High Voltage Cable Splicing-Condensation Reaction

This invention relates to the field of electrical cable splicing and more particularly to a novel technique for providing insulated splices for high voltage cables.

High voltage cables that are used to transmit substantial quantities of electrical power either above ground or underground, frequently require splicing either during the installation in the field, or during down time, i.e. repair. Several general techniques are known for handling such situations.

One method known to applicant is to provide a traditional cable splice, and to then take the spliced section of cable, insert it into a protective sheath or housing, and encapsulate the spliced cable segment. Such a technique and the apparatus therefore is disclosed and claimed in the Hankins et al. U.S. Pat. No. 3,992,569 assigned to Hexcel Corporation.

Another technique is disclosed in Filreis et al. U.S. Pat. No. 3,879,249 wherein a stiff resilient polymeric plastic sheet having a special surface of grooves and lattice work is provided and which sheet may be shaped to form a closure or mold about a splice. As a closure, dirt and dust are sealed out, and as a mold it can serve to shape insulating self-curing resinous compositions applied in a liquid form about the splice.

A very common technique employs a liquid potting method, which is reasonably economical but is primarily intended for low kilovolt transmissions because the materials available for the potting do not bond well to the crosslinked polyethylene or ethylene-propylene insulation used on high voltage cable. Applicant is aware however of a liquid slurry method claimed by Nakata in U.S. Pat. No. 3,996,081 issued Dec. 7, 1976 to be suitable for high voltage cable splice application.

One of the more popular techniques involves the use of tape wrapping followed by the application of high pressure by means of a hydraulic press and subsequent cure at elevated temperatures. This technique is not only costly, but slow, due to extended cure cycles. The emphasis today is on the development of in the field splicing techniques which hopefully can be provided quickly and cheaply while being suitable for high voltage applications. A paper covering Hexcel Corporation's research and development of a field molded splice for use on either crosslinked polyethylene or ethylene propylene rubber insulated, solid dielectric cables was presented at the IEEE Southeast Conference in 1975. This paper relating to that company's HOTSPLICER.TM. is incorporated herein by reference. A patent known by applicant that relates to such a tape wrapping technique, but not assigned to Hexcel is U.S. Pat. No. 3,970,488 issued July 20, 1976 to Nelson. As is recited therein, the generalized technique for making such a tapewrapped splice requires that the ends of the two cables to be spliced together are subjected to a plurality of steps. Firstly, they are prepared by removing a portion of the outer cable jacket, folding back the electrically conductive outer metallic shield, removing a portion of the underlying outer semiconducting screen, penciling the cable insulation down to the inner semiconducting screen, and removing a portion of the inner semiconducting screen to expose the central conductors. The two exposed central conductor end portions are next mechanically and electrically coupled together by means of a conventional connector, e.g. a connector sold in the trade as a CADWELD connector. The splice is next covered with one or more layers of semiconducting tape, and an electrically insulative jacket is molded onto the splice and adjacent regions of the cable insulation, after which a layer of semiconducting material is applied to the outer surface of the insulative mold, a layer of metal gauze material is wrapped around the semiconductive material, secured in place and soldered to the electrically conductive outer metallic shield and the splice is finished off with a layer of conventional electrician's tape.

The insulative jacket is molded to the cable splice by wrapping strips of semiconductive molding compound over the semiconducting tape, wrapping strips of electrically insulative thermosetting molding compound under heat and pressure into the mold chamber to soften the semiconducting and insulative molding compounds and bond them to the various surfaces with which they make contact, and curing the molded splice.

The concept of this invention is to provide a monolithic structure of crosslinked insulation for the splice of two high voltage cables.

The cable is stripped, the semiconducting strand screen is exposed by cutting back the insulation, the insulation is shaped at its termini. The cable ends are joined by crimping the two together or by welding with fusible alloy. Semiconducting tape is wrapped in place. A mold is fixed in place, and a castable composition of this invention is added and allowed to cure to a monolithic impermeable structure which is bonded to the insulation material of the cable, and also to the semiconducting strand screen and the optical semiconducting insulation screen if present.

Accordingly it is an object of this invention to overcome the disadvantages of the prior art splicing systems.

Another object is to provide an easy to use field employable cable repair system.

Yet another object is to provide a crosslinked plastic outer layer for a high voltage splice that bonds to both the insulation and the semiconducting strand screen.

A further object is to provide a two step cure which includes a chain extension followed by a graft copolymerization.

Yet another further object is to employ as the chain extended liquid polyolefin for reaction with cable insulation, one or more liquid polyolefins having at least one condensable moiety thereupon which is chain extended by a condensation reaction.

For a fuller understanding of the nature of advantages of this invention, reference should be made to the following detailed descriptive taken in conjunction with the accompanying drawings.

FIG. 1 is a longitudinal sectional view showing the cable splice of this invention in the mold.

FIG. 2 is a side electrical view showing one embodiment of insulation layer end shaping according to the invention.

FIG. 3 is a side sectional view showing a second embodiment of insulation layer end shaping according to the invention.

FIG. 4 is a perspective cutaway view showing a mold as in FIG. 1 with two electrically joined cable sections therein.

As can be seen from FIG. 1, two cable sections are to be joined together, one of which is shown in both FIGS. 2 and 3. The difference between the two figures refers solely to tailoring and not to the details of the cable unit per se.

It is understood that the two cables of FIG. 1 are substantially identical and as such only one will be described in detail.

Each cable section comprises a conductor section 14, insulation 16 surrounding the conductor section, a tubular metal sheath 18 surrounding the insulation 16. Sheath 18 can be either of sheet, taped or braided construction. Each cable section, as seen in FIG. 2, has been prepared for formation of the splice by removal of insulation 16 from its end to provide an exposed end portion of the conductor section and by removal of some of the metal sheath 18 to provide exposed insulation 16 projecting past the end of the metal sheath. The end of insulation 16 is preferably formed into a tapered configuration, as illustrated in FIG. 2.

The only differences between FIG. 2's embodiment and that of FIG. 3 is in the end treatment. That end strand of FIG. 2 is designated by a pencil taper end shape while that of FIG. 3 is a notch configuration of the insulation. Either of these or any other suitable configuration for end treatment of the insulation layer 16 may be employed with the instant insulation.

In order to practice my invention, the following general procedure is employed: The cables 12 and 14 to be joined are stripped clean at the ends for a sufficient length to allow for adequate handling. Then the cable insulation 16 is cut back from each end to provide adequate exposure of the semiconducting strand screen, 20. The insulation layer is end shaped using standard cutting tools preferably to a pencil taper, per FIG. 2 or a notched configuration, FIG. 3; or to any other convenient configuration. The metal cable ends, 14, are then joined by using a conventional crimping device or by welding with a fusible alloy, such as the commercially available Cadweld.RTM. joining compound. The joint 24 is made smooth, and a uniform layer of semiconducting tape 22 is applied. The operator is urged to make sure that it, 22, overlaps the semiconducting strand screen 20 at both ends of the joint. Next, two halves of a metal mold, 80 as seen in FIG. 4, are applied and fixed in place as is known to the art. The mold preferably lined with semiconducting layer 90, is placed in a preferably horizontal position and one of the castable compositions 84 of my invention is added. Heat is then applied sufficiently to cure the specific casting composition used. Upon cure, a monolithic, water impermeable structure results within the metal mold, which is bonded to the crosslinked polyethylene (or crosslinked polyethylene-propylene) cable insulation and to the semiconducting strand screen 20, and to the semiconducting insulation screen 18, if this latter is present.

As indicated above, after the cable ends, (conductors, 14L and 14R) have been joined and a covering of semi-conductor material such as tape 22 is applied, the junction is placed into a mold 80.

Mold 80 may be constructed of aluminum, copper, steel, or any of the conducting alloys available in the marketplace. Preferably mold 80 is lined with a semiconducting coating 90, to protect against corona discharge. Mold 80 is placed preferably in a horizontal position, for ease of filling, and tightened in place by adjusting hose clamps 94, by tightening screws 96, on the flanges 92 of mold 80. Obviously some suitable means may be employed to prevent leakage, such as a gasket not shown, interposed between 18 and 92 if such is found necessary. Also other closure means adapted to hold the two halves of mold 80 together may also be employed.

Mold 80 is seen to have at least one entry port 82, here 2 are employed to allow for air escape during the addition to the chamber of the mold 100 of the casting compositions of this invention. These ports, 82, communicate with the chamber and have a threaded opening, 88, which is closed off by a removable threaded-in-place cap, not shown.

In order to prevent a dielectric breakdown from being initiated within the region of the junction occupied by the casting composition, 84, it is important that the resin 84 be added and maintained in such a manner as to prevent the formation of voids.

The compositions of this invention are added to chamber 100 through ports 82 in an amount sufficient to fill the chamber 100 up to the layer 90. Mix 84 is poured, pumped or injected in any manner that is known to the art. Heat is applied to the exterior of the mold 80 to be transferred to the curing resin 84. Heat may be applied by the use of strip heaters, heating jackets or the like, all of which are known to the art. The amount of heat to be applied is contingent upon the mix being added, and the particular size of the mold but is readily discernible to the skilled artisan.

The likelihood of the formation of voids in the curing resin can be substantially reduced by deaerating the resin prior to its addition to the chamber.

Upon cure, which will usually take place in longer durations of time, if the aforesaid heat is not applied, a monolithic water impermeable structure results within the mold. Upon release of the mold portions, as by unscrewing screw 96 and removing clamps 94, it is found that the cured resin is bonded to the cable insulation 16, and to the semi-conducting strand screen.

If, depending upon the manufacturer of the cable, an insulation screen is part of the cable as the outer most layer, it should be soldered to the metallic mold.

For the reader's information, it has been found that the insulation layer of high voltage cable is generally either cross-linked polyethylene, or cross-linked polyethylene-propylene.

In the embodiment depicted in FIGS. 1 and 4 of a mold suitable for use herein, funnels 103 have been added and are shown threadingly engaged to the threads 86 of opening 88. These funnels 103 render addition to the cast mix 84 easier. Upon completion of the cast mix addition, funnels 103 are removed and a threaded cap not shown is secured to 82. By use of such a cap no mix can escape to cause voids in the monolithic structure to be formed.

In FIG. 4 an electrically joined, tape wrapped splice is shown inserted in the mold 80. This mold does not have the lining of semi-conductive mastic as is seen in FIG. 1.

The description of the mold employable herein should not be read in a limiting manner. Thus any mold with entry means for addition of the cast mix, and having suitable closures to maintain the cable ends fixedly in place during during of the chemical composition may be employed.

In the practice of the instant invention it is seen that a liquid polyolefin which may or may not have pendent functionality is first chain-extended. In those instances where there is pendent functionality such as hydroxyl, carboxyl and the like, chain extension can take place by the addition of another liquid polyolefin which has different pendent groups capable of entering into a condensation reaction with any of the known condensable pendent groups either aforesaid or not mentioned. Alternatively, instead of employing a second liquid polyolefine for "internal" chain extension, another ingredient can be added herein is designated as an external chain extender, and which would also bear condensable moieties thereupon. For example, such compounds would include polyols to react with liquid polyolefins having condensable functionality. The concept of chain extension by condensation is well known and further details need not be cited presently.

If the liquid polyolefin does not have condensable pendent functionality, chain extension may take place by free radical catalysis to break the double bond and to add thereupon. Typical of such a reaction would be the addition of an organo mercaptan to such a polyolefin. Details of the use of non-functional liquid polyolefins for the preparation of casting compositions for reaction with cross-linked cable insulation part of the subject matter of my co-pending application Ser. No. 874,104 filed concurrently herewith.

It is also to be seen that the practioner may choose to chain extend a liquid polyolefin which does have condensable pendent moieties thereupon, by a free radical initiated reaction. The use of such liquid polyolefins for the preparations of casting compositions for reaction with cross-linked cable insulation is also disclosed and claimed in my aforesaid co-pending application. The liquid olefin (LPO) is used with solid polyethylene (PE), see infra. It is seen that the chain extended liquid polyolefin and PE is placed in a mold, heated to gelation and then allowed to react with the cross-linked cable insulation which is usually cross-linked polyethylene or cross-linked polypropylene-ethylene as well as the solid PE powder to form a single monolithic cross-linked structure.

In the instant invention the liquid polyolefins to employ are those of the general formula: ##STR1## wherein Vi is a vinyl side chain; B is the backbone of the polymer and contains at least one unsaturated double bond; G represents non-reactive side group substituents selected from the group consisting of cycloalkyl, alkyl, aryl, aralkyl, iodo, bromo, chloro, cyano, carbalkoxy, and alkoxy. Fn is a functional chain-extendable moiety each of which may be the same or different. Wherein m is a number of at least one, x is a number from 0 to about 5; Fn is a moiety selected from the group consisting of: --OH, --COOH, --NH.sub.2, --SH, --C.dbd.CH, --NCO, ##STR2## And q designates a molecular weight range of 300 to 10,000. Preferably x will vary from 2.1 to 2.5 and q will preferably range from 500 to 6,000.

According to the instant invention, it is posible to employ unsaturated liquid polyolefins with hydroxyl, carboxyl, amino, thiol, epoxy and isocyanato functional groups. The commercially skilled chemist will recognize that only hydroxyl, carboxyl and amino functional liquid polyolefins are readily available in the marketplace. However, the skilled artisan, can prepare those other raw materials for use in this invention using the commercial compounds available.

Typical reactions that may be employed to prepare thiol, isocyanato and epoxy terminated products are as follows:

In all of the above R is an unsaturated liquid polyolefin moiety.

As has been indicated above, the LPO which has been chain extended is mixed with a solid polyolefin (PE) which is preferably finely divided and used as the casting composition with the cable insulation. The purpose of employing the solid olefin is to produce a graft polymerization of the residual unsaturation within the chain extended LPO with the (PE) in addition to the reaction of the LPO with active hydrogen atoms of the cable insulation by free radical polymerization initiated by the peroxide present. These two reactions take place simultaneously to form a strongly bonded single composite structure including the cable insulation.

While the term (PE) has been used, the solid finely divided polyolefin can be not only polyethylene, but also polypropylene, polyethylene-propylene, polybutene, polypentene, polyhexene, polycyclohexene, polystyrene, polyvinyl toluene, polyethylene-vinyl acetate copolymer, polystyrene-butadiene and polyvinyl chloride among others. Only those polymers, crystalline or not, which are not readily swollen by the balance of the liquid castable system of this invention at ambient temperature can be employed.

It is advantageous to have a mixture of various particle sizes of the finely divided high molecular weight solid polyolefin, to achieve maximum packing density of the fine particles and still yield good castability. Thus I prefer a bimodal or trimodal size distribution. Needless to say, the solid polyolefin can consist of a plurality of the members of those within the class provided that each member meets the criteria set forth above. I have found that the addition of 25 to 60 percent of the weight of the total system of the (PE) is satisfactory, and that 40 to 50% by weight addition provides good flow characteristics.

The casting compositions for reaction with the cable insulation according to the this invention are prepared by premixing the ingredients under vacuum to eliminate entrapped gas and air bubbles. There are a variety of standard differential speed, batch and continuous type mixers which may be employed. The blades may be horizontally or vertically oriented. The mixer is loaded with the liquid polyolefin, optionally a second liquid polyolefin if chain extension is to be carried out internally, as defined herein, and/or one or more chain extending agents, an optional viscosity reducing agent, such as a liquid diolefin, as is discussed herein, and of course the finely divided solid polyolefin. This solid polyolefin may be bimodal, as is discussed in detail herein, as well as trimodal which is also contemplated herein. Mixing is carried out under vacuum for all of the ingredients.

If immediate useage is to transpire on site, then any catalysts required should also be included in the mixture, such that chain extension to gelation can commence. The mix is then placed into the mold with the pre-prepared insulation section, heat applied, and reaction with the insulation allowed to take place.

If however, field use is contemplated, and the activated reaction mix is not shelf storable then the catalysts should not be added to the mixer, but packaged separately, and the main reaction mix should be packaged for shipment to the field location. For such field useage, I prefer to unload the mixer by loading the casting mix into plastic bags of predetermined size according to the intended size of the electrical splice. These bags after filling are to be evacuated to remove any possible entrapped air and then sealed. The plastic bags preferably have a divided section or partition or plastic capsule, which will contain catalyst or catalysts, dissolved or dispersed in a non-volatile liquid, which preferably has therein dissolved a dye of distinctive color. (This non-volatile liquid may be any of the subsequently mentioned monomeric liquid diolefines such as diallyl phthalate, etc.). When it becomes necessary to prepare the liquid casting system for use, the plastic container and contents are warmed by some convenient means to a temperature which provides adequate fluidity, the partition removed or broken and the catalyst mixture kneaded into the casting slurry until a uniform mix as determined by color is achieved. Then the bag is conveniently cut or punctured at one end and the casting slurry poured or squeezed into the ports or funnel of the metal mold prepared for the splice. Squeezing out the contents of the plastic bag may be conveniently carried out by hand or the bag may be inserted into a reservoir of a hydraulic or screw actuated injector. While the mold is being filled, I have found that it may be convenient to aid in the removal of entrapped air bubbles by mechanical vibration. This can be done by attaching any of the commercial types of air or electrically driven mechanical vibrators to the body of the mold. The casting mix is poured into the mold until it is completely full and rises up into the stem of the ports or funnel. Heat is then slowly applied until the first cure temperature is reached. In general this will be in the range of 50.degree.-110.degree. C. although I usually prefer a range of 70.degree.-100.degree. C. However it may also be higher or lower than these temperatures. For either site or field use, heating is maintained at this initial cure temperature until gelation has been achieved. Generally this may require about 20 to 50 minutes and then the temperature is elevated up to the final cure temperature. I have found that a convenient and practical range for cure is between 135.degree.-180.degree. C. At these temperatures the reaction mixture can effectively soften and penetrate into the surface of the cross-linked cable insulation and form a homogeneous bond by graft polymerization with that surface, as well as with the suspended solid polyolefine particles. In general I have found that good cures can be achieved when the total mass of the splice has been held at the desired cure temperature for about 30 to 120 minutes. As would be expected, the rate of cure is a function of temperature and the catalyst used. Although more rapid cures may be attained at the higher temperatures, there is less strain imposed upon the total system after cooling, if the cure temperature is maintained in the lower range.

It is to be understood that while I have suggested the use of a mono or multi compartment plastic bags or plastic cartons that are inert and not reactable with the mixture, the use of same is not required and is not critical to this invention. The advantage of same however, is that packages or billets may be pre-prepared for field use at a master facility.

In practicing my invention I prefer to use any of a variety of commercially available liquid polyolefines. Many such materials are the so-called liquid polybutadienes, although they may also be copolymers of butadiene-acrylonitrile or butadiene-styrene, and they may also contain minor amounts of other monomers, which provide specific types of functional end groups.

Typical examples of commercially available liquid polyolefines are those produced by B.F. Goodrich Chemical Company under the trade name Hycar CTB, CTBN, CTBNX and ATEN; Phillips Petroleum Company's Butarez CTBB, HTPB and NF series; United Technology's CBAN and ABAN liquid elastomers; ARCO Chemical Company's R-45M and R-45HT series; and there are many others. It is also within the scope of this invention to use liquid polyolefins, based on isoprene, cyclohexadiene, cyclopentadiene, cyanoprene, conjugated vinyl cyclohexene and chloroprene.

Any of the diolefines may be copolymerized with each other as well as butadiene and with or without acrylonitrile, styrene and other monomers, which may provide functional groups. Generally these liquid polyolefines are relatively low in molecular weight, ranging preferably from 2000 to 5000, but they may also be lower or higher than these values i.e. 1500 to 6000.

Since it is preferable to use materials of low viscosity to obtain the most desirable flow characteristics, I have found it advantageous to dilute some of the higher viscosity liquid polyolefines with low volatility, liquid, monomeric non-conjugated diolefines. As preferred divalent monomers the diallyl phthalates, allyl diglycol carbonate (PPG Chemical's CR-39), hydroquinone diallyl ether, resorcinol diallyl ether,1, 9-decadiene, divinyl cyclohexanes, or any other of the myriad forms of non-conjugated doubly unsaturated hydrocarbons may be used as dilutents. Although they are more reactive, I have also found that any of the isomers or mixed isomers of divinyl benzene may also be used as diluents, as well as the commercially available low viscosity unsaturated polyesters.

When the liquid polyolefine has functional groups in the molecule, such as carboxyl, hydroxyl, thiol or amine, an equivalent amount of functional monomeric reagent is added to allow chain extension to a high molecular weight. Thus a carboxy containing liquid polymer is chain extended by means of a bifunctional epoxy. Hydroxy compounds and thiol derivatives can be extended by means of diisocyanates or epoxies and the thiols may also be extended by means of epoxies.

In certain of these reactions catalysts are required to initiate chain growth. In as much as I can chain extend what I deem internally, by merely reacting two liquid polyolefines with two different condensable end groups such as NCO and OH, or I can introduce a separate chain extender, externally such as toluene diisocyanates, as an added agent, another external compound as a chain extender would be any of the organic diepoxides, i.e. available commercially. Since I prefer long pot lives at ambient temperatures for the practice of my invention, I normally limit the amount of initiating catalyst to the minimum level necessary to achieve initiation at an elevated temperature. For catalysis of chain growth I prefer the reactions to initiate in the range of 70.degree. to 100.degree. C., although lower or higher temperatures may be used. Certain catalysts at low enough concentration and reactivity at ambient temperatures may be added at the factory at the time of initial batch preparation of the castable composition. Otherwise the catalysts are withheld for addition just prior to use. Further catalysis details are recited below.

Where the liquid polyolefine is resistant toward polymerization and requires higher temperatures to achieve initial gelation, I prefer to use a higher melting or less soluble, solid polyolefine powder. I have found that it is particularly advantageous to have a substantial viscosity increase or gelation occur before reaching the solution or melting temperature of the solid polyolefine. On the other hand it is also possible to achieve this initial gelation at somewhat lower temperatures by the use of a more reactive initiating catalyst. In either case the objective is to attain a substantial viscosity increase or gelation prior to raising the temperature above the solution or melting temperature of the solid polyolefine to maintain a fixed and uniform distribution of all of the ingredients while the final steps of polymerization and grafting are achieved.

In the practice of my invention it will frequently be necessary to have two or more different catalysts as well as promotors present to initiate the different sequential steps of the polymerization. One, for instance, for chain extension and another for reaction with the insulation. Ideally it would be simplest to include all of the catalytic reagents at the time when all the other ingredients are blended together. In some systems this will be possible but in most instances it can lead to substantially reduced shelf life. Shelf life can be enhanced by the use of common procedures, however. For maximum extension of pot life it is best to add the catalyst just prior to casting and cure in the splicing mold. Nevertheless, it is within the scope of my invention to add all, one, or none of the catalytic agents at the time of initial mixing of the ingredients. This is entirely dependent upon the nature and reactivity of the ingredients and catalysts selected for any given casting formulation.

As catalysts I have found that the reaction of carboxyl groups with epoxy resins is enhanced by means of chromium salts of oil soluble organic acids as described in U.S. Pat. Nos. 3,977,996 and 3,978,026. Hydroxy groups will react with isocyanates when catalyzed, for example, by means of organo tin compounds such as dibutyl tin dilaurate or metal chelates, such as ferric acetylacetonate, among others. Amines generally require no other catalysis in reaction with either isocyanates or epoxies and generally the same can be true of thiol compounds at elevated temperatures. However thiols do require free radical initiation for reactions across a double bond as well as the subsequent graft polymerization with the solid polyolefin and the cross-linked insulation. Therefore, according to my invention, I have found that the commercially available organic peroxides can be used to catalyze chain growth in the reactions of dimercaptans with liquid polyolefines and the graft polymerization. As catalysts I particularly prefer to use benzoyl peroxide, t-butyl perbenzoate, di-t-butyl peroxide, t-butyl-perpivalate, bis-(2-ethylhexyl) percarbonate, dicumyl peroxide, bis-(t-butylperoxy) diisopropylbenzene, 2,5-dimethyl-2,5-di-t-butylperoxyhexane, 2,5-dimethyl-2,5-di-t-butylperoxy hexyne-3, n-butyl-4, 4-bis(t-butylperoxy) valerate, 1, 1-bis(t-butylperoxy), 3,3,5-trimethyl cyclohexane and there are many others. Furthermore it may also be advantageous to use certain promotors such as cobalt naphthenate or tertiary amines in conjunction with the peroxide catalysts.

As examples of isocyanato compounds that can be employed as chain extending agents herein, for what has been defined as an external chain extension agent, mention may be made of toluene diisocyanate, hexamethylene diisocyanate, diphenymethane-diisocyanate, cyclohexyldiisocyanate, naphtalene diisocyanate, and meta-phenylene diisocyanate, for both -OH and -SH functional liquid polyolefins.

While triisocyanates may be employed, their presence will create or at least could tend to create excessive crosslinking which gives rise to contrary physical properties than those desired.

Epoxide pendent groups on the liquid polyolefins can be chain extended by employing amines, such as: ethylene diamine, phenylene diamines, N-phenylhexamethylenediamine, N,N'-dimethylphenylenediamine. These epoxide pendent groups on the liquid polyolefines can also be chain extended by employing dicarboxylic acids, such as: adipic acid, azelaic acid, sebacic acid, and dodecenylsuccinic anhydride, hexahydrophthallylanhydride.

Carboxyl functional groups on the liquid polyolefin can be extended by bifunctional epoxide compounds. Those marketed by the companies indicated under designs set forth below:

Shell 828; Union Carbide ERL 2795, ERL 2713, EP 201; Dow DER 321, 334, 732, 736; diglycidyl ether

These carboxyl groups can also be extended to form mixtures of hydroxy amides, aminoesters and oxazolines, by reactions with bifunctional aziridines such as: butyl N,N'-diaziridinyl phosphate, bis(1-aziridinyl)benzene, bis(1-aziridinyl)dimethyl ether, bis(2-aziridinyl) dimethyl ether, among others.

All chain extensions to be employed in this invention must chain extend by a condensation reaction and not by the splitting of double bonds.

The following are non-limiting examples

The following example illustrates the instant invention in that a combination of hydroxyl and amino polyolefins are reacted with isocyanate. This casting composition is then further reacted with the polyethylene powder and the cable insulation according to this invention.

The above ingredients were thoroughly mixed. A 10 gram sample (a), was decanted into a separate container. To the balance, was added 23 grams of a bimodal blend of polyethylene powder. This mixture was thoroughly stirred and degassed, and then divided into three separate portions.

To portion (b), nothing else was added.

To the vessel containing portion (c) was added a slice of cross-linked cable insulation, made of polyethylene.

To the vessel containing portion (d) was added a slice of cross-linked cable insulation made of ethylene-propylene rubber.

All four samples were heated as follows:

30 minutes at 75.degree.-80.degree. C., then

20 minutes at 125.degree.-130.degree. C., then

15 minutes at 150.degree.-160.degree. C.

Cured samples (a) was a tough, resilient rubber. Sample (b) was substantially harder than (a) and was a hard, tough though rubbery resin.

The casting compositions when interacted with the cable insulations as in (c) and (d) appeared to adhere well to the insulation as was demonstrated by the apparent peel strength in pulling the rubbery resins from the surfaces of the insulation slices.

To 25 g of R45HT was added 1.9 g of hexamethylene diisocyanate for chain extension. Then 24 g of polystyrene crystals and a mixture of 0.03 g ferric acetylacetonate and 1.3 g of 40% DiCup-DAP (40% dicumyl peroxide in diallylphthalate) catalysts was stirred in. The mixture was heated at 80.degree. C. for about 30 minutes, gradually raised to 170.degree. C. over 20 minutes and then heated an additional 30 minutes at 170.degree. C. Upon cooling a very hard, tough resin was obtained. This had reduced unsaturation due to graft polymerization with the polystyrene and would have formed a monolithic structure had cable insulation also been present.

In the following experiments, I employed a 2800 molecular weight, 2.5 hydroxyl groups per molecule hydroxy substituted LPO, namely Arco R45HT.

Ten gram portions of each of 3a, 3a and 3c were dispersed with 8 grams of a bimodal mix of polyethylene and polypropylene powders, and poured into a mold surrounding a section of cured polyethylene cable insulation. Each container (mold) was heated at 75.degree. to 80.degree. C. for 30 minutes, during which time gellation took place. The temperature was raised to 125.degree.-130.degree. for 20 minutes and finally to 150.degree.-160.degree. for 15 minutes. It was found on cooling that a tough uniform composite structure had been formed with the insulation that was difficult to peel off.

As is known, a bimodal or polymodal blend constitutes a mixture in a stated ratio of small size to large size particles such that on composition the small particles fill the spaces between the large ones to enhance the density of the material.

The following constitutes a procedure for the preparation of a mold to be utilized in accordance with the techniques of this invention for the preparation of splices of high-voltage cable. It is readily understood that when molds 80, necessary to this invention, are to be prepared on a commercial basis other modes of manufacture that are more conductive to lower costs may be employed.

An aluminum mold 80 was prepared by cutting a 14" length of 2" wide schedule 5 aluminum tubing. According to specification, this material has a 2.375 inch outside diameter and a 2.25 inch inside diameter. To each end was brazed a 60.degree. cone of aluminum with the larger diameter of the cone equal to the exterior diameter of the tube. A portion of the tapered section of each cone was removed to leave a 15/16" opening at each end, 104. The tube with 2 tapering ends was then longitudinally sawed in half. To one of the halves at 4" from each end, in a straight line, was brazed a 1" length of 3/8" O.D. aluminum tubing which had been previously flared to provide a funnel-like opening. Holes were drilled through the inside diameters of the funnel tubes to provide fluid communication of the funnel to the main part, or chamber of the mold. The configuration of the two halves was to ensure that the longitude of the mold halves correctly abutted along the entire length thereof to prevent leakage of cast mix when such is added through the funnel tubes. This construction differs slightly from that of the figures, but the net effect of having funnel openings is the same.

The interior of each half of the mold was thoroughly cleaned and several coats of semi-conducting paint were applied with adequate time being provided for drying between the application of each coat. A total layer of thickness of about 1/16" was found suitable. The mold was now ready for use.

Two 12" lengths of 27 KV aluminum power cable having an O.D. of 15/16" were cut and trimmed as shown in FIG. 2, leaving 2" bare conductor exposed followed by 3/4" of semi-conductor cable screen. A metal crimp was used to join the conductors. After sanding and wiping with acetone, two layers of semi-conducting tape were wrapped over the bare wire and the crimp seal overlapping the semi-conductor shield of the cable. The aluminum shell mold was placed symmetrically around the spliced cable and clamped tightly over the cable by means of standard screw tightened clamps. The assembly was placed in a horizontal position with the funnel tubes upstanding and ready for cast addition.

A 1000 gram batch of the fomulation of Example 3a which had been previously prepared was added through one of the inlet funnels and allowed to flow into and fill the mold chamber up into the two inlet tubes approximately half way to the top of the funnels. The assembly was supported in a horizontal position, placed in an oven at 75.degree.-80.degree. C. for 90 minutes for gelation to transpire. The temperature was raised to 125.degree.-130.degree. C. for an hour, and finally to 150.degree.-160.degree. C. for another 80 minutes. Upon cooling, a monolithic electrical splice assembly was recovered. The insulation material, which was cross linked polyethylene was found to be fully bonded to the material which had been cast into the mold and allowed to harden.

When dielectric strength measurements are run of castings made from compositions employable in this invention, by ASTM test D149, it is found that measurements in the range of 500-600 volts per mil. are obtained.

Since certain changes may be made in the above products, compositions and processes without departing from the scope of the invention herein involved, it is intended that all matter contained in the above description shall be interpreted solely as illustrative and not in a limiting sense.