Background of the Invention
1. Field of the Invention
This invention relates generally to heating and air conditioning systems and, more particularly, to a solid state heating and air conditioning system employing thermoelectric modules.
2. Description of the Prior Art
As is well-known, the costs associated with heating and cooling the interior of a structure such as a residence, office, etc. are increasing dramatically due to the current energy shortages. The conventional freon-pumped systems suffer from several disadvantages. First, both the initial costs of manufacture and installation are high. Second, such systems are expensive to operate and maintain. Third, the conventional systems are complex and require many moving parts. As a result, maintenance is often a problem. Another disadvantage resides in the fact that standard central heating/air conditioning systems generally operate off a single thermostat and therefore cannot maintain individual room temperatures. Finally, it is well-known that freon is detrimental to the Earth's ozone layer.
In a thermoelectric cooling system, a cold junction is produced where heat is absorbed by electrons while moving from a lower energy state to a higher energy state. A power supply provides the energy required to move the electrons through the energy state system. A heat exchanger is attached to a hot junction to expel excess heat.
Thermoelectric cooling "couples" are made from two elements of semiconductor material, primarily Bismuth Telluride, heavily doped to create an excess (N-type) or a deficiency (P-type) of electrons. Heat absorbed at a cold junction is pumped to a hot junction at a rate proportional to the current passing through the "couple". In practical applications, a plurality of couples are combined in a module where they are connected in series electrically and in parallel thermally. Such modules are commercially available from Material Electronic Products Corporation, Trenton, N.J.
The use of such thermoelectric heat pumps has thus far been limited to situations arising out of special considerations such as size, space, weight, environmental conditions, etc. For example, a typical unit measures one inch by one inch by 0.25 inches thick. Use may be found in military and aerospace applications, laboratory and scientific equipment, mobile refrigerators such as recreational vehicle refrigerators and mobile home refrigerators, portable picnic coolers, cream and butter dispensers, beverage coolers, etc.
Summary of the Invention
It is an object of the present invention to provide an improved heating and air-conditioning system.
It is a further object of the present invention to provide an air conditioning and heating system which utilizes solid-state thermoelectric modules.
It is a still further object of the present invention to provide a freon-free air-conditioning/heating system.
Yet another object of the present invention is to provide an air-conditioning/heating system which utilizes a closed loop feedback system to maintain a desired temperature and is capable of maintaining individual room temperatures.
It is a still further object of the present invention to provide an air-conditioning/heating system which is smaller and less complex than conventional systems.
It is yet another object of the present invention to provide an air-conditioning and heating system that is less expensive to manufacture, install and operate than conventional systems.
A still further object of the present invention is to provide an improved solid-state air-conditioning/heating system which provides for continuous air circulation.
Another object of the present invention is to provide an improved air-conditioning/heating system which may be powered by batteries or solar cells.
According to a broad aspect of the invention there is provided a solid state heating and cooling apparatus for controlling the temperature of a room, comprising: at least one thermoelectric module having first and second sides, said first and second sides being hot and cold respectively when current passes through said module in a first direction and becoming cold and hot respectively when said current passes through said module in a second opposite direction; first means for supplying said current to said at least one thermoelectric module; a first inlet duct leading from said room to a first region proximate said first side; a first outlet duct leading from said first region to said room; a first fan for causing air to flow from said room to said first region via said first inlet duct and from said first region back to said room via said first outlet duct so as to cool said room when said first said is cold and to heat said room when said first side is hot; a second inlet duct leading from an area apart from said room to a second region proximate said second side; a second outlet duct leading from said second region to a region apart from said room; a second fan for causing waste air to flow into said second inlet duct, past said second region and out said second outlet duct; and second means for reversing the direction of current flowing through said at least one thermoelectric module.
The above and other objects, features and advantages of the present invention will be better understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Brief Description of the Drawings
FIG. 1 is a schematic diagram of a first embodiment of the inventive solid state heating and cooling apparatus of the present invention;
FIG. 2 is a schematic diagram of a second embodiment of the inventive solid state heating and cooling apparatus of the present invention; and
FIG. 3 is a plan view of the inventive solid state heating and cooling apparatus of the present invention.
Description of the Preferred Embodiments
Referring to FIG. 1, air-conditioning power is applied to the inventive solid state heating and cooling apparatus via a connector 10 having a ground conductor 12 coupled to ground, having a first conductor 14 coupled to a first terminal of a protective fuse 16, and a third conductor 18 coupled to a first terminal of a full wave bridge rectifier 20 and to first terminals of fans 22 and 24. The other side or second terminal of fuse 16 is coupled to a first terminal of a main on/off switch S.sub.1, the output of which is coupled to an input of air-conditioning voltage control unit 26 and to a second terminal of fans 22 and 24 via varactor 28. The output of air-conditioning voltage control unit 26 is coupled to a second input of the full wave bridge rectifier 20.
The positive and negative output of full wave bridge rectifier 20 are coupled via a filter to the positive and negative input of a polarity reversal circuit 30. The filter comprises resistor R1, capacitors C.sub.1 and C.sub.2 and inductor L.sub.1. A thermocouple-type pickup 32 is coupled to voltage control unit 26 and to polarity reversal circuit 30 for the control thereof.
First and second outputs 34 and 36 are coupled to first and second inputs of a plurality of series-coupled thermoelectric modules 38 of the type described hereinabove. Also coupled in series between outputs 34 and 36 of polarity reversal circuit 30 are resistors 40 and 42 and the parallel combination of oppositely poled diodes 44 and 46 for purposes to be described hereinbelow.
The circuit operates as follows:
Power is applied via connector 10, fuse 16 and main off/on switch S.sub.1 to continuous running fans 22 and 24. Fan 22 is mounted on the room side of the unit, while fan 24 is mounted on the waste side of the unit. Thermocouple 32 measures the temperature of the incoming air, and controls voltage control unit 26 so as to control the amount of air-conditioning power which is applied to the full wave bridge rectifier circuit 20. As thermocouple 32 senses the need for heat, it directs polarity reversal circuit 30 to assume a state such that light-emitting diode (LED) 44 is forward biased and light emitting diode (LED) 46 is reverse biased. If light-emitting diode 44 is red and light-emitting diode 46 is green, then a red signal will indicate that the apparatus is operating in the heating mode with current flowing through the series coupled thermoelectric modules 38 in a direction to create a hot side adjacent fan 22. Thus, heat will be radiated in the room.
When thermocouple 32 senses the need of cooling, it causes polarity reversal circuit to reverse polarity causing current to flow through the thermoelectric modules 38 in a opposite direction creating a cold side adjacent fan 22 thus absorbing heat from the room. In this case, light-emitting diode 46 is forward biased. The light-emitting diodes not only indicate whether the apparatus is operating in a cooling or heating mode, but they also indicate by their intensity how hard the unit is heat pumping.
The filter formed by capacitors C.sub.1 and C.sub.2 and inductor L.sub.1 is an active LC filter which reduces ripple to within 10 percent of the operating voltage. As will be apparent to one skilled in the art, the values of C.sub.1, C.sub.2 and L.sub.1 will vary in accordance with the voltage and load.
As stated previously, the thermoelectric modules are arranged in series. This provides a higher voltage and less current whereas a parallel arrangement would provide higher current and a lower voltage. Thus, the series arrangement simplifies power supply requirements.
FIG. 2 illustrates an alternate embodiment of the circuit shown in FIG. 1 with the greatest difference being that the circuit shown in FIG. 2 is not automatic but requires manual intervention to change the operating mode from heating to cooling and vice versa. Like elements have been denoted with like reference characters. It will be first noted that varactor 28 has been omitted from FIG. 2 and that the full wave bridge rectifier 20 in FIG. 1 is now shown as diodes D1, D2, D3 and D4 in FIG. 2. The LC filter shown in FIG. 1, has now been replaced with an alternate filter embodiment comprising capacitor C.sub.1 and C.sub.2 and resistors R2, R3 and R4.
The system is placed either in a heating or cooling mode by properly positioning arms 54 and 56 of switch S2 with respect to terminals 58, 60, 62 and 64. That is, with arms 54 contacting terminal 58 and arm 56 contacting terminal 60, then current flows such as to forward bias diode 56 and produce a cold side on thermoelectric modules 38 which is adjacent the exterior fan so as to absorb heat from the room and create a hot side adjacent fan 24 which is directed away from the room to be cooled. Similarly, when arm 54 and arm 56 are contacting terminals 62 and 64 respectively, current flows so as to forward bias diode 44 and create a hot side of thermoelectric modules 38 adjacent interior 22 so as to radiate heat into the room and a cold side adjacent waste fan 24.
FIG. 3 is a plan view of a solid state heating and cooling apparatus employing the circuitry of FIGS. 1 and 2 and which may be installed at ceiling level in a room to be controlled, or actually in the ceiling, or within existing ductwork. As can be seen, a plurality of series connected thermoelectric modules 60 is positioned with heat sinks 62 and 64 adjacent opposite sides thereof. Heat sinks 62 and 64 may, for example, be aluminum fin heat sinks. An inlet fan 66 is positioned adjacent a plurality of air inlet louvers and rotates so as to direct air from the room to be controlled through a duct 68 and past heat sink 62 to an outlet duct 70 and through a plurality of air outlet louvers 72 into the room to be controlled. If, for example, the system is operating in a heating mode, heat sink 62 will be adjacent to the hot side of thermoelectric modules 16 and heat sink 64 will be adjacent the cold side. Air from the room to be controlled will be pulled into duct 68 by fan 66 and past heat sink 62 where it will be heated and directed via duct 70 through louvers 72 and into the room to be heated. A waste air fan 74 is positioned adjacent a waste air inlet 76 for directing air through duct 78 and past heat sink 64. This air then exits by means of the waste air outlet 80. Heat from the waste air traveling through duct 78 will be absorbed by heat sink 64 and cooler air exiting outlet 80 will be directed to an area outside the room to be controlled. The filter capacitors 82 and 84, the full wave bridge rectifier 86, the on/off switch 88 and fuse 90 may be positioned as shown. The switch may also function as a heat/cool switch, and power is supplied to the circuit via connector 92 and cord 94.
If the system is operating in the cooling mode, the cold side of thermoelectric modules 60 will be adjacent sink 62 while its hot side will be adjacent to sink 64. In this case, air passing into duct 68 via fan 56 will pass by sink 62 and in doing so, heat will be absorbed into the sink causing cooler air to flow via duct 70 into the room via louver 72. The waste heat which is being collected in sink 64 is absorbed by cooler air passing into duct 60 by means of fan 74 and passing by sink 64 resulting in hotter air being exited at outlet 80.
Thus, there has been described an improved solid state heating and air-conditioning system which utilizes solid state thermoelectric modules. It is freon free and can be implemented to use a closed loop feedback system so as to maintain a desired temperature in an individual room. Furthermore, its implementation allows it to be smaller and less complex.
The above description is given by way of example only. Changes in form and detail may be made by one skilled in the art without departing from the scope of the invention as defined by the appended claims.