US 3,933,755 AGrant
Melamine, Formaldehyde, Thiourea and Diol Ether Thermosetting Resin and Method of Preparing the Same
Issue Date:1976-01-20
•3 Claims
Abstract
A thermosetting resin useful for attaching decorative paper facings to chipboard and like cellulosic panels is prepared by condensation of melamine with thiourea, formaldehyde, and a diol ether, up to one half by weight of the melamine being capable of being replaced by urea without seriously effecting the quality of the resin.
Metadata
Assignee
- Suddeutsche Kalkstickstoff-Werke AG
Inventors
- Horst Michaud
- Josef Seeholzer
- Ludwig Pentzel
- Josefa Mangs
Application Information
Application Number:US 4721527
Filing Date:1974-05-22
Priority Date:1970-06-02
Art Unit:143
Classifications
IPC:
C08G 1232C08G 1238
Field of Search:
26067.6 R
Patent Drawings
This patent does not have any drawings.
Description
The following Examples are further illustrative of this invention.
EXAMPLE 1
600 g Aqueous 30% formaldehyde solution (6 moles formaldehyde) were adjusted to pH 8.6 at 20.degree.C with aqueous sodium hydroxide solution. 27 g (0.355 Mole) thiourea, 36 g (0.34 mole) diethyleneglycol, and 378 g (3 moles) melamine were stirred into the formaldehyde solution at ambient temperature. The mixture obtained was heated to 90.degree.C and held at that temperature until a sample of the resin solution so obtained became turbid when diluted with 1.5 volumes water at 20.degree.C. The bulk of the solution was then cooled quickly to ambient temperature (20.degree.C), and the cooled solution had a viscosity of 17.6 seconds, a specific gravity of 1.250, and an index of refraction of 1.490. It contained 57 % resin solids.
Sheets of porous, pigmented decorative paper of high acellulose content were impregnated with the resin solution to which 0.05% formamidinesulfinic acid was added as a hardener immediately prior to application. The resin solution added approximately 130% to 145% to the weight of the paper after drying, and the resin composition contained 5.0 to 5.5% (by weight) of material volatile at 160.degree.C.
Both faces of a chipboard panel were coated with the impregnated paper, and the coated panel was placed between the polished platens of a press preheated to 160.degree.C. The press was closed immediately, and a pressure of 20 kg/cm.sup.2 was applied to the coated panel within approximately ten seconds after insertion in the press. The press was opened two minutes later, and the hot panel was withdrawn and replaced by another, identically coated panel to start a new curing cycle.
The surface of the cured, coated panel was uniformly glossy, and it compared favorably in its smoothness and the absence of pores or other undesired depressions with a panel prepared with conventional resins at low pressure and cooled in the press. Its gloss was equal or superior to that of all but the very best conventionally prepared panels, and far superior to otherwise conventional panels which are removed from the press while hot.
Example 2
600 g (6 Moles) 30% formaldehyde solution, 62 g of a thiourea-formaldehyde precondensate, and 36 g (0.4 mole) diethyleneglycol (0.4 mole) were mixed at ambient temperature (20.degree.C). The precondensate was an aqueous 60% solution prepared from thiourea and formaldehyde in a mole ratio of 1:1 and had a viscosity of 12 seconds, a specific gravity of 1.22, and an index of refraction of 1.494. The solution so obtained was adjusted to pH 8.6 with aqueous sodium hydroxide solution, further mixed with 378 g (3 moles) melamine, and heated to 90.degree.C.
This temperature was maintained until a sample cooled to 20.degree.C and diluted with 1.5 volumes of water showed the first turbidity. The bulk of the resin solution was then cooled as quickly as possible. It had a viscosity of 17.3 seconds, a specific gravity of 1.250 at 20.degree., and an index of refraction of 1.4858 at 20.degree.C.
The resin solution was mixed with 0.05% (by weight) formamidinesulfinic acid as a hardener and used for impregnating decorative paper of the type described in Example 1 so as to add 130 - 145% to the dried weight of the coated paper, including 5.0 - 5.5% material volatile at 160.degree.C and mainly consisting of residual water and traces of formaldehyde.
Chipboard panels were coated with the impregnated paper sheets on both major faces, inserted into the afore-described press at 160.degree.C and compressed between the press platens within 10 seconds after insertion with a pressure of 20 kg/cm.sup.2. The press was opened after 90 seconds, and the hot, cured panels were withdrawn. They were of the same quality as the panels prepared according to the method of Example 1.
Example 3
600 g (6 Moles) aqueous 30% formaldehyde solution, 80 g of a thioureamethylol methyl ether (0.3 mole thiourea), and 18 g (0.l7 mole) diethyleneglycol were mixed at 20.degree.C. The mixture was adjusted to pH 8.6 with aqueous sodium hydroxide solution, and 378 g (3 moles) melamine were stirred into the adjusted solution.
The mixture was heated to 90.degree.C and kept at this temperature until a sample diluted with 1.5 volumes water showed the first turbidity. The bulk of the resin solution was then cooled quickly to 20.degree.C. It had a viscosity of 18.7 seconds, a specific gravity of 1.246, and an index of refraction of 1.495.
The thioureamethylol methyl ether was used as an aqueous 60% solution having a viscosity of 18.2 seconds, a specific gravity of 1.190, and an index of refraction of 1.525.
The resin solution was mixed with 0.05% formamidinesulfinic acid as a hardener and used for impregnating decorative paper in an amount to add 130 - 145% to the weight of the paper after drying. Volatile content was 5.0 to 5.5%, as determined by drying to equilibrium at 160.degree.C.
A chipboard panel whose faces were coated with respective sheets of the impregnated paper was cured 90 seconds at 20 kg/cm.sup.2 and 160.degree.C, as described above, and thereafter withdrawn hot from the press.
Its gloss was even better than that of the coated panels prepared by the procedures of Examples 1 and 2.
Example 4
555 g (5.55 Moles) aqueous 30% formaldehyde solution were adjusted to pH 8.8 with aqueous sodium hydroxide solution and mixed with 350 g (2.78 moles) melamine at ambient temperature. The mixture was heated to 90.degree.C and held at that temperature until a drop of the resulting resin solution produced a turbid cloud when dropped into water. At this stage, 40 g of the thioureaformaldehyde precondensate described in Example 2 and 40 g (0.38 mole) diethyleneglycol were added and heating was continued until a sample became turbid when mixed with 1.7 volumes water. 50 g (0.835 Mole) urea were stirred into the resin solution which was then cooled quickly to 20.degree.C. Its viscosity was 16.3 seconds, its specific gravity 1.255, and its index of refraction 1.4859.
Paper was impregnated with the resin solution after addition of 0.05% (wt.) formamidinesulfinic acid to the latter. The amount of impregnating solution was sufficient to increase the dry weight of the paper by 130 - 145%, the volatile content being 5.0 - 5.5%. The impregnated paper sheets were applied to both faces of a chipboard panel, and the coated panel was cured between highly polished metal sheets at 160.degree.C and 20 kg/cm.sup.2 in 80 seconds.
The panel surfaces were smooth and almost as glossy as those prepared by the methods of Examples 1 and 2.
Example 5
600 g Aqueous 30% formaldehyde solution (6 moles formaldehyde), 62 g of the thiourea-formaldehyde precondensate described in Example 2, and 36 g dipropyleneglycol were mixed at ambient temperature. The solution so obtained was adjusted to pH 8.7 with aqueous sodium hydroxide solution and further mixed with 378 g (3 moles) melamine.
The resulting mixture was heated to 90.degree.C and kept at that temperature until a sample became turbid when mixed with two volumes of water. The resin solution then was cooled to 20.degree.C and had a viscosity of 17.2 seconds, a specific gravity of 1.249, and an index of refraction of 1.4877.
After having received a hardening addition of 0.05% formamidinesulfinic acid, the resin solution was used for inpregnating decorative paper to a dry pick-up of 130 to 145% including 5.0 - 5.5% volatile matter. A chipboard panel coated with the paper and cured in 90 seconds as described above showed good uniform gloss about equal to that produced in Examples 1 and 2 after having been taken from the hot press.
Closely similar results were obtained, when the diethyleneglycol or dipropyleneglycol was replaced by other diol ethers having up to eight carbon atoms, such as dibutyleneglycol, di-isopropyleneglycol, diisobutyleneglycol, di-tert-butylglycol, ethylpropyl glycol ether, ethylbutylglycol ether, propylbutylglycol ether, and the like.
While the invention has been described with particular reference to specific embodiments, it is to be understood that it is not limited thereto, but is to be construed broadly and restricted solely by the scope of the appended claims.
Claims
What is claimed is:
1. A thermosetting resin composition capable of bonding paper to clipboard within two minutes at a temperature of 160.degree.C and a pressure of 20 kg/cm.sup.2 when mixed with 0.05% formamidinesulfinic acid, the resulting bond between said paper and said clipboard being stable at said temperature at atmospheric pressure, said resin composition essentially consisting of a liquid condensation mixture obtained by heating melamine, formaldehyde, thiourea, and a diol ether at 80.degree. - 100.degree.C and pH 8.6 - 8.8 until the condensation mixture first becomes turbid at 20.degree.C when diluted with water to a solids content of 10% - 50%, said diol ether being of the formula HO--(CH.sub.2).sub.m --O--(CH.sub.2).sub.m --OH, wherein m is 2 or 3, the amount of said thiourea being 0.08 to 0.12 mole, the amount of said formaldehyde being 2 moles, and the amount of said diol ether being between 0.06 and 0.13 mole, said amounts being per mole of melamine.
2. A resin composition as set forth in claim 1, further comprising 0.2 to 0.4 mole urea per mole of said melamine.
3. A resin composition as set forth in claim 1, the specific gravity of said composition being 1.24 to 1.26 at 20.degree.C, and the index of refraction thereof being 1.48 to 1.50 at 20.degree.C.
Patent Citations (9)
| Patent | Date | Inventor | Cited By |
|---|---|---|---|
| US2197357 | 1940-04-01 | Widmer et al. | |
| US2329651 | 1943-09-01 | Powers | |
| US2358276 | 1944-09-01 | Hodgins et al. | |
| US2454495 | 1948-11-01 | Widmer et al. | |
| US2456568 | 1948-12-01 | Scott et al. | |
| US2839484 | 1958-06-01 | Renner | |
| US3479247 | 1969-11-01 | Bonzagni | |
| US3488310 | 1970-11-01 | McCombs | |
| US3501429 | 1970-03-01 | Bonzagni |