GaN based HEMTs with buried field plates

[0001] This application claims the benefit of provisional application Ser. No. 60/858,851 to Yifeng Wu, which was filed on Nov. 13, 2006.

[0002] The invention was made with Government support under Contract No. ONR 03-C-0092. The Government has certain rights in this invention.

[0003] 1. Field of the Invention

[0004] The present invention relates to transistors and particularly to transistors utilizing field plates to improve performance.

[0005] 2. Description of the Related Art

[0006] Improvements in the manufacturing of AlGaN/GaN semiconductor materials have helped advance the development of AlGaN/GaN transistors, such as high electron mobility transistors (HEMTs) for high frequency, high temperature and high power applications. AlGaN/GaN has large bandgaps, high peak and saturation electron velocity values [B. Gelmont, K. Kim and M. Shur, Monte Carlo Simulation of Electron Transport in Gallium Nitride, J. Appl. Phys. 74, (1993), pp. 1818-1821]. AlGaN/GaN HEMTs can also have 2DEG sheet densities in excess of 10¹³ cm⁻² and relatively high electron mobility (up to 2019 cm²/Vs) [R. Gaska, et al., Electron Transport in AlGaN-GaN Heterostructures Grown on 6H-SiC Substrates, Appl. Phys. Lett. 72, (1998), pp. 707-709]. These characteristics allow AlGaN/GaN HEMTs to provide very high voltage and high power operation at RF, microwave and millimeter wave frequencies.

[0007] AlGaN/GaN HEMTs have been grown on sapphire substrates and have shown a power density of 4.6 W/mm and a total power of 7.6 W [Y. F. Wu et al., GaN-Based FETs for Microwave Power Amplification, IEICE Trans. Electron. E-82-C, (1999). pp. 1895-1905]. AlGaN/GaN HEMTs have also been grown on SiC have shown a power density of 9.8 W/mm at 8 GHz [Y. F. Wu, et al., Very-High Power Density AlGaN/GaN HEMTs, IEEE Trans. Electron. Dev. 48, (2001), pp. 586-590] and a total output power of 22.9 W at 9 GHz [M. Micovic, et al., AlGaN/GaN Heterojunction Field Effect Transistors Grown by Nitrogen Plasma Assisted Molecular Beam Epitaxy, IEEE Trans. Electron. Dev. 48, (2001), pp. 591-596].

[0008] U.S. Pat. No. 5,192,987 to Khan et al. discloses GaN/AlGaN based HEMTs grown on a buffer and a substrate. Other AlGaN/GaN HEMTs and field effect transistors (FETs) have been described by Gaska et al., High-Temperature Performance of AlGaN/GaN HFET's on SiC Substrates, IEEE Electron Device Letters, 18, (1997), pp. 492-494; and Wu et al., High Al-content AlGaN/GaN HEMTs With Very High Performance, IEDM-1999 Digest, pp. 925-927, Washington D.C., December 1999. Some of these devices have shown a gain-bandwidth product (f_T) as high as 100 gigahertz [Lu et al., AlGaN/GaN HEMTs on SiC With Over 100 GHz ft and Low Microwave Noise, IEEE Transactions on Electron Devices, Vol. 48, No. 3, March 2001, pp. 581-585] and high power densities up to 10 W/mm at X-band [Wu et al., Bias-dependent Performance of High-Power AlGaN/GaN HEMTs, IEDM-2001, Washington D.C., Dec. 2-6, 2001] and [Wu et al., High Al-Content AlGaN/GaN MODFETs for Ultrahigh Performance, IEEE Electron Device Letters 19, (1998), pp. 50-53].

[0009] Electron trapping and the resulting difference between DC and RF characteristics can be a limiting factor in the performance of these devices. Silicon nitride (SiN) passivation has been employed to alleviate this trapping problem resulting in high performance devices with power densities over 10 W/mm at 10 Ghz. For example, U.S. Pat. No. 6,586,781 to Wu et al. discloses methods and structures for reducing the trapping effect in GaN-based transistors. However, due to the high electric fields existing in these structures, charge trapping can still be a concern.

[0010] Field plates have been used to enhance the performance of GaN-Based HEMTs at microwave frequencies and have exhibited performance improvement over non-field-plated devices [See S Kamalkar and U. K. Mishra, Very High Voltage AlGaN/GaN High Electron Mobility Transistors Using a Field Plate Deposited on a Stepped Insulator, Solid State Electronics 45, (2001), pp. 1645-1662]. Many field plate approaches have involved a field plate connected to the gate of the transistor with the field plate on top of the drain side of a channel. This can result in a reduction of the electric field on the gate-to-drain side of the transistor, thereby increasing breakdown voltage and reducing the high-field trapping effect. However, transistors with gate-to-drain field plates can exhibit relatively poor reliability performance, particularly at class C (or higher class) operation where the electric field on the source side of the gate becomes significant.

[0011] Still other field plate approaches have involved connecting the field plate to the source. Source-connected field plates offer a reduction in gate-to-drain capacitance, which consequently enhances the gain. This arrangement however increases gate to field plate capacitance, or gate to source capacitance because the field plate is connected to the source. With the field plate on top of the gate, it is difficult to increase the gate cross-section, which limits the gate conductance. The addition of gate-to-source capacitance can reduce device bandwidth while the limited gate conductance restricts the power-gain cutoff frequency.

[0012] The present invention provides transistors that operate with low gate-to-source and gate-to-drain capacitances, as well as a high gate conductance, which leads to increased device gain, bandwidth and operational frequencies. One embodiment of a transistor according to the present invention comprises an active region with a channel layer. Source and drain electrodes are in contact with the active region and a gate is between the source and drain electrodes and in contact with the active region. The gate comprises a generally t-shaped top portion with overhangs which enhances gate conductance. A first spacer layer is on at least part of said active layer between the gate and the drain electrode and between the gate and the source electrode. A source-connected field plate is on the first spacer layer under at least part of the t-shaped portion of the gate. A second spacer layer is on top of said first spacer layer, covering at least part of said field plate.

[0013] One embodiment of a high electron mobility transistor (HEMT) according to the present invention comprises a buffer layer and barrier layer arranged successively on a substrate, with a two dimensional electron gas (2DEG) layer at the heterointerface between the buffer layer and said barrier layer. A source and a drain electrode are included both making contact with the 2DEG layer, and a gate is included on the barrier layer between the source and drain electrodes. The gate comprises a generally t-shaped top that is integral to the gate and enhances gate conductance. A first dielectric layer is on at least part of the surface of the barrier layer between the gate and the drain electrode and between the gate and the source electrode, with the gate contacting the barrier layer through an opening in the first dielectric layer. A source-connected field plate is on the first dielectric layer under at least part of the t-shaped portion of the gate. A second dielectric layer is on top of said first dielectric layer, covering at least part of said field plate.

[0014] One embodiment of a high electron mobility transistor (HEMT) according to the present invention comprises a GaN layer and barrier layer arranged successively on a substrate, with a two dimensional electron gas (2DEG) layer at the heterointerface between the GaN layer and said barrier layer. A source and a drain electrode are included both making contact with the 2DEG, and a gate is included on the barrier layer between the source and drain electrodes. The gate comprises a t-shaped top that is integral to the gate and enhances gate conductance. A first spacer layer is on at least part of the surface of the barrier layer between the gate and the drain electrode and between the gate and the source electrode, with the gate opening contacting a recess in the barrier layer. A source-connected field plate is on the first spacer layer under at least part of the t-shaped portion of the gate. A second spacer layer is on top of said first spacer layer, covering at least part of said field plate.

[0015] One embodiment of a high electron mobility transistor (HEMT) according to the present invention comprises a buffer layer on a substrate and a barrier layer on the buffer layer, with a two dimensional electron gas (2DEG) layer at the heterointerface between the buffer layer and said barrier layer. An In_xGa_1-xN layer is inserted in the buffer layer. A source and a drain electrode are included both making contact with the 2DEG, and a gate is included on the barrier layer between the source and drain electrodes. The gate comprises a generally t-shaped top that is integral to the gate and enhances gate conductance. A first dielectric layer is on at least part of the surface of the barrier layer between the gate and the drain electrode and between the gate and the source electrode. A source-connected field plate is on the first dielectric layer under at least part of the t-shaped portion of the gate. A second dielectric layer is on top of said first dielectric layer, covering at least part of said field plate.

[0016] These and other further features and advantages of the invention would be apparent to those skilled in the art from the following detailed description, taken together with the accompanying drawings, in which:

[0024] The present invention provides structures for transistors, such as high electron mobility transistors (HEMTs) that provide lower gate-to-source and gate-drain capacitance, as well as high gate conductance. This results in devices having increased device gain, bandwidth and operational frequencies. The present invention is generally directed to transistors having a “T-shaped” gate with a field plate below or “buried” under one or both of the overhangs of the gate's T-shaped portion.

[0025] This arrangement can be used with many different transistor structures, such as transistor structures made of wide bandgap materials. Transistors generally include an active region having a plurality of semiconductor layers, one of which is a channel layer. The channel layer is often made of a two dimensional electron gas (2DEG). Metal source and drain electrodes are formed in contact with the active region, and a gate is formed on the active region between the source and drain electrodes for modulating electric fields within the active region.

[0026] A first spacer layer is formed above the active region, over at least a portion of the surface of the active region between the gate and the drain and at least a portion of the surface between the gate and the source. A second spacer layer is formed above the first spacer layer, over at least a portion of the surface of the first spacer layer region between the gate and the drain and at least a portion of the surface between the gate and the source. The first and second spacer layers can comprise a dielectric layer or a combination of multiple dielectric layers, and in certain embodiments other materials such as epitaxially grown layers.

[0027] In one embodiment the first spacer layer covers the topmost surface of the active region between the gate and the drain electrode, and between the gate and the source electrode. In other embodiments as described below the spacer layer can cover less of the surface of the active region.

[0028] A conductive first field plate is formed on the first spacer layer with the first spacer layer providing isolation between the field plate and the active region below. The first field plate extends a distance L_td on the spacer layer from under the T-shaped portion on the drain side of the gate, toward the drain electrode. The first field plate can be electrically connected to either the source electrode or the gate. Additional spacer layer field and field plate pairs can also be included in different embodiments according to the invention. For example, a field plate can alternatively extend a distance L_ts on the spacer layer from under the T-shaped portion on the source side of gate, toward the source electrode. In a preferred embodiment, there is a space between the lower surface of the gate's T-shaped portion and the layers below to minimize the capacitance between the gate and source.

[0029] In one embodiment the second spacer layer covers the entire field plate so that it is essentially buried, as well as covering the topmost surface of the first spacer layer region between the gate and the drain electrode, and between the gate and the source electrode. In other embodiments as described below the second spacer layer can cover less of the surface of the first spacer layer or less than all of the field plate. In still other embodiments the second spacer layer covers only the topmost surface of the second spacer layer region between the gate and the source and drain, and not the field plate.

[0030] This field plate arrangement can reduce the peak electric field, gate-to-source capacitance, and gate-to-drain capacitance, while also increasing gate conductance. Reducing the capacitances and increasing the gate conductance leads to increased device gain, bandwidth and operational frequencies as well as increased breakdown voltage and reduced trapping. The reduction of the electric field can also yield other benefits such as reduced leakage currents and enhanced reliability. The source-connected field plate is arranged such that capacitance on the source side of the gate is reduced, which enhances performance and robustness for applications that require more negatively biased gate conditions. This includes class-C and other higher classes (e.g. E, F) of operations. By having the field plate connected to the source, capacitance on the drain side is reduced as well since the transistor experiences reduced peak electric field on the drain side.

[0031] One type of transistor that can utilize the buried source-connected field plate arrangement according to the present invention is a high electron mobility transistor (HEMT), which typically includes a buffer layer and a barrier layer on the buffer layer. A two dimensional electron gas (2DEG) channel layer is located at the heterointerface between the buffer layer and the barrier layer. A gate electrode is formed on the barrier layer between source and drain electrodes. The HEMT also includes the multiple spacer layers and field plate arrangement described above.

[0032] Another type of transistor that can utilize the gate-source field plate arrangement according to the present invention is a field effect transistor and particularly a metal semiconductor field effect transistor (MESFET), which typically includes a buffer layer and a channel layer on the buffer layer. A gate is formed on the channel layer between source and drain electrodes and the MESFET also includes the multiple spacer layer and field plate arrangement described above.

[0033] It will be understood that when an element or layer is referred to as being “on”, “connected to”, “coupled to” or “in contact with” another element or layer, it can be directly on, connected or coupled to, or in contact with the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to”, “directly coupled to” or “directly in contact with” another element or layer, there are no intervening elements or layers present. Likewise, when a first element or layer is referred to as being “in electrical contact with” or “electrically coupled to” a second element or layer, there is an electrical path that permits current flow between the first element or layer and the second element or layer. The electrical path may include capacitors, coupled inductors, and/or other elements that permit current flow even without direct contact between conductive elements.

[0034] FIGS. 1 and 2 show one embodiment of a HEMT 10 according to the present invention that is preferably Group-III nitride based, although other material systems can also be used. Group III nitrides refer to those semiconductor compounds formed between nitrogen and the elements in the Group III of the periodic table, usually aluminum (Al), gallium (Ga), and indium (In). The term also refers to ternary and tertiary compounds such as AlGaN and AlInGaN.

[0035] The HEMT 10 comprises a substrate 12 which can be made from silicon carbide, sapphire, spinet, ZnO, silicon, gallium nitride, aluminum nitride, or any other material or combinations of materials capable of supporting growth of a Group-III nitride material. A nucleation layer 14 can be formed on the substrate 12 to reduce the lattice mismatch between the substrate 12 and the next layer in the HEMT 10. The nucleation layer 14 should be approximately 1000 angstroms (Å) thick, although other thicknesses can be used. The nucleation layer 14 can comprise many different materials, with a suitable material being Al_zGa_1-zN (0<=z<=1), and can be formed on the substrate 12 using known semiconductor growth techniques such as Metal Organic Chemical Vapor Deposition (MOCVD), Hydride Vapor Phase Epitaxy (HVPE), or Molecular Beam Epitaxy (MBE).

[0036] Substrate 12 can be made of many different materials with a suitable substrate being a 4H polytype of silicon carbide, although other silicon carbide polytypes can also be used including 3C, 6H and 15R polytypes. Silicon carbide has a much closer crystal lattice match to Group III nitrides than sapphire and results in Group III nitride films of higher quality. Silicon carbide also has a very high thermal conductivity so that the total output power of Group III nitride devices on silicon carbide is not limited by the thermal dissipation of the substrate (as may be the case with some devices formed on sapphire). Also, the availability of silicon carbide substrates provides the capacity for device isolation and reduced parasitic capacitance that make commercial devices possible. SiC substrates are available from Cree, Inc., of Durham, N.C. and methods for producing them are set forth in the scientific literature as well as in a U.S. Pat. Nos. Re. 34,861 to Davis et al.; 4,946,547 to Palmour et al.; and 5,200,022 to Kong et al.

[0037] The formation of a nucleation layer 14 can depend on the material used for the substrate 12. For example, methods of forming a nucleation layer 14 on various substrates are taught in U.S. Pat. Nos. 5,290,393 to Nakamura and 5,686,738 to Moustakas, each of which are incorporated by reference as if fully set forth herein. Methods of forming nucleation layers on silicon carbide substrates are disclosed in U.S. Pat. Nos. 5,393,993 to Edmond et al., 5,523,589 to Edmond et al., and 5,739,554 to Edmond et al., each of which is incorporated herein by reference as if fully set forth herein.

[0038] The HEMT 10 further comprises a high resistivity buffer layer 16 formed on the nucleation layer 14. The buffer layer 16 can comprise doped or undoped layers of Group III-nitride materials with a preferred buffer layer 16 made of a Group III-nitride material such as Al_xGa_yIn_(1-x-y)N (0<=x<=1, 0<=y<=1, x+y<=1). Other materials can also be used for the buffer layer 16 such as GaN that is approximately 0.5-20 μm thick, with part of the buffer layer doped with Fe.

[0039] A barrier layer 18 is formed on the buffer layer 16 with the buffer layer 16 being sandwiched between the barrier layer 18 and the nucleation layer 14. Like the buffer layer 16, the barrier layer 18 can comprise doped or undoped layers of Group III-nitride materials. The barrier layer can be made of one or multiple layers of Al_xGa_1-xN or Al_xIn_yGa_1-x-yN, where x ranges from 0-1, and x can be a function of depth such that the barrier layer 18 can be a graded layer. A 2DEG channel layer 26 is induced at the heterointerface between the buffer layer 16 and the barrier layer 18, with the buffer layer 16, 2DEG channel layer 26 and barrier layer 18 generally forming the HEMTs active region.

[0040] Exemplary HEMT structures are illustrated in U.S. Pat. Nos. 6,316,793 to Sheppard et al., 6,586,781 to WU et al., 6,548,333 to Smith and U.S. Published Patent Application Nos. 2002/0167023 to Prashant et al., and 2003/0020092 to Parikh et al., each of which is incorporated by reference as though fully set forth herein. Other nitride based HEMT structures are illustrated in U.S. Pat. Nos. 5,192,987 to Kahn et al. and 5,296,395 to Kahn et al., each of which is incorporated herein by reference as if fully set forth herein. The buffer and barrier layers 16 and 18 can be made using the same methods used to grow the nucleation layer 14. Electric isolation between the devices is accomplished through mesa etch or ion implementation outside the active HEMT.

[0041] Metal source and drain electrodes 20, 22 are formed in contact with the barrier layer 18, and a gate 24 is formed on the barrier layer 18 through an opening in a first non-conducting spacer layer 28, between the source and drain electrodes 20, 22. Electric current can flow between the source and drain electrodes 20, 22 through the 2DEG channel layer 26 between the buffer layer 16 and the barrier layer 18 when the gate 24 is biased at the appropriate level. The formation of source and drain electrodes 20, 22 is described in detail in the patents and publications referenced above.

[0042] The source and drain electrodes 20, 22 can be made of different materials including but not limited to alloys of titanium, aluminum, gold or nickel. The gate 24 can also be made of different materials including but not limited to gold, nickel, platinum, titanium, chromium, alloys of titanium and tungsten, or platinum silicide. The gate 24 can have many different lengths (L_g), with a suitable gate length ranging from 10 nm to 1000 nm, although other gate lengths can also be used.

[0043] The first non-conducting spacer layer 28 is formed around the gate 24 and at least part of the surface of the barrier layer 18 between the gate 24 and the source and drain electrodes 20, 22. As shown in FIG. 1, the spacer layer 28 covers all of the barrier layer 18 between the gate 24 and source and drain electrodes 20, 22. The first spacer layer 28 can comprise a dielectric layer, or a combination of multiple dielectric layers. Different dielectric materials can be used such as a SiN, SiO2, Si, Ge, MgOx, MgNx, ZnO, SiNx, SiOx, alloys or layer sequences thereof. The first spacer layer can be many different thicknesses, with a suitable range of thicknesses being approximately 50 nm to 500 nm. As best shown in FIG. 2, the gate 24 is contacted at a gate contact 36.

[0044] The gate 24 also comprises a generally T-shaped top portion 34, which is larger than and integral to gate 24. The larger top portion 34 overhangs and has a larger cross-section than the gate, and as a result lower resistance and enhanced gate conductance. The top portion 34 and gate are generally T-shaped, but it is understood that these can comprise many different shapes. The objective is to include a section on the gate 24 to improve conductivity to allow for higher frequency operation, with the section being enlarged to achieve this objective. Having a particular shape to the enlarged top-portion is not critical.

[0045] The top portion 34 can also be made from a variety of materials, some of which can be the same or similar to the material for the gate 24 above. The overhangs of the top portion 34 can have many different lengths (L_tp), with a suitable length ranging from 0.2 um to 2 um, although other lengths can also be used. Additionally, the top portion 34 is either on or above the layers below it, and in the embodiment shown is either on or above the second spacer layer 30. In one embodiment, a space is provided between the top portion 34 and the spacer layer 30, which helps reduce capacitance between the gate and the source. The top portion 34 and gate can be fabricated using known photo-resist techniques, and in one embodiment a photo-resist layer can be included on the spacer layer 30 and the top portion formed on the photo-resist layer. Subsequent removal of the photo-resist layer leaves a space between the spacer layer and the top portion.

[0046] The second spacer layer 30 is formed on at least part of the surface of said first spacer layer 28 between the gate 24 and the source and drain electrodes 20, 22 and above at least part of a field plate 32. As shown in FIG. 1, the second spacer layer 30 covers all of the first spacer layer 28 between the gate 24 and source and drain electrodes 20, 22. The second spacer layer 30 can comprise a dielectric layer, or a combination of multiple dielectric layers. Different dielectric materials can be used such as a SiN, SiO2, Si, Ge, MgOx, MgNx, ZnO, SiNx, SiOx, alloys or layer sequences thereof. The second spacer layer 30 can be many different thicknesses, with a suitable range of thicknesses being approximately 50 nm to 500 nm.

[0047] The field plate 32 is formed on the spacer layer 28 under the overhangs of the gate top portion 34, with the field plate extending on the spacer layer 28 a distance L_td toward the drain electrode 22 as shown in FIG. 1, or alternatively a distance L_ts toward the source electrode 20. The spacer layer 28 is arranged to provide isolation between the field plate 32 and the barrier layer 18, so the spacer layer 28 need only cover the barrier layer 18 below the first field plate 32. For ease of manufacturing, however, the spacer layer 28 typically covers the entire barrier layer 18. L_td can be different distances with a suitable range of distances being from 0.05-0.5 um. Similarly, L_ts can be different distances with a suitable range of distances being from 0.05-0.5 um. In other embodiments, the field plates may not be continuous, but can have holes or interruptions as desired. The second spacer layer 30 can also cover the field plate 32.

[0048] The field plate 32 can comprise many different conductive materials with a suitable material being a metal or a stack of metal layers deposited using standard metallization methods. In one embodiment according to the present invention the field plate 32 comprises the same metal as the feature that it is electrically connected to as described below.

[0049] The field plate 32 can be electrically connected to either the source electrode 20 or the gate 24. FIG. 2 shows one embodiment where the first field plate 32 can be electrically connected to the source electrode 20 through a first conductive path 38 that runs outside the active region of the HEMT 10 and is connected to the source electrode 20. As shown in FIG. 2, the path 38 runs outside the active area of the HEMT at the edge opposite the gate contact 36. In alternative embodiments according to the present invention, the conductive path could run outside the active area of the HEMT 10 on the side of the gate contact 36, or the HEMT 10 could include two or more conductive paths running on one or both sides of the HEMT 10 (not shown). In one embodiment, the conductive paths can be made of the same material as the source electrode 20 and in other embodiments they can be made of a different material and can be formed at a different step in the fabrication process after formation of the source electrode 20. It is understood that this illustrates only one of the different ways that the field plate can be connected to the source according to the present invention.

[0050] Alternatively, the field plate 32 can also be electrically connected to the gate 24 by many different methods, with two suitable methods described herein. First, the field plate can be connected to the gate 24 by a second conductive path 40 that runs outside of the active region of the HEMT 10 between the field plate 32 and gate 24. The conductive path 40 can connect to the gate contact 36 or a portion of the gate 24 outside of the HEMTs active region, such as the portion of the gate 24 opposite the gate contact 36. Alternatively, more than one conductive path can be used to connect the field plate 32 and gate 24.

[0051] An alternative connection structure comprises conductive paths in the form of conductive vias (not shown), which can be formed running from the first field plate 32 to the gate 24, through the first or second spacer layers 28,30. The vias provide an electrical connection between the gate 24 and field plate 32 and the vias can be formed by first forming holes in the spacer layers 28,30, such as by etching, and then filling the holes with a conductive material either in a separate step or during formation of the field plate 32. The vias can be arranged periodically down the field plate 32 to provide for effective current spreading from the gate 24 to the field plate 32.

[0052] FIG. 3 shows the HEMT 40 that is the same as the HEMT 10 of FIGS. 1 and 2, having many features that are similar to those in HEMT 10, and for those similar features the same reference numbers are used in describing this figure and those below. The HEMT 10 depicts the second non-conducting spacer layer 30 as being formed over the field plate 32 and over the portion of the first spacer layer 28 between the gate 24 and the drain 22, with the first spacer layer 28 between the gate 24 and the source 20 remaining uncovered by second spacer layer 30. It is understood that there are various embodiments whereby the second spacer layer 30 can cover less than the entire first spacer layer 28 between the gate 24 and the source 20 and between the gate 24 and the drain 22.

[0053] Additionally, the generally T-shaped top portion 42 of gate 24 in FIG. 3 is a different shape than the top portion 34 of FIGS. 1 and 2. It is understood that the top portion 34, 42 can comprise a variety of shapes and sizes in order to enhance gate conductance. The top portion 42 can also extend toward source 20 and drain 22 in varying degrees, with typical gate-to-source spacing from 0.05 um to 2 um and typical gate-to-drain spacing from 0 um to 3 um.

[0054] FIG. 4 shows another embodiment of a HEMT 50 according to the present invention having many features that are similar to those in HEMT 10, and for those similar features the same reference numbers are used. HEMT 50 comprises a substrate 12, nucleation layer 14, buffer layer 16, barrier layer 18, source electrode 20, drain electrode 22, gate 24 and 2DEG 26 channel layer, first spacer layer 28, second spacer layer 30 and gate top portion 34.

[0055] However, rather than just having one field plate 32 under the overhang of the drain side of top portion 34, a second field plate portion 44 can be deposited on the first spacer layer 28 or on the second spacer layer 30 (not shown). Different second field plates according to the present invention can provide different coverage, with the second field plate 44 as shown under the overhang of the top portion 34 between the source 20 and gate 24 and integral to the gate 24 and top portion 34. It is understood that many different field plate arrangements can be included, with the first spacer layer 28 covering all or less than the entire active layer and the second spacer layer 30 covering all or less than the entire first or second field plate 32,44 or all or less than the entire first spacer layer 28. In those embodiments where the second spacer layer 30 covers less than all of the first or second field plates 32,44 and/or spacer layer 28, the second spacer layer 30 must cover enough of the first or second field plates 32,44 to provide electrical isolation between the first and second field plates 32, 44.

[0056] The second field plate 44 can be connected to the source electrode 20 or the gate 24 and many different connecting structures can be used. Second conductive buses can be formed on the second spacer layer 30 to extend between the second field plate 44 and the source electrode 20. Different numbers of buses can be used so that current effectively spreads from the source electrode 20 into the second field plate 44, while not covering too much of the active region such that unwanted capacitance is introduced. The first field plate 32 can also be electrically connected to the source electrode 20 through a third conductive path that runs outside of the active region of the HEMTs 40 and is connected to the source electrode 20.

[0057] After deposition of the second field plate 44 and its connection to the source electrode 20, the active structure can be covered by a dielectric passivation layer (not shown), such as silicon nitride. Methods of forming the dielectric passivation layer are described in detail in the patents and publications referenced above. The HEMT 10 in FIGS. 1 and 2 and the transistors described below can also be covered by a dielectric passivation layer after formation of the spacer layer(s) and field plates(s).

[0058] FIG. 5 shows another embodiment of a HEMT 60 according to the present invention having many features that are similar to those in HEMT 10, and for those similar features the same reference numbers are used. HEMT 60 comprises a substrate 12, nucleation layer 14, buffer layer 16, barrier layer 18, source electrode 20, drain electrode 22, gate 24 and 2DEG 26 channel layer, field plate 32 and gate top portion 34.

[0059] The HEMT 60, however, comprises a first spacer layer 46 that can cover less than the entire surface of the barrier layer 18 between the gate 24 and source 20 and/or between the gate 24 and drain 22. The coverage should be enough to provide electric isolation between the field plate 32 and the barrier layer 18. Additionally, a second spacer layer 48 can cover less than the entire surface of the first spacer layer 46 between the gate 24 and source 20 and/or between the gate 24 and drain 22.

[0060] FIG. 6 shows another embodiment of a HEMT 70 according to the present invention having many features that are similar to those in HEMT 10. HEMT 70 comprises a substrate 12, nucleation layer 14, buffer layer 16, barrier layer 18, source electrode 20, drain electrode 22, gate 24, 2DEG 26 channel layer, first and second spacer layers 28,30, field plate 32 and gate top portion 34.

[0061] The HEMT 70, however, shows an alternative embodiment whereby a recess 52 into the barrier layer 18 accepts the lower portion 54 of gate 24. Moreover, an In_xGa_1-xN layer 56 may be included, such as in the GaN buffer layer, to serve as an energy barrier. The layer can comprise other materials, and this arrangement is described in U.S. Pat. No. 7,170,111 to Saxler, which is incorporated herein by reference as if fully set forth herein.

[0062] FIG. 7 shows tables 58 and 62, which depict gain plots of current-gain cut-off frequency (Ft) and power-gain cut-off frequency (Fmax) for two GaN HEMTS with standard gate-connected and with buried source-connected field plates. Tables 58 and 62 compare the operating characteristics of the GaN based HEMTs, and show that the Buried FP Device of table 62 exhibits 50% higher Fmax when compared to the Standard FP Device of table 58.

[0063] It is understood that the field plate arrangement can be applied to other transistors beyond HEMTs, including MESFETs and Metal Oxide Semiconductor Heterostructure Field Effect Transistor (MOSHFET). The field plate arrangement can also be applied to microwave and millimeter-wave power amplifiers for communication, instrumentation, military applications and so forth.

[0064] Although the present invention has been described in considerable detail with reference to certain preferred configurations thereof, other versions are possible. The buried field plate and gate arrangement can be used in many different devices. The field plates and gates can also have many different shapes and can be connected to the source contact in many different ways. Accordingly, the spirit and scope of the invention should not be limited to the preferred versions of the invention described above.