Integrated Circuit Module With Integral Capacitor

It is well known that it is desirable to provide a capacitor in close relationship with an integrated circuit chip to minimize the effects of noise generated by electrical pulses applied during operation of the chip. U.S. Pat. No. 3,880,493 describes one suitable arrangement wherein a capacitor is built into a socket associated with the IC module. This is a satisfactory structure; however, the apparatus of the invention has certain advantages, particularly since it makes it possible to eliminate the IC socket, if desired.

FIG. 1 is an exploded view of the invention;

FIG. 2 is a sectional view of the apparatus of FIG. 1 partly assembled; and

FIG. 3 is a sectional view of a modification of the invention.

An integrated circuit (IC) chip or module 10 embodying the invention includes a ceramic base 20 having a top surface 22 and a bottom surface 24. An IC chip 30, having terminals 32, is secured to the top surface 22, along with a lead frame comprising a plurality of leads 40, each of which is suitably connected to one of the output terminals 32 on the IC chip 30. The leads 40 have portions 42 which engage the top surface of the base and external contact portions 44 which extend downwardly therefrom so that they can be inserted into a socket, a printed circuit board, or the like. In addition, two leads 50 are provided at opposite portions of the base, these leads having pads 52 which engage the top surface of the base and depending contact portions 54 for connection, one to the system power supply and one to ground.

The module 10 includes a cover 60 which is also of a ceramic, or any suitable material, which serves as a dielectric medium for a capacitor 70, which is embedded in it. The capacitor 70 is generally of the type shown in U.S. Pat. No. 3,880,493 and is made up of two sets of interleaved metal plates 72 and 74. The plates are as large as possible, and they are as close together as possible, and one set has a lead 76 extending along one end of the cover, and the other set has a common lead 78 extending along the other end of the cover. The leads extend vertically downwardly to the lower surface of the cover where they terminate in contact pads 80 and 82. The pads 80 and 82 are near opposite corners of the lower surface of the cover so that, when the cover and base are assembled, the pads make contact with the pads 52 of leads 50. If desired, or if necessary, spring contacts 84 or the like may be provided between the pads 80-52 and 82-52, as shown in FIG. 3.

The cover and base may be sealed together by means of a glass frit seal, as is well known in the art and as illustrated in FIGS. 1 and 3.