many modifications may be made within the scope of the present invention. Thus, for example, more than one aperture may be provided in the chuck for ducting the air jets to the back surface of the wafer. As another example the central conductive plate 2 need not be flush with the back surface of the chuck but instead may be buried in--and so fully surrounded by--the dielectric material. In this case the conductive plate 2 is contacted by an electrical connection which passes through the dielectric material at the back side of the chuck.
Although the previous description is directed to holding a semiconductor wafer it is noted here that an electrostatic chuck in accordance with the present invention is also suitable for holding other substrates having at least some electrically conducting properties, for example and electrically conductive substrate or an insulating substrate having a conductive or semiconductive coating or surface region.
Claims
We claim:
1. An electrostatic chuck for holding a semiconductor wafer in intimate contact therewith under the action of Coulombic forces, comprising a layer of dielectric material on an electrically conductive member, said dielectric material being loaded with a particulate material of relatively high thermal conductivity so that the layer has enhanced thermal conduction for dissipating heat from a semiconductor wafer held by said chuck, said dielectric material also being capable of charge retention for retaining said wafer in intimate contact with said chuck after both the generation of an electric field therebetween by an applied electric voltage and the discontinuation of the applied voltage which generated said electric field.
2. An electrostatic chuck as claimed in claim 1, further comprising electrical contact means for electrically contacting the semiconductor wafer.
3. An electrostatic chuck as claimed in claim 2, wherein the electrical contact means is in the form of an electrically conducting annulus surrounding the electrically conductive member, the annulus being thicker than the electrically conductive member.
4. An electrostatic chuck as claimed in any of the preceding claims, wherein the electrically conductive member and the electrical contact means are bonded together in spaced relation by the dielectric layer.
5. An electrostatic chuck as claimed in claim 4, wherein the dielectric material comprises epoxy resin loaded with a material having a relatively high thermal conductivity.
6. An electrostatic chuck as claimed in claim 5, wherein the epoxy resin is loaded with particulate mica or alumina.
7. An electrostatic chuck as claimed in claim 6, further comprising ducting means extending through the thickness of the dielectric layer and the electrically conductive member.